Sheet No.

: EN Troubleshooting Guide
Revision: 04/30/04T-626
IMDS ID No.: Not Relevant

Technical Information

Electroless Nickel
Troubleshooting Guide
Subject
General Troubleshooting Guidelines
Discussion of Impurities in EN Plating Solutions
Critical Contaminant Levels in EN Plating Solutions
Specific EN Plating Problems:
Low Deposition Rate
No Deposition (New EN Solution Will Not Plate)
Pitted Deposits
Rough Deposits
Porous Deposits
Non-Uniform Deposits
Blistering (Ferrous & Non-Ferrous Metals)
Poor Adhesion
Streaky or Patterned Deposits
Skip Plating
Turbid or Milky Appearing Solution
Deposition on Tank Walls and/or Equipment
Rapid Solution pH Change
Test Procedures
Metric Conversion Tables
Temperature Conversion Tables

Page
2
3-5
6
7
8
8
9
10
10
10
11
11
12
12
13
13
14
15-16
17

Important Notice Regarding the Attached Information:

The statements, technical information and recommendations contained in this document are based on tests and data that are believed to be reliable. Further, as the actual use of
our products by others is beyond our control, no guarantee of any kind is made as to the effects of such use, or the results to be obtained, whether the use is made in accordance
with the recommendations or suggestions contained herein or otherwise. This document is not contractual and NOTHING HEREIN CONSTITUTES A REPRESENTATION OR
WARRANTY THAT THE GOODS DESCRIBED ARE FIT FOR A PARTICULAR PURPOSE OF A CUSTOMER or that their use does not conflict with any existing patent rights. The
exclusive source of any warranty and of any other customer rights whatsoever is on the Atotech invoice. Also, since this data sheet may be provided by electronic media, Atotech
cannot guarantee the accuracy or originality hereof. Any alterations made to this document other than by Atotech corporate headquarters is expressly prohibited.

Atotech USA Inc. 1750 Overview Drive, Rock Hill, SC 29730

Telephone: 803-817-3500 Fax: 803-817-3666

Electroless Nickel Troubleshooting Guide

PAGE 2

GENERAL TROUBLESHOOTING GUIDELINES

Areas to Investigate
! Substrate - Nature and Condition
! Substrate Preparation - Cleaners, Acid Dips, Rinsing
! Operator Handling - Movement of Parts Down the Production Line
! Electroless Nickel Bath - Chemistry, Maintenance, Control
! Post-Treatment Steps - Passivates, Heat Hardening, Baking
Methodology
! What is the Problem?
Deposit Roughness, Pitting, Edge Skip, Premature Corrosion
! Where Does the Problem Occur and Not Occur?
Some Substrates, All Substrates,
Some Parts (which ones) or All Parts
From Some Tanks or All Tanks
! When Does the Problem Occur and Not Occur?
All of the Time, Some of the Time
! When Did the Problem First Start?
With a New EN Bath, With a New Job, With a New Pre-treatment Cycle
! How Does the Defect Appear?
Pattern, Random, Hit or Miss
! Look for Differences
What is the Difference between Parts Showing the Problem and Those That Do Not?
! Look for Patterns or Changes That Might Have Been Made
Do They Correlate With the Time That the Problem Started?
! Seek Out A Logical Cause of the Problem
Arrive at a True Solution (Not a Band-Aid) to the Problem

