(주)나온테크

(주)나온테크
CEO Message

Welcome.

NAONTECH is a leading enterprise of robot and automation system in semiconductor, flat panel display and solar cell
manufacturing industries based on robot technology and system engineering expertise.
Since founded in 2000, NAONTECH has supplied various substrate transfer robots and automation tools to the
semiconductor, FPD process equipment companies, and emerging solar energy companies in Korean market.

All of our staffs having passionate and experience have developed efficient and reliable material handling modules,
such as atmospheric wafer transfer robot (WTR),vacuum robot, FOUP stocker, equipment front end module (EFEM),
cassette transfer robot (CHR), vacuum chambers, solar cell tray, and CVD system, etc. in a short period.

We are growing up steadily with the help of strong trust from customers, shareholders and passionate staffs, and do
our best to provide discriminating and creative values to the customer.
We᾿ re hearing of client᾿ s continuous requests at anytime and at anyplace, and focus our resources on robot and
automation System

Our dream is becoming a leading company in world market and we will show our success stories in automated
manufacturing tools to accelerate your profitable business.

Please set your affection on NAONTECH and encourage us.

Thank you.

President / CEO
Won-Kyung, Kim

History
2013. 03 Completed Vacuum Robot GEN 8
2013. 01 Participated Semicon Korea 2013
2013. 01 Developed Quad Vactra 2006. 10 Developed Gen8 glass stocker robot
2012. 10 Participated Robotworld 2012 2006. 05 Developed cassette handling robot for AGV (High payload)
2012. 06 Completed Solar Cluster Tool GEN 6 2006. 03 Developed bare reticle stocker system
2012. 02 Participated Semicon Korea 2012 2005. 04 Developed solar cell substrate handling robot
2011. 01 Participated Semicon Korea 2011 2005. 02 Developed robot for FOUP stocker system Crane
2010. 12 Completed Twin Vacuum Robot 2004. 12 Developed cassette handling robot for AGV
2010. 06 Completed Vacuum Cluster System 2004. 07 Developed glass transfer robot
2010. 02 Participated Semicon Korea 2010 2004. 03 Developed cell stocker robot for Gen 7 glass
2010. 01 Completed Trackless WTR 2003. 10 Develop vacuum robot
2009. 01 Participated Semicon Korea 2009 2003. 02 Participated Semicon Korea show
2008. 09 Solar Cell CVD TM delivered solar cell transfer system 2002. 12 Nominated main contractor of vacuum robot development
2008. 01 Participated Semicon Korea 2008 program sponsored by government
2007. 06 Completed SCARA robot (HYDRA series) 2002. 09 Developed atmospheric wafer transfer robot
2007. 03 Developed vacuum load lock for Gen8 2001. 10 Founded R&D center
2007. 02 Completed EFEM development 2001. 06 Registered venture company
2007. 01 Completed Semicon/ LCD robot line up 2001. 03 Develop remote inspection robot
2006. 12 Moved HQ to Ansan facility 2000. 03 Founded
 BUSINESS Semicon - Atmospheric Robot
1. FEATURES
- Class 1 clean room environment comply.
- Meets various user requirements with fast delivery.
- Fleid proven motion control technology enables highest uptime.
(single, dual and dump end-effector/telescopic vertical motion
mechanism available)
- High stiffness with minimum weight using optimum structure design.
- Expandable up to 5 axes.

2. SPECIFICATION
Arm Type Single Arm Dual Arm
Model Number WTR-S20Z20 WTR-S30Z30 WTR-D20Z20 WTR-D30Z30
Weight 27Kg 30Kg 30Kg 35Kg
Wafer Size 200mm 300mm 200mm 300mm
R1,R2 axis 495mm 650mm 495mm 650mm
Maximum
T axis 330° 330° 330° 330°
Work Range
Z axis 200mm 350mm 200mm 350mm
R1,R2 axis 1200mm/sec 1700mm/sec 1200mm/sec 1700mm/sec
Maximum
T axis 290°/sec 290°/sec 290°/sec 290°/sec
Velocity
Z axis 400mm/sec 400mm/sec 400mm/sec 400mm/sec
Grip Type Vacuum Vacuum, Edge, Passive Vacuum Vacuum, Edge, Passive

