MOC306x

DESCRIPTION
The MOC306x Series are optically coupled isolators
consisting of a Gallium Arsenide infrared emitting diode 1 Anode
coupled with a monolithic silicon detector performing
the functions of a zero crossing bilateral triac 2 Cathode
mounted in a standard 6 pin dual-in-line package.
3 NC

FEATURES 4 Main Terminal 1

• Zero Voltage Crossing 5 Substrate,

• Triac Driver Output (Do not Connect)
• High VDRM minimum 600V 6 Main Terminal 2
• High Critical Rate of Rise of Off-State Voltage
dv/dt minimum 600V/μs
• Isolation Voltage 5000VRMS ABSOLUTE MAXIMUM RATINGS
• RoHS Compliant TA = 25°C unless otherwise specified.
• UL File No. E91231 Package System “TT” Stresses exceeding the absolute maximum ratings can cause
• VDE File No. 40028086 permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
APPLICATIONS
Input
• Solenoid / Valve Controls
• Light Controls Forward Current 50mA
• AC Motor Drivers Reverse Voltage 6V
• Temperature Controls Juntion Temperature 125°C
• AC Motor Starters Power dissipation 120mW
• Solid State Relays
Output
ORDER INFORMATION
Off State Output Terminal Voltage 600V
• Add Suffix “X” for VDE Approval On State RMS Current 100mARMS
• Add G after PN for 10mm lead spacing
Peak Repetitive Surge Current 1.0A
• Add SM after PN for Surface Mount (Pulse Width 100μs, 120pps)
• Add SMT&R after PN for Surface Mount Junction Temperature 125°C
Tape & Reel
Power Dissipation 150mW

Total Package
Isolation Voltage 5000VRMS
Total Power Dissipation 250mW
Operating Temperature -40 to 100°C
Storage Temperature -55 to 150°C
Lead Soldering Temperature (10s) 260°C

ISOCOM COMPONENTS 2004 LTD ISOCOM COMPONENTS ASIA LTD

Unit 25B, Park View Road West, Park View Industrial Estate Hong Kong Office,
Hartlepool, Cleveland, TS25 1PE, United Kingdom Block A, 8/F, Wah Hing Industrial mansion,
Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong.
e-mail: sales@isocom.co.uk Tel: +852 2995 9217 Fax : +852 8161 6292
http://www.isocom.com e-mail sales@isocom.com.hk

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)

INPUT
Parameter Symbol Test Condition Min Typ. Max Unit

Forward Voltage VF IF = 20mA 1.2 1.4 V

Reverse Current IR VR = 6V 0.05 10 μA

OUTPUT
Parameter Symbol Test Condition Min Typ. Max Unit
Peak Off-state Current IDRM VDRM = 600V 500 nA
Either Direction IF = 0mA
Note 1
Peak Blocking Voltage VDRM IDRM = 500nA 600 V
Either Direction

On-state Voltage VTM ITM = 100mA (peak) 3.0 V

Either Direction

Critical Rate of dv/dt IF = 0mA, 1000 V/μs

Rise of Off-state Vin = 240VRMS
Voltage
(Static dv/dt)

COUPLED
Parameter Symbol Test Condition Min Typ. Max Unit
Input Trigger Current IFT VTM = 3V mA
Either Direction
Note 2

MOC3060 30
MOC3061 15
MOC3062 10
MOC3063 5
Holding Current IH 400 μA
Either Direction

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)

ZERO CROSSING CHARACTERISTICS

Parameter Symbol Test Condition Min Typ. Max Unit

Inhibit Voltage VINH IF = Rated IFT, 5 20 V

MT1-MT2 Voltage above which
device will not trigger
Leakage Current at IDRM2 IF = Rated IFT, 500 μA
Inhibit State VDRM = 600V,
Off-state

ISOLATION
Parameter Symbol Test Condition Min Typ. Max Unit

Isolation Voltage VISO RH = 40 to 60%, t = 1 min 5000 VRMS

Input-Output
Note 3

Note 1 : Test Voltage must be applied within dv/dt rating.

Note 2 : Guaranteed to trigger at an IF value less than or equal to max IFT,

recommended IF lies between Rated IFT to Absolute Max IF.

Note 3 : Measured with input leads shorted together and output leads shorted together.

