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DRV5056
SBAS644 – APRIL 2018

DRV5056 Unipolar Ratiometric Linear Hall Effect Sensor

1 Features 3 Description
•
1 Unipolar Linear Hall Effect Magnetic Sensor The DRV5056 is a linear Hall effect sensor that
responds proportionally to flux density of a magnetic
• Operates From 3.3-V and 5-V Power Supplies south pole. The device can be used for accurate
• Analog Output With 0.6-V Quiescent Offset: position sensing in a wide range of applications.
– Maximizes Voltage Swing for High Accuracy Featuring a unipolar magnetic response, the analog
• Magnetic Sensitivity Options (At VCC = 5 V): output drives 0.6 V when no magnetic field is present,
– A1: 200 mV/mT, 20-mT Range and increases when a south magnetic pole is applied.
This response maximizes the output dynamic range
– A2: 100 mV/mT, 39-mT Range
in applications that sense one magnetic pole. Four
– A3: 50 mV/mT, 79-mT Range sensitivity options further maximize the output swing
– A4: 25 mV/mT, 158-mT Range based on the required sensing range.
• Fast 20-kHz Sensing Bandwidth The device operates from 3.3-V or 5-V power
• Low-Noise Output With ±1-mA Drive supplies. Magnetic flux perpendicular to the top of the
package is sensed, and the two package options
• Compensation For Magnet Temperature Drift
provide different sensing directions.
• Standard Industry Packages:
The device uses a ratiometric architecture that can
– Surface-Mount SOT-23 minimize error from VCC tolerance when the external
– Through-Hole TO-92 analog-to-digital converter (ADC) uses the same VCC
for its reference. Additionally, the device features
2 Applications magnet temperature compensation to counteract how
magnets drift for linear performance across a wide
• Precise Position Sensing
–40°C to +125°C temperature range.
• Industrial Automation and Robotics
• Home Appliances Device Information(1)
• Gamepads, Pedals, Keyboards, Triggers PART NUMBER PACKAGE BODY SIZE (NOM)

• Height Leveling, Tilt and Weight Measurement SOT-23 (3) 2.92 mm × 1.30 mm
DRV5056
TO-92 (3) 4.00 mm × 3.15 mm
• Fluid Flow Rate Measurement
• Medical Devices (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Current Sensing

Typical Schematic Magnetic Response

VCC OUT
VCC
VL (MAX)
DRV5056 Controller
VCC
OUT ADC
GND

0.6 V
B
0 mT south

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 13
2 Applications ........................................................... 1 8 Application and Implementation ........................ 14
3 Description ............................................................. 1 8.1 Application Information............................................ 14
4 Revision History..................................................... 2 8.2 Typical Application .................................................. 15
8.3 Do's and Don'ts ....................................................... 17
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3 9 Power Supply Recommendations...................... 19
6.1 Absolute Maximum Ratings ...................................... 3 10 Layout................................................................... 19
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 19
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Examples................................................... 19
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 20
6.5 Electrical Characteristics........................................... 4 11.1 Documentation Support ....................................... 20
6.6 Magnetic Characteristics........................................... 5 11.2 Receiving Notification of Documentation Updates 20
6.7 Typical Characteristics .............................................. 6 11.3 Community Resources.......................................... 20
7 Detailed Description .............................................. 9 11.4 Trademarks ........................................................... 20
7.1 Overview ................................................................... 9 11.5 Electrostatic Discharge Caution ............................ 20
7.2 Functional Block Diagram ......................................... 9 11.6 Glossary ................................................................ 20
7.3 Feature Description................................................... 9 12 Mechanical, Packaging, and Orderable
Information ........................................................... 20

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE REVISION NOTES

April 2018 * Initial release.

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5 Pin Configuration and Functions

DBZ Package LPG Package

3-Pin SOT-23 3-Pin TO-92
Top View Top View

VCC 1

3 GND

OUT 2

1 2 3

VCC GND OUT

Pin Functions
PIN
I/O DESCRIPTION
NAME SOT-23 TO-92
GND 3 2 — Ground reference
OUT 2 3 O Analog output
Power supply. TI recommends connecting this pin to a ceramic capacitor to ground
VCC 1 1 —
with a value of at least 0.01 µF.

