Circuit level interconnect reliability study using 3D circuit model

F He, CM Tan - Microelectronics Reliability, 2010 - Elsevier
Integrated circuit (IC) reliability is gaining increasing concerns in IC technology with
decreasing device size, and the impact of interconnect failure mechanisms on IC failure rate …
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Circuit level interconnect reliability study using 3D circuit model

F He, CM Tan - Microelectronics Reliability, 2010 - infona.pl
Integrated circuit (IC) reliability is gaining increasing concerns in IC technology with
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Circuit level interconnect reliability study using 3D circuit model

F He, CM Tan - Microelectronics Reliability, 2010 - pure.lib.cgu.edu.tw
摘要Integrated circuit (IC) reliability is gaining increasing concerns in IC technology with
decreasing device size, and the impact of interconnect failure mechanisms on IC failure rate …
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[CITATION][C] Circuit level interconnect reliability study using 3D circuit model

F HE, CM TAN - Microelectronics and reliability, 2010 - pascal-francis.inist.fr
Circuit level interconnect reliability study using 3D circuit model CNRS Inist Pascal-Francis
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Circuit level interconnect reliability study using 3D circuit model

F He, CM Tan - Microelectronics Reliability, 2010 - pure.lib.cgu.edu.tw
Integrated circuit (IC) reliability is gaining increasing concerns in IC technology with
decreasing device size, and the impact of interconnect failure mechanisms on IC failure rate …
Cite

[CITATION][C] Circuit level interconnect reliability study using 3D circuit model

F HE, CM TAN - Microelectronics and reliability, 2010 - Elsevier
Cite