TDA1175P

LOW-NOISE VERTICAL DEFLECTION SYSTEM

FEATURES SUMMARY
■ COMPLETE VERTICAL DEFLECTION Figure 1. Package
SYSTEM
■ LOW NOISE
■ SUITABLE FOR HIGH DEFINITION
MONITORS
■ ESD PROTECTED

DESCRIPTION
The TDA1175P is a monolithic integrated circuit in
POWERDIP16 plastic package. It is intended for
POWERDIP16
use in black and white and colour TV receivers.
Low-noise makes this device particularly suitable (Plastic Package)
for use in monitors.
The functions incorporated are: synchronization
circuit, oscillator and ramp generator, high power
gain amplifier, flyback generator, voltage regula-
tor.

Figure 2. Pin Connections

RAMP OUTPUT 1 16 RAMP GENERATOR

SUPPLY VOLTAGE 2 15 COMPENSATION

FLYBACK 3 14 AMP. INPUT

GROUND 4 13 GROUND

GROUND 5 12 GROUND

POWER AMPLIFIER OUTPUT 6 11 OSCILLATOR

POWER AMPLIFIER
7 10 SYNC. INPUT
SUPPLY VOLTAGE
REGULATED VOLTAGE 8 9 HEIGHT ADJUSTMENT

REV. 2
April 2004 1/13
TDA1175P

Figure 3. Block Diagram

+ VS
C4 DA

8 2 3 7
FREQ P1 TDA1175P C9
RH

VOLTAGE FLYBACK POWER

11 OSCILLATOR 6
REGULATOR GENERATOR AMPLIFIER
C1
RG YOKE
C8
SYNC RAMP BUFFER
SYNC 10 PREAMPLIFIER 15
CIRCUIT GENERATOR STAGE

C5 C7
RE
4 5 12 13 9 16 1 14
LINEARITY RD
TABS C2

HEIGHT P2 RA P3 RB RC
C6 RF
C3

Table 1. Absolute Maximum Ratings

Symbol Parameter Value Unit
VS Supply Voltage at Pin 2 35 V
V6, V7 Flyback Peak Voltage 60 V
+ 10
V14 Power Amplifier Input Voltage V
– 0.5
IO Output Peak Current (non repetitive) at t = 2ms 2 A
IO Output Peak Current at f = 50Hz, t ≤ 10µs 2.5 A
IO Output Peak Current at f = 50Hz, t > 10µs 1.5 A
I3 Pin 3 DC Current at V6 < V2 100 mA
I3 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5ms 1.8 A
I10 Pin 10 Current ± 20 mA
Power Dissipation at at Ttab = 90°C 4.3 W
PTOT
Power Dissipation at Tamb = 70°C (free air) (1) 1 W
TSTG , Tj Storage and Junction Temperature – 40 to 150 °C

Table 2. Thermal Data

Symbol Parameter Value Unit
Rth (j-tab) Thermal Resistance Junction-pin Max. 12 °C/W

Rth (j-amb) Thermal Resistance Junction-ambient Max. 80 °C/W(1)

Note: 1. Obtained with tabs soldered to printed circuit with minimized copper area.

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 TDA1175P

ELECTRICAL CHARACTERISTICS
(Tamb = 25°C, unless otherwise specified)

Table 3. DC CHARACTERISTICS
(Refer to the test circuits, VS = 35V)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I2 Pin 2 Quiescent Current I3 = 0 7 14 mA 5
I7 Pin 7 Quiescent Current I6 = 0 8 17 mA 5
–I11 Oscillator Bias Current V11 = 1V 0.1 1 µA 4
–I14 Amplifier Input Bias Current V14 = 1V 1 10 µA 5
–I16 Ramp Generator Bias Current V16 = 0 0.02 0.3 µA 4
–I16 Ramp Generator Current I9 = 20µA, V16 = 0 18.5 20 21.5 µA 5

∆I 16
---------- Ramp Generator Non-linearity ∆V16 = 0 to 12V, I9 = 20µA 0.2 1 % 5
I 16

