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NCP2993

Audio Power Amplifier, 1.3 W,


with Selectable Fast Turn-On
Time
The NCP2993 is an audio power amplifier designed for portable
communication device applications such as mobile phone http://onsemi.com
applications. The NCP2993 is capable of delivering 1.3 W of
MARKING
continuous average power to an 8.0 BTL load from a 5.0 V power
DIAGRAM
supply, and 1.1 W to a 4.0  BTL load from a 3.6 V power supply.
The NCP2993 provides high quality audio while requiring few WLCSP9
2993
external components and minimal power consumption. It features a low FC SUFFIX
AYWW
−power consumption shutdown mode, which is achieved by driving the CASE 499BM
G
SHUTDOWN pin with logic low.
The NCP2993 contains circuitry to prevent from “pop and click” noise 2993 = Specific Device Code
that would otherwise occur during turn−on and turn−off transitions. It is A = Assembly Location
a zero pop noise device when a single ended or a differential audio input Y = Year
is used. WW = Work Week
For maximum flexibility, the NCP2993 provides an externally G = Pb−Free Package
controlled gain (with resistors). In addition, it integrates 2 different
Turn On times (15 ms or 30 ms) adjustable with the TON pin.
Due to its superior PSRR, it can be directly connected to the PIN CONNECTIONS
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP package with a
A1 A2 A3
0.4mm pitch (Lead−Free).
INM OUTA INP
Features
B1 B2 B3
• 1.3 W to an 8.0  BTL Load from a 5.0 V Power Supply VM TON VP
• Best−in−Class PSRR: up to −88 dB, Direct Connection to the
Battery C1 C2 C3
• Zero Pop Noise Signature with a Single Ended Audio Input
BYPASS OUTB SHUTDOWN
• Ultra Low Current Shutdown Mode: 10 nA (Top View)
• 2.5 V−5.5 V Operation
• External Gain Configuration Capability
• External Turn−on Time Configuration Capability: 15 ms or 30 ms ORDERING INFORMATION
See detailed ordering and shipping information in the package
• Thermal Overload Protection Circuitry dimensions section on page 11 of this data sheet.
• This is a Pb−Free Device*
Typical Applications
• Portable Electronic Devices
• PDAs
• Wireless Phones

*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.

© Semiconductor Components Industries, LLC, 2011 1 Publication Order Number:


November, 2011 − Rev. 1 NCP2993/D
NCP2993

Rf

24 k Vp

Cs 1 F

Ci Ri
AUDIO INM Vp
- OUTA
INPUT INP
100 nF 24 k +
R1
Vp 20 k
8
R2
- 20 k
BYPASS + OUTB
Cbypass 1 F

SHUTDOWN SHUTDOWN
CONTROL

TON VM

Connect to Vp or GND

Figure 1. Typical Audio Amplifier Application Circuit with Single Ended Input

Rf

24 k Vp

Ci Ri Cs 1 F
+
100 nF 24 k
INM Vp
- OUTA
AUDIO INP
+
INPUT Ci Ri R1
− Vp 20 k
100 nF 24 k 8
R2
24 k Rf 20 k
-
BYPASS + OUTB
Cbypass 1 F

SHUTDOWN SHUTDOWN
CONTROL

TON VM

Connect to Vp or GND

Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input

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2
NCP2993

PIN DESCRIPTION
Pin Name Type Description
A1 INM I Negative input of the first amplifier, receives the audio input signal. Connected to the feedback
resistor Rf and to the input resistor Rin.

A2 OUTA O Negative output of the NCP2993. Connected to the load and to the feedback resistor Rf.
A3 INP I Positive input of the first amplifier, receives the common mode voltage.
B1 VM I Analog Ground.
B2 TON I TON pin selects 2 different Turn On times:
TON = GND −> 30 ms
TON = VP −> 15 ms
B3 VP I Positive analog supply of the cell. Range: 2.5 V−5.5 V.
C1 BYPASS I Bypass capacitor pin which provides the common mode voltage (Vp/2).
C2 OUTB O Positive output of the NCP2993. Connected to the load.
C3 SHUTDOWN I The device enters in shutdown mode when a low level is applied on this pin.

