YU41986B - Device for applying solder onto conducting plates - Google Patents

Device for applying solder onto conducting plates

Info

Publication number: YU41986B
Authority: YU; Yugoslavia
Prior art keywords: conducting plates; applying solder; solder onto; onto conducting; applying
Prior art date: 1980-09-09

Application number

YU2124/81A

Other languages

English (en)

Other versions

YU212481A (en

Inventor

B T Caratsch

Original Assignee

Sinter Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-09-09

Filing date

1981-09-04

Publication date

1988-04-30

1981-09-04 Application filed by Sinter Ltd filed Critical Sinter Ltd

1983-12-31 Publication of YU212481A publication Critical patent/YU212481A/xx

1988-04-30 Publication of YU41986B publication Critical patent/YU41986B/xx

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Mechanical Engineering (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Molten Solder (AREA)
Manufacturing Of Printed Wiring (AREA)

YU2124/81A 1980-09-09 1981-09-04 Device for applying solder onto conducting plates YU41986B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CH6760/80A CH656769A5 (de)	1980-09-09	1980-09-09	Vorrichtung zum aufbringen von lot auf leiterplatten.

Publications (2)

Publication Number	Publication Date
YU212481A YU212481A (en)	1983-12-31
YU41986B true YU41986B (en)	1988-04-30

Family

ID=4314614

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
YU2124/81A YU41986B (en)	1980-09-09	1981-09-04	Device for applying solder onto conducting plates

Country Status (29)

Country	Link
US (2)	US4414914A (cs)
EP (1)	EP0047441B1 (cs)
JP (1)	JPS592399B2 (cs)
KR (1)	KR860000414B1 (cs)
AR (1)	AR229100A1 (cs)
AT (1)	ATE14691T1 (cs)
AU (1)	AU545145B2 (cs)
BR (1)	BR8105766A (cs)
CA (1)	CA1167978A (cs)
CH (1)	CH656769A5 (cs)
CS (1)	CS253562B2 (cs)
DD (1)	DD201747A5 (cs)
DE (1)	DE3171701D1 (cs)
ES (1)	ES8302505A1 (cs)
GB (1)	GB2083395B (cs)
HK (1)	HK75785A (cs)
HU (1)	HU181826B (cs)
IE (1)	IE52592B1 (cs)
IL (1)	IL63738A (cs)
MX (1)	MX150893A (cs)
MY (1)	MY8600215A (cs)
PH (1)	PH19590A (cs)
PL (1)	PL135245B1 (cs)
RO (1)	RO83564B (cs)
SG (1)	SG44785G (cs)
SU (1)	SU1144615A3 (cs)
TR (1)	TR21220A (cs)
YU (1)	YU41986B (cs)
ZA (1)	ZA816059B (cs)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4541358A (en) *	1983-11-28	1985-09-17	The Htc Corporation	Method and apparatus for solder removal
US4608941A (en) *	1985-01-10	1986-09-02	Teledyne Electro-Mechanisms	Apparatus for soldering printed circuit panels
JPS625651A (ja) *	1985-03-28	1987-01-12	Senjiyu Kinzoku Kogyo Kk	微細構造の被めっき部分のめっき方法およびそのための支持装置
US4637541A (en) *	1985-06-28	1987-01-20	Unit Industries, Inc.	Circuit board soldering device
US4776508A (en) *	1985-06-28	1988-10-11	Unit Design Inc.	Electronic component lead tinning device
US4676426A (en) *	1986-03-10	1987-06-30	Ibm Corp.	Solder leveling technique
US4745004A (en) *	1987-01-08	1988-05-17	Schwerin Thomas E	Method and apparatus for transporting circuit or other work units being processed
JPS6420894U (cs) *	1987-07-29	1989-02-01
US5130164A (en) *	1989-04-28	1992-07-14	United Technologies Corporation	Solder-coating method
US5226964A (en) *	1991-07-26	1993-07-13	Monitriol, Inc.	Vertical solder coating apparatus
US5240738A (en) *	1991-12-31	1993-08-31	International Business Machines Corporation	Method of applying solder to a flexible circuit
NL1010214C2 (nl) *	1998-09-29	2000-03-30	Lantronic Bv	Inrichting voor het behandelen van printplaten.
JP2013509863A (ja)	2009-11-03	2013-03-21	エイチティージーモレキュラーダイアグノスティクス，インコーポレイテッド	定量的ヌクレアーゼ保護シークエンシング（ｑＮＰＳ）
CH706161A1 (de)	2012-03-15	2013-10-15	Oti Greentech Group Ag	Ölrückgewinnung.
US10362720B2 (en)	2014-08-06	2019-07-23	Greene Lyon Group, Inc.	Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
US10774600B2 (en)	2016-08-19	2020-09-15	Weatherford Technology Holdings, Llc	Slip monitor and control

