Power Management IC Series for Automotive Body Control

High Voltage
LDO Regulators
BD3570FP, BD3570HFP, BD3571FP, BD3571HFP, BD3572FP, BD3572HFP
BD3573FP, BD3573HFP, BD3574FP, BD3574HFP, BD3575FP, BD3575HFP No.11036EBT02

●Description
BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle
microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30μA (TYP).With these
devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within ±2% over the
wide ambient temperature range (-40 to 125℃), and the short circuit protection is folded-type to minimize generation of
heat during malfunction. These devices are developed to offer most robust power-supply design under the harsh
automotive environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to
simplify the use with battery direct-coupled systems.

●Features
1) Ultra-low quiescent current: 30μA (TYP.)
2) Low-saturation voltage type P-channel DMOS output transistors
3) High output voltage precision:  2%／Iomax = 500 mA
4) Low-ESR ceramic capacitors can be used as output capacitors.
5) Vcc power supply voltage = 50 V
6) Built-in overcurrent protection circuit and thermal shutdown circuit
7) TO252-3, TO252-5, HRP5 Package

●Applications
Onboard vehicle devices (body-control, car stereos, satellite navigation systems, etc.)

●Line up matrix

BD3570FP/HFP BD3571FP/HFP BD3572FP/HFP BD3573FP/HFP BD3574FP/HFP BD3575FP/HFP

Output voltage 3.3V 5.0 V Variable 3.3V 5.0 V Variable
SW function － － － 〇 〇 〇
Package FP:TO252-3,TO252-5
HFP:HRP5

●Absolute maximum ratings (Ta=25℃)

Parameter Symbol Limit Unit
Supply voltage VCC 50 ※1 V
Switch Supply voltage VSW 50 ※2 V
Output current IO 500 mA
1.2 (TO252-3) ※3
Power dissipation Pd 1.3 (TO252-5) ※4 W
1.6 (HRP5) ※5
Operating temperature range Topr -40 to +125 ℃
Storage temperature range Tstg -55 to +150 ℃
Maximum junction
Tjmax 150 ℃
temperature
※1 Not to exceed Pd and ASO.
※2 for ON/OFF SW Regulator only
※3 TO252-3: Reduced by 9.6 mW/℃ over 25 ℃, when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm).
※4 TO252-5: Reduced by 10.4 mW/℃ over 25 ℃, when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm).
※5 HRP5: Reduced by 12.8 mW/℃ over 25 ℃, when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm).

www.rohm.com
1/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

●Operating Conditions
Parameter Symbol Min. Max. Unit
BD3570,3572,3573,3575FP/HFP VCC 4.5 ※6 36.0 V
Input voltage
BD3571,3574FP/HFP VCC 5.5 ※6 36.0 V
Output current IO － 500 mA
Variable Output Voltage Range VO 2.8 12 V
※6 Please consider that the Output voltage would be dropped (Dropout voltage) according to the output current.

●Electrical Characteristics（Unless otherwise specified, Ta=-40 to125℃, VCC=13.2 V, SW=3V ※7, VO settings is 5V ※8）
Limit
Parameter Symbol Unit Conditions
Min. Typ. Max.

Shut Down Current ※７ lshut － － 10 μA SW=GND

Bias current lb － 30 50 μA IO=0mA

VO× VO× IO=200mA,

Output voltage VO VO V
0.98 1.02 VO:Please refer to Product line.

ADJ Terminal voltage ※8 VADJ 1.235 1.260 1.285 V IO=200mA

Output current IO 0.5 － － A

Dropout voltage △Vd － 0.25 0.48 V VCC=4.75V,lO=200mA ※9

Ripple rejection R.R. 45 55 － dB f=120Hz,ein=1Vrms,IO=100mA

VCCD※10≦VCC≦25V
Line Regulation Reg.I － 10 30 mV
IO = 0 mA

Load Regulation Reg.L － 20 40 mV 0ｍA≦IO≦200ｍA

Swith Threshold voltage H ※７ SWH 2.0 － － V IO=0 mA

Swith Threshold voltage L ※７ SWL － － 0.5 V IO=0 mA

Swith Bias current ※７ SWI － 22 60 μA SW=5V,lO=0mA

※7 BD3573,3574,3575FP/HFP only
※8 BD3572,3575FP/HFP only
※9 BD3571,3572,3574,3575FP/HFP only
※10 BD3570,3573FP/HFP :VCCD=5.5V
BD3571,3572,3574,3575FP/HFP :VCCD=6.5V

