Max3070e Max3079e PDF

MAX3070EMAX3079E
LE
AVAILAB
+3.3V, 15kV ESD-Protected, Fail-Safe,

Hot-Swap, RS-485/RS-422 Transceivers
General Description
The MAX3070EMAX3079E 3.3V, 15kV ESD-protected,
RS-485/RS-422 transceivers feature one driver and one
receiver. These devices include fail-safe circuitry, guaranteeing a logic-high receiver output when receiver
inputs are open or shorted. The receiver outputs a logic
high if all transmitters on a terminated bus are disabled
(high impedance). The MAX3070EMAX3079E include a
hot-swap capability to eliminate false transitions on the
bus during power-up or hot insertion.
The MAX3070E/MAX3071E/MAX3072E feature reduced
slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing
error-free data transmission up to 250kbps. The
MAX3073E/MAX3074E/MAX3075E also feature slewrate-limited drivers but allow transmit speeds up to
500kbps. The MAX3076E/MAX3077E/MAX3078E driver
slew rates are not limited, making transmit speeds up to
16Mbps possible. The MAX3079E slew rate is pin
selectable for 250kbps, 500kbps, and 16Mbps.
The MAX3072E/MAX3075E/MAX3078E are intended for
half-duplex communications, and the MAX3070E/
MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX307
7E are intended for full-duplex communications. The
MAX3079E is selectable for half-duplex or full-duplex
operation. It also features independently programmable
receiver and transmitter output phase through
separate pins.
The MAX3070EMAX3079E transceivers draw 800A
of supply current when unloaded or when fully loaded
Functional
with the drivers disabled.
All devices Diagrams
have a 1/8-unit
load receiver input impedance, allowing up to 256
transceivers on the bus.
Applications
Lighting Systems
Industrial Control
Features
3.3V Operation
Electrostatic Discharge (ESD) Protection for
RS-485 I/O Pins
15kV Human Body Model
True Fail-Safe Receiver While Maintaining
EIA/TIA-485 Compatibility
Hot-Swap Input Structure on DE and RE
Enhanced Slew-Rate Limiting Facilitates ErrorFree Data Transmission
(MAX3070EMAX3075E/MAX3079E)
Low-Current Shutdown Mode (Except
MAX3071E/MAX3074E/MAX3077E)
Pin-Selectable Full-/Half-Duplex Operation
(MAX3079E)
Phase Controls to Correct for Twisted-Pair
Reversal (MAX3079E)
Allow Up to 256 Transceivers on the Bus
Available in Industry-Standard 8-Pin SO Package
Ordering
Ordering Information
Information
PART
TEMP RANGE
PIN-PACKAGE
MAX3070EEPD
-40C to +85C
14 Plastic DIP
MAX3070EESD
-40C to +85C
14 SO
MAX3070EAPD
-40C to +125C
MAX3070EASD
-40C to +125C
MAX3071EEPA
-40C to +85C
14 Plastic DIP
14 SO
8 Plastic DIP
MAX3071EESA
-40C to +85C
MAX3071EAPA
-40C to +125C
8 Plastic DIP
8 SO
MAX3071EASA
-40C to +125C
8 SO
Security Systems
Devices are available in both leaded (Pb) and lead(Pb)-free

packaging. Specify lead-free by adding a + after the part
number.
Instrumentation
Ordering Information continued at end of data sheet.
Telecom
Selector Guide, Pin Configurations, and Typical Operating

Circuits appear at end of data sheet.
Pin Configurations appear at end of data sheet.
Functional Diagrams continued at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com.
19-2668; Rev 2; 4/09
MAX3070EMAX3079E
ABSOLUTE MAXIMUM RATINGS
Continuous Power Dissipation (TA = +70C)
8-Pin SO (derate 5.88mW/C above +70C) .................471mW
8-Pin Plastic DIP (derate 9.09mW/C above +70C) .....727mW
14-Pin SO (derate 8.33mW/C above +70C) ...............667mW
14-Pin Plastic DIP (derate 10.0mW/C above +70C) ...800mW
Operating Temperature Ranges
MAX307_EE_ _ ................................................-40C to +85C
MAX307_EA_ _ ..............................................-40C to +125C
MAX3077EMSA .............................................-55C to +125C
Junction Temperature ......................................................+150C
Storage Temperature Range .............................-65C to +150C
Lead Temperature (soldering, 10s) .................................+300C
(All voltages referenced to GND)

Supply Voltage (VCC).............................................................+6V
Control Input Voltage (RE, DE, SLR,
H/F, TXP, RXP)......................................................-0.3V to +6V
Driver Input Voltage (DI)...........................................-0.3V to +6V
Driver Output Voltage (Z, Y, A, B) .............................-8V to +13V
Receiver Input Voltage (A, B)....................................-8V to +13V
Receiver Input Voltage
Full Duplex (A, B) ..................................................-8V to +13V
Receiver Output Voltage (RO)....................-0.3V to (VCC + 0.3V)
Driver Output Current .....................................................250mA
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = 3.3V 10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DRIVER
Differential Driver Output
Change in Magnitude of
Differential Output Voltage
Driver Common-Mode Output
Voltage
Change in Magnitude of
Common-Mode Voltage
Input High Voltage
Input Low Voltage
Input Hysteresis
Input Current
VOD
VOD
VOC
VOC
VCC
RL = 54 (RS485), Figure 1
1.5
VCC
VCC
RL = 100 or 54, Figure 1 (Note 2)
0.2
0.2
RL = 100 or 54, Figure 1
VIL
DE, DI, RE, TXP, RXP, H/F
VHYS
I IN2
VCC / 2
RL = 100 or 54, Figure 1 (Note 2)

I IN1
2
0.8
DE, DI, RE
10
k
10
40
VCC x 0.4
SRL Input Low Voltage
TXP, RXP, H/F internal pulldown
SRL Input Middle Voltage
V
VCC x 0.6
0.4
SRL = VCC
SRL = GND
IO
V
mV
DE
VCC - 0.4
Output Leakage (Y and Z)

