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What is Xilinx XC4VLX25-10FF668C ?

Table of Contents

Introduction

Xilinx is a leading provider of programmable logic devices including FPGAs

(Field Programmable Gate Arrays). The Xilinx XC4VLX25 part number

refers to a specific FPGA belonging to the Virtex-4 FPGA family that was

introduced in 2006. The XC4VLX25 combines high performance, logic

density and low power consumption making it well suited for a wide range

of applications.

This article will provide an in-depth understanding of the Xilinx

XC4VLX25-10FF668C FPGA in terms of its key features, architecture,

available packages, and target applications.

XC4VLX25 FPGA Overview

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The Xilinx XC4VLX25 device is a mid-range FPGA in the Virtex-4 series

catering to cost-sensitive, high-volume applications. Some key

characteristics are:

 Built on 90nm copper CMOS process for power efficiency

 Up to 25,660 logic cells providing over 200K equivalent logic gates

 1866 Kbits (216 blocks) of 36-Kbit fast block RAM with 2-port access

 Up to 3.8 Gbps serial transceiver data rate per channel

 Up to 444 user I/O pins for flexible connectivity

 Power consumption as low as 0.15W per 1000 logic cells

 Partial reconfiguration capability to load sections of the FPGA

dynamically

 Hard IP blocks for PCI, Ethernet, memory control etc. available

The XC4VLX25 combines Virtex-4 family features like advanced routing,

DSP blocks, clock management, processors etc. in a mid-density, lower

cost package suitable for high volume markets.

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FPGA Architecture and Features

The Xilinx XC4VLX25 FPGA provides following key architectural

components and features:

Configurable Logic Blocks (CLBs)

The basic logic building block, each CLB contains 4 interconnected slices.

Each slice has two 4-input LUTs and register storage. CLBs implement logic

functions and macros.

36Kb Block RAM

With 216 in-built 36Kb RAM blocks that can be cascaded for wider words,

the FPGA offers up to 7.8Mb of fast on-chip RAM for data buffering.

Digital Clock Managers (DCMs)

8 on-chip DCMs provide a range of clock management features like

frequency synthesis, deskew, jitter filtering etc. for high performance.

Multi-Gigabit Transceivers

Up to 16 integrated multi-gigabit serial transceivers with data rates

reaching 3.8Gbps support high-speed protocols.

PCI Express Endpoint Block

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The integrated Endpoint block enables PCIe connectivity with flexible lane

width support.

PowerPC Processor Block

An optional on-chip IBM PowerPC 405 processor enables embedded

control, peripheral management and other functions.

These advanced architectural capabilities make the XC4VLX25 suitable for

complex projects beyond just glue logic.

Available Packages

The XC4VLX25 FPGA is available in three Flip-chip packages, offering pin

counts of 668 to 1517 pins:

Package Pins Ball Pitch

FF668 668 1mm
FF900 900 1mm
FF1148 1148 1mm
FF1517 1517 1mm

The fine 1mm ball pitch allows these high density packages to

accommodate the several hundred I/O pins. The flip-chip design provides

direct die contact to the package substrate minimizing parasitics.

Applications of XC4VLX25

With its balance of logic capacity, features and cost-effectiveness, the

Xilinx XC4VLX25 FPGA suits a wide spectrum of applications:

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 Automotive – Engine control units, driver assistance systems

 Industrial – Motor drives, robotics, instrumentation

 Video and Imaging – Video conferencing systems, medical imaging

 Wired Communications – Switching, routing, base stations

 Wireless Infrastructure – 3G/4G wireless base stations

 Aerospace and Defense – Radars, guidance systems, encryption

 High-end Consumer Devices – Gaming consoles, A/V receivers

The Virtex-4 family FPGAs offer ASIC-like capabilities but with reduced

risks, cost and faster time-to-market. The density, performance and power

efficiency specifically make the XC4VLX25 suitable for high volume

markets like automotive, consumer devices and communications

infrastructure.

