This document contains acronyms commonly used in electronics manufacturing and telecommunications. Some key acronyms include 3GPP for 3rd Generation Partnership Project, ADC for Analog to Digital Converter, AGC for Automatic Gain Control, BER for Bit Error Rate, CDMA for Code Division Multiple Access, DSP for Digital Signal Processor, ESD for Electrostatic Discharge, FCC for Federal Communications Commission, GSM for Global System for Mobile communications, I2C for Inter-Integrated Circuit, IC for Integrated Circuit, LNA for Low Noise Amplifier, PLL for Phase Locked Loop, PCB for Printed Circuit Board, RF for Radio Frequency, RIM for Research In Motion, SNR
This document contains acronyms commonly used in electronics manufacturing and telecommunications. Some key acronyms include 3GPP for 3rd Generation Partnership Project, ADC for Analog to Digital Converter, AGC for Automatic Gain Control, BER for Bit Error Rate, CDMA for Code Division Multiple Access, DSP for Digital Signal Processor, ESD for Electrostatic Discharge, FCC for Federal Communications Commission, GSM for Global System for Mobile communications, I2C for Inter-Integrated Circuit, IC for Integrated Circuit, LNA for Low Noise Amplifier, PLL for Phase Locked Loop, PCB for Printed Circuit Board, RF for Radio Frequency, RIM for Research In Motion, SNR
This document contains acronyms commonly used in electronics manufacturing and telecommunications. Some key acronyms include 3GPP for 3rd Generation Partnership Project, ADC for Analog to Digital Converter, AGC for Automatic Gain Control, BER for Bit Error Rate, CDMA for Code Division Multiple Access, DSP for Digital Signal Processor, ESD for Electrostatic Discharge, FCC for Federal Communications Commission, GSM for Global System for Mobile communications, I2C for Inter-Integrated Circuit, IC for Integrated Circuit, LNA for Low Noise Amplifier, PLL for Phase Locked Loop, PCB for Printed Circuit Board, RF for Radio Frequency, RIM for Research In Motion, SNR
This document contains acronyms commonly used in electronics manufacturing and telecommunications. Some key acronyms include 3GPP for 3rd Generation Partnership Project, ADC for Analog to Digital Converter, AGC for Automatic Gain Control, BER for Bit Error Rate, CDMA for Code Division Multiple Access, DSP for Digital Signal Processor, ESD for Electrostatic Discharge, FCC for Federal Communications Commission, GSM for Global System for Mobile communications, I2C for Inter-Integrated Circuit, IC for Integrated Circuit, LNA for Low Noise Amplifier, PLL for Phase Locked Loop, PCB for Printed Circuit Board, RF for Radio Frequency, RIM for Research In Motion, SNR
ACLR Adjacent Channel Leakage Ratio ACPR Adjancent Channel Power Ratio ADC Analog to Digital Converter AFC Automatic Frequency Control AFT Audio Frequency Test AGC Automatic Gain Control ANT Antenna API Application programming interface ARFCN Absolute Radio Frequency Channel Number ARM Acorm RISC Machine (Processor) BCCH Broadcast Control Channel BER Bit Error Rate BJT Bipolar Junction Transistor BLER BLock Error Rate BLT Board Level Test BPF Band Pass Filter BS Base Station BT Bluetooth BW Band Width CBT Rhode&Schwarz Bluetooth Tester CDG CDMA Development Group CDMA Code Division Multiple Access CMU Rhode & Schwarz’s Universal Mobile Communications Tester CODEC Compressor/Decompressor CP Charge pump CPL Directional Coupler CSP Chip scale package CSR Cambidge Silicon Radio CW Continuous Wave DAC Digital to Analog Converter DB Decibel DL Downlink DRAM Dynamic Random Access Memory DSP Digital Signal Processor DUT Device Under Test EBI External bus interface E-DCH Enhanced Dedicated Channel EDGE Enhanced Data rates for GSM Evolution EIA