Full Duplex
V
100
SRL Input High Voltage
SRL Input Current
No load
VIH
Input Impedance First Transition

Input Current
RL = 100 (RS422), Figure 1
DE = GND,
VCC = GND or 3.6V
75
-75
VIN = +12V
VIN = -7V
125
-100
V
V
A
A
Maxim Integrated
MAX3070EMAX3079E
DC ELECTRICAL CHARACTERISTICS (continued)
(VCC = 3.3V 10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25C.) (Note 1)
PARAMETER
SYMBOL
Driver Short-Circuit Output

Current
I OSD
Driver Short-Circuit Foldback

Output Current
I OSDF
Thermal-Shutdown Threshold
TTS
Thermal-Shutdown Hysteresis
TTSH
Input Current (A and B)
CONDITIONS
MIN
0 V OUT 12V (Note 3)

-7V VOUT VCC (Note 3)
(VCC - 1V) VOUT 12V (Note 3)
TYP
MAX
40
250
-250
-40
20
-7V VOUT 1V (Note 3)
-20
IA, B
VTH
-7V VCM 12V
VIN = -7V
mA
15
VIN = +12V
mA
175
DE = GND,
VCC = GND or 3.6V
UNITS
125
-100
RECEIVER
Receiver Differential Threshold
Voltage
-200
-125
-50
mV
Receiver Input Hysteresis
VTH
VA + VB = 0V
RO Output High Voltage
VOH
I O = -1mA
RO Output Low Voltage
VOL
I O = 1mA
0.4
Three-State Output Current at

Receiver
I OZR
0 V O VCC
Receiver Input Resistance
RIN
-7V VCM 12V
Receiver Output Short-Circuit

Current
I OSR
0V VRO VCC
15
mV
VCC - 0.6
96
k
80
mA
SUPPLY CURRENT
Supply Current
Supply Current in Shutdown
Mode
ICC
I SHDN
No load, RE = 0, DE = VCC
0.8
1.5
No load, RE = VCC, DE = VCC
0.8
1.5
No load, RE = 0, DE = 0
0.8
1.5
RE = VCC, DE = GND
0.05
10
Human Body Model
15
mA
ESD PROTECTION
ESD Protection for Y, Z, A, and B
kV
Note 1: All currents into the device are positive. All currents out of the device are negative. All voltages are referred to device
ground, unless otherwise noted.
Note 2: VOD and VOC are the changes in VOD and VOC, respectively, when the DI input changes state.
Note 3: The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback output current applies during current limiting to allow a recovery from bus contention.
Maxim Integrated
MAX3070EMAX3079E
DRIVER SWITCHING CHARACTERISTICS
MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)
(VCC = 3.3V 10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25C.)
PARAMETER
Driver Propagation Delay
SYMBOL
tDPLH
tDPHL
CONDITIONS
CL= 50pF, RL= 54, Figures 2 and 3
Driver Differential Output Rise or

Fall Time
tDR , tDF
Differential Driver Output Skew

|tDPLH - tDPHL|
tDSKEW
Maximum Data Rate
MIN
TYP
MAX
UNITS
250
1500
250
1500
350
1600
ns
200
ns
ns
250
kbps
Driver Enable to Output High
tDZH
Figure 4
2500
Driver Enable to Output Low
tDZL
Figure 5
2500
ns
Driver Disable Time from Low
tDLZ
Figure 5
100
ns
Driver Disable Time from High
tDHZ
Figure 4
100
ns
Driver Enable from Shutdown to

Output High
tDZH(SHDN) Figure 4
5500
ns

Output Low
tDZL(SHDN) Figure 5
5500
ns
600
ns
Time to Shutdown
tSHDN
50
200
ns
RECEIVER SWITCHING CHARACTERISTICS

MAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)
PARAMETER
Receiver Propagation Delay
Receiver Output Skew
|tRPLH - tRPHL|
SYMBOL
tRPLH
tRPHL
tRSKEW
CONDITIONS
TYP
MAX
200
CL = 15pF, Figures 6 and 7
200
Maximum Data Rate
30
250
UNITS
ns
ns
kbps
Receiver Enable to Output Low
tRZL
Figure 8
50
ns
Receiver Enable to Output High
tRZH
Figure 8
50
ns
Receiver Disable Time from Low
tRLZ
Figure 8
50
ns
Receiver Disable Time from High
tRHZ
Figure 8
50
ns
Receiver Enable from Shutdown

to Output High
tRZH(SHDN) Figure 8
4000
ns

to Output Low
tRZL(SHDN) Figure 8
4000
ns
600
ns
Time to Shutdown
MIN
tSHDN
50
200
Maxim Integrated
MAX3070EMAX3079E
MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps)
PARAMETER
SYMBOL
tDPLH
tDPHL
CONDITIONS
CL = 50pF, RL = 54, Figures 2 and 3

Fall Time
tDR , tDF

|tDPLH - tDPHL|
tDSKEW
Maximum Data Rate
MIN
TYP
MAX
UNITS
180
800
180
800
200
800
ns
100
ns
500
ns
kbps
tDZH
Figure 4
2500
ns
tDZL
Figure 5
2500
ns
tDLZ
Figure 5
100
ns
tDHZ
Figure 4
100
ns

Output High
tDZH(SHDN) Figure 4
4500
ns

Output Low
tDZL(SHDN) Figure 5
4500
ns
600
ns
MAX
UNITS
Time to Shutdown
tSHDN
50
200

MAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = VCC (500kbps)
PARAMETER
|tRPLH - tRPHL|
SYMBOL
tRPLH
tRPHL
tRSKEW
CONDITIONS
MIN
TYP
200
200
Maximum Data Rate
30
500
ns
ns
kbps
tRZL
Figure 8
50
ns
tRZH
Figure 8
50
ns
tRLZ
Figure 8
50
ns
tRHZ
Figure 8
50
ns

to Output High
tRZH(SHDN) Figure 8
4000
ns

to Output Low
tRZL(SHDN) Figure 8
4000
ns
600
ns
Time to Shutdown
Maxim Integrated
tSHDN
50
200
MAX3070EMAX3079E
MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)
PARAMETER
SYMBOL
tDPLH
tDPHL
CONDITIONS
MIN
TYP
MAX
50
CL = 50pF, RL= 54, Figures 2 and 3
50
UNITS
ns

