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    Dis Assembly Notebook HP2530p

    Uploaded by

    WizarD_G73
    The document provides disassembly instructions for recycling various HP notebook and tablet PC models. It lists components that require selective treatment under the WEEE directive, including batteries, LCD panels, and printed circuit boards. The instructions describe removing screws and parts like the battery, hard drive, memory, and keyboard to access these components. Detailed steps are provided and accompanied by illustrations of the disassembly process.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd

    Dis Assembly Notebook HP2530p

    Uploaded by

    WizarD_G73
    80 views14 pages
    The document provides disassembly instructions for recycling various HP notebook and tablet PC models. It lists components that require selective treatment under the WEEE directive, including batteries, LCD panels, and printed circuit boards. The instructions describe removing screws and parts like the battery, hard drive, memory, and keyboard to access these components. Detailed steps are provided and accompanied by illustrations of the disassembly process.

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    © Attribution Non-Commercial (BY-NC)

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    The document provides disassembly instructions for recycling various HP notebook and tablet PC models. It lists components that require selective treatment under the WEEE directive, including batteries, LCD panels, and printed circuit boards. The instructions describe removing screws and parts like the battery, hard drive, memory, and keyboard to access these components. Detailed steps are provided and accompanied by illustrations of the disassembly process.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    80 views14 pages

    Dis Assembly Notebook HP2530p

    Uploaded by

    WizarD_G73
    The document provides disassembly instructions for recycling various HP notebook and tablet PC models. It lists components that require selective treatment under the WEEE directive, including batteries, LCD panels, and printed circuit boards. The instructions describe removing screws and parts like the battery, hard drive, memory, and keyboard to access these components. Detailed steps are provided and accompanied by illustrations of the disassembly process.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 14

    Product End-of-Life Disassembly Instructions

    Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] HP 2530P Mobile Thin Client HP 2530P Name / Model #3 Name / Model #4 Name / Model #5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries With a surface greater than 10 sq cm Mother board All types including standard alkaline and lithium coin or button style batteries 3 cell battery and RTC battery For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps LCD panel 1 0 1 2

    Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing EL-MF877-00 Template Revision A

    Include the cartridges, print heads, tubes, vent chambers, and service stations.

    Page 1

    radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 screw driver Description #2 screw driver Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. Remove battery module Remove HDD door, minicard door, RAM door, bluetooth door. Remove HDD module (1.8"HDD module or 2.5 HDD module) Remove expansion memory Remove minicard module Remove ODD assembly or 2.5" HDD module Remove Keyboard Remove strip cover (with power button PCB & wirless button & num lock PCB) Remove LCD cable and antenna Divide LCD assembly from base assembly Divide logic-up assembly(with TP module & caps lock PCB & F/P module) from base assembly Divide M/B(with CPU and memory and thermal module and Fan) from base assembly Remove thermal module and Fan assembly from MB. Remove Speaker module and indicate FFC from logic-lower assembly Divide the LCD bezel from LCD assembly Divide LCD panel and Hinge Bracket. Seperate Al skin from logic-up and strip cover and LCD cover philip #1 Torx type

    3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

    EL-MF877-00 Template Revision A

    Page 2

    1. Remove battery module Push the Battery Latch knob L & R and remove the battery module

    2. Remove HDD door, minicard door, RAM door, bluetooth door. Divide the screw and remover those door

    EL-MF877-00 Template Revision A

    Page 3

    3. Remove HDD module (1.8"HDD module or 2.5 HDD module) Divide the HDD bracket and 1.8HDD FFC and remove the HDD module

    4. Remove expansion memory

    EL-MF877-00 Template Revision A

    Page 4

    5. Remove minicard module

    6. Remove ODD assembly or 2.5" HDD module Divide the screws and remove the ODD module assembly

    EL-MF877-00 Template Revision A

    Page 5

    7. Remove Keyboard Divide the screw 5 pcs and remover the Keyboard

    8. Remove strip cover (with power button PCB & wirless button & num lock PCB) Divide the screw and push the strip cover to remove it.

    EL-MF877-00 Template Revision A

    Page 6

    9. Remove LCD cable and antenna Divide the antenna and LCD cable from routing area

    EL-MF877-00 Template Revision A

    Page 7

    10. Divide LCD assembly from base assembly Divide the screws 6pcs from Hinge base and divide it from base assembly

    EL-MF877-00 Template Revision A

    Page 8

    11. Divide logic-up assembly(with TP module & caps lock PCB & F/P module) from base assembly Divide the screws 11pcs and divide it from base assembly

    EL-MF877-00 Template Revision A

    Page 9

    12. Divide M/B(with CPU and memory and thermal module and Fan) from base assembly Divide the screws 3pcs and divide it from base assembly

    13. Remove thermal module and Fan assembly from MB Divide the screws 2pcs and divide it from MotherBoard

    EL-MF877-00 Template Revision A

    Page 10

    14. Remove Speaker module and indicate FFC from logic-lower assembly Divide the screw and divide it from logic lower assembly

    15. Divide the LCD bezel from LCD assembly Divide the screws 4pcs and divide it from LCD assembly

    EL-MF877-00 Template Revision A

    Page 11

    16. Divide LCD panel and Hinge Bracket from LCD assembly. Divide the screws 2pcs and divide it from LCD assembly

    17. Divide Hinge Bracket from LCD panel

    EL-MF877-00 Template Revision A

    Page 12

    18. Seperate Al skin from logic-up and strip cover and LCD cover

    EL-MF877-00 Template Revision A

    Page 13

    EL-MF877-00 Template Revision A

    Page 14

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