Electronic Industries Alliance EMI Electromagnetic Interference ESD Electrostatic Discharge ESR Equivalent Series Resistance ETSI European Telecommunications Standards Institute EVDO Evolution Data Optimized EVM Error Vector Magnitude FCC Federal Comunications Comission FER Frame Error Rate FM Frequency Modulation GCAP Global Control Audio Power (IC) GND Ground RIM Training Jabil RR 2009 GPIB General Purpose Interface Bus GPS Global Positioning System GSM Global System for Mobile Comunications GUI Graphical User Interface HAST Highly accelerated stress test HIC Humidity indicator card HPF High Pass Filter HS High Speed HSDPA High Speed Downlink Packet Access HS-DPCCH High Speed Dedicated Physical Control Channel HSUPA High Speed Uplink Packed Access HTOL High-temperature operating life I In-Phase I2C Inter-Integrated Circuit IC Integrated Circuit ID Identification IDEN Integrated Digital Enhanced Network IF Intermediate Frequency ILPC Inner Loop Power Control IMEI International Mobile Equipment Identifier IP3 3er Order Intercept Point ISI Intersymbol Interference ISM Industry, Scientific and Medical JXDM An application used to communicate directly to the radio chipset LCD Liquid Crystal Display LDO Low Dropout (regulator) LED Light Emitting Diode Li Lithium LNA Low Noise Amplifier LO Local Oscillator LP Low Power LPF Low Pass Filter MAC Media Access Control MBB Moisture barrier bag MFG Manufacturer MFI Manufacturing Flash Image MIC Microwave Integrated Circuit MIC (Audio) Microphone MMIC Monolithic Microwave Integated Circuit MPP Multipurpose pin mQFN micro-Quad Flat No-lead package MRD Mobile Receive Diversity MS Mobile Station MSL Moisture sensitivity level MSM Mobile Station Modem (trademarked by QUALCOMM) MUX Multiplexer NC No Connect NF Noise Figure NVRAM No Volatil RAM OBW Occupied Bandwidth OBW Occupied Bandwidth ODCT Offset Direct Conversion Transmitter RIM Training Jabil RR 2009 OTG On-the-go PA Power Amplifier PATS Portable Auomated Test Software PBM Pulse burst modulation PCB Printed Circuit Board PDA Personal Digital Assistant PDM Pulse Density Modulated PDTCH Packet Data TCHannel PECL Pseudo Emitter Coupled Logic PFM Pulse frequency modulation PLL Phase Locked Loop PM Power management POP Populated Print Circuit Board PRT Parametric Radio Test PRx Primary receiver PSAP Public Safety Answering Point PSK Phase Shift Keying PTT Push to Talk PWM Pulse Width Modulation Q Quadrature QAM Quadrature Amplitude Modulation QCT QUALCOMM CDMA Technologies division QPSK Quadrature Phase Shift Keying RBF Reject Band Filter REV Revision RF Radio Frequency RFR RF Receiver RFT RF Transmitter RFT Radio Frequency Test RIM Reaserch In Motion RMS Root Mean Square RSSI Receive Signal Strength Indication RTAS RIM Tool Authentication Server RTC Real Time Clock RTR RadioOne RF Tranceiver RTR RF Transceiver RUIM Removable user identity module Rx Receive SAR Specific Absortion Ratio SAW Surface Acoustic Wave (Filter) SBI Serial bus interface (3-wire unless designated as SSBI) SCL Serial Clock SDA Serial Data S-GPS Simultaneous-GPS SHDR Simultaneous Hybrid Dual Receiver SiGe Silicon germanium SIM Subscriber Information Module SMPS Switched-mode power supply (DC-to-DC converter) SMT Surface mount technology SnPb Tin/lead SNR Signal to Noise Ratio SPI Serial Protocol Interface RIM Training Jabil RR 2009 SPI (BT) Serial Peripheral Interface SRx Secondary Receiver SSBI Single-wire serial bus interface SVP Standarized Virtual Parts TCCH Trafic Correction Channel TCXO Temperature Compensated Crystal Oscillator TDMA Time Division Multiply Access TEDI Tracking Engineering and Device Issues TOA Time of Arrival TTFF Time To First Fix TX Transmit UARFCN UMTS ARFCN UART Universal