Mechanical Assembly and Customer Manufacturing Technology For S.E.P. Packages

Mechanical Assembly and
Customer Manufacturing
Technology for S.E.P. Packages
Application Note AP-826
July 1998
Order Number: 243734-001

Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
The Intel Celeron processor may contain design defects or errors known as errata which may cause the products to deviate from published
specifications. Such errata are not covered by Intel’s warranty. Current characterized errata are available on request.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by:
calling 1-800-548-4725 or
by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation, 1998
*Third-party brands and names are the property of their respective owners.
Application Note AP-826

Contents
1.0 INTRODUCTION .......................................................................................................... 1
1.1 Purpose of this Document................................................................................ 1
1.2 References....................................................................................................... 1
2.0 Single Edge Processor Package .................................................................................. 2
2.1 Package Terminology ...................................................................................... 2
2.2 S.E.P. Package Design and Construction ....................................................... 3
2.2.1 Package Design.................................................................................. 3
2.2.2 Package Substrate.............................................................................. 3
2.2.3 Processor Core Package Body Materials ........................................... 5
2.3 Package Assembly and Test ........................................................................... 6
2.4 Package Handling and Shipping Media ........................................................... 7
2.4.1 Intel Celeron™ Processor Shipping Media Description ...................... 7
2.4.2 S.E.P. Package Handling Precautions for ESD Protection................. 8
2.4.3 Package Handling............................................................................... 8
2.4.4 Package Enabling ............................................................................... 8
2.4.5 Retention Mechanism ......................................................................... 9
2.4.6 Thermal Interface Material .................................................................. 9
2.4.7 Heatsink and Heatsink Attachment..................................................... 9
2.5 S.E.P. Package Quality and Reliability ..........................................................10
2.6 Package Change Control...............................................................................10
2.7 S.E.P. Package Marking ................................................................................10
2.7.1 Package Core Processor Marking ....................................................11
2.8 Package Processor Return Policy .................................................................11
3.0 Processor Enabling Mechanism .................................................................................12
3.1 Slot 1 Connector ............................................................................................14
3.1.1 Other Connector Form Factors: Restrictions and Requirements ......15
3.2 Retention Mechanism ....................................................................................15
3.2.1 Retention Mechanism Mechanical Description .................................15
3.2.2 S.E.P. Package only Retention Mechanism with Plastic
Fastener Description.........................................................................15
3.2.3 S.E.P. Package only Retention Mechanism with Captive
Fasteners Description .......................................................................16
3.2.4 Mechanical Retention Mechanism Attach Mount..............................16
4.0 Motherboard Integration Manufacturing Guidelines....................................................18
4.1 Introduction and Suggested Integration Flow ................................................18
4.1.1 Recommended Slot 1 Connector Insertion Steps
and Requirements.............................................................................19
4.2 Retention Mechanism Attach Mount Installation............................................21
4.2.1 Attach Mount Assembly Criteria........................................................21
4.2.1.1 HVM Enabled Procedures and Equipment
for RMAM installation ...........................................................22
Application Note AP-826 iii

5.0 System Integration Manufacturing Guidelines ............................................................ 23
5.1 Introduction and Suggested Integration Flow ................................................ 23
5.2 Heatsink Attachment to the Substrate ........................................................... 23
5.2.1 Manual Heatsink Attachment Method ............................................... 24
5.2.2 HVM Enabled Procedures and Equipment for Production
Heatsink Attachment......................................................................... 26
5.2.3 Manual Installation of the Captive Fastener Retention
Mechanism ....................................................................................... 29
5.2.4 Manual Installation of the Plastic Fastener Retention
Mechanism ....................................................................................... 30
5.2.5 Insertion of S.E.P. Package .............................................................. 30
5.2.6 Other System and Motherboard Assembly Issues............................ 30
5.3 Removal of S.E.P. Package and Mechanical Support Pieces ....................... 31
5.3.1 Removal of the S.E.P. Package ....................................................... 31
5.3.2 Removal of the Captive Fastener Retention Mechanism.................. 32
5.3.3 Removal of the Plastic Fastener Retention Mechanism ................... 32
5.4 Reuse of Processor and Enabling Components ............................................ 34
6.0 Boxed Intel® Celeron™ Processor Integration Guidelines ......................................... 35
6.1 Boxed Processor Fan Heatsink ..................................................................... 35
6.2 Boxed Processor Fan Power Cable............................................................... 35
6.3 Boxed Processor System Integration Manufacturing Guidelines................... 35
6.3.1 Pre-Installation Preparation .............................................................. 36
6.3.2 Motherboard Preparation – Installation of the Retention
Mechanisms...................................................................................... 36
6.3.3 Installing the Boxed Processor ......................................................... 37
6.3.4 Removing the Boxed Processor ....................................................... 38
Figures
1 S.E.P. Package — Front or Primary Side View ............................................... 2
2 S.E.P. Package — Back or Secondary Side View........................................... 3
3 Mechanical Schematic of S.E.P. Package Substrate ...................................... 4
4 Substrate Edge Finger Contact and Key Detail ............................................... 5
5 Example Processor Core (PLGA) .................................................................... 6
6 S.E.P. Package Assembly/Test Process Flow ................................................ 6
7 Intel® Celeron™ Processor Shipping Box — Exploded View .......................... 7
8 Intel® Celeron™ Processor Shipping Box — Assembled View ....................... 8
9 S.E.P. Package Marking................................................................................ 11
10 Motherboard Footprint for RM and Slot 1 Connector..................................... 12
11 S.E.P. Package Before Insertion into Retention Mechanism......................... 13
12 S.E.P. Package Installed in a Retention Mechanism (RM) with
Plastic Fasteners ........................................................................................... 14
13 Slot 1 Connector ............................................................................................ 14
14 S.E.P. Package Only Retention Mechanism with Plastic Fastener ............... 15
15 S.E.P. Package Only Retention Mechanism with Captive Fastener.............. 16
16 Retention Mechanism Attach Mount Assembly ............................................. 17
17 Retention Mechanism Attach Mount Motherboard Interaction Details........... 17
18 Suggested Motherboard/System Integration Manufacturing Flow
(Bolded Boxes Covered in this Section) ........................................................ 19
19 Slot 1 Connector, Retention Features Highlighted ........................................ 20
iv Application Note AP-826

20 Slot 1 Connector Mounted in Motherboard ....................................................20
21 Recommended Process Capability to Ensure Correct Interaction
of S.E.P. Package and Mechanical Support Pieces ......................................20
22 ATX Motherboard with Slot 1 Connector and RMAM (for captive
nuts only) Installed .........................................................................................21
23 Attach Mount Installed in Motherboard ..........................................................22
24 Attach Mount Installed in Motherboard, Bottom View ....................................22
25 Suggested Motherboard/System Integration Manufacturing Flow
(Bolded Boxes Covered in this Subsection)...................................................23
26 Insert Heatsink Clip Legs ...............................................................................24
27 Clip Base on Secondary (Non-Primary) Side.................................................24
28 Engage Two Legs of the Clip into Heatsink ...................................................25
29 Grasp Heatsink Clip Assembly Between Clip Base and Heatsink .................25
30 Verify All Feet Are Fully Engaged ..................................................................26
31 HVM Heatsink Attachment Fixture.................................................................26
32 Place Clip on Fixture......................................................................................27
33 Clip Rotated and Lowered into Nest ..............................................................27
34 S.E.P. Package Placed Over Clip Legs .........................................................28
35 Heatsink Placed Over Clip Legs ....................................................................28
36 Lower Handle to Raise Plunger and Assembly..............................................29
37 Manual Installation of Captive Nut Fastener ..................................................29
38 Manual Installation of Plastic Fastener ..........................................................30
39 Removing S.E.P. Package from RM..............................................................31
40 Rotate the S.E.P. Package Out of the Slot 1 Connector................................31
41 Plastic Fastener Installation/Extraction Tool ..................................................32
42 Slide Head Under Pin ....................................................................................33
43 Pull Up Gently ................................................................................................33
44 Rotate Up.......................................................................................................34
45 Removing RM with Plastic Fasteners ............................................................34
46 Suggested System Integration Manufacturing Flow ......................................36
47 Inserting the Boxed Processor.......................................................................37
48 Connecting the Boxed Processor Fan Power Cable......................................37
49 Removing the Boxed Intel® Celeron™ Processor .........................................38
Tables
1 Environmental Test Conditions for S.E.P. Package.......................................10
2 Intel® Celeron™ Processor Enabled Mechanical Solution
and Materials List...........................................................................................18
3 Intel® Celeron™ Processor Enabled Mechanical Solution
and Materials List...........................................................................................23
4 Boxed Intel® Celeron™ Processor System Assembly and Material List .......36
Application Note AP-826 v

