WO2024127654A1 - Power supply unit for aerosol-generating device, and aerosol-generating device - Google Patents

Abstract

This inhalation device (100) comprises a power supply part (111C) that supplies electric power to a heating part (121C), a main substrate (50), and a power supply substrate (71). The power supply substrate (71) is provided with a positive electrode tab connection part (711a) that is connected to a positive electrode tab (111a), a + contact connection part (784) that is connected to a contact of the main substrate (50), and a first + electroconductive region (781) and a second + electroconductive region (782) that connect the positive electrode tab connection part (711a) and the + contact connection part (784). The widths (W1, W2) of the first + electroconductive region (781) and the second + electroconductive region (782) are both greater than the width (Wa) of the positive electrode tab connection part (711a).

Description

Power supply unit for aerosol generating device, and aerosol generating device

The present disclosure relates to a power supply unit for an aerosol generating device, and to an aerosol generating device.

The aerosol generating device contains a power source, a heating unit, multiple sensors, and a circuit board mounting the sensors and control device in a case (for example, Patent Document 1). It is desirable for an aerosol generating device such as a heated smoking device to be small enough to fit in the user's hand.

Japanese Patent Publication No. 2021-83383

In an aerosol generating device, the aerosol source needs to be heated rapidly, so the current supplied from the power supply is large for a small device. Therefore, it is necessary to ensure that power can be supplied to the heating section appropriately.

The present disclosure provides a power supply unit for an aerosol generating device that can provide an appropriate power supply, and an aerosol generating device.

The power supply unit of the aerosol generating device of the present disclosure comprises:
A power source for supplying power to a heating section for heating the aerosol source;
A control device for controlling the heating unit;
a first substrate on which the control device is mounted;
a second substrate connected to the power source and the first substrate;
The second substrate comprises:
an electrode connection portion connected to an electrode of the power source;
A contact connection portion connected to a contact of the first substrate;
a conductive region connecting the electrode connection portion and the contact connection portion;
The width of the conductive region is greater than the width of the electrode connection portion.

The aerosol generating device of the present disclosure comprises:
Power supply,
A heating unit that consumes the power supplied from the power source to heat the aerosol source;
A control device for controlling the heating unit;
a first substrate on which the control device is mounted;
a second substrate connected to the power source and the first substrate;
The second substrate comprises:
an electrode connection portion connected to an electrode of the power source;
A contact connection portion connected to a contact of the first substrate;
a conductive region connecting the electrode connection portion and the contact connection portion;
The width of the conductive region is greater than the width of the electrode connection portion.

According to the present disclosure, because the conductive area is large, current concentration inside the second substrate can be avoided even if a large current flows from the power supply through the electrode connection portion, and power can be supplied appropriately from the power supply.

FIG. 1 is a schematic diagram showing a first configuration example of a suction device (suction device 100A). FIG. 2 is a schematic diagram showing a second configuration example (suction device 100B) of the suction device. FIG. 3 is an overall perspective view of a suction device 100 which is one embodiment of the suction device of the present disclosure. FIG. 4 is a perspective view of the internal unit 10 as viewed from the front right side. FIG. 5 is a perspective view of the internal unit 10 as viewed from the front left side. FIG. 6 is an exploded perspective view of the internal unit 10. As shown in FIG. FIG. 7 is a cross-sectional perspective view of heater assembly 30. As shown in FIG. FIG. 8 is a block diagram showing the electrical connections of the main elements of the internal unit 10 in a simplified manner. FIG. 9 is a cross-sectional view of the power supply board 71. FIG. 10 is a diagram showing the first conductive layer L1 and the second conductive layer L2 of the power supply board 71 as viewed from the front. FIG. 11 is a diagram showing the first conductive layer L1 and the second conductive layer L2 of a power supply board 71 of the modified example as viewed from the front. FIG. 12 is a diagram illustrating an example of a positive electrode tab 111a connected to a positive electrode tab connection portion 711a. FIG. 13 is a diagram illustrating another example of the positive electrode tab 111a connected to the positive electrode tab connection portion 711a.

Below, a suction device, a control method, and a program according to an embodiment of the present disclosure will be described with reference to the drawings. First, two configuration examples (a first configuration example and a second configuration example) to which the configuration of the suction device of the present disclosure can be applied will be described. Note that, in the following, identical or similar elements will be denoted by the same or similar reference symbols, and their description may be omitted or simplified as appropriate.

<<1. Configuration example of suction device>>
The inhalation device is a device that generates a substance to be inhaled by a user. In the following description, the substance generated by the inhalation device is described as an aerosol. Alternatively, the substance generated by the inhalation device may be a gas.

(1) First Configuration Example Fig. 1 is a schematic diagram showing a first configuration example of an inhalation device. As shown in Fig. 1, an inhalation device 100A according to this configuration example includes a power supply unit 110, a cartridge 120, and a flavor imparting cartridge 130. The power supply unit 110 includes a power supply section 111A, a sensor section 112A, a notification section 113A, a memory section 114A, a communication section 115A, and a control section 116A. The cartridge 120 includes a heating section 121A, a liquid guiding section 122, and a liquid storage section 123. The flavor imparting cartridge 130 includes a flavor source 131 and a mouthpiece 124. An air flow path 180 is formed in the cartridge 120 and the flavor imparting cartridge 130.

The power supply unit 111A stores power. The power supply unit 111A supplies power to each component of the suction device 100A under the control of the control unit 116A. The power supply unit 111A may be configured, for example, by a rechargeable battery such as a lithium ion secondary battery.

The sensor unit 112A acquires various information related to the suction device 100A. As one example, the sensor unit 112A is configured with a pressure sensor such as a condenser microphone, a flow rate sensor, or a temperature sensor, and acquires values associated with suction by the user. As another example, the sensor unit 112A is configured with an input device such as a button or switch that accepts information input from the user.

The notification unit 113A notifies the user of information. The information that the notification unit 113A notifies the user includes various information such as the SOC (State Of Charge) indicating the charging state of the power supply unit 111A, the pre-heating time for inhalation, and the period during which inhalation is possible. The notification unit 113A is composed of, for example, a light-emitting device that emits light, a display device that displays images, a sound output device that outputs sound, or a vibration device that vibrates.

The memory unit 114A stores various information for the operation of the suction device 100A. The memory unit 114A is configured, for example, with a non-volatile storage medium such as a flash memory.

The communication unit 115A is a communication interface capable of performing communication conforming to any wired or wireless communication standard. Such communication standards may include, for example, standards using Wi-Fi (registered trademark), Bluetooth (registered trademark), BLE (Bluetooth Low Energy (registered trademark)), NFC (Near Field Communication), or LPWA (Low Power Wide Area).

The control unit 116A functions as an arithmetic processing unit and a control unit, and controls the overall operation of the suction device 100A in accordance with various programs. The control unit 116A is realized by an electronic circuit such as a CPU (Central Processing Unit) or a microprocessor.

The liquid storage unit 123 stores the aerosol source. The aerosol source is atomized to generate an aerosol. The aerosol source is, for example, a liquid such as a polyhydric alcohol such as glycerin and propylene glycol, or water. The aerosol source may contain a tobacco-derived or non-tobacco-derived flavor component. If the inhalation device 100A is a medical inhaler such as a nebulizer, the aerosol source may contain a medicine.