Fall Time
tDR , tDF
15
ns

|tDPLH - tDPHL|
tDSKEW
ns
Maximum Data Rate
16
Mbps
tDZH
Figure 4
150
ns
tDZL
Figure 5
150
ns
tDLZ
Figure 5
100
ns
tDHZ
Figure 4
100
ns

Output High
tDZH(SHDN) Figure 4
1250
1800
ns

Output Low
tDZL(SHDN) Figure 5
1250
1800
ns
200
600
ns
TYP
MAX
UNITS
40
75
40
75
Time to Shutdown
tSHDN
50

MAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)
PARAMETER
|tRPLH - tRPHL|
SYMBOL
tRPLH
tRPHL
tRSKEW
CONDITIONS
Maximum Data Rate
8
16
ns
ns
Mbps
tRZL
Figure 8
50
ns
tRZH
Figure 8
50
ns
tRLZ
Figure 8
50
ns
tRHZ
Figure 8
50
ns

to Output High
tRZH(SHDN) Figure 8
1800
ns

to Output Low
tRZL(SHDN) Figure 8
1800
ns
600
ns
Time to Shutdown
MIN
tSHDN
50
200
Maxim Integrated
MAX3070EMAX3079E
Typical Operating Characteristics
(VCC = 3.3V, TA = +25C, unless otherwise noted. Note: The MAX3077EMSA/PR meets specification over temperature.)
OUTPUT CURRENT
vs. RECEIVER OUTPUT HIGH VOLTAGE
DE = 0
0.7
0.6
MAX3070E toc02
20
15
10
-25
25
50
75
100
20
15
10
125
0.5
1.0
1.5
2.0
2.5
3.5
3.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
OUTPUT HIGH VOLTAGE (V)
RECEIVER OUTPUT HIGH VOLTAGE

vs. TEMPERATURE
RECEIVER OUTPUT LOW VOLTAGE

vs. TEMPERATURE
DRIVER OUTPUT CURRENT

vs. DIFFERENTIAL OUTPUT VOLTAGE
3.15
3.10
0.7
3.05
0.6
0.5
0.4
0.3
90
80
0.2
25
50
75
100
50
40
30
0
-50
125
60
10
0
-25
70
20
0.1
3.00
MAX3070E toc06
IO = -1mA
OUTPUT CURRENT (mA)
3.20
100
MAX3070E toc05
3.25
0.8
OUTPUT LOW VOLTAGE (V)
IO = -1mA
MAX3070E toc04
TEMPERATURE (C)
3.30
-50
25
0
-50
-25
25
50
75
100
125
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TEMPERATURE (C)
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER DIFFERENTIAL OUTPUT VOLTAGE

vs. TEMPERATURE
OUTPUT CURRENT
vs. TRANSMITTER OUTPUT HIGH VOLTAGE
OUTPUT CURRENT
vs. TRANSMITTER OUTPUT LOW VOLTAGE
2.30
2.20
2.10
2.00
1.90
140
120
100
80
60
-50
-25
25
50
75
TEMPERATURE (C)
Maxim Integrated
100
125
140
120
100
80
60
40
20
20
0
1.60
160
40
1.80
1.70
180
MAX3070E toc09
2.40
160
OUTPUT CURRENT (mA)
RL = 54
2.50
OUTPUT CURRENT (mA)
2.60
XMAX3070E toc07
TEMPERATURE (C)
MAX3070E toc08
30
0.5
DIFFERENTIAL OUTPUT VOLTAGE (V)
35
OUTPUT CURRENT (mA)
DE = VCC
0.8
25
OUTPUT CURRENT (mA)
0.9
SUPPLY CURRENT (mA)
30
MAX3070E toc01
1.0
OUTPUT CURRENT
vs. RECEIVER OUTPUT LOW VOLTAGE
MAX3070E toc03
SUPPLY CURRENT vs. TEMPERATURE
-7 -6 -5 -4 -3 -2 -1
10
12
OUTPUT LOW VOLTAGE (V)
MAX3070EMAX3079E
Typical Operating Characteristics (continued)
SHUTDOWN CURRENT
vs. TEMPERATURE
1.4
1.2
1.0
0.8
0.6
0.4
tDPLH
tDPHL
800
700
600
MAX3070E toc12
900
500
DRIVER PROPAGATION DELAY (ns)
1.6
1000
MAX3070E toc11
1.8
MAX3070E toc10
2.0
SHUTDOWN CURRENT (A)
DRIVER PROPAGATION DELAY

vs. TEMPERATURE (500kbps)

vs. TEMPERATURE (250kbps)
450
tDPLH
400
tDPHL
350
300
250
0.2
-25
25
50
75
100
-50
125
-25
25
50
75
100
25
50
75
100

vs. TEMPERATURE (16Mbps)
RECEIVER PROPAGATION DELAY

vs. TEMPERATURE (250kbps AND 500kbps)

vs. TEMPERATURE (16Mbps)
tDPLH
15
tDPHL
10
5
120
90
tDPLH
tDPHL
60
30
25
50
75
100
125
60
50
tDPLH
40
tDPHL
30
20
10
0
0
-25
70
RECEIVER PROPAGATION DELAY (ns)
20
MAX3070E toc14
MAX3070E toc13
25
150
-50
-25
TEMPERATURE (C)
25
50
75
100
125
-50
-25
25
50
75
100
125
TEMPERATURE (C)
TEMPERATURE (C)

