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Polyurethanes & Specialties

Polybenzoxazines : New Chemistry


Roger Tietze
Robert Kultzow
Tim Truong

Presentation
Huntsman Advanced Materials

Introduction
Chemistry
Material Properties
Bisphenol A benzoxazine
Conclusion
Future Developments

Introduction
Huntsman Advanced Materials

Technology Origin:
Chemistry discovered in the 1930s
Patent technology was acquired from a Swiss
Research organization in the early 1990s
Huntsman has modified and enhanced the scope of
benzoxazine technology
Technology has been commercialized
Huntsman trade name : Azyrals

Chemistry
Huntsman Advanced Materials

Benzoxazines are a unique non-halogen thermoset


resin chemistry
These compounds can be synthesized from phenols,
formaldehyde, and amines.
No halogen based precursors
Benzoxazines can homopolymerize to form a
polybenzoxazine thermoset networks
Benzoxazines also co-cure with epoxies
Electronics PWB market has a need for a nonhalogen resin chemistry.

Polybenzoxazine Chemistry
Huntsman Advanced Materials

Advantages
Potential low cost high performance thermoset
High purity resin system
High glass transition temperature
Low shrinkage
Low coefficient of thermal expansion
Better moisture resistance.
Better flammability resistance than epoxies and other
thermosets
Excellent electrical properties

Benzoxazine Synthesis
Huntsman Advanced Materials

OH

R3

O
2x

R2

R1
-2H2O

R3

O
N

R2
R1

R4

H 2N

R4

XU3560 Benzoxazine :
Bisphenol A benzoxazineHuntsman Advanced Materials

CH3
O
N

O
CH3

Benzoxazine Polymerization
Huntsman Advanced Materials

Heat

R1

R1
O

N
O

H
R1

R1
O

Benzoxazine/Epoxy
Polymerization

Huntsman Advanced Materials

R1

H
R1

Catalyst

Heat

R1

O
R2
"
O
O

O
O

Epoxy

R1

O
H

O
H

R2
"

R2
"

R2
"

O
H

Benzoxazine: Neat Resin Sample


Preparation

Huntsman Advanced Materials

To test the properties of benzoxazines and other


thermosets, neat resin samples were prepared by the
following procedure:

Resins and hardeners are melted


Degassed
Poured into a mold
Cured with the appropriate cure cycle

Neat Resin Castings


Huntsman Advanced Materials

Resin

Type

Cure

LZ8001

FR4 bis A epoxy

1 hour @ 177C

MY720/DDS

High Tg epoxy

4 hour @ 200C

Arocy B40

Cyanate Ester

4 hours @ 218C

BMI/DABA

Polyimide

4 hours @ 218C

Polybenzoxazine A

Benzoxazine

2 hours @ 200C

Polybenzoxazine B

Benzoxazine

2 hours @ 200C

Polybenzoxazine C

Benzoxazine

2 hours @ 200C

Polybenzoxazine D

Benzoxazine

2 hours @ 200C

Polybenzoxazine E

Benzoxazine

2 hours @ 200C

Neat Resin Castings


Huntsman Advanced Materials

Resin

Glass Transition Temperatures, C

LZ8001 epoxy / Dicy

130C 140C

MY720 / DDS

200C

Arocy B40

240C

BMI Resin/DABA

240C

Polybenzoxazine A

160C

Polybenzoxazine B

155C

Polybenzoxazine C

250C

Polybenzoxazine D

170C

Polybenzoxazine E

200C

TMA Analysis

UL94 Testing : Neat Resin


Huntsman Advanced Materials

Resin

1st Burn 2ndBurn

Length

Rating

LZ8001 / Dicy

8.0

N/a

Burn to clamp

HB

MY720 / DDS

46.0

N/a

Burn to clamp

HB

Arocy B40

15.6

7.8

3.2

V1

BMI Resin/DABA

51.0

N/a

Burn to clamp

HB

Polybenzoxazine A

31.0

19.2

4.2

HB

Polybenzoxazine B

28.0

7.2

2.8

HB

Polybenzoxazine C

4.9

2.0

0.3

V0

Polybenzoxazine D

5.9

3.9

2.0

V1

Polybenzoxazine E

2.9

2.4

1.1

V0

Note: Longest burn time recorded

Benzoxazine: Electrical Testing

Huntsman Advanced Materials

Neat resin specimens : 0.5 x 0.5


Neat resin specimen thickness : 2.0 mm 2.5 mm
HP4291A RF Impedance/Material Analyzer
Linked to HP 16453A Dielectric Material Test
Fixture with a High Impedance Test Head
Calibration included the HP low loss capacitor
Frequency range : 1 MHz to 1.8 GHZ
Reported data range : 10 MHz 1.5 GHZ

