WO2024147426A1 - Curable composition, cured film produced using composition, color filter including cured film and display device including color filter - Google Patents
Curable composition, cured film produced using composition, color filter including cured film and display device including color filter Download PDFInfo
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- WO2024147426A1 WO2024147426A1 PCT/KR2023/013071 KR2023013071W WO2024147426A1 WO 2024147426 A1 WO2024147426 A1 WO 2024147426A1 KR 2023013071 W KR2023013071 W KR 2023013071W WO 2024147426 A1 WO2024147426 A1 WO 2024147426A1
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- curable composition
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- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- PSBPNWBGNOWCCU-UHFFFAOYSA-N OB(O)O.S.S.S Chemical compound OB(O)O.S.S.S PSBPNWBGNOWCCU-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- CQHKDHVZYZUZMJ-UHFFFAOYSA-N [2,2-bis(hydroxymethyl)-3-prop-2-enoyloxypropyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CO)COC(=O)C=C CQHKDHVZYZUZMJ-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- IPTNXMGXEGQYSY-UHFFFAOYSA-N acetic acid;1-methoxybutan-1-ol Chemical compound CC(O)=O.CCCC(O)OC IPTNXMGXEGQYSY-UHFFFAOYSA-N 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- BWLBGMIXKSTLSX-UHFFFAOYSA-N alpha-hydroxy-alpha-methylpropanoic acid Natural products CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000000852 azido group Chemical group *N=[N+]=[N-] 0.000 description 1
- WYLQRHZSKIDFEP-UHFFFAOYSA-N benzene-1,4-dithiol Chemical compound SC1=CC=C(S)C=C1 WYLQRHZSKIDFEP-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- ALRHLSYJTWAHJZ-UHFFFAOYSA-N beta-hydroxy propionic acid Natural products OCCC(O)=O ALRHLSYJTWAHJZ-UHFFFAOYSA-N 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- HXTBYXIZCDULQI-UHFFFAOYSA-N bis[4-(methylamino)phenyl]methanone Chemical compound C1=CC(NC)=CC=C1C(=O)C1=CC=C(NC)C=C1 HXTBYXIZCDULQI-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 125000003739 carbamimidoyl group Chemical group C(N)(=N)* 0.000 description 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000012045 crude solution Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- BLCKNMAZFRMCJJ-UHFFFAOYSA-N cyclohexyl cyclohexyloxycarbonyloxy carbonate Chemical compound C1CCCCC1OC(=O)OOC(=O)OC1CCCCC1 BLCKNMAZFRMCJJ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- NDMXSCGMYOVVJE-UHFFFAOYSA-N ethoxymethyl acetate Chemical compound CCOCOC(C)=O NDMXSCGMYOVVJE-UHFFFAOYSA-N 0.000 description 1
- WNIHNYUROPJCLW-UHFFFAOYSA-N ethyl 2-ethoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OCC WNIHNYUROPJCLW-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- UKDLORMZNPQILV-UHFFFAOYSA-N ethyl 3-hydroxypropanoate Chemical compound CCOC(=O)CCO UKDLORMZNPQILV-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 229910052949 galena Inorganic materials 0.000 description 1
- 229960004275 glycolic acid Drugs 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000005549 heteroarylene group Chemical group 0.000 description 1
- 125000004366 heterocycloalkenyl group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 description 1
- 125000005638 hydrazono group Chemical group 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- AZQGFVRDZTUHBU-UHFFFAOYSA-N isocyanic acid;triethoxy(propyl)silane Chemical compound N=C=O.CCC[Si](OCC)(OCC)OCC AZQGFVRDZTUHBU-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- MDEDOIDXVJXDBW-UHFFFAOYSA-N methoxymethyl acetate Chemical compound COCOC(C)=O MDEDOIDXVJXDBW-UHFFFAOYSA-N 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- YSGBMDFJWFIEDF-UHFFFAOYSA-N methyl 2-hydroxy-3-methylbutanoate Chemical compound COC(=O)C(O)C(C)C YSGBMDFJWFIEDF-UHFFFAOYSA-N 0.000 description 1
- GSJFXBNYJCXDGI-UHFFFAOYSA-N methyl 2-hydroxyacetate Chemical compound COC(=O)CO GSJFXBNYJCXDGI-UHFFFAOYSA-N 0.000 description 1
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- ZWRDBWDXRLPESY-UHFFFAOYSA-N n-benzyl-n-ethylethanamine Chemical compound CCN(CC)CC1=CC=CC=C1 ZWRDBWDXRLPESY-UHFFFAOYSA-N 0.000 description 1
- JIKUXBYRTXDNIY-UHFFFAOYSA-N n-methyl-n-phenylformamide Chemical compound O=CN(C)C1=CC=CC=C1 JIKUXBYRTXDNIY-UHFFFAOYSA-N 0.000 description 1
- MZYHMUONCNKCHE-UHFFFAOYSA-N naphthalene-1,2,3,4-tetracarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=C(C(O)=O)C(C(O)=O)=C21 MZYHMUONCNKCHE-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- UFOIOXZLTXNHQH-UHFFFAOYSA-N oxolane-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C1OC(C(O)=O)C(C(O)=O)C1C(O)=O UFOIOXZLTXNHQH-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920005593 poly(benzyl methacrylate) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/12—Esters of phenols or saturated alcohols
- C08F222/24—Esters containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
Definitions
- This description relates to a curable composition, a cured film manufactured using the composition, a color filter comprising the cured film, and a display device comprising the color filter.