MAXIMUM RATINGS (Note 1)


Rating Symbol Value Unit

Supply Voltage Vp 6.0 V


Operating Supply Voltage Op Vp 2.5 to 5.5 V −
Input Voltage Vin −0.3 to VCC +0.3 V
Power Dissipation (Note 2) Pd Internally Limited −
Operating Ambient Temperature TA −40 to +85 °C
Max Junction Temperature TJ 150 °C
Storage Temperature Range Tstg −65 to +150 °C
Thermal Resistance Junction−to−Air RJA (Note 3) °C/W
ESD Protection Human Body Model (HBM) (Note 4) − 2000 V
Machine Model (MM) (Note 5) 200
Latchup Current @ TA = 85°C (Note 6) − ±100 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
2. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation.
3. The RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with
500 mm2. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 k resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.

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NCP2993

ELECTRICAL CHARACTERISTICS Limits apply for TA between −40°C to +85°C (Unless otherwise noted).
Min Max
Characteristic Symbol Conditions (Note 6) Typ (Note 6) Unit
Supply Quiescent Current Idd Vp = 2.5 V, No Load − 1.8 3.5 mA
Vp = 5.0 V, No Load − 1.95
Vp = 2.5 V, 8  − 1.8 3.5
Vp = 5.0 V, 8  − 1.95
Common Mode Voltage Vcm − − Vp/2 − V
Shutdown Current ISD − 0.02 0.5 A
Shutdown Pull−Down RSD − 300 − k
Shutdown Voltage High VSDIH − 1.2 − − V
Shutdown Voltage Low VSDIL − − − 0.4 V
Turn On Time (Note 8) TWU TON = GND − 30 − ms
TON = VP 15
Turn Off Time TOFF − − 1.0 − s
Output Impedance in Shutdown Mode ZSD − − 8.5 − k
Output Swing Vloadpeak Vp = 2.5 V, RL = 8.0  1.9 2.3 − V
Vp = 5.0 V, RL = 8.0  (Note 7) −
TA = +25°C 3.8 4.6
RMS Output Power PO Vp = 2.5 V, RL = 4.0  − 0.5 − W
THD + N < 1%
Vp = 2.5 V, RL = 8.0  0.32
THD + N < 1% − −
Vp = 5.0 V, RL = 8.0  1.3
THD + N < 1%
Maximum Power Dissipation (Note 8) PDmax Vp = 5.0 V, RL = 8.0  − − 0.65 W
Output Offset Voltage VOS Vp = 2.5 V − 1.0 − mV
Vp = 5.0 V
Signal−to−Noise Ratio SNR Vp = 2.5 V, G = 2.0 − 91 − dB
20 Hz < F < 20 kHz
Positive Supply Rejection Ratio PSRR V+ G = 2.0, RL = 8.0  dB
Cby = 1.0 F
Input Grounded
F = 217 Hz
Vp = 5.0 V − −88 −
Vp = 4.2 V − −88 −
Vp = 3.0 V − −88 −

F = 1.0 kHz
Vp = 5.0 V − −88 −
Vp = 4.2 V − −88 −
Vp = 3.0 V − −88 −
Efficiency  Vp = 2.5 V, Porms = 320 mW − 70 − %
Vp = 5.0 V, Porms = 1.0 W − 60 −
Thermal Shutdown Temperature Tsd − 160 − °C
Total Harmonic Distortion THD Vp = 2.5 V, F = 1.0 kHz − − − %
RL = 4.0  AV = 2.0 − 0.015 −
PO = 0.32 W − − −

Vp = 5.0 V, F = 1.0 kHz − − −


RL = 8.0  AV = 2.0 − 0.01 −
PO = 1.0 W − − −
6. Min/Max limits are guaranteed by design, test or statistical analysis.
7. This parameter is guaranteed but not tested in production in case of a 5.0 V power supply.
8. See page 10 for a theoretical approach of this parameter.

