Sample Street Light Report 2 PDF
Sample Street Light Report 2 PDF
Sample Street Light Report 2 PDF
CHAPTER 1
1.1 INTRODUCTION
1.2 OBJECTIVE
CHAPTER 2
2.1 METHODOLOGY
and proximity sensor. The skin sensor and breadth alcohol sensor detects
the presence of alcohol content and the proximity sensor helps in
detecting any kind of malpractice. The novelty of this paper is to
effectively reduce the energy consumption of the street lights by
controlling the street light’s intensity, sensing both human as well as
vehicular movement and injury and death caused by drunk driving can be
prevented by prior sensing of the alcohol content in drivers by a simple.
Somchai Hiranvarodo describes a comparative analysis of photovoltaic
(PV) street lighting system in three different lamps. Namely, a low
pressure sodium lamp, a high pressure sodium lamp and a fluorescent
lamp have been used for installation in each mast to determine the
suitable system to install in a typical rural area of Thailand. All three
systems have been mounted with the same module type and wattage in
different places within the Rajamangala Institute of Technology,
Thanyaburi district, Pathumthani province of Thailand. An operation of
solar street lighting system can be divided into 2 period of time, namely,
at 18.00-22.00 hours and 05.00-06.00 hours. The design of a control circuit
was experimentally done in this work. Protection of the battery from
damage for deep discharge and overcharge by a controller was also
considered. The life cycle cost analysis (LCCA) is the appropriate method
for comparing three different lamps. The present worth of each system
can be compared and the least cost option selected. LCCA was based on
the key assumptions (year 2002). The results of comparative analysis of
the PV street lighting systems with a fluorescent lamp have been the
appropriate system for installation in a typical rural area of Thailand
when the cost of lamps, system performance and possibility for purchasing
the components of the system have been considered. The results of this
work can he stated that the average luminance in lux of the fluorescent
lamp at design location Pathumthani province of Thailand, has a highest
CHAPTER 3
PROPOSED SYSTEM
CHAPTER 4
Microcontroller
Transformer
Bridge Rectifier
Voltage Regulator
Light Dependent Resistor
IR Sensors
Relay
Diodes
Resistors
Capacitors
Transistor
Microcontroller ( PIC16f883 ) :-
Fig:4.2 PIC16F883 IC
PIC16f883 MICROCONTROLLER
baseline devices, but the two additional opcode bit allow 128 registers
and 2048 word of code to be directly addressed. There are a few
additional miscellaneous instructions, and two additional 8 bit literal
instructions, add and subtracts. The mid range core is available in the
majority of devices labelled PIC12 and PIC16.
Features
Device Features:
1 input only pin
25 I/O
High sink/source current 25 mA
Interrupt-on-pin change option
Timers:
TMR0: 8-bit timer/counter with 8-bit pre scaler
TMR1 enhanced: 16-bit timer/counter with pre scaler,
External Gate Input mode and dedicated low-power 32 kHz
oscillator
TMR2: 8-bit timer/counter with 8-bit period register,
prescaler and postscaler
Capture/Compare/PWM (CCP) module
Enhanced Capture/Compare/PWM (ECCP) module
with auto-shutdown and PWM steering
Master Synchronous Serial Port (MSSP) module
SPI™ mode, I2C™ mode with address mask capability
Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module:
Supports RS-485, RS-232 and LIN compatibility
Auto-Baud Detect
Auto-wake-up on Start bit
Analog Features:
Transformer :-
In the diagrams below, when the input connected to the left corner of
the diamond is positive, and the input connected to the right corner is
negative, current flows from the upper power supply terminal to the
right along the red (positive) path to the output, and returns to the lower
supply terminal via the blue (negative) path.
When the input connected to the left corner is negative, and the input
connected to the right corner is positive, current flows from the lower supply
terminal to the right along there (positive) path to the output, and returns to the
upper supply terminal via the blue ( negative ) path. In each case, the upper
right output remains positive and lower right output negative. Since this
is true whether the input is AC or DC, this circuit not only produces a
DC output from an AC input, it can also provide what is sometimes
called “ reverse polarity protection “. That is, it permits normal
functioning of the loads ( wires ) from a DC power source have been
reversed, and protects the equipment from potential damage caused by
reverse polarity.
The basic construction and symbol for LDR are shown in above
figures respectively. The device consists of a pair of metal film contacts
separated by a snake like track of cadmium sulphide film, designed to
provide the maximum possible contact area with the two metal films.