Clean & Vacuum Robot EFEM & Backbone Option Mapping Mapping Mapping Mapping
Mounting Top, Bottom, Side
Repeatability ±0.1mm
Control 3~6 axes

Semicon - Atmospheric Robot(Special Type)

1. FEATURES
- Class 1 clean room environment comply design.
- Customized design available to meet userʼs requirements.
- Variable pitch, flip, dumping, long travelling
- High throughput with reliable motion control technique.
- Easy operation using teach pendant with GUI
- Option: Traverse unit/mounting/end-effector shape and material / mapping
ATM Robot for LCD FPD/OLED Cassette Handling 6G & 8G Vacuum Robot
2. SPECIFICATION
Feature Flip Dump Long stroke for up/down
Arm Type Single Arm Single Arm Single Arm
Model Number WTR-S20S20 WTR-S30Z30 WTR-S20Z25 WTR-S30Z35 WTR-S30Z35 WTR-S30-TS
Weight 35Kg 40kg 30Kg 45Kg 45Kg 50kg
Wafer Size 200mm 300mm 200mm 300mm 300mm 300mm
R axis 495mm 650mm 495mm 690mm 690mm 816mm
Maximum T axis 330° 330° 330° 330° 330° 330°
Work Range Z axis 200mm 300mm 250mm 350mm 350mm 700mm
F axis -10°~190° -10°~190° - - - -
R axis 1000mm/sec 1200mm/sec 1000mm/sec 1200mm/sec 1200mm/sec 1000mm/sec
Maximum T axis 290°/sec 290°/sec 290°/sec 290°/sec 290°/sec 290°/sec
Velocity Z axis 400mm/sec 400mm/sec 400mm/sec 400mm/sec 400mm/sec 400mm/sec
F axis 360°/sec 360°/sec - - - 360°/sec
Grip Type Vacuum, Guide Vacuum,Edge,Guide Vacuum Vacuum,Edge,Guide Vacuum,Edge,Guide Vacuum, Guide
Option Mapping, Flip Mapping, Flip Dump 5 Dump 5 Dump 25 -
Mounting Top, Bottom, Side
Repeatability ±0.1mm
Silicon Wafer Handling Thin Film Vacuum Handling Control 6 axes

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 Semicon - Atmospheric Robot(SCARA) Semicon - Vacuum Robot : Single/Dual Type(Vactra-D)
1. FEATURES 1. FEATURES
- Class 1 clean room environment comply design. - Type : Single arm(3 axes) / dual arms(4 axes)
- Independent end effector motion enables high throughput. - Application : Vacuum Cluster Tool For CVD, Etcher ..
- Customized design available to meet userʼs requirements. - High Throughput ( Swap time, Infinite Rotation )
- No traverse unit required up to 3 sided EFEM. - Proven 4-bar link arm [ Particle free ]
- High throughput with reliable motion control technique. - Small Radius of Rotation
- Collision detect function. - High Rigidity ( Sag & Wobble )
- Single, dual, quad end effectors are available. - AWC (Auto Wafer Centering)
- Easy operation using teach pendant with GUI
- Option: Mounting/end-effector shape and material / mapping 2. SPECIFICATION
2 Blade Type (HDR350D) Wafer Size 200mm and 300mm
2. SPECIFICATION
Payload 1Kg/each
Wafer Size 200mm and 300mm R 1,050mm(Max) R ±0.1mm
Payload 1Kg/each T Infinite rotation Repeatability T ±0.01°
Motion
R 927mm (Max) R ±0.1mm Z 50mm (3σ) Z ±0.05mm
T 290° Repeatability T ±0.01° Swing Diameter 670mm (Configurable) Placement 0.15mm TIR
Motion
Z 350mm (3σ) Z ±0.05mm Max. Speed R: 600mm/sec Z: 100mm/sec
Swing Diameter 670mm (Configurable) Placement 0.15mm TIR Dimension Drive only 310(D) x 610(H)mm
Max. Speed XY: 800mm/sec Z: 400mm/sec Weight 50-55Kg(including arm set)
Drive only 310(W) X 310(D) X 610(H)mm Mounting Option Bottom, Top mount
Dimension Including arm @ HDR350D:480(W) X 475(D) X 767(H)mm Input Power 200~240VAC, 50~60Hz, Single Ph.
home position HDR350Q:480(W) X 475(D) X 949.5(H)mm Vacuum performance 5x 10-8 Torr( Base pressure) / 1 x 10-9 std.cc/sec He( leak rate)
Weight 50~55kg (including arm set) Control Interface RS232C, LAN, DeviceNet, MISC I/O(16 input, 16 output)
Mounting Option Bottom, Top, Side mount Teaching Pendant 5.7” 256 color Touch LCD thru RS232C
Input Power 200~240VAC, 50~60Hz, Single Ph.
Vacuum <600mmHg, 100cc/sec, Ø6mm quick connector
Control Interface RS232C, LAN, Device Net, MISC I/O (8 input, 8 output)
4 Blade Type (HDR350Q)
Teaching Pendant 5.7” 256 color Touch LCD thru RS232C

