LVDS-type on-chip transmision line interconnect with passive equalizers in 90nm CMOS process

A Mineyama, H Ito, T Ishii, K Okada… - 2008 Asia and South …, 2008 - ieeexplore.ieee.org
A Mineyama, H Ito, T Ishii, K Okada, K Masu
2008 Asia and South Pacific Design Automation Conference, 2008ieeexplore.ieee.org
This paper demonstrates a low voltage differential signaling (LVDS)-type on-chip
transmission line (TL) interconnect to solve delay issues on global interconnects. The
proposed on-chip TL interconnect can achieve 10.5 Gbps signaling and has smaller delay,
smaller delay variation and better power efficiency than conventional on-chip interconnects
at high-frequencies.
This paper demonstrates a low voltage differential signaling (LVDS)-type on-chip transmission line (TL) interconnect to solve delay issues on global interconnects. The proposed on-chip TL interconnect can achieve 10.5 Gbps signaling and has smaller delay, smaller delay variation and better power efficiency than conventional on-chip interconnects at high-frequencies.
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