6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Power supply voltage VCC –0.3 7 V
Output voltage OUT –0.3 VCC + 0.3 V
Magnetic flux density, BMAX Unlimited T
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

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6.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-
±2500
001 (1)
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification
±750
JESD22-C101 (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
3 3.63
VCC Power supply voltage (1) V
4.5 5.5
IO Output continuous current –1 1 mA
TA Operating ambient temperature (2) –40 125 °C

(1) There are two isolated operating VCC ranges. For more information see the Operating VCC Ranges section.
(2) Power dissipation and thermal limits must be observed.

6.4 Thermal Information

DRV5056
(1)
THERMAL METRIC SOT-23 (DBZ) TO-92 (LPG) UNIT
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 170 121 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66 67 °C/W
RθJB Junction-to-board thermal resistance 49 97 °C/W
YJT Junction-to-top characterization parameter 1.7 7.6 °C/W
YJB Junction-to-board characterization parameter 48 97 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

6.5 Electrical Characteristics

for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS (1) MIN TYP MAX UNIT
ICC Operating supply current 6 10 mA
tON Power-on time (see Figure 17) B = 0 mT, no load on OUT 150 300 µs
fBW Sensing bandwidth 20 kHz
td Propagation delay time From change in B to change in OUT 10 µs
VCC = 5 V 130
BND Input-referred RMS noise density nT/√Hz
VCC = 3.3 V 215
VCC = 5 V 0.12
BN Input-referred noise BND × 6.6 × √20 kHz mTPP
VCC = 3.3 V 0.2
DRV5056A1 24
DRV5056A2 12
VN Output-referred noise (2) BN × S mVPP
DRV5056A3 6
DRV5056A4 3

(1) B is the applied magnetic flux density.

(2) VN describes voltage noise on the device output. If the full device bandwidth is not needed, noise can be reduced with an RC filter.

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6.6 Magnetic Characteristics

for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS (1) MIN TYP MAX UNIT
DRV5056A1 0.535 0.6 0.665
DRV5056A2 0.54 0.6 0.66
VQ Quiescent voltage B = 0 mT, TA = 25°C V
DRV5056A3,
0.55 0.6 0.65
DRV5056A4
B = 0 mT, VCC = 5 V 0.08
VQΔT Quiescent voltage temperature drift TA = –40°C to 125°C V
versus 25°C VCC = 3.3 V 0.04

High-temperature operating stress for

VQΔL Quiescent voltage lifetime drift <0.5%
1000 hours
DRV5056A1 190 200 210
VCC = 5 V, DRV5056A2 95 100 105
TA = 25°C DRV5056A3 47.5 50 52.5
DRV5056A4 23.8 25 26.2
S Sensitivity mV/mT
DRV5056A1 114 120 126
VCC = 3.3 V, DRV5056A2 57 60 63
TA = 25°C DRV5056A3 28.5 30 31.5
DRV5056A4 14.3 15 15.8
DRV5056A1 20
VCC = 5 V, DRV5056A2 39
TA = 25°C DRV5056A3 79
DRV5056A4 158
BL Full-scale magnetic sensing range (2) mT
DRV5056A1 19
VCC = 3.3 V, DRV5056A2 39
TA = 25°C DRV5056A3 78
DRV5056A4 155
VL Linear range of output voltage (3) VQ VCC – 0.2 V
Sensitivity temperature compensation
STC 0.12 %/°C
for magnets (4)
(3)
SLE Sensitivity linearity error VOUT is within VL ±1%
TA = 25°C,
SRE Sensitivity ratiometry error (5) -2.5% 2.5%
with respect to VCC = 3.3 V or 5 V
High-temperature operating stress for
SΔL Sensitivity lifetime drift <0.5% %
1000 hours

(1) B is the applied magnetic flux density.

(2) BL describes the minimum linear sensing range at 25°C taking into account the maximum VQ and Sensitivity tolerances.
(3) See the Sensitivity Linearity section.
(4) STC describes the rate the device increases sensitivity with temperature. For more information, see the Sensitivity Temperature
Compensation For Magnets section and Figure 6 to Figure 13.
(5) See the Ratiometric Architecture section.

