LM2936

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LM2936 Ultra-Low Quiescent Current LDO Voltage Regulator

Check for Samples: LM2936

1FEATURES DESCRIPTION
2• Ultra Low Quiescent Current (IQ ≤ 15 μA for The LM2936 ultra-low quiescent current regulator
IO = 100 μA) features low dropout voltage and low current in the
standby mode. With less than 15 μA quiescent
• Fixed 3.0V, 3.3V or 5.0V with 50 mA Output current at a 100 μA load, the LM2936 is ideally suited
• ±2% Initial Output Tolerance for automotive and other battery operated systems.
• ±3% Output Tolerance Over Line, Load, and The LM2936 retains all of the features that are
Temperature common to low dropout regulators including a low
dropout PNP pass device, short circuit protection,
• Dropout Voltage Typically 200 mV @ IO = 50 reverse battery protection, and thermal shutdown.
mA The LM2936 has a 40V maximum operating voltage
• Reverse Battery Protection limit, a −40°C to +125°C operating temperature
• −50V Reverse Transient Protection range, and ±3% output voltage tolerance over the
entire output current, input voltage, and temperature
• Internal Short Circuit Current Limit range. The LM2936 is available in a TO-92 package,
• Internal Thermal Shutdown Protection SOIC-8 and SOT–223 surface mount packages, and
• 40V Operating Voltage Limit a PFM surface mount power package.
• 60V Operating Voltage Limit for LM2936HV
• Shutdown Pin Available with LM2936BM
Package

Typical Application

* Required if regulator is located more than 2″ from power supply filter capacitor.
** Required for stability. See Electrical Characteristics for required values. Must be rated over intended operating
temperature range. Effective series resistance (ESR) is critical, see curve. Locate capacitor as close as possible to
the regulator output and ground pins. Capacitance may be increased without bound.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM2936
SNOSC48N – JUNE 2000 – REVISED MARCH 2013 www.ti.com

Connection Diagrams

Figure 1. PFM Figure 2. SOT-223

Top View Top View
See Package Number NDP0003B See Package Number DCY0004A

Figure 3. 8-Pin SOIC (D) Figure 4. 8-Pin SOIC (D)

Top View Top View
See Package Number D0008A See Package Number D0008A

Figure 5. TO-92 Figure 6. 8-Pin VSSOP (DGK)

Bottom View Top View
See Package Number LP0003A See Package Number DGK0008A

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

(1) (2)
Absolute Maximum Ratings
Input Voltage (Survival) +60V, −50V
(3)
ESD Susceptibility 2000V
(4)
Power Dissipation Internally limited
Junction Temperature (TJmax) 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 260°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating ratings.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human body model, 100 pF discharge through a 1.5 kΩ resistor.
(4) The maximum power dissipation is a function of TJmax, θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJmax − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2936 will go
into thermal shutdown.

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Operating Ratings
Operating Temperature Range −40°C to +125°C
Maximum Operating Input Voltage - LM2936 +40V
Maximum Operating Input Voltage - LM2936HV only +60V
Maximum Shutdown Pin Voltage - LM2936BM only 0V to 40V
TO-92 (LP0003A) θJA 195°C/W
VSSOP-8 (DGK0008A) θJA 200°C/W
SOIC-8 (D0008A) θJA 140°C/W
SOIC-8 (D0008A) θJC 45°C/W
PFM (NDP0003B) θJA 136°C/W
PFM (NDP0003B) θJC 6°C/W
SOT-223 (DCY0004A) θJA 149°C/W
SOT-223 (DCY0004A) θJC 36°C/W

Electrical Characteristics for LM2936–3.0

VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range
Min Typical Max
Parameter Conditions (1) (2) (1) Units

