SXP3101 L2 A 2
SXP3101 L2 A 2
SXP3101 L2 A 2
March, 2005
Preliminary Specification
SXP3101L2
(LR-2/P1L1-2D2, 1550nm EML, APD-PD)
Features
10Gb/s Serial Optical Interface
High quality and reliability optical device and
sub-assemblies
1550nm EML laser for up to 80km operation
over single mode fiber
High sensitivity APD photo diode and TIA
XFP MSA Revision 4.0 Compliant
Easy supply management for hot pluggability
Duplex LC Receptacle
XFP Mechanical Interface with color coded latch
for easy removal (Bail color: White)
XFI High Speed Electrical Interface
2-wire interface for management and diagnostic
monitoring
Applications
Tx_Disable and Rx_LOS functions
SONET(OC-192)/SDH(STM64) line card
Multi-Protocol
Other high speed data connections
SONET OC-192/SDH STM-64
Low Power Consumption
+3.3V, +5.0V Power Supplies
Power consumption less than 3.5W
Framer/Mapper Framer/Mapper
or or
SER SXP3101 SXP3101 SER
Ethernet MAC Ethernet MAC
DES (XFP) (XFP) DES
or or
FC Controlller FC Controlller
Preliminary Specification
1. General Description
The SXP3101L2 is a very compact 10Gb/s optical transceiver module for serial optical
communication applications at 10Gb/s. The SXP3101L2 converts a 10Gb/s serial electrical
data stream to 10Gb/s optical output signal and a 10Gb/s optical input signal to 10Gb/s
serial electrical data streams. The high speed 10Gb/s electrical interface is fully compliant
with XFI specification.
The SXP3101L2 is designed for use in a variety of 10Gb/s SONET/SDH equipment
including FEC (9.95Gb/s to 10.7Gb/s). The high performance cooled 1550nm EML
transmitter and high sensitivity APD receiver provide superior performance for SONET /SDH
at up to 80km links.
The fully XFP compliant form factor provides hot pluggability, easy optical port upgrades and
low EMI emission.
2. Functional Description
The SXP3101L2 contains a duplex LC connector for the optical interface and a 30-pin
connector for the electrical interface. Figure 2.1 shows the functional block diagram of
SXP3101L2 XFP Transceiver.
Transmitter Operation
The transceiver module receives 10Gb/s electrical data and transmits the data as an optical
signal. The transmitter contains a Clock Data Recovery (CDR) circuit that reduces the jitter
of received signal and reshapes the electrical signal before the electrical to optical (E-O)
conversion. The optical output power is maintained constant by an automatic power control
(APC) circuit. The transmitter output can be turned off by TX disable signal, at TX_DIS pin.
When TX_DIS is asserted High, the transmitter is turned off.
Receiver Operation
The received optical signal is converted to serial electrical data signal. The optical receiver
contains a CDR circuits that reshapes and retimes an electrical signal before sending out to
the XFI channel (i.e. XFP connector and high speed signal traces).
The RX_LOS signal indicates insufficient optical power for reliable signal reception at the
receiver.
Management Interface
A 2-wire interface (SCL, SDA) is used for serial ID, digital diagnostics and other control
/monitor functions. The address of XFP transceiver is 1010000x. MOD_DESEL signal can
be used in order to support multiple XFP modules on the same 2-wire interface bus.
Preliminary Specification
VC C 5 5.0V
SX P3101L2
VC C 3 3.3V
Signal
EML
Optical Output
TD P/TD N C onditioner TOSA
TEC
P_D OW N /R ST C ontrol
TX_D IS
Bias C ontrol
C ircuit
IN Tb
I2C D ata Tx Pow er,Tx Bias
SD A uC
I2C C lock System
SC L APD Bias
M OD _N R Rx P ower, C ont rol
LOS
M OD -D ESEL
C urrent
R X_LOS
M onitor
R EFC LKP
100ohm
R EFC LKN
R D P/ Signal C onditioner APD
Optical Input
RDN w ith LIA R OSA
M OD _Abs
3. Package Dimensions
Figure 3.1 shows the package dimensions of SXP3101L2. SXP3101L2 is designed to be
complaint with XFP MSA specification. Package dimensions are specified in section 6.3 of
the XFP MSA specification Rev.4.0.