The liquid guide section 122 guides and holds the aerosol source, which is a liquid stored in the liquid storage section 123, from the liquid storage section 123. The liquid guide section 122 is, for example, a wick formed by twisting a fiber material such as glass fiber or a porous material such as porous ceramic. In this case, the aerosol source stored in the liquid storage section 123 is guided by the capillary effect of the wick.

The heating unit 121A generates aerosol by heating the aerosol source and atomizing the aerosol source. In the example shown in FIG. 1, the heating unit 121A is configured as a coil and is wound around the liquid guide unit 122. When the heating unit 121A generates heat, the aerosol source held in the liquid guide unit 122 is heated and atomized, and an aerosol is generated. The heating unit 121A generates heat when power is supplied from the power supply unit 111A. As an example, when the sensor unit 112A detects that the user has started inhaling and/or that predetermined information has been input, power may be supplied to the heating unit 121A. Then, when the sensor unit 112A detects that the user has stopped inhaling and/or that predetermined information has been input, power supply to the heating unit 121A may be stopped. The user's inhalation action on the suction device 100A can be detected, for example, based on the pressure (internal pressure) inside the suction device 100A detected by a suction sensor exceeding a predetermined threshold.

The flavor source 131 is a component for imparting flavor components to the aerosol. The flavor source 131 may contain tobacco-derived or non-tobacco-derived flavor components.

The air flow path 180 is a flow path for air inhaled by the user. The air flow path 180 has a tubular structure with an air inlet hole 181, which is an entrance of air into the air flow path 180, and an air outlet hole 182, which is an exit of air from the air flow path 180, at both ends. In the middle of the air flow path 180, the liquid guide section 122 is arranged on the upstream side (the side closer to the air inlet hole 181), and the flavor source 131 is arranged on the downstream side (the side closer to the air outlet hole 182). The air flowing in from the air inlet hole 181 as the user inhales is mixed with the aerosol generated by the heating section 121A, and as shown by the arrow 190, is transported through the flavor source 131 to the air outlet hole 182. When the mixed fluid of the aerosol and air passes through the flavor source 131, the flavor components contained in the flavor source 131 are imparted to the aerosol.

The mouthpiece 124 is a member that is held by the user when inhaling. An air outlet hole 182 is arranged in the mouthpiece 124. By holding the mouthpiece 124 in the mouth and inhaling, the user can take in the mixed fluid of the aerosol and air into the mouth.

The above describes an example of the configuration of the suction device 100A. Of course, the configuration of the suction device 100A is not limited to the above, and various configurations such as those exemplified below are possible.

As an example, the inhalation device 100A may not include a flavoring cartridge 130. In that case, the cartridge 120 is provided with a mouthpiece 124.

As another example, the suction device 100A may include multiple types of aerosol sources. Multiple types of aerosols generated from the multiple types of aerosol sources may be mixed in the air flow path 180 and undergo a chemical reaction to generate further types of aerosols.

Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121A. For example, the means for atomizing the aerosol source may be vibration atomization or induction heating.

(2) Second Configuration Example Fig. 2 is a schematic diagram showing a second configuration example of the suction device. As shown in Fig. 2, the suction device 100B according to this configuration example includes a power supply unit 111B, a sensor unit 112B, a notification unit 113B, a memory unit 114B, a communication unit 115B, a control unit 116B, a heating unit 121B, a storage unit 140, and a heat insulating unit 144. In the suction device 100A according to the first configuration example, the power supply unit 110 that stores the power supply unit 111A and the heating unit 121A are separate, but in the suction device 100B according to the second configuration example, the power supply unit 111B and the heating unit 121B are integrated. That is, the suction device 100B according to the second configuration example can also be said to be a power supply unit with a built-in heating unit.

Each of the power supply unit 111B, the sensor unit 112B, the notification unit 113B, the memory unit 114B, the communication unit 115B, and the control unit 116B is substantially the same as the corresponding components included in the suction device 100A according to the first configuration example.

The storage section 140 has an internal space 141 and holds the stick-shaped substrate 150 while storing a part of the stick-shaped substrate 150 in the internal space 141. The storage section 140 has an opening 142 that connects the internal space 141 to the outside, and stores the stick-shaped substrate 150 inserted into the internal space 141 through the opening 142. For example, the storage section 140 is a cylindrical body with the opening 142 and the bottom 143 as the bottom surface, and defines a columnar internal space 141. An air flow path that supplies air to the internal space 141 is connected to the storage section 140. An air inlet hole, which is an air inlet to the air flow path, is arranged, for example, on the side of the suction device 100. An air outlet hole, which is an air outlet from the air flow path to the internal space 141, is arranged, for example, on the bottom 143.

The stick-type substrate 150 includes a substrate portion 151 and a mouthpiece portion 152. The substrate portion 151 includes an aerosol source. The aerosol source includes a flavor component derived from tobacco or non-tobacco. When the inhalation device 100B is a medical inhaler such as a nebulizer, the aerosol source may include a medicine. The aerosol source may be, for example, a liquid such as polyhydric alcohol such as glycerin and propylene glycol, and water, which includes a flavor component derived from tobacco or non-tobacco, or may be a solid containing a flavor component derived from tobacco or non-tobacco. When the stick-type substrate 150 is held in the storage portion 140, at least a part of the substrate portion 151 is stored in the internal space 141, and at least a part of the mouthpiece portion 152 protrudes from the opening 142. When the user holds the mouthpiece portion 152 protruding from the opening 142 in his/her mouth and inhales, air flows into the internal space 141 via an air flow path (not shown) and reaches the user's mouth together with the aerosol generated from the substrate portion 151.

In the example shown in FIG. 2, the heating section 121B is configured in a film shape and is arranged to cover the outer periphery of the storage section 140. When the heating section 121B generates heat, the substrate section 151 of the stick-shaped substrate 150 is heated from the outer periphery, and an aerosol is generated.

The insulating section 144 prevents heat transfer from the heating section 121B to other components. For example, the insulating section 144 is made of a vacuum insulating material or an aerogel insulating material.

The above describes an example of the configuration of the suction device 100B. Of course, the configuration of the suction device 100B is not limited to the above, and various configurations such as those shown below are possible.

As one example, the heating section 121B may be configured in a blade shape and disposed so as to protrude from the bottom 143 of the storage section 140 into the internal space 141. In that case, the blade-shaped heating section 121B is inserted into the substrate section 151 of the stick-shaped substrate 150 and heats the substrate section 151 of the stick-shaped substrate 150 from the inside. As another example, the heating section 121B may be disposed so as to cover the bottom 143 of the storage section 140. Furthermore, the heating section 121B may be configured as a combination of two or more of a first heating section that covers the outer periphery of the storage section 140, a blade-shaped second heating section, and a third heating section that covers the bottom 143 of the storage section 140.

As another example, the storage unit 140 may include an opening/closing mechanism, such as a hinge, that opens and closes a portion of the outer shell that forms the internal space 141. The storage unit 140 may then open and close the outer shell to accommodate the stick-shaped substrate 150 inserted into the internal space 141 while clamping it. In this case, the heating unit 121B may be provided at the clamping location in the storage unit 140, and may heat the stick-shaped substrate 150 while pressing it.

Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121B. For example, the means for atomizing the aerosol source may be induction heating. In that case, the suction device 100B has at least an electromagnetic induction source such as a coil that generates a magnetic field, instead of the heating unit 121B. A susceptor that generates heat by induction heating may be provided in the suction device 100B, or may be included in the stick-shaped substrate 150.

The suction device 100B may further include the heating unit 121A, the liquid guide unit 122, the liquid storage unit 123, and the air flow path 180 according to the first configuration example, and the air flow path 180 may supply air to the internal space 141. In this case, the mixed fluid of the aerosol and air generated by the heating unit 121A flows into the internal space 141 and is further mixed with the aerosol generated by the heating unit 121B, and reaches the user's oral cavity.

<<2. Configuration example of the suction device of the present disclosure>>
Next, an embodiment of a suction device (hereinafter, referred to as suction device 100) in which the configuration of the suction device disclosed herein is applied to the suction device 100B of the second configuration example described above will be described. Note that, although a specific description will be omitted, a part of the configuration of the suction device 100 described in detail below can also be applied to the suction device 100A of the first configuration example.

Figure 3 is an overall perspective view of the suction device 100. In the following description, the direction in which the stick-shaped substrate 150 is inserted into and removed from the suction device 100 is defined as the up-down direction, the direction in which the shutter 23, which will be described later, slides is defined as the front-rear direction, and the direction perpendicular to the up-down direction and the front-rear direction is defined as the left-right direction. As shown in the figure, the front is defined as Fr, the rear as Rr, the left side as L, the right side as R, the top as U, and the bottom as D.

The suction device 100 is preferably sized to fit in the hand, and has, for example, a rod shape. For example, a user holds the suction device 100 in one hand with the fingertips in contact with the surface of the suction device 100. Note that the shape of the suction device 100 is not limited to a rod shape, and can be any shape (for example, a rounded, approximately rectangular parallelepiped shape or an egg shape).

The suction device 100 comprises an internal unit 10 (see Figures 4 to 6) and a case 20 that constitutes the exterior of the suction device 100. The case 20 has a lower case 21 and an upper case 22. A portion of the internal unit 10 is housed in the lower case 21, and the entire internal unit 10 is housed in the case 20 by placing the upper case 22 over the lower case 21 from above.

The top surface of the suction device 100 is provided with an opening 27 (see Figures 4 to 6) through which the stick-shaped substrate 150 is inserted and removed, and a shutter 23 that can slide back and forth. The opening 27 is located at the rear side of the top surface of the suction device 100. The shutter 23 selectively takes an open state (front position) that opens the opening 27 to allow the stick-shaped substrate 150 to be inserted and removed, and a closed state (rear position) that positions the shutter 23 above the opening 27 to close the opening 27. When inserting the stick-shaped substrate 150 into the opening 27, the user opens the shutter 23.

A shutter detection sensor 11 (see FIG. 4) is provided near the shutter 23. The shutter detection sensor 11 detects whether the shutter 23 is open or not. The shutter detection sensor 11 is an example of the sensor unit 112B of the suction device 100B in FIG. 2.

Also, a USB (Universal Serial Bus) port 26 (see FIG. 4) is provided on the top surface of the suction device 100, adjacent to the opening 27. In the open state described above, the shutter 23 blocks the USB port 26. On the other hand, in the closed state described above, the shutter 23 does not block the USB port 26, and the USB port 26 is open. The USB port 26 is configured to be electrically connectable to an external power source (not shown) capable of supplying power for charging the power supply unit 111C (see FIG. 4). The USB port 26 is, for example, a receptacle into which a mating plug can be inserted. As an example, in this embodiment, the USB port 26 is a USB Type-C shaped receptacle.

The operation unit 24 and the light-emitting unit 25 are provided on the front surface of the suction device 100. The operation unit 24 is disposed below the light-emitting unit 25. More specifically, the operation unit 24 and the light-emitting unit 25 are components of the internal unit 10 housed in the case 20, and are configured such that a portion of the operation unit 24 and the light-emitting unit 25 are exposed from an opening formed on the front surface of the case 20. The light-emitting unit 25 is an example of the notification unit 113B of the suction device 100B in FIG. 2.

The operation unit 24 is a button-type switch that can be operated by the user, and is an input device that accepts information input from the user. The operation unit 24 is connected to the main board 50 (see Figures 4 to 6) described below. When the user presses the operation unit 24, for example, the MCU (Micro Controller Unit) 1 (see Figures 4 to 6) or the heating unit 121C (see Figure 7) is started. The MCU 1 functions as the control unit 116B in the suction device 100B. The MCU 1 may also have an integrated function as the communication unit 115B in addition to the function as the control unit 116B in the suction device 100B. Furthermore, the MCU 1 may be composed of one IC or two or more ICs. For example, the discharge control to the heating unit 121C and the charge control to the power supply unit 111C may be performed by one IC or by separate ICs.

The light-emitting unit 25 is composed of light-emitting elements such as LEDs (Light Emitting Diodes). In more detail, the light-emitting unit 25 has a plurality of LEDs 251 (see FIG. 6) provided on the main board 50, and a transparent cover 250 that covers the plurality of LEDs 251 and transmits light from the LEDs 251. A portion of the transparent cover 250 is exposed from an opening formed on the front surface of the case 20. In this embodiment, for example, the plurality of LEDs 251 are configured to be capable of emitting light in a plurality of colors including blue, yellow, and red. The number of light-emitting elements can be set arbitrarily, and for example, the light-emitting unit 25 may have only one light-emitting element.

The light emitting unit 25 emits light in a predetermined light emission manner in response to a command from the MCU 1, and notifies the user of predetermined information. Here, the light emission manner can be, for example, the light emission color, but is not limited to this, and can be, for example, the strength of the lighting intensity (in other words, brightness), or the lighting pattern (for example, blinking at a predetermined time interval), etc. In addition, the predetermined information is, for example, operational information indicating whether the power of the suction device 100 is on or not.

Next, the internal unit 10 of the suction device 100 of this embodiment will be described with reference to Figures 4 to 8. Figure 4 is a perspective view of the internal unit 10 seen from the front right side, Figure 5 is a perspective view of the internal unit 10 seen from the front left side, Figure 6 is an exploded perspective view of the internal unit 10, Figure 7 is a cross-sectional perspective view of the heater assembly 30, and Figure 8 is a block diagram simply showing the electrical connections of the main elements of the internal unit 10. Note that the internal unit 10 is the suction device 100 with the case 20 and shutter 23 removed.

The internal unit 10 includes a chassis 40, a main board 50, a vibration device 60, a heater assembly 30, a power supply unit 111C, a power supply board 71, a peripheral FPC 72, a sensor FPC 73, and various sensors. The peripheral FPC 72 and the sensor FPC 73 are flexible circuit boards. Flexible circuit boards are flexible, contain conductive wiring and/or signal wiring, and can mount electronic components (elements) such as resistors and chips. Flexible circuit boards generally have a thickness of 100 μm to 600 μm. The power supply board 71 may be a flexible circuit board, a rigid board (described later), or a combination of a flexible board and a rigid board, but a flexible circuit board will be used as an example here.

(Chassis)
6 , the chassis 40 has a power supply holding portion 41 that holds the power supply unit 111C, a board holding portion 42 that holds the main board 50, and a heater holding portion 43 that holds the heater assembly 30. The power supply holding portion 41 is located in the lower part of the chassis 40, and the board holding portion 42 and the heater holding portion 43 are located in the upper part of the chassis 40.