Benzoxazine: Electrical Properties


of Neat Resins

Huntsman Advanced Materials

Neat Resin Sample

DK Range

Df Range

LZ8001

3.5 3.7

0.020 0.035

AER4100

3.5 3.7

0.020 0.035

Arocy B40

2.80 2.97

0.0050 0.0090

Polybenzoxazine A

3.00 3.15

0.0060 0.0100

Polybenzoxazine B

3.15 3.30

0.0070 0.0110

Polybenzoxazine C

3.45 3.60

0.0070 0.0090

Polybenzoxazine D

3.40 3.45

0.0065 0.0085

Frequency = 10 MHZ 1.5 GHz

Neat Resin Results


Huntsman Advanced Materials

Benzoxazines more flame resistant than epoxies


Good electrical properties
High glass transition temperatures

Typical Properties XU3560


Huntsman Advanced Materials

Visual appearance
Melting point, C
Viscosity @ 125C, cps
Volatile, %

DSC uncured
Initiation Temperature To, C
Peak Temperature Tg, C
H, J/g

Yellow chunks
80-85
185
~2

231
241
238

Mechanical Properties
Huntsman Advanced Materials

Curing Cycle
Tg(C) DSC
Tg(C) DMA
Tg(C)DMA Wet*
Flex Properties Dry @ RT
Modulus, ksi, (MPa)
Strength, ksi, (MPa)
Tensile Properties Dry @ RT
Modulus, ksi, (MPa)
Strength, ksi, (MPa)
Elongation, %
Compression Properties Dry @ RT
Modulus, ksi, (MPa)
Strength, ksi, (MPa)
Elongation, %
Toughness Properties Dry @ RT
KIc, lbin/in2, (MPam)
GIc, in-lb/in2, (J/m2)
*48hrs boiling water

XU3560
2hr/180C + 2hr/200C
171
163
150
667 (4602)
19.1 (132)
773 (5334)
4.5 (31)
1.2
508 (3505)
33 (228)
8.3
844 (0.94)
0.96 (168)

Formulations for XU3560


Huntsman Advanced Materials
1

75
25

70
30
--3.50
1.05

70
30
10
3.50
1.05

2hr/180C +
2hr/200C
219
227
181

1hr/120C +
4hr/180C
204
198
164

1hr/120C +
4hr/180C
NT
200
158

642
16.7

742
19.3

527
19.2

626
7.6
1.6

722
7.4
1.0

564
12.6
2.8

581
0.47

NT
NT

850
1.23

97-191
CY 179
Hycar CTBN1300x13
XB 6079
Benzopinacol
Curing Cycle
Tg(C) DSC
Tg(C) DMA, E
Tg(C)DMA, E Wet*

Flex Properties Dry @ RT


Modulus, ksi, (MPa)
Strength, ksi, (MPa)
Tensile Properties Dry @ RT
Modulus, ksi, (MPa)
Strength, ksi, (MPa)
Elongation, %
Toughness Properties Dry @ RT
2
KIc, lbin/in , (MPam)
GIc, in-lb/in2, (J/m2)

Novel High Performance


Systems

Huntsman Advanced Materials

Conclusions :

We have developed unique benzoxazine resins with commercially


viable manufacturing processes.

These resins afford wide formulation latitude and can be


formulated with epoxies, thermoplastics and catalysts to suit
various applications and fabrication processes.

These resins are ideal for high performance composite, structural


adhesive and printing wiring board (PWB) applications.

The benzoxazine/epoxy systems have high TgC, good thermal


oxidation stability, low water pick-up, reduced shrinkage, good
electrical, and are room temperature stable.

Benzoxazine Technology
Huntsman Advanced Materials

Current Status
Technology development work continues
New candidate products have been introduced for
Aerospace composite markets
High performance laminating markets

We have cooperative developments programs with Key


customers
Qualifications in progress at major customers in both Electronic
and Aerospace segments
Industrial applications are being explored
Manufacturing in place in North America and Europe.
Process development work to install manufacturing capability in
Asia in the near future.

Huntsman Advanced Materials

Thank You
Questions

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