(250kbps AND 500kbps)
DRIVER PROPAGATION DELAY (250kbps)
MAX3070E toc17
MAX3070E toc16
VA - VB
1V/div
DI
2V/div
VY - VZ
2V/div
1s/div
125
MAX3070E toc15
TEMPERATURE (C)
-25
TEMPERATURE (C)
30
-50
-50
125
TEMPERATURE (C)
-50
200
500
RO
2V/div
200ns/div
Maxim Integrated
MAX3070EMAX3079E
Typical Operating Characteristics (continued)
DRIVER PROPAGATION DELAY (500kbps)
RECEIVER PROPAGATION DELAY (16Mbps)
DRIVER PROPAGATION DELAY (16Mbps)
MAX3070E toc18
MAX3070E toc20
MAX3070E toc19
VA
1V/div
DI
2V/div
DI
2V/div
VB
1V/div
VZ
1V/div
VY - VZ
2V/div
RO
2V/div
VY
1V/div
400ns/div
20ns/div
10ns/div
Test Circuits and Waveforms

3V
DE
RL/2
VOD
DI
VOC
RL/2
VOD
RL
CL
Figure 1. Driver DC Test Load
Figure 2. Driver Timing Test Circuit
VCC
DI
VCC/2
0
tDPLH
tDPHL
1/2 VO
Z
VO
Y
1/2 VO
VO
VDIFF 0
-VO
VDIFF = V (Y) - V (Z)

10%
90%
90%
10%
tDF
tDR
tSKEW = | tDPLH - tDPHL |
Figure 3. Driver Propagation Delays
Maxim Integrated
MAX3070EMAX3079E
Test Circuits and Waveforms (continued)
S1
D
0 OR 3V
OUT
CL
50pF
GENERATOR
RL = 500
50
VCC
DE
VCC / 2
tDZH, tDZH(SHDN)
0
0.25V
OUT
VOH
VOM = (0 + VOH) / 2
0
tDHZ
Figure 4. Driver Enable and Disable Times (tDHZ, tDZH, tDZH(SHDN))
VCC
RL = 500
S1
0 OR 3V
OUT
CL
50pF
GENERATOR
50
VCC
DE
VCC / 2
tDZL, tDZL(SHDN)
tDLZ
VCC
VOM = (VOL + VCC) / 2
OUT
VOL
0.25V
Figure 5. Driver Enable and Disable Times (tDZL, tDLZ, tDLZ(SHDN))
10
Maxim Integrated
MAX3070EMAX3079E
Test Circuits and Waveforms (continued)
B
VID
ATE
RECEIVER
OUTPUT
+1V
-1V
tRPLH
VOH
A
RO
tRPHL
1.5V
VOL
THE RISE TIME AND FALL TIME OF INPUTS A AND B < 4ns
Figure 6. Receiver Propagation Delay Test Circuit
Figure 7. Receiver Propagation Delays

S1
+1.5V
S3
VCC
1k
-1.5V
VID
R
CL
15pF
GENERATOR
S2
50
S1 OPEN
S2 CLOSED
S3 = +1.5V
S1 CLOSED
S2 OPEN
S3 = -1.5V
3V
3V
1.5V
RE
RE
tRZH, tRZH(SHDN)
tRZL, tRZL(SHDN)
VOH
RO
VCC
VOH / 2
(VOL + VCC) / 2
RO
S1 OPEN
S2 CLOSED
S3 = +1.5V
VOL
S1 CLOSED
S2 OPEN
S3 = -1.5V
3V
1.5V
1.5V
RE
tRHZ
3V
RE
0
tRLZ
VCC
VOH
0.25V
RO
0
RO
0.25V
VOL
Figure 8. Receiver Enable and Disable Times
Maxim Integrated
11
MAX3070EMAX3079E
Pin Description
PIN
MAX3070E
MAX3073E
MAX3076E
MAX3071E
MAX3074E
MAX3077E
FULL-DUPLEX
DEVICES
MAX3079E
HALFDUPLEX
DEVICES
FULLHALFDUPLE
DUPLE
X MODE X MODE
NAME
FUNCTION
H/F
Half-/Full-Duplex Select Pin. Connect H/F to VCC for halfduplex mode; connect to GND or leave unconnected for
full-duplex mode.
RO
Receiver Output. When RE is low and if (A - B) -50mV,

RO is high; if (A - B) -200mV, RO is low.
RE
Receiver Output Enable. Drive RE low to enable RO; RO

is high impedance when RE is high. Drive RE high and
DE low to enter low-power shutdown mode. RE is a hotswap input (see the Hot-Swap Capability section for
details).
DE
Driver Output Enable. Drive DE high to enable driver

outputs. These outputs are high impedance when DE is
low. Drive RE high and DE low to enter low-power
shutdown mode. DE is a hot-swap input (see the HotSwap Capability section for details).
DI
Driver Input. With DE high, a low on DI forces noninverting

output low and inverting output high. Similarly, a high on
DI forces noninverting output high and inverting output
low.
12
MAX3072E
MAX3075E
MAX3078E
SRL
Slew-Rate Limit Selector Pin. Connect SRL to ground for

16Mbps communication rate; connect to VCC for
500kbps communication rate. Leave unconnected for
250kbps communication rate.
6, 7
GND
Ground
TXP
Transmitter Phase. Connect TXP to ground or leave

unconnected for normal transmitter phase/polarity.
Connect to VCC to invert the transmitter phase/polarity.
Noninverting Driver Output
Noninverting Driver Output and Noninverting Receiver

Input*
10
10
Inverting Driver Output
10
Inverting Driver Output and Inverting Receiver Input*
11
11
Inverting Receiver Input
11
Receiver Input Resistors*
Inverting Receiver Input and Inverting Driver Output
Maxim Integrated
MAX3070EMAX3079E
Pin Description (continued)
PIN
MAX3070E
MAX3073E
MAX3076E
MAX3071E
MAX3074E
MAX3077E
FULL-DUPLEX
DEVICES
MAX3072E
MAX3075E
MAX3078E
MAX3079E
HALFDUPLEX
DEVICES
FULLHALFDUPLE
DUPLE
X MODE X MODE
NAME
FUNCTION
12
12
Noninverting Receiver Input
12
Receiver Input Resistors*

