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Scaling and evaluation of carbon nanotube interconnects for VLSI applications

Published: 24 September 2007 Publication History

Abstract

The work in this paper addresses the need to evaluate the impact of emerging interconnect technologies, such as carbon nanotubes (CNTs), in the context of system applications. The critical properties of CNTs are described in terms of equivalent material parameters such that a general methodology of interconnect sizing can be used. This methodology is used to rescale the interlayer dielectric (ILD) stack-up and wire dimensions for different combinations of CNT and copper interconnects and vias; the stack-ups are then examined in an on-chip network application. The results of changing the ILD and wire sizing for a conservative estimate assuming a CNT bundle with 1/3 contacted metallic CNTs showed 30% improvement in delay and energy over copper at the 22 nm node and a 50% increase in total system throughput for a power constrained on-chip network application.

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    Published In

    cover image Guide Proceedings
    Nano-Net '07: Proceedings of the 2nd international conference on Nano-Networks
    September 2007
    124 pages
    ISBN:9789639799103

    Sponsors

    • European Nanoelectronics Initiative Advisory Council
    • IEEE Communications Society
    • Create-Net

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    ICST (Institute for Computer Sciences, Social-Informatics and Telecommunications Engineering)

    Brussels, Belgium

    Publication History

    Published: 24 September 2007

    Author Tags

    1. VLSI
    2. carbon nanotube
    3. evaluation
    4. interconnect
    5. modeling
    6. on-chip networks
    7. scaling

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    • (2015)Critical path-aware voltage island partitioning and floorplanning for hard real-time embedded systemsIntegration, the VLSI Journal10.1016/j.vlsi.2014.05.00248:C(21-35)Online publication date: 1-Jan-2015

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