Fyp 1
Fyp 1
Fyp 1
Microelectronics Devices
using Metal Foam Heat
Sink
SUPERVISOR:
DR. MUHAMMAD ANWAR
1. Presented by:
TAHA RAHAT (180501030)
2. Motivation
Different models have been developed for finding heat transfer rate in metal
foams for nano-fluids and PCM.
Water based cooling system with foam technology is still under research. This
project involves comparison of analytical and numerical simulations to validate
result for water cooled foam technology.
Moreover, the pore size of foam is related to the type of cooling fluid and its
thermophysical property. We will try and find the optimal foam properties for the
specific fluid i.e., water.
5. Literature Review
Year Author Title Important Points
2005 A. Bhattacharya and R.L Metal Foam and Finned • For a given pore size, the heat transfer rate increases with porosity.
Mahajan Metal Foam Heat Sinks for
Electronics Cooling in • If the porosity is held constant, the heat transfer rate is found to be
Buoyancy-Induced lower at higher pore densities.
Convection
2010 N.A. Roberts and D.G. Convective Performance of • The addition of nanoparticles results in an enhancement of the
Walker Nanofluids in Commercial convection coefficient of a fluid in the commercial system.
Electronics Cooling
Systems • Nanofluids have roughly the same performance in real systems as
they do in well controlled experimental systems without a large
increase in required pumping power.
2010 Maryam Haghighi and Estimation of Effective • It can be demonstrated that inclusion of high porosity open cell
Norollah Kasiri Thermal Conductivity metal foam into the structure of commercially available air coolers
Enhancement Using Foam enhances the effective thermal conductivity, the heat transfer
in Heat Exchangers Based coefficient and the thermal performance considerably. The
on a New Analytical Model relationship between conductivity and foam geometrical
specifications is very important for efficient design of foam heat
exchangers.
Year Author Title Important Points
2013 S.S. Khaleduzzaman,and Nanofluids for Thermal • Nanofluids are promising fluids that can help to cool electronics
R.Saidur, Performance Improvement devices.
in Cooling of Electronic
Device • CuO-water nanofluid provides better thermal performance
improvement compared to Al2O3-water and SiC-water nanofluid.
2015 Huijin Xu, Liang Gong, and Flow and heat transfer • Velocity profile of nanofluid in metal foam is very uniform and the
Minghai Xu characteristics of nanofluid LTNE effect of nanofluid in metal foam is obvious when the
flowing through metal difference between thermal conductivity of fluid and that of solid
foams is large.
• The effect of the imposed heat flux on the temperature field is due
mainly to the heat conduction inside the porous matrix.
Year Author Title Important Points
2019 Tauseef‑ur‑ Rehman · Thermal performance • Experimental investigation is carried out to single out the metallic
Hafz Muhammad Ali analysis of metallic foam-PCM-based heat sink performance for various
foam‑based heat sinks configurations. Copper and nickel foam-based PCM composites
embedded with RT‑54HC are analyzed for various fractions of PCM. Results revealed that
parafn: an experimental incorporation of the PCM within metallic foam reduces the base
investigation for electronic temperature of the heat sink. Furthermore, copper foam-based sink
cooling depicted lesser base temperature when compared to that of nickel
foam. Maximum utilization of PCM’s latent heat is found at 24 W
and the reduction in base temperature is found to be 26%.
Temperature of the sink is reduced as fraction of PCM is added
and vice versa.
2019 Jakub Skibinski, Karol Influence of Pore Size • Higher thermal conductivity can be obtained for structures with
Cwieka, Variation on Thermal homogeneous pore volume distribution.
Conductivity of Open-
Porous Foams • Thermal conductivity is strongly related to porosity.
2020 Michele Celli, and Antonio Flow and Convection in • The Darcy-Forchheimer model and LTNE model is a good
Barletta Metal Foams: a Survey and approximation for the flow through periodic porous structures.
New CFD Results
6. OBJECTIVES
A configuration of metal
A cooling system that can
foam and cooling fluid that
be used for effective
provides best thermal
microelectronics cooling
performance
Use of CREO parametric to generate the CAD model for metal foam
regions. And 2D sketch is created and simulated in ansys design
moduler and fluent
skewness 0.6
Structured 1mm
element size
Non- 0.5mm Structured and non-
structured structured mesh
element size regions
9. Results and simulations
B: Convergence
Temperature contours
inlet
10. REMAINING WORK
Any additional articles needed for consultation related to selection of
metal foam for heatsink.
Metal foams have tendency to compete other fin-structured heat sinks. Heat
extraction is efficient at the cost of pressure loss but it can further be optimized to
enhance these features.
Particle path lines allows us to see the pathway of fluid which help us to minimize
the size while keeping performance optimal.
The main objective of the project modelling and simulating a heat exchanging
components for microelectronics to increase their reliability and service life.
10. References
Ambreen, T., & Kim, M.-H. (2018). Effect of fin shape on the thermal performance of nanofluid-cooled
micro pin-fin heat sinks. International Journal of Heat and Mass Transfer, 12.
doi:https://doi.org/10.1016/j.ijheatmasstransfer.2018.05.164
Bhattacharya, A., & Mahajan, R. L. (2005). Metal Foam and Finned Metal Foam Heat Sinks for Electronics
Cooling in Buoyancy-Induced Convection. Journal of Electronic packaging, 8.
doi:https://doi.org/10.1115/1.2229225
Boulahrouz, S., Avenas, Y., & Chehhat, A. (2017). CFD Simulation of Heat Transfer and Fluid Flow within
Mettalic foam in Forced Convection Enviroment. Mechanics and Mechanical Engineering, 26.
Ghaziani, N. O., & Hassanipour, F. (2016). Convective Heat Transfer of Al2O3 Nanofluids in Porous
Media. Journal of Heat Transfer, 7. doi:https://doi.org/10.1115/1.4034936
Khaleduzzman, S. S., Saidur, R., Selvaraj, J., Mahbubul, I. M., Sohel, M. R., & Shahrul,
I. M. (2013). Nanofluids for Thermal Performance Improvement in Cooling of Electronic
Device. Advanced Materials Research, 7. doi:10.4028/www.scientific.net/AMR.832.218
Mehmedagic, I., & Krug, J. (2015). Heat Sink Design and Optimization. 32.
Pulvirenti, B., Celli, M., & Barletta, A. (2020). Flow and Convection in Metal Foams: a
Survey and New CFD Results. Fluids, 18. doi:10.3390/fluids5030155
Xu, H., Gong, L., Huang, S., & Xu, M. (2015). Flow and heat transfer characteristics
of nanofluid flowing through metal foams. International Journal of Heat and Mass
Transfer, 9. doi:http://dx.doi.org/10.1016/j.ijheatmasstransfer.2014.12.024
ThankYou .