TOPIC - Integrated Circuit: Class-Bca 1 Semester

MLSU
CLASS- BCA 1st SEMESTER
TOPIC – Integrated Circuit

PRESENTED BY:-
Shalini Purohit
UNDER GUIDENCE OF:-

Sonu Upadhyay Mam
Index
 Introduction
 Types –
1. Monolithic IC’s
2. Thick and Thin film IC’s
3. Hybrid IC’s
 GENERATIONS-
1. SSI
2. MSI
3. LSI
4. VLSI
5. VVLSI
6. WSI
7. NANOTECHNOLOGY
 Advantages and Disadvantages
 IC Packages
Introduction
• WHAT IS INTEGRATED CIRCUITS ?
• A complex set of electronic components and
their interconnections that are imprinted onto a
tiny slice of semiconducting material.
• Integrated Circuits are usually called ICs or
chips.
Integrated circuits were made possible by
experimental discoveries which showed
that semiconductor devices could perform
the functions of vacuum tubes and by mid-
20th-century technology advancements in
semiconductor device fabrication.
• The integration of large numbers of tiny
transistors into a small chip was an
enormous improvement over the manual
assembly of circuits using electronic
components.
• The integrated circuit's mass production
capability, reliability, and building-block
approach to circuit design ensured the rapid
adoption of standardized ICs in place of
designs using discrete transistors.
History of ic
An IC also refered as chip or micro chip is a set of electroic
circuits on one small chip of semiconductor material,
normaly silicon.
This can be made much smaller than a discreet circuit

made from independent electronic components.
IC’s can be made very compact having up to several
billion transistors and other electronic components in an
area the size of a fingure-nail.
The width of each conducting line in a circuit can be made

smaller and smaller as a technology advances; in 2008 it
dropped below 100 nanometers and has now being
reduced to tens of nanometers.
Structure of IC
TYPES OF IC’s
• Monolithic IC’s
1
• Thick and Thin film IC’s

2
• Hybrid IC’s
3
Monolithic IC’s
A Monolithic Microwave Integrated
Circuit, or MMIC is a type of integrated
circuit (IC) device that operates
at microwave frequencies.
 These devices typically perform

functions such as microwave mixing,
power amplification, low-noise
amplification, and high-frequency
switching.
Inputs and outputs on MMIC devices are frequently
matched to a characteristic impedance of 50 ohms.
This makes them easier to use, as cascading of
MMICs does not then require an external matching
network.
Thick & Thin Film IC’s
The general characteristic, properties,
and appearance of thin and thick-film
integrated circuits are similar, although
they both differ in many respect from
monolithic integrated circuits.
 They are not formed within a

semiconductor wafer but on the surface of
an insulating substrate such as glass or an
appropriate ceramic material.
The primary difference between the thin-and-thick-film
techniques is the process employed for the forming the passive
component and the metallic conduction pattern.
The thin-film circuit employs an evaporation or cathode-

sputtering technique; the thick film employs silk-screen techniques.
Hybrid IC’s (HIC)
 A hybrid integrated circuit, HIC, hybrid microcircuit, or
simply hybrid is a miniaturized electronic circuit
constructed of individual devices, such as semiconductor
devices (e.g. transistors and diodes) and passive
components (e.g. resistors, inductors, transformers,
and capacitors), bonded to a substrate or printed circuit
board (PCB).
Hybrid circuits are often encapsulated in epoxy,
as shown in the photo.
A hybrid circuit serves as a component on a PCB

in the same way as a monolithic integrated circuit.
 The difference between the two types of devices

is in how they are constructed and manufactured.
Generations of IC’s
 SSI
 MSI
 LSI
 VLSI
 VVLSI
 WSI
 NANO TECHNOLOGY
Scale of integration
Small Scale Integration (SSI)
 Normally it has about 20 components.
 The Minuteman missile and Apollo program needed

lightweight digital computers for their initially-guided
flight computers.
 The Apollo guidance computer led and motivated the

integrated-circuit technology, while the Minuteman
missile forced it into mass-production.
Medium Scale Integration (MSI)
 It can have about 100 components.
 Medium Scale Integration came in to

industry in late 1960s.
 MSI is the next step in the development

of integrated circuits after 'Small Scale
Integration'.
 Medium-Scale Integration allowed more

