HP EliteBook 840 G8 Notebook PC

QuickSpecs HP EliteBook 840 G8 Notebook PC
Overview
HP EliteBook 840 G8 Notebook PC
Left
1. Ambient Light Sensor (Optional) 7. Glass Clickpad

2. Internal Microphones (2) 8. Smartcard Reader (Optional)
3. Webcam LED (Optional) 9. Audio Combo Jack
4. Camera Shutter 10. SuperSpeed USB Type-A 5Gbps signaling rate (USB 3.2 Gen 1)
5. HD and IR Camera (Optional) 11. SuperSpeed USB Type-A 5Gbps signaling rate (Charging) (USB 3.2
Gen 1)
6. IR Camera LEDs (Optional) 12. Nano Security Lock Slot (Lock sold separately)
c06969201 — DA16799 — Worldwide — Version 24 — April 20, 2022 Page 1

Overview
Right
1. Power Button 5. Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate

Key (USB Power Delivery, DisplayPort™ 1.4)1
2. Power Connector 6. SIM Card Slot (Optional)
3. HDMI 2.0bPort (Cable not included) 7. Touch Fingerprint Sensor (Select models)
4. Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling
rate (USB Power Delivery, DisplayPort™ 1.4)1
1. SuperSpeed USB 20Gbps is not available with Thunderbolt™ 4.

Overview
AT A GLANCE
• Windows 11 Pro, other Windows OS or FreeDOS preinstalled

• Premium ultraslim design with precision-crafted machined aluminum (CNC) chassis for a premium look and feel
• 11th Generation Intel® Core™ i5, i7 Processors up to four-core
• Designed to support all HP docking options including the HP Universal Dock G5
• Featuring the redesigned quiet HP Keyboard with the HP Programmable key and backlit options
• Innovative world-facing third mic improves inbound ambient noise cancellation while 360 degree mic pick-up allows
everyone to clearly hear and be heard
• Optional ultrabright displays with ambient light sensor
• Choice of displays:
35.6 cm (14”) diagonal FHD IPS Anti-Glare LED-backlit, 250 nits, 45% NTSC
35.6 cm (14") diagonal FHD IPS Anti-Glare LED-backlit non-touch 400 nits, 72% NTSC
35.6cm (14") diagonal FHD IPS Anti-Glare LED-backlit non-touch, 1000 nits, 100% sRGB with HP Sure View
35.6cm (14") diagonal FHD IPS Anti-Glare On-Cell LED-backlit touch, 250 nits, 45% NTSC
• Enterprise grade security with HP Sure Sense, HP Sure Start Gen6, HP Privacy Camera, HP Sure View Reflect , HP Sure Run
Gen4, HP Sure Recover Gen4 with Embedded Reimaging , HP Sure Click, SmartCard Reader and Touch Fingerprint reader
• Connectivity with optional CAT20 5G/WWAN, and Thunderbolt™ Docking (Dock sold separately)
• Supports fast charging (50% in 30 minutes) with no impact on battery recharge cycles
• Choice of solid state drives up to 2 TB and DDR4 memory up to 64 GB
• Undergoes MIL-STD 810H tests1
• Intel® Iris® Xᵉ Graphics
1. MIL-STD 810H is not intended to demonstrate fitness of U.S. Department of Defense contract requirements or for military use.
Test results are not a guarantee of future performance under these test conditions. Accidental damage requires an optional HP
Accidental Damage Protection Care Pack.
NOTE: See important legal disclosures for all listed specs in their respective features sections.

Technical Specifications
PRODUCT NAME
HP EliteBook 840 G8 Notebook PC
OPERATING SYSTEM
Preinstalled Windows 11 Pro 2
Windows 11 Pro Education 2
Windows 11 Home – HP recommends Windows 11 Pro for business 2
Windows 11 Home Single Language – HP recommends Windows 11 Pro for business 2
Windows 11 Pro (Windows 11 Enterprise available with a Volume Licensing Agreement) 2
Windows 10 Pro 1,2
Windows 10 Pro Education 1,2
Windows 10 Home – HP recommends Windows 11 Pro for business 1,2
Windows 10 Home Single Language – HP recommends Windows 11 Pro for business 1,2
Windows 10 Pro (Windows 10 Enterprise available with a Volume Licensing Agreement) 1,2
FreeDOS
1. Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing
may vary by device. Features and app availability may vary by region. Certain features require specific hardware (see
Windows 11 Specifications).
2. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is
automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional
requirements may apply over time for updates. See http://www.windows.com.
PROCESSORS
Intel® Core™ i7-1165G7 processor (2.8 GHz base frequency, up to 4.7 GHz frequency with Intel® Turbo Boost Technology,
12 MB L3 cache, 4 cores) 3,4,5,6
Intel® Core™ i7-1185G7 (3.0 GHz base frequency, up to 4.8 GHz with Intel® Turbo Boost Technology, 12 MB L3 cache,
4 cores), supports Intel® vPro® Technology 3,4,5,6
Intel® Core™ i5-1135G7 processor (2.4 GHz base frequency, up to 4.2 GHz frequency with Intel® Turbo Boost Technology,
8 MB L3 cache, 4 cores) 3,4,5,6
Intel® Core™ i5-1145G7 (2.6 GHz base frequency, up to 4.4 GHz with Intel® Turbo Boost Technology, 8 MB L3 cache,
4 cores), supports Intel® vPro® Technology 3,4,5,6
Processor Family
11th Generation Intel® Core™ i7 processor (i7-1165G7)6
3.Multicore is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application

workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement
of higher performance.
4.Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
5. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
6. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7
drivers on http://www.support.hp.com.
CHIPSET
Chipset is integrated with processor.
GRAPHICS
Integrated
Intel® Iris® Xᵉ Graphics7
Supports
Support HD decode, DX12, HDMI 2.0b, HDCP 2.38
7. Intel® Iris® Xe Graphics capabilities require system to be configured with Intel® Core™ i5 or i7 processors and dual channel
memory. Intel® Iris® Xe Graphics with Intel® Core™ i5 or 7 processors and single channel memory will only function as UHD
graphics.
8. HDMI cable sold separately.
DISPLAY
Non-Touch
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC (1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for HD Camera (1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for HD + IR Camera (1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for WWAN 4G (1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for HD Camera for WWAN 4G (1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for HD + IR Camera for WWAN 4G
(1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for HD + IR Camera for WWAN 5G
(1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP+PSR, 400 nits, 100% sRGB, Low Power Ambient Light Sensor for HD + IR
Camera (1920 x 1080) 9,10
Camera for WWAN 4G (1920 x 1080) 9,10
Camera for WWAN 5G (1920 x 1080) 9,10
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP+PSR, 1000 nits, 100% sRGB with HP Sure View Reflect integrated
privacy screen, Ambient Light Sensor for HD Camera (1920 x 1080) 9,10,11,12

privacy screen, Ambient Light Sensor for HD + IR Camera (1920 x 1080) 9,10,11,12
privacy screen, Ambient Light Sensor for HD Camera for WWAN 4G (1920 x 1080) 9,10,11,12
privacy screen, Ambient Light Sensor for HD + IR Camera for WWAN 4G (1920 x 1080) 9,10,11,12
privacy screen, Ambient Light Sensor for HD + IR Camera for WWAN 5G (1920 x 1080) 9,10,11,12
Touch
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for HD + IR Camera Touch on Panel
(1920 x 1080) 9,10,11,12
35.56 cm (14") diagonal FHD bent, anti-glare UMA eDP, 250 nits, 45% NTSC for HD + IR Camera for WWAN 4G Touch on Panel
(1920 x 1080) 9,10,11,12
HDMI 2.013
Support resolution up to 4K @60 Hz
9. FHD/HD content required to view FHD/HD images.