- quantum dot ink compositions that are being actively studied, at the initial stage, they were dispersed in solvents used in curable compositions with relatively low polarity and high hydrophobicity. For this reason, it was difficult to include more than 20% by weight of quantum dots relative to the total amount of the composition, so it was not possible to increase the luminous efficiency of the ink beyond a certain level, and even if additional quantum dots were added and dispersed to increase luminous efficiency, ink-jetting was not possible. This possible point also exceeded the range, so fairness could not be satisfied.
- the solvent-free type of quantum dot ink that does not contain a solvent is the most desirable form to apply in actual processes, and the current technology for applying quantum dots themselves to solvent-type compositions is evaluated to have reached a certain limit.
- One embodiment is to provide a curable composition that can simultaneously improve optical properties and reduce reflectance.
- Another embodiment is to provide a cured film manufactured using the curable composition.
- Another embodiment is to provide a color filter including the cured film.
- Another embodiment is to provide a display device including the color filter.
- One embodiment includes (A) quantum dots; and (B) a polymerizable compound including a compound represented by the following formula (1).
- L 1 is a divalent linking group containing a sulfur atom, but does not include a disulfide (*-SS-*) linking structure,
- L 2 and L 3 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, or a substituted or unsubstituted C3 to C20 cycloalkylene group,
- R 1 and R 2 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
- the L 1 may be represented by any one of the following formulas L-1 to formula L-4.
- the compound represented by Formula 1 may be represented by any one of the following Formulas 1-1 to 1-3.
- L 10 and L 11 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group
- the compound represented by Formula 2 may have a refractive index of 1.455 or less.
- the curable composition may be a solvent-free curable composition.
- the solvent-free curable composition includes 5 to 60 wt% of the quantum dots, based on the total amount of the solvent-free curable composition; And it may include 40% by weight to 95% by weight of the polymerizable compound.
- the curable composition may further include a polymerization initiator, a light diffuser, a polymerization inhibitor, or a combination thereof.
- the light diffuser may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.
- the curable composition may further include a solvent.
- the curable composition includes 1% to 40% by weight of the quantum dots, based on the total weight of the curable composition; 1% to 20% by weight of the polymerizable compound; And it may include 40% by weight to 80% by weight of the solvent.
- the curable composition includes malonic acid; 3-amino-1,2-propanediol; Silane-based coupling agent; leveling agent; Fluorine-based surfactant; Or, it may further include a combination thereof.
- Another embodiment provides a color filter including the cured film.
- the optical properties of the curable composition containing quantum dots can be improved while simultaneously reducing reflectance.
- R 1 and R 2 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
- L 4 to L 8 are each independently a single bond or a substituted or unsubstituted C1 to C20 alkylene group.
- the compound represented by Formula 1 may be represented by any one of the following Formulas 1-1 to 1-3, but is not necessarily limited thereto.
- L 9 is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, or an ether group (*-O-*),
- R 3 and R 4 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
- the compound represented by Formula 1 and the compound having a different structure from the compound represented by Formula 1 have a weight ratio of 1:9 to 9:1, for example, 5:5 to 5:5. It may be included in a weight ratio of 9:1.
- the compound represented by Formula 1 may be included in a larger amount than a compound having a different structure from the compound represented by Formula 1 (for example, the compound represented by Formula 2, etc.).
- the compound represented by Formula 1 is contained in a greater amount than the compound having a different structure from the compound represented by Formula 1 (e.g., the compound represented by Formula 2, etc.), for example, at a weight ratio of 6:4 to 9:1,
- the curing rate of the curable composition according to one embodiment is increased, thereby maximizing simultaneous improvement of the two effects of improving optical properties and reducing reflectance.