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NCP2993

TYPICAL CHARACTERISTICS

1 1
THD+N THD+N
VP = 2.5 V VP = 3 V
Pout = 100 mW Pout = 250 mW
RL = 8  RL = 8 
0.1 0.1
THD+N (%)

THD+N (%)
0.01 0.01

0.001 0.001
10 100 1,000 10,000 100,000 10 100 1,000 10,000 100,000
FREQUENCY (Hz) FREQUENCY (Hz)
Figure 3. THD+N vs. Frequency, Figure 4. THD+N vs. Frequency,
Single−Ended Input Single−Ended Input

1 1
THD+N THD+N
VP = 5 V VP = 2.5 V
Pout = 250 mW Pout = 100 mW
RL = 8  RL = 4 
0.1 0.1
THD+N (%)

THD+N (%)

0.01 0.01

0.001 0.001
10 100 1,000 10,000 100,000 10 100 1,000 10,000 100,000
FREQUENCY (Hz) FREQUENCY (Hz)
Figure 5. THD+N vs. Frequency, Figure 6. THD+N vs. Frequency,
Single−Ended Input Single−Ended Input

1 1
THD+N THD+N
VP = 3 V VP = 5 V
Pout = 250 mW Pout = 500 mW
RL = 4  RL = 4 
0.1 0.1
THD+N (%)

THD+N (%)

0.01 0.01

0.001 0.001
10 100 1,000 10,000 100,000 10 100 1,000 10,000 100,000
FREQUENCY (Hz) FREQUENCY (Hz)

Figure 7. THD+N vs. Frequency, Figure 8. THD+N vs. Frequency,


Single−Ended Input Single−Ended Input

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NCP2993

TYPICAL CHARACTERISTICS

1 1
THD+N THD+N
VP = 2.5 V VP = 3 V
Pout = 100 mW Pout = 250 mW
RL = 8  RL = 8 
0.1 0.1
THD+N (%)

THD+N (%)
0.01 0.01

0.001 0.001
10 100 1,000 10,000 100,000 10 100 1,000 10,000 100,000
FREQUENCY (Hz) FREQUENCY (Hz)
Figure 9. THD+N vs. Frequency, Figure 10. THD+N vs. Frequency,
Differential Input Differential Input

1 1
THD+N THD+N
VP = 5 V VP = 2.5 V
Pout = 500 mW Pout = 100 mW
RL = 8  RL = 4 
0.1 0.1
THD+N (%)

THD+N (%)

0.01 0.01

0.001 0.001
10 100 1,000 10,000 100,000 10 100 1,000 10,000 100,000
FREQUENCY (Hz) FREQUENCY (Hz)
Figure 11. THD+N vs. Frequency, Figure 12. THD+N vs. Frequency,
Differential Input Differential Input

1 1
THD+N THD+N
VP = 3 V VP = 5 V
Pout = 250 mW Pout = 500 mW
RL = 4  RL = 4 
0.1 0.1
THD+N (%)

THD+N (%)

0.01 0.01

0.001 0.001
10 100 1,000 10,000 100,000 10 100 1,000 10,000 100,000
FREQUENCY (Hz) FREQUENCY (Hz)

Figure 13. THD+N vs. Frequency, Figure 14. THD+N vs. Frequency,
Differential Input Differential Input

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NCP2993

TYPICAL CHARACTERISTICS

10

Vp = 2.5 V
1
3.6 V 4.2 V 5.0 V 5.5 V
THD (%)

3.0 V
0.1

2.7 V

0.01
THD+N
RL = 8 
Single−Ended Input
0.001
0 200 400 600 800 1000 1200 1400 1600 1800
Pout (mW)
Figure 15. THD+N vs. Pout

10

Vp = 2.5 V 3.6 V 4.2 V 5.0 V 5.5 V


1
2.7 V
THD (%)

3.0 V

0.1

THD+N
RL = 8 
Differential Input
0.01
0 200 400 600 800 1000 1200 1400 1600 1800
Pout (mW)
Figure 16. THD+N vs. Pout

0 0
PSRR PSRR
−10
VP = 3 V VP = 3 V
−20
−20 G=2 G=2
−30 Input Shorted Input Shorted to GND
to GND −40 Differential Configuration
PSRR (dB)

PSRR (dB)

−40
−50 −60
−60
−80
−70
−80
−100
−90
−100 −120
10 100 1000 10000 100000 10 100 1000 10000 100000
FREQUENCY (Hz) FREQUENCY (Hz)

Figure 17. PSRR vs. Frequency Figure 18. PSRR vs. Frequency

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NCP2993

TYPICAL CHARACTERISTICS

0 0
PSRR
−10 −10 PSRR
VP = 4.2 V
VP = 4.2 V
−20 G=2 −20
G=2
−30 Input Shorted −30 Input Shorted to GND
to GND
Differential Configuration
PSRR (dB)