10. Resolutions are dependent upon monitor capability, and resolution and color depth settings.
11. HP Sure View integrated privacy screen is an optional feature that must be configured at purchase and is designed to
function in landscape orientation.
12. Actual brightness will be lower with touchscreen or Sure View.
Docking Total Max Dock Technical limitations / additional information

station number of resolutions Connectors For more details refer to HP Dock QuickSpecs
model supported supported for http://h20195.www2.hp.com/v2/GetDocume
(Sold displays DP 1.4 hosts nt.aspx?docname=c04168358
separately) (incl. the with DSC
notebook) All information below applies to platforms
display) running DP 1.4 with DSC
HP Thunderbolt Max Dual 8K@ 60Hz in 2xDP, 1xVGA, Max displays = 4 with max resolution of 5K@
Dock G2 number of high res mode 1xTB, 1xUSB-C 30Hz running Thunderbolt host
displays alt-mode
=4 Max resolution possible is dual 8K displays @
60Hz running Thunderbolt host or running a
non-Thunderbolt host in High Resolution
mode
The highest resolution for dual displays

running a non-Thunderbolt host in Multi-
function mode is one 5K dual cable (using
both DP ports) + one 4K on USB-C DP port

HP USB-C 3 Dual 5K@ 30Hz + 1xHDMI, 2xDP Three maximum displays supported are two
Dock G5 1 4K UHD (multi- 5K@ 30 Hz on DP ports plus one 4K UHD@ 30
function mode) Hz on HDMI in Multi-function mode
Highest resolution with dual displays is two

8K@ 60Hz host in High Resolution mode
The highest resolution for running a non-

Thunderbolt host in Multi-function mode is a
single 5K dual cable (using both DP ports) +
one 4K on HDMI port
HP USB-C/A 3 Triple 4K UHD@ 1xHDMI, 2xDP In High Resolution, mode the max available is
Universal Dock 60Hz one display. This dock’s best use case is triple
G2 display.
The best resolution for dual display is two 4K

UHD@ 60Hz
Highest triple displays resolution available is

three 4KUHD @60Hz using both DP and 1
HDMI port.
Best single display is with High Resolution

mode using HDMI port.
Single 4K@ 30 Hz
HP USB-C Single external display using either HDMI or
1 1xHDMI, 1xVGA
Travel Dock G2 4960 x 2160 (via VGA
HDMI)
or
1920 x 1200@
60Hz via VGA

STORAGE AND DRIVES
Primary M.2 Storage
2 TB PCIe® Gen3x4 NVMe™ M.2 SSD TLC14
1 TB PCIe® Gen3x4 NVMe™ M.2 SSD TLC14
512 GB PCIe® Gen3x4 NVMe™ M.2 SSD TLC 14
256 GB PCIe® Gen3x4 NVMe™ M.2 SSD TLC14
128 GB PCIe® Gen3x2 NVMe™ M.2 SSD TLC14
512 GB PCIe® NVMe™ Value M.2 SSD14

256 GB PCIe® NVMe™ Value M.2 SSD14
512 GB PCIe®Gen 3x4 NVMe™ M.2 SED TLC OPAL2 14

256 GB PCIe® Gen3x4 NVMe™ M.2 SED TLC OPAL2 14
512 GB Intel® PCIe® NVMe™ QLC M.2 SSD with 32 GB Intel® Optane™ memory 14,15
14. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
15. Intel® Optane™ H10 memory system acceleration does not replace or increase the DRAM in your system. Requires 8th
Gen or higher Intel® Core™ processor, BIOS version with Intel® Optane™ supported, Windows 10 64-bit, and an Intel® Rapid
Storage Technology (Intel® RST) driver.
MEMORY
Maximum Memory
64 GB DDR4-3200 SDRAM16
Memory
64 GB DDR4-3200 SDRAM (2 x 32 GB)16
32 GB DDR4-3200 SDRAM (2 x 16 GB)16
16 GB DDR4-3200 SDRAM (2 x 8 GB) 16
16 GB DDR4-3200 SDRAM (1 x 16 GB) 16
8 GB DDR4-3200 SDRAM (1 x 8 GB) 16
8 GB DDR4-3200 SDRAM (2 x 4 GB) 16
4 GB DDR4-3200 SDRAM (1 x 4 GB) 16
Memory Slots
2 SODIMM
DDR4 SODIMMS, system runs at 3200
Supports Dual Channel Memory
16. Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to
ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.

NETWORKING/COMMUNICATIONS
WLAN
Intel® Dual Band Wi-Fi® 6 AX201 802.11a/b/g/n/ac/ax (2x2) WLAN and Bluetooth® 5 Combo, vPro® 17, 18,56
Intel® Dual Band Wi-Fi® 6 AX201 802.11a/b/g/n/ac/ax (2x2) WLAN and Bluetooth® 5 Combo, non-vPro®17,56
WWAN
Intel® XMM™ 7360 LTE-Advanced Cat 9 19
Qualcomm® Snapdragon™ X55 5G ModemCat 20 20
Near Field Communications (NFC) Module 22

HP Module with NXP NFC Controller NPC300 12C NCI
Miracast
Native Miracast Support21
17. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels.
56. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited.
Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs.
18. For full Intel® vPro™ functionality, Windows, a vPro supported processor, vPro enabled chipset, vPro enabled WLAN card
and discrete TPM 2.0 are required. See https://www.intel.com/content/www/us/en/architecture-and-technology/vpro/vpro-
platform-general.html
19. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract.
Check with service provider for coverage and availability in your area. Connection speeds will vary due to location,
environment, network conditions, and other factors. LTE not available on all products, in all regions.
20. Qualcomm® 5G module is optional and must be configured at the factory. Module designed for 5G networks as carriers
deploy Evolved-Universal Terrestrial Radio Access New Radio Dual Connectivity (ENDC) with both 100Mhz of 5G NR and LTE
channel bandwidth, using 256QAM 4x4, requires activation and separately purchased service contract. Check with service
provider for coverage and availability in your area. Connection, upload and download speeds will vary due to network,
location, environment, network conditions, and other factors. 5G LTE not available on all products, in all regions. Backwards
compatible to 4G LTE and 3G HSPA technologies. 5G LTE module is available where carrier supported.
21. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
22. Sold separately or as an optional feature.

