Tem Grids & Tem Support Films: Ted Pella, Inc
Tem Grids & Tem Support Films: Ted Pella, Inc
Tem Grids & Tem Support Films: Ted Pella, Inc
Reference / Finder
Grids Maxtaform Grids Veco Grids Athene Grids
Wide selection of reference, Selection of Rh coated grids. Selection of rigid grids. Selection of unique grids.
locator and micron index grids. Mesh, Honeycomb and Slot Mesh, Honeycomb and Slot
Page 17-18 Page 19 Page 20-24 Page 25-26
Carbon
Formvar
Grid
Carbon
Page 29-33
Grid
Form-
PELCO® Grids
The PELCO® grids are usually somewhat thicker than similar TEM PELCO® Grids
grids, but still maintain a good definition of the grid bars. The wide
Square Pitch µm Hole µm Bar µm %
rim on the PELCO® grids provides additional stiffness and minimizes
Mesh Transmis-
interfering with the sample when picking up and handling the grids sion
with tweezers. The popular PELCO® grids were introduced 44 years 50 508 425 83 70
ago (1968) and have found a large international user base in all dis- 75 339 284 55 70
ciplines of TEM. The grids have a shiny (smooth) finish on one side
100 254 204 50 65
and matt or dull finish on the other side. Comprehensive selection of
different grid styles is offered with a standard diameter of 3.05mm. 150 169 125 44 60
Available materials are Cu, Ni, Au, Al, Ti, Stainless Steel and Mo (for 200 127 90 37 50
high temperature applications). 300 85 54 31 40
Packaging: Standard Cu grids are 100 grids/vial, except specials 400 64 38 26 35
which are listed accordingly. Gold, Titanium, Molybdenum, Stainless
Steel and Aluminum are packaged 25 grids/vial. Special Grid Storage Boxes are available, even for the PELCO® Tabbed Grids.
Tabbed 50 Mesh: Pitch 508µm; Hole Width 425µm; Bar Width 83µm; Transmission 70%
3HGC50 PELCO® Tabbed Center-Marked Grids, 50 mesh, Copper 100/vial
Folding 50 Mesh
4GC50/50 PELCO® Folding 50/50 Mesh, Center-Marked Grids, Copper 100/vial
Tabbed 75 Mesh: Pitch 339µm; Hole Width 284µm; Bar Width 55µm; Transmission 70%
3HGC75 PELCO® Tabbed, Center-Marked Grids, 75 mesh, Copper 100/vial
3HGN75 PELCO® Tabbed, Center-Marked Grids, 75 mesh, Nickel 100/vial
Tabbed 100 Mesh: Pitch 254µm; Hole Width 204µm; Bar Width 50µm; Transmission 65%
3HGC100 PELCO® Tabbed Center-Marked Grids, 100 mesh, Copper 100/vial
3HGN100 PELCO® Tabbed Center-Marked Grids, 100 mesh, Nickel 100/vial
Tabbed 150 Mesh: Pitch 169µm; Hole Width 125µm; Bar Width 44µm; Transmission 60%
3HGC150 PELCO® Tabbed Center-Marked Grids, 150 mesh, Copper 100/vial
3HGN150 PELCO® Tabbed Center-Marked Grids, 150 mesh, Nickel 100/vial
Tabbed 200 Mesh: Pitch 127µm; Hole Width 90µm; Bar Width 37µm; Transmission 50%
3HGC200 PELCO® Tabbed Center-Marked Grids, 200 mesh, Copper 100/vial
3HGN200 PELCO® Tabbed Center-Marked Grids, 200 mesh, Nickel 100/vial
300 Mesh: Pitch 85µm; Hole Width 54µm; Bar Width 31µm; Transmission 40%
1GC300 PELCO® Center-Marked Grids, 300 mesh, Copper 100/vial
1GN300 PELCO® Center-Marked Grids, 300 mesh, Nickel 100/vial