Electroless Nickel Troubleshooting Guide

PAGE 3

EFFECTS OF IMPURITIES ON ELECTROLESS NICKEL PLATING SOLUTIONS

There are many different sources of contamination of electroless nickel solutions. Dissolved metals, organic
compounds, anions and silicon compounds can all adversely affect the operation of the plating solution and the
deposit it produces. The level at which an individual compound becomes a problem depends upon the
compound and may be synergistic with other contaminants in the bath. The following discussion describes the
effect of different contaminants and establishes limits for their presence in an electroless nickel bath.
Metallic Contamination
Metals can be grouped into two categories - those that stabilize or inhibit the electroless nickel reaction and
those that catalyze it. Most metals are stabilizers, tend to reduce the plating rate of the bath, and may cause
skip-plating, edge-pullback, or no plating at all. Metals such as cadmium and lead are especially detrimental
even at very low concentrations. Their effects can sometimes be overcome by raising the activity of the bath by
increasing temperature, concentration and/or pH. Increasing the load factor can also help overcome this type of
contamination, especially with borderline levels of metals.
Catalyzing contaminants, like palladium and platinum, cause electroless nickel solutions to become unstable
and decompose. This type of contaminant is normally introduced into the bath by using racks or barrels that
previously had been used for precious metal plating, or through drag-in of catalysts from plating-on- plastics
operations. Unfortunately, there is no method to remove these metals and the solution must be discarded.
Organic Contamination
Organic contamination usually appears as fine pitting on all the surfaces of the part. Because there are many
potential sources, the cause of organic contamination is often difficult to establish. In addition, it is usually not
possible to analyze an electroless nickel bath to identify the specific organic that is present. However, some of
the more common sources of organic contamination are solvents from improperly cured stop-offs, oils and
grease left on the part (or in pores or holes), drippage of lubricant from equipment, and organic compounds
present in water sources that are not removed by the deionizing system.
Once an electroless nickel solution has been contaminated with an organic compound, it often cannot be
cleaned up. While carbon filtration can sometimes be used to remove solvents and oils from electrolytic nickel
plating baths, this method is not practical for electroless solutions. Because of this, contaminated baths are
often dumped.
Anionic Contamination
Certain anions, especially sulfides, can cause dark, porous deposits when present in electroless nickel baths.
They also tend to stabilize and slow down the bath. Sulfides also depress the phosphorus content of an
electroless nickel coating and increase its internal stress. Some sources of this contamination include sulfides
in steel, dry film lubricants, sulfide containing greases, and ground water contamination.
Nitrates, when present in concentrations greater than a few ppm, can cause streaky, discolored deposits, slow
plating rates or no plating. This type of contamination most commonly occurs when electroless nickel tanks are
improperly rinsed and neutralized after nitric acid passivation. Nitrate contamination of water used to rinse
tanks after nitric acid passivation can easily be detected with nitrate test papers. If a positive result is obtained
to this test, rinsing should be repeated until no signs of nitrate are seen.

Electroless Nickel Troubleshooting Guide

PAGE 4

Chlorides
The presence of chlorides in an electroless nickel solution usually results in increased porosity and reduced
corrosion resistance of the deposited coating. Their presence can also lead to etching and corrosion of
anodically protected stainless steel tanks. Chlorides are generally introduced into the bath by drag-in of
hydrochloric acid from the pre-treatment line. Whatever the source and cause of anion contamination, once
they are present, they can be very difficult to remove. Thus, baths contaminated with anions are generally
discarded.
Orthophosphite
The build-up of orthophosphite in an electroless nickel solution is inevitable. It is the reaction product formed
when hypophosphite reduces nickel. For each gram of nickel reduced, about 4 grams of orthophosphite are
produced. When its concentration exceeds 100-150 g/l, orthophosphite tends to be co-deposited in the coating
and degrade its performance. Coatings deposited from baths containing excessive orthophosphite typically
exhibit high tensile stress, increased porosity and exhibit greatly reduced corrosion resistance. The presence of
excessive orthophosphite also tends to reduce plating rate and can cause the bath to white-out.
Silicon Compounds
The presence of some types of silicon compounds can cause instability in an electroless nickel solution and
produce rough deposits. Typically, this results from those silicon compounds, such as colloidal silica, that are
not soluble in the solution. Soluble compounds such as sodium silicate seem to have a minimal effect upon the
bath and its deposit. Silicon contamination is most commonly introduced into the bath as airborne particles of
dust or sand, as cleaner residues left on the part, or from improperly filtered deionized water. Colloidal silica,
which is often present in groundwater, can be as small as 0.25 m in diameter. Accordingly, the filters used in a
deionized water system must be adequately sized and properly maintained.
Contamination Levels
Some common contaminants of electroless nickel solutions and their critical concentrations are shown in the
following table. These levels are only guidelines. Their effect can vary depending upon bath formulation and
operation. The level at which most contaminants become a problem is dependent upon such factors as bath
loading, the nature of the substrate being plated and the activity of the solution (pH, temperature and
concentration). In addition, many contaminants have a synergistic effect and together may produce problems at
lower concentration levels than they would individually.
Bismuth, when present by itself, stabilizes electroless nickel solutions and can reduce plating rate and produce
skip plating. When antimony is also present, bismuth causes the coating's internal stress to become highly
tensile.
Tin at low concentrations, especially when introduced into electroless nickel solutions as a lubricant
component, can cause severe instability of electroless nickel solutions. At high concentrations, tin typically acts
as a stabilizer.
The performance of zinc contaminated electroless nickel solutions is dependent upon the loading factor of the
bath. Bulk plating facilities with large ratios can tolerate high levels of zinc without effect. Facilities with low bath
loading may experience problems at lower contaminant levels.