AUDIO/MULTIMEDIA
Audio
Audio by Bang & Olufsen
2 Integrated stereo speakers
Integrated microphone (3-Mic Array)
World- Facing microphone
Speaker Power
2W/4ohm Per speaker
Camera
720p HD camera9,22
720p HD+IR camera9,22
Sensors
Ambient light sensor
Hall Sensor
HP Tamper Lock54
9. FHD/HD content required to view FHD/HD images.

22. Sold separately or as an optional feature.
54. HP Tamper Lock must be enabled by the customer or your administrator.
KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

Keyboard
HP Premium Collaboration Keyboard with Numeric Keypad, spill resistant
Optional backlit keyboard and DuraKeys23
Pointing Device
Clickpad with multi-touch gesture support, taps enabled as default
Microsoft Precision Touchpad Default Gestures Support
Function Keys
F1 - Display Switching
F2 - Blank or Privacy
F3 - Brightness Down
F4 - Brightness Up
F5 - Audio Mute
F6 - Volume Down
F7 - Volume Up
F8 - Mic Mute
F9 - Blank or Backlit Toggle
F10 - Insert
F11 - Airplane Mode
F12 - HP Command Center (Programmable Key)
Print Screen

Power Button (with LED)
Hidden Function Keys

Fn+R - Break
Fn+S - Sys Rq
Fn+C - Scroll Lock
23. Keyboards are made from up to 65% post-consumer recycled plastic.
SOFTWARE AND SECURITY

Preinstalled Software
BIOS
HP BIOSphere Gen624
HP Drive Lock & Automatic Drive Lock
BIOS Update via Network
HP Secure Erase25
Absolute Persistence Module26
HP LAN-Wireless Protection
Software
HP Connection Optimizer27
HP Hotkey Support
myHP
HP Support Assistant28
HP QuickDrop
HP Noise Cancellation Software
Touchpoint Customizer for Commercial
HP Notifications
HP Privacy Settings
HP Wireless Button Driver
HP Power Manager
Tile App29
HP PC Hardware Diagnostics Windows
Buy Microsoft Office (Sold separately)
Microsoft Defender33
HP Smart Support 55
Manageability Features
HP Driver Packs (download)30
HP Manageability Integration Kit Gen4 (download)31
HP System Software Manager (SSM) (download)
HP BIOS Config Utility (BCU) (download)
HP Client Catalog (download)
HP Client Management Script Library (download)
HP Image Assistant (download)

Client Security Software

HP Client Security Manager Gen732
Security Management
Setup password (via BIOS)
HP Fingerprint Sensor34
Support for chassis padlocks and cable lock devices
HP Wolf Pro Security Edition35
HP Sure Click36
HP Sure Sense50
HP Sure Start Gen637
HP Sure Admin51
HP Sure Recover Gen438
HP Sure Run Gen439
TPM 2.0 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified)40
Infineon SLB9670 Version: 7.85
Is the BIOS on this notebook ISO/IEC 19678:2015 (formerly NIST 800-147) compliant?: Yes
UEFI version: 2.7
Class: Class 3
24. HP BIOSphere Gen6 is available on select HP Pro and Elite PCs. Features may vary depending on the platform and
configurations.
25. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication
800-88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.
26. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription
and full activation of the software agent. License subscriptions can be purchased for terms ranging multiple years.
Service is limited, check with Absolute for availability outside the U.S. Certain conditions apply. For full details visit:
https://www.absolute.com/about/legal/agreements/absolute/
27. HP Connection Optimizer requires Windows 10.
28. HP Support Assistant requires Windows and Internet access.
29. Some features require optional subscription to Tile Premium. Tile application for Windows 10 available for
download from the Windows Store. Mobile phone app available for download from App Store and Google Play.
Requires iOS 11 and greater or Android 6.0 and greater see https://support.thetileapp.com/hc/en-us/articles/200424778
for more information. HP Tile will function as long as the PC has battery power.
30. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
31. HP Manageability Integration Kit can be downloaded from
http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
32. HP Client Security Manager Gen7 requires Windows and is available on the select HP Elite and Pro PCs.
33. Windows Defender Opt in and internet connection required for updates.
34. HP Fingerprint sensor is an optional feature that must be configured at purchase.
35. HP Wolf Pro Security Edition (including HP Sure Click Pro and HP Sure Sense Pro) is available preloaded on select SKUs
and, depending on the HP product purchased, includes a paid 1-year or 3-year license. The HP Wolf Pro Security Edition
software is licensed under the license terms of the HP Wolf Security Software - End-User license Agreement (EULA) that can
be found at: https://support.hp.com/us-en/document/ish_3875769-3873014-16 as that EULA is modified by the following:
“7. Term. Unless otherwise terminated earlier pursuant to the terms contained in this EULA, the license for the HP Wolf Pro
Security Edition (HP Sure Sense Pro and HP Sure Click Pro) is effective upon activation and will continue for either a twelve

(12) month or thirty-six (36) month license term (“Initial Term”). At the end of the Initial Term you may either (a) purchase a
renewal license for the HP Wolf Pro Security Edition from HP.com, HP Sales or an HP Channel Partner, or (b) continue using
the standard versions of HP Sure Click and HP Sure Sense at no additional cost with no future software updates or HP
Support.
36. HP Sure Click requires Windows 10 Pro or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details
37. HP Sure Start Gen6 is available on select HP PCs.
38. HP Sure Recover Gen4 is available on select HP PCs and requires an open network connection. You must back up
important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data.
39.HP Sure Run Gen4 is available on select Windows 10 based HP Pro, Elite and Workstation PCs with select Intel® or AMD
processors.
40. Firmware TPM is version 2.0.
50. HP Sure Sense is available on select HP PCs and is not available with Windows10 Home.
51. HP Sure Admin requires Windows 10, HP BIOS, HP Manageability Integration Kit from
http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the
Android or Apple store.
55. HP Smart Support is available to commercial customers through your HP Service Representative and HP Factory
Configuration Services; or it can be downloaded at: http://www.hp.com/smart-support. HP Smart Support automatically
collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and health
insights.