1.0 INTRODUCTION
The Intel Celeron processor is the next processor in the Intel P6 processor family line of Intel
processors. The Intel Celeron processor, like the Pentium Pro processor, implements a Dynamic
Execution micro-architecture — a unique combination of multiple branch prediction, data flow
analysis and speculative execution. This enables the Intel Celeron processor to deliver higher
performance than the Pentium processor, while maintaining binary compatibility with all previous
Intel architecture processors. The Intel Celeron processor also executes MMX™ technology
instructions for enhanced media and communication performance. The Pentium II processor
utilizes multiple low-power states such as AutoHALT, Stop-Grant, Sleep and Deep Sleep to
conserve power during idle times.
1.1 Purpose of this Document

This application note is meant to familiarize the reader with the S.E.P. package technology
developed by Intel and related issues for the Personal Computer Original Equipment Manufacturer
(PC OEM) The first section details the manufacturing technology used by Intel for the S.E.P.
package. The second half of the document describes an enabled mechanical solution for use in PC
OEM systems and impacts that solution has on the PC OEM manufacturing process.
1.2 References
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
• Intel Celeron Processor at 266 MHz and 300 MHz datasheet (Order Number 243658)
• AP-485, Intel Processor Identification with the CPUID Instruction (Order Number 241618)
• AP-585, Pentium® II Processor GTL+ Guidelines (Order Number 243330)
• AP-586, Pentium® II Processor Thermal Design Guidelines (Order Number 243333)
• AP-587, Pentium® II Processor Power Distribution Guidelines (Order Number 243332)
• AP-589, Pentium® II Processor Electro-Magnetic Interference (Order Number 243334)
• Intel Celeron Processor Specification Update (Order Number 243748)
• Pentium® II Processor I/O Buffer Models, IBIS Format (Electronic Form)
• Pentium® II Processor Developer's Manual (Order Number 243341)
• Packaging Databook (Order Number 240800)
• Slot 1 Connector Design Guidelines, located at the following Intel website:
Intel website http://developer.intel.com/design/celeron/or http://www.intel.com
Application Note AP-826 1

Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages
2.0 Single Edge Processor Package

The Intel® Celeron™ processor family is the first microprocessor product family from Intel
Corporation to utilize the Single Edge Processor (S.E.P.) package technology. The S.E.P. package
utilizes surface mount technology on a substrate with an edge finger connection.
The S.E.P. package utilizes a Slot 1 form factor. It consists of a substrate with an edge finger
connection. Passive components and the processor core are mounted on a single side of the
substrate. Four through holes on the substrate allow for heatsink installation.
The edge finger connection maintains socketability for system configuration and fits within
existing Pentium® II processor-based systems. The edge finger connection uses a connector that is
noted as the 'Slot 1 connector' in this and other documentation.
2.1 Package Terminology

The following terms are used throughout this document and are explained here for clarification:
• Intel® Celeron™ processor family - family of processors designed for Basic PCs. The
introductory Intel Celeron processor is the first to use the S.E.P. package.
• Package - The new processor packaging technology is called a "Single Edge Processor
Package". Examples of other processor packaging technology are BGA (ball grid array),
S.E.C. cartridge (Single Edge Contact Cartridge).
• Gold fingers - The exposed gold connectors that make electrical connection to the Slot 1
connector (also known as “edge fingers”).
• Processor substrate -The structure on which the components are mounted with the S.E.P.
package (with or without components attached).
• Processor core - The processor's execution engine.
Figure 1. S.E.P. Package — Front or Primary Side View
2 Application Note AP-826

Figure 2. S.E.P. Package — Back or Secondary Side View
Sub-Brand mark
®
i m ©’98
Additional terms referred to in this and other related documentation are the Mechanical Support
Pieces (MSPs), which are used on the system to connect the processor to the system motherboard,
and retention of the processor during system shock and vibration. The MSPs represent one solution
for retention of the processor in the Slot 1 connector. This application note focuses on the use of
these pieces:
• Slot 1 Connector - The connector that the S.E.P. package plugs into.
• Retention mechanisms (RM) - Mechanical pieces that hold the Package in the Slot 1
connector. There are multiple RM configurations.
• Heatsink clip - A metal piece that holds the heatsink firmly to the processor core.
• Retention Mechanism Attach Mount - A mechanical piece which secures a screw type
retention mechanism to the motherboard.
Other mechanical solutions are not investigated in detail in this document.
2.2 S.E.P. Package Design and Construction
2.2.1 Package Design

The design of the S.E.P. package and materials used in the package undergo testing to assure the
highest quality. Testing is performed across multiple lots and the correlation of lot data to
manufacturing performance at Intel is determined. Suppliers also undergo quality audits in order to
demonstrate manufacturability and quality-to-performance specifications.
2.2.2 Package Substrate

The S.E.P. package contains active and passive components mounted onto the primary side of the
substrate. The substrate has contact fingers on one edge that provide the electro-mechanical
connection to the Slot 1 connector (and thus to the system motherboard) (see Figure 3). The
substrate is fabricated of normal FR-4 based organic laminate material and has a minimum

flammability rating of 94V–0. Copper trace and power plane parametrics, along with other key
performance and manufacturing designs, have been selected to provide optimum electrical
performance. The edge finger contacts are plated with gold over a nickel barrier layer for a reliable
substrate edge finger to Slot 1 connector electrical contact. The edge fingers are equally distributed
between the primary and secondary sides of the substrate (121 edge finger contacts per side, 242
total contacts for the S.E.P. package). The contact areas of these edge fingers are maximized by
using a two-sided staggered design for the placement of the fingers. A key slot is provided in the
edge finger array, off center of the card length, to prevent improper placement of the S.E.P. package
substrate into the Slot 1 connector (see Figure 3 and Figure 4). See the Intel Celeron Processor at
266 MHz and 300 MHz datasheet for detailed mechanical dimensions and signal listing for the
substrate edge fingers.
Figure 3. Mechanical Schematic of S.E.P. Package Substrate
Pin A1 Pin A121
Detail provided in next figure.
Sub-Brand mark
®
i m ©’98
Pin B121 Pin B1

Figure 4. Substrate Edge Finger Contact and Key Detail
Substrate Key
Pin A73 Pin A74
The edge fingers are specified to last for a maximum of 50 insertions. This is to ensure an upper
limit for the contact resistance to the Slot 1 connector (and meet electrical performance
requirements). Insertion/extraction cycling above 50 insertions may cause an increase in the
contact resistance and a degradation in the material integrity of the edge finger gold plating (and
possible oxidation buildup). The actual number of insertions before processor failure will vary
based upon system configuration and environmental conditions.
2.2.3 Processor Core Package Body Materials

The S.E.P. package processor core may vary by product. For initial product release, the processor
core for the S.E.P. package consists of the silicon logic die, mounted and interconnected to a
multilayer plastic laminate body (also referred to as a Plastic Land Grid Array (PLGA) (see
Figure 5).The laminate structure is Bismaleimide Triazine (BT) resin with laminated copper foil
interconnects. The logic die is gold wedge wire bonded to the component package. The cavity of
the logic core body is encapsulated with a high temperature thermoset polymer coating to provide
mechanical and environmental protection. The logic core package to substrate interconnects use
eutectic tin-lead (SnPb) solder balls. See the product datasheet for details on your specific product.