LM2936HV–3.0 Only
Output Voltage 5.5V ≤ VIN ≤ 48V,
(3) 2.910 3.000 3.090 V
100 µA ≤ IO ≤ 50 mA
Line Regulation 6V ≤ VIN ≤ 60V, IO = 1mA 10 30 mV
All LM2936–3.0
2.940 3.000 3.060
Output Voltage 4.0V ≤ VIN ≤ 26V, 2.910 3.000 3.090 V
(3)
100 µA ≤ IO ≤ 50 mA
Quiescent Current IO = 100 μA, 8V ≤ VIN ≤ 24V 15 20 μA
IO = 10 mA, 8V ≤ VIN ≤ 24V 0.20 0.50 mA
IO = 50 mA, 8V ≤ VIN ≤ 24V 1.5 2.5 mA
Line Regulation 9V ≤ VIN ≤ 16V 5 10
mV
6V ≤ VIN ≤ 40V, IO = 1 mA 10 30
Load Regulation 100 μA ≤ IO ≤ 5 mA 10 30
mV
5 mA ≤ IO ≤ 50 mA 10 30
Dropout Voltage IO = 100 μA 0.05 0.10 V
IO = 50 mA 0.20 0.40 V
Short Circuit Current VO = 0V 65 120 250 mA
Output Impedance IO = 30 mAdc and 10 mArms, 450
mΩ
f = 1000 Hz
Output Noise Voltage 10 Hz–100 kHz 500 μV
Long Term Stability 20 mV/1000 Hr
Ripple Rejection Vripple = 1Vrms, fripple = 120 Hz −40 −60 dB
Reverse Polarity RL = 500Ω, T = 1 ms −50
−80 V
Transient Input Voltage
Output Voltage with VIN = −15V, RL = 500Ω
0.00 −0.30 V
Reverse Polarity Input
Maximum Line Transient RL = 500Ω, VO ≤ 3.30V, T = 40ms 60 V
Output Bypass COUT = 22µF
0.3 8 Ω
Capacitance (COUT) ESR 0.1mA ≤ IOUT ≤ 50mA
Shutdown Input − LM2936BM–3.0 Only

(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
(3) To ensure constant junction temperature, pulse testing is used.
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Electrical Characteristics for LM2936–3.0 (continued)

VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range
Min Typical Max
Parameter Conditions (1) (2) (1) Units

Output Voltage, VOUT Output Off, VSD=2.4V, RLOAD = 500Ω 0 0.010 V

Shutdown High Output Off, RLOAD = 500Ω 2.00 1.1 V
Threshold Voltage, VIH
Shutdown Low Output On, RLOAD = 500Ω 1.1 0.60 V
Threshold Voltage, VIL
Shutdown High Output Off, VSD = 2.4V, RLOAD = 500Ω 12 μA
Current, IIH
Quiescent Current Output Off, VSD = 2.4V, RLOAD = 500Ω 30 μA
Includes IIH Current

Electrical Characteristics for LM2936–3.3

VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range
Min Typical Max
Parameter Conditions (1) (2) (1) Units

LM2936HV–3.3 Only
Output Voltage 5.5V ≤ VIN ≤ 48V,
(3) 3.201 3.300 3.399 V
100 µA ≤ IO ≤ 50 mA
Line Regulation 6V ≤ VIN ≤ 60V, IO = 1mA 10 30 mV
All LM2936–3.3
3.234 3.300 3.366
Output Voltage 4.0V ≤ VIN ≤ 26V, 3.201 3.300 3.399 V
(3)
100 µA ≤ IO ≤ 50 mA
Quiescent Current IO = 100 μA, 8V ≤ VIN ≤ 24V 15 20 μA
IO = 10 mA, 8V ≤ VIN ≤ 24V 0.20 0.50 mA
IO = 50 mA, 8V ≤ VIN ≤ 24V 1.5 2.5 mA
Line Regulation 9V ≤ VIN ≤ 16V 5 10
mV
6V ≤ VIN ≤ 40V, IO = 1 mA 10 30
Load Regulation 100 μA ≤ IO ≤ 5 mA 10 30
mV
5 mA ≤ IO ≤ 50 mA 10 30
Dropout Voltage IO = 100 μA 0.05 0.10 V
IO = 50 mA 0.20 0.40 V
Short Circuit Current VO = 0V 65 120 250 mA
Output Impedance IO = 30 mAdc and 10 mArms,
450 mΩ
f = 1000 Hz
Output Noise Voltage 10 Hz–100 kHz 500 μV
Long Term Stability 20 mV/1000 Hr
Ripple Rejection Vripple = 1Vrms, fripple = 120 Hz −40 −60 dB
Reverse Polarity RL = 500Ω, T = 1 ms −50
−80 V
Transient Input Voltage
Output Voltage with VIN = −15V, RL = 500Ω
0.00 −0.30 V
Reverse Polarity Input
Maximum Line Transient RL = 500Ω, VO ≤ 3.63V, T = 40ms 60 V
Output Bypass COUT = 22µF
0.3 8 Ω
Capacitance (COUT) ESR 0.1mA ≤ IOUT ≤ 50mA
Shutdown Input − LM2936BM–3.3 Only
Output Voltage, VOUT Output Off, VSD=2.4V, RLOAD = 500Ω 0 0.010 V

(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
(3) To ensure constant junction temperature, pulse testing is used.
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Electrical Characteristics for LM2936–3.3 (continued)

VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range
Min Typical Max
Parameter Conditions (1) (2) (1) Units

Shutdown High Output Off, RLOAD = 500Ω 2.00 1.1 V

Threshold Voltage, VIH
Shutdown Low Output On, RLOAD = 500Ω 1.1 0.60 V
Threshold Voltage, VIL
Shutdown High Output Off, VSD = 2.4V, RLOAD = 500Ω 12 μA
Current, IIH
Quiescent Current Output Off, VSD = 2.4V, RLOAD = 500Ω 30 μA
Includes IIH Current

Electrical Characteristics for LM2936–5.0

VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range
Min Typical Max
Parameter Conditions (1) (2) (1) Units

LM2936HV–5.0 Only
Output Voltage 5.5V ≤ VIN ≤ 48V,
(3) 4.85 5.00 5.15 V
100 µA ≤ IO ≤ 50 mA
Line Regulation 6V ≤ VIN ≤ 60V, IO = 1mA 15 35 mV
All LM2936–5.0
4.90 5.00 5.10
Output Voltage 5.5V ≤ VIN ≤ 26V, 4.85 5.00 5.15 V
(3)
100 µA ≤ IO ≤ 50 mA
Quiescent Current IO = 100 μA, 8V ≤ VIN ≤ 24V 9 15 μA
IO = 10 mA, 8V ≤ VIN ≤ 24V 0.20 0.50 mA
IO = 50 mA, 8V ≤ VIN ≤ 24V 1.5 2.5 mA
Line Regulation 9V ≤ VIN ≤ 16V 5 10
mV
6V ≤ VIN ≤ 40V, IO = 1 mA 10 30
Load Regulation 100 μA ≤ IO ≤ 5 mA 10 30
mV
5 mA ≤ IO ≤ 50 mA 10 30
Dropout Voltage IO = 100 μA 0.05 0.10 V
IO = 50 mA 0.20 0.40 V
Short Circuit Current VO = 0V 65 120 250 mA
Output Impedance IO = 30 mAdc and 10 mArms,
450 mΩ
f = 1000 Hz
Output Noise Voltage 10 Hz–100 kHz 500 μV
Long Term Stability 20 mV/1000 Hr
Ripple Rejection Vripple = 1Vrms, fripple = 120 Hz −40 −60 dB
Reverse Polarity RL = 500Ω, T = 1 ms −50
−80 V
Transient Input Voltage
Output Voltage with VIN = −15V, RL = 500Ω
0.00 −0.30 V
Reverse Polarity Input
Maximum Line Transient RL = 500Ω, VO ≤ 5.5V, T = 40ms 60 V
Output Bypass COUT = 10µF
0.3 8 Ω
Capacitance (COUT) ESR 0.1mA ≤ IOUT ≤ 50mA
Shutdown Input − LM2936BM–5.0 Only
Output Voltage, VOUT Output Off, VSD=2.4V, RLOAD = 500Ω 0 0.010 V
Shutdown High Output Off, RLOAD = 500Ω 2.00 1.1 V
Threshold Voltage, VIH

(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
(3) To ensure constant junction temperature, pulse testing is used.
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Electrical Characteristics for LM2936–5.0 (continued)

VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range
Min Typical Max
Parameter Conditions (1) (2) (1) Units

Shutdown Low Output On, RLOAD = 500Ω 1.1 0.60 V

Threshold Voltage, VIL
Shutdown High Output Off, VSD = 2.4V, RLOAD = 500Ω 12 μA
Current, IIH
Quiescent Current Output Off, VSD = 2.4V, RLOAD = 500Ω 30 μA
Includes IIH Current

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Typical Performance Characteristics

Maximum Power
Dissipation (TO-92) Dropout Voltage

Figure 7. Figure 8.

Dropout Voltage Quiescent Current

Figure 9. Figure 10.

Quiescent Current Quiescent Current

Figure 11. Figure 12.

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Typical Performance Characteristics (continued)

Quiescent Current Quiescent Current

Figure 13. Figure 14.

LM2936–5.0 COUT ESR LM2936–3.0 COUT ESR

50

Figure 15. Figure 16.

LM2936–3.3 COUT ESR Peak Output Current

Figure 17. Figure 18.

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Typical Performance Characteristics (continued)

Peak Output Current LM2936–5.0 Current Limit

Figure 19. Figure 20.

LM2936–5.0 Output at
LM2936–5.0 Line Transient Response Voltage Extremes

Figure 21. Figure 22.

