High Voltage 3-Phase Motor Driver: SLA6805MP

SLA6805MP
High Voltage 3-Phase Motor Driver
Features and Benefits Description

▪ Built-in pre-drive IC
The SLA6805MP inverter power module (IPM) device provides
▪ IGBT power element
a robust, highly-integrated solution for optimally controlling
▪ CMOS compatible input (5 V)
3-phase motor power inverter systems and variable speed
▪ High-side gate driver using bootstrap circuit or floating
control systems used in energy-conserving designs to drive
power supply
motors of residential and commercial appliances. These ICs
▪ Built-in protection circuit for controlling power supply
take 85 to 253 VAC input voltage, and 3 A (continuous) output
voltage drop
current. They can withstand voltages of up to 600 V (IGBT
▪ Overcurrent protection circuit (OCP)
breakdown voltage).
▪ Output of fault signal during operation of protection
circuit The SMA6800MP power package includes an IC with all of the
▪ Output current 3 A necessary power elements (six IGBTs), pre-driver ICs (two),
▪ Small SIP (SLA 23-pin) and flyback diodes (six), needed to configure the main circuit
Packages: Power SIP of an inverter. This enables the main circuit of the inverter to
Not to scale
be configured with fewer external components than traditional
designs.
Applications include residential white goods (home
applications) and commercial appliance motor control:
• Air conditioner fan
• Refrigerator compressor
Leadform Leadform
2152 (IEC)
• Dishwasher pump
2151 Leadform 2153
Functional Block Diagram VB
UV
R
D ETEC T HO
High-Side Driver Q
P U LSE R
VCC FILTER S
HV HS
LEV EL
SHIFT
HIN
P U LS E
G ENPERU LS E R
A TO
COM
VCC
LIN1 LO 1
D ELA Y
UV
D ETEC T
Low-Side Driver LIN2 LO 2

D ELA Y
LIN3 LO 3
D ELA Y
COM
RS
BLANK OCP
TIMER
and
FO (TOTEM POLE) HOLD
VTRIP
Figure 1. Driver block diagrams. RC
28610.02
This datasheet has been downloaded from http://www.digchip.com at this page

SLA6805MP High Voltage 3-Phase Motor Driver
Selection Guide
IGBT Breakdown IGBT Saturation Output Current
Part Number Packing Voltage, VCES(min) Voltage, VCE(sat)(typ) Continuous, IO(max) Pulsed, IOP (max)
(V) (V) (A) (A)
SLA6805MP 18 pieces per tube 600 1.75 3 6
Absolute Maximum Ratings, valid at TA = 25°C

Characteristic Symbol Remarks Rating Unit
IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 V
Logic Supply Voltage VCC Between VCC and COM 20 V
Bootstrap Voltage VBS Between VB and HS (U,V, and W phases) 20 V
Output Current, Continuous IO TC = 25°C 3 A
Output Current, Pulsed IOP PW ≤ 1 ms, duty cycle = 50% 6 A
Input Voltage VIN –0.5 to 7 V
RC Pin Input Voltage VRC Between RC and COM; CC ≤ 2200 pF 20 V
Allowable power dissipation PD TC = 25°C, all elements operating 32 W
Thermal resistance (Junction to Case) RθJC All elements operating (IGBT) 3.8 °C/W
All elements operating (FWD) 5.4 °C
Case Operating Temperature TCOP –20 to 100 °C
Junction Temperature (MOSFET) TJ 150 °C
Storage Temperature Tstg –40 to 150 °C
Recommended Operating Conditions

Characteristic Symbol Remarks Min. Typ. Max. Units
Main Supply Voltage VBB Between VBB and LS, IBB ≤ 2 A – 300 450 V
Logic Supply Voltage VCC Between VCC and COM 13.5 – 16.5 V
Dead Time tdead 1.5 – – μs
Junction Temperature TJ – – 125 °C
All performance characteristics given are typical values for circuit or