The power supply holding section 41 has a cylindrical shape with a portion of the side cut out, in other words, a roughly semi-cylindrical shape. The power supply holding section 41 has a bottom wall section 401, a side wall section 402 having an arc shape and standing upward from the bottom wall section 401, and an upper wall section 403 provided at the upper end section of the side wall section 402. The power supply section 111C is disposed in a space surrounded by the bottom wall section 401, the side wall section 402, and the upper wall section 403.

The board holding portion 42 is provided on a vertical wall portion 404 that stands upward from the upper wall portion 403 of the power supply holding portion 41. The board holding portion 42 is provided on one side (here, the front side) of the vertical wall portion 404 in the front-rear direction, and holds the main board 50.

The heater holding portion 43 is provided on the opposite side (here, the rear side) of the vertical wall portion 404 from the substrate holding portion 42 in the front-rear direction. The heater holding portion 43 has a space surrounded by the vertical wall portion 404, a pair of left and right wall portions 405 extending in the front-rear direction from the vertical wall portion 404, and the upper surface of the upper wall portion 403 of the power supply holding portion 41, and the heater assembly 30 is disposed in this space.

(Main board)
The main board 50 is a rigid board on which a plurality of electronic components (elements) are mounted on both sides. Rigid boards are not flexible and generally have a thickness of 300 μm to 1,600 μm. The main board 50 is mounted with an MCU 1, an LED 251, a charging IC (Integrated Circuit) 81, a step-up DC/DC converter 82, and the like. The main board 50 is held by the board holder 42 of the chassis 40 so that the element mounting surface faces the front-rear direction. In FIG. 6, only the front surface 501 (here, the front surface) of the main board 50 is shown. Therefore, the charging IC 81 and the step-up DC/DC converter 82 mounted on the back surface 502 (here, the rear surface) are not shown.

A power supply connection section 51 that electrically connects to the power supply section 111C is provided in the lower region of the surface 501 of the main board 50. The power supply connection section 51 is electrically connected to the power supply section 111C via the board connection section 710 of the power supply board 71. The power supply section 111C is a cylindrical lithium ion secondary battery, and is an example of the power supply section 111B of the suction device 100B in FIG. 2.

As shown in FIG. 6, the power supply unit 111C is provided with a positive electrode tab 111a and a negative electrode tab 111b. The power supply unit 111C is arranged in the power supply holding portion 41 of the chassis 40 with the positive electrode tab 111a and the negative electrode tab 111b arranged forward. The power supply board 71 is arranged in front of the power supply unit 111C and the main board 50 and extends in the vertical direction. Also referring to FIG. 8, the positive electrode tab connection portion 711a and the negative electrode tab connection portion 711b of the power supply board 71 are connected to the positive electrode tab 111a and the negative electrode tab 111b of the power supply unit 111C, respectively, and the board connection portion 710 is electrically connected to the power supply connection portion 51 of the main board 50. The power of the power supply unit 111C is transmitted to the main board 50 through the conductive track formed on the power supply board 71 and is supplied to each electronic component, for example, the step-up DC/DC converter 82. The power supply board 71 is also provided with a power supply temperature sensor 16. The power supply temperature sensor 16 is a sensor that detects the temperature of the power supply unit 111C. The power supply temperature sensor 16 is, for example, a thermistor. The power supply temperature sensor 16 is an example of the sensor unit 112B of the suction device 100B in FIG. 2.

The power supply board 71 is provided with a fuse 17 interposed in a conductive track formed on the power supply board 71. The fuse 17 cuts off the circuit when an excessive current flows. The power supply board 71 will be described in more detail later.

Furthermore, a protection IC 83 and a power gauge IC 84 are mounted on the surface 501 of the main board 50. Referring also to FIG. 8, the protection IC 83 protects the power supply unit 111C by stopping the charging or discharging of the power supply unit 111C in the event of overcharging or over-discharging during charging or discharging of the power supply unit 111C. The power gauge IC 84 derives battery information such as the remaining capacity of the power supply unit 111C, SOC (State Of Charge) indicating the charging state, and SOH (State Of Health) indicating the health state, and also obtains temperature information relating to the temperature of the power supply unit 111C from the power supply temperature sensor 16. The power gauge IC 84 is connected to the MCU 1 by a communication line LN for serial communication, and is configured to be able to communicate with the MCU 1.

A USB port 26 is provided in the upper region of the back surface 502 of the main board 50. The USB port 26 is electrically connected to the charging IC 81 by wiring formed on the main board 50.

As shown in FIG. 8, the rear surface 502 of the main board 50 is provided with a charging IC 81, a step-up DC/DC converter 82, and heater connections 57a, 57b. The charging IC 81 performs charging control to supply (charge) the power input from the USB port 26 to the power supply unit 111C. The step-up DC/DC converter 82 boosts the power supplied from the power supply unit 111C to generate power to be supplied to the heating unit 121C via the heating switch 85. The heating switch 85 is, for example, a FET (Field Effect Transistor).

The heater connectors 57a and 57b are connected to the board connector 121a extending from below the heater assembly 30, and supply power to the heating section 121C of the heater assembly 30. This allows power to be supplied from the power supply section 111C to the heating section 121C of the heater assembly 30 via the main board 50.

(Vibration device)
The vibration device 60 is composed of a vibration element such as a vibration motor. As shown in FIG. 6, the vibration device 60 is disposed between the upper surface of the power supply unit 111C and the upper wall unit 403 in the power supply holding unit 41 of the chassis 40. The lead wire 61 of the vibration device 60 is connected to the peripheral FPC 72. The vibration device 60 vibrates in a predetermined vibration mode in response to a command from the MCU 1 to notify the user of predetermined information. For example, when the heating of the stick-type substrate 150 starts or ends, the vibration device 60 vibrates in a predetermined vibration mode to notify the user of the start or end of heating. The vibration device 60 is an example of the notification unit 113B of the suction device 100B in FIG. 2.

(Heater Assembly)
7, the heater assembly 30 includes a heating section 121C, a housing section 140C, and a heat insulating section 144C. The heating section 121C is, for example, a film heater, and is wound around the outer periphery of the housing section 140C. The heating section 121C and the board connection section 121a may be formed of a single heater FPC.

The heater assembly 30 is also provided with a stick guide 31. The stick guide 31 is provided on the upper part of the heater assembly 30 and guides the insertion and removal of the stick-shaped substrate 150 into the storage section 140C. The stick guide 31 is a cylindrical member that has an opening 27 and constitutes part of the storage section 140C.

The heater assembly 30 is also provided with a heater temperature sensor 15 capable of detecting the temperature of the heating section 121C. More specifically, the heater temperature sensor 15 is provided between the heating section 121C and the insulating section 144C, in contact with or in close proximity to the heating section 121C. The heater temperature sensor 15 is, for example, a thermistor.

(Sensor FPC)
6, the sensor FPC 73 is disposed between the standing wall portion 404 of the heater holding portion 43 and the heater assembly 30. The sensor FPC 73 is equipped with a stick detection sensor 12, a suction sensor 13, and a case temperature sensor 14. The stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 are an example of the sensor unit 112B of the suction device 100B in FIG.