○This product is not designed for protection against radio active rays.

www.rohm.com
2/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

●Reference Data: BD3574HFP（Unless otherwise specified, Ta=25℃）

50 6 6
CIRCUIT CURRENT: I CC [μA]

5 5
40

OUTPUT VOLTAGE: VO [V]

OUTPUT VOLTAGE: VO [V]

4 4
30 Ta=-40℃
3 3
20 Ta=125℃ Ta=125℃
2 2 Ta=25℃
Ta=25℃ Ta=25℃
10
1 1 Ta=125℃
Ta=-40℃
Ta=-40℃

0 0 0
0 5 10 15 20 25 0 5 10 15 20 25 0 500 1000 1500 2000
SUPPLY VOLTAGE: VCC [V] SUPPLY VOLTAGE: VCC [V] OUTPUT CURRENT: IO [mA]

Fig. 1 Total Supply Current Fig. 2 Output Voltage VS Fig. 3 Output Voltage VS Load
Power Supply Voltage

3 70 6

Ta=125℃
60
RIPPLE REJECTION:R.R. [dB]
DROPOUT VOLTAGE:ΔVd[V]

OUTPUT VOLTAGE: VO [V]

50 Ta=25℃
2 4 Ta=25℃
Ta=125℃ Ta=125℃
40
Ta=-40℃
3
Ta=25℃
30
1 2
Ta=-40℃ 20 Ta=-40℃

1
10

0 0 0
0 100 200 300 400 500 10 100 1000 10000 100000 1000000 0 0.5 1 1.5 2
OUTPUT CURRENT: IO[mA] FREQUENCY: f [Hz] SUPPLY VOLTAGE: VSW [V]

Fig. 4 Dropout Voltage Fig. 5 Ripple rejection Fig. 6 Output Voltage VS

SW Input Voltage
100 6 5.5

5
CIRCUIT CURRENT: I CC [μA]

OUTPUT VOLTAGE: VO [V]

OUTPUT VOLTAGE: VO [V]

80
5.25
4
60
3 5
40
2
4.75
20
1

0 0 4.5
0 100 200 300 400 500 100 120 140 160 180 200 -40 0 40 80 120
OUTPUT CURRENT: IO[mA] AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃]

Fig. 7 Total Supply Current Fig. 8 Thermal Shutdown Circuit Fig. 9 Output Voltage VS
Classified by Load Temperature

120 2 50
DROPOUT VOLTAGE:ΔVd [V]

CIRCUIT CURRENT: I cc [μA]

SW BIAS CURRENT: ISW [μA]

40
90 1.5
Ta=125℃
30

60 1
20
Ta=25℃
30 0.5
10
Ta=-40℃

0 0 0
0 5 10 15 20 25 -40 0 40 80 120 -40 0 40 80 120

SUPPLY VOLTAGE: VSW [V] AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃]

Fig. 10 SW Bias current Fig. 11 Dropout voltage VS Fig. 12 Total Supply Current
Temperature Temperature

www.rohm.com
3/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

●Block Diagram

Vcc Vcc Vcc

1 1 1
Cin Cin Cin

Vref Vref Vref

SW SW
Vo 2 Vo 2 Vo
3 5 5
OCP Co OCP Co OCP Co
＊1） ＊1）

GND GND ＊2） GND ＊2）

TSD TSD TSD
3
Fin Fin Fin
2 3 4 4
＊1) ＊1)
N.C. N.C. ADJ (N.C. ) ADJ (N.C. )
Fig.13 TO252-3 Fig.15 HRP5
Fig.14 TO252-5
Cin：0.33μF～1000μF ＊1）For Fixed Voltage Regulator only
Co：0.1μF～1000μF ＊2）For adjustable Voltage Regulator only
●I/O Circuit diagram (All resistance values are typical.)
Vcc Vcc

SW Vo Vo
210K 1K

1992K: BD3570, BD3573

200K 3706K: BD3571, BD3574
150

1250K

Fig.16 2PIN[SW] Fig.17 5PIN[VO] Fig.18 4.5PIN[ADJ,VO]

BD3570,3571,3573,3574 BD3572,BD3575
●Pin Assignments
FIN
Pin No. Pin name Function
TO252-3 1 VCC Power supply pin
2 N.C. N.C. pin
3 VO Voltage output pin
1 2 3 Fin GND GND pin