system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
Allegro MicroSystems, Inc. 2
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Typical Application Diagram
2 3 4 11
10
VB1 VB2 VB3
5
VCC1 HO1
1
HS1
HVIC
HO2
13
HS2 M
9
HIN1
8
HIN2
7
HIN3 HO3
6 12
COM1 HS3
14
23
VCC2
LO1
C o n t r o lle r
RC LVIC
20
LIN1 LO2
19 17
LIN2 RS
18
LIN3
LO3
16
RCIN
15
CC 22
FO
21
COM2
RS
15V
NOTE:
▪ All of the input pins are connected to GND with internal pull-down resistors rated at 100 kΩ, however, an external pull-down
resistor may be required to secure stable condition of the inputs if high impedance conditions are applied to them.
▪ To use the OCP circuit, an external shunt resistor, RS, is needed. The RS value can be obtained from the formula:
RS(Ω) = 0.5 V / Overcurrent Detection Set Current (A) .
▪ A blanking timer is built-in to mask the noise generated on RS at turn-on.
▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from
external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise
susceptibility is necessary.

ELECTRICAL CHARACTERISTICS, valid at TA=25°C, CC ≤ 2200 pF, unless otherwise noted

Characteristics Symbol Conditions Min Typ Max Units
Logic Supply Voltage VCC Between VCC and COM 13.5 15 16.5 V
Logic Supply Current ICC VCC = 15 V – 4 6 mA
VIH VCC = 15 V, output on – 2.0 2.5 V
Input Voltage
VIL VCC = 15 V, output off 1.0 1.5 – V
Input Voltage Hysteresis VIhys VCC = 15 V – 0.5 – V
IIH High side, VCC = 15 V, VIN = 5 V – 50 100 μA
Input Current
IIL Low side, VCC = 15 V, VIN = 0 V – – 2 μA
VUVHL 9.0 10.0 11.0 V
High side, between VB and U, V, or W
VUVHH 9.5 10.5 11.5 V
VUVHhys High side, hysteresis – 0.5 – V
Undervoltage Lock Out
VUVLL 10.0 11.0 12.0 V
Low side, between VB and U, V, or W
VUVLH 10.5 11.5 12.5 V
VUVLhys Low side, hysteresis – 0.5 – V
VFOL 0 – 1.0 V
FO Terminal Output Voltage VCC = 15 V
VFOH 4.0 – 5.5 V
Overcurrent Protection Trip Voltage VTRIP VCC = 15 V 0.45 0.50 0.55 V
tp1 VRC = 15 V, RC = 1 MΩ, CC = 1000 pF – 260 – μs
Overcurrent Protection Hold Time
tp2 VRC = 5 V, RC = 330 kΩ, CC = 2200 pF – 870 – μs
Blanking Time tblank VCC = 15 V – 2 – μs
IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 – – V
IGBT Leakage Current ICES VCC = 15 V, VCE = 600 V, VIN = 0 V – – 1 mA
IGBT Saturation Voltage VCE(sat) VCC = 15 V, IC = 3 A, VIN = 5 V – 1.75 2.1 V
Diode Forward Voltage VF VCC = 15 V, IF = 3 A, VIN = 0 V – 1.65 2.0 V
Diode Recovery Time trr IF = 3 A, di / dt = 100 A/μs – 50 – ns
tdH(on) – 315 – ns
trH – 55 – ns
Switching Time, High Side
tdH(off) – 455 – ns
tfH VBB = 300 V, VCC = 15 V, IC = 3 A, 0 V ≤ VIN ≤ 5 V, – 175 – ns
tdL(on) inductive load – 430 – ns
trL – 100 – ns
Switching Time, Low Side
tdL(off) – 410 – ns
tfL – 190 – ns

High Side Driver Input/Output Timing Diagrams
HIN
VUVHH
VB-HS VUVHL
UVLO
Release
HO
After UVLO is released, IC operation is started by the first rising edge of input
Low Side Driver Input/Output Timing Diagrams
LIN
VUVHH
VCC VUVHL
UVLO
Release
LO
tblank
VTRIP(H)
RS
tblank
VTRIP(L)
tp = RC × CC × {–ln (1–3.5 / VRC)}

where CC ≤ 2200 pF tp
FO
RC
Slope by RC,CC
After UVLO is released, IC operation is started by the first rising edge of input
After RC charging and releasing, the OCP operation is started by the first rising edge of input