Asynchronous Receiver/Transmitter UMTS Universal Mobile Telecommunications System UPS Uninterruptible Power Supply USB Universal Serial Bus VCC Supply Voltage VCO Voltage Controlled Oscillator VCTCXO Voltage-controlled temperature-compensated crystal oscillator VNC Virtual Network computing WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network WPIC World Phone Integrated Circuit XTAL Crystal a radio architecture that converts received signals directly from RF to Zero-IF or ZIF Zero baseband, thereby eliminating the transmit signals likewise eliminate the Tx intermediate frequency IF, upconverting directly from baseband to RF I2S Inter IC Sound PCM Pulse Code Modulation Bps Bits per second 3G Third Generation 3PL Third Party Logistics Provider ABAP language ABC Activities Based Costing ADSL Asymmetric Digital Subscriber Line AI Automatic Insertion AIT Automatic Inspection Technology AMA American Management Association AML Approved Manufacturer's List AMPL Approved Manufacturer's Parts List AMT Advanced Manufacturing Technology AOI Automatic Optical Inspection A/P Accounts Payables APICS American Production and Inventory Control Society - Supply Chain APO Adaptive Performance Optimization APQP Advanced Product Quality Planning APS Advanced Planning System AQL Acceptable Quality Level A/R Accounts Receivable ASIC Application Specific Integrated Circuit ASP Attached Support Processor ATO Assemble to Order RIM Training Jabil RR 2009 ATP Available to Promise AVL Approved Vendor List AXI Automated x-ray inspection AXL Axial< B B2B Business to Business BAT Board Assembly and Test BCCP Bump Chip Carrier BGA Ball Grid Array BIOS Basic Input/Output System BOM Bill of Material BPCS Business Planning and Control Systems BPH Boards per Hour BPP Business Process Procedure BSI British Standards Institute BSQC Bottom Side Quality Control BST Board System Test BTO Build to Order BUC Business Unit Coordinator BUD Business Unit Director BUM Business Unit Manager BW Business Warehouse C CAC Corrective Action Committee CAD Computer Aided Design CAE Computer Aided Engineering CAM Computer Aided Manufacturing CAR Corrective Action Report CAS Chemical Abstract Service CAT Corrective Action Team CBGA Ceramic Ball Grid Array CCGA Ceramic Column Grid Array CDFP Ceramic Dual Flat Package CDIP Ceramic Dual Inline Package CDMA Call Division Multiple Access CEM Contract Electronics Manufacturing CEO Chief Executive Officer CFO Chief Financial Officer CFR Cost & Freight CGA Column Grid Array CIF Cost, Insurance & Freight CIM Computer Integrated Manufacturing CIP Carriage and Insurance Paid To CIQ Computer Integrated Quality CIQS Computer Integrated Quality System CIS Customer Information System CLF Customer Line Fallout CM Contract Manufacturing - former term used to describe EMS (Electronic CMR Change Management Request CMTS Cellular Mobile Telephone System COB Chip on Board or Close of Business COC Certificate of Compliance RIM Training Jabil RR 2009 COGM Cost of Goods Manufacturer CofC Certificate of Compliance/Conformity COGS Cost of Goods Sold COO Chief Operating Officer COSHH Control of Substances Hazardous to Health CPE Customer Provided Equipment CPGA Ceramic Pin Grid Array Package CPIM Certified in Production and Inventory Management CPT Carriage Paid To CQFP Ceramic Quad Flat Pack CRD Component Reference Designator CRP Capacity Requirements Planning CRT Cathode Ray Tube CSP Certified Service Provider CSR Customer Service Representative CTB Clean To Build CTO Configure to Order CTS Clean To Start CV Single Line Phone CWA Contract Work Authorization D D/S Direct Sale D/W Direct Withdrawal DAF Delivered at Frontier DBW Drive by Wire DC Distribution Center DDP Delivered