Cinterion Datasheet Evolution LGA0
Cinterion Datasheet Evolution LGA0
Cinterion Datasheet Evolution LGA0
LGA Solderable
LGA RLS
Mounting
Quad-Band TCP/IP
EDGE Industrial
Class 12 Interface
GPRS USB
Class 12
Cinterion’s Evolution Platform is comprised of multiple Part of the Evolution Platform, the LGA solderable products
Cinterion modules offering scalability, compatibility as well as including the EES3, EGS5, EGS3 and BGS3 modules which
an easy path to future upgrades and added functionality as feature efficient and reliable LGA mounting technology along
technology needs expand. Portfolio benefits include maximum with optimized size and performance.
flexibility, high functionality, ease of integration, as well as The modules are based on a new advanced processor design
backward and forward compatibility, which ensures a reliable, and the field proven and reliable Cinterion M2M software
high quality and cost efficient solution that preserves your stack. The latest chip technology enables high performance,
technology investment. improved efficiency and the benefit of long-term availability.
www.cinterion.com
EES3, EGS5, EGS3, BGS3
Same footprint, full flexibility
▪ EDGE Class 12 The EES3 Wireless Module — One of the smallest EDGE modules in the world
▪ GPRS Class 12 (Enhanced Data Rates for GSM Evolution — the fastest transmission standard in
▪ GSM GSM). The EES3 features an integrated TCP/IP stack over AT, serial and USB ports,
and a RIL driver for Microsoft® Windows™ Mobile 6.1 based devices.
▪ GPRS Class 12 The EGS5 Wireless Module — Offers embedded JAVA™ processing based on a
▪ GSM state-of-the-art ARM 9 processor architecture. Other features include GPRS Class
EGS5 ▪ JAVA™ 12 functionality, an integrated TCP/IP stack over AT, and an array of industrial
interfaces such as SPI, I²C bus, USB, AD/DA converter, and multiple GPIOs.
▪ GPRS Class 12 The EGS3 Wireless Module — Offers enhanced M2M connectivity with GPRS
▪ GSM Class 12 functionality, an integrated TCP/IP stack over AT as well as industrial
interfaces SPI, I²C, and USB port.
▪ GPRS Class 10 The BGS3 Wireless Module — Basic M2M functionality with GPRS Class 10
▪ GSM functionality, two serial interfaces, an integrated TCP/IP stack over AT and a RIL
driver for Microsoft® Windows™ Mobile 6.1 based devices.
EDGE Class 12 — The highest symmetric data speed (236.8 kbps in uplink and
33.9 mm 3.2 mm downlink) for M2M applications requiring fast data transmissions.
GPRS Class 12 — High symmetric data speed (86 kbps in uplink and downlink) for
M2M applications.
29.6 mm
Internal Memory — Fully integrated and optimized internal memory for highest
reliability and easy design-in.
JavaTM — Java offers easy and fast application development, a broad choice of
tools, high code reusability, easy maintenance, a proven security concept, on-device
debugging as well as multi-threading programming and program execution.
Original size Multi SIM Interface — Flexible SIM interface enables usage of the best fitting and
newest SIM technology — from regular SIM cards to M2M component SIM's.
LGA Benefits
Land grid array, or LGA, is a surface-mount technology for
fully automated manufacturing allowing the benefit of
efficiency and process consistency. Cinterion’s unique type
of LGA technology was designed with a focus on reliability
and flexibility to meet the demanding requirements of M2M
applications.
© Copyright 2008, Cinterion • Subject to changes in technology, design and availability • Order No: L30960Y1000A200 • Printed in Germany