1GG300 PELCO® Center-Marked Grids, 300 mesh, Gold 25/vial
Tabbed 300 Mesh: Pitch 85µm; Hole Width 54µm; Bar Width 31µm; Transmission 40%
3HGC300 PELCO® Tabbed Center-Marked Grids, 300 mesh, Copper 100/vial
3HGN300 PELCO® Tabbed Center-Marked Grids, 300 mesh, Nickel 100/vial
400 Mesh: Pitch 64µm; Hole Width 38µm; Bar Width 26µm; Transmission 35%
1GC400 PELCO® Center-Marked Grids, 400 mesh, Copper 100/vial
1GN400 PELCO® Center-Marked Grids, 400 mesh, Nickel 100/vial
1GG400 PELCO® Center-Marked Grids, 400 mesh, Gold 25/vial
Tabbed 400 Mesh: Pitch 64µm; Hole Width 38µm; Bar Width 26µm; Transmission 35%
3HGC400 PELCO® Tabbed Center-Marked Grids, 300 mesh, Copper 100/vial
Tabbed 500 Mesh: Pitch 51µm; Hole Width 28µm; Bar Width 23µm; Transmission 30%
3HGC500 PELCO® Tabbed Center-Marked Grids, 500 mesh, Copper 100/vial
Cuts tabs from handle grids; very fine cutting in tight places. Gold plating offered to re-
duce contamination and oxidation. High Precision Carbon Steel. Length: 115mm; blade
width x thickness is 10.5 x 4.25mm; Style 15a.
511 Tab-Nipper............................................... each
511-A Tab-Nipper, Gold Plated........................... each
Tabbed 75 Mesh: Pitch 339µm; Hole Width 284µm; Bar Width 55µm; Transmission 70%
3HGT75 PELCO® Tabbed, Center-Marked Grids, 75 mesh, Titanium 25/vial
Tabbed 300 Mesh: Pitch 85µm; Hole Width 54µm; Bar Width 31µm; Transmission 40%
3HGT300 PELCO® Tabbed Center-Marked Grids, 300 mesh, Titanium 25/vial
400 Mesh: Pitch 64µm; Hole Width 38µm; Bar Width 26µm; Transmission 35%
1GT400 PELCO® Center-Marked Grids, 400 mesh, Titanium 25/vial
1GA400 PELCO® Center-Marked Grids, 400 mesh, Aluminum 25/vial
The Gilder grids are available in 50 to an unrivalled 2000 mesh. The Gilder grids
feature well defined grid bars, shiny (smooth) and matt side difference and are
packaged in custom anti-static vials. They are made with precision electroplat-
ing technologies. An additional feature of the Gilder grids are the rim and centre
marks to aid in the orientation on the grid and identification of each side. Most
Gilder grids have a rim mark and many grids also have center marks. Wide selec-
tion of grid styles to support virtually every application with standard diameter of
3.05mm. Available materials are Cu, Ni, Au, Mo and Cu/Pd. Standard Mesh Grids with
Packaging: Standard Cu or Ni 100grids/vial, except special configurations which marks: An asymmetrical mark
in the rim, shown top. Center Fine Mesh Grids with marks:
are listed accordingly with packaging of 25 or 50 grids/vial. mark for quadrant location or An asymmetrical mark in the
older style, “reverse arrow”, rim, shown top. Center mark
bottom. divides grid into 6 areas, bot-
Molybdenum is used in applications where it’s hardness, expansion coefficient,
tom.
high temperature and corrosive resistance characteristics are considered impor-
tant. Mo typical purity 99.9%, melting point 2617°C (4742.6°F).