Semicon - Atmospheric Robot(Trackless Type) Semicon - Vacuum Robot : Quad Arm Type(Vactra-Q)
1. FEATURES
1. FEATURES
- Hybrid mechanism enables robot to access up to 3 LPM by trackless
X-axis motion. - High throughput & reliability using 6 axes (option: 8 axes) vacuum robot
- Fast Wafer Transfer time : 300 wafers/Hr - AWC function available
- Maximize EFEM space availability - Stacked Load Lock Chamber with pre-heat & post-cool
- End-effector option : Vacuum paddle, vacuum fork, active edge grip - Available twin chamber(CVD, ALD, etc)
- Various arm configuration, i.e. 5 Plus 1 - UPEH 250 wafers/hr

2. SPECIFICATION 2. SPECIFICATION
Wafer Size 200mm and 300mm Model Vactra-Q
Payload 650g/each Application Wafer 200mm & 300mm Compatible
Pitch 10mm Payload 1.5kg(Inc. End Effector)
R1, R2 340mm Arm Type Four hands, independent
T 330° Axes 6-Axes (Option 8 Axes)
Motion Z 300mm Mount Top or Bottom Mount
X -505mm ~ 505mm R axis Full stroke / 1.5s
Swing radius 340mm Velocity T axis 180° / 2.0s
R 1000mm/s Z axis 100mm / 2.6s
T 230°/s R axis 860mm / from rotation center
Speed Z 400mm/s Work Range T axis 340˚
X 1,300mm/s Z axis 100mm
Repeatability ±0.1mm Repeatability ±0.1mm / R, T, Z-axis
Weight 75Kg AWC Function Available
Dimension (Retracted) 680(L)X330(W)X927.5(H) Vacuum Seal Method Magnetic Fluid Seal
Path Line 860mm Vacuum Level 1.3x10-5 Pa
Pneumatic 5Kg/cm2 Pressurized air / 600mmHg Vacuum Leak rate : 1.3x10-9 Pa·m3/sec
Input Power 200~240VAC, 50~60Hz, 1Ø
Communication LAN, RS232C, DeviceNet, PIO
Teaching Pendant 5.7” 256 color touch screen, RS232c

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 Semicon - Vacuum Cluster System Semicon - EFEM
1. FEATURES 1. FEATURES
- High throughout : Fast swap time, Infinite Rotation - Designed for 200mm and 300mm wafer transfer service.
- Customizing system: stack load lock, batch load lock, heater unit, cooling unit - Designed for customizable configuration.
- AWC Function - Close loop control of enclosure pressure.
- Reliability and Easy Maintenance - Field maintenance service available
- Semi standard compliance.
- Easy leveling and docking for fast preparation.
2. SPECIFICATION
Arm Type Single / Dual
Hand Type Ceramic / CFRP
Grip Type Passive / O-ring 2. SPECIFICATION
Option AWC Function ITEM SPECIFICATION
Max Reach 950mm # of port 2 3 4
Minimum Rotation Radius 440mm Robot Reach Max. 800mm
Position Repeatability ±0.1mm
No of Blade 2 Arm
Wafer Size 300mm Vacuum Robot
Z axis (Stroke) 330 mm
R1 axis 950mm Repeatability ≤±0.1 mm
Maximum
T axis 360° 220 280 350
Work Range 작업속도(WPH)
Z axis 95mm~215mm FOUP Opening Time ≤12 Sec
R1 axis 600mm/sec Load port Cleanliness Class 1 @ 0.1㎛
Maximum
T axis 290°/sec Option Mapping, ID Reader, Aligner
Velocity
Z axis 200mm/sec 2Port EFEM
Filter Efficiency 99.9999 %
Pay Load 0.5kgf/arm Filter Pressure Drop ≤7.6 mmAq (at 0.2m/sec)
Mounting TOP
Communication LAN, RS232C, DeviceNet, PIO
Noise 65dB