XC4VLX25-10FF668C Part Number Significance

The full Xilinx part number reveals more details regarding the specific

device:

XC4VLX25 – Base FPGA model

-10 – Operating speed grade (-10 = 100MHz)

FF668 – 668 pin Flip-Chip BGA package

C – RoHS 6/6 compliant lead-free package

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Therefore, the XC4VLX25-10FF668C indicates:

 Virtex-4 XC4VLX25 family FPGA

 Lowest cost -10 speed grade

 High density 668 pin FF BGA package

 RoHS 6/6 compliant Pb-free solder balls

This combination targets cost-driven high volume applications which can

use the available logic and features without needing max performance.

Summary

The Xilinx XC4VLX25-10FF668C FPGA delivers an optimal mix of capacity,

capabilities and cost-effectiveness on proven 90nm Virtex-4 technology.

Over 200K logic cell density, 3600Kb of on-chip RAM, up to 16 multi-gigabit

serial transceivers, abundant hard IP blocks and 1mm fine pitch 668 pin

packaging suit the device to a large variety of applications in automotive,

industrial, communications, aerospace/defense and other high volume

segments. The performance, features and smaller cost provides ASIC-class

value at lower risk and time-to-market.

FAQs

What is the main difference between Virtex-4 and Virtex-5 FPGAs?

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Virtex-5 moved to 65nm process advancing to 40nm lithography for added

density and performance compared to 90nm Virtex-4 generation.

What voltage does XC4VLX25 operate at?

XC4VLX25 supports voltage from 0.97V to 1.2V allowing optimized power

efficiency. 1.0V is the nominal supply voltage.

Does XC4VLX25 support partial reconfiguration?

Yes, the early access partial reconfiguration feature is available in

XC4VLX25 to dynamically modify sections of the FPGA as needed.

What is the typical power consumption of XC4VLX25?

At 500K gate utilization, supply voltage of 1V and speed grade -10, power

is typically under 2W. Maximum thermal power reaches 15W.

What is the difference between FX668 and FF668 packages?

FF668 is the Flip-chip version while FX668 is the same 668 pin count but

wire-bonded package. FF provides better electrical performance than FX.

Introduction

Xilinx is a leading provider of programmable logic devices including FPGAs

(Field Programmable Gate Arrays). The Xilinx XC4VLX25 part number

refers to a specific FPGA belonging to the Virtex-4 FPGA family that was

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 RAYMING PCB & ASSEMBLY

introduced in 2006. The XC4VLX25 combines high performance, logic

density and low power consumption making it well suited for a wide range

of applications.

This article will provide an in-depth understanding of the Xilinx

XC4VLX25-10FF668C FPGA in terms of its key features, architecture,

available packages, and target applications.

XC4VLX25 FPGA Overview

The Xilinx XC4VLX25 device is a mid-range FPGA in the Virtex-4 series

catering to cost-sensitive, high-volume applications. Some key

characteristics are:

 Built on 90nm copper CMOS process for power efficiency

 Up to 25,660 logic cells providing over 200K equivalent logic gates

 1866 Kbits (216 blocks) of 36-Kbit fast block RAM with 2-port access

 Up to 3.8 Gbps serial transceiver data rate per channel

 Up to 444 user I/O pins for flexible connectivity

 Power consumption as low as 0.15W per 1000 logic cells

 Partial reconfiguration capability to load sections of the FPGA

dynamically

 Hard IP blocks for PCI, Ethernet, memory control etc. available

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 RAYMING PCB & ASSEMBLY

The XC4VLX25 combines Virtex-4 family features like advanced routing,

DSP blocks, clock management, processors etc. in a mid-density, lower

cost package suitable for high volume markets.

FPGA Architecture and Features

The Xilinx XC4VLX25 FPGA provides following key architectural

components and features:

Configurable Logic Blocks (CLBs)

The basic logic building block, each CLB contains 4 interconnected slices.

Each slice has two 4-input LUTs and register storage. CLBs implement logic

functions and macros.

36Kb Block RAM

With 216 in-built 36Kb RAM blocks that can be cascaded for wider words,

the FPGA offers up to 7.8Mb of fast on-chip RAM for data buffering.

Digital Clock Managers (DCMs)

8 on-chip DCMs provide a range of clock management features like

frequency synthesis, deskew, jitter filtering etc. for high performance.