Unit : mm
Figure 3.1. Package Dimensions
Preliminary Specification
1 GND 30 GND
3 Mod_DESEL 28 TDN
4 INTERRUPTb 27 GND
5 TX_DIS 26 GND
6 VCC5 25 REFCLKN
7 GND 24 REFCLKP
8 VCC3 23 GND
10 SCL 21 P_DOWN/RST
12 MOD_ABS 19 GND
13 MOD_NR 18 RDP
14 RX_LOS 17 RDN
15 GND 16 GND
GND 30
1 GND
TDP 29
2 VEE5 (not in use)
TDN 28
3 Mod_DESEL
GND 27
4 INTERRUPTb
GND 26
5 TX_DIS
REFCLKP 25
6 VCC5
REFCLKN 24
7 GND
GND 23
8 VCC3
VCC2 (not in use) 22
Toward Bezel 9 VCC3
P_DOWN/RST 21
10 SCL
VCC2 (not in use) 20
11 SDA
GND 19
12 MOD_ABS
RDP 18
13 MOD_NR
RDN 17
14 RX_LOS
GND 16
15 GND
Preliminary Specification
module
board.
Preliminary Specification
Note
1: Module ground pins are isolated from the module case and chassis ground within the module.
2: Shall be pulled up with 4.7k to 10k ohm to a voltage between 3.15V and 3.45V on the host board.
Preliminary Specification
Preliminary Specification
6. Electrical Interface
6.1. High Speed Electrical Interface
XFI Application Reference model
Figure 6.1.1 shows the high speed electrical interface (XFI) compliance points.
XFI electrical interface is specified for each compliance point in the chapter 3 of the XFP
MSA specification.
Capacitors
B' B
XFP Connector
Note
1: 0.05-0.1 GHz
2: 0.1-5.5GHz
4: 0.1-15GHz
Preliminary Specification
Note
1: 0.05-0.1 GHz
2: 0.1-5.5GHz
4: 0.1-15GHz
Y2 Y2
Y1 Y1
0 0
-Y1
-Y1
-Y2 -Y2
Figure 6.1.2 Tranmitter Input Eye Mask Figure 6.1.3 Receiver Output Eye Mask
Preliminary Specification
Note that the reference clock is not needed for SXP3101L2. The differential reference
clock signals if used are internally terminated across a 100Ohm resistance as shown in
Figure 2.1.
Transmitter CDR
Table 6.2.1 Transmitter CDR Specification
Note
1: In order to meet SONET/SDH jitter transfer requirement, de-jitter PLL will be needed on the
Receiver CDR
Note
Preliminary Specification
Table 6.3.1 Low Speed Control and Alarm Signals Electrical Interface
Note
5: Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)= -10A.
6: Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)= 10A.
7: at 400KHz, 3.0kohms, at 100kHz 8.0kohms max
Preliminary Specification
7. Optical Interface
Note:
1: Measured at 9.95328Gbps, Framed PRBS2^31-1, NRZ
2: When there is no applied jitter on electrical input to the module
Preliminary Specification
RX_LOS [V]
Voh
Vol
Preliminary Specification
9. User Interface
9.1. XFP Mechanical Interface
XFP Mechanical Interface is specified in the chapter 6 in the XFP MSA specification.
XFP Mechanical Components
Figure 9.1 shows the XFP transceiver concept and mechanical components.
