XR829 Datasheet

Single-Chip IEEE 802.11 b/g/n WLAN, Bluetooth 2.1/4.0/4.1

Revision 1.0
May 5, 2018

Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved

 Declaration

Declaration
THIS DOCUMENTATION IS THE ORIGINAL WORK AND COPYRIGHTED PROPERTY OF XRADIO TECHNOLOGY
(“XRADIO”). REPRODUCTION IN WHOLE OR IN PART MUST OBTAIN THE WRITTEN APPROVAL OF XRADIO AND GIVE
CLEAR ACKNOWLEDGEMENT TO THE COPYRIGHT OWNER.

THE INFORMATION FURNISHED BY XRADIO IS BELIEVED TO BE ACCURATE AND RELIABLE. XRADIO RESERVES THE
RIGHT TO MAKE CHANGES IN CIRCUIT DESIGN AND/OR SPECIFICATIONS AT ANY TIME WITHOUT NOTICE. XRADIO
DOES NOT ASSUME ANY RESPONSIBILITY AND LIABILITY FOR ITS USE. NOR FOR ANY INFRINGEMENTS OF PATENTS
OR OTHER RIGHTS OF THE THIRD PARTIES WHICH MAY RESULT FROM ITS USE. NO LICENSE IS GRANTED BY
IMPLICATION OR OTHERWISE UNDER ANY PATENT OR PATENT RIGHTS OF XRADIO. THIS DATASHEET NEITHER
STATES NOR IMPLIES WARRANTY OF ANY KIND, INCLUDING FITNESS FOR ANY PARTICULAR APPLICATION.

THIRD PARTY LICENCES MAY BE REQUIRED TO IMPLEMENT THE SOLUTION/PRODUCT. CUSTOMERS SHALL BE
SOLELY RESPONSIBLE TO OBTAIN ALL APPROPRIATELY REQUIRED THIRD PARTY LICENCES. XRADIO SHALL NOT BE
LIABLE FOR ANY LICENCE FEE OR ROYALTY DUE IN RESPECT OF ANY REQUIRED THIRD PARTY LICENCE. XRADIO
SHALL HAVE NO WARRANTY, INDEMNITY OR OTHER OBLIGATIONS WITH RESPECT TO MATTERS COVERED UNDER
ANY REQUIRED THIRD PARTY LICENCE.

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 2
 Revision History

Revision History
Version Data Summary of Changes
1.0 2018-5-5 Initial Version

Table 1- 1 Revision History

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 3
 Contents

Contents
Declaration......................................................................................................................................................................2

Revision History.............................................................................................................................................................. 3

Contents.......................................................................................................................................................................... 4

Tables.............................................................................................................................................................................. 6

Figures............................................................................................................................................................................. 7

1 System Overview.................................................................................................................................................... 8

1.1 General Description................................................................................................................................8

1.2 Features.................................................................................................................................................. 8

1.3 Applications............................................................................................................................................ 9

1.4 Block Diagram......................................................................................................................................... 9

2 Pin Description......................................................................................................................................................10

2.1 Pin Assignment..................................................................................................................................... 10

2.2 Pin List...................................................................................................................................................10

3 Power Supply........................................................................................................................................................ 13

3.1 Power Up and Power Down................................................................................................................. 13

3.2 Analog Power Supply............................................................................................................................14

3.3 Digital Power Supply.............................................................................................................................15

3.4 Power Consumption............................................................................................................................. 15

4 Clocks.................................................................................................................................................................... 16

4.1 Reference Clock.................................................................................................................................... 16

4.2 Low Power Clock...................................................................................................................................18

5 Electrical Characteristics.......................................................................................................................................19

5.1 Absolute Maximum Rating................................................................................................................... 19

5.2 Digital IO Pin DC Characteristics........................................................................................................... 19

6 Transceiver/Receiver Performance...................................................................................................................... 20

6.1 WLAN Performance.............................................................................................................................. 20

6.2 Bluetooth Performance........................................................................................................................ 21

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 4
 Contents

7 Package Outline & PCB Layout Design................................................................................................................. 23

8 Carrier Information............................................................................................................................................... 25

8.1 Tray Carrier............................................................................................................................................25

8.2 Tape Reel Carrier...................................................................................................................................28

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 5
 Tables

Tables
Table 1- 1 Revision History.....................................................................................................................................................3

Table 2- 1 Pin List..................................................................................................................................................................10

Table 3- 1 Analog Power Supply.......................................................................................................................................... 14