Duty Paid DDU Delivered Duty Unpaid DE Design Engineer DEQ Delivered Ex Quay DES Delivered Ex Ship DF Direct Fulfillment DFA Design for Assembly DFD Design for Disassembly DFEMC Design for Electromagnetic Compatibility DFESD Design for Electrostatic Discharge DFI Design for Installability DFM Design for Manufacturing; Design for Maintainability DFML Design for Material Logistics DFP Design for Procurement; Design for Production; Design for Packageability DFQ Design for Quality Design for Redesign; Design for Reliability; DFR Design for Reuse; Design for Repair DFS Design for Safety; Design for Simplicity; Design for Speed DFT Design for Test DFX Design for Excellence DGR Daily Going Rate DID Direct Inward Dialing - type of telephone line that is not part of the internal DII Days In Inventory DIMM Dual Inline Memory Module DIP Dual Inline Package DL Direct Labor RIM Training Jabil RR 2009 DLT Digital Linear Tape DNS Design Navigate System DOA Dead On Arrival DOC Microsoft Word file extension DOE Design of Experiment DOF Direct Order Fulfillment DOH Days on Hand DPM Defects per Million - common Quality term DPMO Defects per Million Opportunities - common Quality term DR Dynamic Replenishment DRM Dynamic Replenishment Model DSI Digital Speed Interpolation DSL Digital Subscriber Line DSO Days Sales Outstanding DSP Digital Signal Processor DTS Dock to Stock DWDM Dense Wavelength Division Multiplexing E EBN Electronic Buyer's News (EMS Industry publication) E&O Errors and Omissions (type of insurance) EC Electronic Commerce ECN Engineering Change Notice ECO Engineering Change Order ED Electrically Defective EDI Electronic Data Interchange EDM Electronic Document Management EDS Engineering Data Services EEO Equal Employment Opportunity EFT Electronic Funds Transfer EMC Electromagnetic Compatibility EMI Electromagnetic Interference EMS Electronic Manufacturing Services EOL End Of Life EPBGA Enhanced Plastic Ball Grid Array EPS Electronic Packout System or Earnings Per Share EQFP Enhanced Quad Flat Pack ERP Enterprise Resource Planning ERS Evaluated Receipt Settlement ESD Electrostatic Discharge ESI Early Supplier Involvement ESS Environmental Stress Screening ETA Estimated Time of Arrival ETD Estimated Time of Delivery F FA Final Assembly or Field Analysis FAB Bare board FAI Final Article Inspection FAS Free Alongside Strip FCA Free Carrier FCD Factory Complete Date FCPA Foreign Corrupt Practices Act FEDI Financial Electronic Data Interchange RIM Training Jabil RR 2009 FGI Finished Goods Inventory FIFO First In, First Out FNI Final Inspection FM Functional Manager FMEA Failure Mode Effect Analysis FOB Free On Board FPY First Pass Yield FQC Final Quality Control FQFP Fine Pitch Metric Quat Flat Package FSA Full System Assembly FSR Field Service Return FST Functional System Test FTP File Transfer Protocol FVT Functional Verification Test G GAL Global Address List in Outlook GDT Global Desktop Team GHD Global Help Desk GIF Graphics Interchange Format - graphics file extension GMP Good Manufacturing Practices GNT Global Network Team GPS Global Performance System; GQAM Global Quality Assurance Manager GRN Goods Receipt Number GSB General Services Building (St. Petersburg, Florida) GSM General Surface Mount GST Global Systems Team GTB Global Technology Building GTS Global Test Services GUI Graphical User Interface H HALT Highly Accelerated Life Test HASS Highly Accelerated Stress Screening HDD Hard Disk Drive HERS Manufacturer's Part Number in SAP HI POT High Potential Safety Test HMP Highly Marketable Part HMU Hot Mock Up HP Hewlett Packard Corporation HQFP Heat Spreader Quad Flat Pack Package HR Human Resources H&S Health and Safety HSP High Speed Placement