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL88301C (cs) *		1900-01-01
US2999302A (en) *		1961-09-12		Certificate of correction
US1479783A (en) *	1921-12-03	1924-01-08	Frank F Bentley	Soldering apparatus
US1572953A (en) *	1924-05-15	1926-02-16	Pletsch Carl	Galvanizing apparatus
US2803216A (en) *	1956-05-02	1957-08-20	Itt	Apparatus for printed-circuit solder coating
US3416958A (en) *	1966-02-25	1968-12-17	Lear Siegler Inc	Alloy coating for electrical conductors
GB1207667A (en) *	1966-11-03	1970-10-07	Zeva Elek Zitats Ges Smits & L	Methods of and machines for soldering printed circuit panels
DE1807989C3 (de) *	1968-11-06	1979-12-13	Ersa, Ernst Sachs Kg Gmbh & Co, 6980 Wertheim	Vorrichtung zur Lötung elektrischer Verbindungen, insbesondere gedruckter Schaltungen
US3606132A (en) *	1970-02-25	1971-09-20	Mann Henry Inc	Soldering apparatus for printed circuit boards
GB1446636A (en) *	1972-12-01	1976-08-18	Xerox Corp	Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon
US3795358A (en) *	1972-12-11	1974-03-05	Ibm	Immersion solder leveling apparatus using ultrasonic cavitation
US3825164A (en) *	1972-12-11	1974-07-23	Ibm	Apparatus for soldering printed circuit cards
US3924794A (en) *	1973-08-14	1975-12-09	Us Energy	Solder leveling process
US3865298A (en) *	1973-08-14	1975-02-11	Atomic Energy Commission	Solder leveling
US4083323A (en) *	1975-08-07	1978-04-11	Xerox Corporation	Pneumatic system for solder leveling apparatus
DE2836493C2 (de) *	1978-08-21	1979-11-22	Siemens Ag, 1000 Berlin Und 8000 Muenchen	Leiterplattenhalterung
US4333417A (en) *	1979-12-13	1982-06-08	Camp Neal H	Coating system

1980
- 1980-09-09 CH CH6760/80A patent/CH656769A5/de not_active IP Right Cessation
1981
- 1981-08-27 AT AT81106652T patent/ATE14691T1/de not_active IP Right Cessation
- 1981-08-27 EP EP81106652A patent/EP0047441B1/de not_active Expired
- 1981-08-27 DE DE8181106652T patent/DE3171701D1/de not_active Expired
- 1981-09-01 ZA ZA816059A patent/ZA816059B/xx unknown
- 1981-09-01 GB GB8126439A patent/GB2083395B/en not_active Expired
- 1981-09-01 PH PH26131-AA patent/PH19590A/en unknown
- 1981-09-04 IL IL63738A patent/IL63738A/xx unknown
- 1981-09-04 YU YU2124/81A patent/YU41986B/xx unknown
- 1981-09-07 AR AR286669A patent/AR229100A1/es active
- 1981-09-08 PL PL1981232948A patent/PL135245B1/pl unknown
- 1981-09-08 MX MX189081A patent/MX150893A/es unknown
- 1981-09-08 IE IE2070/81A patent/IE52592B1/en unknown
- 1981-09-08 CA CA000385416A patent/CA1167978A/en not_active Expired
- 1981-09-08 DD DD81233134A patent/DD201747A5/de unknown
- 1981-09-08 ES ES505285A patent/ES8302505A1/es not_active Expired
- 1981-09-08 SU SU813337802A patent/SU1144615A3/ru active
- 1981-09-09 AU AU75076/81A patent/AU545145B2/en not_active Ceased
- 1981-09-09 RO RO105263A patent/RO83564B/ro unknown
- 1981-09-09 TR TR21220A patent/TR21220A/xx unknown
- 1981-09-09 JP JP56141119A patent/JPS592399B2/ja not_active Expired
- 1981-09-09 BR BR8105766A patent/BR8105766A/pt unknown
- 1981-09-09 US US06/300,971 patent/US4414914A/en not_active Expired - Fee Related
- 1981-09-09 HU HU812599A patent/HU181826B/hu unknown
- 1981-09-09 CS CS816650A patent/CS253562B2/cs unknown
- 1981-09-09 KR KR1019810003361A patent/KR860000414B1/ko active
1982
- 1982-09-30 US US06/431,093 patent/US4469716A/en not_active Expired - Fee Related
1985
- 1985-06-11 SG SG44785A patent/SG44785G/en unknown
- 1985-10-03 HK HK757/85A patent/HK75785A/xx unknown
1986
- 1986-12-30 MY MY215/86A patent/MY8600215A/xx unknown