Electroless Nickel Troubleshooting Guide

PAGE 5

Silicon compound may be introduced into electroless nickel solutions in many different forms, as silica,
silicates, silicones, etc. Analysis to determine which form is present can be difficult. Common analytical
techniques probably measure only a small part of the total silicon present.
Every contaminant present in an electroless nickel solution changes the properties of the deposit obtained.
Engineering properties, such as corrosion resistance, can be greatly degraded. Solutions contaminated at
levels where operating characteristics are normal may still produce inferior deposits. Thus, it is good practice to
eliminate the source of a contaminant rather than keeping contamination levels within acceptable limits.

Electroless Nickel Troubleshooting Guide

PAGE 6

CRITICAL CONTAMINANT LEVELS IN EN PLATING SOLUTIONS

Contaminant
Aluminum
Bismuth
Bismuth (with Sb)
Cadmium*
Chromium
Copper
Iron

Problem Level
>150 ppm
1-3 ppm
>3 ppm
1-3 ppm
1 ppm
1-2 ppm

Symptom
Reduced rate
Reduced rate
Skip plating
High Stress
No plating
Skip plating
Reduced rate
Skip plating
Copper deposits

Remedy
Discard
Increase activity or discard
Discard
Increase activity or discard
Increase activity or discard
Increase activity

Palladium

1 ppm

Reduced rate
Dark deposit
Reduced rate
No plating
Skip plating
Reduced rate
Skip plating
Decomposition

Platinum

1-3 ppm

Decomposition

Discard

Tin

1-3 ppm

Instability

Discard

>75 ppm

Lead*
2-5 ppm
Manganese

Tin
Titanium
Zinc
Organics
Sulfides
Nitrates
Chlorides

Not determined

3-10 ppm
Not determined
>15 ppm
Not determined
>1 ppm
> 50-75 ppm
Not determined

Orthophosphite
> 150-250 g/l
Silicon
Compounds

>6 ppm

Dull deposit
Reduced rate
Reduced rate
Skip plating
Reduced rate
Dark deposit
Fine pitting
Reduced rate
Dark deposit
Dark deposit
Streaky deposit
Porous deposits
White out
Stressed deposits
Porous Deposits
Roughness
Instability

Increase activity or discard

Increase activity or discard
Increase activity or discard
Discard

Increase activity or discard

Increase activity or discard
Increase activity or discard
Discard
Discard
Remove or discard
Discard
Discard
Discard

* NOTE: Heavy metals such as Cd and Pb are typically used in trace quantities as brightening and stabilizing
additives in most proprietary electroless nickel baths.