Pin-out Diagrams
Leadform 2151 Leadform 2153

Tab Side
2 4 6 8 10 12 14 16 18 20 22
1 3 5 7 9 11 13 15 17 19 21 23
2 4 6 8 10 12 14 16 18 20 22
1 3 5 7 9 11 13 15 17 19 21 23
Leadform 2152
Tab Side
1 4 10 14
2 5 7 9 11 12 15 17 19 21 23
3 6 8 13 16 18 20 22
Tab Side
Terminal List Table

Number Name Function
1 U Output of U phase
2 VB1 High side bootstrap terminal (U phase)
3 VB2 High side bootstrap terminal (V phase)
4 VB3 High side bootstrap terminal (W phase)
5 VCC1 High side logic supply voltage
6 COM1 High side logic GND terminal
7 HIN3 High side input terminal (W phase)
8 HIN2 High side input terminal (V phase)
9 HIN1 High side input terminal (U phase)
10 VBB1 Main supply voltage 1 (connect to VBB2 externally)
11 VBB2 Main supply voltage 2 (connect to VBB1 externally)
12 W1 Output of W phase (connect to W2 externally)
13 V Output of V phase
14 W2 Output of W phase (connect to W1 externally)
15 LS2 Low side emitter terminal (connect to LS1 externally)
16 RCIN Overcurrent protection hold time adjustment terminal
17 LS1 Low side emitter terminal (connect to LS1 externally)
18 LIN3 Low side input terminal (W phase)
19 LIN2 Low side input terminal (V phase)
20 LIN1 Low side input terminal (U phase)
21 COM2 Low side GND terminal
22 FO Overcurrent protection fault-signal output terminal
23 VCC2 Low side logic supply voltage

Package Outline Drawing

Leadform 2151
Dual rows, 23 alternating pins; vertical case mounting; pin #1 opposite tab side
31.3 ±0.2
31 ±0.2
24.4 ±0.2
16.4 ±0.2 4.8 ±0.2
0.6
Gate protrusion
1.7 ±0.1
Ø3.2 ±0.15 Ø3.2 ±0.15
Gate protrusion
16 ±0.2 B 2.45 ±0.2

BSC
12.9 ±0.2
9.9 ±0.2
Branding Area
R1
REF
5 ±0.5
9.3 +0.1
– 0.5 +0.2
0.55 – 0.1
4.3
View A 1.27 ±0.5 A REF 4.5 ±0.7
0.65 +0.2
– 0.1
1 3 5 7 9 11 13 15 17 19 21 23
2 4 6 8 10 12 14 16 18 20 22
0.7 MAX
A Measured at pin tips Leadform: 2151
Deflection at pin bend
B To case top
Terminal core material: Cu
View A
Terminal plating: Ni
Recommended attachment: Solder dip (Sn-Ag-Cu)
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, type: SLA6805MP
2nd line, lot: YMDDT

Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
T is the tracking letter
Leadframe plating Pb-free. Device composition

complies with the RoHS directive.


Leadform 2152
Triple rows (IEC compliant), 23 alternating pins; vertical case mounting; pin #1 on tab side
31.3 ±0.2
31 ±0.2
24.4 ±0.2
16.4 ±0.2 4.8 ±0.2
0.6
Gate protrusion
1.7 ±0.1
Ø3.2 ±0.15 Ø3.2 ±0.15
Gate protrusion
16 ±0.2 B 2.45 ±0.2

BSC
12.9 ±0.2
9.9 ±0.2
Branding Area
R1
5 ±0.5 REF
8.7 +1
– 0.5
0.5 +0.2
– 0.1
3.7
REF 3.1 ±0.7 3.1 ±0.7
View A 1.27 ±0.5 A
0.6 +0.15
– 0.05
3 6 8 13 16 18 20 22
2 5 7 9 11 12 15 17 19 21 23
1 4 10 14
0.7 MAX
A Measured at pin tips Leadform: 2152
B To case top
View A

DD is the date



Leadform 2153
Dual rows, 23 alternating pins; pins bent 90° for horizontal case mounting; pin #1 in outer row
31.3 ±0.2
31 ±0.2
24.4 ±0.2
16.4 ±0.2 4.8 ±0.2
0.6
Gate protrusion
1.7 ±0.1
Ø3.2 ±0.15 Ø3.2 ±0.15
Gate protrusion
16 ±0.2 B 2.45 ±0.2

