ASTM D1037 Internal Bond Test
ASTM D1037 Internal Bond Test
ASTM D1037 Internal Bond Test
Chipboard, fiberboard, and particle board are engineered materials made by gluing
wood chips or wood particles together with an adhesive under high pressure.
Increased use of these materials has resulted in the need for more stringent
testing to determine their strength properties. One of these tests is the tensile
strength perpendicular to surface test, also known as the internal bond strength
test, and is also commonly used as a fundamental measure of the adhesive
performance in wood composites. This test method covers the determination of
tensile strength properties of these boards or adhesive bonds in wood.
A suitable test set up for testing to these standards includes either a 3300 or 5500
Series electromechanical testing machine, configured with a suitable load cell and
the internal bond fixture. Our internal bond fixture is designed in compliance with
the test fixture specifications stated in the test standards.
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