3. PLATFORM MODEL

Stack L/L & TM Batch L/L & TM

3Port EFEM 4Port EFEM

3. Aligner
Wafer Size & Type 300 mm Notch Type 450 mm Notch Type
Vacuum Robot Twin Backbone Grip Type Passive, Vacuum Passive, Vacuum
Axis X, Y, Θ, U X, Y, Θ, U
Centering (um) Centering (um)
4. TM & LL FEATURES
±20um ±30um
Accuracy
Notch(° ) ±0.1° Notch(° ) ±0.1°
- Load lock : batch & stack available Wafer Position detection Wafer ±5mm(R) Wafer ±5mm(R)
- 5+5 batch type: heater unit Wafer Check & Vacuum < 0.1 Sec Wafer Check & Vacuum < 0.1 Sec
< 4.1 Sec < 4.3 Sec
- 2 shelf, high & low stack, cooling Unit Repeatability & Throughput Wafer Rotation-Theta < 3.5 Sec
(Align Time)
Wafer Rotation-Theta < 3.5 Sec
(Align Time)
- Vacuum, gas line & IO box Wafer Line Up (X, Y,Θ) < 0.5 Sec Wafer Line Up (X, Y, Θ) < 0.7 Sec

- Easy maintenance & Clean appearance 이동 후 Chuck 이동 X,Y ORG < 0.7 Sec X,Y ORG < 0.7 Sec
Spin Chuck Peek Ø30 ~ Ø50 Peek Ø30 ~ Ø50
Mechanical Interface Bottom Mount Bottom Mount

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 FPD - 3G Glass Transfer Robot FPD - Cassett Handling Robot
1. FEATURES
1. FEATURES
- Capable of handling substrates for Gen 2 through Gen3
- Supports glass cassette of 4th ~8th generation
- High stiffness arm structure against light weight
- High stiffness arm structure against light weight
- High reliability, productivity, precision
- High throughput through optimal motion control
- Low noise level
- High reliability, productivity, precision
- Easy maintenance
- Easy maintenance
- Low noise level
2. SPECIFICATION
Arm Type Dual Arm
Hand Type CFRP
Grip Type Vacuum / O ring
Option Aligner
Rotation Radius 565mm
Position Repeatability ±0.5mm
Substrate Size < 370 x 470mm
R1,R2 axis 1,350mm
Maximum
T axis 330°
Work Range
Z axis 400mm
R1,R2 axis 1,930mm/s
Maximum
T axis 270°/s
Velocity 50kg 100kg
Z axis 400mm/s
Pay Load 10Kg Including Hand
Communication LAN, RS232C, DeviceNet, PIO
Noise 75 db
Input Power AC200V ~ 230V±10%
Environment
Cleanliness Class 10

FPD - 4G Glass Transfer Robot

1. FEATURES
- Capable of handling substrates for Gen 4 through Gen 5.5
- High stiffness arm structure against light weight
- High throughput through optimal motion control 1000kg
- High reliability, productivity, precision
- Low noise level
- Easy maintenance