BSC
12.9 ±0.2
9.9 ±0.2 3 ±0.5
Branding Area BSC
2.2 ±0.7
BSC
R1
4.4 REF
REF
1.27 ±0.1 A 2.2 ±0.7

View A 0.6 ±0.1 BSC 0.5 ±0.1
1 2 3 5 7 9 11 13 15 17 19 21 23
4 6 8 10 12 14 16 18 20 22
0.7 MAX
A Measured at pin exit from case Leadform: 2153
B To case top
View A

DD is the date


Packing Specification
Leadforms 2151 and 2152
31.2
580
Tube material: PVC

Maximum 18 pieces per tube
13.8 (pins aligned along X direction)
Rubber plug each end
X
137
621
186
Z Maximum 12 tubes in Y direction

Maximum 12 tubes in Z direction
Y
Maximum pieces per carton:
18 pieces per tube
12 tubes per layer
x 3 layers of tubes
648 pieces per carton

Packing Specification
Leadform 2153
31.0
580
Tube material: PVC

Maximum 18 pieces per tube
15.8
(pins aligned along X direction)
X Rubber plug each end
130
610
185
Z Maximum 12 tubes in Y direction

Maximum 12 tubes in Z direction
Y
Maximum pieces per carton:
18 pieces per tube
10 tubes per layer
x 3 layers of tubes
540 pieces per carton

WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage Heatsink Mounting Method
environments and handling methods, please observe the following
cautions. Torque When Tightening Mounting Screws. The recommended tightening
Cautions for Storage torque for this product package type is: 58.8 to 78.4 N•cm (6.0 to
• Ensure that storage conditions comply with the standard 8.0 kgf•cm).
temperature (5°C to 35°C) and the standard relative humidity
Soldering
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity. • When soldering the products, please be sure to minimize the
• Avoid locations where dust or harmful gases are present and working time, within the following limits:
avoid direct sunlight.
• Reinspect for rust on leads and solderability of products that have 260±5°C 10 s
been stored for a long time.
Cautions for Testing and Handling 380±5°C 5s
When tests are carried out during inspection testing and other • Soldering iron should be at a distance of at least 1.5 mm from the
standard test periods, protect the products from power surges
body of the products
from the testing device, shorts between adjacent products, and
shorts to the heatsink. Electrostatic Discharge
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a • When handling the products, operator must be grounded.
heatsink, it shall be applied evenly and thinly. If more silicone Grounded wrist straps worn should have at least 1 MΩ of
grease than required is applied, it may produce stress. resistance to ground to prevent shock hazard.
• Volatile-type silicone greases may permeate the product and • Workbenches where the products are handled should be
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the grounded and be provided with conductive table and floor mats.
product. • When using measuring equipment such as a curve tracer, the
• Our recommended silicone greases for heat radiation purposes, equipment should be grounded.
which will not cause any adverse effect on the product life, are
indicated below: • When soldering the products, the head of soldering irons or the
Type Suppliers solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
G746 Shin-Etsu Chemical Co., Ltd.
• The products should always be stored and transported in our
YG6260 GE Toshiba Silicone Co., Ltd.
shipping containers or conductive containers, or be wrapped in
SC102 Dow Corning Toray Silicone Co., Ltd.
aluminum foil.

The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit im-
provements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this
publication is current before placing any order.
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products
at a certain rate is inevitable.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aerospace equipment) is not supported.
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written
confirmation of your specifications.
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equip-
ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are
given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property
rights, or any other rights of Sanken or Allegro or any third party that may result from its use.
Copyright © 2007 Allegro MicroSystems, Inc.

This datasheet is based on Sanken datasheet SSJ-03405.