G200M Gilder Grids, 200 mesh, Molybdenum, Center & Rim Mark 25/vial
G400 Gilder Grids, 400 mesh, Copper, Center & Rim Mark 100/vial
G400G Gilder Grids, 400 mesh, Gold, Center & Rim Mark 50/vial
Palladium Coated Copper Grids
G400CUPD Gilder Grids, 400 mesh, Cu/Pd, Center & Rim Mark 100/vial
Thickness of Nickel grids is 35 microns ±5 microns
G400N Gilder Grids, 400 mesh, Nickel, Center & Rim Mark 100/vial
400 Mesh Fine Bar: Pitch 62µm; Hole Width 54µm; Bar Width 8µm; Transmission 76%
G400HS Gilder Fine Bar Grids, 400 mesh, Copper, Rim Mark 100/vial
400 Line Parallel Bar: Pitch 62µm; Space Width 40µm; Bar Width 22µm; Transmission 65%
G400P Gilder Parallel Bar Grids, 400 lines, Copper, Rim Mark 50/vial
600 Mesh Fine Bar: Pitch 42µm; Hole Width 37µm; Bar Width 5µm; Transmission 78%
G600HS Gilder Fine Bar Grids, 600 mesh, Copper, Rim Mark 100/vial
600 Mesh Thick-Thin: Hole Size 30µm; Bar Width 10/16µm; Transmission 65%
G600TT Gilder Thick-Thin Bar Grids, 600 mesh, Copper, Rim Mark 100/vial
G600TTG Gilder Thick-Thin Bar Grids, 600 mesh, Gold, Rim Mark 50/vial
n Gilder wGrids
1000 Mesh Fine Bar: Pitch 25µm; Hole Width 19µm; Bar Width 6µm; Transmission 57%
G1000HS Gilder Fine Bar Grids, 1000 mesh, Copper, Rim Mark 25/vial
G1000HSN Gilder Fine Bar Grids, 1000 mesh, Nickel, Rim Mark 25/vial
G1000HSG Gilder Fine Bar Grids, 1000 mesh, Gold, Rim Mark 25/vial
1500 Mesh Fine Bar: Pitch 16.5µm; Hole Width 11.5µm; Bar Width 5µm; Transmission 49%
G1500HS Gilder Fine Bar Grids, 1500 mesh, Copper, Center Mark 15/vial
G1500HSN Gilder Fine Bar Grids, 1500 mesh, Nickel, Center Mark 15/vial
G1500HSG Gilder Fine Bar Grids, 1500 mesh, Gold, Center Mark 15/vial
2000 Mesh Fine Bar: Pitch 12.5µm; Hole Width 7.5µm; Bar Width 5µm; Transmission 36%
G2000HS Gilder Fine Bar Grids, 2000 mesh, Copper, Rim Mark 10/vial
G2000HSN Gilder Fine Bar Grids, 2000 mesh, Nickel, Rim Mark 10/vial
150 Hexagonal Mesh: Pitch 165µm; Hole width 105µm; Bar width 35µm; Transmission 62%
G150HEX Gilder Hexagonal Grids, 150 mesh, Copper, Rim Mark 100/vial
300 Hexagonal Mesh: Pitch 83µm; Hole Width 58µm; Bar Width 25µm; Transmission 49%
G300HEX Gilder Hexagonal Grids, 300 mesh, Copper, Rim Mark 100/vial
G200HH Gilder Fine Bar Hexagonal Grids, 200 mesh, Copper, Rim Mark 100/vial
Thickness of Nickel grids is 35 microns ±5 microns
G200HHN Gilder Fine Bar Hexagonal Grids, 200 mesh, Nickel, Rim Mark 100/vial
G300HH Gilder Fine Bar Hexagonal Grids, 300 mesh, Copper, Rim Mark 100/vial
Thickness of Nickel grids is 35 microns ±5 microns
G300HHN Gilder Fine Bar Hexagonal Grids, 300 mesh, Nickel, Rim Mark 100/vial
G400HH Gilder Fine Bar Hexagonal Grids, 400 mesh, Copper, Center & 100/vial
Rim Mark
G400HHN Gilder Fine Bar Hexagonal Grids, 400 mesh, Nickel, Center & Rim 100/vial
Mark
n Gilder 600 Mesh Hexagonal, Fine Bar and Finest Bar Grids
600 Hexagonal Mesh, Fine Bar: Pitch 37µm; Hole Width 29µm; Bar Width 8µm;
Transmission 61%
G600HH Gilder Fine Bar Hexagonal Grids, 600 mesh, Copper, Center & 100/vial
Rim Mark
600 Hexagonal Mesh, Finest Bar: Pitch 42µm; Hole Width 37µm; Bar Width 5µm;
Transmission 78%
G600HHS Gilder Finest Bar Hexagonal Grids, 600 mesh, Copper, Center 100/vial