LM2936–5.0 Ripple Rejection LM2936–5.0 Load Transient Response

Figure 23. Figure 24.

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Typical Performance Characteristics (continued)

LM2936–5.0 Low Voltage Behavior LM2936–5.0 Output Impedance

Figure 25. Figure 26.

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APPLICATIONS INFORMATION

Unlike other PNP low dropout regulators, the LM2936 remains fully operational to 40V. Owing to power
dissipation characteristics of the available packages, full output current cannot be ensured for all combinations of
ambient temperature and input voltage. As an example, consider an LM2936Z–5.0 operating at 25°C ambient.
Using the formula for maximum allowable power dissipation given in (1), we find that PDmax = 641 mW at 25°C.
Including the small contribution of the quiescent current to total power dissipation the maximum input voltage
(while still delivering 50 mA output current) is 17.3V. The LM2936Z–5.0 will go into thermal shutdown if it
attempts to deliver full output current with an input voltage of more than 17.3V. Similarly, at 40V input and 25°C
ambient the LM2936Z–5.0 can deliver 18 mA maximum.
Under conditions of higher ambient temperatures, the voltage and current calculated in the previous examples
will drop. For instance, at the maximum ambient of 125°C the LM2936Z–5.0 can only dissipate 128 mW, limiting
the input voltage to 7.34V for a 50 mA load, or 3.5 mA output current for a 40V input.
The junction to ambient thermal resistance θJA rating has two distinct components: the junction to case thermal
resistance rating θJC; and the case to ambient thermal resistance rating θCA. The relationship is defined as: θJA =
θJC + θCA.
For the SOIC-8 and PFM surface mount packages the θJA rating can be improved by using the copper mounting
pads on the printed circuit board as a thermal conductive path to extract heat from the package.
On the SOIC-8 package the four ground pins are thermally connected to the backside of the die. Adding
approximately 0.04 square inches of 2 oz. copper pad area to these four pins will improve the θJA rating to
approximately 110°C/W. If this extra pad are is placed directly beneath the package there should not be any
impact on board density.
On the PFM package the ground tab is thermally connected to the backside of the die. Adding 1 square inch of 2
oz. copper pad area directly under the ground tab will improve the θJA rating to approximately 50°C/W.
While the LM2936 has an internally set thermal shutdown point of typically 160°C, this is intended as a safety
feature only. Continuous operation near the thermal shutdown temperature should be avoided as it may have a
negative affect on the life of the device.
While the LM2936 maintains regulation to 60V, it will not withstand a short circuit above 40V because of safe
operating area limitations in the internal PNP pass device. Above 60V the LM2936 will break down with
catastrophic effects on the regulator and possibly the load as well. Do not use this device in a design where the
input operating voltage may exceed 40V, or where transients are likely to exceed 60V.

SHUTDOWN PIN
The LM2936BM has a pin for shutting down the regulator output. Applying a Logic Level High (>2.0V) to the
Shutdown pin will cause the output to turn off. Leaving the Shutdown pin open, connecting it to Ground, or
applying a Logic Level Low (<0.6V) will allow the regulator output to turn on.

(1) The maximum power dissipation is a function of TJmax, θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJmax − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2936 will go
into thermal shutdown.

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Equivalent Schematic Diagram

Figure 27.

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REVISION HISTORY

Changes from Revision M (March 2013) to Revision N Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 12

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM2936BM-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM293

& no Sb/Br) 6B3.3
LM2936BM-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6B5.0
LM2936BMX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6B3.3
LM2936BMX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LM293
6B5.0
LM2936BMX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6B5.0
LM2936DT-3.0 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM2936D
T-3.0
LM2936DT-3.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D
& no Sb/Br) T-3.0
LM2936DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D
& no Sb/Br) T-3.3
LM2936DT-5.0 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM2936D
T-5.0
LM2936DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D
& no Sb/Br) T-5.0
LM2936DTX-3.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D
& no Sb/Br) T-3.0
LM2936DTX-3.3 ACTIVE TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125

LM2936DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D
& no Sb/Br) T-3.3
LM2936DTX-5.0 NRND TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM2936D
T-5.0
LM2936DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D
& no Sb/Br) T-5.0
LM2936HVBMA-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H
BM3.3
LM2936HVBMA-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 2936H
& no Sb/Br) BM3.3

Addendum-Page 1
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www.ti.com 1-Nov-2013

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM2936HVBMA-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H