SMART CARD READER
Smart Card Reader Smart card standard PC/SC 2.0 for Windows smart card standard
(Optional) Smart Card support ISO 7816 Class A and AB smart cards
Smart Card Interface Smart Card Interface with T = 0 and T = 1 support Support I2C
memory card, SLE4418, SLE4428, SLE4432, SLE4442,
SLE4436, SLE5536, SLE6636, AT88SC1608, AT45D041 card
and AT45DB041 card via external EEPROM
Model number Alcor AU9560
FIPS 201 Compliant Yes
POWER
Power Supply
HP Smart 65 W External AC power adapter41
HP Smart 65 W EM External AC power adapter41
HP Smart 65 W USB Type-C adapter41
HP Smart 45 W External AC power adapter41
HP Smart 45 W External AC power adapter, 2-prong (Japan only) 41
Power Cord
2-wire plug - 1.0m
3-wire plug - 1.0m
Primary Battery
HP Long Life 3-cell, 53 Wh Polymer42,52
Supports HP Fast Charge (Up to 50% in 30 minutes)43
Battery Life
Up to 15 hours and 45 minutes44
Battery Weight
0.45 lb
0.205 kg
41. Availability may vary by country.
42. Battery is internal and not replaceable by customer. Serviceable by warranty.
43. Supports HP Fast Charge with 65W AC Adapter. Recharges the battery up to 50% within 30 minutes when the system is
off or in standby mode. Power adapter with a minimum capacity of 65 watts is required. After charging has reached 50%
capacity, charging will return to normal. Charging time may vary +/-10% due to System tolerance.
44. Windows 10 MM18 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery
will naturally decrease with time and usage. See http://www.bapco.com for additional details.
52. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life,
time, usage, environment, temperature, system configuration, loaded apps, features, power management settings and other
factors.

WEIGHTS & DIMENSIONS
Product Weight
Non-Touch
Starting at 2.98 lb (1.35 kg)45
Touch
Starting at 3.23 lb (1.46 kg)45
Product Dimensions (W x D x H)
12.73 x 8.45 x 0.7 in
32.35 x 21.47 x 1.79 cm
WLAN only
12.73 x 8.45 x 0.7 in
32.35 x 21.47 x 1.78 cm
WWAN only
12.73 x 8.45 x 0.75 in
32.35 x 21.47 x 1.92 cm
45. Weight will vary by configuration.
PORTS/SLOTS
Ports
2 Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4) 53
2 SuperSpeed USB Type-A 5Gbps signaling rate includes 1 Charging 53 (USB 3.2 Gen 1)
1 HDMI 2.0b13
1 Headphone/microphone combo
1 4.5 mm AC power
1 nano SIM card slot46
1 Smartcard reader (Optional)
1 Nano Security Lock Slot (Lock sold separately)
46. All units have a SIM card slot and icon but units that do not support WWAN are shipped with a non-removable SIM slot
plug.
53. SuperSpeed USB 20Gbps is not available with Thunderbolt™ 4.

SERVICE AND SUPPORT
1-year and 3-year limited warranties and 90 day software limited warranty options depending on country.
Batteries have a default one year limited warranty except for HP Long Life batteries which will follow the one or three year
warranty of the platform. Refer to http://www.hp.com/support/batterywarranty/
for additional battery information. On-site service and extended coverage is also available. HP Care Pack Services
are optional extended service contracts that go beyond the standard limited warranties. To choose the right level
of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc. 47
47. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or indicated
to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such
rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP
Product.

SYSTEM UNIT
Nominal Operating Voltage 19.5V
Average Operating Power
1.825W
Integrated graphics Yes
Discrete Graphics N/A
Max Operating Power UMA < 45W

Temperature
Operating 32° to 95° F (0° to 35° C)
Non-operating 41° to 95° F (5° to 35° C) (writing optical)
Relative Humidity
Operating 10% to 90%, non-condensing
Non-operating 5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature
Shock
Operating 40 G, 2 ms, half-sine
Non-operating 200 G, 2 ms, half-sine
Random Vibration
Operating 0.75 grms
Non-operating 1.50 grms
Altitude (unpressurized)
Operating -50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating -50 to 40,000 ft (-15.24 to 12,192 m)
Planned Industry Standard
Certifications
UL Yes
CSA Yes
FCC Compliance Yes
ENERGY STAR® Select models 48
EPEAT® EPEAT 2019 Gold in United States 49
ICES Yes
Australia / Yes
NZ A-Tick Compliance Yes
CCC Yes
Japan VCCI Compliance Yes
KC Yes
BSMI Yes
CE Marking Compliance Yes
BNCI or BELUS Yes
CIT Yes
GOST Yes
Saudi Arabian Compliance (ICCP)
Yes
SABS Yes
48. Configurations of the HP EliteBook 840 G8 Notebook PC that are ENERGY STAR® certified are identified as HP EliteBook
840 G8 Notebook PC ENERGY STAR on HP websites and on http://www.energystar.gov.

49. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
ENVIRONMENTAL DATA
Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may
& declarations be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT® Gold registered in the United States. See http://www.epeat.net for registration
status in your country.
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*
Sustainable Impact • Ocean-bound plastic in Speaker Box

Specifications • 35% post-consumer recycled plastic
• External Power Supply 90% Efficiency
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
• Bulk packaging available
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Notebook model is based on a “Typically Configured Notebook”.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Sort 6.36 W 6.53 W 6.61 W

idle)
Normal Operation (Long 1.25 W 1.15 W 1.11 W

idle)
Sleep 1.25 W 1.15 W 1.11 W
Off 0.29 W 0.31 W 0.29 W
Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model

family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is
for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Short 22 BTU/hr 22 BTU/hr 23 BTU/hr

idle)
Normal Operation (Long 4 BTU/hr 4 BTU/hr 4 BTU/hr

idle)
Sleep 4 BTU/hr 4 BTU/hr 4 BTU/hr
Off 1 BTU/hr 1 BTU/hr 1 BTU/hr
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
attained for one hour.
Declared Noise Emissions Sound Power Sound Pressure

(in accordance with (LWAd, bels) (LpAm, decibels)
ISO 7779 and ISO 9296)
Typically Configured – Idle 2.5 15
Fixed Disk – Random 2.9 21

writes
Optical Drive – Sequential N/A N/A

reads
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the spare parts are available throughout the warranty
period and or for up to “5” years after the end of production.
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS)
directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
http://www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product is 96.2% recycle-able when properly disposed of at end of life.
Packaging Materials External: PAPER/Corrugated 41 g

Internal: PAPER/Paperboard 220 g
PAPER/Molded Pulp 163 g
PLASTIC/Polypropylene - PP 4g
PLASTIC/Polyethylene low density - LDPE 14 g

The plastic packaging material contains at least 100% recycled content.
The corrugated paper packaging materials contains at least 35.6% recycled content.
RoHS Compliance HP Inc. complies fully with materials regulations. We were among the first companies to extend
the restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive
to our products worldwide through the HP GSE. HP has contributed to the development of related
legislation in Europe, as well as China, India, and Vietnam.
We believe the RoHS directive and similar laws play an important role in promoting industry-wide
elimination of substances of concern. We have supported the inclusion of additional substances—
including PVC, BFRs, and certain phthalates—in future RoHS legislation that pertains to electrical
and electronics products.
We met our voluntary objective to achieve worldwide compliance with the new EU RoHS
requirements for virtually all relevant products by July 2013, and we will continue to extend the
scope of the commitment to include further restricted substances as regulations continue to
evolve.
To obtain a copy of the HP RoHS Compliance Statement, see HP RoHS position statement.
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer
to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has
been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers.
These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
footnotes • Percentage of ocean-bound plastic contained in each component varies by product

• Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-
2018 standard.
• External power supplies, WWAN modules, power cords, cables and peripherals excluded.
• 100% outer box packaging and corrugated cushions made from sustainably sourced
certified and recycled fibers.
• Fiber cushions made from 100% recycled wood fiber and organic materials.