2. SPECIFICATION 2. SPECIFICATION
Specification (Pay Load) 50Kg 80Kg 100Kg 150Kg 250Kg 1000Kg
Arm Type Dual Arm
Arm Type Single
Hand Type CFRP
Hand Type Steel
Grip Type Vacuum / O ring
Grip Type Pad with Guide
Option Aligner
Rotation Radius(mm) 525 580 640 720 915 1,400
Rotation Radius 565mm
Position Repeatability(mm) ±1.0 ±1.5 ±2.0 ±2.5 ±3.5 5
Position Repeatability ±0.5mm
Substrate Size(mm) 648x755x630 700x800x650 970x778x715 990x900x800 1300x1100x850 2000x1660x800
Substrate Size < 1,320 x 1,500mm
R(mm) 1,050 1,100 1,230 1,400 1,800 2,500
R1,R2 axis 2,600mm Maximum
Maximum T (° ) 180 180 180 180 180 180
T axis 330° Work Range
Work Range Z(mm) 110 110 110 110 120 3,000
Z axis 450mm
R(mm/s) 1,250 1,400 1,750 1,940 1,200 1,100
R1,R2 axis 2,200mm/s Maximum
Maximum T (° /s) 180 180 180 150 100 70
T axis 180°/s Velocity
Velocity Z(mm/s) 100 100 100 100 60 60
Z axis 400mm/s
Mounting TOP TOP TOP TOP Bottom
Pay Load 10Kg Including Hand
Communication LAN, RS232C, DeviceNet, PIO
Communication LAN, RS232C, DeviceNet, PIO
Arm Concept FROG
Noise 75 db
Noise 80db 80db 80db 80db 85db 85db
Input Power AC200V ~ 230V±10%
Environment Input Power AC200V~230V±10%
Cleanliness Class 10 Environment
Cleanliness Class 10

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 FPD - 6G Vacuum Robot Solar - Glass Handling Robot
1. FEATURES 1. FEATURES
- Application for Cluster Tool(6G) / CVD, PE-CVD, Etcher, etc - Capable of handling for 5G(1100X1300) substrate - Lower passline
- High temp. compatible - Minimum deflection by stiff arm - High throughput through optimal motion control
- Monitoring for motor torque & temperature available - High Reliability, Productivity, Precision - Low Noise Level
- High rigidity through link mechanism on arm - Easy maintenance - Capable of tray forhandling crystal form cell & Thin film cell
- Low gas emission by eliminating belt drive in vacuum environments.
- Magnetic seal used for all drive in vacuum environments 2. SPECIFICATION
Model LTR
Arm Type SINGLE / DUAL
Hand Type CFRP
Grip Type Vacuum
2. SPECIFICATION Option Align
Model Vactra - 6G Minimum Rotation Radius 1,300mm
Structure Link + Slider Position Repeatability ±0.5mm
Axis 4 axis (X1, X2, θ, Z) Substrate Size 1320x1500mmx0.7t ~ 2t
Substrate Size 6G R1 axis 2,600mm
Maximum
Payload 30kg Including Fork T axis 330°
Work Range
X1, X2 2,800mm Z axis 450mm
Work
θ 0 ~ 330° R1 axis 2500mm/s
Range Maximum
Z 300 & 700mm T axis 180°/s
Velocity
R 2,800mm / 2.0s Z axis 400mm/s
Tact Θ 180°/ 2.8s Pay Load 15kgf/each
Z 60mm / 1.2s Mounting Top/Bottom
Repeatability ± 0.2mm Communication LAN, RS232C, DeviceNet, PIO
Clean 10 Arm 구조 RMR
Vacuum Level 1.0 x 10-7 Torr Noise 70dB
Input Power AC200V~230V±10%
Environment
Cleanliness Class 10

FPD - 8G Vacuum Robot Solar - Tray Transfer System

1. FEATURES 1. FEATURES
- Application for Cluster Tool(8G) / CVD, PE-CVD, Etcher, etc - Supports heavy tray for solar transfer system - Payload 250kg
- High temp. compatible - Minimum deflection by stiff arm - High throughput through optimal motion control
- Monitoring for motor torque & temperature available - High Reliability, Productivity, Precision - Low Noise Level
- High rigidity through link mechanism on arm - Easy maintenance
- Low gas emission by eliminating belt drive in vacuum environments.
- Sensors for substrate detection can be wired internally. 2. SPECIFICATION
- Magnetic seal used for all drive in vacuum environments
Arm Type SINGLE / DUAL
Hand Type STEEL
Grip Type Rubber Mount
2. SPECIFICATION Option -
Model Vactra - 8G Minimum Rotation Radius 1,064mm
Structure Link + Slider Position Repeatability ±0.5mm
Axis 4 axis (X1, X2, θ, Z) Substrate Size 1380mmx1380mm
Substrate Size 8G R1 axis 2,230mm
Maximum
Payload 100kg Including Fork T axis 285°
Work Range
X1, X2 3,800mm Z axis 200mm
Work
θ 0 ~ 330° R1 axis 1,100mm/sec
Range
Maximum
Z 700mm T axis 180°/sec
Velocity
R 3,800mm / 3.0s Z axis 180mm/sec
Tact Θ 180° / 3.5s Pay Load 250Kgf
Z 100mm / 1.3s Mounting BOTTOM
Repeatability ± 0.25mm Communication LAN, RS232C, DeviceNet, PIO
Clean 10 Arm 구조 FROG
Vacuum Level 1.0 x 10-7 Torr Noise 70db