Table 3- 2 Digital Power Supply........................................................................................................................................... 15

Table 3- 3 Power Consumption............................................................................................................................................15

Table 4- 1 External Reference Clock Specifications.............................................................................................................16

Table 4- 2 External Clock Requirements.............................................................................................................................. 16

Table 4- 3 External Crystal Characteristics Requirements.................................................................................................. 17

Table 4- 4 Low Power Clock Specifications..........................................................................................................................18

Table 5- 1 Absolute Maximum Rating................................................................................................................................. 19

Table 5- 2 IO DC Characteristics (VDD_IO=3.3V)................................................................................................................. 19

Table 5- 3 IO DC Characteristics (VDD_IO=1.8V)................................................................................................................. 19

Table 6- 1 WLAN Transceiver/Receiver Performance......................................................................................................... 20

Table 6- 2 Bluetooth Transceiver/Receiver Performance................................................................................................... 21

Table 7- 1 Package Dimensions............................................................................................................................................23

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 Figures

Figures
Figure 1- 1 XR29 Block Diagram.............................................................................................................................................9

Figure 2- 1 Pin Assignment...................................................................................................................................................10

Figure 3- 1 WLAN subsystem Power Up and Power Down.................................................................................................13

Figure 3- 2 Bluetooth subsystem Power Up and Power Down...........................................................................................14

Figure 7- 1 Package Dimensions.......................................................................................................................................... 23

Figure 7- 2 Example for PCB Layout Design.........................................................................................................................24

Figure 7- 3 Photograph of Package Top............................................................................................................................... 24

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 7
 System Overview

1 System Overview

1.1 General Description

This scope of document is to provide a specification of XR829 Wireless LAN SoC, that will be used by the
system/design/development teams to detail the design requirements.

XR829 is a fully integrated SoC to support 2.4G WLAN 802.11 b/g/n and Bluetooth 2.1+EDR/4.1. It is optimized for
mobile applications such as PDAs and portable media players. High sensitivity and transmitting power ensure long
distance and robust connection. Highest level of integration allows very compact and cost effective reference designs
delivering fast time-to-market for new WLAN and Bluetooth enabled products. And small 5x5mm QFN package is
suitable for very compact design.

1.2 Features

WLAN Features

• Compatible with IEEE 802.11 b/g/n standard

• 802.11n support for 20/40MHz bandwidth
• Support for Short Guard Interval
• Support for 802.11n MCS0~MCS7
• 6M~54M data rate for 802.11g
• DSSS, CCK modulation with long and short preamble
• Support frame aggregation using A-MSDU, A-MPDU
• Supports MAC enhancements including
– 802.11d - Regulatory domain operation
– 802.11e - QoS including WMM
– 802.11h - Transmit power control dynamic and frequency selection
– 802.11i - Security including WPA2 and WAPI compliance
– 802.11r - Roaming
– 802.11w - Management frame protection
• Support for Station, SoftAP and P2P mode
• Support for Wi-Fi Direct

Bluetooth Features

• Bluetooth Dual Mode support with 2.1/4.0/4.1

• Class 1, Class 2 and Class 3 transmitter operation
• Host Controller Interface using a high-speed UART, maximum baud rate of 4 Mbps

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 8
 System Overview

• Adaptive Frequency Hopping

• SCO and eSCO support
• 1, 3 and 5 slots all packet types support
• Audio interfaces: PCM, I2S
• Transcoders for A-law, µ-law and CVSD voice over air
• Piconet and scatternet support
• Secure simple pairing
• Sniff/Sniff Subrating low power mode support

1.3 Applications

Tablet PC
Smart internet TV box
Portable media player (PMP)
Portable gaming device (PGD)
Internet of Thing (IOT)

1.4 Block Diagram

Top level block diagram of XR829 is shown in Figure 1-1.

Figure 1- 1 XR29 Block Diagram

The XR829 includes a single-band 2.4G RF transceiver (integration with PA, LNA and TR switch), PMU, WLAN modem,
WLAN MAC, Bluetooth modem and Bluetooth protocol stack. The WLAN subsystem keeps data communications with
the host using SDIO 2.0, while the Bluetooth subsystem uses HCI UART and PCM for audio data. The XR829 core
benefits are to provide an industry leading price competitive solution with a high level of system integration. In turn
this reduces the overall BOM cost while also shortening the mass production cycle.