DISPLAYS
1. Actual brightness will be lower with touchscreen or Sure View.
Note: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may
vary either higher or lower.
Panel LCD 14 inch FHD Outline Dimensions (W x H) 316.17 x 186.4 mm (max) (w/ PCB)
(1920x1080) Anti-Glare WLED
UWVA 45percent cg 250nits Active Area 309.37 x 174.02 mm (typ.)
eDP 1.2 w/o PSR bent NWBZ Weight 300 g (max)
Diagonal Size 14.0 inch
Thickness 3.0 mm/ 5.0 mm (PCB) (max)
Interface eDP 1.2
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 600:1 (typ.)
Refresh Rate 60 Hz
Brightness 250 nits
Pixel Resolution 1920 x 1080 (FHD)
Format RGB Stripe
Backlight LED
Color Gamut Coverage NTSC 45%
Color Depth 6 bits (Hi FRC supportive w/ condition to enable)
Viewing Angle UWVA 85/85/85/85
Panel LCD 14 inch FHD Outline Dimensions (W x H) 316.17 x 186.4 mm (max) (w/ PCB)
UWVA 45percent cg 250nits Active Area 309.37 x 174.02 mm (typ.)
eDP 1.2 w/o PSR bent Touch on Weight 305 g (max)
Panel NWBZ Diagonal Size 14.0 inch
Thickness 3.0 mm/ 5.0 mm (PCB) (max)
Interface eDP 1.2
Surface Treatment Anti-Glare On-cell
Touch Enabled Yes
Refresh Rate 60 Hz
Brightness 250 nits1
Format RGB Stripe
Backlight LED
Color Gamut Coverage NTSC 45%
Color Depth 6 bits (Hi FRC supportive w/ condition to enable)

Panel LCD 14 inch FHD Outline Dimensions (W x H) 315.07 x 186.6 mm (max)
UWVA sRGB 100percent cg Active Area 309.37 X 174.02 mm (typ.)
400nits eDP Weight 200 g (max)
1.4+PSR2 bent LP NB2X Diagonal Size 14.0 inch
Thickness 2.0 mm/4.0 mm (w/PCB) (max)
Interface eDP 1.4
Surface Treatment Anti-Glare
Touch Enabled No
Refresh Rate 60 Hz
Brightness 400 nits
Format RGB Stripe
Backlight LED
Color Gamut Coverage sRGB 100% (NTSC 72%)
Color Depth 6 bits
Panel LCD 14-in FHD Outline Dimensions (W x H x D) 314.612 x 185.33 mm (max.)

UWVA 100% sRGB 1000nits eDP Active Area 309.312 x 173.99 mm
1.4+PSR HP Sure View Reflect Weight 230 g (max.)
NB2Y bent Diagonal Size 14.0”
Thickness 3.9 mm (max.)
Interface eDP 1.4 + PSR
Surface Treatment Anti-glare (AG)
Touch Enabled No
Refresh Rate 60 Hz
Brightness 1000 nits1
Format RGB
Backlight LED
Color Gamut Coverage 100% sRGB
Color Depth 8 bits

STORAGE
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 10 and 11)
is reserved for system recovery software.
SSD 128GB 2280 PCIe-3x2 Form Factor M.2 2280

Three Layer Cell
Capacity 128 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface PCIe NVMe Gen3X2
Maximum Sequential Read Up to 1400 ~ 2100 MB/s
Maximum Sequential Write Up to 800 ~ 1200 MB/s

Logical Blocks 250,069,680
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

Features ATA Security (Option); TRIM; L1.2
SSD 1TB 2280 PCIe-3x4 Form Factor M.2 2280

NVMe Three Layer Cell
single-sided Capacity 1 TB
NAND Type TLC

Logical Blocks 2,000,409,264

Features ATA Security; TRIM; L1.2

SSD 256GB 2280 M2 PCIe- Form Factor M.2 2280
3x4 SS NVMe TLC
Capacity 256 GB
NAND Type TLC


SSD 256GB 2280 PCIe Form Factor M.2 2280

NVMe Value
Capacity 256 GB
NAND Type Value



NVMe Self Encrypted OPAL2
Three Layer Cell Capacity 256 GB
NAND Type TLC



Features ATA Security (Option); TCG Opal 2.0; TRIM; L1.2
SSD 2TB 2280 PCIe-3x4 Form Factor M.2 2280

NVMe Three Layer Cell
single-sided Capacity 2 TB
NAND Type TLC


SSD 512GB 2280 M2 PCIe- Form Factor M.2 2280

3x4 SS NVMe TLC
Capacity 512 GB
NAND Type TLC



SSD 512GB 2280 PCIe NVMe Form Factor M.2 2280
Value
Capacity 512 GB
NAND Type Value


SSD 512GB 2280 PCIe- Form Factor M.2 2280

3x2x2 NVMe+SSD 32GB 3D
Xpoint Capacity 512 GB
NAND Type QLC+3D XPoint
Interface PCIe NVMe Gen3X2X2
Maximum Sequential Read Up to 2400 MB/s
Maximum Sequential Write Up to 1300 MB/s



NVMe Self Encrypted OPAL2
Three Layer Cell Capacity 512 GB
NAND Type TLC


Features ATA Security (Option); TCG Opal 2.0; TRIM; L1.2

NETWORKING
Intel® Wi-Fi® 61 AX201 + Wireless LAN Standards IEEE 802.11a
BT5 (802.11ax 2x2, IEEE 802.11b
vPro®, supporting gigabit IEEE 802.11g
IEEE 802.11n
file transfer speeds)5
IEEE 802.11ac
vPro® IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Features Wi-Fi 6 technology
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: max 300 Mbps
•802.11ac: 1733 Mbps
•802.11ax: max 2.4 Gbps
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security3 •IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
•WPA2 certification
•IEEE 802.11i
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b: +17dBm minimum
• 802.11g: +16 dBm minimum
• 802.11a: +17dBm minimum
• 802.11n HT20(2.4GHz): +14dBm minimum
• 802.11n HT20(5GHz): +14dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum

• 802.11ax HE40(2.4GHz): +12dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
Power Consumption •Transmit mode: 2.0 W
•Receive mode: 1.6 W
•Idle mode (PSP) 180 mW (WLAN Associated)
•Idle mode: 50 mW (WLAN unassociated)
•Connected Standby/Modern Standby: 10mW
•Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 • 802.11b, 1Mbps: -93.5dBm maximum
• 802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11ac, MCS0 (VHT80): -84dBm maximum
• 802.11ac, MCS9 (VHT160): -58.5dBm maximum
• 802.11ax, MCS11(HE40): -57dBm maximum
• 802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8 g
2. Type 126: 1.3 g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED White – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate1 2.17 Mbps
BLE: 1 Mbps signaling data rate1 0.2 Mbps
1. Actual throughput may vary.
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps

asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
Security & Manageability Intel® vPro® support with appropriate Intel® chipset components
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi
6 (802.11ax) is backwards compatible with prior 802.11 specs.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel
12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).