Figure 5. Example Processor Core (PLGA)
2.3 Package Assembly and Test

The processor core and other components are assembled onto the substrate using traditional SMT
processes and methodologies. The S.E.P. package assembly and test flow is shown in Figure 6.
Figure 6. S.E.P. Package Assembly/Test Process Flow
Components
tested by Component Surface
Supplier Prep Mount
Final
Visual
Visual Test
Inspection
Inspection
Outgoing
Quality Pack
Audit

2.4 Package Handling and Shipping Media

The S.E.P. package was designed to be a robust packaging solution for processors. As a result,
sealed, desiccant, ESD protective bags are not required during shipping of the processors from
Intel.
This section provides additional handling guidelines and information on the shipping media used
for the processors. The Intel Celeron processor at 266 MHz and 300 MHz datasheet (order number
243658) contains specific operational and storage specifications for the processor.
2.4.1 Intel Celeron Processor Shipping Media Description

The S. E. P. package processors are packaged in a shipping box using a thermo-formed ESD plastic
(industry name is XEROSTAT 1000) insert base with the substrate edge fingers down. The ESD
plastic insert is an electrically dissipative, Recycled High Density Polyethylene (RHDPE) molded
plastic (See Figure 7 and Figure 8). The insert cover is then attached over the S.E.P. card processors
to secure them during shipment. The closed insert is placed into the carbon lined outer box to
achieve full ESD protection. There are 50 S.E.P. packages per insert. The outer box is constructed
from corrugated cardboard and has a conductive carbon coating inside to dissipate any electrostatic
charge.
Figure 7. Intel® Celeron Processor Shipping Box — Exploded View
Static-
Dissipative
Insert
S.E.P.P.
Shipping Box

Figure 8. Intel® Celeron Processor Shipping Box — Assembled View
2.4.2 S.E.P. Package Handling Precautions for ESD Protection

The S.E.P. package processor must be unpacked at ESD workstations. Electrical fields are able to
penetrate electrical devices. An ungrounded person handling a component or computer board in a
non-static shielding container can cause a large charge to be transferred through the container into
the sensitive electronic device.
Eliminating static electricity in the work place is accomplished by grounding operators, equipment
(including the use of dissipative table mats) and parts (components and computer boards).
Grounding prevents static charge buildup and electrostatic potential differences. Electrical field
damage is averted by transporting products in special electrostatic shielding packages (i.e.
antistatic or dissipative carriers). Refer to the Packaging Databook (order number 240800) for
detailed information, guideline and recommendations on proper precautions against component
damage due to ESD. The Packaging Databook (order number 240800) also contains information on
package handling, electrical overstress and other information.
2.4.3 Package Handling

The package is not meant to survive severe mishandling. When handling material, it is
recommended that clean, lint free gloves or finger cots are worn to ensure the S.E.P. packages are
free from contaminates. Also, avoid contact of foreign material with the substrate edge fingers.
Dropping the processor from a workstation table top to the floor can cause processor contamination
or damage.
Avoid S.E.P. package substrate deflections induced during handling and/or assembly. The S.E.P.
package cannot exceed 0.160” deflection as measured from the end of the substrate in the direction
of the heatsink and 0.080” deflection as measure from the end of the substrate in the direction away
from the heatsink.
2.4.4 Package Enabling

Intel has provided reference designs for the enabled components which are utilized with the Intel
Celeron processor in the Basic PC systems. The enabled components include, Retention
Mechanism, heatsink, thermal interface material, and heatsink attach clip. The paragraphs below
describe the handling of each of these components during integration.

2.4.5 Retention Mechanism

The retention mechanism is used to guide the S.E.P. package and heatsink assembly into the Slot 1
connector and when fully seated, provides structural support. Insertion force of a S.E.P. package
and heatsink assembly into a connector with a retention mechanism is 35 lbs. maximum. Extraction
force in the same configuration is a maximum of 25 lbs.
System mounting of retention mechanism is mounted on the primary side of planar. Installation and
removal of the retention mechanism utilizes normal tools such as Phillips screwdriver, pliers, and
Allen wrench. Caution must be taken not to damage the motherboard or S.E.P. package during
retention mechanism installation or removal.
2.4.6 Thermal Interface Material

The purpose of the thermal interface material is to assure good heat transfer between the S.E.P.
Package and the unit heatsink. This material can be applied by the heatsink supplier. This material
is typically applied by the heatsink supplier. This material may/may not be applied by the heatsink
vendor. Additionally, a plastic cover may/may not be applied over the thermal interface material to
protect it during shipping. If the heatsink has thermal interface material with a protective plastic
cover, ensure that this protective cover is removed prior to attaching the heatsink.
2.4.7 Heatsink and Heatsink Attachment

The heatsink attachment mechanism must not induce permanent stress or flex on the S.E.P.
package substrate with the exception of a uniform load not to exceed 20 psi compressive loads to
maintain the heatsink to processor thermal interface. Metal attach mechanisms, like heatsink clips,
must have sharp edges removed to avoid damage or create any contact wear points on the S.E.P.
package substrate. The metal attach mechanisms also must be shielded from electrical contact with
the S.E.P. package substrate. The metal attach mechanisms also must be shielded from electrical
contact with the S.E.P. package substrate with the exception of the S.E.P. package substrate through
holes.
During heatsink attach, handle all components with clean gloves. It is recommended that the units
be removed singly from the packaging as needed to attach heatsinks. It is recommended that an
operator should grip the substrate by the upper edges. Contact with bottom edge fingers (i.e., gold
fingers) should be avoided to prevent contamination of damage to the gold fingers.