The structure is housed in a clear plastic or resin case, to provide free
access to external light. Practical LDRs are available in variety of sizes
and packages styles, the most popular size having a face diameter of
roughly 10mm. Practical LDR is shown in below figure.
IR Sensors :-
An infrared sensor is an electronic device, that emits in order to sense
some of aspects of the surroundings. An IR sensor can measure the
heat of an object as well as detects the motion. These types of
sensors measures only infrared radiations, rather than emitting it that is
called as a passive IR sensor. Usually in the infrared spectrum, all the
start operating but there are also miniature versions which can be
activated with a low current directly obtained from a microcontroller
port pins.
Diodes :-
In electronics, a diode is a two-terminal electronic component
That conducts primarily in one direction (asymmetric conductance); it
has low (ideally zero) resistance to the flow of current in one direction
, and high (ideally infinite) resistance in the other. A semiconductor
diode, the most common type today, is a crystalline piece of
semiconductor material with a p–n junction connected to two electrical
terminals. The diode can be viewed as an electronic version of a
check valve. This unidirectional behaviour is called rectification, and
is used to convert alternating current to direct current, including
extraction of modulation from radio signals in radio receivers—these
diodes are forms of rectifiers . A semiconductor diode's current–voltage
characteristic can be tailored by selecting the semiconductor materials
and the doping impurities introduced into the materials during
manufacture. These techniques are used to create special – purpose
Resistors :-
A resistor is a passive two terminal electrical component that
implements electrical resistance as a circuit element. In electronic
circuit, resistors are used to limit current flow, to adjust signal levels,
bias active elements, and terminate transmission line among other uses.
High power resistors, that can dissipate many watts of electrical power
as heat, may be used as part of motor controls, in power distribution
systems, or as test loads for generators. Fixed resistors have
resistances that only change slightly with temperature, time or
operating voltage. Variable resistors can be used to adjust circuit
elements ( such as a volume control or a lamp dimmer ), or as
sensing devices for heat, light, humidity, force, or chemical activity.
Capacitors :-
they smooth the output of power supplies. In resonant circuit they tune
radios to particular frequencies. In electric power transmission system,
they stabilise voltage and power flow.
Transistor (BC547) :-
BC547 is an NPN bipolar junction transistors. A transistor, stands for
transfer of resistance, is commonly used to amplify current. A small
current at its base controls a large current at collector and emitter
terminals. BC547 is mainly used for amplification and switching
purposes. It has a maximum current gain of 800. It’s equivalent
transistor are BC548 and BC549. The transistor terminals requires a
fixed DC voltage to operate in the desired region of its characteristic
curves. This is known as biasing. For amplification application, the
transistor is biased such that it is partly ON for all input conditions.
The input signal at base is amplified and taken at the emitter. BC547
is used in common emitter configuration for amplifiers. The voltage
divider is the commonly used biasing mode. For switching
applications, transistor is biased so that it remains fully ON if there is
a signal at its base. In the absence of base signal it gets completely
OFF.
CHAPTER 5
CIRCUIT DIAGRAM
CHAPTER 6
PROGRAMING CODE
#include<xc.h>
#include"config.h"
#include"adc.h"
#define LDR 0
#define RX1 2
#define RX2 1
#defineSTL2 PORTCbits.RC7
#defineRX2_THRESHOLD 100
#defineRX1_THRESHOLD 100
#defineON 1
#defineOFF 0
void Initilisation(void);
voidHardwareSetup(void);
void main(void)
HardwareSetup();
Initilisation();
While(1)
RELAY = OFF;
else
RELAY = ON;
Rx1Val = read_adc(RX1);
Rx2Val = read_adc(RX2);
STL1 = ON;
STL2 = ON;
Flag = 1;
{
STL1 = ON;
STL2 = OFF;
STL1 = OFF;
STL2 = ON;
Flag2 = 1 ;
STL1 = OFF;
STL2 = OFF;
Flag = 0;
If(Flag2 == 1)
Counter++;
If(Counter == 5000)
STL2 = OFF;
Flag2 = 0;
Counter = 0;
// DelayMs(250);
voidHardwareSetup(void)
TRISAbits.TRISA0 = 1;
ANSELbits.ANS0 = 1;
TRISAbits.TRISA1 = 1;
ANSELbits.ANS1 = 1;
TRISAbits.TRISA2 = 1;
ANSELbits.ANS2 = 1;
TRISBbits.TRISB0 = 0;
ANSELHbits.ANS12 = 0;
TRISCbits.TRISC6 = 0;
TRISCbits.TRISC7 = 0;
voidInitilisation(void)
init_adc();
RELAY = OFF;
STL1 = OFF;
STL2 = OFF;
/*
* Delayfunctions forHI-TECH C on the PIC
*
* Functions available:
*
DelayUs(x) : Delay specified number of microseconds
*
DelayMs(x) : Delay specifiednumber of milliseconds
*
* Note that there are range limits: x must not exceed 255 - for
*
Crystal frequencies > 12 MHz the range for DelayUs is even
*
smaller . To use DelayUs it is only necessary to include this file ;
*
to useDelayMs you must include delay . c in your project .