Multi-Gigabit Transceivers

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Up to 16 integrated multi-gigabit serial transceivers with data rates

reaching 3.8Gbps support high-speed protocols.

PCI Express Endpoint Block

The integrated Endpoint block enables PCIe connectivity with flexible lane

width support.

PowerPC Processor Block

An optional on-chip IBM PowerPC 405 processor enables embedded

control, peripheral management and other functions.

Show Image

These advanced architectural capabilities make the XC4VLX25 suitable for

complex projects beyond just glue logic.

Available Packages

The XC4VLX25 FPGA is available in three Flip-chip packages, offering pin

counts of 668 to 1517 pins:

Package Pins Ball Pitch

FF668 668 1mm
FF900 900 1mm
FF1148 1148 1mm
FF1517 1517 1mm

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 RAYMING PCB & ASSEMBLY

The fine 1mm ball pitch allows these high density packages to

accommodate the several hundred I/O pins. The flip-chip design provides

direct die contact to the package substrate minimizing parasitics.

Applications of XC4VLX25

With its balance of logic capacity, features and cost-effectiveness, the

Xilinx XC4VLX25 FPGA suits a wide spectrum of applications:

 Automotive – Engine control units, driver assistance systems

 Industrial – Motor drives, robotics, instrumentation

 Video and Imaging – Video conferencing systems, medical imaging

 Wired Communications – Switching, routing, base stations

 Wireless Infrastructure – 3G/4G wireless base stations

 Aerospace and Defense – Radars, guidance systems, encryption

 High-end Consumer Devices – Gaming consoles, A/V receivers

The Virtex-4 family FPGAs offer ASIC-like capabilities but with reduced

risks, cost and faster time-to-market. The density, performance and power

efficiency specifically make the XC4VLX25 suitable for high volume

markets like automotive, consumer devices and communications

infrastructure.

XC4VLX25-10FF668C Part Number Significance

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 RAYMING PCB & ASSEMBLY

The full Xilinx part number reveals more details regarding the specific

device:

XC4VLX25 – Base FPGA model

-10 – Operating speed grade (-10 = 100MHz)

FF668 – 668 pin Flip-Chip BGA package

C – RoHS 6/6 compliant lead-free package

Therefore, the XC4VLX25-10FF668C indicates:

 Virtex-4 XC4VLX25 family FPGA

 Lowest cost -10 speed grade

 High density 668 pin FF BGA package

 RoHS 6/6 compliant Pb-free solder balls

This combination targets cost-driven high volume applications which can

use the available logic and features without needing max performance.

Summary

The Xilinx XC4VLX25-10FF668C FPGA delivers an optimal mix of capacity,

capabilities and cost-effectiveness on proven 90nm Virtex-4 technology.

Over 200K logic cell density, 3600Kb of on-chip RAM, up to 16 multi-gigabit

serial transceivers, abundant hard IP blocks and 1mm fine pitch 668 pin

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 RAYMING PCB & ASSEMBLY

packaging suit the device to a large variety of applications in automotive,

industrial, communications, aerospace/defense and other high volume

segments. The performance, features and smaller cost provides ASIC-class

value at lower risk and time-to-market.

FAQs

What is the main difference between Virtex-4 and Virtex-5 FPGAs?

Virtex-5 moved to 65nm process advancing to 40nm lithography for added

density and performance compared to 90nm Virtex-4 generation.

What voltage does XC4VLX25 operate at?

XC4VLX25 supports voltage from 0.97V to 1.2V allowing optimized power

efficiency. 1.0V is the nominal supply voltage.

Does XC4VLX25 support partial reconfiguration?

Yes, the early access partial reconfiguration feature is available in

XC4VLX25 to dynamically modify sections of the FPGA as needed.

What is the typical power consumption of XC4VLX25?

At 500K gate utilization, supply voltage of 1V and speed grade -10, power

is typically under 2W. Maximum thermal power reaches 15W.

What is the difference between FX668 and FF668 packages?

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 RAYMING PCB & ASSEMBLY

FF668 is the Flip-chip version while FX668 is the same 668 pin count but

wire-bonded package. FF provides better electrical performance than FX.

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