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 9
 Pin Description

2 Pin Description

2.1 Pin Assignment

Figure 2- 1 Pin Assignment

2.2 Pin List

The following signal type codes are used in the table:

I: Input
O: Output
I/O: for Input/Output
P: Power pin

Table 2- 1 Pin List

Name Pin Type Description

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 Pin Description

Analog
XTAL1 4 I Reference clock input or XTAL inputs
XTAL2 3 I
ANT 40 I/O 2.4 GHz RF input/output
Power
VDD14_TX 36 P Supply for RF TX
VDD14_RX 1 P Supply for RF RX
VDD14_DIG 22 P Supply for digital LDO
VDD12_CLK 2 P Supply for Clock
VDD12_DIG 21 P Supply for digital LDO
VDD_IO 11 P Supply for IO
VDD_SENSE 28 P DCDC feedback
VDD_VLX 29 P DCDC output
VDD_RTC 26 P Supply for RTC
VDD25_EF 27 P Supply for EFUSE
VDD33_PA 38 P Supply for PA
VBAT 30,37 P Supply for on-chip-PMU
Digital
LDO_SEL 25 I DCDC/LDO select
0：Internal switching regulator select
1：Internal LDO select
LPCLK 20 I Low power clock input, 32.768 kHz, or be grounded
BT_WKUP_HOST 6 O Bluetooth subsystem wakes up host
BT_HOST_WKUP 5 I Host wakes up Bluetooth subsystem
PCM_CLK 31 I/O Bluetooth PCM clock
PCM_IN 33 I Bluetooth PCM data input
PCM_OUT 32 O Bluetooth PCM data output
PCM_SYNC 34 I/O Bluetooth PCM synchronization control
UART_TX 10 O Bluetooth UART transmit
UART_RX 9 I Bluetooth UART receive
UART_CTS 8 I Bluetooth UART CTS
UART_RTS 7 O Bluetooth UART RTS
BT_RSTN 23 I Bluetooth Reset, active low
WL_RSTN 24 I WLAN Reset, active low
CLKREQO 18 O Clock request
WIRQ 35 O WLAN interrupt request
SDIO_CMD 12 I/O SDIO command
SDIO_D0 13 I/O SDIO data

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 Pin Description

SDIO_D1 14 I/O SDIO data

SDIO_D2 17 I/O SDIO data
SDIO_D3 15 I/O SDIO data
SDIO_CLK 16 I SDIO clock
TEN 19 I Test enable select, active high

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 12
 Power Supply

3 Power Supply

3.1 Power Up and Power Down

Figure 3- 1 WLAN subsystem Power Up and Power Down

There is no constraint on the WLAN subsystem power supplies (VBAT and VDD_IO) activation sequence. The WLAN
subsystem can start up without the reference clock being present. The platform is then expected to provide a stable
clock within Tstablems (see reference value in chapter 4) unless the built-in XTAL oscillator is used. A typical startup for
the WLAN subsystem is as follows:

(1)VBAT, VDD_IO is applied.

(2)Release WL_RSTN pin from low to high.
(3)The host should wait 30ms after the WL_RSTN release for the on-chip PMU to stabilize.
(4)WLAN subsystem is now in the Sleep state.
(5)The host wake up the WLAN subsystem by writing WUP bit through the SDIO interface.
(6)Within Tstablems, the reference clock should be stable and the system can start using it.
(7)The host can download the firmware and release the CPU reset by further SDIO write.
(8)WLAN subsystem will begin to initialize.
(9)Once initialized, which includes a series of messages passing between the host and the WLAN subsystem, the
WLAN subsystem may not have anything further to do and will enter the sleep state if Host set WLAN_RDY to 0.

To power down the WLAN subsystem, WL_RSTN have to be set to 0. There are no constraints on other input pins.
VDD_IO is allowed to go down 20ms after all input signals have been set to 0 (avoid the influent current).

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 13
 Power Supply

Figure 3- 2 Bluetooth subsystem Power Up and Power Down

The Bluetooth subsystem power up and power down is similar to the WLAN subsystem. A typical startup for the
Bluetooth subsystem is as follows:

(1)VBAT, VDD_IO is applied.

(2)Release BT_RSTN pin from low to high.
(3)The host should wait 30ms after the BT_RSTN release for the on-chip PMU to stabilize.
(4)Bluetooth subsystem is now in the Sleep state.
(5)The host should now wake the Bluetooth subsystem by pull up BT_HOST_WKUP pin.
(6)Within Tstablems, the reference clock should be stable and the system can start using it.
(7)The host and Bluetooth subsystem will synchronous baud rate through the UART interface.
(8)The host can download firmware by further UART write.
(9)Bluetooth subsystem will begin to initialize.
(10)Once initialized, which includes a series of messages passing between the host and the Bluetooth subsystem,
the Bluetooth subsystem may not have anything further to do and will enter the sleep state if Host pull down
BT_HOST_WKUP pin.