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6.7 Typical Characteristics

at TA = 25°C (unless otherwise noted)

655 640
638
650
636
645
Quiescent Voltage (mV)

Quiescent Voltage (mV)

634
640 632
630
635
628
630
626
625 624
622
620
620
615 VCC = 3.3 V
VCC = 5 V 618
610 616
-40 -20 0 20 40 60 80 100 120 140 160 180 200 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5
Temperature (qC) D002
Supply Voltage (V) D003

Figure 1. Quiescent Voltage vs Temperature Figure 2. Quiescent Voltage vs Supply Voltage

140 250
130
120
200
110
A1 A3
Sensitivity (mV/MT)

100
Y Axis Title (Unit)

A2 A4 A1 A3
90 150 A2 A4
80
70
60 100
50
40
50
30
20
10 0
3 3.1 3.2 3.3 3.4 3.5 3.6 4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5
Supply Voltage (V) D006 D007
VCC = 3.3 V VCC = 5 V

Figure 3. Sensitivity vs Supply Voltage Figure 4. Sensitivity vs Supply Voltage

7 150

6.75 145
140
6.5
Supply Current (mA)

Sensitivity (mV/mT)

135
6.25 130
6 125

5.75 120
115
5.5
110 +3STD
5.25 VCC = 3.3 V 105 AVG
VCC = 5 V -3STD
5 100
-40 -20 0 20 40 60 80 100 120 140 160 180 200 -40 -20 0 20 40 60 80 100 120 140 160 180 200
Temperature (qC) D001
Temperature (qC) D008
DRV5056A1, VCC = 3.3 V

Figure 5. Supply Current vs Temperature Figure 6. Sensitivity vs Temperature

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Typical Characteristics (continued)

at TA = 25°C (unless otherwise noted)
260 80

75
240
Sensitivity (mV/mT)

Sensitivity (mV/mT)
70
220
65
200
60

180 +3STD +3STD

55
AVG AVG
3STD 3STD
160 50
-40 -20 0 20 40 60 80 100 120 140 160 180 200 -40 -20 0 20 40 60 80 100 120 140 160 180 200
Temperature (qC) D009
Temperature (qC) D010
DRV5056A1, VCC = 5.0 V DRV5056A2, VCC = 3.3 V

Figure 7. Sensitivity vs Temperature Figure 8. Sensitivity vs Temperature

120 39

115 37

110
35
Sensitivity (mV/mT)

Sensitivity (mV/mT)

105
33
100
31
95
29
90
+3STD +3STD
85 AVG 27 AVG
3STD 3STD
80 25
-40 -20 0 20 40 60 80 100 120 140 160 180 200 -40 -20 0 20 40 60 80 100 120 140 160 180 200
Temperature (qC) D011
Temperature (qC) D012
DRV5056A2, VCC = 5.0 V DRV5056A3, VCC = 3.3 V

Figure 9. Sensitivity vs Temperature Figure 10. Sensitivity vs Temperature

60 19

18

55
17
Sensitivity (mV/mT)

Sensitivity (mV/mT)

16
50
15

14
45
+3STD +3STD
AVG 13 AVG
3STD 3STD
40 12
-40 -20 0 20 40 60 80 100 120 140 160 180 200 -40 -20 0 20 40 60 80 100 120 140 160 180 200
Temperature (qC) D013
Temperature (qC) D014
DRV5056A3, VCC = 5.0 V DRV5056A4, VCC = 3.3 V

Figure 11. Sensitivity vs Temperature Figure 12. Sensitivity vs Temperature

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Typical Characteristics (continued)

at TA = 25°C (unless otherwise noted)
30

28

Sensitivity (mV/mT)
26

24

22 +3STD
AVG
3STD
20
-40 -20 0 20 40 60 80 100 120 140 160 180 200
Temperature (qC) D015
DRV5056A4, VCC = 5.0 V

Figure 13. Sensitivity vs Temperature

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7 Detailed Description

7.1 Overview
The DRV5056 is a 3-pin linear Hall effect sensor with fully integrated signal conditioning, temperature
compensation circuits, mechanical stress cancellation, and amplifiers. The device operates from 3.3-V and 5-V
(±10%) power supplies, measures magnetic flux density, and outputs a proportional analog voltage that is
referenced to VCC.

7.2 Functional Block Diagram

Element Bias Band-Gap VCC

Reference
Offset 0.01 F
Cancellation Trim (Minimum)
GND
Registers
Temperature
Compensation
VCC
Optional Filter
Precision Output OUT
Amplifier Driver

7.3 Feature Description

7.3.1 Magnetic Flux Direction
As shown in Figure 14, the DRV5056 is sensitive to the magnetic field component that is perpendicular to the top
of the package.

TO-92

SOT-23

PCB

Figure 14. Direction of Sensitivity

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Feature Description (continued)

Magnetic flux that travels from the bottom to the top of the package is considered positive. This condition exists
when a south magnetic pole is near the top (marked-side) of the package. Magnetic flux that travels from the top
to the bottom of the package results in negative millitesla values.