2.5 S.E.P. Package Quality and Reliability

The S.E.P. package was submitted to normal reliability stress evaluations. Table 1 lists the
environmental test conditions which were used in the study.
After each of the stress conditions described in Table 1, electrical end-point testing was performed
to verify that the processor under test had not degraded. All processors under stress passed after
every environmental stress test exposure.
Table 1. Environmental Test Conditions for S.E.P. Package
Test Condition Duration Test Configuration
Temperature 1000 cycles

-40°C to 85°C S.E.P. Package
Cycling 15 min soak at each extreme
5 Hz to 20 Hz
0.01 g2/Hz sloping to S.E.P. Package, Slot 1
Random 0.02 g2/Hz (flat) 10 min/axis Connector, and Retention
Vibration
20 Hz – 500 Hz Mechanism
0.02 g2/Hz (flat)
Trapezoidal 50G S.E.P. Package, Slot 1
Mechanical Three drops in each of six
Velocity change of Connector, and Retention
Shock directions
170 in/sec Mechanism
Humidity 85%RH: 55oC 500 hours S.E.P. Package
2.6 Package Change Control

New products at Intel undergo development phases prior to production. Once the product has gone
through the development phases and entered into production, it is still possible that changes may
occur. A change is any modification that could impact performance, appearance, quality, reliability,
functionality, interchangeability, cleanliness, handling, or manufacturability of the supplied
materials. This may apply to any change in the raw materials used directly or indirectly in the
supplier's manufacturing process (including changing suppliers), any change in the manufacturing
flow, or any change in handling or shipping materials used internally or in shipment to Intel.
In the event that a change is made to the S.E.P. package, Intel will qualify the changed material
prior to approving the change for implementation. For any form, fit or function change, Intel will
notify customers using the same criteria used for other Intel components.
2.7 S.E.P. Package Marking

In order to identify S.E.P. package (and processor) history, each unit is marked with the lot number
for factory planning and logistics, and shop floor control links to the actual units. See Figure 9 for
details on marking of the S.E.P. package.

Figure 9. S.E.P. Package Marking
Static White Silkscreen marks (pre-marked by material vendor)
Sub-Brand mark
®
i m ©’98
Dynamic laser mark area (marked by Intel)
Dynamic Laser Marks
GRP1LN1 contains: Lot number

GRP1LN1 GRP1LN2
GRP1LN2 contains: S Spec Number or QDF Number
GRP2LN1 GRP2LN2
GRP2LN1 contains: Speed/Bus Frequency.
GRP2LN2 contains: Factory of Origin
2.7.1 Package Core Processor Marking

The core processor on the primary side of the S.E.P. package is also marked with information for
traceability. However, the markings will not be visible when the heatsink is attached.
2.8 Package Processor Return Policy

The processor should be returned directly to the local Quality Support Center via your components
Customer Quality Engineer (CQE) contact or sales contact. Within the U.S., the S.E.P. package can
also be returned via the 1-800-628-8686 (Intel hotline). The following procedure is only applicable
for returns needing technical analysis. All other returns need to be handled through the normal
RMA process. The processor should be returned in the condition which it was purchased (heatsinks
should only be left on boxed processors purchased with heatsinks). A description of the failure
mode should be enclosed. S.E.P. package returns will follow normal microprocessor FACR process
and throughput commitments.
Processor should be returned in appropriate packing

• Incorporate ESD dissipative boxes or bags
• Place unit into an ESD bag and wrap unit with at least two to four inches of wrapping. For
multiple returns, ensure that individual units are wrapped and cushioned with at least two to
four inches of bubble wrap or foam between units and between unit and outer box.

3.0 Processor Enabling Mechanism

The Slot 1 connector and S.E.P. package do not provide the needed mechanical integrity during
transport and sever movement; therefore, other mechanical solutions are required to secure the
S.E.P. package in the Slot 1 connector. Intel has enabled two such solutions (commonly known as
RM—retention mechanisms); other solutions are not discussed in the document. Although Intel has
conducted shock and vibration testing and validation on the solution mentioned in this document,
customers need to perform validation for their system configuration.
The main difference between the S.E.P. package and the S.E.C. cartridge in terms of the retention
mechanism is that the S.E.P. package does not utilize a cartridge to surround the substrate. Instead,
the S.E.P. package utilizes special heatsink geometry that interfaces with the RM’s as shown in
Figure 11. In the S.E.C. cartridge design the deflecting features that ‘snapped’ into place were
integrated into the cartridge design. In the S.E.P. package design the deflecting elements are the
RM’s and the motherboard itself while the S.E.P. package and heatsink assembly is rigid.
The two RM configurations are the captive fastener RM and the plastic fastener RM. The captive
fastener RM consists of the Captive Fastener Retention Mechanism (CFRM), the Heatsink
Assembly (HSA) and the Retention Mechanism Assembly Mount (RMAM). The plastic fastener
RM consists of the Plastic Fastener Retention Mechanism (PFRM), the Heatsink Assembly (HSA)
and the plastic fasteners. The RM holds the processor into the Slot 1 connector during mechanical
shock and vibration. The RMAM attaches the RM to the motherboard for the CFRM, while the
plastic fasteners perform the same function for the PFRM. The RM holds the S.E.P. package and
Heatsink Assembly by integral heatsink features that must be present for the RM to function
correctly. The required features in the heatsink design is detailed in the Single Edge Processor
Package Retention Mechanism, Heatsink attachment, and Heatsink Functional Specification
(doc # 711696). Please note that example heatsinks are shown throughout Section 3.0, Section 4.0,
and Section 5.0. Heatsinks and thermal solutions beyond the specific retention features are the
responsibility of the OEM manufacturer. Figure 10 provides the basic motherboard footprint for the
Slot 1 connector, RMAM and RM pieces. Mechanical dimensions and other structural information
for the RMs are located in the Slot 1 Connector Design Guidelines and the Mechanical Support
Pieces for S.E.P. Package, both located at the Intel website. Intel does not supply the RMs or
equipment described in this application note. Refer to the Intel Celeron Processor Support
Components Guide, located at the Intel website for supplier information. From Chapter 3 onward,
unless otherwise specified, the heatsink and support mechanical pieces refer to Intel’s enabled
solution.
Figure 10. Motherboard Footprint for RM and Slot 1 Connector
Retention Mechanism Mount Through Holes

4X 0.140”
or 4X 0.159”
hole size based on RM type
Slot 1 Connector

Figure 11. S.E.P. Package Before Insertion into Retention Mechanism

Figure 12. S.E.P. Package Installed in a Retention Mechanism (RM) with Plastic Fasteners
3.1 Slot 1 Connector

The Slot 1 connector (Figure 13) is a 242 contact, 1.0 mm pitch, edge connector intended for the
S.E.C. cartridge and S.E.P. package technologies. The Slot 1 connector mounts on the motherboard
and allows insertion and removal of the processor from the motherboard (see Figure 11 and
Figure 12). Mechanical, electrical and other technical details of the Slot 1 connector can be found
in the Slot 1 Connector Guidelines, as located on the Intel website.
Figure 13. Slot 1 Connector
B1 73 Contact Pairs 48 Contact Pairs B121
A1 A121
Top View
Bottom View
001008

3.1.1 Other Connector Form Factors: Restrictions and Requirements

The Slot 1 connector is only one of the possible connector solutions for the S.E.P. package. Any
other solution for providing the electro-mechanical connection between the processor and the
motherboard must meet the processor specifications as defined in the Intel Celeron Processor at
266MHz and 300MHz Datasheet.
3.2 Retention Mechanism
3.2.1 Retention Mechanism Mechanical Description

The retention mechanism (RM) holds the S.E.P. package in the Slot 1 connector during mechanical
shock and vibration. The RM is symmetrical; identical parts can be installed at either end of the
Slot 1 connector to receive the S.E.P. package. The RM comes in two styles described in the next
two sections. The Plastic Fastener RM uses push pin plastic fasteners which uses a push/pry
assembly/disassembly process. The Captive Fastener RM utilizes the Retention Mechanism Attach
Mount (RMAM) and a Phillips screwdriver assembly and disassembly process.
Correct orientation of the S.E.P. package is achieved when the ‘substrate key’ and the Slot 1
connector key are engaged. The RM also aids in processor alignment to the Slot 1 connector during
insertion of the processor.
The S.E.C. cartridge uses the cartridge latch to lock in with the RM, while the S.E.P. package relies
on heatsink notch features for RM engagement. The RM contains draft angles, lead-ins and
chamfers for smooth travel of the processor down the RM posts and into the connector.
3.2.2 S.E.P. Package only Retention Mechanism with Plastic Fastener