PSRR (dB)
−40 −40
−50 −50
−60 −60
−70 −70
−80 −80
−90 −90
−100 −100
10 100 1000 10000 100000 10 100 1000 10000 100000
FREQUENCY (Hz) FREQUENCY (Hz)

Figure 19. PSRR vs. Frequency Figure 20. PSRR vs. Frequency

0 0
−10 PSRR −10 PSRR
VP = 5 V VP = 5 V
−20 G=2 −20
G=2
−30 Input Shorted −30 Input Shorted to GND
to GND Differential Configuration
PSRR (dB)

PSRR (dB)

−40 −40
−50 −50
−60 −60
−70 −70
−80 −80
−90 −90
−100 −100
10 100 1000 10000 100000 10 100 1000 10000 100000
FREQUENCY (Hz) FREQUENCY (Hz)
Figure 21. PSRR vs. Frequency Figure 22. PSRR vs. Frequency

900

800
700 5.5 V
600
5.0 V
Pdsp (mW)

500
400 4.2 V

300 3.6 V

200 3.0 V

100 Vp = 2.5 V 2.7 V


RL = 8 
0
0 200 400 600 800 1000 1200 1400 1600 1800
Pout (mW)
Figure 23. Power Dissipation vs. Pout

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NCP2993

2000 100
MAXIMUM OUTPUT POWER (mW)
1800 90
1600 80
1400 70
1200 60

SNR (dB)
1000 50
800 40
600 30
SNR
400 20
Pout = 125 mW
200 THD+N < 1%
10 RL = 8 
RL = 8 
0 0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 10 100 1000 10000 100000
VP (V) FREQUENCY (Hz)
Figure 24. Maximum Output Power vs. VP Figure 25. SNR vs. Frequency

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9
NCP2993

APPLICATION INFORMATION
Detailed Description transistors are real−time controlled, and when one current
The NCP2993 audio amplifier can operate under 2.5 V exceeds 1.1 A, the gate voltage of the MOS transistor is
until 5.5 V power supply. With less than 1% THD + N, it clipped and no more current can be delivered.
can deliver up to 1.35 W RMS output power to an 8.0 
load (VP = 5.0 V). If application allows to reach 10% Thermal Overload Protection
THD + N, then 1.65 W can be provided using a 5.0 V Internal amplifiers are switched off when the
power supply. temperature exceeds 160°C, and will be switched on again
The structure of the NCP2993 is basically composed of only when the temperature decreases fewer than 140°C.
two identical internal power amplifiers; the first one is The NCP2993 is unity−gain stable and requires no
externally configurable with gain−setting resistors Rin and external components besides gain−setting resistors, an
Rf (the closed−loop gain is fixed by the ratios of these input coupling capacitor and a proper bypassing capacitor
resistors) and the second is internally fixed in an inverting in the typical application.
unity−gain configuration by two resistors of 20 k. So the The first amplifier is externally configurable (Rf and
load is driven differentially through OUTA and OUTB Rin), while the second is fixed in an inverting unity gain
outputs. This configuration eliminates the need for an configuration.
output coupling capacitor. The differential−ended amplifier presents two major
advantages:
Internal Power Amplifier − The possible output power is four times larger (the
The output PMOS and NMOS transistors of the amplifier output swing is doubled) as compared to a single−ended
were designed to deliver the output power of the amplifier under the same conditions.
specifications without clipping. The channel resistance − Output pins (OUTA and OUTB) are biased at the same
(Ron) of the NMOS and PMOS transistors does not exceed potential VP/2, this eliminates the need for an output
0.6 when they drive current. coupling capacitor required with a single−ended
The structure of the internal power amplifier is amplifier configuration.
composed of three symmetrical gain stages, first and The differential closed loop−gain of the amplifier is
medium gain stages are transconductance gain stages to R V
given by Avd + 2 * f + orms .
obtain maximum bandwidth and DC gain. Rin Vinrms
Output power delivered to the load is given by
Turn−On and Turn−Off Transitions
(Vopeak)2
When a shutdown low level is applied, the output level Porms + (Vopeak is the peak differential output
2 * RL
is tied to Ground on each output after 10 s.
voltage).
With TON = GND, turn on time is set to 30 ms. With TON
When choosing gain configuration to obtain the desired
= VP, turn on time is set to 15 ms. To avoid any pop and click
output power, check that the amplifier is not current limited
noises, Rin * Cin < 2.4 ms with TON = GND and Rin * Cin
or clipped.
< 1.2 ms with TON = Vp. The electrical characteristics are
The maximum current which can be delivered to the load
identical with the 2 configurations. This fast turn on time
Vopeak
added to a very low shutdown current saves battery life and is 500 mA Iopeak + .
RL
brings flexibility when designing the audio section of the
final application. Gain−Setting Resistor Selection (Rin and Rf)
NCP2993 is a zero pop noise device when using a Rin and Rf set the closed−loop gain of the amplifier.
single−ended or differential audio input configuration. In order to optimize device and system performance, the
NCP2993 should be used in low gain configurations.
Shutdown Function
The low gain configuration minimizes THD + noise
The device enters shutdown mode when shutdown signal
values and maximizes the signal to noise ratio, and the
is low. During the shutdown mode, the DC quiescent
amplifier can still be used without running into the
current of the circuit does not exceed 100 nA. In this
bandwidth limitations.
configuration, the output impedance is 8.5 k on each
A closed loop gain in the range from 2 to 5 is
output.
recommended to optimize overall system performance.
Current Limit Circuit An input resistor (Rin) value of 24 k is realistic in most
The maximum output power of the circuit (Porms = of applications, and doesn’t require the use of a too large
1.0 W, VP = 5.0 V, RL = 8.0 ) requires a peak current in capacitor Cin.
the load of 500 mA.
Input Capacitor Selection (Cin)
In order to limit the excessive power dissipation in the
The input coupling capacitor blocks the DC voltage at
load when a short−circuit occurs, the current limit in the
the amplifier input terminal. This capacitor creates a
load is fixed to 1.1 A. The current in the four output MOS

