Computer-Based Control for

Industrial Automation
(ENMF 533)

Introduction to Computer
Hardware
(Chapter 1: Textbook)

Dr. A. Ramirez-Serrano

Elements of Automation (ENMF-533) Introduction

 The First Computer

The Babbage
Difference Engine
(1832)
25,000 parts
cost: £17,470

Elements of Automation (ENMF-533) Introduction

 ENIAC - The first electronic computer
(1946)

Elements of Automation (ENMF-533) Introduction

 Von Neumann with IAS

Elements of Automation (ENMF-533) Introduction

 Hardware, Software, and
Firmware
Hardware: All physical
components that make up the
computer/device system.

Software: The programs that

control the operation of a computer
or a system.

Firmware: software permanently

embedded in the structure of the
hardware.

Hardware, software and firmware are

intimately related •Firmware for controlling large
overhead variable message
signs on highways.
•Firmware for controlling disk
drive enclosures.
Elements of Automation (ENMF-533) Introduction
 Hardware (architecture & organization)

Architecture: Abstract view of the computer

and describes what it can do (e.g., 32-bit number
architecture).

Organization: How the architecture is

implemented (e.g., how 32-bit numbers are built) . 

Elements of Automation (ENMF-533) Introduction

 Evolution in Complexity

Elements of Automation (ENMF-533) Introduction

 Early Semiconductor
Fabrication

J. Bardeen, W.H. Brattain, “The first transistor, a semiconductor triode”, Phys. Rev., 74, 230 (1948).

Elements of Automation (ENMF-533) Introduction

“Introduction to MEMS Des Introduction to MEMS Design and Fabrication ign and Fabrication”, K.S.J. Pister, UC Berkeley
 Intel
133 MHz
Pentium
Processor
3.3 million transistors
0.35 micron lithography
4 layer metalization
First silicon: May 1995

Elements of Automation (ENMF-533) Introduction

“Introduction to MEMS Des Introduction to MEMS Design and Fabrication ign and Fabrication”, K.S.J. Pister, UC Berkeley
 Elements of Automation (ENMF-533)
“Microsensors, MEMS, and Smart Devices”, J.W. Gardner, V.K. Varadan, O.O., Awadelkarim Introduction
 Elements of Automation (ENMF-533)
“Microsensors, MEMS, and Smart Devices”, J.W. Gardner, V.K. Varadan, O.O., Awadelkarim Introduction
 Evolution in Transistor Count

Elements of Automation (ENMF-533) Introduction

 Evolution in Speed/Performance

Elements of Automation (ENMF-533) Introduction

 Intel 4004 Micro-Processor

Elements of Automation (ENMF-533) Introduction

 Intel Pentium (II) microprocessor

Elements of Automation (ENMF-533) Introduction

 Logic Technologies

 TTL – Transistor Transistor

Logic
 MOS – Metal Oxide
Semiconductor
 CMOS – Complementary MOS
 Etc.

http://www.nalanda.nitc.ac.in/industry/appnotes/TI_logic/data/www.ti.com/sc/docs/
products/logic/techfam/ttl.html

Elements of Automation (ENMF-533) Introduction

 74LS TTL Components
 The TTL family of integrated circuits was introduced about 20 years
ago by Texas Instruments.
 TTL stands for Transistor Transistor Logic, which signifies that two
transistors are used to drive each output of each chip, one for pulling
the output down to a low level, and one for pulling the output up to a
high level. Chips made using TTL technology are faster than the older
RTL (Resistor Transistor Logic) and DTL (Diode Transistor Logic)
families of integrated circuits, and they consume more power than the
MOS (Metal Oxide Semiconductor) technology used in most VLSI
(Very Large Scale Integrated circuit) chips.

 The TTL family has at least 6 subfamilies which offer different

speed/power tradeoffs (Basic, low-power, Schottky, low-power- Schottky,
advanced- Schottky, advanced low-power- Schottky).

