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Transport-layer-assisted routing for runtime thermal management of 3D NoC systems

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An-Yeu (Andy) WuAuthors Info & Claims

ACM Transactions on Embedded Computing Systems (TECS), Volume 13, Issue 1

Article No.: 11, Pages 1 - 22

https://doi.org/10.1145/2512468

Published: 05 September 2013 Publication History

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Abstract

To ensure thermal safety and to avoid performance degradation from temperature regulation in 3D NoC, we propose a new temperature-traffic control framework. The framework contains the vertical throttling-based runtime thermal management (VT-RTM) scheme and the transport-layer assisted routing (TLAR) scheme. VT-RTM scheme increases the cooling speed and maintains high availability. TLAR scheme sustains the throughput of the nonstationary irregular mesh network. In our experiments, VT-RTM scheme reduces cooling time by 84% and achieves 98% network availability; the overall performance impact is around 8% of traditional schemes. TLAR scheme reduces average latency by 35∼% and improves sustainable throughput by 76%

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Cited By

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Huang DCostero LAtienza D(2024)An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-DesignIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2024.345941435:11(2161-2176)Online publication date: 1-Nov-2024
https://dl.acm.org/doi/10.1109/TPDS.2024.3459414
Safari MRohbani NSoleimani MSarbazi-Azad H(2023)OCRAProceedings of the 16th International Workshop on Network on Chip Architectures10.1145/3610396.3618092(40-45)Online publication date: 28-Oct-2023
https://dl.acm.org/doi/10.1145/3610396.3618092
Chen KLiao YChen CWang L(2023)Adaptive Machine Learning-Based Proactive Thermal Management for NoC SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.328296931:8(1114-1127)Online publication date: 1-Aug-2023
https://dl.acm.org/doi/10.1109/TVLSI.2023.3282969
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Transport-layer-assisted routing for runtime thermal management of 3D NoC systems

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Published In

cover image ACM Transactions on Embedded Computing Systems

ACM Transactions on Embedded Computing Systems Volume 13, Issue 1

August 2013

332 pages

ISSN:1539-9087

EISSN:1558-3465

DOI:10.1145/2501626

Issue’s Table of Contents

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 05 September 2013

Accepted: 01 December 2011

Revised: 01 August 2011

Received: 01 March 2011

Published in TECS Volume 13, Issue 1

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Cited By

View all

Huang DCostero LAtienza D(2024)An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-DesignIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2024.345941435:11(2161-2176)Online publication date: 1-Nov-2024
https://dl.acm.org/doi/10.1109/TPDS.2024.3459414
Safari MRohbani NSoleimani MSarbazi-Azad H(2023)OCRAProceedings of the 16th International Workshop on Network on Chip Architectures10.1145/3610396.3618092(40-45)Online publication date: 28-Oct-2023
https://dl.acm.org/doi/10.1145/3610396.3618092
Chen KLiao YChen CWang L(2023)Adaptive Machine Learning-Based Proactive Thermal Management for NoC SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.328296931:8(1114-1127)Online publication date: 1-Aug-2023
https://dl.acm.org/doi/10.1109/TVLSI.2023.3282969
Fu YLi LPan HWang KFeng FChen QZhang C(2019)Thermal Sensor Placement and Thermal Reconstruction Under Gaussian and Non-Gaussian Sensor Noises for 3-D NoCIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.287817838:11(2139-2152)Online publication date: 21-Oct-2019
https://dl.acm.org/doi/10.1109/TCAD.2018.2878178
Chen K(2017)Game-based Congestion-aware Adaptive Routing (GCAR) for Proactive Thermal-aware 3D Network-on-Chip SystemsProceedings of the 10th International Workshop on Network on Chip Architectures10.1145/3139540.3139547(1-6)Online publication date: 14-Oct-2017
https://dl.acm.org/doi/10.1145/3139540.3139547
Chang WTseng HKuo CCho YShin SKim SHung CHong J(2014)A traffic-balanced routing scheme for heat balance in 3D networks-on-chipProceedings of the 29th Annual ACM Symposium on Applied Computing10.1145/2554850.2554961(1437-1442)Online publication date: 24-Mar-2014
https://dl.acm.org/doi/10.1145/2554850.2554961

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Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems

Topology-Aware Adaptive Routing for Nonstationary Irregular Mesh in Throttled 3D NoC Systems

On Runtime Communication- and Thermal-aware Application Mapping in 3D NoC