To power down the Bluetooth subsystem, BT_RSTN have to be set to 0. There are no constraints on other input pins.
VDD_IO is allowed to go down 20ms after all input signals have been set to 0 (avoid the influent current).

3.2 Analog Power Supply

Table 3- 1 Analog Power Supply

Symbol Parameter Min Typ Max Unit

VBAT Power supply 2.7 3.6 5.5 V
VDD33_PA TX PA 3.3V power supply 3.0 3.3 3.6 V

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 Power Supply

VDD14_RX RX LDO power supply 1.4 1.5 2 V

VDD14_TX TX LDO power supply 1.4 1.5 2 V
VDD_SENSE DCDC feedback 1.4 1.5 2 V
VDD12_CLK Clock LDO power supply 1.14 1.2 1.26 V

3.3 Digital Power Supply

Table 3- 2 Digital Power Supply

Symbol Parameter Min Typ Max Unit

VDD_IO IO power supply 1.62 3.3 3.6 V
VDD25_EF EFUSE power supply 2.3 2.5 2.7 V
VDD14_DIG Digital LDO power supply 1.4 1.5 2 V
VDD12_DIG Digital power supply 1 1.1 1.2 V
VDD_RTC RTC power supply 1 1.1 1.2 V

3.4 Power Consumption

Conditions：VBAT=3.6V; VDDIO=3.3V; Temp:25oC

Table 3- 3 Power Consumption

WLAN State Bluetooth State DCDC mode (mA) LDO mode (mA)
Standby Standby 0.00078 0.00078
Sleep Sleep 0.12 0.21
20M Mode RX DSSS/CCK 1M Standby 29 62
20M Mode RX OFDM MCS7 Standby 35 75
40M Mode RX OFDM MCS7 Standby 41 88
20M Mode TX @16dBm， Standby 145 192
DSSS/CCK 11M
20M Mode TX @14dBm， Standby 128 179
OFDM MCS7
40M Mode TX @15dBm， Standby 137 190
OFDM MCS0
40M Mode TX @14dBm， Standby 126 180
OFDM MCS7
Standby RX active DH1/2DH3/3DH5 19 41
Standby TX active @5dbm 42 90
DH1/2DH3/3DH5

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 15
 Clocks

4 Clocks
XR829 uses a reference clock and a low power clock.

For the reference clock, XR829 can either use an external reference clock source or generate its own reference using a
XTAL and a built-in oscillator.

For the low power clock, XR829 can either use an external 32.768 KHz clock or generate its internal RCOSC. If use
internal RCOSC, the LPCLK pin should be grounded. The low power clock is used during power save modes and used
only for power controller module .

4.1 Reference Clock

Table 4- 1 External Reference Clock Specifications

Symbol Parameter Min Typ Max Unit

Clock input frequency list using an external clock source 13 24 52 MHz
FIN Clock input frequency list using a XTAL and the built-in
19.2 24 52 MHz
oscillator
FINTOL Tolerance on input frequency without trimming -20 - +20 ppm
Tstable Clock stabilization time - - 10 ms
ILEAK Input leakage current, both for analog and digital - - 1 uA

Clock frequency detection

An integrated automatic detection algorithm detects the reference clock frequency using the low power clock after a
hardware reset.

Clock source detection

An integrated automatic detection mechanism detects the clock source from the connections of the XTAL1 and XTAL2
pins:

• When an external reference clock source is used, the clock input pin is XTAL2. The XR829 supports both an analog
and digital source. An analog source shall be AC coupled to XTAL2 while a digital source shall be DC coupled to XTAL2.
In both cases, XTAL1 must be left floating.

• When a XTAL and the built-in oscillator are used, the XTAL shall be DC coupled to XTAL1 and XTAL2.