Noninverting Receiver Input and Noninverting Driver
Output
13
13
RXP
Receiver Phase. Connect RXP to GND or leave

unconnected for normal transmitter phase/polarity.
Connect to VCC to invert receiver phase/polarity.
14
14
14
VCC
Positive Supply VCC = 3.3V 10%. Bypass VCC to GND

with a 0.1F capacitor.
1, 8, 13
N.C.
No Connect. Not internally connected. Can be

connected to GND.
*MAX3079E only. In half-duplex mode, the driver outputs serve as receiver inputs. The full-duplex receiver inputs (A and B) still have a
1/8-unit load, but are not connected to the receiver.
Function Tables
MAX3070E/MAX3073E/MAX3076E
TRANSMITTING
TRANSMITTING
INPUTS
INPUT
OUTPUTS
OUTPUTS
RE
DE
DI
DI
High-Z
High-Z
RECEIVING
INPUTS
RECEIVING
Shutdown
OUTPUT
INPUTS
OUTPUT
A, B
RO
-50mV
RE
DE
A, B
RO
-200mV
-50mV
Open/shorted
-200mV
Open/
shorted
High-Z
Shutdown
Maxim Integrated
13
MAX3070EMAX3079E
Function Tables (continued)
RECEIVING
TRANSMITTING
INPUTS
INPUTS
OUTPUTS
OUTPUTS
RE
DE
DI
B/Z
A/Y
RE
DE
A-B
RO
-50mV
-200mV
Open/
shorted
High-Z
Shutdown
0
1
High-Z
High-Z
Shutdown
MAX3079E
TRANSMITTING
INPUTS
OUTPUTS
TXP
RE
DE
DI
High-Z
High-Z
Shutdown
RECEIVING
INPUTS
OUTPUTS
H/F
RXP
RE
DE
A, B
Y, Z
RO
> -50mV
< -200mV
> -50mV
0
1
< -200mV
> -50mV
< -200mV
> -50mV
< -200mV
Open/shorted
Open/shorted
Open/shorted
Open/shorted
High-Z
Shutdown
X = Dont care; shutdown mode, driver and receiver outputs are high impedance.
14
Maxim Integrated
MAX3070EMAX3079E
Detailed Description
The MAX3070EMAX3079E high-speed transceivers for
RS-485/RS-422 communication contain one driver and
one receiver. These devices feature fail-safe circuitry,
which guarantees a logic-high receiver output when the
receiver inputs are open or shorted, or when they are
connected to a terminated transmission line with all drivers disabled (see the Fail-Safe section). The
MAX3070E/MAX3072E/MAX3073E/MAX3075E/
MAX3076E/MAX3078E/MAX3079E also feature a hotswap capability allowing line insertion without erroneous data transfer (see the Hot Swap Capability
section). The MAX3070E/MAX3071E/MAX3072E feature
reduced slew-rate drivers that minimize EMI and
reduce reflections caused by improperly terminated
cables, allowing error-free data transmission up to
250kbps. The MAX3073E/MAX3074E/MAX3075E also
offer slew-rate limits allowing transmit speeds up to
500kbps. The MAX3076E/MAX3077E/MAX3078Es driver slew rates are not limited, making transmit speeds
up to 16Mbps possible. The MAX3079Es slew rate is
selectable between 250kbps, 500kbps, and 16Mbps
by driving a selector pin with a three-state driver.
The MAX3072E/MAX3075E/MAX3078E are half-duplex
transceivers, while the MAX3070E/MAX3071E/
MAX3073E/MAX3074E/MAX3076E/MAX3077E are fullduplex transceivers. The MAX3079E is selectable
between half- and full-duplex communication by driving
a selector pin (SRL) high or low, respectively.
All devices operate from a single 3.3V supply. Drivers are
output short-circuit current limited. Thermal-shutdown circuitry protects drivers against excessive power dissipation. When activated, the thermal-shutdown circuitry
places the driver outputs into a high-impedance state.
Receiver Input Filtering

The receivers of the MAX3070EMAX3075E, and the
MAX3079E when operating in 250kbps or 500kbps
mode, incorporate input filtering in addition to input
hysteresis. This filtering enhances noise immunity with
differential signals that have very slow rise and fall
times. Receiver propagation delay increases by 25%
due to this filtering.
Fail-Safe
The MAX3070E family guarantees a logic-high receiver
output when the receiver inputs are shorted or open, or
when they are connected to a terminated transmission
line with all drivers disabled. This is done by setting the
receiver input threshold between -50mV and -200mV. If
the differential receiver input voltage (A - B) is greater
than or equal to -50mV, RO is logic high. If A - B is less
Maxim Integrated
than or equal to -200mV, RO is logic low. In the case of

a terminated bus with all transmitters disabled, the
receivers differential input voltage is pulled to 0V by
the termination. With the receiver thresholds of the
MAX3070E family, this results in a logic high with a
50mV minimum noise margin. Unlike previous fail-safe
devices, the -50mV to -200mV threshold complies with
the 200mV EIA/TIA-485 standard.
Hot-Swap Capability
(Except MAX3071E/MAX3074E/MAX3077E)
Hot-Swap Inputs
When circuit boards are inserted into a hot, or powered, backplane, differential disturbances to the data
bus can lead to data errors. Upon initial circuit board
insertion, the data communication processor undergoes its own power-up sequence. During this period,
the processors logic-output drivers are high impedance and are unable to drive the DE and RE inputs of
these devices to a defined logic level. Leakage currents up to 10A from the high-impedance state of the
processors logic drivers could cause standard CMOS
enable inputs of a transceiver to drift to an incorrect
logic level. Additionally, parasitic circuit board capacitance could cause coupling of V CC or GND to the
enable inputs. Without the hot-swap capability, these
factors could improperly enable the transceivers driver
or receiver.
When VCC rises, an internal pulldown circuit holds DE
low and RE high. After the initial power-up sequence,
the pulldown circuit becomes transparent, resetting the
hot-swap tolerable input.
Hot-Swap Input Circuitry