HTML Hypertext Markup Language - web development language HVLM High Volume, Low Mix I IA Inventory Analyst IC Integrated Circuit ICT In-Circuit Test IL Indirect Labor IMD In-mold Decoration IMPCON Integrated Manufacturing Production Control RIM Training Jabil RR 2009 IP Investors in People;Intellectual Property IPC Institute of Interconnecting and Packaging Electronic Circuits IR Investor Relations ISO International Standards Organization IT Information Technology J Jabil Circuit stock symbol on the JBL New York Stock Exchange JEL Jabil Emerging Leader JGS Jabil Global Services JIT Just-In-Time Inventory System JPG Joint Photographic Experts Group - graphics file extension JPN Jabil Part Number JTS Jabil Technology Services JVN Jabil Voice Network L LAN Local Area Network LCC Leadless Chip Carrier LCL Lower Control Limit LDCC Leaded Chip Carrier, J-Leads LFCSP Lead Frame Chip Scale Package LIFO Last In, First Out LGA Land Grid Array LOA Letter of Agreement/Agency LOI Letter of Intent LQFP Linear Quad Flat Pack Package LVHM Low Volume High Mix M MCU Multi-Point Control Unit MDA Manufacturing Defect Analysis ME Manufacturing Engineer MELF Metal Electrode Face MES Manufacturing Execution System MESS Material Excess and Shortage Status> MET Manufacturing Engineering Technician MFG Manufacturing MFPY Monthly First Pass Yield MIS Management Information System MIT Manager in Training MLP Micro Lead Frame Package MO Machine Operator MOQ Minimum Order Quantity MPC Management, Planning and Control MPM Screen Printer Manufacturer MPMS Mold Production Management System MPS Master Production Schedule MPU Main Processing Unit MPV Material Price Variance MQA Materials Quotation Analyst MQFP Micro Quad Flat Pack MRB Material Review Board MRO Maintenance, Repair & Operating Supplies RIM Training Jabil RR 2009 MRP Materials Requirements Planning MS Master Schedule MSA Material Supplier Agreement MSDS Material Safety Data Sheet MSN Multi Service Network MSOP Miniature Small Outline Package MTBF Mean Time Between Failures MTD Month-To-Date N NAFTA North American Free Trade Agreement NBV Net Book Value NCD New Customer Development NDA Non Disclosure Agreement NDF Non-Defined Fail NGA Node Gate Array NPFs No Problem Found Assemblies NPI New Product Introduction NRE Non Recurring Expense NTI New Technology Introduction NYSE New York Stock Exchange O OBA Out of Box Audit ODM Original Design Manufacturer OEE Overall Equipment Effectiveness OEM Original Equipment Manufacturer OLA Operations Level Agreement OLE Overall Labor Efficiency ORT On-Going Reliability Test OSHA Occupational Safety and Health Act OTD On Time Delivery OTS On Time Ship OTW Over the Wave P P&L Profit and Loss P/n Part Number PBA Printed Board Assembly PBGA Plastic Ball Grid Array PBX Private Branch Exchange PC Production Coordinator; Personal Computer PC & L Production Control and Logistics PCA Printed Circuit Assembly PCB Printed Circuit Board PCBA Printed Circuit Board Assembly PCI Peripheral Component Interface PDA Personal Digital Assistant PDF Portable Document Format PDM Product Data Management PE Production Engineer;Price Earnings ratio PEL Permissible Exposure Limit PFMEA Product/Process Failiure Mode Effects and Analysis PFTA Pre-Functional Test Assembly PGA Plastic Grid Array/Pin Grid Arrays RIM Training Jabil RR 2009 PGI Post Goods Issue PI Physical Inventory PLCC Plastic J-Lead Carrier PLD Programmable Logic Devices PLS Purchase Leverage System PLV Production Line Verification PNG Portable Network Graphics PO Purchase Order POC Point of Contact POD Proof of Delivery POS Point of Service POST Power-On Self-Test PP Production Planner PP1 Pre-Production Run 1 PPE Personal Protective Equipment PPT