Elements of Automation (ENMF-533) Introduction

 TTL NAND gate with OPEN
COLLECTOR output

Open-Collector

TTL gates with open-collector

output stages have eliminated a
resistor, a transistor, and the diode
used in previous circuits. The
collector of Q4 is connected only to
the output Y. In order for open-
collector TTL gates to work, an
external pull-up resistor must be
provided (of the order 10 k ohms ).

Elements of Automation (ENMF-533) Introduction

 TTL Families
 The term Schottky refers to a technology for
making faster transistors.
 It is interesting to note that, in each
generation of the TTL family, the low power
representative of that generation is about 3
times slower than the other member, but
consumes about 1/10 the power. Today, the
low-power Schottky subfamily is the most
widely used member of the TTL family; chips
from this family are available from a wide
variety of manufacturers

Elements of Automation (ENMF-533) Introduction

 Chip Manufacturers
 All manufacturers of TTL chips use a common naming system, as
exemplified by the chip name ``SN74LS00''. The prefix SN indicates
that the chip was made by Texas Instruments; other manufacturers
have their own prefix codes, but if the remainder of the chip name
matches, the chips should perform exactly the same function.
Additional one letter codes may be added as prefixes or suffixes to this
code, for example, RSN indicates radiation hardened chips made by
Texas Instruments, and SNM indicates the use of quality control
procedures specified by the military specification MIL-STD-883. The
numeric code 74 indicates that the chip conforms to the requirements
of the civilian computer industry, being able to operate over a
temperature range of 0o to 70o C, while the code 54 indicates the ability
to operate over the more extreme temperature range of -55o to 125o C
required by many military and industrial applications. The letters LS
indicate which subfamily the chip belongs to. Finally, the last two digits
indicate the logical function performed by the chip.

Elements of Automation (ENMF-533) Introduction

 Each Iowa Logic Specification Language TTL subcircuit description
corresponds to one standard chip, and these chips are packaged one per file,
in a form appropriate for inclusion using the use statement. The actual file
names of these circuits will depend on your installation, but in general, the
prefix indicating the manufacturer and military rating will not be included in the
name, since it conveys nothing about the logical function of the chip. The
following circuit descriptions are currently available (listed in numeric order):

 LS00 Quad 2-input nand gates.

 LS02 Quad 2-input nor gates.
 LS04 Hex inverters.
 LS08 Quad 2-input and gates.
 LS10 Triple 3-input nand gates.
 LS11 Triple 3-input and gates.
 LS20 Dual 4-input nand gates.
 LS21 Dual 4-input and gates.
 LS27 Triple 3-input nor gates.
 LS30 8-input nand gate.
 LS32 Quad 2-input or gates.
 LS42 BCD-to-decimal decoder (or 3-line to 8-line decoder with enable).
 LS74A Dual positive-edge-triggered D flipflop.
 LS85 4-bit binary magnitude comparator.
 LS86 Quad 2-input exclusive-or gates.
 Elements of Automation
LS109A Dual (ENMF-533) Introduction
positive-edge-triggered J- flipflop.
 Silicon in 2010
Density AccessTime
(Gbits/cm2) (ns)
Die Area: 2.5x2.5 cm
DRAM 8.5 10
Voltage: 0.6 V
DRAM (Logic) 2.5 10
Technology: 0.07 m
SRAM (Cache) 0.3 1.5

Density Max. Ave. Power Clock Rate

(Mgates/cm2) (W /cm2) (GHz)
Custom 25 54 3
Std. Cell 10 27 1.5
Gate Array 5 18 1
Single-Mask GA 2.5 12.5 0.7
FPGA 0.4 4.5 0.25
Elements of Automation (ENMF-533) Introduction
 The Diode
B Al A
SiO2

Cross-section of pn-junction in an IC process

A Al
p A

B B
One-dimensional
representation diode symbol

Elements of Automation (ENMF-533) Introduction

 Depletion Region
hole diffusion
electron diffusion
(a) Current flow.
p n

hole drift
electron drift
Charge 
Density
+ x (b) Charge density.
Distance
-

Electrical 
Field x
(c) Electric field.