S
S N

PCB PCB

Figure 15. The Flux Direction for Positive B

7.3.2 Magnetic Response

The DRV5056 outputs an analog voltage according to Equation 1 when in the presence of a magnetic field:
(
VOUT = VQ + B × Sensitivity (25°C) × (1 + STC × (TA ± 25° C)) )
where
• VQ is typically 600 mV
• B is the applied magnetic flux density
• Sensitivity(25°C) depends on the device option and VCC
• STC is typically 0.12%/°C
• TA is the ambient temperature
• VOUT is within the VL range (1)
As an example, consider the DRV5056A3 with VCC = 3.3 V, a temperature of 50°C, and 67 mT applied.
Excluding tolerances, VOUT = 600 mV + 67 mT × (30 mV/mT × [1 + 0.0012/°C × (50°C – 25°C)]) = 2670 mV.
The DRV5056 only responds to the flux density of a magnetic south pole.

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Feature Description (continued)

7.3.3 Sensitivity Linearity
The device produces a linear response when the output voltage is within the specified VL range. Outside this
range, sensitivity is reduced and nonlinear. Figure 16 graphs the magnetic response.
OUT
VCC
VL (MAX)

0.6 V
B
0 mT south
Figure 16. Magnetic Response

Equation 2 calculates parameter BL, the minimum linear sensing range at 25°C taking into account the maximum
quiescent voltage and sensitivity tolerances.
VL(MAX) ± VQ(MAX)
BL(MIN) =
S(MAX) (2)
The parameter SLE defines linearity error as the difference in sensitivity between any two positive B values when
the output is within the VL range.

7.3.4 Ratiometric Architecture

The DRV5056 has a ratiometric analog architecture that scales the sensitivity linearly with the power-supply
voltage. For example, the sensitivity is 5% higher when VCC = 5.25 V compared to VCC = 5 V. This behavior
enables external ADCs to digitize a more consistent value regardless of the power-supply voltage tolerance,
when the ADC uses VCC as its reference.
Equation 3 calculates sensitivity ratiometry error:
S(VCC) / S(5V) S(VCC) / S(3.3V)
SRE = 1 ± for V CC = 4.5 V to 5.5 V, SRE = 1 ± for V CC = 3 V to 3.63 V
VCC / 5V VCC / 3.3V
where
• S(VCC) is the sensitivity at the current VCC voltage
• S(5V) or S(3.3V) is the sensitivity when VCC = 5 V or 3.3 V
• VCC is the current VCC voltage (3)

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Feature Description (continued)

7.3.5 Operating VCC Ranges
The DRV5056 has two recommended operating VCC ranges: 3 V to 3.63 V and 4.5 V to 5.5 V. When VCC is in
the middle region between 3.63 V to 4.5 V, the device continues to function, but sensitivity is less known
because there is a crossover threshold near 4 V that adjusts device characteristics.

7.3.6 Sensitivity Temperature Compensation For Magnets

Magnets generally produce weaker fields as temperature increases. The DRV5056 compensates by increasing
sensitivity with temperature, as defined by the parameter STC. The sensitivity at TA = 125°C is typically 12%
higher than at TA = 25°C.

7.3.7 Power-On Time

After the VCC voltage is applied, the DRV5056 requires a short initialization time before the output is set. The
parameter tON describes the time from when VCC crosses 3 V until OUT is within 5% of VQ, with 0 mT applied
and no load attached to OUT. Figure 17 shows this timing diagram.
VCC

3V
tON

time

Output

95% × V Q

Invalid

time
Figure 17. tON Definition

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Feature Description (continued)

7.3.8 Hall Element Location
Figure 18 shows the location of the sensing element inside each package option.
SOT-23
Top View

SOT-23
Side View

centered 650 µm
±50 µm ±80 µm

TO-92
Top View
2 mm 2 mm
TO-92
1.54 mm Side View

±50 µm 1030 µm
1.61 mm ±115 µm

Figure 18. Hall Element Location

7.4 Device Functional Modes

The DRV5056 has one mode of operation that applies when the Recommended Operating Conditions are met.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Selecting the Sensitivity Option
Select the highest DRV5056 sensitivity option that can measure the required range of magnetic flux density, so
that the output voltage swing is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to a
magnet.