- compounds having a different structure from the compound represented by Formula 1 include, in addition to the compounds represented by Formula 2-1 and Formula 2-2, ethylene glycol diacrylate, triethylene glycol diacrylate, and 1,4-butanediol.
- the polymerizable compound may have a molecular weight of 170 g/mol to 1,000 g/mol.
- the molecular weight of the polymerizable compound is within the above range, it can be advantageous for ink-jetting because it does not impair the optical properties of quantum dots and does not increase the viscosity of the composition.
- the quantum dots may have a maximum fluorescence emission wavelength of 500 nm to 680 nm.
- the quantum dots when the curable composition according to one embodiment is a curable composition containing a solvent, the quantum dots may be included in an amount of 1% by weight to 40% by weight, for example, 3% by weight to 30% by weight, based on the total amount of the curable composition.
- the quantum dots When the quantum dots are included within the above range, the light conversion rate is excellent and pattern characteristics and development characteristics are not impaired, so excellent processability can be achieved.
- the quantum dots absorb light in a wavelength range of 360 nm to 780 nm, for example, 400 nm to 780 nm, and emit fluorescence in a wavelength range of 500 nm to 700 nm, for example, 500 nm to 580 nm, or emit fluorescence in a wavelength range of 600 nm to 680 nm.
- the quantum dot may have a maximum fluorescence emission wavelength (fluorescence ⁇ em ) of 500 nm to 680 nm.
- the quantum dots may each independently be an organic material, an inorganic material, or a hybrid of an organic material and an inorganic material.
- the curable composition according to one embodiment may further include a dispersant.
- the dispersant helps the light conversion material such as quantum dots to be uniformly dispersed within the curable composition, and nonionic, anionic, or cationic dispersants can all be used.
- polyalkylene glycol or its esters polyoxy alkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonic acid salt, carboxylic acid ester, carboxylic acid salt, alkyl amide alkylene oxide. Adducts, alkyl amines, etc.
- the ligand having the polar group may be represented by any one of the compounds represented by the following formulas A to Q, but is not necessarily limited thereto.
- m1 is an integer from 0 to 10.
- triazine-based compounds examples include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4' -Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine , 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine , 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)- 4,6-bis(trichlor
- the curable composition according to one embodiment may further include a binder resin.
- the curable composition may further include a surfactant, such as a fluorine-based surfactant, if necessary, to improve coating properties and prevent defects, that is, to improve leveling performance.
- a surfactant such as a fluorine-based surfactant
- the solvent may be included in an amount of 40% to 80% by weight, for example, 45% to 80% by weight, based on the total amount of the curable composition.
- the solvent-type curable composition has an appropriate viscosity and can have excellent coating properties during large-area coating using spin coating and slit.
- One of the methods for producing the cured film includes forming a pattern by applying the curable composition on a substrate using an inkjet spraying method (S1); and curing the pattern (S2).
- Pixels can be obtained by curing the obtained pattern.
- a thermal curing process or a photo curing process can be applied.
- the heat curing process is preferably performed by heating to a temperature of 100°C or higher, more preferably by heating to 100°C to 300°C, and more preferably by heating to 160°C to 250°C. You can.
- the photocuring process irradiates active rays such as UV light of 190 nm to 450 nm, for example, 200 nm to 500 nm.
- Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.
- Another method of manufacturing the cured film is to manufacture the cured film using the lithography method using the curable composition, and the manufacturing method is as follows.
- a mask of a predetermined shape is interposed, and then actinic rays such as UV rays of 190 nm to 450 nm, for example, 200 nm to 400 nm, are irradiated.
- actinic rays such as UV rays of 190 nm to 450 nm, for example, 200 nm to 400 nm.
- Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.
- the exposure amount varies depending on the type, mixing amount, and dry film thickness of each component of the curable composition, but for example, when using a high-pressure mercury lamp, it is 500 mJ/cm 2 or less (based on a 365 nm sensor).
- an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts remaining to form an image pattern. That is, when developing with an alkaline developer, the unexposed portion is dissolved and an image color filter pattern is formed.
- the image pattern obtained by the above phenomenon can be cured by heating again or irradiating with actinic rays, etc., in order to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc.
- TPO-L Polynetron Co., Ltd.
- Titanium dioxide dispersion (TiO 2 solid content 20% by weight, average particle diameter: 200nm, Dito Technology Co., Ltd.)
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Abstract
Provided are: a curable composition comprising (A) quantum dots and (B) a polymerizable compound which comprises a compound represented by a specific chemical formula; a cured film produced using the curable composition; a color filter including the cured film; and a display device including the color filter.