*
*/
or
picc -DXTAL_FREQ=100KHZ
Divided by 4.
*/
#ifndef XTAL_FREQ
#endif
#define DelayUs ( x)
_dcnt = (x)*((XTAL_FREQ)/(12MHZ)); \
While(--_dcnt != 0) \
Continue;
#else
#define DelayUs(x)
_dcnt = (x)/((12MHZ)/(XTAL_FREQ))|1; \
While(--_dcnt != 0) \
Continue;
#endif
/*
* Delay functions
*
See delay.h for details
*
* Make sure this code is compiled with full optimization!!!
SNGCE ECE DEPT Page 41
AUTOMATIC STREETLIGHT
*/
#include "delay.h"
VoidDelayMs(unsigned charcnt)
# if XTAL_FREQ<= 4MHZ
do
DelayUs(996);
} while( --cnt);
#endif
unsignedchar i;
do
i =4;
do
DelayUs(250);
} while(--i);
} while(--cnt);
#endif
Unsigned chari;
do
{
i= 4;
do
DelayMs(250);
} while(--i);
} while(--cnt);
#include<xc.h>
// CONFIG1
#pragmaconfigFOSC = HS
#pragmaconfigWDTE = OFF
#pragmaconfigCP = OFF
#pragmaconfigBOREN = OFF
#pragmaconfig IESO = ON
#pragmaconfigFCMEN = ON
// Fail – Safe Clock Monitor Enabled bit (Fail – Safe Clock Monitor is
Disabled)
// Low Voltage Programming Enable bit (RB3 pin has digital I/O, HV
On MCLR must be used for programming)
// CONFIG2
#pragmaconfigBOR4V = BOR40V
#pragmaconfigWRT = OFF
Extern voidinit_adc(void);
SNGCE ECE DEPT Page 46
AUTOMATIC STREETLIGHT
#include <pic.h>
#include "adc.h"
#include"delay.h"
void nit_adc()
ADCON0 = 0B00000001;
ADCON1 =0B10000000;
// TRISA =0XFF;
Unsignedintadc_value=0;
SNGCE ECE DEPT Page 47
AUTOMATIC STREETLIGHT
// DelayMs(20);
GO =1;
While(GO);
adc_value=ADRESH;
return(adc_value);
ADCON0&= 0xc7;
ADCON0 |= (Channel<<3);
DelayMs (20);
GO_nDONE = 1;
While(GO_Ndone);
Return((ADRESH<<8)+ADRESL) ;
CHAPTER 7
1. Drawing the layout of the PCB in the paper. The track layout of
the electronic circuit should be made in such manner that the paths
are in easy routes. It is then transferred to a Mylar sheet. The sheet
is then touched with black ink.
2. The solder side of the Mylar sheet is placed on the shiny side of
the five–star sheet and is placed in a frame. Then it is exposed to
sunlight with Mylar sheet facing the sunlight.
3. The exposed five–star sheet is put in hydrogen peroxide solution.
Then it is put in hot water and shook till unexposed region
becomes transparent.
4. This is put in cold water and then the rough side is stuck onto the
silk screen. This is then pressed and dried well.
5. The plastic sheet of the five-star sheet is removed leaving the
pattern on the screen.
6. A copper clad sheet is cut to the size and cleaned. This is placed
under screen.
7. As it resistant ink if spread on the screen so that a pattern of
tracks and a pad is obtained on a copper clad sheet. It is then
dried.
8. The dried sheet is then etched using Ferric Chloride solution ( 32
Baume ) till all the unwanted copper is etched away. Swish the
board to keep the each fluid moving. Lift PCB and check all the
unwanted copper is removed. Etching is done by immersing the
marked copper clad in a ferric chloride solution. After that the
etched sheet is dried.