Mark
12414-CU
100 Mesh
12433-CU 12435-CU
100 Mesh 200 Mesh
79750 Maxtaform Reference Finder Grids, Style H2, 200 mesh, Copper 100/vial
79751 Maxtaform Reference Finder Grids, Style H2, 200 mesh, 100/vial
Nickel
G200HF3 Gilder Reference Locater Grids, 332 cells unique by alphanumeric 25/vial
code, copper
7GC200 PELCO® Pinpointer Grids, 3.0mm O.D., 200 mesh, Copper 100/vial
7HGN100 PELCO® Pinpointer Grids, 3.0mm O.D., 200 mesh, Nickel 100/vial
Maxtaform™ Grids
Maxtaform™ introduced “flashed” (plated one side with Rhodium) grids to give positive identification to one surface of the grid. These
“High Grade” grids also eliminate tarnishing of the Cu grids with the Rhodium flashing. Maxtaform™ also manufactures a range of pre-
cise indicator/reference grids.
100 Mesh: Pitch 250µm; Hole Width 200µm; Bar Width 50µm
12559-CU Veco Center Reference Grids, 100 mesh, Copper 100/vial
12560-NI Veco Center Reference Grids, 100 mesh, Nickel 100/vial
150 Mesh: Pitch 167µm; Hole Width 117µm; Bar Width 50µm
12563-CU Veco Center Reference Grids, 150 mesh, Copper 100/vial
12564-NI Veco Center Reference Grids, 150 mesh, Nickel 100/vial
200 Mesh: Pitch 125µm; Hole Width 85µm; Bar Width 40µm
12567-CU Veco Center Reference Grids, 200 mesh, Copper 100/vial
300 Mesh: Pitch 83µm; Hole Width 45µm; Bar Width 38µm
12571-CU Veco Center Reference Grids, 300 mesh, Copper 100/vial
12572-NI Veco Center Reference Grids, 300 mesh, Nickel 100/vial
400 Mesh: Pitch 63µm; Hole Width 30µm; Bar Width 33µm
12575-CU Veco Center Reference Grids, 400 mesh, Copper 100/vial
n Biology Tweezers
Athene Grids
Athene grids production started 60 years ago, about 1948, and still retain the qualities which made the pioneer electron microscopists
appreciative: Sharp burr-free bars and corners, and close quality inspection. Different styles have been added over the years. Styles
available are square mesh, honeycomb and slots. Standard diameter is 3.05mm and materials are in Cu, Ni and Au.
4 Slots
G227 Athene Polyslot Grids, 350 to 700µm, Copper 100/vial
n GridStick™ Adhesive
For adhering grids to the GridStick™, includes instruc-
An inexpensive device to reduce or eliminate precipitate and dirt tions and coats about 200 GridSticks.
from your electron microscopy grids during staining.
155-9 GridStick™ Adhesive, 5ml................... each
The SynapTek GridStick™ is
manufactured from a thin
but rigid alloy that does
n Grid Coating Pen
not react with commonly
used organic solvents and
stains. The stick is 4mm
A light touch with this pen will provide a thin layer of adhesive on
wide by 75mm long and
the grid. Layer will dry in 1-2 minutes at room temperature and is
has a slot along its cen-
then ready to receive the sections. Pen may also be used as pre-
ter with small undercut
treatment before coating grids with formvar or other thin films.
notches on one side to
(MSDS on web site)
make grid removal simple.
A small area on top of 1556 Grid Coating Pen...............................................each
each stick is reserved for
identification (use a fine n Tomography Grids
point permanent ink pen).
Full loaded SynapTek™ GridStick™ with 1.5mm square coper grid, 300 mesh.