Description
The retention mechanism with plastic fasteners comes in as an assembly (Figure 14). The total part
count for one complete retention mechanism assembly is six: two retention mechanism’s and four
plastic fastener assemblies.
Figure 14. S.E.P. Package Only Retention Mechanism with Plastic Fastener

3.2.3 S.E.P. Package only Retention Mechanism with Captive Fasteners

Description
The captive fastener version of the retention mechanism comes as an assembly with two brass
captive nuts installed into integral clip features on the RM (Figure 15). The total part count for one
complete retention mechanism assembly is four (two retention mechanisms with two captive nuts
each and two retention mechanism attach mounts).
Figure 15. S.E.P. Package Only Retention Mechanism with Captive Fastener
3.2.4 Mechanical Retention Mechanism Attach Mount

The Retention Mechanism Attach Mount (RMAM) is a small assembly that is part of the
mechanical support pieces for RM attachment to the motherboard (see Figure 16). The RMAM
holds the retention mechanism to the motherboard using the captured nuts on the retention
mechanism. The RMAM requires approximately 44 lbs-f to insert into the motherboard. The
RMAM studs are threaded and are fabricated from brass, and the bridge is molded plastic. The
RMAM is designed to be inserted from the bottom of the motherboard. See the Mechanical
Support Pieces for SEC Cartridge Processors for further mechanical details of the RMAM that are
not presented here. (see Figure 17 which provides details on RMAM and motherboard interaction,
providing depths underneath the motherboard itself).

Figure 16. Retention Mechanism Attach Mount Assembly
Isometric View
Not to Scale
Note: RMAM studs are threaded for use with the RM captured nuts.
Figure 17. Retention Mechanism Attach Mount Motherboard Interaction Details
For proper interference fit, the retention mechanism attach mount studs
must match the motherboard hole diameter. There are two RMAM and
motherboard diameters (0.140 +0.002/–0.001 or 0.159 +0.002/–0.001).
Motherboard should be 0.062 nominal
Approx 0.060
Retention mechanism attach mount bridge Approx 0.139
Clearance between motherboard and

retention mechanism attach mount bridge is approx 0.060
Drawing not to scale.

All dimensions in inches.
retmech1.vsd
Note: The area underneath the retention mechanism attach mount bridge can be used for routing and
traces, but should be considered a keepout zone for components.
Note: The trace keepout for all layers around the holes should be 0.350 inch diameter.

4.0 Motherboard Integration Manufacturing Guidelines

The S.E.P. package and enabling mechanism (RM) introduce manufacturing concerns and issues
that differ from the S.E.C. cartridge and previous generations. It is important to understand the
impact to manufacturing for each of these parts. All parts are recommended as a robust solution for
the S.E.P. package.
This section addresses issues surrounding motherboard manufacturing and preparation. Section 5.0
addresses issues surrounding system integration. At each step, manufacturing information and third
party contacts for specific manufacturing tooling and hardware will be provided when available.
Utilizing the S.E.P. package technology requires manufacturing steps which are different from
traditional OEM motherboard and systems manufacturing. The S.E.P. package requires a Slot 1
connector and retention mechanism option (plastic fastener). The heatsink assembly for the S.E.P.
package may be attached using a special fixture or by a manual process. Motherboard and systems
manufacturing should carefully evaluate the integration of the processor and mechanical support
pieces with respect to the manufacturing environment.
4.1 Introduction and Suggested Integration Flow

Table 2 and Figure 18 provide the overall list of materials and suggested manufacturing flow for the
integration of the S.E.P. package (and RM) into the motherboard and system manufacturing flow.
Motherboard related items highlighted in each are covered in this section. The other materials and
manufacturing steps are covered in Section 5.0, “System Integration Manufacturing Guidelines” on
page 23.
As shown in Figure 18, it is recommended to perform Slot 1 connector installation and RMAM (if
applicable) mounting during the motherboard manufacturing process. The Slot 1 connector mounts
similar to other edge connectors (PCI, ISA, AGP), but has specific requirements to ensure correct
integration with the other MSP. The RMAM is a bottom-side integration piece; a specific press is
available for high volume manufacturing environments.
Table 2. Intel® Celeron™ Processor Enabled Mechanical Solution and Materials List
Assembly Type Quantity per Board and System
Board Assembly
Slot 1 Connector
1
Retention Mechanism Attach Mount (if using an S.E.P.
2
Package retention mechanism with Captive Fasteners)
System Assembly
Heatsink 1
Thermal Interface (Chomerics 70-10) 1
Heatsink Clip 1
Retention Mechanism 2

Figure 18. Suggested Motherboard/System Integration Manufacturing Flow (Bolded Boxes

Covered in this Section)
Attach RM to
Insert Slot 1 Insert RMAM if Motherboard,
Connector using Captive Nut Captive Nuts or
RM Plastic Fasteners
Remove Thermal Attach Heatsink to

Interface Material S.E.P. Package
Protective Cover Using Heatsink Clip
Ensure Heatsink Insert Heatsink

Continue System and Processor are and Processor
Assembly Engaged in RM into RM and Slot
and Slot 1 1 Connector
manflow1 vsd
4.1.1 Recommended Slot 1 Connector Insertion Steps and Requirements
Note: Only use Slot 1 connectors which are stored correctly in the supplier packaging. It is not
recommended to use components which are loose or stacked without completely inspecting the
component leads for alignment.
1. Pick the Slot 1 connectors, one at a time, from the supplier packaging and ensure that no
contact is made with the lead area of the component. Supplier packaging should be placed on
the line so the retention features do not rest on the packaging material.
2. Place the Slot 1 connectors on the board so that all the leads are within their corresponding
PTH (Plated Through Hole) using the retention features as a guide, and allow it to rest on the
retention feature before the application of any insertion force.
3. Ensure that the Slot 1 connector stands vertically, that is, does not tend to lean to one side or
another and sit evenly on the board, (if this happens, remove the Slot 1 connector and inspect
the lead alignment). Note: Depending on the vendor, the Slot 1 connector may not stand
vertically and will have to be held in place by hand.
4. Apply uniform insertion force to 2 positions on the Slot 1 connector (1/3 and 2/3 along the
length of the component). Ensure that the Slot 1 connector enters the board smoothly. An
operator can listen for the sound of a lead bending on the substrate.

Figure 19. Slot 1 Connector, Retention Features Highlighted
Component Retention Features
Figure 20. Slot 1 Connector Mounted in Motherboard
Apply Insertion Force as Indicated
Retention Feature Printed Circuit Board
Figure 21. Recommended Process Capability to Ensure Correct Interaction of S.E.P. Package
and Mechanical Support Pieces
0 .0 1 5 in c h e s
m a x tilt
U n a c c e p ta b le – N o le a d p ro tru s io n
S h o r t A x is
0 .0 1 5 in c h e s
m a x tilt
S lo t 1 C o n n e c to r
U n a c c e p ta b le – N o le a d p ro tru s io n
L o n g A x is

Figure 22. ATX Motherboard with Slot 1 Connector and RMAM (for captive nuts only) Installed
Slot 1 Connector
Retention
Mechanism
Attach Mount
(if captive nuts
are used)
4.2 Retention Mechanism Attach Mount Installation

For the RMAM to work correctly, the attach mount stud must be fully inserted into the
motherboard with a snug fit. The attach mount stud must be straight (normal or perpendicular) to
the motherboard for purposes of attaching Retention Module. Figure 24 shows a motherboard with
Slot 1 connector and RMAM installed. Figure 23 and Figure 24 show detail of the installed
RMAM.
4.2.1 Attach Mount Assembly Criteria

The RMAM studs should be protruding through the board on the top side as in, Figure 22,
Figure 23, and Figure 24. The RMAM studs are designed to contact the motherboard hole in four
locations in the hole, rather than around the entire circumference of the motherboard itself. There
should be no cracking of the laminate around the holes through which the attach mount studs
protrude. Cracks will typically be emanating radially from the hole edges. Cracks would occur due
to an incorrect assembly that uses either too much force, incorrectly aligned studs, incorrectly sized
holes in motherboard or incorrectly manufactured RMAM.

