Modeling and analysis of phase change materials for efficient thermal management

F Kaplan, C De Vivero, S Howes… - 2014 IEEE 32nd …, 2014 - ieeexplore.ieee.org
Direct placement of Phase Change Materials (PCMs) on the chip has been recently explored
as a passive temperature management solution. PCMs provide the ability to store large …

Simulation and optimization of HPC job allocation for jointly reducing communication and cooling costs

J Meng, S McCauley, F Kaplan, VJ Leung… - … Informatics and Systems, 2015 - Elsevier
Performance and energy are critical aspects in high performance computing (HPC) data
centers. Highly parallel HPC applications that require multiple nodes usually run for long …

LoCool: Fighting hot spots locally for improving system energy efficiency

F Kaplan, M Said, S Reda… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Elevated on-chip temperatures significantly degrade performance, energy-efficiency, and
lifetime of processors. The cooling system for a chip is typically designed to remove the worst-…

Degradations of model compounds representing some phenolics in olive mill wastewater via electro‐Fenton and photoelectro‐Fenton treatments

F Kaplan, A Hesenov, B Gözmen… - Environmental …, 2011 - Taylor & Francis
The electrochemical oxidation of vanillic acid, o‐coumaric acid and protocatechuic acid,
three representative toxic phenolics in olive mill wastewater, was studied using carbon felt …

Unveiling the interplay between global link arrangements and network management algorithms on dragonfly networks

F Kaplan, O Tuncer, VJ Leung… - 2017 17th IEEE/ACM …, 2017 - ieeexplore.ieee.org
Network messaging delay historically constitutes a large portion of the wall-clock time for
High Performance Computing (HPC) applications, as these applications run on many nodes …

Optimizing communication and cooling costs in HPC data centers via intelligent job allocation

F Kaplan, J Meng, AK Coskun - 2013 International Green …, 2013 - ieeexplore.ieee.org
Nearly half of the energy in the computing clusters today is consumed by the cooling
infrastructure. It is possible to reduce the cooling cost by allowing the data center temperatures to …

Communication and cooling aware job allocation in data centers for communication-intensive workloads

J Meng, E Llamosí, F Kaplan, C Zhang, J Sheng… - Journal of Parallel and …, 2016 - Elsevier
Energy consumption is an increasingly important concern in data centers. Today, nearly half
of the energy in data centers is consumed by the cooling infrastructure. Existing policies on …

Level-spread: A new job allocation policy for dragonfly networks

Y Zhang, O Tuncer, F Kaplan, K Olcoz… - 2018 IEEE …, 2018 - ieeexplore.ieee.org
The dragonfly network topology has attracted attention in recent years owing to its high radix
and constant diameter. However, the influence of job allocation on communication time in …

Fast thermal modeling of liquid, thermoelectric, and hybrid cooling

F Kaplan, S Reda, AK Coskun - 2017 16th IEEE Intersociety …, 2017 - ieeexplore.ieee.org
Localized hot spots result in elevated on-chip temperatures, significantly limiting the performance,
energy efficiency and reliability of today's processors. For efficient removal of hot spots…

Adaptive sprinting: How to get the most out of Phase Change based passive cooling

F Kaplan, AK Coskun - … on Low Power Electronics and Design …, 2015 - ieeexplore.ieee.org
CMOS scaling trends lead to elevated on-chip temperatures, which substantially limit the
performance of today's processors. To improve thermal efficiency, Phase Change Materials (…