Intel® Wi-Fi 61 AX201 + Wireless LAN Standards IEEE 802.11a
BT5 (802.11ax 2x2, non- IEEE 802.11b
vPro®, supporting gigabit IEEE 802.11g
IEEE 802.11n
file transfer speeds)5
IEEE 802.11ac
non-vPro® IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Features Wi-Fi 6 technology
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: max 300 Mbps
•802.11ac: 1733 Mbps
•802.11ax: max 2.4 Gbps
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security3 •IEEE and WiFI compliant 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
•IEEE 802.11i
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b: +17dBm minimum
• 802.11g: +16 dBm minimum
• 802.11a: +17dBm minimum
• 802.11ax HE40(2.4GHz): +12dBm minimum

Power Consumption •Transmit mode2.0 W
•Receive mode1.6 W
•Idle mode (PSP)180 mW(WLAN Associated)
•Idle mode50 mW(WLAN unassociated)
•Connected Standby 10mW
•Radio disabled8 mW"
Power Management ACPI and PCI Express ompliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity • 802.11b, 1Mbps: -93.5dBm maximum
• 802.11b, 11Mbps: -84dBm maximum
• 802.11ac, MCS9 (VHT160): -58.5dBm maximum
• 802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8 g
2. Type 126: 1.3 g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED Off – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate1 2.17 Mbps
BLE: 1 Mbps signaling data rate1 0.2 Mbps
1. Actual throughput may vary.
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels

Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps

asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Software BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi
6 (802.11ax) is backwards compatible with prior 802.11 specs.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel
12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a
packet error rate of 10% for 802.11a/g (OFDM modulation).
Qualcomm® Technology/ WCDMA/HSDPA/HSUPA/HSPA+ operating bands:

Snapdragon™ X55 Operating bands Band 1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)
5G 1 modem Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)

Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)
Band 9: 1750 to 1785 MHz(UL), 1845to 1880 MHz (DL)
LTE FDD/TDD operating bands:
Band 29: 717 to 728 MHz (DL)
Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL)
Band 34: 2010 to 2025 MHz (UL/DL)
Band 38: 2570 to 2620 MHz (UL/DL)
Band 39: 1880 to 1920 MHz (UL/DL)
Band 40: 2300 to 2400 MHz (UL/DL)
Band 41: 2496 to 2690 MHz (UL/DL)
Band 42: 3400 to 3600 MHZ (UL/DL)
Band 46: 5150 to 5925 MHZ (DL)
Band 48: 3550 to 3700 MHZ (UL/DL)
5GNR Sub 6GHZ
n1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)
n41: 2496 to 2690 MHz (UL/DL)
n77: 3300 to 4200 MHz (UL/DL)
n78: 3300 to 3800 MHz (UL/DL)
n79: 4400 to 5000 MHz (UL/DL)

Wireless protocol
standards 5GNR Air Interface
l 3GPP Rel15 5G NR sub-6
LTE Rel14
20 layers and 2 Gbps downlink (DL) throughput – 4 × 4 MIMO across
5x CA
200 Mbps uplink (UL) throughput – 40 MHz ULCA and 256 QAM
WCDMA
R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
GPS Standalone, A-GPS (MS-A, MS-B)
GPS bands GPS: L1 (1575.42MHz)
GLONASS: L1 (1602MHz)
BeidouB1(1561.098MHz)
Galileo E1 (1575.42)
Maximum data rates 5G sub 6G : 3.8 Gbps
LTE: ue-CategoryDL 20, (DL : 2 Gbps )
ue-CategoryUL 18 , (UL: 200Mbps)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output power LTE: 23 dBm in all band except B41
LTE B41 HPUE = 26dBm
HSPA+: 23.5 dBm
Maximum power consumption 5G Sub 6 : 2500 mA
LTE: 1,300 mA (peak); 1100 mA (average)
HSPA+: 1,100 mA (peak); 800 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 8g
Dimensions
42 mm × 30 mm × 2.6 mm
(Length x Width x Thickness)
1. Qualcomm® 5G module is optional and must be configured at the factory. Module designed for 5G networks as carriers deploy
Evolved-Universal Terrestrial Radio Access New Radio Dual Connectivity (ENDC) with both 100Mhz of 5G NR and LTE channel
bandwidth, using 256QAM 4x4, requires activation and separately purchased service contract. Check with service provider for
coverage and availability in your area. Connection, upload and download speeds will vary due to network, location, environment,
network conditions, and other factors. 5G LTE not available on all products, in all regions. Backwards compatible to 4G LTE and 3G
HSPA technologies. 5G LTE module is available where carrier supported.

Intel® XMM™ 7360 LTE- Technology/Operating FDD LTE:
Advanced CAT 9 1 bands 2100 (Band 1), 1900 (Band 2), 1800 (Band 3), 1700/2100 (Band 4),
850 (Band 5), 2600 (Band 7), 900 (Band 8), 1400 (Band 11), 700 (Band 12
lower), 700 (Band 13 upper), 700 (Band 17 lower), 850 (Band 18 lower),
850 (Band 19 upper), 800 (Band 20), 1450 (Band 21), 850 (Band 26)
700 (Band 28), 700 (Band 29 RX only), 2300 (Band 30), 1700/2100 (Band
66)
TDD LTE:
2600 (Band 38), 1900 (Band 39), 2300 (Band 40), 2500 (Band 41)
HSPA+:
2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4), 850 (Band 5), 900
(Band 8)
Wireless protocol
3GPP Release 11 LTE Specification CAT.9, MAX 60MHz aggregation BW
standards
WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
GPS Standalone, A-GPS (MS-A, MS-B and LTO)
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou 1561.098
LTE: 450 Mbps (DL 3CA), 50 Mbps (Upload)

Maximum data rates DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output LTE: 23 dBm

power HSPA+: 23.5 dBm
Maximum power LTE: 1,200 mA (peak); 900 mA (average)
consumption HSPA+: 1,100 mA (peak); 800 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 6.2 g
Dimensions
42 x 30 x 2.3 mm
(Length x Width x
Thickness)
1. Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available
in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location,
environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.

NXP NPC300 Near Field Dimensions (L x W x H) Module 17 mm by 10 mm by 2.0 mm
Communication
Module Chipset NPC300
System interface I2C
NFC RF standards ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
NFC Forum Support Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
Reader (PCD-VCD) ISO/IEC 14443 A
Mode1 ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
Card Emulation (PICC- ISO/IEC 14443 A

VICC) Mode1 ISO/IEC 14443 B and B’
MIFARE
FeliCa
Frequency 13.56 MHz

NFC Modes Supported Reader/Writer, Peer-to-Peer
Raw RF Data Rates 106, 212, 424, 848 kbps
Operating 0°C to 70°C
temperature
Storage temperature -20°C to 125°C
Humidity 10-90% operating
5-95% non-operating
Supply Operating 2.97 to 5.5 Volts
voltage
I/O Voltage 1.8V or 3.3V
Power Consumption
(Booster enable, VBAT= 3.3V, VCC_BOOST = 5V)
Mode Power Consumption, Typical2
Polling 7.3 mA
Detected Test Tag 32.9 mA
Type 1
Type 2
Type 3

Type 4
Antenna Antenna connector, 0.5mm pitch, 7 connector FPC. Antenna matching is
external to module.
1. With application or UICC support

2. Actual Power Consumption is dependent on NFC antenna and matching circuit and on the particular polling sequence and period
configured.

