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    IEP Goa 2 Basics of CMOS Mixed Signal 2009

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    PARTH RAMANUJ
    This document summarizes a presentation on mixed-signal VLSI design basics given on March 16, 2009. The presentation covers CMOS technology, analog and digital design blocks, RF design issues, and circuit components. It outlines topics including CMOS process sequences, analog and digital circuit basics, RF systems and issues, component modeling, and inductors. Design tradeoffs are discussed for linearity, noise, impedance matching, and power consumption. Circuit examples include MOS capacitors, resistors, and spiral inductors.

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    © All Rights Reserved
    Download as PPT, PDF, TXT or read online from Scribd

    IEP Goa 2 Basics of CMOS Mixed Signal 2009

    Uploaded by

    PARTH RAMANUJ
    20 views101 pages
    This document summarizes a presentation on mixed-signal VLSI design basics given on March 16, 2009. The presentation covers CMOS technology, analog and digital design blocks, RF design issues, and circuit components. It outlines topics including CMOS process sequences, analog and digital circuit basics, RF systems and issues, component modeling, and inductors. Design tradeoffs are discussed for linearity, noise, impedance matching, and power consumption. Circuit examples include MOS capacitors, resistors, and spiral inductors.

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    IEP Goa 2 Basics of CMOS Mixed signal 2009

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    This document summarizes a presentation on mixed-signal VLSI design basics given on March 16, 2009. The presentation covers CMOS technology, analog and digital design blocks, RF design issues, and circuit components. It outlines topics including CMOS process sequences, analog and digital circuit basics, RF systems and issues, component modeling, and inductors. Design tradeoffs are discussed for linearity, noise, impedance matching, and power consumption. Circuit examples include MOS capacitors, resistors, and spiral inductors.

    Copyright:

    © All Rights Reserved
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    20 views101 pages

    IEP Goa 2 Basics of CMOS Mixed Signal 2009

    Uploaded by

    PARTH RAMANUJ
    This document summarizes a presentation on mixed-signal VLSI design basics given on March 16, 2009. The presentation covers CMOS technology, analog and digital design blocks, RF design issues, and circuit components. It outlines topics including CMOS process sequences, analog and digital circuit basics, RF systems and issues, component modeling, and inductors. Design tradeoffs are discussed for linearity, noise, impedance matching, and power consumption. Circuit examples include MOS capacitors, resistors, and spiral inductors.

    Copyright:

    © All Rights Reserved
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    of 101

    “Mixed Signal VLSI DESIGN:

    Basics of CMOS
    Analog, Digital and RF Circuits”

    Arun N. Chandorkar
    Department of Electrical Engineering
    Indian Institute of Technology, Bombay
    Powai, Mumbai-400076,India
    E-Mail: anc@ee.iitb.ac.in

    16th March 2009


    Mixed Signal Basics

    OUTLINE:
    • 1.Technology
    • 2. Analog Design issues
    • 3. Digital Design Blocks
    • 4. RF design issues
    • 5. Components
    • 6. Conclusion
    “Mixed Signal VLSI DESIGN”

    Basics of CMOS Technology

    16th March 2009


    CMOS Process sequence for
    Mixed Signal Circuits

    Reference: CMOS Mixed Signal Design : R.J.Baker


    CMOS Process sequence for Mixed
    Signal Circuits

    Reference: CMOS Mixed Signal Design : R.J.Baker


    “Mixed Signal VLSI DESIGN”

    Basics of CMOS Analog Circuits”

    16th March 2009


    “Mixed Signal VLSI DESIGN:
    Basics Blocks of CMOS Digital
    Circuits”
    Reference: CMOS Mixed Signal Design : R.J.Baker
    “Mixed Signal VLSI DESIGN”