VS Supply Voltage Range 10 35 V

Pin 1 Saturation Voltage to
V1 I1 = 1mA 1 14 V
Ground
Pin 3 Saturation Voltage to
V3 I3 = 10mA 1.5 2.5 V 4
Ground
V6 Qiuescent output Voltage Vs = 10V, R1 = 1kΩ, R2 = 1kΩ 4.1 4.4 4.7 V 4
Vs = 35V, R1 = 3kΩ, R2 = 1kΩ 8.2 8.8 9.4 V 4
Output Saturation Voltage to
V6L – I6 = 0.1A 0.9 1.2 V 6
Ground
– I6 = 0.8A 1.8 2.2 V 6
Output Saturation Voltage to
V6H I6 = 0.1A 1.4 2.1 V 7
Supply
I6 = 0.8A 2.8 3.1 V 7
V8 Regulated Voltage at Pin 8 6.5 6.7 6.9 V 5
V9 Regulated Voltage at Pin 9 I9 = 20µA 6.6 6.8 7 V 5

∆V 8 ∆V 9 Regulated Voltage Drift with

------------
- ------------- ∆Vs = 10 to 35V 1 2 mV/V 5
Supply Voltage
∆V S ∆V S

Amplifier Input Reference

V14 V10 ≤ 0.4V 2.20 2.27 2.35 V
Voltage

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TDA1175P

Table 4. AC CHARACTERISTICS
(Refer to the AC test circuit, VS = 22V, f = 50Hz)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
IS Supply Current IY = 1APP 140 mA 8
Sync. Input Current (positive or
I10 0.5 2 mA 8
negative)
V6 Flyback Voltage IY = 1APP 45 V 8
tfly Flyback Time IY = 1APP 0.7 ms 8
VON Peak to Peak Output Noise Pin 11 Connected to GND 18 30 mVpp 8
(P1 + R1) = 300kΩ
fO Free Running Frequency 36 43.5 Hz 8
C9 = 0.1 µF
fOPER Operating Frequency Range 10 120 Hz 8
I10 = 0.5mA, C9 = 0.1µF
∆f Synchronization Range 14 Hz 8
(P1+R1) = 300kΩ

∆f Frequency Drift with Supply

VS = 10 to 35V
0.00 Hz/V
8
---------- Voltage 5
∆V S

Frequency Drift with tab

∆f Ttab = 40 to 120°C 0.01 Hz/°C 8
------------ Temperature
∆T ab

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 TDA1175P

DC TEST CIRCUITS

Figure 4. Figure 6.

+VS + VS
I3
V3

3 2 7 I4
2 7
10
TDA1175P 6
11 11 TDA1175P 6

I8 9 16 14 R1
TABS 14
TABS
1κΩ - I9 - I12 V4
V4L
1V 1V 8V R2

4V

Figure 5. Figure 7.
+VS + VS
I2

I5

2 7 2 7 V4H

11 TDA1175P 14 11 TDA1175P 6

8 16 9 14
TABS TABS

V6 - I12 - I10
V7 I4
100kΩ

1V
1V

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TDA1175P

Figure 8. AC Test and Application Circuit for Large Screen B/W TV Set 10Ω/20mH/1APP

VS = 22V
0.1µF 1N4001 470µF

100µF TABS
0.1µF
7 2 3.3Ω

3 6
Yoke
220kΩ 100pF 5.6kΩ Ry = 10Ω 560Ω*
Ly = 20mH
15
470pF 1000µF
SYNC. 10 5.6kΩ
INPUT TDA1175P
14
10µF
22kΩ

1
11 100kΩ
P1
100kΩ 8 9 16
R1
47kΩ 1.8kΩ
220kΩ 100kΩ

0.1µF
120kΩ 910kΩ 1Ω
C9 0.1µF
0.1µF
*on application only

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 TDA1175P

Figure 9. Typical Application Circuit for VGA Monitor (RY = 10Ω, LY = 20mH, IY = 0.8APP)

C9 C10 560pF

3.3nF R12 R13 R11 C12

3.3Ω 2.7kΩ 470µF
50V
220kΩ C11
VS 0.1µF
C8
(26V)
22µF R7
C1 C2 D1 15 2 6 35V 27kΩ
0.1µF 1000µF 1N4007
35V
7 R14
Y1
C3 14 220µF
R1 YOKE
100µF 1/2W
3.3kΩ
35V
3
TDA1175P
R8
10
1
11 47kΩ
P3 R9
C4 50kΩ 5.1kΩ
0.15µF
8 9 16 4 5 12 13 V.LIN