The enable inputs feature hot-swap capability. At the
input there are two NMOS devices, M1 and M2
(Figure 9). When VCC ramps from zero, an internal 10s
timer turns on M2 and sets the SR latch, which also
turns on M1. Transistors M2, a 500A current sink, and
M1, a 100A current sink, pull DE to GND through a
5k resistor. M2 is designed to pull DE to the disabled
state against an external parasitic capacitance up to
100pF that can drive DE high. After 10s, the timer
deactivates M2 while M1 remains on, holding DE low
against three-state leakages that can drive DE high. M1
remains on until an external source overcomes the
required input current. At this time, the SR latch resets
and M1 turns off. When M1 turns off, DE reverts to a
standard, high-impedance CMOS input. Whenever VCC
drops below 1V, the hot-swap input is reset.
For RE there is a complementary circuit employing two
PMOS devices pulling RE to VCC.
15
MAX3070EMAX3079E
operation. Drive H/F high for half-duplex operation. In
full-duplex mode, the pin configuration of the driver and
receiver is the same as that of a MAX3070E. In halfduplex mode, the receiver inputs are switched to the
driver outputs, connecting outputs Y and Z to inputs A
and B, respectively. In half-duplex mode, the internal
full-duplex receiver input resistors are still connected to
pins 11 and 12.
VCC
10s
TIMER
SR LATCH
TIMER
15kV ESD Protection
5k
DE
(HOT SWAP)
DE
100A
500A
M1
M2
Figure 9. Simplified Structure of the Driver Enable Pin (DE)
MAX3079E Programming
The MAX3079E has several programmable operating
modes. Transmitter rise and fall times are programmable, resulting in maximum data rates of 250kbps,
500kbps, and 16Mbps. To select the desired data rate,
drive SRL to one of three possible states by using a
three-state driver: V CC , GND, or unconnected. For
250kbps operation, set the three-state device in highimpedance mode or leave SRL unconnected. For
500kbps operation, drive SRL high or connect it to VCC.
For 16Mbps operation, drive SRL low or connect it to
GND. SRL can be changed during operation without
interrupting data communications.
Occasionally, twisted-pair lines are connected backward
from normal orientation. The MAX3079E has two pins that
invert the phase of the driver and the receiver to correct
this problem. For normal operation, drive TXP and RXP
low, connect them to ground, or leave them unconnected (internal pulldown). To invert the driver phase, drive
TXP high or connect it to VCC. To invert the receiver
phase, drive RXP high or connect it to VCC. Note that the
receiver threshold is positive when RXP is high.
The MAX3079E can operate in full- or half-duplex
mode. Drive the H/F pin low, leave it unconnected
(internal pulldown), or connect it to GND for full-duplex
16
As with all Maxim devices, ESD-protection structures

are incorporated on all pins to protect against electrostatic discharges encountered during handling and
assembly. The driver outputs and receiver inputs of the
MAX3070E family of devices have extra protection
against static electricity. Maxims engineers have developed state-of-the-art structures to protect these pins
against ESD of 15kV without damage. The ESD structures withstand high ESD in all states: normal operation,
shutdown, and powered down. After an ESD event, the
MAX3070EMAX3079E keep working without latchup or
damage.
ESD protection can be tested in various ways. The
transmitter outputs and receiver inputs of the
MAX3070EMAX3079E are characterized for protection
to the following limits:
15kV using the Human Body Model
6kV using the Contact Discharge method specified
in IEC 1000-4-2
ESD Test Conditions

ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model
Figure 10a shows the Human Body Model, and Figure
10b shows the current waveform it generates when discharged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5k resistor.
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment. However, it does
not specifically refer to integrated circuits. The
MAX3070E family of devices helps you design equipment to meet IEC 1000-4-2, without the need for additional ESD-protection components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
Maxim Integrated
MAX3070EMAX3079E
RC
1M
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
100pF
RD
1500
IP 100%
90%
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Ir
AMPS
DEVICE
UNDER
TEST
36.8%
10%
0
0
Figure 10a. Human Body ESD Test Model
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
150pF
tDL
CURRENT WAVEFORM
Figure 10b. Human Body Current Waveform

I
100%
90%
RD
330
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
TIME
tRL
IPEAK
RC
50M TO 100M
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
DEVICE
UNDER
TEST
10%
tr = 0.7ns TO 1ns
30ns
60ns
Figure 10c. IEC 1000-4-2 ESD Test Model
current in IEC 1000-4-2, because series resistance is

lower in the IEC 1000-4-2 model. Hence, the ESD withstand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 10c shows the IEC 1000-4-2 model, and Figure
10d shows the current waveform for IEC 1000-4-2 ESD
Contact Discharge test.
The air-gap test involves approaching the device with a
charged probe. The contact-discharge method connects
the probe to the device before the probe is energized.
Machine Model
The machine model for ESD tests all pins using a
200pF storage capacitor and zero discharge resistance. The objective is to emulate the stress caused
when I/O pins are contacted by handling equipment
during test and assembly. Of course, all pins require
this protection, not just RS-485 inputs and outputs.
Maxim Integrated
Figure 10d. IEC 1000-4-2 ESD Generator Current Waveform
Applications Information
256 Transceivers on the Bus
The standard RS-485 receiver input impedance is 12k
(1-unit load), and the standard driver can drive up to 32unit loads. The MAX3070E family of transceivers has a
1/8-unit load receiver input impedance (96k), allowing
up to 256 transceivers to be connected in parallel on one
communication line. Any combination of these devices
as well as other RS-485 transceivers with a total of 32unit loads or fewer can be connected to the line.
Reduced EMI and Reflections