External Clock Source

• Requirements

Table 4- 2 External Clock Requirements

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 Clocks

Symbol Parameter Min Typ Max Unit

AC coupled signal
FIN Frequency 13 24 52 MHz
VAPP Peak-to-peak voltage range of the AC coupled 0.4 0.5 1.2 Vpp
analog input
NH Total harmonic content of the input signal - - -25 dBc
DC coupled signal
VIL input low voltage on XTAL2 0 - 0.3*V18 V
VIH input high voltage on XTAL2 0.7*V18 - V18 V
Tr/Tf 10%-90% rise and fall time - - 5 ns
Duty cycle Cycle-to-cycle 40 50 60 %
Both analog and digital signals
ZINRE Real part of parallel AC input impedance at the pin 30 - - KOhm
ZINIM Imaginary part of parallel AC input impedance at
- 3.5 5 pF
the pin
ZDC DC input impedance 1 - - MOhm
Phase Ref clock @ 24 MHz, 2.4 GHz 802.11b/g/n operation
noise @1 kHz -123
@10 kHz - - -133 dBc/Hz
@100 kHz -138
@1 MHz -138

External XTAL and Built-in Oscillator

Table 4- 3 External Crystal Characteristics Requirements

Parameter Conditions Min Typ Max Unit

Frequency range 13 - 52 MHz
ESR - - 60 Ohm
Cin_xtal(1) Single-ended 3.5 18 36 pF
Load capacitance(1) - 16 27 pF
(2)
Oscillator tuning range +/-20 +/-50 +/-70 ppm
Crystal frequency accuracy at nominal temperature 25 °C -10 - +10 ppm
Crystal drift due to temperature -20 °C to +85 °C -10 - +10 ppm
Crystal pull ability 10 - 150 ppm/pF

(1)The load capacitance value (Cload) depends on XTAL model, XTAL1 and XTAL2 pin have extra capacitance (Cin_xtal), so
external added load capacitance value Cload_ext = Cload - Cin_xtal. Cin_xtal has tuning range about 7pF, which is controlled by
software, for details please go to software user manual.

(2)Tuning range depends on XTAL load capacitance requirement, typical case is based on 26MHz XTAL, 8pF Cload.

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 17
 Clocks

4.2 Low Power Clock

Table 4- 4 Low Power Clock Specifications

Symbol Parameter Min Typ Max Unit

FIN Frequency - 32.768 - KHz
F/FIN Frequency accuracy -250 - +250 ppm
Duty cycle 30 - 70 %
Jitter Cycle-to-cycle -40 - +40 ns
Rin Input resistance 1 - - MOhm
Cin Input capacitance - - 5 pF
VIL Input low voltage on LPCLK 0 - 0.4 V
VIH Input high voltage on LPCLK VDD_IO- 0.4 - VDD_IO V

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 18
 Electrical Characteristics

5 Electrical Characteristics

5.1 Absolute Maximum Rating

The Absolute Maximum Rating (AMR) corresponds to the maximum value that can be applied without leading to
instantaneous or very short-term unrecoverable hard failure (destructive breakdown).

Table 5- 1 Absolute Maximum Rating

Symbol Parameter Min Max Unit

VBAT 2.7~5.5V power supply -0.3 5.8 V
VDD_IO IO power supply -0.3 4.0 V
Vin Input voltage on any digital pin -0.3 3.6 V
o
Tstg Storage Temperature -40 150 C
o
Ta Ambient Operating Temperature -40 85 C
Storage 5 95 %
Humidity
Operation 10 93 %

5.2 Digital IO Pin DC Characteristics

Table 5- 2 IO DC Characteristics (VDD_IO=3.3V)

Symbol Parameter Min Typ Max Unit

VIH Input high voltage 2.06 - 3.6 V
VIL Input low voltage -0.3 - 1.32 V
VOH Output high voltage 2.4 - 3.6 V
VOL Output low voltage -0.3 - 0.4 V
RPU Input Pull-up Resistance 40 66 110 KΩ
RPD Input Pull-down Resistance 40 66 110 KΩ

Table 5- 3 IO DC Characteristics (VDD_IO=1.8V)

Symbol Parameter Min Typ Max Unit

VIH Input high voltage 1.18 - 2 V
VIL Input low voltage -0.3 - 0.65 V
VOH Output high voltage 1.44 - 2 V
VOL Output low voltage -0.3 - 0.4 V
RPU Input Pull-up Resistance 80 135 210 KΩ
RPD Input Pull-down Resistance 80 135 210 KΩ

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 19
 Transceiver/Receiver Performance