complex systems to be produced using
smaller circuit boards than in SSI (Small
Scale Integration).
Large Scale integration (LSI)
It have about 1000 components.
LSI is the process of integrating or embedding

thousands of transistors on single silicon
semiconductor microchip. LSI technology
was conceived in mid-1970s when computer
processor microchips were under development
Very Large Scale Integration (VLSI)
Very large scale integration.
It can have about 10,000 components.
VLSI began in the 1970s ,when
complex semiconductor and communication t
echnologies were being developed.
Very Very Large Scale Integration(VVLSI)
Very Very Large Scale Integration

 Also known as Ultra large scale integration.
It can have about 10million components.
The ability to pack more electronic components onto
a chip increases the computational power and speed
of the computer or other machine in which the chip
resides.
Wafer Scale Integration(WSI)
The evolution in semiconductor technology that
builds a gigantic circuit on an entire wafer.
Just as the integrated circuit eliminated cutting apart

thousands of transistors from the wafer only to wire
them back again on circuit boards, wafer scale
integration eliminates cutting apart the chips.
Nanotechnology
 Nanotechnology, in the context of computer
science, is a type of engineering geared toward
building electronic components and devices measured
in nanometers, which are extremely tiny in size and
structure.
 Nanotechnology facilitates the building of
functional matter and systems at the scalar level of an
atom or molecule.
Nanotechnology is also known as Nanotech.
Explains Nanotechnology
Nanotechnology works through different approaches to
build nano materials or products, including bottom-up,
top-down and Functional system development.
In a bottom-up approach, a product is designed as it
evolves from its tiniest form factor to larger product.
In a top-down approach, a large product may be
reverse engineered to develop products scaled according
to nanometer.
A functional approach deals with a complete system
and may incorporate bottom-up and top-down
approaches.
Advantages of IC’s
1. Very small size
2. Low cost
3. Reduce power consuption
4. Highly reliable
5. Higher operating speed
6. Reduced external wiring connections
7. Easy to use
Disadvantages of IC’s
1. Component dependent
2. Limited capitance
3. Impossible to fabricates transformers
4. Limited power supplies
5. Not flexiable
IC’s Packages
Single Inline
Packaging
Dual Inline
Packaging
Zigzag Inline
packaging
Single Inline Packaging (SIP)
A single in-line (pin) package (SIP or SIPP) has
one row of connecting pins. It is not as popular as
the DIP, but has been used for
packaging RAM chips and multiple resistors with
a common pin. SIPs group RAM chips together on
a small board either by the DIP process or surface
mounting SMD process.
Dual Inline Packaging (DIP)
A dual in-line package is an electronic component

package with a rectangular housing and two parallel
rows of electrical connecting pins. The package
may be through-hole mounted to a printed circuit
board or inserted in a socket.
Zigzag Inline Packaging
The zigzag in-line package or ZIP was a short-lived
packaging technology for integrated circuits,
particularly dynamic RAM chips.
A ZIP is an integrated circuit encapsulated in a slab of
plastic with 20 or 40 pins, measuring (for the ZIP-20
package) about 3 mm x 30 mm x 10 mm.
The package's pins protrude in two rows from one of
the long edges. The two rows are staggered by 1.27 mm
(0.05"), giving them a zigzag appearance, and allowing
them to be spaced more closely than a rectangular grid
would allow
Zigzag Inline Packaging

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MLSU

CLASS- BCA 1st SEMESTER

TOPIC – Integrated Circuit

UNDER GUIDENCE OF:-

This can be made much smaller than a discreet circuit

The width of each conducting line in a circuit can be made

• Thick and Thin film IC’s

 These devices typically perform

 They are not formed within a

The thin-film circuit employs an evaporation or cathode-

A hybrid circuit serves as a component on a PCB

 The difference between the two types of devices

 Normally it has about 20 components.

 The Minuteman missile and Apollo program needed

 The Apollo guidance computer led and motivated the

 Medium Scale Integration came in to

 MSI is the next step in the development

 Medium-Scale Integration allowed more

LSI is the process of integrating or embedding

Very Very Large Scale Integration

Just as the integrated circuit eliminated cutting apart

A dual in-line package is an electronic component

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