Electroless Nickel Troubleshooting Guide

PAGE 7

SPECIFIC EN PLATING PROBLEMS

Low Deposition Rate
Possible Causes

Corrective Action

Low nickel content

Analyze and adjust, as required

Low hypophosphite content

Analyze and adjust, as required

Low pH

Adjust to within recommended range

Low bath temperature

Increase to within recommended range

Bath is over-stabilized

Remove, if possible (by dummying using steel wool)

Nitrate contamination

Dump bath and remake

Identify source of contamination and eliminate

Low bath loading

Increase workload in bath

Add NICHEM Accelerator at daily start-up (mid-phos baths
only)

Excessive agitation

Reduce agitation

Solution is old and due for

replacement
Solution contamination (metallic or
organic)

Make up a new bath

Keep accurate records to determine life of bath.
Identify source and eliminate
Avoid using racks, baskets, and barrels which have been used
for other processes (e.g. Cd, Pb, Zn or Sn)
Contaminated rinses
Drag-in from pre-treatment solutions
Poor quality water used for make-up and rinsing of parts
Contaminated air used for agitation
Make up a new bath, if necessary

Electroless Nickel Troubleshooting Guide

PAGE 8

No Deposition (New EN Solution Will Not Plate)

Possible Causes

Corrective Action

Low bath temperature

Adjust to within recommended range

Low pH

Adjust to within recommended range

Low nickel content

Analyze and adjust, as required

Low hypophosphite content

Analyze and adjust, as required

Nitrate contamination

Dump bath and remake

Identify source of contamination and eliminate

Parts are non-catalytic

Copper, brass, etc. are not catalytic and require initiating

Solution contamination

Identify source and eliminate

Avoid using racks, baskets, and barrels which have been used
for other processes, e.g. Cd, Pb, Zn or Sn
Contaminated rinses
Drag-in from pre-treatment solutions
Poor quality water
Contaminated air used for agitation
Make up new bath, if necessary

Pitted Deposits
Possible Cause

Corrective Action

Organic contamination from filter

cartridges (wound polypropylene,
etc.)

Use pre-washed cartridges to remove harmful anti-static

spinning agents.

Drag-in of surfactants from cleaners

and wetted acids

Improve cleaning and rinsing

Do not use inhibitors in acid dips

Contamination from plastic in nonapproved pumps, piping, tank linings

(e.g., PVC, etc.)

Only use approved materials for EN installations

Bad or improper cleaning and

activation

Use approved EN cleaners and acid dips

Poor substrate condition

Discuss with customer and materials supplier

Poor filtration

Improve filtration

Electroless Nickel Troubleshooting Guide

PAGE 9

Rough Deposits
Possible Cause

Corrective Action

Poor filtration

Filter bath at 10 times per hour through a 1-5 m filter

Insufficient agitation

Increase airflow or use work movement

Roughness on upward facing (shelf)

surfaces

Re-rack work so affected surfaces do not face upward

Bath contamination from airborne

particles

Trace source of dirt and eliminate

Cover tank when not in use

Overactive electroless bath

Lower deposition rate

Residual magnetism in the work

Demagnetize parts prior to deposition

Stray electrical currents

Identify source and eliminate

Make-up pre-mixes added too quickly

Modify procedure so additions are made more slowly

Make-up pre-mixes impinge directly

on the work or heaters

Distribute pre-mixes evenly over the bath surface

Holes in PTFE heating coils

Check heat exchangers

Poor pre-treatment of the work

Check pre-treatment cycle, and keep rinse tanks clean

Incorrect tank materials

Check plastic or stainless for impurities, replace if necessary

Contamination dripping into the bath

Locate source and eliminate

Contamination from uncoated racks

Locate source and eliminate

Stabilizer content too low

Add NICHEM Stabilizer

Too high of a anodic current applied

to SS tank

Set as per manufacturers specs.

pH is too high

Adjust pH to recommended range

Temperature is too high

Adjust temperature to recommended range

Localized overheating

Improve tank design

Excessive work load

Adjust bath loading to recommended range

Electroless Nickel Troubleshooting Guide

PAGE 10

Porous Deposits
Possible Cause

Corrective Action

Organic impurities

Identify source and eliminate

Use clean air for agitation
Avoid drips from sources above the tank

Insufficient air agitation

Increase the uniformity and velocity of air flow

Suspended matter in solution

Improve filtration

Porous substrate

Improve the quality of the substrate surface

Flask plate with nickel sulfamate prior to EN

Old solution with high orthophosphite

Dump the bath and re-make

Non-Uniform Deposits
Possible Cause

Corrective Action

Operating parameters out of range

Check temperature, pH, nickel & hypophosphite

concentrations

Poor cleaning or activation

Check pre-treatment steps and change, as required

Interference from stray currents

Check for stray currents and eliminate

Blistering - Ferrous Metals

Possible Cause

Corrective Action

Substrate is not clean or activated

Improve cleaning and acid activation

Contaminated rinse water prior to EN

Improve quality of rinse water

Use separate rinse tank

EN bath is over-stabilized

Analyze solution and adjust, as required. Add NICHEM

Accelerator (mid-phos baths only!).