The MAX3070E/MAX3071E/MAX3072E feature reduced
slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing
error-free data transmission up to 250kbps. The
MAX3073E/MAX3074E/MAX3075E offer higher driver
output slew-rate limits, allowing transmit speeds up to
500kbps. The MAX3079E with SRL = VCC or unconnected, are slew-rate limited. With SRL unconnected,
the MAX3079E error-free data transmission is up to
250kbps; with SRL connected to VCC the data transmit
speeds up to 500kbps.
17
MAX3070EMAX3079E
Low-Power Shutdown Mode (Except
MAX3071E/MAX3074E/MAX3077E)
Low-power shutdown mode is initiated by bringing both
RE high and DE low. In shutdown, the devices typically
draw only 50nA of supply current.
RE and DE can be driven simultaneously; the parts are
guaranteed not to enter shutdown if RE is high and DE
is low for less than 50ns. If the inputs are in this state
for at least 600ns, the parts are guaranteed to enter
shutdown.
Enable times t ZH and t ZL (see the Switching
Characteristics section) assume the part was not in a
low-power shutdown state. Enable times tZH(SHDN) and
tZL(SHDN) assume the parts were shut down. It takes
drivers and receivers longer to become enabled from
low-power shutdown mode (tZH(SHDN), tZL(SHDN)) than
from driver/receiver-disable mode (tZH, tZL).
A
R
Line Length
The RS-485/RS-422 standard covers line lengths up to
4000ft. For line lengths greater than 4000ft, use the
repeater application shown in Figure 11.
Typical Applications
The MAX3072E/MAX3075E/MAX3078E/MAX3079E
transceivers are designed for bidirectional data communications on multipoint bus transmission lines. Figures
12 and 13 show typical network applications circuits.
To minimize reflections, terminate the line at both ends
in its characteristic impedance, and keep stub lengths
off the main line as short as possible. The slew-rate-limited MAX3072E/MAX3075E and the two modes of the
MAX3079E are more tolerant of imperfect termination.
MAX3070E/MAX3071E/MAX3073E/
MAX3074E/MAX3076E/MAX3077E/
MAX3079E (FULL-DUPLEX)
RO
RE
Driver Output Protection

Two mechanisms prevent excessive output current and
power dissipation caused by faults or by bus contention.
The first, a foldback current limit on the output stage,
provides immediate protection against short circuits over
the whole common-mode voltage range (see the Typical
Operating Characteristics). The second, a thermal-shutdown circuit, forces the driver outputs into a high-impedance state if the die temperature becomes excessive.
DATA IN
B 120
DE
Chip Information
Z
DI
TRANSISTOR COUNT: 1228

PROCESS: BiCMOS
DATA OUT
Y 120
Figure 11. Line Repeater for MAX3070E/MAX3071E/MAX3073E/

MAX3074E/MAX3076E/MAX3077E/MAX3079E in Full-Duplex
Mode
120
120
DI
DE
B
D
D
DI
DE
RO
A
R
RO
RE
RE
R
MAX3072E
MAX3075E
MAX3078E
MAX3079E (HALF-DUPLEX)
R
D
DI
DE
RO RE
DI
DE
RO RE
Figure 12. Typical Half-Duplex RS-485 Network
18
Maxim Integrated
MAX3070EMAX3079E
A
RO
RE
DE
Y
120
120
DI
Z
Z
120
120
DI
DE
RE
RO
B
R
Y
A
Y
R
D
DI
MAX3070E
MAX3073E
MAX3076E
MAX3079E (FULL-DUPLEX)
DE RE RO
DI
DE RE RO
Figure 13. Typical Full-Duplex RS-485 Network
Selector Guide
PART
HALF/FULLDUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED
LOW-POWER
SHUTDOWN
RECEIVER/
DRIVER
ENABLE
TRANSCEIVERS
ON BUS
PINS
MAX3070E
Full
0.250
Yes
Yes
Yes
256
14
MAX3071E
Full
0.250
Yes
No
No
256
MAX3072E
Half
0.250
Yes
Yes
Yes
256
MAX3073E
Full
0.5
Yes
Yes
Yes
256
14
MAX3074E
Full
0.5
Yes
No
No
256
MAX3075E
Half
0.5
Yes
Yes
Yes
256
MAX3076E
Full
16
No
Yes
Yes
256
14
MAX3077E
Full
16
No
No
No
256
MAX3078E
Half
16
No
Yes
Yes
256
MAX3079E
Selectable
Selectable
Selectable
Yes
Yes
256
14
Maxim Integrated
19
MAX3070EMAX3079E
Pin Configurations and Typical Operating Circuits
VCC
DE
N.C. 1
RO
RE
0.1F
14
4
14 VCC
13 N.C.
12 A
DE 4
11 B
DI 5
10 Z
D
GND 6
9 Y
GND 7
8 N.C.
VCC RE
9
5
DI
MAX3070E
MAX3073E
MAX3076E
Rt
RO
10
Z
12
RO
N.C.
A
Rt
DI
11
B
1, 8, 13
GND
6, 7
GND DE
RE
TYPICAL FULL-DUPLEX OPERATING CIRCUIT
DIP/SO
0.1F
MAX3071E
MAX3074E
MAX3077E
VCC 1
VCC 1
RO 2
DI 3
D
GND 4
5
3
DI
VCC
Rt
RO
Z
8
2
RO
A
Rt
DI
7
B
DIP/SO
GND
4
GND
TYPICAL FULL-DUPLEX OPERATING CIRCUIT
0.1F
RO 1
VCC
RO
RE 2
RE
DE 3
DE
GND
DI
DI 4
VCC
MAX3072E
MAX3075E
MAX3078E
DI
D
A
A
Rt
DE
Rt
B
GND
RO
R
RE
DIP/SO
TYPICAL HALF-DUPLEX OPERATING CIRCUIT
NOTE: PIN LABELS Y AND Z ON TIMING, TEST, AND WAVEFORMS DIAGRAMS.