Preliminary Specification
Digital
Diagnostic
functions
118
119-122 4 Btyte Password Change
XFP MSA
Reserved Serial ID User
Data Vendor
for Future EEPROM
Specific Reserved
Diagnostic 223 Data
Functions
Functions 224 (not protected)
Vendor
Specific
255 255
ID Data 255 255 255
Table 00h Table 01h Table 02h Table 03h-7Fh Table 80h-FFh
Preliminary Specification
Note2. Over specified temperature and voltage range over the life of the product into a fixed measurement
system
Preliminary Specification
Size Size
Address Name Hex ASC Description Address Name Hex ASC Description
(Bytes) (Bytes)
Base ID Filed Extended ID Field
128 1 Identifier 06 XFP module 192 AF 3.5W
129 1 Ext. Indentifier 90 3.5W Max, With CDR 193 96 1.5W (Note3)
4 Power Supply
130 1 Connector 07 LC Connector 194 A8 500mA/800mA (Note4)
131 00 195 00
132 00 196
133 00 197
134 00 198
8 Tranciver
135 00 199
136 00 200
137 04 P1L1-2D2 201
138 00 202
139 1 Encoding 30 SONET Scrambled, NRZ 203
16 Vendor SN Note5
140 1 BR-Min 64 9.95Gbps 204
141 1 BR-Max 6C 1075Gbps 205
142 1 Length (SMF)-km 50 80km 206
143 1 Length (E-50 m) 00 207
144 1 Length (50 m) 00 208
145 1 Length (62.5 m) 00 209
146 1 Length (Copper) 00 210
147 1 Device Tech 74 211
148 53 S 212
Year
149 75 u 213
150 6D m 214
Month
151 69 i 215
8 Date Code Note6
152 74 t 216
Day
153 6F o 217
154 6D m 218
Lot code
155 6F o 219
16 Vendor name
156 45 E 220 1 Diagnostic Monitoring Type 08 No BER Support,
157 6C l 221 1 Enhanced Options 60 Optional Soft TX_Disable,
158 65 e 222 1 Aux Monitoring 70 +3.3V Support Voltage
159 63 c 223 1 CC_EXT Note7
160 74 t Vendor Specific ID Fileds
161 72 r 224
162 69 i 225
163 63 c 226
164 1 CDR Support F0 227
165 00 228
166 3 Vendor OUI 00 229
167 5F 230
168 53 S 231
169 58 X 232
170 50 P 233
171 33 3 234
172 31 1 235
173 30 0 236
174 31 1 237
175 4C L 238
16 Vendor PN
176 32 2 239
32 Vendor Specific
177 20 240
178 20 241
179 20 242
180 20 243
181 20 244
182 20 245
183 20 246
184 4E N A to Z 247
2 Vendor rev
185 20 248
186 79 249
2 Wavelength 1550nm @ RT
187 18 250
188 0F 251
2 Wavelength Tolerance +/-20nm (Note1)
189 A0 252
190 1 Max Case Temp 46 70degC 253
191 1 CC_BASE Note2 254
255
Note1.The guaranteed +/- range of transmitter output wavelength under all normal operating conditions.
Note5. Address 196 to 211 Vendor Serial Number Note6. Address 212 to 219 Date code
Preliminary Specification
XFP Connector
0.1uF 22uF 0.1uF
XFP Module
TRANSMIT
TDP
DATA
100 TDN
RECEIVE
RDP
DATA
100
RDN
REFCLKP
100
REFCLKN
MOD_Abs
uPC P_DOWN/RST
INTb
SCL
SDA
MOD_NR
FG 50 line
Preliminary Specification
Caution
_______________________________________________________________________________
If this product is used under conditions not recommended in the specification or is used with
unauthorized revision, the classification for laser product safety is invalid. Reclassify the product
_______________________________________________________________________________
EMI (Emission)
SXP3101L2 is designed to meet FCC Class B limits for emissions and noise immunity per
CENELEC EN50 081 and 082 specifications.
RF Immunity
SXP3101L2 has an immunity to operate when tested in accordance with IEC 61000-4-3 (80-
1000MHz, Test Level 3) and GR-1089.
Preliminary Specification
SXP 3101 L2
For test purposes, Evaluation Board model number SK3101A and SP3101A may be ordered
to use with the SXP3101 Series transceivers.
SK3101A : SPX3101 XFP evaluation board
SP3101A : XFP 2-wire serial interface evaluation kit
Preliminary Specification
U.S.A.
ExceLight Communications, 4021 Stirrup Creek Drive, Suite 200 Durham, NC 27703
Tel. +1-919-361-1600 / Fax. +1-919-361-1619
E-mail: info@excelight.com
http://www.excelight.com
Europe
Sumitomo Electric Europe Ltd., 220, Centennial Park, Elstree, Herts, WD6 3SL, United
Kingdom
Tel. +44-208-953-8681
Fax. +44-208-207-5950
E-mail: photonics@sumielectric.com
http://www.sumielectric.com
Japan
Sumitomo Electric Industries, Ltd.
1, Taya-cho, Sakae-ku, Yokohama, 244-8588
Tel. +81-45-853-7154 / Fax. +81-45-851-1932
E-mail: product-info@ppd.sei.co.jp
http://www.sei.co.jp/Electro-optic/index_e.html