Blistering Non-Ferrous Metals

Possible Cause
Inadequate preparation or activation
of substrate

Corrective Action
Improve cleaning and acid activation

Electroless Nickel Troubleshooting Guide

PAGE 11

Poor Adhesion
Possible Cause

Corrective Action

Incorrect pre-treatment

Use the proper pre-treatment cycle(s)

Cleaning or pickling bath is

contaminated

Discard bath(s) and replace

EN bath is old and contaminated

Discard bath and replace

Improper cleaning or activation

Ensure that the correct pretreatment cycle(s) is being used

Poor cleaning

Check life of cleaner. Make up new, if required.

If cleaner has an oil film on surface, dump and clean out tanks.

Poor activation

Change acid dip

If cleaner has an oil film on surface, dump and clean out tanks.
Do not use inhibitors or wetting agents in acid dips.

Contaminated solution.

Check quality of make-up water for presence of heavy metals

(e.g., Pb, Fe, etc., or organics). Only use deionized water.

Contaminated rinse water

Check that rinses are clear and free running.

If cleaner has an oil film on surface, dump and clean out tanks.

Electroless nickel deposit is highly

tensile stressed

Dump EN bath and remake

Reduce plating rate

Streaky or Patterned Deposits

Possible Cause

Corrective Action

Poor agitation

Improve the degree of agitation, air and/or mechanical

Filtered solution return blocked

Relocate and baffle the filter solution return

Gas patterns

Reposition parts to avoid gas streaking

Drag-in of silicates

Improve rinsing; use non-silicated cleaners

Low tank loading

Increase loading to recommended range

Add NICHEM Accelerator (mid-phos baths only!)

Improper surface preparation

Improve cleaning, pickling and water rinsing.

Electroless Nickel Troubleshooting Guide

PAGE 12

Skip Plating
Possible Cause

Corrective Action

Heavy metal contamination of the EN

bath (e.g. Pb, Bi, Cd, Hg, Sn, Ag)

Identify source and eliminate

When processing leaded alloys, either strike plate with nickel
sulfamate or use a warm, alkaline hypophosphite pre-dip to
speed-up deposition prior to EN.

Excessive air agitation

Reduce velocity of the air flow

Improper cleaning

Ensure that the proper pretreatment cycle(s) is used

Improper activation

Change the acid dip.

Change the cleaners
If cleaner has an oil film on surface, dump and clean out tank

Contaminated EN bath

Check quality of make-up water for contamination by heavy

metals (e.g., Pb, Fe, etc. or organics). Use only deionized or
distilled water.

Contaminated rinses

Check that rinses are clear and free running.

Ensure that no oil contaminates any rinse water or tank walls.

Improper loading factor, small area of

work in large solution volume

Increase work area being plated and/or reduce agitation

Turbid, Milky or Steel Gray Appearing Solution (White-Out)

Possible Cause

Corrective Action

Complexor concentration is too low

Increase complexor concentration

pH is too high

Lower pH with dilute sulfuric acid

High orthophosphite content

Dilute or dump bath and remake

Poor mixing of the bath after

Add pre-mixes more slowly and allow to mix

additions
Hypophosphite content is too high

Check, lower pH and reduce the addition rate

Bath is too old (High orthophosphite)

Dump bath and remake

Impurities in air agitation

Replace the air filter

Impurities from poor water feed

Use deionized water

Drag in from pre-treatment steps

Improve rinsing

Electroless Nickel Troubleshooting Guide

PAGE 13

Deposition on Tank Walls and/or Equipment (Plate-out)