The stick detection sensor 12 is a sensor capable of detecting the stick-shaped substrate 150 housed in the housing section 140. In this embodiment, the stick detection sensor 12 is an optical sensor capable of detecting the stick-shaped substrate 150 based on the amount of reflected light of light irradiated onto the housing section 140. Here, the amount of light is a concept that includes luminous flux, illuminance, luminous flux emittance, luminous intensity, brightness, etc. The optical sensor is, for example, an IR (Infrared Rays) sensor.

The suction sensor 13 is a sensor that detects the user's puffing action (inhalation action). The suction sensor 13 is composed of, for example, a condenser microphone, a pressure sensor, a puff thermistor, etc. The suction sensor 13 is provided near the stick guide 31 on the sensor FPC 73.

The case temperature sensor 14 is a sensor that detects the temperature of the case 20. The case temperature sensor 14 is, for example, a thermistor. The case temperature sensor 14 is arranged adjacent to the inner surface of the case 20 on the sensor FPC 73.

The sensor FPC 73 is also provided with a heater temperature sensor connection 731 that connects to the heater temperature sensor 15 of the heater assembly 30. The heater temperature sensor connection 731 is provided on the lower part of the sensor FPC 73. More specifically, a lead wire 15a is connected to the heater temperature sensor 15, and the heater temperature sensor connection 731 connects to the lead wire 15a extending from below the heater assembly 30.

The stick detection sensor 12, suction sensor 13, case temperature sensor 14, and heater temperature sensor connection part 731 are connected to the board connection part 730 via signal wiring formed on the sensor FPC 73. The board connection part 730 is electrically connected to the sensor FPC connection part 55 provided in the central region of the surface 501 of the main board 50. This allows the detection results of each sensor to be output to the MCU 1 mounted on the main board 50, etc.

In the suction device 100 configured in this manner, when the shutter detection sensor 11 detects the open state of the shutter 23 and the stick detection sensor 12 detects the stick-shaped substrate 150, the MCU1 starts heating the heating unit 121C. When the user holds the suction mouth 152 of the stick-shaped substrate 150 in his/her mouth and inhales, aerosol is supplied into the user's mouth from the aerosol source of the stick-shaped substrate 150 heated by the heating unit 121C. The suction sensor 13 detects the number of suctions, and the MCU1 stops heating after a predetermined number of suctions or after a predetermined time has elapsed. While the suction device 100 is heating, the case temperature sensor 14, heater temperature sensor 15, and power supply temperature sensor 16 detect the respective temperatures, and if abnormal heating is determined, the MCU1 stops or suppresses heating of the heating unit 121C. In addition, the user can operate the operation unit 24 to, for example, check the SOC of the power supply unit 111C. The light-emitting unit 25 (LED 251) and the vibration device 60 notify the user of various information such as the SOC of the power supply unit 111C, error indications, etc. If the SOC of the power supply unit 111C decreases, the user can connect an external power source to the USB port 26 to charge the power supply unit 111C.

(Power supply board)
Next, the power supply board 71 will be described in detail with reference to FIGS.
FIG. 9 is a cross-sectional view of the power supply board 71. As shown in FIG. 9, the power supply board 71 has a multi-layer structure. Specifically, the power supply board 71 has a base material 760, a first conductive layer L1 provided on one side of the base material 760 (hereinafter, the front side), a second conductive layer L2 provided on the other side of the base material 760 (hereinafter, the back side), a first insulating layer 761 located on the first conductive layer L1, a second insulating layer 762 located on the second conductive layer L2, a first adhesive layer 763 that bonds the first conductive layer L1 and the first insulating layer 761, and a second adhesive layer 764 that bonds the second conductive layer L2 and the second insulating layer 762. As shown in FIG. 6, the power supply board 71 is arranged so that the stacking direction is the front-rear direction and the first conductive layer L1 side faces forward when it is housed in the case 20 (hereinafter, the housed state).

FIG. 10 is a view of the first conductive layer L1 and the second conductive layer L2 of the power supply board 71 as seen from the front. In FIG. 10, the areas filled in black indicate conductive areas, and the outer lines of the conductive areas indicate the outer edge 760a of the base material 760 of the power supply board 71, which is located between the first conductive layer L1 and the second conductive layer L2.

The power supply board 71 has a generally rectangular main body 771 that is longer in the vertical direction than in the horizontal direction, an upper right extension 772 that extends further upward from the upper right part of the main body 771, and a lower left extension 773 that extends at an angle from the bottom of the main body 771 toward the lower left.

As described above, the power supply board 71 is provided with a positive electrode tab connection portion 711a and a negative electrode tab connection portion 711b, and is equipped with a power supply temperature sensor 16 and a fuse 17, and is electrically connected to the power supply connection portion 51 of the main board 50 by a board connection portion 710. More specifically, the positive electrode tab connection portion 711a and the negative electrode tab connection portion 711b are exposed on the surface of the power supply board 71. The power supply temperature sensor 16 and the fuse 17 are mounted on the surface of the power supply board 71 and connected to the first conductive layer L1 on the surface side shown in FIG. 10. The board connection portion 710 is mounted on the back surface of the power supply board 71.

The first conductive layer L1 has a first -conductive region 780 formed in the main body 771 and the upper right extension 772, a first +conductive region 781 formed in the lower part of the lower left extension 773, and a second +conductive region 782 formed in the upper part of the lower left extension 773 and between the first -conductive region 780 and the first +conductive region 781. The first -conductive region 780, the first +conductive region 781, and the second +conductive region 782 are arranged at a distance from each other in the vertical direction and are insulated. The first -conductive region 780, the first +conductive region 781, and the second +conductive region 782 are formed slightly inward from the outer edge 760a and over substantially the entire area in the width direction (left-right direction).

The first + conductive region 781 is provided with a positive electrode tab connection portion 711a, and the first - conductive region 780 is provided with a negative electrode tab connection portion 711b. The positive electrode tab connection portion 711a and the negative electrode tab connection portion 711b are disposed at approximately the same position in the left-right direction, and are disposed adjacent to each other in the up-down direction, sandwiching the second + conductive region 782 therebetween.

A fuse 17 is connected between the first + conductive region 781 and the second + conductive region 782, and the first + conductive region 781 and the second + conductive region 782 are normally conductive via the fuse 17. On the other hand, when an overcurrent occurs, the fuse 17 melts, thereby insulating the first + conductive region 781 and the second + conductive region 782.

The second + conductive region 782 is connected to the second conductive layer L2 via a number of through holes penetrating the substrate 760. The second conductive layer L2 has a third + conductive region 783 formed across the main body 771 and the lower left extension 773, a + contact connection portion 784 formed at the bottom of the upper right extension 772 and connected to the + contact of the board connection portion 710, and a - contact connection portion 785 formed at the top of the upper right extension 772 and connected to the - contact of the board connection portion 710. The third + conductive region 783 and the + contact connection portion 784 are continuous and always conductive. On the other hand, the + contact connection portion 784 and the - contact connection portion 785 are arranged at a distance from each other in the vertical direction and are insulated.

In the power supply board 71 configured in this manner, the power supplied from the positive electrode tab 111a of the power supply unit 111C is supplied to the main board 50 through the positive electrode tab connection portion 711a, the first + conductive area 781, the fuse 17, the second + conductive area 782, the third + conductive area 783, the + contact connection portion 784, and the + contact of the board connection portion 710.

