Rothermund, M - Résultats de la recherche

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Development of novel single-die hybridisation processes for small-pitch pixel detectors / Svihra, Peter (CERN) ; Braach, Justus (Hamburg University (DE)) ; Buschmann, Eric (CERN) ; Dannheim, Dominik (CERN) ; Dort, Katharina (Justus-Liebig-Universitaet Giessen (DE)) ; Fritzsch, Thomas (Fraunhofer IZM) ; Kristiansen, H (Conpart) ; Rothermund, M (Fraunhofer IZM) ; Schmidt, Janis Viktor (KIT - Karlsruhe Institute of Technology (DE)) ; Vicente Barreto Pinto, Mateus (Universite de Geneve (CH)) et al.
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D; phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. [...]
arXiv:2210.02132; CLICdp-Conf-2022-001.- Geneva : CERN, 2023-03-15 - 12 p.
- Published in : JINST Fulltext: CLICdp-Conf-2022-001 - PDF; 2210.02132 - PDF;
In : 23rd International Workshop for Radiation Imaging Detectors, Riva Del Garda, It, 26 - 30 Jun 2022, pp.C03008

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Detector technologies for CLIC / Dannheim, D. ; Krüger, K. (ed.) ; Levy, A. (ed.) ; Nürnberg, A. (ed.) ; Sicking, E. (ed.)
The Compact Linear Collider (CLIC) is a high-energy high-luminosity linear electron-positron collider under development [...]
arXiv:1905.02520 ; CERN-2019-001 - 2019 - 152. (CERN Yellow Reports: Monographs ; 1/2019)

ebook

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Flip chip assembly of thinned chips for hybrid pixel detector applications / Fritzsch, T (IZM) ; Zoschke, K (IZM) ; Woehrmann, M (TU Berlin) ; Rothermund, M (IZM) ; Huegging, F (UBONN) ; Ehrmann, O (TU Berlin) ; Oppermann, H (IZM) ; Lang, K.D (TU Berlin)
There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. [...]
AIDA-PUB-2014-018.- Geneva : CERN, 2014 - Published in : JINST 9 (2014) C05039
In : 15th International Workshop on Radiation Imaging Detectors, Paris, France, 23 - 27 Jun 2013, pp.C05039

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A via last TSV process applied to ATLAS pixel detector modules: proof of principle demonstration / Barbero, M (U. Bonn (main)) ; Fritzsch, T (IZM) ; Gonella, L (U. Bonn (main)) ; Hügging, F ; Krüger, H (U. Bonn (main)) ; Rothermund, M (IZM) ; Wermes, N (U. Bonn (main))
Via last Through Silicon Vias (TSVs) can be exploited to build low material modules for the upgrades of the ATLAS pixel detector at the High Luminosity LHC. To prove this concept a via last TSV process is demonstrated on ATLAS pixel readout wafers. [...]
AIDA-PUB-2012-011.- Geneva : CERN, 2012 - Published in : JINST 7 (2012) P08008 Fulltext: PDF;

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Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip / ATLAS IBL Collaboration
The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. [...]
arXiv:1209.1906; AIDA-PUB-2012-010.- 2012 - 45 p. - Published in : JINST 7 (2012) P11010 Fulltext: PDF; External link: Preprint

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Voir aussi: noms d'auteurs similaires
1	Rothermund, M.
2	Rothermund, Mario

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