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    ASML - Products - HMI Escan Series

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    hijer

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    ASML - Products - HMI Escan Series

    Uploaded by

    hijer
    166 views1 page

    Original Title

    ASML_Products_HMI eScan series

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    Copyright:

    © All Rights Reserved
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    Download as pdf
    166 views1 page

    ASML - Products - HMI Escan Series

    Uploaded by

    hijer

    Copyright:

    © All Rights Reserved
    Download as PDF or read online from Scribd
    Download as pdf
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    @ eScan® Series ‘HOME -Proauets @Scan® Sores Description Scan series of e-beam inspection systems is designed for vanced wafer manutectuters. With the acvent of eScan®. orocty eacoine in advancee fate beng recaltrated oScan® F fers tact old ennancoment wth the smatest e-beam mepeztion| xol se, nignestsonctvty to DOI, and nan-resokton imaging for - Inspeeaon. Crystal clear on-o0lreviow magec oectvoly reduce ‘no ume to recut cys by oumunsting moet roviow SEM. requirements. eScan® 220% e-beam inspecton system caplures ‘ny physical defect and VC (Votage Convast)dafacs th Hl oscan®sones patented resoluton enhancement econ gun. eScan® 320:p's LeaphScan™ technology with LFOV (Lage Field of View) and WWDS { Whe Wafer Die Sampling ) provides effectively Rexbity for process monitoring. eScan® 400sp with continuous scan e-beam inspection system provides most cos fective solution nih balanced sensiviy end throughput for advanced memory and logic abs ‘oScan® 500: ‘eScari500 tne next genettion model fr the cutentTagship models eScar"320 and eScan®400, Faced win te continuing minituration demands of he manuracturng processes ofthe semiconductor customers, the image resolution of he eScari"500is enhanced by mare than 20% compared othe eScar320_Al the same ima, # bundles 4 mor flexible "LeapNScan™" scanning system wth he Continuous Scan system ‘Value Propostio + AN EBI system with longest fe ime for advanced abs. ‘+ An EB! system withthe highest sens to DOI (defect of intrest) signature detection “+ An EB! system wth the most retabe data andthe highest datactfcation matting, “+ AN EB! eystom ofoang to manos! connéonce ovel on advanced covice analy. + ANEBL system with Hits unique advanced charge control capabity, + The ellanager™ ADC system wih the mast advanced defect binning gorithm. ‘Applications ‘Scarfs capable of ganarating detect baselne for both physica and eiectical defects. eScans main applications incuce - Front-end of ine at Sade, HKMG and FinFET, Mid-end of ine a contact ACI and WCMP; and ack-and ofine at Via ACI and CU-CUP, ee.

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