Worldwide Contacts
Asia-Pacific
China Korea
Sanken Electric Hong Kong Co., Ltd. Sanken Electric Korea Co., Ltd.
Mirae Asset Life Building, 6F
Suite 1026, Ocean Centre, Canton Road
168 Kongduk-dong, Mapo-ku
Tsimshatsui, Kowloon, Hong Kong
Seoul 121-705, Korea
Tel: 852-2735-5262, Fax: 852-2735-5494 Tel: 82-2-714-3700, Fax: 82-2-3272-2145
Sanken Electric (Shanghai) Co., Ltd. Singapore
Room 3202, Maxdo Centre, Xingyi Road 8
Sanken Electric Singapore Pte. Ltd.
Changning District, Shanghai, China
150 Beach Road, #14-03 The Gateway West
Tel: 86-21-5208-1177, Fax: 86-21-5208-1757
Singapore 189720
Taiwan Sanken Electric Co., Ltd. Tel: 65-6291-4755, Fax: 65-6297-1744
Room 1801, 18th Floor, 88 Jung Shiau East Road
Sec. 2, Taipei 100, Taiwan R.O.C. Europe
Tel: 886-2-2356-8161, Fax: 886-2-2356-8261 Sanken Power Systems (UK) Limited
India Pencoed Technology Park
Pencoed, Bridgend CF35 5HY, United Kingdom
Saket Devices Pvt. Ltd. Tel: 44-1656-869-100, Fax: 44-1656-869-162
Office No. 13, First Floor, Bandal-Dhankude Plaza
Near PMT Depot, Paud Road North America
Kothrud, Pune 411 038, India
United States
Tel: 91-20-5621-2340, 91-20-2528-5449
Fax: 91-20-2528-5459 Allegro MicroSystems, Inc.
115 Northeast Cutoff
Japan Worcester, Massachusetts 01606, U.S.A.
Sanken Electric Co., Ltd. Tel: 1-508-853-5000, Fax: 1-508-853-7895
Overseas Sales Headquarters Allegro MicroSystems, Inc.
Metropolitan Plaza Building, 1-11-1 Nishi-Ikebukuro 14 Hughes Street, Suite B105
Toshima-ku, Tokyo 171-0021, Japan Irvine, California 92618, U.S.A.
Tel: 81-3-3986-6164, Fax: 81-3-3986-8637 Tel: 1-949-460-2003, Fax: 1-949-460-7837


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SLA6805MP

High Voltage 3-Phase Motor Driver

Features and Benefits Description

Functional Block Diagram VB

Low-Side Driver LIN2 LO 2

Figure 1. Driver block diagrams. RC

This datasheet has been downloaded from http://www.digchip.com at this page

SLA6805MP 18 pieces per tube 600 1.75 3 6

Absolute Maximum Ratings, valid at TA = 25°C

Recommended Operating Conditions

All performance characteristics given are typical values for circuit or

Typical Application Diagram

Allegro MicroSystems, Inc. 3

ELECTRICAL CHARACTERISTICS, valid at TA=25°C, CC ≤ 2200 pF, unless otherwise noted

Allegro MicroSystems, Inc. 4

High Side Driver Input/Output Timing Diagrams

Low Side Driver Input/Output Timing Diagrams

tp = RC × CC × {–ln (1–3.5 / VRC)}

Allegro MicroSystems, Inc. 5

Leadform 2151 Leadform 2153

Terminal List Table

Allegro MicroSystems, Inc. 6

Package Outline Drawing

Ø3.2 ±0.15 Ø3.2 ±0.15

16 ±0.2 B 2.45 ±0.2

2nd line, lot: YMDDT

Leadframe plating Pb-free. Device composition

Allegro MicroSystems, Inc. 7

Package Outline Drawing

Ø3.2 ±0.15 Ø3.2 ±0.15

16 ±0.2 B 2.45 ±0.2

2nd line, lot: YMDDT

Leadframe plating Pb-free. Device composition

Allegro MicroSystems, Inc. 8

Package Outline Drawing

Ø3.2 ±0.15 Ø3.2 ±0.15

16 ±0.2 B 2.45 ±0.2

1.27 ±0.1 A 2.2 ±0.7

2nd line, lot: YMDDT

Leadframe plating Pb-free. Device composition

Allegro MicroSystems, Inc. 9

Tube material: PVC

Z Maximum 12 tubes in Y direction

Allegro MicroSystems, Inc. 10

Tube material: PVC

Z Maximum 12 tubes in Y direction

Allegro MicroSystems, Inc. 11

Allegro MicroSystems, Inc. 12

Copyright © 2007 Allegro MicroSystems, Inc.

Allegro MicroSystems, Inc. 13

Allegro MicroSystems, Inc. 14

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