Figure 23. Attach Mount Installed in Motherboard
Figure 24. Attach Mount Installed in Motherboard, Bottom View
4.2.1.1 HVM Enabled Procedures and Equipment for RMAM

installation
Intel has enabled a set of machinery for efficient installation of the RMAM in High Volume
Manufacturing (HVM) environments. The machinery is a press which performs the insertion of the
RMAM into the motherboard, from the bottom side. The machine is pneumatically driven, and
requires motherboard specific fixtures to properly hold the motherboard and RMAM. The machine
can also be used to rework (i.e., remove) an incorrectly processed RMAM. The Pentium II
Processor Suppliers Guide, provides a list of suppliers for equipment for HVM presses, and
fixtures.

5.0 System Integration Manufacturing Guidelines
5.1 Introduction and Suggested Integration Flow

Table 3 and Figure 18 provide the overall list of materials, manufacturing flow for the integration
of the S.E.P. package and RM into the motherboard, and system flow. System integration related
items highlighted in each are covered in this section. The other materials and manufacturing steps
are covered in Section 4.0, “Motherboard Integration Manufacturing Guidelines” on page 18.
Table 3. Intel® Celeron™ Processor Enabled Mechanical Solution and Materials List
Assembly Type Quantity per Board and System
Board Assembly
Slot 1 Connector
Retention Mechanism Attach Mount 1
Retention Mechanism Attach Mount (if using an S.E.P. 2
Package retention mechanism with Captive Fasteners)
System Assembly
Heatsink 1
Thermal Interface 1
Heatsink Clip 1
Retention Mechanism 2
Figure 25. Suggested Motherboard/System Integration Manufacturing Flow (Bolded Boxes

Covered in this Subsection)
Attach RM to
Insert Slot 1 Insert RMAM if Motherboard,
Connector using Captive Nut Captive Nuts or
RM Plastic Fasteners
Remove Thermal Attach Heatsink to

Interface Material S.E.P. Package
Protective Cover Using Heatsink Clip
Ensure Heatsink Insert Heatsink

Continue System and Processor are and Processor
Assembly Engaged in RM into RM and Slot 1
and Slot 1 Connector
manflow2.vsd
5.2 Heatsink Attachment to the Substrate

The S.E.P. package is enabled for heatsink clip attachment of thermal solutions only. Two methods
for attaching the heatsink clip are described in this section, they are the manual-based technique
and the tool-fixture-based technique. The required parts for either process are the S.E.P. package,

the heatsink clip and the heatsink. The environmental requirements are that all parts are placed on
static free bench using proper operator grounding and ESD mat. Thermal solutions must provide
adequate thermal conduction paths to remove the heat generated by the processor and dissipate that
heat into the system environment. The system environment must then ensure adequate overall
circulation to properly cool the processor and other internal components
5.2.1 Manual Heatsink Attachment Method
Note: Figure 26 through Figure 30 are shown for illustration purpose only. The operator should always
exercise proper handling procedures and wear protective gloves. Do NOT touch the Edge Fingers.
The process for installing the heatsink manually is depicted in the Figure 26 through Figure 30.
1. Carefully insert all four heatsink clip legs into S.E.P. package (Figure 26). Note that the clip
base must be located on the non-primary side (Figure 27)
Figure 26. Insert Heatsink Clip Legs
Figure 27. Clip Base on Secondary (Non-Primary) Side
2. Fully engage two legs of the clip into the heatsink (Figure 27).

Figure 28. Engage Two Legs of the Clip into Heatsink
3. Grasp the heatsink clip assembly between the clip base and the heatsink (Figure 28). Do not
bend or apply pressure directly to S.E.P. package.
4. Using a nonmetallic bar stock or screw driver, push the remaining two clip legs into the
heatsink (Figure 29). Caution: Take care not to contact passives or scratch S.E.P. package
when using screw driver or bar stock.
Figure 29. Grasp Heatsink Clip Assembly Between Clip Base and Heatsink
5. Verify that all the feet on the clip are fully engaged and seated on the heatsink (Figure 30).

Figure 30. Verify All Feet Are Fully Engaged
Reverse the process steps to remove the clip from the S.E.P. package.
5.2.2 HVM Enabled Procedures and Equipment for Production Heatsink

Attachment
Intel has enabled a fixture for efficient heatsink and clip attachment to the S.E.P. package in High
Volume Manufacturing (HVM) environments. The machine installs the four legs of the heatsink
clip simultaneously, reducing the overall time for heatsink installation. Through the actuation of a
lever, the machine applies force to the heatsink clip in such a way that the S.E.P. package and
heatsink can be lowered down onto the legs in a top-down fashion. When the lever is released the
clip legs relax and the assembly is ready to be installed onto the motherboard. Note that this
equipment can be automated if high volume production requires higher throughput.
1. Lower the handle of the fixture. Raising the head of the plunger above the nest.
Figure 31. HVM Heatsink Attachment Fixture
Head of Plunger
Nest
Handle

2. Place a clip on the head of the plunger with the “legs” of the clip pointing to the front and rear
of the fixture. Rotate the clip 90o securing the clip on the plunger head. The clip has a mylar
backing – Do NOT remove the mylar backing. The clip seats against the S.E.P package
substrate. If there is no mylar backing, an electrical short condition could arise when the metal
clip makes contact with traces.
Figure 32. Place Clip on Fixture
3. Raise the handle of the fixture lowering the clip into the nest. This action pushes the legs
together and allows the S.E.P. package and the heatsink to easily fit onto the clip
4. Slip the S.E.P. package over the legs of the clip. A slight rocking motion maybe required.
Figure 33. Clip Rotated and Lowered into Nest

5. Apply thermal interface material on core package. Note: skip to step #6 if thermal interface
material is provided with the heatsink.
6. Slip the heatsink over the legs of the heatsink clip. Note: If the thermal interface material is
attached to the heatsink, remove any protective backing to expose the interface material.
Ensure that a thermal interface has been applied before you assemble the heatsink.
Figure 34. S.E.P. Package Placed Over Clip Legs
Figure 35. Heatsink Placed Over Clip Legs

Figure 36. Lower Handle to Raise Plunger and Assembly
7. Lower the handle of the fixture, raising the head of the plunger and the finished assembly
above the nest. Rotate the assembly 90o to remove it from the plunger.
5.2.3 Manual Installation of the Captive Fastener Retention Mechanism

To install the captive fastener RM simply orient the RM at either end of the Slot 1 connector. The
parts are symmetrical and fit either end of the connector. Using a Phillips screw driver rotate each
of the four captive nuts in a clockwise direction while pushing down slightly to start the thread
engagement (see Figure 37). Tighten to 6 psi. Do not over-tighten as damage to the brass nuts could
occur.
Figure 37. Manual Installation of Captive Nut Fastener