Microsoft Powerpoint file extension PPV Purchase Price Variance PQFP Plastic Quad Flat Package PR Public Relations PRWS Pre-Wash PSA Pre-Ship Audit PTF Platform Tray Feeder PTH Plated Through Hole PVT Process Verification Test PWA Printed Wiring Assembly PWB Printed Wiring Board Q Q&A Question & Answer QBR Quarterly Business Review QC Quality Control QE Quality Engineer QFD Quality Function Deployment QFMS Quality First Management System QFP/QFN Quad Flat Pack/Quad Flat No-Lead QM Quality Management Module QN Quality Network QSOP Quarter Size Outline Packages QTEC Quality, Teamwork, Empowerment, Continuous Improvement R R&D Research & Development RAMTF Random Access Matrix Tray Feeder RDL Radial REQ Resource Expenditure Quote RF Radio Frequency RFC Request For Change RFQ Request for Quotation RI Receive Inspection RIR Receive Inspection Report RMA Return Materials Authorization RODMAN Regional Operations Development Manager ROI Return On Investment ROIC Return On Invested Capital RIM Training Jabil RR 2009 RPC Reclaimed Production Components RQFP Power Quad Flat Pack RTC Return to Customer RTV Return to Vendor S S&P 500 Standard & Poor's 500 SaaS Software as a Service SAF Sub-Assembly Forecast SAP Systems, Applications & Products - Jabil's ERP system SBGA Super Ball Grid Array SCAR Supplier Corrective Action Report SCM Supply Chain Management SCSI Small Computer Systems Interface SEC Securities Exchange Commission SED Shipper's Export Declaration SHP Surface Horizontal Package SIM Single Inline Module SIP Single Inline Package SIS Supplier Information System SLA Service Level Agreement SLI Shipper's Letter of Instruction SMCI Supplier Managed Consigned Inventory SMD Surface Mount Device SME Subject Matter Expert SMI Supplier Managed Inventory SMT Surface Mount Technology SNT System Network Test SO Small Outline Integrated Circuit SOC Small Outline, C-Leads SOIC Small Outline Integrated Circuit SONET Synchronous Optical Network SOJ Small Outline Package with J Leads SOT Small Outline Transistor SOW Statement of Work SPB Seconds per Board SPC Statistical Process Control, former manufacturing quality system currently SPV Sales Price Variance SQE Supplier Quality Engineer SQFP Small Quad Flat Package SROH Abbreb for c-class component in SAP SSD Solid State Device SSL Secure Socket Layer SSOP Shrink Small Outline Package STP Shielded Twisted Pair SVP Senior Vice President SVS Synthetic Vision System T TAB Tape Automated Bonding TAM Telecommunications Access Method TARS Test Analysis and Rework System TBGA Tiny Ball Grid Array TE Test Engineer RIM Training Jabil RR 2009 TER Travel and Entertainment Report TH Through Hole TLV Threshold Limit Value TP Transport Protocol TQFP Thin Quad Flat Package TQM Total Quality Management TQRDCE Technology/Quality/Responsiveness/Delivery/Cost/Environment TS Transport Stream TSOP Thin Shrink Outline Package TSQC Top Side Quality Control TSSOP Thin Shrink Small Outline Packages TTM Time To Market TTV Time To Volume TVSOP Thin Very Small Outline Packages U UCL Upper Control Limit UK United Kingdom USD United States Dollar V VAMs Vendor Accounts Managers VCC Voltage Constant Current VCD Vertical Component Device VCLF Verified Customer Line Fallout VGA Video Graphic Analyzer VOC Volatile Organic Compounds VOIP Voice Over Internet Provider VMI Vendor Managed Inventory VP Vice President VPN Virtual Private Network VQFP Very Thin Quad Flat Package W WACC Weighted Average Cost of Capital WAN Wide Area Network WIP Work in Progress WMA Windows Media File extension for audio files WMV Windows Media File extension for video files X XLS Microsoft Excel file extension XML Extensible Markup Language Z ZIP Zig Zag Inline Package, TH Leads