BM5.0
LM2936HVBMA-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 2936H
& no Sb/Br) BM5.0
LM2936HVBMAX3.3 NRND SOIC D 8 2500 TBD Call TI Call TI 2936H
BM3.3
LM2936HVBMAX3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM 2936H
& no Sb/Br) BM3.3
LM2936HVBMAX5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM 2936H
& no Sb/Br) BM5.0
LM2936HVMA-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H
M-5.0
LM2936HVMA-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 2936H
& no Sb/Br) M-5.0
LM2936HVMAX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 2936H
M-5.0
LM2936HVMAX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 2936H
& no Sb/Br) M-5.0
LM2936M-3.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6M-3
LM2936M-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM293
6-3.3
LM2936M-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6-3.3
LM2936M-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM293
6M-5
LM2936M-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN | CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6M-5
LM2936MM-3.0 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 KBC
LM2936MM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KBC
& no Sb/Br)
LM2936MM-3.3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 KBB
LM2936MM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KBB
& no Sb/Br)
LM2936MM-5.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KBA
& no Sb/Br)

Addendum-Page 2
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Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM2936MMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KBB
& no Sb/Br)
LM2936MMX-5.0 NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 KBA
LM2936MMX-5.0/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KBA
& no Sb/Br)
LM2936MP-3.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS CU SN Level-1-260C-UNLIM KACA
& no Sb/Br)
LM2936MP-3.3 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 KABA
LM2936MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KABA
& no Sb/Br)
LM2936MP-5.0 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 KAAA
LM2936MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KAAA
& no Sb/Br)
LM2936MPX-3.0 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 KACA
LM2936MPX-3.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KACA
& no Sb/Br)
LM2936MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KABA
& no Sb/Br)
LM2936MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 KAAA
& no Sb/Br)
LM2936MX-3.3 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LM293
6-3.3
LM2936MX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6-3.3
LM2936MX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LM293
6M-5
LM2936MX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN | CU SN Level-1-260C-UNLIM -40 to 125 LM293
& no Sb/Br) 6M-5
LM2936Z-3.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN | CU SN N / A for Pkg Type -40 to 125 LM2936
& no Sb/Br) Z-3
LM2936Z-3.3/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN | CU SN N / A for Pkg Type -40 to 125 LM2936
& no Sb/Br) Z-3.3
LM2936Z-5.0/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS SN | CU SN N / A for Pkg Type LM293
& no Sb/Br) 6Z-5
LM2936Z-5.0/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS SN | CU SN N / A for Pkg Type LM293
& no Sb/Br) 6Z-5

Addendum-Page 3
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM2936Z-5.0/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS SN | CU SN N / A for Pkg Type LM293
& no Sb/Br) 6Z-5
LM2936Z-5.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN | CU SN N / A for Pkg Type -40 to 125 LM293
& no Sb/Br) 6Z-5

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 4
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 5
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2936BMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936BMX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936BMX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936DTX-3.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM2936DTX-5.0 TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM2936HVBMAX3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936HVBMAX3.3/NOP SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
B
LM2936HVBMAX5.0/NOP SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
B
LM2936HVMAX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936HVMAX-5.0/NOP SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
B
LM2936MM-3.0 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MM-3.3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2936MM-5.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MMX-5.0 VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-3.3 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MPX-3.0 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MX-3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936MX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936MX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

*All dimensions are nominal

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2936BMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936BMX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LM2936BMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936DTX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936DTX-5.0 TO-252 NDP 3 2500 367.0 367.0 35.0
LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936HVBMAX3.3 SOIC D 8 2500 367.0 367.0 35.0
LM2936HVBMAX3.3/NOP SOIC D 8 2500 367.0 367.0 35.0
B
LM2936HVBMAX5.0/NOP SOIC D 8 2500 367.0 367.0 35.0
B
LM2936HVMAX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LM2936HVMAX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936MM-3.0 VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936MMX-5.0 VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-3.3 SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MPX-3.0 SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936MX-3.3 SOIC D 8 2500 367.0 367.0 35.0
LM2936MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936MX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LM2936MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0

Pack Materials-Page 3
 MECHANICAL DATA
NDP0003B

TD03B (Rev F)

www.ti.com
 MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M

7,30 (0.287) 3,70 (0.146)

6,70 (0.264) 3,30 (0.130)

Gauge Plane
1 2 3
0,25 (0.010)
0,84 (0.033) 0°–10°
2,30 (0.091)
0,66 (0.026)
0,10 (0.004) M
4,60 (0.181) 0,75 (0.030) MIN

1,70 (0.067)
1,80 (0.071) MAX 1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane

0,10 (0.0040) 0,08 (0.003)

0,02 (0.0008)

4202506/B 06/2002

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.

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