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NCP2993

high−pass filter with Rin, the cut−off frequency is given by − up to 22 pF capacitor connected between each amplifier
fc + 1 . output terminals and ground.
2 *  * Rin * Cin − Dedicated IEC filters such as ESD7.0 series from
The size of the capacitor must be large enough to couple ON Semiconductor.
in low frequencies without severe attenuation. In any case, the protection should be placed as close as
possible to the ESD stress entry point. Proper and carefull
IEC 61000-4-2 Level 4
layout is a key factor to ensure optimum protection level is
In some particular applications, NCP2993 may need
achieved. Designer should make sure the connection
extra ESD protection to pass IEC 61000-4-2 Level 4
impedance between protection and ground / protection and
qualification.
NCP2993 is as low as possible.
Depending on the test, user can consider different level
of protection:

ORDERING INFORMATION
Device Package Shipping†
NCP2993FCT2G 9−Pin Flip−Chip 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

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11
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS

WLCSP9, 1.22x1.22
CASE 499BM−01
ISSUE O
SCALE 4:1 DATE 27 SEP 2010

NOTES:
D A B

ÈÈ
1. DIMENSIONING AND TOLERANCING PER
PIN A1 ASME Y14.5M, 1994.
REFERENCE 2. CONTROLLING DIMENSION: MILLIMETERS.

ÈÈ
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E MILLIMETERS
DIM MIN MAX
2X 0.05 C A −−− 0.66
A1 0.17 0.24
A2 0.40 REF
2X 0.05 C
TOP VIEW b 0.24 0.29
D 1.22 BSC
E 1.22 BSC
A2 e 0.40 BSC
0.05 C
GENERIC
A
MARKING DIAGRAM*
0.05 C
SEATING XXXX
NOTE 3
A1 SIDE VIEW C PLANE AYWW
G

9X b e XXXX = Specific Device Code


0.05 C A B e A = Assembly Location
C Y = Year
0.03 C
B WW = Work Week
G = Pb−Free Package
A

1 2 3 *This information is generic. Please refer


BOTTOM VIEW to device data sheet for actual part
marking.
Pb−Free indicator, “G” or microdot “ G”,
RECOMMENDED may or may not be present.
SOLDERING FOOTPRINT*

A1 PACKAGE
OUTLINE

9X
0.25
0.40
PITCH 0.40
PITCH
DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering


details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98AON53177E Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: WLCSP9, 1.22X1.22 PAGE 1 OF 1

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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