9. The unwanted resist is removed using sodium hydroxide solution.
Holes are then dried.
7.2 SOLDERING
SOLDER
Types :
1. Rosin core :- 60/40 Sn/Pb solders are the most common types used
for electronics assembly. These solders are available in various
diameters and are most appropriate for small electronics work (
0.02” – 0.05” diameter is recommended )
2. Lead free :- Lead free solders are used as more environmental –
friendly substitutes for leaded solder, but they are typically not as
easy to use mainly because of their higher melting point and
poorer wetting properties.
3. Silver :- Silver solders are typically used for low resistance
connections but they have higher melting point and are expensive
than Sn/Pb solders.
4. Acid - core :- Acid – core solders should not be used for electronic.
They are intended for plumbing of non – electronic assembly work.
The acid – core flux will cause corrosion of the circuitry and can
damage components.
5. Other special solders :- various melting point eutectics : these
special solders are typically used for non – electronic assembly of
FLUX
It should provide a liquid cover over the materials and exclude air
gap up to the soldering temperature.
It should dissolve any oxide on the metal surface.
It should be easily replaced from the metal by the molten soldering
operation.
Residue should be removed after completing soldering operation.
The most common flux used in hand soldering of electronic
components is rosin, combination of mild organic acids extracted
from pine tree.
SOLDERING IRON
while few minutes. 50W and 25W soldering irons are commonly used for
soldering of electronic circuits.
SOLDERING STEPS :
1. Make the layout of the component in the circuit. Plug in the chord
of the soldering irons the main to get heated.
2. Straighten and clean the component leads using a blade or knife.
3. Mount the components on the PCB by bending the leads of the
components. Use nose pliers.
4. Apply flux on the joints and solder the joints. Solder must be in
minimum time to avoid dry soldering and heating up of the
components.
5. Wash the residue using water and brush.
6. Solder joints should be inspected when completed to determine if
they have been properly made.
A .Shiny surface
soldering has been removed, but before the solder has hardened.
Cold solder joints may work at first, but will eventually fail.
2. Air Pocket :- Air pocket ( voids ) result from incomplete wetting of
surface, allowing air to be in contact with the connecting metals.
This will cause oxidation of the joints & eventual failure. Blow
holes can occur due to vaporization of moisture on the surface of
the board & existing through the molten solder. Boards should be
clean & dry, prior to soldering. Ethanol ( 100% ) can be used as a
moisture chaser if boards are wet prior to soldering.
3. Dimples :- Dimples in the surface do not always indicate a serious
problem, but they should be avoided since they are precursors to
voids.
4. Floaters : Black spots :- Floating in the soldering fillet should be
avoided, because they indicate contamination & potential for failure
as in the case of voids. These black spots usually results from
overheated ( burnt ) Rosin or other contaminants such as burnt wire
insulation. Maintaining a clean tip will help to avoid these
problems.
5. Balls :- A solder balls instead of a fillet can occur if the trace was
heated but the leads were not ( vice versa ). This prevents proper
wetting of both surfaces & result in solder being attached to only
one surface ( component of trace ).
6. Excess solder :- Excess solder usage can cover up other potential
problems & should be avoided. It can lead to solder bridge. In
addition, spherical solder joints can result from the application of
too much solder.
CHAPTER 8
8.1 ADVANTAGES
Photo resistors convert light into electricity and are not dependent
on any other force.
LDR’s are sensitive, inexpensive, and readily available devices.
They have good power and voltage handling capabilities, similar to
those of a conventional resistor.
They are small enough to fit into virtually any electronic device
and are used all around the world as a basic component in many
embedded systems.
LDR may be connected either way round and no special
precautions are required when soldering.
8.2 DISADVANTAGES
CHAPTER 9
9.1 CONCLUSION
All this will be possible, however, only through innovation, hard work and
above all proper use of technology.
CHAPTER 10
REFERENCES
http://www.electronics-tutorials.ws
http://www.electronics.indianetzone.com
http://www.wikipedia.org
http://www.encyclobeamia.solarbotics.net
IOSR Journal of Electronics and Communication Engineering (IOSR-
JECE)
www.electronicsmanufacturers.com
www.engineersforyou.com
International Journal of Innovative Research in Science,
Engineering and Technology
(An ISO 3297: 2007 Certified Organization)
Vol. 3, Issue 2, February 2014