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 Solar - Automatic Wafer Handling Unit Controller & Software
▒ Robot Controller
- Control : up to 8 Axes (Max. 16Axes)
1. FEATURES - Reliable H/W : Proven Servo Driver & Motion Control Unit
- Transport solar cell wafer and tray - Touch Panel Teaching Unit to control & monitoring the robot
- High temperature (up to 300) and non contact wafer handling - AWC Function for 300mm Wafer Robot
- PLC based control and graphic user interface - Function for Vibration Control
- Capable of communication with host control system

Controller & Teaching Unit Controller Inside

▒ For Semiconductor & Various Size LTR

Item Semiconductor Several Size For LTR
Outward Size (mm) 440(W)x370(L)x190(H) 600(W)x400(L)x750(H)
Power AC200V,Single Phase, Max 20A AC200V,Three-Phase, Max 35A
Control Axis Basic 4 Axis (Max 6 Axis) Basic 4 Axis (Max 5 Axis)

Solar - Vacuum Cluster T.P

Control Method
Basic
Basic
AC Servo, 20Bits Full Absolute
5.7”,256 Color Touch
RS-232C, Ethernet
AC Servo, 20Bits Full Absolute
5.7”,256 Color Touch
RS-232C, Ethernet
Host Interface
Option RS-422C, Device Net, Profibus RS-422C, Device Net, Profibus
System I/O Each 8Point (In/Out) Each 8Point (In/Out)
I/O
1. FEATURES User I/O (System I/O) Each 16Point (In/Out) Each 16Point (In/Out)
Temperature 0~55° 0~55°
- Type : 6 facet, Tandem Environment
Humidity < RH 90% < RH 90%
- Applications : CVD Weight 15Kg 75Kg
- Features : Customized Engineering,
Vacuum Robot
Transfer Chamber ▒ AWC
Load Lock (Cassette Elevator or Stack) - It is AWC function that correct position error, when pick & place of wafer, detected
automatically and prevent accident in the advance by reporting in high level
- The AWC with fast response and high accuracy is established to chamber and
2. SPECIFICATION calculate position error using on/off signal and coordinate of robot
- The repeatability of AWC Function is 0.3mm normally and influenced by stiffness
Item Specifications and speed of robot
Glass Size 370x470x3mm 1100x1400x4mm
No. of Facet 6 facets 6 facets
▒ Vibration Control
TM Dimension 1300x1500x240mm 3060x3300x1200mm
Transfer plane 1250mm 1700mm - Robot was exposed in various vibration environment on working, and has natural frequency of each drive
Load Lock
Material A5083 A5083 - Minimize vibration and drive with high speed because our company's robot controller measures natural frequency of each
Dimension 916x870x547 1700x1400x500 drive and removes frequency related it
Pay Load 5Kg 15Kg
Arm Type Single Dual ▒ Glass Align Sensor
# of Axes 3 axes (R, T, Z) 4 axes (R1, R2, T, Z)
R axes : 945mm R axes : 2,500mm
- The glass align function can pick or place glass to calibrated position even if it is twisted on hand
Working Range
Z axes : 50mm Z axes : 300mm - The glass align function can correct position to R, T, TR direction according to number of drive axis of robot and sensor
Vacuum
R : 600mm/sec R : 100mm/sec - The repeatability of glass align function is about 1.5mm
Robot
Max Velocity T : 180deg/sec T : 90 deg/sec
Z : 80mm/sec Z : 100mm/sec
Wafer Pick or Place Time < 5 sec < 15 sec
Vertical Trajectory < 2.0mm Max. < 5.0mm Max.
Weight Approx. 75Kg Approx. 1250Kg

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