    Basics of CMOS RF Circuits

    16th March 2009


    RF VLSI Design:
    Issues and Applications
    RF Systems for VLSI Design
    Global System for Mobile communications (GSM: originally from Groupe
    Spécial Mobile) is the most popular standard for mobile phones in the world.
    GSM is a cellular network, which means that mobile phones connect to it by
    searching for cells in the immediate vicinity. GSM networks operate in four
    different frequency ranges. Most GSM networks operate in the 900 MHz or
    1800 MHz bands. Some countries in the Americas (including Canada and the
    United States) use the 850 MHz and 1900 MHz bands because the 900 and
    1800 MHz frequency bands were already allocated.
    The rarer 400 and 450 MHz frequency bands are assigned in some
    countries, notably Scandinavia, where these frequencies were previously
    used for first-generation systems.
    In the 900 MHz band the uplink frequency band is 890–915 MHz, and the
    downlink frequency band is 935–960 MHz. This 25 MHz bandwidth is
    subdivided into 124 carrier frequency channels, each spaced 200 kHz apart.
    Time division multiplexing is used to allow eight full-rate or sixteen half-rate
    speech channels per radio frequency channel. There are eight radio timeslots
    (giving eight burst periods) grouped into what is called a TDMA frame. Half
    rate channels use alternate frames in the same timeslot. The channel data
    rate is 270.833 kbit/s, and the frame duration is 4.615 ms.
    RF Systems ( Continued)
    Code division multiple access (CDMA) is a channel access method utilized
    by various radio communication technologies.
    W-CDMA (Wideband Code Division Multiple Access) is a type of 3G cellular
    network. W-CDMA is the higher speed transmission protocol used in the
    UMTS system.
    Universal Mobile Telecommunications System (UMTS) is one of the third-
    generation (3G) cell phone technologies. Currently, the most common form
    uses W-CDMA .
    Wi-Fi is a Wireless technology brand owned by the Wi-Fi Alliance intended to
    improve the interoperability of wireless.
    WiMAX, the Worldwide Interoperability for Microwave Access, is a
    telecommunications technology aimed at providing wireless data over long
    distances in a variety of ways, from point-to-point links to full mobile cellular
    type access. It is based on the IEEE 802.16 standard, which is also called
    WirelessMAN..
    A wireless LAN or WLAN is a wireless local area network, which is the linking
    of two or more computers without using wires. WLAN utilizes spread-spectrum
    or OFDM modulation technology
    DCS1800 - Digital Cellular System 1800MHz. Digital Cellular System 1800MHz
    is a term given to what is now known as GSM1800
    RF Design Issues

    • Linearity
    • Dynamic Range and Power Distortion
    • Noise
    • Impedance matching
    • Modeling of devices at RF frequencies
    • Temperature dependence
    • Modeling of passive components
    • Matching between the components
    • Power consumption
    • High frequency figure of merit, fT should be at least five times higher
    than the operating frequency
    RF Design Hexagon
    Large Signal Issues ( Cont.)
    “Mixed Signal VLSI DESIGN”

    Basics Circuit Components in


    CMOS Technology

    16th March 2009


    Low Frequency C-V of MOS capacitor

    Reference: CMOS Mixed Signal Design : R.J.Baker


    Floating MOS Capacitor

    Reference: CMOS Mixed Signal Design : R.J.Baker


    Reference: CMOS Mixed Signal Design : R.J.Baker
    Reference: CMOS Mixed Signal Design : R.J.Baker
    Reference: CMOS Mixed Signal Design : R.J.Baker
    Resistors Realization in
    CMOS Technology
    Spiral Segment of Inductor on Si
    Inductors in MOS Technology
    • The self-inductance for a straight conductor is

    L =ln { 2l /GMD} -1.25 + (AMD/l) + (

    Where L is the self-inductance in micro henries, l is the conductor


    length in cm, GMD and AMD represent the geometric and arithmetic
    mean distance, respectively,
    of the conductor cross section,  is the conductor permeability, and
    T is the frequency correction parameter.
    • The geometric mean distance (GMD) between two conductors is the
    distance between two infinitely thin imaginary filaments whose mutual
    inductance is equal to the mutual inductance between the two original
    conductors .
    The GMD is equal to 0.44705 times a side in the case of a square
    cross section.
    • The arithmetic mean distance (AMD) is the average of all the
    distances between the points of one conductor and the points of
    another. For a single conductor, the arithmetic mean distance is the
    average of all possible distances within the cross section.
    Variation in Frequency-Correction
    Parameter T

    Table.1
    Thin Films and Microwave Frequencies.
    Value of T Film Thickness Frequency

    0.9974 10000 A 10 gigahertz

    0.9986 0.0025 mm 1 gigahertz

    0.9095 0.0075 mm 1 gigahertz


    Inductance of spiral
    • M = 2 l Q where
    Q=ln[(1/GMD) + sqrt {1+ (l2 / GMD2)}]
    – sqrt { 1+ (GMD2 / l2) } + (GMD/l)

    • Total Inductance is then given by:


    LT = L 0 + M + + M –
    where L0 is the sum of the self-inductances of all
    straight segments,
    M + is the sum of the positive mutual inductances
    and
    M – is the sum of th negative mutual inductances
    Spiral Inductor
    Physical Inductor Model
    Mutual inductance
    Zin = j w (L+M)
    which means the inductance
    of the conductor increases by M,
    and M is the mutual inductance
    between the two conductors.
    So, parallel currents traveling in phase’
    can contribute positive
    mutual components of inductance.

    Thus the inductance of a conductor


    can be expressed as,
    L = Lself ± M
    M=2lQ
    where
    Q=ln[(1/GMD) + sqrt {1+ (l2 / GMD2)}] – sqrt { 1+ (GMD2 / l2 } + (GMD/l)
    LT = L0 + M + + M -
    Layout of Spiral inductor and probe
    pads for measurement.
    RF inductor issues
    Acknowledgements
    TO
    My Graduate students of last 10 Years,
    Who did their Projects
    With me in Analog, Digital and RF Designs
    &
    Also those who participated in my courses in
    “Digital VLSI Design”, “Analog VLSI Design”
    VLSI technology, RF VLSI and System Design.
    Thanks to authors who put their work on
    Many Websites and they are as referred in the PPTs
    Thank-you

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