-
EP4035195
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP4035195
| EP4035195 - METHOD OF PLASMA PROCESSING A SUBSTRATE IN A PLASMA CHAMBER AND PLASMA PROCESSING SYSTEM [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 01.07.2022 Database last updated on 21.10.2024 | |
| Former | The international publication has been made Status updated on 03.04.2021 | ||
| Former | unknown Status updated on 16.10.2020 | Most recent event Tooltip | 27.09.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states TRUMPF Huettinger Sp. Z o. o. ul Marecka 47 05-220 Zielonka / PL | [2022/31] | Inventor(s) | 01 /
GAJEWSKI, Wojciech Bora Komorowskiego 39/113 03-982 Warsaw / PL | 02 /
RUDA, Krzysztof Marecka 47 05-220 Zielonka / PL | 03 /
SWIATNICKI, Jakub Wladyslawa Jagielly 27 98-220 Zdunska Wola / PL | [2022/31] | Representative(s) | Trumpf Patentabteilung Trumpf SE + Co. KG TH550 Patente und Lizenzen Johann-Maus-Straße 2 71254 Ditzingen / DE | [2022/31] | Application number, filing date | 20786441.4 | 23.09.2020 | [2022/31] | WO2020EP76571 | Priority number, date | EP20190461583 | 23.09.2019 Original published format: EP 19461583 | [2022/31] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021058566 | Date: | 01.04.2021 | Language: | EN | [2021/13] | Type: | A1 Application with search report | No.: | EP4035195 | Date: | 03.08.2022 | Language: | EN | The application published by WIPO in one of the EPO official languages on 01.04.2021 takes the place of the publication of the European patent application. | [2022/31] | Search report(s) | International search report - published on: | EP | 01.04.2021 | Classification | IPC: | H01J37/32, H01J37/34 | [2022/31] | CPC: |
H01J37/32935 (EP,CN);
H01J37/32036 (EP,CN);
H01J37/32944 (EP,CN,US);
H01J37/34 (EP,CN,US);
H01J2237/332 (US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/31] | Title | German: | VERFAHREN ZUR PLASMABEHANDLUNG EINES SUBSTRATS IN EINER PLASMAKAMMER UND PLASMAVERARBEITUNGSSYSTEM | [2022/31] | English: | METHOD OF PLASMA PROCESSING A SUBSTRATE IN A PLASMA CHAMBER AND PLASMA PROCESSING SYSTEM | [2022/31] | French: | PROCÉDÉ DE TRAITEMENT AU PLASMA D'UN SUBSTRAT DANS UNE CHAMBRE À PLASMA ET SYSTÈME DE TRAITEMENT AU PLASMA | [2022/31] | Entry into regional phase | 22.04.2022 | National basic fee paid | 22.04.2022 | Designation fee(s) paid | 22.04.2022 | Examination fee paid | Examination procedure | 22.04.2022 | Examination requested [2022/31] | 22.04.2022 | Date on which the examining division has become responsible | 21.11.2022 | Amendment by applicant (claims and/or description) | Fees paid | Renewal fee | 27.09.2022 | Renewal fee patent year 03 | 26.09.2023 | Renewal fee patent year 04 | 25.09.2024 | Renewal fee patent year 05 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X]WO2004001094 (TOSOH SMD INC [US], et al) [X] 1,9,10,12-14,16-18 * figure 2 * * paragraph [0002] * * paragraph [0005] - paragraph [0009] * * paragraph [0022] - paragraph [0038] *; | [X]WO2004072754 (HUETTINGER ELEKTRONIK GMBH [DE], et al) [X] 1,16 * figures 1, 2 * * page 2, line 29 - line 31 * * page 3, line 1 - page 11, line 22 * * page 13, line 4 - page 18, line 32 *; | [A]US2006100824 (MORIYA TSUYOSHI [JP]) [A] 1-21* the whole document *; | [X]US2009308734 (KRAUSS ALAN F [US]) [X] 1,10-14,16-18,20 * paragraph [0016] - paragraph [0052] * * paragraph [0102] - paragraph [0115] * * paragraph [0206] * * paragraph [0215] - paragraph [0221] *; | [XI]US2014062305 (KLEIN JESSE N [US], et al) [X] 1,9-14,16-20 * figures 6-10 * * paragraph [0022] - paragraph [0065] * * paragraph [0078] * * paragraph [0084] * * paragraph [0092] * * paragraph [0099] * [I] 5,15,21; | [XI]DE102013110883 (TRUMPF HÜTTINGER GMBH & CO KG [DE]) [X] 1,6-9,14,16,17,19,20 * paragraph [0001] - paragraph [0002] * * paragraph [0034] - paragraph [0036] * * paragraph [0055] * * paragraph [0077] * * paragraph [0082] - paragraph [0086] * * paragraph [0100] - paragraph [0101] * * paragraph [0120] - paragraph [0121] * [I] 5,21; | [X]US2017141000 (SAKIYAMA YUKINORI [US], et al) [X] 1-4,6-8,12-14,16,17 * figures 1B, 10-12, 16 * * paragraph [0087] - paragraph [0101] * * claims 1-9 * | by applicant | EP1593143 | US7640120 | DE102009002684 | US8007641 | DE102011007596 | DE102014220094 | US2018040461 | US10181392 | EP3234980 | US10209294 | US10290477 | EP2905802 |