POWER
AC Adapter 45 Watt Dimensions 95x40x26.8mm
Smart nPFC Standard Weight unit: 200g +/- 10g
Barrel 4.5mm Right Input
Angle 1.8m
Input Efficiency 87.74 % at 115 Vac and 88.4 % at 230Vac
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.4 A at 90 Vac
Output
Output power 45W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A
Connector
Connector 4.5mm Barrel Type
Environmental Design
Operating
temperature 32oF to 95oF (0oto 35oC)
Non-operating
(storage) temperature -4oF to 185oF (-20oto 85oC)
Non-operating
(storage) temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1, EN60950-
1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1, SELV;
Agency approvals - C-UL-US, DENAN, EN55032 Class B, FCC Class B,
CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.

Smart nPFC Standard Weight
Barrel 4.5mm Right unit: 200g +/- 10g
Angle 1.8m 2prong Input
Output
Output power 45W
DC output 19.5V

Connector
Operating
temperature 32oF to 95oF (0oto 35oC)
Non-operating
(storage) -4oF to 185oF (-20oto 85oC)
temperature
Humidity 20% to 95%
EMI and Safety Eg:
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1, EN60950-1
and/or EN62368-1, UL60950-1 and/or UL62368-1, Class1, SELV;
Agency approvals - C-UL-US, DENAN, EN55032 Class B, FCC Class B, CISPR32
Class B, CCC, NOM-001 NYCE.
AC Adapter 65 Watt Dimensions 88x53.5x21mm

nPFC Slim USB type C Weight
Straight 1.8m unit: 220g +/- 10g
Input
Input Efficiency 81.5% min at 115 Vac/ 230Vac @ 5V/3A
86.7% min at 115 Vac/ 230Vac @ 9V/3A
88% min at 115 Vac/ 230Vac @ 12V/5A
89% min at 115 Vac/ 230Vac @ 15V/4.33A
89% min at 115 Vac/ 230Vac @ 20V/3.25A

Input AC current 1.6 A at 90 VAC and maximum load
Output
Output power 65W
DC output 5V/9V/12V/15V/20V
Connector
Connector USB Type C
Operating
temperature
32oFto 95oF (0oto 35oC)
Non-operating
(storage)
temperature -4oFto 185oF (-20oto 85oC)
Humidity 5% to 95%

EMI and Safety Eg:
and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1, SELV;
AC Adapter 65 Watt Dimensions 90.0x51x28.5mm

nPFC Standard USB Weight
type C Straight 1.8m unit: 250g +/- 10g
Input
Input Efficiency
81.5% min at 115 Vac/ 230Vac @ 5V/3A
86.7% min at 115 Vac/ 230Vac @ 9V/3A
88% min at 115 Vac/ 230Vac @ 12V/5A
89% min at 115 Vac/ 230Vac @ 15V/4.33A
89% min at 115 Vac/ 230Vac @ 20V/3.25A

Input AC current 1.6 A at 90 VAC and maximum load
Output
Output power 65W
DC output 5V/9V/12V/15V/20V
Output current limit 8.0A Max.
Connector
Connector USB TYPE C
Operating 32°F to 95°F (0°to 35°C)
temperature
Non-operating -4°F to 185°F (-20°to 85°C)
(storage)
temperature
Humidity 20% to 95%
EMI and Safety Eg:
Dimensions 102x55x30mm
Weight unit: 250g +/- 10g
Input

AC Adapter 65 Watt Input Efficiency 88.0 % at 115 Vac and 89.0 % at 230Vac
Smart nPFC EM Barrel 47 ~ 63 Hz
Input frequency range
4.5mm New EM Max. 1.7 A at 90 Vac
Input AC current
Output
Output power 65W
DC output 19.5V
Connector
Operating 320F to 950F (0oto 35oC)
temperature
Non-operating -4oF to 185oF (-20oto 85oC)
Humidity 20% to 95%
EMI and Safety Eg:

Smart nPFC Standard Weight unit: 230g +/- 10g
Barrel 4.5mm Right
Angle 1.8m Input
Output
Output power 65W
DC output 19.5V
Connector
Operating 32oF to 95oF (0oto 35oC)
temperature
Non-operating -4oF to 185oF (-20oto 85oC)

Humidity 20% to 95%
EMI and Safety Eg:
and/or EN62368-1, UL60950-1 and/or UL62368-1, Class1, SELV;
Battery CC 3 Cell 53 Wh Dimensions (H x W x L)

53 Long Life -PL Fast
Charge 7.3 x 52.9 x 267.11mm (0.287 x 2.082 x 10.516 inch)
Weight 0.205 kg (0.45 lb)
Cells/Type 3cell Lithium-Ion Polymer cell
Energy
Voltage 11.55V
Amp-hour capacity 4.59Ah
1
Watt-hour capacity 53Wh
Temperature
Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating 14˚ to 140˚ F (-10˚ to 60˚ C)
(Discharging)
Fuel Gauge LED N/A
Warranty Depends on system offering
Optional Travel
Battery Available
No
1. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time,
usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors.

FINGERPRINT READER
Model
Synaptics Validity VFS7552 touch sensor
Mobile Voltage Operation
3.0V to 3.6V
Operating Temperature
14° – 167°F (-10°-75°C)
Current Consumption Image
36mA peak
Low Latency Wait For Finger
950 uA
Capture Rate
30 cm/sec
ESD Resistance
IEC 61000-4-2 4B (+15KV)
Detection Matrix
200*1 (Plus another secondary line) / 508 dpi / 10mm sensor area
FRR (False Reject Rate) / FAR
(False Acceptance Rate) FRR ~ 1% @ 1:50K FAR
COUNTRY OF ORIGIN
China

Options and Accessories (sold separately and availability may vary by country)
Category Description Part Number
Cases HP Business Backpack (up to 17.3") 2SC67AA
HP Business Case (up to 15.6") 2SC66AA
HP Business Slim Top Load (up to 14.1" x .75" thick) 2SC65AA
Prelude Pro Top Load 1X645AA
Docking HP Thunderbolt Dock 120W G2 2UK37AA

HP TB Dock w/ Combo Cable (230W) 3TR87AA
HP TB Dock Audio Module 3AQ21AA
HP TB Dock 120W G2 cable 3XB94AA
HP TB Dock G2 combo cable 3XB96AA
HP TB Dock 230W G2 Cable 3XB95AA
HP USB-C Mini Dock 1PM64AA
HP USB-C Dock G5 5TW10AA
HP USB-C/A Universal Dock G2 5TW13AA
Input/Output HP Wireless Rechargeable 950MK Mouse and Keyboard 3M165AA