Possible Cause

Corrective Action

Stainless steel tank not passivated or

incorrectly anodically protected

Use the proper strength (> 25%) of nitric acid

Increase time of nitric acid passivation
Set potential to the proper voltage

Inadequate filtration

Improve filtration

Insufficient work movement

Install mechanical agitation of parts

Occlusion of suspended particles

Improve filtration of EN solution

Tank materials etched or damaged

Check for compatibility of tank materials with EN chemistry

Stabilizer content is too low

Add NICHEM Stabilizer

Parts dropped in a SS tank disturb

passivation

Improve racking to prevent parts from falling into tank

Bath temperature is too high

Reduce temperature to within recommended range

High pH cause salts to precipitate

Check and adjust pH

Filter the solution

Excessive additions

Make small, frequent additions

Always make additions away from coils and heaters and not
onto work

Localized overheating

Use derated type electric heaters

Increase the area between steam coil and tank walls to improve
solution circulation

Excessive work load

Reduce work load to recommended range

Rapid Solution pH Change

Possible Cause

Corrective Action

High work load

Reduce load size; recalculate surface area of parts

Plating on tank walls &/or equipment

Filter bath out; strip tank and equipment with nitric acid

Drag-in of pre-plate chemicals

Improve pre-plate rinsing

Electroless Nickel Troubleshooting Guide

PAGE 14

TEST PROCEDURES
Porosity Tests
Ferroxyl (Steel)
Immerse a cleaned EN plated sample in a solution containing 25 grams of potassium ferrocyanide and 15
grams of sodium chloride in one liter of deionized water at ambient temperature for 30 seconds. Blue spots
appearing on the sample indicate porosity in the EN coating.
Hot Deionized Water (Steel)
Immerse a cleaned sample in boiling deionized water for five minutes. Remove article and rinse in methanol
and dry. Rust spots appearing on the sample indicate porosity in the EN coating.
Copper Sulfate (Steel)
Immerse or swab the sample with a solution of saturated copper sulfate for 15 seconds. Pore sites are
indicated by copper-colored spots.
Hydrochloric Acid. (Steel and Aluminum)
Immerse a cleaned sample in 50% by volume hydrochloric acid for two minutes at ambient temperature.
Gassing indicates porosity over steel. Black spots indicate porosity over aluminum.
Alizarin (Aluminum)
Immerse a cleaned sample in a 10% (by wt.) solution of sodium hydroxide in water at ambient temperature (6575o F). After three minutes, the sample shall be removed, rinsed in water, and then immersed in ambient
temperature alizarin sulfonate solution. After four minutes, the sample shall be removed and repeatedly dipped
in glacial acetic acid until the violet color disappears. Any remaining red spots indicate porosity. The alizarin
sulfonate solution is prepared by dissolving 1.5 grams of methyl cellulose in 90 ml. of boiling deionized water to
which, after cooling, a solution of 0.1 grams alizarin sulfonic acid dissolved in 5 ml of ethanol is added.

Deposit Purity & Corrosion Resistance

Nitric Acid (High Phos. EN)
Immerse a cleaned, dry sample into concentrated 42o B Nitric acid for 30 seconds at ambient temperature. A
high phosphorus EN deposit should not darken in 30 seconds. NOTE: The nitric acid solution used for this test
must be fresh. Acid that has absorbed water from the air can cause parts to fail.

Electroless Nickel Troubleshooting Guide

PAGE 15

METRIC CONVERSION TABLES

Volume
Multiply

by

To Obtain

Cubic centimeters

0.061

cubic inches

Cubic centimeters

2.65x 10-4

gallons

Cubic centimeters

0.0338

ounces (fluid)

Cubic feet

28317

cubic centimeters

Cubic feet

1728

cubic inches

Cubic feet

7.48

gallons

Cubic feet of water 60F

62.37

pounds

Cubic inches

16.39

cubic centimeters

Cubic meters

35.3145

cubic feet

Cubic feet

0.0283

cubic meters

Multiply

by

To Obtain

Cubic feet

28.3162

liters

Cubic inches

0.0164

liters

Gallons

3785.4

cubic centimeters

Gallons (U.S.)