6 Transceiver/Receiver Performance

6.1 WLAN Performance

Conditions：VBAT=3.6V; VDDIO=3.3V; Temp:25 oC

Table 6- 1 WLAN Transceiver/Receiver Performance

Performance
Parameter Description Unit
Min Typ Max

Frequency range Center channel frequency 2412 - 2484 MHz

RX Sensitivity (802.11b) 1Mbps DSSS - -97 - dBm

2Mbps DSSS - -95 - dBm

5.5Mbps CCK - -93 - dBm

11Mbps CCK - -90 - dBm

RX Sensitivity (802.11g) 6Mbps OFDM - -92 - dBm

9Mbps OFDM - -92 - dBm

12Mbps OFDM - -91 - dBm

18Mbps OFDM - -88 - dBm
24Mbps OFDM - -86 - dBm
36Mbps OFDM - -82 - dBm

48Mbps OFDM - -78 - dBm

54Mbps OFDM - -76 - dBm

RX Sensitivity (802.11n, MCS0 - -91 - dBm

20MHz) MCS1 - -87 - dBm

MCS2 - -85 - dBm

MCS3 - -83 - dBm

MCS4 - -79 - dBm

MCS5 - -75 - dBm

MCS6 - -74 - dBm

MCS7 - -72 - dBm

RX Sensitivity (802.11n, MCS0 - -89 - dBm

40MHz) MCS1 - -87.5 - dBm

MCS2 - -84.5 - dBm

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 Transceiver/Receiver Performance

MCS3 - -81.5 - dBm

MCS4 - -78 - dBm

MCS5 - -74 - dBm

MCS6 - -72 - dBm

MCS7 - -71 - dBm

Maximum Input Level 11b@11Mbps CCK - -10 - dBm

11g@54Mbps OFDM - -20 - dBm

11n@ HT20, MCS 7 - -20 - dBm

11n@ HT40, MCS 7 - -20 - dBm

TX Power 1Mbps DSSS - 20 - dBm

11Mbps CCK - 20 - dBm

6Mbps OFDM - 20 - dBm

54Mbps OFDM - 19 - dBm

HT20, MCS 0 - 17.5 - dBm

HT20, MCS 7 - 17.5 - dBm

HT40, MCS 0 - 16 - dBm

HT40, MCS 7 - 17 - dBm

6.2 Bluetooth Performance

Conditions：VBAT=3.6V; VDDIO=3.3V; Temp:25 oC

Table 6- 2 Bluetooth Transceiver/Receiver Performance

Performance
Parameter Description Unit
Min Typ Max

Frequency range Center channel frequency 2402 - 2480 MHz

RX Sensitivity (BR) 1Mbps GFSK - -91 - dBm

RX Sensitivity (EDR) 2Mbps π/4-DQPSK - -93 - dBm

3Mbps 8DPSK - -85 - dBm

RX Sensitivity (BLE) 1Mbps GFSK - -93 - dBm

Maximum Input Level 1Mbps GFSK - -20 - dBm

2Mbps π/4-DQPSK - -20 - dBm

3Mbps 8DPSK - -10 - dBm

TX Out Power Class1, Class2, Class3 -17 7 - dBm

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 Transceiver/Receiver Performance

@BR, EDR

BLE - 7 - dBm

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 Package Outline & PCB Layout Design

7 Package Outline & PCB Layout Design

Figure 7- 1 Package Dimensions

Table 7- 1 Package Dimensions

Symbol Min Typ Max Unit

A 0.70 0.75 0.80 mm
A1 0 0.02 0.05 mm
A3 0.20REF mm
b 0.15 0.20 0.25 mm
D 4.90 5.00 5.10 mm
E 4.90 5.00 5.10 mm
D2 3.15 3.30 3.45 mm
E2 3.15 3.30 3.45 mm
e 0.30 0.40 0.50 mm
K 0.20 - - mm

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 23
 Package Outline & PCB Layout Design

L 0.30 0.40 0.50 mm

R 0.09 - - mm
La 0.12 0.15 0.18 mm
Lb 0.23 0.26 0.29 mm
Lc 0.30 0.39 0.50 mm

5.000mm

0.400mm

0.700mm

0.400mm

5.000mm 3.450mm 5.750mm

0.200mm R0.100mm

3.450mm

0.750mm

5.750mm

Figure 7- 2 Example for PCB Layout Design

Figure 7- 3 Photograph of Package Top

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 24
 Carrier Information

8 Carrier Information
XR829 use two kinds of carriers for customer delivery and production, which are tray carrier and tape reel carrier.
Each tray has 490ps of chips, while each tape reel provides 4900ps samples.

8.1 Tray Carrier

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 Carrier Information

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 Carrier Information

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 Carrier Information

8.2 Tape Reel Carrier

XR829 Datasheet (Revision 1.0) Copyright @2017 Xradio Technology Co., Ltd. All Rights Reserved Page 28