The first -conductive region 780 of the first conductive layer L1 is connected to the -contact connection part 785 via multiple through holes penetrating the substrate 760, and is connected to the -contact of the board connection part 710 mounted on the back surface at the top of the upper right extension part 772. The wiring connected from the negative electrode tab 111b of the power supply part 111C through the first -conductive region 780 and the -contact connection part 785 to the -contact of the board connection part 710 has the same potential as the reference potential (ground potential) of the internal unit 10, and constitutes the ground line 75 (see FIG. 8).

Here, as shown in FIG. 10, the width W1 of the first + conductive region 781 and the width W2 of the second + conductive region 782 connecting the positive electrode tab connection portion 711a and the positive contact connection portion 784 are wider than the width Wa of the positive electrode tab connection portion 711a. The width is the length in the direction perpendicular to the current flow direction. In this embodiment, the current flow direction is the up-down direction from the positive electrode tab connection portion 711a to the positive contact connection portion 784, and the width is the length in the left-right direction perpendicular to the up-down direction. Because the widths W1 and W2 of the first + conductive region 781 and the second + conductive region 782 are wide, current concentration can be avoided inside the power supply board 71 even if a large current flows from the power supply unit 111C through the positive electrode tab connection portion 711a, and power can be appropriately supplied from the power supply unit 111C. In particular, in the region where the positive electrode tab connection portion 711a and the first + conductive region 781 are connected, it is preferable that the width W1 of the first + conductive region 781 is wider than the width Wa of the positive electrode tab connection portion 711a. Similarly, the width W3 of the first - conductive region 780 connecting the negative electrode tab connection portion 711b and the - contact connection portion 785 is wider than the width Wb of the negative electrode tab connection portion 711b. In particular, in the region where the negative electrode tab connection portion 711b and the first - conductive region 780 are connected, it is preferable that the width W3 of the first - conductive region 780 is wider than the width Wb of the negative electrode tab connection portion 711b.

Fuse 17 is provided between first + conductive region 781 and second + conductive region 782, so if some abnormality causes a current greater than the rated value to flow from power supply unit 111C to main board 50, or from main board 50 to power supply unit 111C, the circuit can be cut off to prevent the current from continuing to flow, allowing for safe power supply. Also, main board 50 can be made smaller than when fuse 17 is provided on main board 50.

FIG. 11 is a front view of the first conductive layer L1 and the second conductive layer L2 of the power supply board 71 of the modified example. As shown in FIG. 11, the first + conductive region 781, the second + conductive region 782, the third + conductive region 783, and the first - conductive region 780 formed on the first conductive layer L1 and the second conductive layer L2 may be formed as mesh-shaped conductive regions. This can reduce stress on the board connection portion 710. On the other hand, the first conductive layer L1 and the second conductive layer L2 of the power supply board 71 shown in FIG. 10 have the smallest DC resistance and provide good power supply efficiency.

In the above embodiment, the power supply temperature sensor 16 and the fuse 17 are mounted on the power supply board 71, but other elements may be mounted. For example, from the viewpoint of safety, a protection IC 83, a circuit breaker FET connected to the protection IC 83 to cut off charging of the power supply unit 111C or discharging to the power supply unit 111C, and a current detection shunt resistor connected to the protection IC 83 to detect the charging or discharging current of the power supply unit 111C may be mounted. In particular, the protection IC 83 and the current detection shunt resistor not only improve safety, but also enable more accurate detection of the charging voltage and charging current or the discharging voltage and discharging current of the power supply unit 111C. That is, when the protection IC 83 is mounted on the power supply board 71, the voltage can be detected near the power supply unit 111C compared to the case where the protection IC 83 is mounted on the main board 50, so that the accuracy of detection of overcharging, overdischarging, and short circuits due to voltage is improved. By mounting the protection IC 83 on the power supply board 71, it is also possible to detect these before the fuse. Similarly, when a current detection shunt resistor is mounted on the power supply board 71, the current can be detected closer to the power supply unit 111C than when it is mounted on the main board 50, improving the accuracy of detecting overcharging, overdischarging, and short circuits caused by current. Mounting a current detection shunt resistor on the power supply board 71 also makes it possible to detect these before the fuse 17.

FIGS. 12 and 13 are diagrams illustrating the positive electrode tab 111a connected to the positive electrode tab connection portion 711a. Note that although not explained here, the same applies to the negative electrode tab 111b connected to the negative electrode tab connection portion 711b.

The connection between the positive electrode tab 111a and the positive electrode tab connection part 711a is generally made by soldering the tip of the positive electrode tab 111a to the positive electrode tab connection part 711a. Figure 12 shows a case where a rectangular positive electrode tab 111a is soldered to a rectangular positive electrode tab connection part 711a, and the connection line 790 that connects the positive electrode tab 111a and the positive electrode tab connection part 711a by soldering is a straight line.

As shown in FIG. 13, when the rectangular positive electrode tab 111a with the recess 160 formed therein is soldered to the rectangular positive electrode tab connection portion 711a, a recess 791 is formed in the connecting wire 790. When the recess 160 is formed by connecting one end of two parallel straight line portions 161 with a semicircular arc 162, the bottom of the recess 791 includes a semicircular arc. The bottom of the recess 791 may also include an elliptical arc. In this way, by including the recess 791 in the connecting wire 790, the connecting wire 790 becomes longer than a simple straight line, so that the resistance is reduced and the power supply efficiency can be improved. Furthermore, by making the bottom of the recess 791 into an arc, it is possible to prevent current from concentrating at the corners, and the power supply efficiency can be further improved.

The connecting line 790 is not limited to having a concave portion, but may also have a convex portion, and may have at least a partially curved or bent portion, such as a zigzag or wavy shape. Note that this disclosure does not exclude connecting lines 790 that are simple straight lines.

Returning to Figures 4 to 6, the power supply temperature sensor 16 mounted on the surface of the power supply board 71 is provided, together with the fuse 17, between the positive electrode tab connection portion 711a and the negative electrode tab connection portion 711b. As shown in Figure 10, the power supply temperature sensor 16 is located in the space between the first + conductive area 781 and the second + conductive area 782 of the first conductive layer L1, which are provided to prevent short circuits, and is connected to the board connection portion 710. By mounting the power supply temperature sensor 16 on the power supply board 71, the connection portion of the power supply unit 111C to the main board 50 and the connection portion of the power supply temperature sensor 16 to the main board 50 can be made common, allowing the main board 50 to be made smaller.

More specifically, as shown in FIG. 10, the + terminal of the power supply temperature sensor 16 is connected to the + signal contact of the board connection part 710 via the first + signal wiring 713 formed on the first conductive layer L1, the second + signal wiring 714 formed on the second conductive layer L2, and a through hole 715 connecting the first + signal wiring 713 and the second + signal wiring 714. The + signal contact of the board connection part 710 is connected to the + signal contact of the main board 50. In addition, the - terminal of the power supply temperature sensor 16 is connected to the - signal contact of the board connection part 710 via the first - signal wiring 716 formed on the first conductive layer L1, the second - signal wiring 717 formed on the second conductive layer L2, and a through hole 718 connecting the first - signal wiring 716 and the second - signal wiring 717. The - signal contact of the board connection part 710 is connected to the - signal contact of the main board 50.