231

cubic inches

Gallons (U.S.)

3.785

liters

Gallons (U.S.)

128

ounces (fluid)

Liters

0.2642

gallons (U.S.)

Liters

0.0353

cubic feet

Liters

61.025

cubic inches

Multiply

by

To Obtain

Grams

0.0353

ounces

Kilograms

2.205

pounds

Ounces

28.35

grams

Pounds

453.6

grams

Capacity

Weight

Electroless Nickel Troubleshooting Guide

PAGE 16

Length
Multiply

by

To Obtain

Centimeters

0.3937

inches

Inches

2.54

centimeters

Feet

0.3048

meters

Meters

3.2808

feet

Miles

1.6093

kilometers

Kilometers

0.6214

miles

Multiply

by

To Obtain

psi

7,000

MPa

Pressure

Electroless Nickel Troubleshooting Guide

PAGE 17

TEMPERATURE CONVERSION TABLES

The numbers in bold face type represent the temperature in degrees Fahrenheit or Celsius that are to be
converted into the other scale. If converting from Fahrenheit to Celsius, the equivalent will be found in the left
column. If converting from Celsius to Fahrenheit, the answer appears in the right column.
o

C
-17.8
-17.2
-16.7
-16.1
-15.6
-15.0
-14.4
-13.9
-13.3
-12.8
-12.2
-11.7
-11.1
-10.6
-10.0
-9.44
-8.89
-8.33
-7.78

0 to 18
F/C
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18

C
-7.22
-6.67
-6.11
-5.56
-5.00
-4.44
-3.89
-3.33
-2.78
-2.22
-1.67
-1.11
-0.56
0
0.56
1.11
1.67
2.22
2.78

19 to 37
F/C
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37

F
32.0
33.8
35.6
37.4
39.2
41.0
42.8
44.6
46.4
48.2
50.0
51.8
53.6
55.4
57.2
59.0
60.8
62.6
64.4

C
3.33
3.89
4.44
5.00
5.56
6.11
6.67
7.22
7.78
8.33
8.89
9.44
10.0
10.6
11.1
11.7
12.2
12.8
13.3

38 to 56
F/C
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56

C
13.9
14.1
15.0
15.6
16.1
16.7
17.2
17.8
18.3
18.9
19.4
20.0
20.6
21.1
21.7
22.2
22.8
23.4
23.9

57 to 75
F/C
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75

F
100.4
102.2
104.0
105.8
107.6
109.4
111.2
113.0
114.8
116.6
118.4
120.2
122.0
123.8
125.6
127.4
129.2
131.0
132.8

C
24.4
25.0
25.6
26.1
26.7
27.2
27.8
28.3
28.9
29.4
30.0
30.6
31.1
31.7
32.2
32.8
33.3
33.9
34.4

76 to 94
F/C
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94

C
35.0
35.6
36.1
36.7
37.2
37.8
43.0
49.0
54.0
60.0
66.0
71.0
77.0
82.0
88.0
93.0
99.0
100.0
101.7

95 to 215
F/C
95
96
97
98
99
100
110
120
130
140
150
160
170
180
190
200
210
212
215

F
66.2
68.0
69.8
71.6
73.4
75.2
77.0
78.8
80.6
82.4
84.2
86.0
87.8
89.6
91.4
93.2
95.0
96.8
98.6

F
168.8
170.6
172.4
174.2
176.0
177.8
179.6
181.4
183.2
185.0
186.8
188.6
190.4
192.2
194.0
195.8
197.6
199.4
201.2

F
134.6
136.4
138.2
140.0
141.8
143.6
145.1
147.2
149.0
150.8
152.6
154.4
156.2
158.0
159.8
161.6
163.4
165.2
167.0

F
203.0
204.8
206.6
208.4
210.2
212.0
230.0
248.0
266.0
284.0
302.0
320.0
338.0
256.0
374.0
392.0
410.0
413.0
419.0