5.2.4 Manual Installation of the Plastic Fastener Retention Mechanism

Prepare the RM’s by first inserting the plastic fastener assemblies into each of the four holes. Be
sure that the white plastic pins are raised up from the black plastic component of the push-pin
assembly, otherwise it may be difficult to insert the assembly into the motherboard hole. Next
install the RM’s onto the motherboard at both ends of the Slot 1 connector. Using the push-end of
the insertion/removal tool apply a slight down ward force until the white plastic component of the
push-pin is seated all the way down against the assembly (as shown in Figure 38). Repeat this
process for all four of the pins.
Figure 38. Manual Installation of Plastic Fastener
5.2.5 Insertion of S.E.P. Package

Align the notch of the processor substrate with the notch on the Slot 1 connector. Insert the heatsink
and substrate into the guide rails along the retention mechanism making sure to install the heatsink
into the retention mechanism and the processor substrate into the Slot 1 connector. Press firmly (but
not with excessive force) on the top of the heatsink until you hear a click as the retention
mechanism pops back, firmly locking the processor into the Slot 1 connector. Do not bend the
processor package.
5.2.6 Other System and Motherboard Assembly Issues

For some chassis designs (e.g., ATX), the S.E.P. package may need to be inserted into the Slot 1
connector before the motherboard is assembled into the chassis. Also, the power supply unit (PSU)
may need to be installed after the motherboard in placed into the chassis. It is important to ensure
adequate distance is allowed between the S.E.P. package and the PSU during installation, removal
and shock/vibration environmental testing. Also, the memory modules (SIMMs or DIMMs) may
need to be inserted before the S.E.P. package; the spacing between the heatsink support base and
memory modules should be evaluated. These types of issues should be addressed as the S.E.P.
package processor is evaluated for introduction to the manufacturing flow.

5.3 Removal of S.E.P. Package and Mechanical Support Pieces

Once installed, it is possible to disassemble the processor and retention components. It is
recommended to follow the correct procedure as outlined in this section. Improper use of force or
effort can damage the processor, enabling components or motherboard. Pushing on the
motherboard or components during processor removal can cause damage.
The first step is to remove the S.E.P. package and heatsink assembly. The second and last step of
disassembly is to remove the RM posts. How these posts are removed is determined by which type
of post is used—captive fastener type or plastic fastener type.
5.3.1 Removal of the S.E.P. Package

To remove the S.E.P. package grasp the processor substrate/heatsink assembly by the heatsink.
Apply pressure on the tab of one RM post while pulling up on one end of the S.E.P. package and
heatsink assembly (See Figure 39). It is very important to only work on one end of the processor.
With sufficient force the RM post should release the S.E.P. package assembly (see Figure 40). Once
one end of the processor is free from the RM it will be possible to rotate that end up and out of the
connector and RM.
Note: The retention mechanisms provide firm mechanical support for the processor. If you find that
considerable force is required to remove the processor, consider wearing gloves to protect your
hands and take care to keep your hands away from any metal edges on the chassis and processor
package when de-installing the processor from the retention mechanisms. Loosening or removing
one of the retention mechanisms greatly reduces the force required to remove the processor. See
Section 5.3.2 and Section 5.3.3 for removal instructions.
Figure 39. Removing S.E.P. Package from RM
Figure 40. Rotate the S.E.P. Package Out of the Slot 1 Connector

5.3.2 Removal of the Captive Fastener Retention Mechanism

The removal of the Captive Fastener RM is the exact reverse of the installation process. Simply use
a Phillips screw driver in a counter-clockwise direction on each of the four captive nuts. See the
assembly section for details.
5.3.3 Removal of the Plastic Fastener Retention Mechanism

To increase the ease of disassembly, a tool has been developed to assist in the manual removal, as
well as insertion, of the plastic pin fasteners. This tool is shown in Figure 41. Simply slide the
forked head under the pin, pull up gently, and rotate the pin up as show in through Figure 42.
Avoid touching the motherboard with the extraction tool so as not to damage any components or
traces. Once the pins are raised, the RM can be removed (see Figure 45). The push pins and plastic
fastener sleeve are not meant to be reused.
If no tool is available, removal of the motherboard from the chassis may be required. Once the
motherboard is removed and while viewing the underside of the motherboard, use the tip of a
ballpoint pen or other tool to carefully push the bottom of the white pin insert out of the black
plastic fastener sleeve. Once the white insert pins are removed, carefully push the black sleeve
portion of the fastener out of the motherboard to free the retention mechanism
Figure 41. Plastic Fastener Installation/Extraction Tool

Figure 42. Slide Head Under Pin
Figure 43. Pull Up Gently

Figure 44. Rotate Up
Figure 45. Removing RM with Plastic Fasteners
5.4 Reuse of Processor and Enabling Components

The processor and mechanical support pieces are robust components, meant for use in PC OEM
manufacturing and system environments. The processor is “reusable” within the specification
limits defined in the Intel Celeron™ processor at 266 MHz and 300 MHz datasheet (order number
243658). The mechanical support pieces can be removed from the motherboard as described above.
Removal, though, is NOT recommended for the Slot 1 connector and RMAM. Each of these pieces
interacts with the motherboard material and could damage the board if removed incorrectly. Also,
if removed and intended to be reused within specification limits, each mechanical piece should
receive a thorough inspection to ensure mechanical integrity.

6.0 Boxed Intel® Celeron™ Processor Integration

Guidelines
The Intel Celeron processor is also offered as a boxed processor. The term “boxed processor” refers
to processors specifically designed and packaged for system integrators, who use off-the-shelf
system components to assemble personal computer systems. System integrators use varied
combinations of chassis, power supplies, motherboard form factors, and peripherals. This provides
for a wide variety of thermal environments in which the processor must operate within thermal
specifications. For this reason, boxed processors include an appropriate cooling solution. The
boxed Intel Celeron processor includes an attached active fan heatsink. Boxed processors also
come with installation instructions and any necessary hardware.
6.1 Boxed Processor Fan Heatsink

For the boxed Intel Celeron processor, the fan heatsink is already attached to the processor before
the unit is shipped, using a high quality thermal grease and a metal clip. Specifications for the
boxed Intel Celeron processor can be found in the Intel® Celeron™ Processor at 266MHz and
300MHz Datasheet.
The fan heatsink consists of two pieces: an extruded aluminum heatsink base and a plastic fan-
shroud that attaches to the base. The shroud is made of a molded high grade plastic.
The fan heatsink requires clearance around the unit for proper airflow and cooling efficiency. The
fan heatsink also requires the air-intake temperature to not exceed a specified limit, in order to keep
the processor case below its maximum temperature. Clearance requirements and air-intake
temperature requirements are defined in the Intel® Celeron™ Processor at 266 MHz and 300 MHz
Datasheet.
6.2 Boxed Processor Fan Power Cable

The fan heatsink also requires power to drive the integrated fan to provide needed airflow. A fan
power cable is included with the boxed Intel Celeron processor and connects the fan power
connector to a power header on the motherboard. Specifications and location of the fan power
header on the motherboard are defined in the Intel® Celeron™ Processor at 266 MHz and 300
MHz Datasheet.
6.3 Boxed Processor System Integration Manufacturing

Guidelines
Table 4 and Figure 46 provide the overall list of materials and manufacturing flow for the
integration of the boxed Intel Celeron processor and support pieces into the system manufacturing
flow.

