A wafer-scale 170000-gate FFT processor with built-in test circuits
K Yamashita, A Kanasugi, S Hijiya… - IEEE Journal of Solid …, 1988 - ieeexplore.ieee.org
K Yamashita, A Kanasugi, S Hijiya, G Goto, N Matsumura, T Shirato
IEEE Journal of Solid-State Circuits, 1988•ieeexplore.ieee.orgThe wafer-scale 170000-gate fast Fourier transform (FFT) processor described consists of
individual repeatable building blocks, each of which contains a processing element (PE)
and interconnection wiring. The PE consists of a multiplier accumulator and its built-in self-
test circuits. The wafer system is reconfigured by connected active blocks after block self-
diagnosis. Blocks are connected using a programmable contact-hole mask. The processor
performs parallel 16-bit, eight-point complex FFTs and is implemented with 725 I/O pads in …
individual repeatable building blocks, each of which contains a processing element (PE)
and interconnection wiring. The PE consists of a multiplier accumulator and its built-in self-
test circuits. The wafer system is reconfigured by connected active blocks after block self-
diagnosis. Blocks are connected using a programmable contact-hole mask. The processor
performs parallel 16-bit, eight-point complex FFTs and is implemented with 725 I/O pads in …
The wafer-scale 170000-gate fast Fourier transform (FFT) processor described consists of individual repeatable building blocks, each of which contains a processing element (PE) and interconnection wiring. The PE consists of a multiplier accumulator and its built-in self-test circuits. The wafer system is reconfigured by connected active blocks after block self-diagnosis. Blocks are connected using a programmable contact-hole mask. The processor performs parallel 16-bit, eight-point complex FFTs and is implemented with 725 I/O pads in triple-metal 2.3- mu m p-well CMOS technology on a 4-in. wafer. It is mounted by controlled-collapse bonding facedown on a 11.8*11.8-cm/sup 2/ substrate.< >
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