Also Published As

Publication number	Publication date
PL232948A1 (cs)	1982-06-07
CS253562B2 (en)	1987-11-12
US4469716A (en)	1984-09-04
ES505285A0 (es)	1982-12-01
SG44785G (en)	1986-01-17
ES8302505A1 (es)	1982-12-01
EP0047441A1 (de)	1982-03-17
PL135245B1 (en)	1985-10-31
YU212481A (en)	1983-12-31
IL63738A0 (en)	1981-12-31
IE52592B1 (en)	1987-12-23
CA1167978A (en)	1984-05-22
BR8105766A (pt)	1982-05-25
IE812070L (en)	1982-03-22
AU7507681A (en)	1982-03-18
KR830008635A (ko)	1983-12-10
DD201747A5 (de)	1983-08-03
GB2083395A (en)	1982-03-24
US4414914A (en)	1983-11-15
PH19590A (en)	1986-05-26
CH656769A5 (de)	1986-07-15
RO83564B (ro)	1984-04-30
ZA816059B (en)	1982-08-25
IL63738A (en)	1985-09-29
EP0047441B1 (de)	1985-08-07
MY8600215A (en)	1986-12-31
MX150893A (es)	1984-08-09
HK75785A (en)	1985-10-11
KR860000414B1 (ko)	1986-04-17
AU545145B2 (en)	1985-07-04
HU181826B (en)	1983-11-28
JPS57118695A (en)	1982-07-23
JPS592399B2 (ja)	1984-01-18
ATE14691T1 (de)	1985-08-15
GB2083395B (en)	1984-11-07
RO83564A (ro)	1984-04-02
DE3171701D1 (en)	1985-09-12
SU1144615A3 (ru)	1985-03-07
TR21220A (tr)	1984-01-03
AR229100A1 (es)	1983-06-15

Publication	Publication Date	Title
YU212481A (en)	1983-12-31	Device for applying solder onto conducting plates
JPS56152656A (en)	1981-11-26	Device applying for magnetic field
DE2965459D1 (en)	1983-07-07	Mounting device for plates
GB8322685D0 (en)	1983-09-28	Device for applying liquids
GB8313097D0 (en)	1983-06-15	Device for applying elastic sheath
GB2087729B (en)	1984-03-28	Device for applying toothpaste
DE3176527D1 (en)	1987-12-17	Apparatus for soldering chip type components
JPS5772218A (en)	1982-05-06	Device for supporting component on conductive plate
JPS5777433A (en)	1982-05-14	Pasting device for label
JPS56122199A (en)	1981-09-25	Device for holding electric component
JPS5752508A (en)	1982-03-29	Device for clamping roll which can be exchanged
JPS5785741A (en)	1982-05-28	Device for carrying block plate
JPS57112094A (en)	1982-07-12	Soldering device
JPS57102087A (en)	1982-06-24	Electrode connecting device
JPS5763898A (en)	1982-04-17	Substrate device for electric device
JPS571750A (en)	1982-01-06	Pasting device for case
GB2068268B (en)	1984-02-15	Liquid paste coating apparatus
GB2075895B (en)	1984-09-05	Apparatus for flame-scarfing
JPS5786437A (en)	1982-05-29	Device for pasting tape
JPS5777435A (en)	1982-05-14	Pasting device for label
GB2073674B (en)	1984-07-25	Multiple electrode apparatus
JPS5785292A (en)	1982-05-27	Soldering device
JPS5730398A (en)	1982-02-18	Soldering device
JPS57111583A (en)	1982-07-12	Device for arranging idea
JPS5776790A (en)	1982-05-13	Electrode connecting device