HP Wired Desktop 320MK Mouse and Keyboard 9SR36AA
HP Wireless Premium Keyboard Z9N41AA
HP USB Essential Keyboard and Mouse H6L29AA
HP Comfort Grip Wireless Mouse H2L63AA
HP X4000b Bluetooth Mouse H3T50AA
HP Wired Desktop 320M Mouse 9VA80AA
HP USB Travel Mouse G1K28AA
HP Bluetooth Travel Mouse 6SP30AA
HP Wireless Premium Mouse 1JR31AA
HP USB Premium Mouse 1JR32AA
HP Essential USB Mouse 2TX37AA
HP Elite Presenter Mouse 2CE30AA
HP Stereo 3.5mm Headset T1A66AA
HP Stereo USB Headset T1A67AA
HP UC Wireless Mono Headset W3K08AA
HP UC Wireless Duo Headset W3K09AA
HP USB-C to USB-A Hub Z6A00AA
HP USB-C to DP N9K78AA
HP USB-C to VGA N9K76AA
HP HDMI to VGA H4F02AA
HP USB-C to HDMI 2.0 Adapter 1WC36AA
HP USB to Gig RJ45 Adapter N7P47AA
HP USB-C to RJ45 Adapter V7W66AA
HP USB-C Travel Hub G2 7PJ38AA
HP Elite USB-C Hub 4WX89AA
Power HP 65W Slim AC Adapter H6Y82AA

Options and Accessories (sold separately and availability may vary by country)
HP 45W Smart AC Adapter H6Y88AA
HP 65W Smart AC Adapter H6Y89AA
HP 45W 2-prong 4.5 mm DC jack AC Adapter L6F60AA
HP 45W USB-C Power Adapter 1HE07AA
HP 65W USB-C Power Adapter 1HE08AA
65W USB-C Slim Power Adapter 3PN48AA
HP Notebook Power Bank N9F71AA
HP USB-C Essential Power Bank 3TB55AA
Storage HP USB External DVDRW Drive F2B56AA

HP 256GB PCI-e 3x4 NVMe M.2 SSD TBD
HP 512GB PCI-e 3x4 NVMe M.2 SSD TBD
Memory HP 4GB DDR4 3200 Memory 286H5AA

HP 8GB DDR4 3200 Memory 286H8AA
HP 16GB DDR4 3200 Memory 286J1AA
Security HP Nano Keyed Cable Lock 1AJ39AA

HP Sure Key Cable Lock 6UW42AA

Summary of Changes
Date of change Version History Description of change
December 11, 2020 V1 to V2 Updated Environmental Data, Ports

January 27, 2021 V2 to V3 Updated USB ports to new industry standards.
February 4, 2021 V3 to V4 Added Processors
February 8, 2021 V4 to V5 Updated Smart Reader Card
February 10, 2021 V5 to V6 Updated Environmental Data
February 17, 2021 V6 to V7 Update Processor section
March 9, 2021 V7 to V8 Update Audio and Multimedia section
March 18, 2021 V8 to V9 Update Battery Life
April 21, 2021 V9 to V10 Update Memory Section and Input/ Output Section Updated
April 23, 2021 V10 to V11 Added BIOS information in Software section
April 29, 2021 V11 to V12 Update TPM 2.0
May 6, 2021 V12 to V13 Removed Processors base frequency/Added HP Smart Support
May 20, 2021 V13 to V14 Removed HP Thunderbolt Dock 230W G2
May 27, 2021 V14 to V15 Updated HP Pro Security Edition to HP Wolf Pro Security Edition
June 11, 2021 V15 to V16 Removed HP WorkWell from Software and Security section
September 9, 2021 V16 to V17 Updated Techspecs in Networking and Power section
September 16, 2021 V17 to V18 Added WLAN and WWAN in Product Dimensions section; Environmental Data updated
November 11, 2021 V18 to V19 Updated Windows 10 with Free upgrade to Windows 11 when available in OS section and
footnote.
November 17, 2021 V18 to V20 Update Networking Qualcomm® 5G Disclaimers
December 8, 2021 V20 to V21 Update OS footnotes and Wi-Fi 6 footnotes
December 14, 2021 V21 to V22 Update Windows OS section
February 28, 2022 V22 to V23 Added Processors base frequency
April 20, 2022 V23 to V24 Added Reference for USB Ports
Copyright © 2022 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited
warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Intel, Core and Intel vPro are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association
(VESA®) in the United States and other countries. USB Type-C® and USB-C® are trademarks of USB Implementers Forum. ENERGY
STAR is a registered trademark of the U.S. Environmental Protection Agency. Microsoft and Windows are either registered
trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

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QuickSpecs HP EliteBook 840 G8 Notebook PC

1. Ambient Light Sensor (Optional) 7. Glass Clickpad

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1. Power Button 5. Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate

1. SuperSpeed USB 20Gbps is not available with Thunderbolt™ 4.

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• Windows 11 Pro, other Windows OS or FreeDOS preinstalled

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9. FHD/HD content required to view FHD/HD images.

Docking Total Max Dock Technical limitations / additional information

The highest resolution for dual displays

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Highest resolution with dual displays is two

The highest resolution for running a non-

The best resolution for dual display is two 4K

Highest triple displays resolution available is

Best single display is with High Resolution

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128 GB PCIe® Gen3x2 NVMe™ M.2 SSD TLC14

512 GB PCIe® NVMe™ Value M.2 SSD14

512 GB PCIe®Gen 3x4 NVMe™ M.2 SED TLC OPAL2 14

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Near Field Communications (NFC) Module 22

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9. FHD/HD content required to view FHD/HD images.

KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

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Hidden Function Keys

23. Keyboards are made from up to 65% post-consumer recycled plastic.

SOFTWARE AND SECURITY

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Client Security Software

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Max Operating Power UMA < 45W

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Sustainable Impact • Ocean-bound plastic in Speaker Box

Normal Operation (Sort 6.36 W 6.53 W 6.61 W

Normal Operation (Long 1.25 W 1.15 W 1.11 W

Sleep 1.25 W 1.15 W 1.11 W

Off 0.29 W 0.31 W 0.29 W

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Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz

Normal Operation (Short 22 BTU/hr 22 BTU/hr 23 BTU/hr

Normal Operation (Long 4 BTU/hr 4 BTU/hr 4 BTU/hr

Sleep 4 BTU/hr 4 BTU/hr 4 BTU/hr

Off 1 BTU/hr 1 BTU/hr 1 BTU/hr

Declared Noise Emissions Sound Power Sound Pressure

Typically Configured – Idle 2.5 15

Fixed Disk – Random 2.9 21

Optical Drive – Sequential N/A N/A

Packaging Materials External: PAPER/Corrugated 41 g

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footnotes • Percentage of ocean-bound plastic contained in each component varies by product