Here, the second + signal wiring 714 extends vertically between the third + conductive region 783 formed on the second conductive layer L2 and the outer edge 760a at the right end of the substrate 760. If the second + signal wiring 714 is provided in the center of the third + conductive region 783, the third + conductive region 783 will become narrow and current concentration will occur, but by providing the second + signal wiring 714 between the outer edge 760a of the power supply board 71 and the third + conductive region 783, the third + conductive region 783 can be made wide.

Similarly, the first signal wiring 716 extends vertically between the first conductive region 780 formed on the first conductive layer L1 and the outer edge 760a at the right end of the base material 760. By providing the first signal wiring 716 between the outer edge 760a of the power supply board 71 and the first conductive region 780, a wide first conductive region 780 can be ensured.

By providing the second + signal wiring 714 and the first - signal wiring 716, which have long wiring distances, on different layers, a wider conductive area can be secured compared to providing them on the same layer. Furthermore, the second + signal wiring 714 and the first - signal wiring 716 are arranged so as to overlap when viewed from the stacking direction.

As shown in Figures 4 to 6, the surface of the power supply board 71 on which the power supply temperature sensor 16 and the fuse 17 are mounted is located on the opposite side to the surface facing the power supply unit 111C. This makes it possible to prevent the power supply temperature sensor 16 and the fuse 17 from being damaged when attaching or detaching the power supply unit 111C.

Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can come up with various modified or amended examples within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components in the above-described embodiments may be combined in any manner as long as it does not deviate from the spirit of the invention.

For example, the power supply board 71 has two conductive layers L1 and L2, but it may have one conductive layer or three or more conductive layers.

This specification describes at least the following items. Note that the corresponding components in the above-mentioned embodiment are shown in parentheses, but are not limited to these.

(1) a power source (power source unit 111A to 111C) that supplies power to a heating unit (heating unit 121A to 121C) that heats an aerosol source (stick-shaped substrate 150);
A control device (control unit 116A, control unit 116B, MCU1) for controlling the heating unit;
A first board (main board 50) on which the control device is mounted;
a second substrate (power source substrate 71) connected to the power source and the first substrate;
The second substrate comprises:
Electrode connection parts (positive electrode tab connection part 711a, negative electrode tab connection part 711b) connected to the electrodes (positive electrode tab 111a) of the power source;
A contact connection portion (+contact connection portion 784) connected to the contact of the first substrate;
a conductive region (a first + conductive region 781, a second + conductive region 782) that connects the electrode connection portion and the contact connection portion,
The width of the conductive region (width W1, width W2) is wider than the width of the electrode connection portion (width Wa). A power supply unit of an aerosol generating device (power supply unit 110, suction device 100B, 100).

According to (1), since the conductive area is large, current concentration inside the second substrate can be avoided even if a large current flows from the power supply through the electrode connection, and power can be supplied appropriately from the power supply.

(2) A power supply unit for the aerosol generating device according to (1),
The second substrate includes:
A power supply unit of the aerosol generating device, in which a fuse (fuse 17) is mounted within the conductive area.

According to (2), if some abnormality causes a current greater than the rated current to flow from the power supply to the first board, or from the first board to the power supply, the circuit can be interrupted to prevent the current from continuing to flow, allowing for a safe power supply. In addition, the first board can be made smaller than when a fuse is placed on the first board.

(3) A power supply unit for the aerosol generating device according to (1) or (2),
An electrode tab (positive electrode tab 111a) extending from the power source is connected to the electrode connection portion,
At least a portion of an outer edge of the electrode tab is connected to the electrode connection portion;
A power supply unit for an aerosol generating device, wherein the connecting wire (connecting wire 790) between the electrode tab and the electrode connection portion includes a bent or curved portion.

According to (3), when an electrode tab and an electrode connection part are connected by soldering to form a connecting line, the connecting line is longer than a simple straight line, so that the resistance is reduced and the power supply efficiency can be improved.

(4) A power supply unit for the aerosol generating device according to (3),
The connecting wire includes a recess (recess 791), and the power supply unit of the aerosol generating device.

(4) allows for a longer connecting line.

(5) A power supply unit for the aerosol generating device according to (4),
A power supply unit for an aerosol generating device, wherein the bottom of the recess is an arc of a circle or an ellipse.

(5) This makes it possible to prevent current from concentrating at corners, thereby improving power supply efficiency.

(6) A power supply unit for the aerosol generating device according to any one of (1) to (5),
The second substrate includes:
A power supply unit of the aerosol generating device, in which a thermistor (power supply temperature sensor 16) is implemented.

According to (6), the connection part of the power supply to the first substrate and the connection part of the thermistor to the first substrate can be made common, so the first substrate can be made smaller. In addition, the first substrate can be made smaller than when the thermistor is disposed on the first substrate.

(7) A power supply unit for the aerosol generating device according to (6),
The thermistor is connected to the first substrate via signal wiring (first + signal wiring 713, second + signal wiring 714, first − signal wiring 716, second − signal wiring 717),
A power supply unit for an aerosol generating device, in which at least a portion of the signal wiring (second + signal wiring 714, first - signal wiring 716) is provided between the outer edge portion (outer edge portion 760a) of the second substrate and the conductive area.

According to (7), if the signal wiring is passed between the conductive regions, the conductive region becomes narrow and current concentration occurs. However, by providing the signal wiring between the outer edge of the second substrate and the conductive region, a wide conductive region can be ensured.

(8) A power supply unit for the aerosol generating device according to (6) or (7),
The thermistor is connected to the connection portion (power supply connection portion 51) of the first substrate via a + signal wiring (second + signal wiring 714) and a - signal wiring (first - signal wiring 716),
The second substrate comprises:
It has a multi-layer structure,
At least a portion of the negative signal wiring is disposed in a first layer (first conductive layer L1);
A power supply unit for an aerosol generating device, wherein at least a portion of the + signal wiring is arranged on a second layer (second conductive layer L2) which is a layer different from the first layer.

According to (8), by providing two signal wirings on different layers, a larger conductive area can be secured compared to providing them on the same layer.

(9) A power supply unit for the aerosol generating device according to (8),
The power supply unit for the aerosol generation device, wherein the + signal wiring and the - signal wiring are arranged so as to overlap when viewed from the stacking direction.

According to (9), the signal wiring can be consolidated.

(10) A power supply unit for the aerosol generating device according to any one of (6) to (9),
The electrode connection portion has a positive electrode connection portion (positive electrode tab connection portion 711a) and a negative electrode connection portion (negative electrode tab connection portion 711b),
A power supply unit for an aerosol generating device, wherein the thermistor is disposed between the positive electrode connection portion and the negative electrode connection portion.

According to (10), the second substrate can be made smaller by placing a thermistor in the space provided to prevent short circuits.

(11) A power supply unit for the aerosol generating device according to (2),
The electrode connection portion has a positive electrode connection portion (positive electrode tab connection portion 711a) and a negative electrode connection portion (negative electrode tab connection portion 711b),
A power supply unit for an aerosol generating device, wherein the fuse is disposed between the positive electrode connection portion and the negative electrode connection portion.

According to (11), by placing a fuse in the space provided to prevent short circuits, the second substrate can be made smaller.

(12) A power supply unit for the aerosol generating device according to (10),
The second substrate has a fuse (fuse 17) mounted within the conductive region;
A power supply unit for an aerosol generating device, wherein the thermistor and the fuse are arranged between the positive electrode connection portion and the negative electrode connection portion.