1 x 2mm Synaptek™ Grids The SynapTek GridStick™
is coated with a specially
formulated pressure-sensitive adhesive. This adhesive holds the
grids in place during staining, emulsion coating, carbon coating,
shadow casting and serial section collection.
The SynapTek GridStick™ will fit into conventional Pasteur pi-
5GC300 Tomography Grids, 300 mesh, Cu..............pkg/50
pettes. The grids lie in the same plane as the solution flow, mini- Tomography Grids with Support Films Applied
mizing chances of breaking Formvar films and collecting surface 5GC300-16650 Lacey Carbon on Tomography Grids,
debris. 300 mesh, Cu................................pkg/50
The SynapTek GridStick™ was developed in conjunction with 5GC300-16625 Lacey Carbon on Tomography Grids,
SynapTek™ Grids. Other grids may be used provided they have 300 mesh, Cu................................pkg/25
sufficient thickness to avoid bending when being removed from 5GC300-16050 Carbon Film on Tomography Grids,
the adhesive on the SynapTek GridStick™. SynapTek™ Grids are
300 mesh, Cu................................pkg/50
100µm thick.
5GC300-16025 Carbon Film on Tomography Grids,
300 mesh, Cu................................pkg/25
n Chien Grids
1. Used to pick up many individual sections or ribbons and to
transfer them onto another grid
2. It can also be formvar coated as a receiving grid for examina-
tion of a large number of sections.
3. When formvar coated, it will support 2 or even 3 parallel rib-
bons of serial sections, with no obscuring grid bars.
4. Hole size 50% greater than the largest slot grid.
5. There are two slits in the rim area which allow it to be easily
bent with forceps to make a tab, while keeping the remainder of the grid surface flat prior to picking up ribbons.
References: Chien K, Van de Velde R, Heusser R, 1985. Simultaneous ultramicrotomy of multiple areas and examination of ribbons on one new grid. Proc 43rd
Annual Meeting, Elec Micr Soc Amer, G W Bailey, ed, San Francisco Press, 460.
Galey FR, Nilsson SEG, 1966. A new method for transferring sections from the liquid surface of the trough through staining solutions to the supporting film of a
grid. J Ultrastruct Res, 14, 405-410.
10GC01 PELCO® FIB Lift-Out TEM Grids; single, wide post, copper pkg/100
10GC02 PELCO® FIB Lift-Out TEM Grids; 2 wide posts, copper pkg/100
10GC02T PELCO® FIB Lift-Out TEM Grids; 2 wide posts, copper, 55μ thick
10GC04 PELCO® FIB Lift-Out TEM Grids; 4 narrow posts, copper pkg/100
10GMO2 PELCO® FIB Lift-Out TEM Grids; 2 wide posts, molybdenum pkg/25
21490-10 PELCO® FIB Lift-Out TEM Grids; 4 wide posts, silicon pkg/10
n 1. Formvar: A film of pure Formvar, with no stabilizing coating. These films are useful for your customized coating of stabi-
lizing material or for the support of thin sections.
200 Mesh
n 2. Formvar, Stabilized with Carbon: A Formvar film covered with a “light” layer of carbon. The heat and
electrical conducting properties of carbon help to stabilize the Formvar films when exposed to the electron beam. This is a resilient, all-
purpose specimen support film, ideal for mounting thin sections and for applications using lower ranges of magnification. The 200M-
TH grids (Prod. No. 01803 and 01803-F) are thicker and more rigid than normal and useful for many applications - particularly where
frequent grid handling is involved.