V
Potential
 (d) Electrostatic
x potential.
-W 1 W2

Elements of Automation (ENMF-533) Introduction

 The MOS Transistor
(Metal Oxide Semiconductor)

Gate Oxyde
Gate
Polysilicon Field-Oxyde
Source Drain
(SiO2)
n+ n+

p-substrate p+ stopper

Bulk Contact

CROSS-SECTION of NMOS Transistor

Elements of Automation (ENMF-533) Introduction

 Cross-Section of CMOS Technology
(Complementary Metal Oxide Semiconductor)

Elements of Automation (ENMF-533) Introduction

 MOS transistors
Types and Symbols
D D

G G

S S

NMOS Enhancement NMOS Depletion

D D

G G B

S S

PMOS Enhancement NMOS with

Bulk Contact

Elements of Automation (ENMF-533) Introduction

 Threshold Voltage: Concept

+
S VGS D
G
-

n+ n+

n-channel Depletion
Region
p-substrate

Elements of Automation (ENMF-533) Introduction

 Current-Voltage Relations

VGS VDS
S
G ID
D

n+ – V(x) + n+

L x

p-substrate

MOS transistor and its bias conditions

Elements of Automation (ENMF-533) Introduction

 Transistor in Saturation
VGS

VDS > VGS - VT

G

D
S

- +
n+ VGS - VT n+

Elements of Automation (ENMF-533) Introduction

 The Gate Capacitance

Elements of Automation (ENMF-533) Introduction

 Parasitic Resistances

Polysilicon gate
Drain
contact
G LD

VGS,eff

W
S D

RS RD

Drain

Elements of Automation (ENMF-533) Introduction

 Latchup
VD D
VDD
Rnwell
p-source
+ + + + + +
p n n p p n
n-well Rnwell

Rpsubs n-source
p-substrate Rpsubs

(a) Origin of latchup (b) Equivalent circuit

Elements of Automation (ENMF-533) Introduction

 Bipolar Transistor
E B C

p+ n+ p+ n+
p
isolation
p+
n-epitaxy
n+ buried layer

p-substrate

(a) Cross-sectional view.

E C
n+ p n

(b) Idealized transistor structure.

Elements of Automation (ENMF-533) Introduction

 Schematic Symbols and Sign
Conventions

C C
– –
VBC IC VBC IC
+ + + +
B B
VCE VCE
IB IB
+ – + –
VBE VBE
– –
IE IE
E E

(a) npn (b) pnp

Elements of Automation (ENMF-533) Introduction

 Capacitive Model for Bipolar
Transistor
C

QR Cbc
Ccs
collector-substrate
B junction capacitance

S
QF Cbe

base charge E
base-emitter
junction capacitances
base-collector

Elements of Automation (ENMF-533) Introduction

 Junction Capacitances

Elements of Automation (ENMF-533) Introduction

 Parasitic Resistance

E B C

p+ n+
p+ rE n+ p

isolation
rC1
n-epitaxy
rB p+
rC3

n+ buried layer

rC2

p-substrate

Elements of Automation (ENMF-533) Introduction

 Design Abstraction Levels

SYSTEM

MODULE
+

GATE

CIRCUIT

DEVICE
G
S D
n+ n+

Elements of Automation (ENMF-533) Introduction

 Gate & Module Abstraction level
PCSrc

0
M
u
x
1

IF/ID ID/EX EX/MEM MEM/WB

Add
Add
Add result
4
Branch
Shift
RegWrite left 2
Instruction

Read MemWrite
PC Address register 1 Read
Read data1 ALUSrc
register 2 Zero
Zero MemtoReg
Instruction Registers Read ALU ALU
memory Write 0 Read
data2 result Address 1
register M data M
u Data u
Write x memory x
data 1
Write 0
data
Instruction
[15–0] 16 32 6
Sign ALU
extend control MemRead
Instruction
[20–16]
0
M ALUOp
Instruction u
[15–11] x
1

RegDst

Elements of Automation (ENMF-533) Introduction