R2 C6 R6 R10
82kΩ 0.1µF 56kΩ 0.82Ω
P1 R4
100kΩ 1MΩ
C7
V.FREQ 0.1µF
R5 P2
200kΩ 220kΩ

C5 R3 V. SIZE
1.8µF 240kΩ

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TDA1175P

Figure 10. P.C. Board and Components Layout of the Circuit of Figure 9 (1:1 scale)

V-SIZE
V-FREQ

C9
C12 R12
C18 C6
P1 P2

R18
R6 R9

C2
R2
R11
GND
C4
VS
C11
R1
R10 C1
D1

Y1 C8
R8 IC1 C3

R14
P3
R7
V.LIN

R4 R8
C7 C6
R6
R

Table 5. Bill of Material Item Qty Reference Part

Item Qty Reference Part
15 1 R1 3.3kΩ
1 4 C1, C6, C7, C11 0.1µF
16 1 R2 82kΩ
2 1 C2 1000µF 35V
17 1 R3 240kΩ
3 1 C3 100µF 35V
18 1 R4 1MΩ
4 1 C4 0.15µF
19 1 R5 200kΩ
5 1 C5 1.8nF
20 1 R6 56kΩ
6 1 C8 22µF 35V
21 1 R7 27kΩ
7 1 C9 3.3nF
22 1 R8 47kΩ
8 1 C10 560pF
23 1 R9 5.1kΩ
9 1 C12 470µF 50V
24 1 R10 0.82Ω
10 1 D1 1N4007
25 1 R11 2.7kΩ
11 1 IC1 TDA1175P
26 1 R12 220kΩ
12 1 P1 100kΩ POT
27 1 R13 3.3Ω
13 1 P2 220kΩ POT
28 1 R14 220Ω 1/2W
14 1 P3 50kΩPOT
29 1 Y1 YOKE

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 TDA1175P

MOUNTING INSTRUCTION
The Rth (j-a) can be reduced by soldering the GND Figure 13. Maximum Power Dissipation and
pins to a suitable copper area of the printed circuit Junction-ambient Thermal Resistance versus
board (Figure 11) or to an external heatsink (Fig- "I"
ure 12).
The diagram of Figure 13 shows the maximum dis- G-3558
sipable power Ptot and the Rth (j-a) as a function of Ptot Rth
the side "I" of two equal square copper areas hav- (W) (˚C/W)
ing a thicknessof 35µ (1.4 mils).
During soldering the pins temperature must not 4 80
exceed 260°C and the soldering time must not be
longer than 12 seconds. Rth j - amb
The external heatsink or printed circuit copper 3 60
area must be connected to electrical ground.
2 40
Figure 11. Example of P.C. Board Copper Area

COPPER AREA 35µ THICKNESS

1 Ptot (Tamb = 70˚C) 20

0 0

0 10 20 30 40 l (mm)

Figure 14. Maximum Allowable Power

Dissipation versus Ambient Temperature
G-3559/2
Ptot

WIT
S-3181 4
P.C. BOARD
W

H IN
IT
H
HE

FINI
AT

3
TE H
SI
NK

Figure 12. External Heatsink Mounting

HA

EAT

Example
VI
NG

SINK
Rt

2
h

17.0 mm
=
25

FR
˚C

EE
/W

AIR
1

0
11.9 mm -50 0 50 100 Tamb(˚C)
38.0 mm

S-3474

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TDA1175P

PART NUMBERING

Table 6. Order Codes

Part Number Package Temperature Range
TDA1175P POWERDIP16 -25 to 85 °C

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 TDA1175P

PACKAGE MECHANICAL

Table 7. POWERDIP16 - Mechanical Data

millimeters inches
Symbol
Typ Min Max Typ Min Max
a1 0.51 0.020
B 0.85 1.4 0.033 0.055
b 0.5 0.020
b1 0.38 0.5 0.015 0.020
D 20 0.787
E 8.8 0.346
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
i 5.1 0.201
L 3.3 0.130
Z 1.27 0.050

Figure 15. POWERDIP16 - Package Dimensions

a1

b1
L

b B e E
Z
e3

16 9
F

1 8

Note: Drawing is not to scale

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TDA1175P

REVISION HISTORY

Table 8. Revision History

Date Revision Description of Changes

August-1995 1 First Issue

14-Apr-2004 2 Stylesheet update. No content change.

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 TDA1175P

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by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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