75 Mesh Mesh Prod. No. Description Unit
75 M 01802-F Formvar/Carbon, 75 mesh, Copper pkg/50
approx. grid hole size: 292µm
200 Mesh 200 M 01800 Formvar/Carbon, 200 mesh, Copper pkg/25
200 M 01800-F Formvar/Carbon, 200 mesh, Copper pkg/50
200 M 01801 Formvar/Carbon, 200 mesh, Copper pkg/100
200 M -TH 01803 Formvar/Carbon, 200 mesh TH, Copper pkg/25
300 Mesh
200 M -TH 01803-F Formvar/Carbon, 200 mesh TH, Copper pkg/50
200 M 01800N Formvar/Carbon, 200 mesh, Nickel pkg/25
approx. grid hole size: 97µm
400 Mesh 200 M 01800N-F Formvar/Carbon, 200 mesh, Nickel pkg/50
approx. grid hole size: 97µm
300 M 01753-F Formvar/Carbon, 300 mesh, Copper pkg/50
approx. grid hole size: 63µm
400 M 01754-F Formvar/Carbon, 400 mesh, Copper pkg/50
0.4 x 2mm
Slot approx. grid hole size: 42µm
0.4 x 2mm 01806 Formvar/Carbon, 0.4 x 2mm Slot, Copper pkg/25
TH= Thicker Grids
n 3. Carbon Type-B: A Formvar film coated with a “heavier” layer of carbon. This is the strongest and most versatile sup-
port film we produce. It is stable in the EM under all operating conditions including high magnification with high beam intensity. The
films can withstand vigorous specimen preparation techniques. If the carbon surface is hydrophobic, specimen suspensions can be ap-
plied to the Formvar surface.
Triple Slot
n 4. Carbon Type-A: Carbon support films with a removable Formvar on the opposite side Carbon
of the grid. When the Formvar is removed, by dipping in solvent, a pure carbon film remains. (Note: The
Ultrathin Carbon Film on a Holey Carbon Support Film, Prod. No. 01824, has no Formvar backing.) These
films are stable under all EM operating conditions and are for use where the presence of a Formvar layer
cannot be tolerated. Pure carbon films tend to be more delicate than those with a Formvar backing and
require more delicate handling during specimen preparation than most other support films.
Grid
(b) Ultrathin Carbon Type-A: Carbon support film of approximately 3nm thickness.
(c) Ultrathin Carbon Film on a Holey Carbon Support Film: Pure car-
bon support films with no Formvar backing. This new product has an even thinner
carbon film which is mounted on a carbon holey film. The carbon support layer lying
over the holes is less than 3nm in thickness and is the thinnest support film available.
It is particularly useful for high resolution microscopy of low contrast particles and is
also ideal for use with the Energy Filtering TEM.
0.26µm dia. Latex on Ultrathin Carbon Film on a Holey Carbon Support Film,
example of application.
300 Mesh
n 5. Pure Carbon Film: Carbon films with a thickness of 15-25nm with no Formvar used during manufacturing. Com-
pletely free of Formvar. Carbon films are thin and highly transparent to electrons. They exhibit very fine grain and minimal interference
with specimen structure. Films are ready to use upon receipt. The pure carbon films tend to be more delicate than support films with a
Formvar backing and require more delicate handling during specimen preparation.
n 6. Silicon Monoxide: Silicon monoxide produces a highly resilient support film which can withstand vigorous specimen
preparation techniques. It has low background contrast, is stable under the electron beam and is less hydrophobic than carbon. We
offer two types of silicon monoxide support films:
(a) Formvar Stabilized with Silicon Monoxide: A Formvar film coated with a “light” layer of silicon monoxide.
200 Mesh
Mesh Prod. No. Descriiption Unit
200 M 01830 Silicon Monoxide/Formvar, 200 mesh, Copper pkg/25
approx. grid hole size: 97µm
(b) Lacey Carbon Type-A: A Lacey carbon film with a removable Formvar backing on the opposite side of the grid. When the For-
mvar is removed, by dipping in solvent, the Lacey carbon film remains. These films are stable under all EM operating conditions and for
use where the presence of Formvar can not be tolerated. Pure Lacey Carbon is more delicate than those with Formvar backing and re-
quire more careful handling during specimen preparation.
Powders, dry - G B G G B No
Grid Box Return Policy. If you have empty grid boxes (Prod. No. 160) that you would like to return for credit, you may do so. Use re-
turn Prod. No. 160-R, making sure that the boxes are clean and in good condition (no scratches or markings) and your account will be
credited $.50 for each box returned.