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Fig 1 Forward Current vs Ambient Temperature Fig 2 On-State Current vs Ambient Temperature

Fig 3 Forward Current vs Forward Voltage Fig 4 On-state Current vs On-State Voltage

Fig 5 Minimum Trigger Current vs Fig 6 On-State Voltage vs Ambient Temperature

Ambient Temperature

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Fig 7 Repetitive Peak Off-State Current vs Fig 8 Holding Current vs Ambient Temperature
Ambient Temperature

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ORDER INFORMATION

MOC306x (UL Approval)

After PN PN Description Packing quantity

None MOC3060, MOC3061, Standard DIP6 65 pcs per tube
MOC3062, MOC3063
G MOC3060G, MOC3061G, 10mm Lead Spacing 65 pcs per tube
MOC3062G, MOC3063G
SM MOC3060SM, MOC3061SM, Surface Mount 65 pcs per tube
MOC3062SM, MOC3063SM
SMT&R MOC3060SMT&R, Surface Mount Tape & Reel 1000 pcs per reel
MOC3061SMT&R,
MOC3062SMT&R,
MOC3063SMT&R

MOC306x (UL and VDE Approvals)

After PN PN Description Packing quantity

None MOC3060X, MOC3061X, Standard DIP6 65 pcs per tube
MOC3062X, MOC3063X
G MOC3060XG, MOC3061XG, 10mm Lead Spacing 65 pcs per tube
MOC3062XG, MOC3063XG
SM MOC3060XSM, MOC3061XSM, Surface Mount 65 pcs per tube
MOC3062XSM, MOC3063XSM
SMT&R MOC3060XSMT&R, Surface Mount Tape & Reel 1000 pcs per reel
MOC3061XSMT&R,
MOC3062XSMT&R,
MOC3063XSMT&R

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DEVICE MARKING

Example : MOC3063X

MOC3063X
I YWW TT

MOC3063X Denotes Device Part Number

I denotes Isocom
Y denotes 2 digit Year code
WW denotes 2 digit Week code
TT UL Package System Code

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PACKAGE DIMENSIONS in mm (inch)

DIP

G Form

SMD

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TAPE AND REEL PACKAGING

Dimension
Description Symbol
mm (inch)
Tape Width W 16 ± 0.3 (0.63)

Pitch of Sprocket Holes P0 4 ± 0.1 (0.15)

F 7.5 ± 0.1 (0.295)
Distance of Compartment to Sprocket Holes
P2 2 ± 0.1 (0.079)
Distance of Compartment to Compartment P1 12 ± 0.1 (0.47)

RECOMMENDED PAD LAYOUT for SMD (mm)

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IR REFLOW SOLDERING TEMPERATURE PROFILE
One Time Reflow Soldering is Recommended.
Do not immerse device body in solder paste.

260°C
TP
TP - 5°C
Max Ramp Up Rate tP Max Ramp Down Rate
3°C/s 6°C/s

217°C
TL
TL
TEMP (°C)

200°C
Tsmax

Tsmin 150°C

ts Preheat
60s – 120s

25°C

Time 25°C to Peak Temperature TIME (s)

Profile Details Conditions

Preheat
- Min Temperature (TSMIN) 150°C
- Max Temperature (TSMAX) 200°C
- Time TSMIN to TSMAX (ts) 60s - 120s
Soldering Zone
- Peak Temperature (TP) 260°C
- Time at Peak Temperature 10s max
- Liquidous Temperature (TL) 217°C
- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) 30s max
- Time maintained above TL (tL) 60s - 100s
- Ramp Up Rate (TL to TP) 3°C/s max
- Ramp Down Rate (TP to TL) 6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max

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 DISCLAIMER
Isocom Components is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing Isocom Components products, to comply with the standards of safety in making
a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such Isocom Components products could cause loss of human life, bodily injury or damage to
property.

In developing your designs, please ensure that Isocom Components products are used within
specified operating ranges as set forth in the most recent Isocom Components products
specifications.

The Isocom Components products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These Isocom Components
products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss
of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation Instruments, traffic
signal instruments, combustion control instruments, medical Instruments, all types of safety
devices, etc... Unintended Usage of Isocom Components products listed in this document
shall be made at the customer’s own risk.

Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.

The products described in this document are subject to the foreign exchange and foreign trade
laws.

The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by Isocom Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of Isocom
Components or others.

The information contained herein is subject to change without notice.

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