According to (12), the second substrate can be made smaller by placing a thermistor and a fuse in the space provided to prevent short circuits.

(13) A power supply unit for the aerosol generating device according to (12),
A power supply unit of an aerosol generating device, in which the thermistor and the fuse are mounted on the surface (front side) opposite the power supply.

(13) makes it possible to prevent thermistors and fuses from being damaged when connecting or disconnecting the power supply.

(14) A power supply unit for the aerosol generating device according to any one of (1) to (13),
A power supply unit of an aerosol generating device, wherein the first substrate is a rigid substrate and the second substrate is a flexible circuit substrate.

According to (14), it is possible to avoid power concentration inside the flexible circuit board, and power can be supplied appropriately from the power source.

(15) power supply (power supply units 111A to 111C);
a heating unit (heating units 121A to 121C) that consumes the power supplied from the power source to heat the aerosol source;
A control device (control unit 116A, control unit 116B, MUC1) that controls the heating unit;
A first board (main board 50) on which the control device is mounted;
a second substrate (power source substrate 71) connected to the power source and the first substrate;
The second substrate comprises:
An electrode connection portion (positive electrode tab connection portion 711a) connected to an electrode of the power source;
A contact connection portion (+contact connection portion 784) connected to the contact of the first substrate;
a conductive region (a first + conductive region 781, a second + conductive region 782) that connects the electrode connection portion and the contact connection portion,
The width (width W1, width W2) of the conductive region is wider than the width (width Wa) of the electrode connection portion of the aerosol generating device (inhalation device 100B, 100).

According to (15), since the conductive area is large, current concentration inside the second substrate can be avoided even if a large current flows from the power supply through the electrode connection portion, and power can be appropriately supplied from the power supply.

16 Power supply temperature sensor (thermistor)
17 Fuse 50 Main board (first board)
51 Power supply connection portion (connection portion of first substrate)
71 Power supply board (second board)
100A Suction device (aerosol generating device)
100 Suction device (aerosol generating device, power supply unit)
100B Suction device (aerosol generating device, power supply unit)
110 Power supply unit 111A Power supply unit (power supply)
111B Power supply unit (power supply)
111C Power supply unit (power supply)
111a Positive electrode tab (electrode, electrode tab)
116A control unit (control device)
116B control unit (control device)
121A Heating section 121B Heating section 121C Heating section 150 Stick-type substrate (aerosol source)
711a Positive electrode tab connection part (electrode connection part, positive electrode connection part)
711b Negative electrode tab connection part (electrode connection part, negative electrode connection part)
713 1st + signal wiring (signal wiring)
714 2nd + signal wiring (signal wiring)
716 1st signal wiring (signal wiring)
717 2nd signal wiring (signal wiring)
781 First + conductive region (conductive region)
782 2nd + conductive region (conductive region)
784 + Contact connection part (contact connection part)
790 Connection line 791 Recess L1 First conductive layer (first layer)
L2 Second conductive layer (second layer)
W1 1st + width of conductive region (width of conductive region)
W2 2nd + width of conductive region (width of conductive region)
Wa: Width of positive electrode tab connection part (width of electrode connection part)
MCU1 (control device)

Claims (15)

1. A power source for supplying power to a heating section for heating the aerosol source;
   A control device for controlling the heating unit;
   a first substrate on which the control device is mounted;
   a second substrate connected to the power source and the first substrate;
   The second substrate comprises:
   an electrode connection portion connected to an electrode of the power source;
   a contact connection portion connected to a contact of the first substrate;
   a conductive region connecting the electrode connection portion and the contact connection portion;
   The width of the conductive region is greater than the width of the electrode connection portion.
   Power supply unit for the aerosol generator.
2. A power supply unit for the aerosol generating device according to claim 1,
   The second substrate includes:
   A power supply unit of an aerosol generating device, the power supply unit having a fuse mounted within the conductive region.
3. A power supply unit for the aerosol generating device according to claim 1 or 2,
   An electrode tab extending from the power source is connected to the electrode connection portion,
   At least a portion of an outer edge of the electrode tab is connected to the electrode connection portion;
   A power supply unit for an aerosol generating device, wherein the connecting wire between the electrode tab and the electrode connection portion includes a bent or curved portion.
4. A power supply unit for the aerosol generating device according to claim 3,
   The power supply unit of the aerosol generating device, wherein the connecting wire includes a recess.
5. A power supply unit for the aerosol generating device according to claim 4,
   A power supply unit for an aerosol generating device, wherein the bottom of the recess is an arc of a circle or an ellipse.
6. A power supply unit for the aerosol generating device according to any one of claims 1 to 5,
   The second substrate includes:
   The power supply unit of the aerosol generator, in which the thermistor is implemented.
7. A power supply unit for the aerosol generating device according to claim 6,
   the thermistor is connected to the first substrate via a signal wiring;
   A power supply unit for an aerosol generating device, wherein at least a portion of the signal wiring is provided between the outer edge of the second substrate and the conductive region.
8. A power supply unit for the aerosol generating device according to claim 6 or 7,
   the thermistor is connected to a connection portion of the first substrate via a + signal wiring and a - signal wiring;
   The second substrate comprises:
   It has a multi-layer structure,
   At least a portion of the − signal wiring is disposed on a first layer;
   A power supply unit for an aerosol generating device, wherein at least a portion of the + signal wiring is arranged in a second layer which is a layer different from the first layer.
9. A power supply unit for the aerosol generating device according to claim 8,
   The power supply unit for the aerosol generation device, wherein the + signal wiring and the - signal wiring are arranged so as to overlap when viewed from the stacking direction.
10. A power supply unit for the aerosol generating device according to any one of claims 6 to 9,
    the electrode connection portion has a positive electrode connection portion and a negative electrode connection portion,
    A power supply unit for an aerosol generating device, wherein the thermistor is disposed between the positive electrode connection portion and the negative electrode connection portion.
11. A power supply unit for the aerosol generating device according to claim 2,
    the electrode connection portion has a positive electrode connection portion and a negative electrode connection portion,
    A power supply unit for an aerosol generating device, wherein the fuse is disposed between the positive electrode connection portion and the negative electrode connection portion.
12. A power supply unit for the aerosol generating device according to claim 10,
    the second substrate has a fuse mounted within the conductive region;
    A power supply unit for an aerosol generating device, wherein the thermistor and the fuse are arranged between the positive electrode connection portion and the negative electrode connection portion.
13. A power supply unit for the aerosol generating device according to claim 12,
    A power supply unit for an aerosol generating device, wherein the thermistor and the fuse are mounted on the surface opposite the power supply.
14. A power supply unit for the aerosol generating device according to any one of claims 1 to 13,
    A power supply unit of an aerosol generating device, wherein the first substrate is a rigid substrate and the second substrate is a flexible circuit substrate.
15. Power supply,
    A heating unit that consumes the power supplied from the power source to heat the aerosol source;
    A control device for controlling the heating unit;
    a first substrate on which the control device is mounted;
    a second substrate connected to the power source and the first substrate;
    The second substrate comprises:
    an electrode connection portion connected to an electrode of the power source;
    a contact connection portion connected to a contact of the first substrate;
    a conductive region connecting the electrode connection portion and the contact connection portion;
    An aerosol generating device, wherein the width of the conductive region is wider than the width of the electrode connection portion.

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