Fig. 19

FIN Pin No. Pin name Function

1 VCC Power supply pin
TO252-5 SW VO ON/OFF function pin
2
N.C. N.C. pin(BD3572FP only)
3 N.C. N.C. pin
N.C. N.C. pin
1 2345 4
ADJ Output voltage setting pin(BD3572,3575FP only)
5 VO Voltage output pin
Fig.20
Fin GND GND pin

Pin No. Pin name Function

FIN
1 VCC Power supply pin
HRP5 SW VO ON/OFF function pin (BD3573,3574,3575HFP only)
2
N.C. N.C. pin
3 GND GND pin
1 23 45 N.C. N.C. pin
4
ADJ Output voltage setting pin(BD3572,3575HFP only)
Fig. 21 5 VO Voltage output pin
Fin GND GND pin

www.rohm.com
4/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

●Output Voltage Adjustment

Vo
To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins,
and pull-up resistor R2 between the VO and ADJ pins.
R2

ADJ R1
Vo = VADJ×(R1+R2) / R1 [V]
｛VADJ=1.26V(TYP.)｝

Fig.22
The recommended connection resistor for the ADJ-GND is 30k～150kΩ.

●Setting of Heat
TO252-3 TO252-5 HRP5
2.0 2.0 2.0
IC mounted on a ROHM standard board
IC mounted on a ROHM standard board
IC mounted on a ROHM standard board 1.6 W Substrate size: 70 mm  70 mm  1.6 mm
Substrate size: 70 mm  70 mm  1.6 mm
1.6 1.6 Substrate size: 70 mm  70 mm  1.6 mm 1.6 ja = 78.1 (°C/W)

POWER DISSIPATION: Pd [W]

POWER DISSIPATION: Pd [W]

ja = 104.2 (°C/W)

POWER DISSIPATION: Pd [W]

ja = 96.2 (°C/W)

1.3W
1.2 W
1.2 1.2 1.2

0.8 0.8 0.8

0.4 0.4 0.4

0 0 0
0 25 50 75 100 125 150 0 25 50 75 100 125 150 0 25 50 75 100 125 150
AMBIENT TEMPERATURE: Ta [°C] AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [°C]

Fig. 23 Fig. 24 Fig. 25

Refer to the heat mitigation characteristics illustrated in Figs. 23, 24 and 25 when using the IC in an environment where Ta
≧25℃. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of
the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or damaged. It is necessary to give
sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage
and the maintenance of the reliability of the IC in long-time operation.
In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction
temperature Tjmax. Fig. 23 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate
the IC within the power dissipation Pd. The following method is used to calculate the power consumption PC (W).

Vcc : Input voltage

PC=(VCC-VO)×IO+VCC×ICC Vo : Output voltage
Power dissipation Pd≦PC Io : Load current
Icc : Total supply current

The load current IO is obtained to operate the IC within the power dissipation.
Pd-VCC×ICC
Io≦ (For more information about ICC, see page 12.)
VCC-VO

The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process.

●Calculation example
Example: BD3571FP VCC = 12 V and VO = 5 V at Ta = 85℃
0.624-12×ICC θja=104.2℃/W→-9.6mAW/℃
IO≦
12-5 25℃=1.2W→85℃=0.624W

IO≦89mA (ICC=30μA)

Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the
power dissipation.
The power consumption Pc of the IC in the event of shorting (i.e., if the VO and GND pins are shorted) will be obtained from
the following equation.

Pc=VCC×(ICC+Ishort) Ishort = Short current

www.rohm.com
5/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

●Peripheral Settings for Pins and Precautions

1) VCC pins
Insert capacitors with a capacitance of 0.33μF to 1000μF between the VCC and GND pins.
The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin.

2) Capacitors for stopping oscillation for output pins

Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a
capacitance range between 0.1μF and 1000μF. Since oscillation does not occur even for ESR values from 0.001Ω to
100Ω, a ceramic capacitor can be used. Abrupt input voltage and load fluctuations can affect output voltages. Output
capacitor capacitance values should be determined after sufficient testing of the actual application.

●Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a
special mode where the absolute maximum ratings may be exceeded is anticipated.

2) GND potential
Ensure a minimum GND pin potential in all operating conditions.

3) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin short and mistake fitting

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the
presence of a foreign object may result in damage to the IC.

5) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.

6) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Be sure to turn power off when mounting or dismounting jigs at
the inspection stage. Furthermore, for countermeasures against static electricity, ground the equipment at the assembling
stage and pay utmost attention at the time of transportation or storing the product.

7) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junction is formed by the P layer and the N layer of each element, and a variety of parasitic elements will be
constituted.
For example, when a resistor and transistor are connected to pins as shown in Fig. 19,
 the P/N junction functions as a parasitic diode when GND>Pin A for the resistor or GND>Pin B for the transistor
(NPN).
 Similarly, when GND＞Pin B for the transistor (NPN), the parasitic diode described above combines with the N
layer of other adjacent elements to operate as a parasitic NPN transistor.

www.rohm.com
6/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of
the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will
trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage
to input pins.
Resistor Transistor (NPN)
B (Pin B)
(Pin A) (Pin B) C E
C
B

P+ P P+ P GND
P+ P+
N
N Parasitic element or
N N N N
transistor
P P
Parasitic element
substr (Pin A)
GND t GND
Parasitic element Parasitic elements
or transistor

Fig. 26 Example of a Simple Monolithic IC Architecture

8) Ground wiring patterns

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external parts, either.

9) SW Pin
Do not apply the voltage to SW pin when the VCC is not applied.
And when the VCC is applied, the voltage of SW pin must not exceed VCC.

10) Thermal shutdown circuit (TSD)

This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used
within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its
power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown circuit to turn off
all output power elements. The circuit automatically resets once the chip's temperature Tj drops.
The thermal shutdown circuit operates if the IC is under conditions in express of the absolute maximum ratings. Never
design sets on the premise of using the thermal shutdown circuit. (See Fig. 8)

11) Overcurrent protection circuit (OCP)

The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This
circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current
flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous operation or transitioning of the
protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to
temperatures. (See Fig. 3)

www.rohm.com
7/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

●Ordering Part Number

B D 3 5 7 4 H F P - T R

ローム形名 Part number Package Packaging and forming

3570：3.3V output FP ： TO252-3, specification
no include SW TO252-5 E2: Embossed tape and reel
3571：5.0V output HFP： HRP5
(TO252-3,TO252-5)
no include SW
3572：variable output TR: Embossed tape and reel
no include SW (HRP5)
3573：3.3V output
include SW
3574：5.0V output
include SW
3575：variable output
include SW

TO252-3
<Tape and Reel information>
6.5±0.2 Tape Embossed carrier tape
+0.2
5.1 -0.1
C0.5 Quantity 2000pcs
1.5±0.2

2.3±0.2
0.5±0.1 E2
Direction
The direction is the 1pin of product is at the lower left when you hold
FIN of feed ( reel on the left hand and you pull out the tape on the right hand )
5.5±0.2

9.5±0.5
1.5

1 2 3
2.5
0.8

0.65 0.65
0.5±0.1
0.75

2.3±0.2 2.3±0.2 1.0±0.2

1pin Direction of feed
(Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity.

TO252-5
<Tape and Reel information>
6.5±0.2 2.3±0.2 Tape Embossed carrier tape
Quantity 2000pcs
+0.2 C0.5 0.5±0.1
5.1 -0.1
1.5±0.2

E2
Direction
The direction is the 1pin of product is at the lower left when you hold
FIN
of feed ( reel on the left hand and you pull out the tape on the right hand )
5.5±0.2

9.5±0.5
1.5

1 2 3 4 5
2.5
0.8

0.5±0.1
0.5 1.27
1.0±0.2

1pin Direction of feed

(Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com
8/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP Technical Note

HRP5
9.395±0.125
<Tape and Reel information>
(MAX 9.745 include BURR)
Tape Embossed carrier tape
1.017±0.2

8.82 ± 0.1 1.905±0.1 Quantity 2000pcs

(6.5)
TR
Direction
of feed ( The direction is the 1pin of product is at the upper right when you hold
)

10.54±0.13
(7.49)
8.0±0.13

reel on the left hand and you pull out the tape on the right hand

1.523±0.15
0.835±0.2
1pin

1 2 3 4 5
1.2575 +5.5°
4.5°−4.5°
+0.1
0.27 −0.05
S
0.08±0.05

0.73±0.1
1.72 0.08 S
Direction of feed

(Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com
9/9 2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
 Datasheet

Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
 Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
 Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.