REFER TO PINS A AND B WHEN DE IS HIGH.
20
Maxim Integrated
MAX3070EMAX3079E
Pin Configurations and Typical Operating Circuits (continued)
VCC
RE
MAX3079E
A
RO
TOP VIEW
H/F 1
14 VCC
RO 2
13 RXP
RE 3
12 A
DE 4
MAX3079E
11 B
DI 5
10 Z
SRL 6
9 Y
GND 7
8 TXP
B
RXP
H/F
TXP
DIP/SO
DI
NOTE: SWITCH POSITIONS

INDICATED FOR H/F = GND.
GND
Maxim Integrated
DE
SRL
21
MAX3070EMAX3079E
Ordering Information (continued)
PART
PART
TEMP RANGE
PIN-PACKAGE
TEMP RANGE
PIN-PACKAGE
MAX3072EEPA
-40C to +85C
8 Plastic DIP
MAX3076EEPD
-40C to +85C
14 Plastic DIP
MAX3072EESA
-40C to +85C
8 SO
MAX3076EESD
-40C to +85C
14 SO
MAX3072EAPA
-40C to +125C
8 Plastic DIP
MAX3076EAPD
-40C to +125C
MAX3072EASA
-40C to +125C
8 SO
MAX3076EASD
-40C to +125C
MAX3073EEPD
-40C to +85C
14 Plastic DIP
MAX3077EEPA
-40C to +85C
14 Plastic DIP
14 SO
8 Plastic DIP
MAX3073EESD
-40C to +85C
14 SO
MAX3077EESA
-40C to +85C
MAX3073EAPD
-40C to +125C
14 Plastic DIP
MAX3077EAPA
-40C to +125C
8 Plastic DIP
8 SO
MAX3073EASD
-40C to +125C
14 SO
MAX3077EASA
-40C to +125C
8 SO
MAX3074EEPA
-40C to +85C
8 Plastic DIP
MAX3077EMSA/PR
-55C to +125C
8 SO
MAX3074EESA
-40C to +85C
8 SO
MAX3078EEPA
-40C to +85C
8 Plastic DIP
MAX3074EAPA
-40C to +125C
8 Plastic DIP
MAX3078EESA
-40C to +85C
8 SO
MAX3074EASA
-40C to +125C
8 SO
MAX3078EAPA
-40C to +125C
8 Plastic DIP
MAX3075EEPA
-40C to +85C
8 Plastic DIP
MAX3078EASA
-40C to +125C
8 SO
MAX3075EESA
-40C to +85C
8 SO
MAX3079EEPD
-40C to +85C
14 Plastic DIP
MAX3075EAPA
-40C to +125C
8 Plastic DIP
MAX3079EESD
-40C to +85C
14 SO
MAX3075EASA
-40C to +125C
8 SO
MAX3079EAPD
-40C to +125C
14 Plastic DIP
MAX3079EASD
-40C to +125C
14 SO
Devices are available in both leaded (Pb) and lead(Pb)-free

packaging. Specify lead-free by adding a + after the part
number.
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a +, #, or - in the
package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the
package regardless of RoHS status.
PACKAGE TYPE
22
PACKAGE CODE
8 Plastic DIP
P8-2
14 Plastic DIP
P14-3
8 SO
S8-4
14 SO
S14-1
DOCUMENT NO.
21-0043
21-0041
Maxim Integrated
MAX3070EMAX3079E
Package Information (continued)
DIM
A
A1
B
C
e
E
H
L
INCHES
MILLIMETERS
MAX
MIN
0.053
0.069
0.010
0.004
0.014
0.019
0.007
0.010
0.050 BSC
0.150
0.157
0.228
0.244
0.016
0.050
MAX
MIN
1.75
1.35
0.10
0.25
0.49
0.35
0.19
0.25
1.27 BSC
3.80
4.00
5.80
6.20
0.40
SOICN .EPS
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a +, #, or - in the
package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the
package regardless of RoHS status.
1.27
VARIATIONS:
1
INCHES
TOP VIEW
DIM
D
D
D
MIN
0.189
0.337
0.386
MAX
0.197
0.344
0.394
MILLIMETERS
MIN
4.80
8.55
9.80
MAX
5.00
8.75
10.00
N MS012
8
AA
14
AB
16
AC
D
A
B
FRONT VIEW
A1
C
0\-8\
L
SIDE VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, .150" SOIC

APPROVAL
Maxim Integrated
DOCUMENT CONTROL NO.
21-0041
REV.
23
MAX3070EMAX3079E
Revision History
REVISION
NUMBER
REVISION
DATE
10/02
4/09
DESCRIPTION
Initial release.
PAGES
CHANGED
Added /PR information to reflect new characterization information for military

temperature version.
2, 3, 7, 8, 12, 13, 19,

2225
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
24
Maxim Integrated
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.

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MAX3070EMAX3079E

+3.3V, 15kV ESD-Protected, Fail-Safe,

Devices are available in both leaded (Pb) and lead(Pb)-free

Ordering Information continued at end of data sheet.

Selector Guide, Pin Configurations, and Typical Operating

19-2668; Rev 2; 4/09

(All voltages referenced to GND)

RL = 54 (RS485), Figure 1

RL = 100 or 54, Figure 1 (Note 2)

RL = 100 or 54, Figure 1

DE, DI, RE, TXP, RXP, H/F

DE, DI, RE, TXP, RXP, H/F

RL = 100 or 54, Figure 1 (Note 2)

SRL Input Low Voltage

TXP, RXP, H/F internal pulldown

SRL Input Middle Voltage

Output Leakage (Y and Z)

SRL Input High Voltage

SRL Input Current

Input Impedance First Transition

RL = 100 (RS422), Figure 1

Driver Short-Circuit Output

Driver Short-Circuit Foldback

Input Current (A and B)

0 V OUT 12V (Note 3)

-7V VOUT 1V (Note 3)

-7V VCM 12V

Receiver Input Hysteresis

RO Output High Voltage

RO Output Low Voltage

Three-State Output Current at

Receiver Input Resistance

-7V VCM 12V

Receiver Output Short-Circuit

No load, RE = VCC, DE = VCC

Human Body Model

Driver Differential Output Rise or

CL= 50pF, RL= 54, Figures 2 and 3

Differential Driver Output Skew

CL= 50pF, RL= 54, Figures 2 and 3

Maximum Data Rate

Driver Enable to Output High

Driver Enable to Output Low

Driver Disable Time from Low

Driver Disable Time from High

Driver Enable from Shutdown to

Driver Enable from Shutdown to

RECEIVER SWITCHING CHARACTERISTICS

CL = 15pF, Figures 6 and 7

CL = 15pF, Figures 6 and 7

Maximum Data Rate

Receiver Enable to Output Low

Receiver Enable to Output High

Receiver Disable Time from Low

Receiver Disable Time from High

Receiver Enable from Shutdown

Receiver Enable from Shutdown

Driver Differential Output Rise or