8.1.2 Temperature Compensation for Magnets

The DRV5056 temperature compensation is designed to directly compensate the average drift of neodymium
(NdFeB) magnets and partially compensate ferrite magnets. The residual induction (Br) of a magnet typically
reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite. When the operating temperature of a system is
reduced, temperature drift errors are also reduced.

8.1.3 Adding a Low-Pass Filter

As illustrated in the Functional Block Diagram, an RC low-pass filter can be added to the device output for the
purpose of minimizing voltage noise when the full 20-kHz bandwidth is not needed. This filter can improve the
signal-to-noise ratio (SNR) and overall accuracy. Do not connect a capacitor directly to the device output without
a resistor in between because doing so can make the output unstable.

8.1.4 Designing for Wire Break Detection

Some systems must detect if interconnect wires become open or shorted. The DRV5056 can support this
function.
First, select a sensitivity option that causes the output voltage to stay within the VL range during normal
operation. Second, add a pullup resistor between OUT and VCC. TI recommends a value between 20 kΩ to
100 kΩ, and the current through OUT must not exceed the IO specification, including current going into an
external ADC. Then, if the output voltage is ever measured to be within 150 mV of VCC or GND, a fault condition
exists. Figure 19 shows the circuit, and Table 1 describes fault scenarios.

PCB

DRV5056
VCC
VCC
OUT Cable VOUT
GND

Figure 19. Wire Fault Detection Circuit

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Table 1. Fault Scenarios and the Resulting VOUT

FAULT SCENARIO VOUT
VCC disconnects Close to GND
GND disconnects Close to VCC
VCC shorts to OUT Close to VCC
GND shorts to OUT Close to GND

8.2 Typical Application

Mechanical Component

PCB

Figure 20. Unipolar Sensing Application

8.2.1 Design Requirements

Use the parameters listed in Table 2 for this design example.

Table 2. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
VCC 3.3 V
Magnet 10-mm × 6-mm cylinder, ferrite
Distance from magnet to sensor From 20 mm to 3 mm
Maximum B at the sensor at 25°C 72 mT
Device option DRV5056A3

8.2.2 Detailed Design Procedure

This design example consists of a mechanical component that moves back and forth, an embedded magnet with
the south pole facing the printed-circuit board, and a DRV5056. The DRV5056 outputs an analog voltage that
describes the precise position of the component. The component must not contain ferromagnetic materials such
as iron, nickel, and cobalt because these materials change the magnetic flux lines.

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When designing a linear magnetic sensing system, always consider these three variables: the magnet, sensing
distance, and range of the sensor. Select the DRV5056 with the highest sensitivity that has a BL (linear magnetic
sensing range) that is larger than the maximum magnetic flux density in the application.
Magnets are made from various ferromagnetic materials that have tradeoffs in cost, drift with temperature,
absolute maximum temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) produced in 3-dimensional space. For simple
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet. Figure 21 shows diagrams for Equation 4 and Equation 5.

Thickness Thickness
Width

Distance Distance
S N
Length S N B B
Diameter

Figure 21. Rectangular Block and Cylinder Magnets

Use Equation 4 for the rectangular block shown in Figure 21:

B=
Br
Π( ( arctan
WL
2
2D 4D + W + L 2 2 ) ± arctan ( WL
2(D + T) 4(D + T)2 + W2 + L2
)) (4)

Use Equation 5 for the cylinder shown in Figure 21:

B=
Br
2 ( D+T
2
(0.5C) + (D + T) 2
±
D
(0.5C)2 + D2
)
where
• W is width
• L is length
• T is thickness (the direction of magnetization)
• D is distance
• C is diameter (5)
An online tool that uses these formulas is located at the DRV5013 product folder.
When different magnet orientations are used, TI recommends using simulation software and testing to determine
the magnetic flux density throughout a distance.

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8.2.3 Application Curve

Figure 22 shows the magnetic flux density versus distance for a 10-mm × 6-mm cylinder ferrite magnet.
80

70

Magnetic Flux Density (mT)

60

50

40

30

20

10

0
3 6 9 12 15 18 21
Distance (mm) D001

Figure 22. Magnetic Profile of a 10-mm × 6-mm Cylinder Ferrite Magnet

8.3 Do's and Don'ts

Because the Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, a
correct magnet approach must be used for the sensor to detect the field. Figure 23 illustrates correct and
incorrect approaches.

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Do's and Don'ts (continued)

CORRECT

N S

S N

N S

INCORRECT

N S

Figure 23. Correct and Incorrect Magnet Approaches

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9 Power Supply Recommendations

A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI
recommends using a ceramic capacitor with a value of at least 0.01 µF.