Table 4. Boxed Intel® Celeron™ Processor System Assembly and Material List
Assembly Type Quantity Per System
System Assembly
Processor with Attached Fan Heatsink 1
Fan Power Cable 1
Retention Mechanisms1 2 (Symmetrical)
Slot 1 Motherboard 1
NOTES:
1. Retention Mechanisms are not included with the boxed processor, and are supplied to system integrators by
motherboard vendors with the motherboard products intended for system integrator use.
Figure 46. Suggested System Integration Manufacturing Flow
Install Proper Remove Passive Insert Processor into

Retention Mechanism Slot 1 Connector and
Heatsink Support
into Motherboard Retention Mechanisms
Continue System Plug Fan Power

Integration Per Cable Into Fan
Motherboard Heatsink and
May be required Instructions Motherboard
6.3.1 Pre-Installation Preparation

1. Be sure that the motherboard kit includes retention mechanisms that specifically support the
Intel Celeron processor. Retention mechanisms designed only for the Pentium® II processor
should not be used with the Intel Celeron processor as damage to the processor and
motherboard may occur. Make sure that the motherboard kit includes instructions for installing
the retention mechanisms.
2. Be sure that the boxed Intel Celeron processor kit includes:
•One processor with fan heatsink attached
•One power cable
3. Place the motherboard on an ESD workbench (not in a chassis). Be sure that the motherboard
is bare (that is, no system memory, cables, or cards are installed). If the motherboard has an
installed passive heatsink support, it may be left in the motherboard or removed if necessary,
following the manufacturer’s removal instructions.
6.3.2 Motherboard Preparation – Installation of the Retention Mechanisms

Motherboards for system integrators should be shipped with retention mechanisms and include
instructions on installing the retention mechanisms. Some Slot 1 motherboards may include
retention mechanisms that support the Pentium II processor also. Make sure that the retention
mechanisms being installed specifically support the Intel Celeron processor. Without proper
mechanical support, the boxed Intel Celeron processor may be damaged, and the boxed processor
warranty is void.

Follow the motherboard instructions for installation of the Intel Celeron processor retention
mechanisms.
6.3.3 Installing the Boxed Processor
Figure 47. Inserting the Boxed Processor
1. Align the notch of the processor substrate with the notch on the Slot 1 connector. Install the
processor into the Slot 1 processor connector by pressing firmly (but not with excessive force)
on the top of the processor substrate and heatsink (See Figure 47). Make sure to install the
heatsink into the retention mechanism and the processor substrate into the Slot 1 connector. Do
not bend the processor package.
Figure 48. Connecting the Boxed Processor Fan Power Cable
PC-3872

2. Attach the small end of the fan power cable to the three-pin connector on the processor, and
then attach the large end to the three-pin power header on the motherboard. Consult the
motherboard documentation to determine the connector location.
6.3.4 Removing the Boxed Processor
Figure 49. Removing the Boxed Intel® Celeron™ Processor
Pull one retention mechanism away from the processor with one hand while rotating the processor
out of the Slot 1 connector with the other (See Figure 49). The retention mechanisms provide firm
mechanical support for the processor.
Note: If considerable force is required to remove the processor, consider wearing gloves for protection
and take care to keep hands away from any metal edges on the chassis and processor package when
de-installing the processor from the retention mechanisms. Loosening or removing one of the
retention mechanisms greatly reduces the force required to remove the processor. To loosen
retention mechanisms with brass captive fasteners, simply unscrew the nuts with a screwdriver.
Removing retention mechanisms with plastic fasteners requires the removal of the motherboard
from the chassis. Once the motherboard is removed and while viewing the underside of the
motherboard, use the tip of a ballpoint pen or other tool to carefully push the bottom of the white
pin insert out of the black plastic fastener sleeve. Once the white insert pins are removed, carefully
push the black sleeve portion of the fastener out of the motherboard to free the retention
mechanism. Do not reuse the push pins.

UNITED STATES, Intel Corporation
2200 Mission College Blvd., P.O. Box 58119, Santa Clara, CA 95052-8119
Tel: +1 408 765-8080
JAPAN, Intel Japan K.K.

5-6 Tokodai, Tsukuba-shi, Ibaraki-ken 300-26
Tel: + 81-29847-8522
FRANCE, Intel Corporation S.A.R.L.

1, Quai de Grenelle, 75015 Paris
Tel: +33 1-45717171
UNITED KINGDOM, Intel Corporation (U.K.) Ltd.

Pipers Way, Swindon, Wiltshire, England SN3 1RJ
Tel: +44 1-793-641440
GERMANY, Intel GmbH

Dornacher Strasse 1
85622 Feldkirchen/ Muenchen
Tel: +49 89/99143-0
HONG KONG, Intel Semiconductor Ltd.

32/F Two Pacific Place, 88 Queensway, Central
Tel: +852 2844-4555
CANADA, Intel Semiconductor of Canada, Ltd.

190 Attwell Drive, Suite 500
Rexdale, Ontario M9W 6H8
Tel: +416 675-2438
Printed in USA/96/POD/PMG

Mechanical Assembly and Customer Manufacturing Technology For S.E.P. Packages

Uploaded by

Copyright:

Available Formats

Mechanical Assembly and Customer Manufacturing Technology For S.E.P. Packages

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Mechanical Assembly and Customer Manufacturing Technology For S.E.P. Packages

Uploaded by

Copyright:

Available Formats

Mechanical Assembly and

Order Number: 243734-001

Application Note AP-826

Application Note AP-826 iii

iv Application Note AP-826

Application Note AP-826 v

1.1 Purpose of this Document

Intel website http://developer.intel.com/design/celeron/or http://www.intel.com

Application Note AP-826 1

2.0 Single Edge Processor Package

2.1 Package Terminology

2 Application Note AP-826

Figure 2. S.E.P. Package — Back or Secondary Side View

Other mechanical solutions are not investigated in detail in this document.

2.2 S.E.P. Package Design and Construction

2.2.1 Package Design

2.2.2 Package Substrate

Application Note AP-826 3

Pin A1 Pin A121

Detail provided in next figure.

Pin B121 Pin B1

4 Application Note AP-826

Figure 4. Substrate Edge Finger Contact and Key Detail

Pin A73 Pin A74

2.2.3 Processor Core Package Body Materials

Application Note AP-826 5

Figure 5. Example Processor Core (PLGA)

2.3 Package Assembly and Test

6 Application Note AP-826

2.4 Package Handling and Shipping Media

2.4.1 Intel Celeron Processor Shipping Media Description

Application Note AP-826 7

Figure 8. Intel® Celeron Processor Shipping Box — Assembled View

2.4.2 S.E.P. Package Handling Precautions for ESD Protection

2.4.3 Package Handling

2.4.4 Package Enabling

8 Application Note AP-826

2.4.5 Retention Mechanism

2.4.6 Thermal Interface Material

2.4.7 Heatsink and Heatsink Attachment

Application Note AP-826 9

2.5 S.E.P. Package Quality and Reliability

Table 1. Environmental Test Conditions for S.E.P. Package

Test Condition Duration Test Configuration

Temperature 1000 cycles

Humidity 85%RH: 55oC 500 hours S.E.P. Package

2.6 Package Change Control

2.7 S.E.P. Package Marking

10 Application Note AP-826

Figure 9. S.E.P. Package Marking

Static White Silkscreen marks (pre-marked by material vendor)

Dynamic Laser Marks

GRP1LN1 contains: Lot number

2.7.1 Package Core Processor Marking

2.8 Package Processor Return Policy

Processor should be returned in appropriate packing

Application Note AP-826 11

3.0 Processor Enabling Mechanism

Retention Mechanism Mount Through Holes