10 Layout

10.1 Layout Guidelines

Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet on the
opposite side possible.

10.2 Layout Examples

VCC

GND
VCC GND OUT

OUT

Figure 24. Layout Examples

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: DRV5056
DRV5056
SBAS644 – APRIL 2018 www.ti.com

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation
For related documentation see the following:
• Incremental Rotary Encoder Design Considerations Tech Note
• Using Linear Hall Effect Sensors to Measure Angle Tech Note

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

20 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DRV5056

 PACKAGE OPTION ADDENDUM

www.ti.com 29-Aug-2018

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

DRV5056A1QDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A1
& no Sb/Br)
DRV5056A1QDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A1
& no Sb/Br)
DRV5056A1QLPG ACTIVE TO-92 LPG 3 1000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A1
& no Sb/Br)
DRV5056A1QLPGM ACTIVE TO-92 LPG 3 3000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A1
& no Sb/Br)
DRV5056A2QDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A2
& no Sb/Br)
DRV5056A2QDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A2
& no Sb/Br)
DRV5056A2QLPG ACTIVE TO-92 LPG 3 1000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A2
& no Sb/Br)
DRV5056A2QLPGM ACTIVE TO-92 LPG 3 3000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A2
& no Sb/Br)
DRV5056A3QDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A3
& no Sb/Br)
DRV5056A3QDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A3
& no Sb/Br)
DRV5056A3QLPG ACTIVE TO-92 LPG 3 1000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A3
& no Sb/Br)
DRV5056A3QLPGM ACTIVE TO-92 LPG 3 3000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A3
& no Sb/Br)
DRV5056A4QDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A4
& no Sb/Br)
DRV5056A4QDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 56A4
& no Sb/Br)
DRV5056A4QLPG ACTIVE TO-92 LPG 3 1000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A4
& no Sb/Br)
DRV5056A4QLPGM ACTIVE TO-92 LPG 3 3000 Green (RoHS CU SN N / A for Pkg Type -40 to 125 56A4
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 29-Aug-2018

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF DRV5056 :

• Automotive: DRV5056-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 31-May-2018

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV5056A1QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5056A1QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5056A2QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5056A2QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5056A3QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5056A3QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5056A4QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5056A4QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 31-May-2018

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV5056A1QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5056A1QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5056A2QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5056A2QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5056A3QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5056A3QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5056A4QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5056A4QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0

Pack Materials-Page 2
 PACKAGE OUTLINE
LPG0003A SCALE 1.300
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE

4.1
3.9

3.25
3.05 0.55
3X
0.40 5.05
MAX
1 3

3X (0.8)

3X
15.5
15.1

0.48 0.51
3X 3X
0.35 0.36
2X 1.27 0.05
2.64
2.44

2.68
2.28
1.62
2X (45 ) 1.42

1 2 3
(0.5425) 0.86
0.66
4221343/C 01/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

www.ti.com
 EXAMPLE BOARD LAYOUT
LPG0003A TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE

FULL R
0.05 MAX (1.07) TYP
METAL
ALL AROUND TYP 3X ( 0.75) VIA
TYP

2X
METAL

(1.7) 2X (1.7)

2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
OPENING (2.54)

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE:20X

4221343/C 01/2018

www.ti.com
 TAPE SPECIFICATIONS
LPG0003A TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE

0 1
13.0 0 1
12.4

1 MAX
21
18

2.5 MIN
6.5
5.5
9.5
8.5 0.25
0.15

19.0
17.5

3.8-4.2 TYP 0.45

6.55 12.9 0.35
6.15 12.5

4221343/C 01/2018

www.ti.com
4203227/C
 PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA

0.95
3.04
1.9 2.80
3

2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01

0.25
GAGE PLANE 0.20
TYP
0.08

0.6
TYP SEATING PLANE
0 -8 TYP 0.2

4214838/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.

www.ti.com
 EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG
3X (1.3)
1

3X (0.6)

SYMM

3
2X (0.95)

(R0.05) TYP
(2.1)

LAND PATTERN EXAMPLE

SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214838/C 04/2017

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR

PKG

3X (1.3)
1

3X (0.6)

SYMM
3
2X(0.95)

(R0.05) TYP
(2.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL
SCALE:15X

4214838/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.

www.ti.com
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