Description
본 기재는 경화성 조성물, 상기 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 컬러필터 및 상기 컬러필터를 포함하는 디스플레이 장치에 관한 것이다.This description relates to a curable composition, a cured film manufactured using the composition, a color filter comprising the cured film, and a display device comprising the color filter.
일반적인 양자점의 경우, 소수성을 가지는 표면 특성으로 인해 분산되는 용매가 제한적이고, 그러다 보니 바인더나 경화성 모노머 등과 같은 극성 시스템으로의 도입에 많은 어려움을 겪고 있는 것이 사실이다. In the case of general quantum dots, the solvent in which they are dispersed is limited due to their hydrophobic surface characteristics, and as a result, it is true that they face many difficulties in being introduced into polar systems such as binders or curable monomers.
일 예로, 활발히 연구되고 있는 양자점 잉크 조성물의 경우에도 그 초기 단계에서는 상대적으로 극성도가 낮으며 소수성 정도가 높은 경화성 조성물에 사용되는 용매에 그나마 분산되는 수준이었다. 이 때문에 전체 조성물 총량 대비 20 중량% 이상의 양자점을 포함시키기 어려워 잉크의 광효율을 일정 수준 이상 증가시킬 수 없었고, 광효율을 증가시키기 위해 무리하게 양자점을 추가 투입해 분산시키더라도 잉크-젯팅(Ink-jetting)이 가능한 점도 범위를 넘어서게 되어, 공정성을 만족시킬 수 없었다. For example, even in the case of quantum dot ink compositions that are being actively studied, at the initial stage, they were dispersed in solvents used in curable compositions with relatively low polarity and high hydrophobicity. For this reason, it was difficult to include more than 20% by weight of quantum dots relative to the total amount of the composition, so it was not possible to increase the luminous efficiency of the ink beyond a certain level, and even if additional quantum dots were added and dispersed to increase luminous efficiency, ink-jetting was not possible. This possible point also exceeded the range, so fairness could not be satisfied.
또한, 잉크-젯팅(Ink-jetting)이 가능한 점도 범위를 구현하기 위해 전체 조성물 총량 대비 50 중량% 이상의 용매를 포함시켜 잉크 고형분 함량을 낮추는 방법을 사용해 왔는데, 이 방법 역시 점도 면에서는 어느정도 만족할 만한 결과를 제공하나, 잉크-젯팅(Ink-jetting) 시 용매 휘발에 의한 노즐 건조, 노즐 막힘 현상, 잉크-젯팅(Ink-jetting) 후 시간에 따른 단막 두께 감소 등의 문제와 함께 경화 후 두께 편차가 심해지게 되어, 실제 공정에 적용하기 힘든 단점을 가진다.In addition, in order to achieve a viscosity range that allows ink-jetting, a method of lowering the ink solid content by including more than 50% by weight of solvent relative to the total amount of the composition has been used, and this method also gave somewhat satisfactory results in terms of viscosity. However, during ink-jetting, there are problems such as nozzle drying due to solvent volatilization, nozzle clogging, and single film thickness decrease over time after ink-jetting, and the thickness deviation after curing is severe. It has the disadvantage of being difficult to apply to actual processes.
따라서, 양자점 잉크는 용매를 포함하지 않는 무용매 타입이 실제 공정에 적용하기에 가장 바람직한 형태이며, 현재의 양자점 자체를 용매형 조성물에 적용하는 기술은 이제 어느정도 한계에 다다랐다고 평가되고 있다.Therefore, the solvent-free type of quantum dot ink that does not contain a solvent is the most desirable form to apply in actual processes, and the current technology for applying quantum dots themselves to solvent-type compositions is evaluated to have reached a certain limit.
무용매형 경화성 조성물(양자점 잉크 조성물)의 경우, 중합성 화합물이 과량 포함되는 특성으로 말미암아, 휘발성으로 인한 노즐 건조에 따른 막힘 및 토출 불량, 패턴 격벽 픽셀 내 젯팅된 잉크 조성물의 휘발로 인한 단막 두께 감소 등이 문제가 된다. 따라서, 무용매형 경화성 조성물의 광특성을 개선시키려는 노력이 다각도로 이루어지고 있다. 무용매형 경화성 조성물의 광특성 개선을 위해서 일반적으로 무기물의 함량을 증가시키는 방법을 사용하는데, 문제는 무기물의 함량이 증가할수록 반사율이 높아진다는 것이다. 즉, 무용매형 경화성 조성물의 광특성 개선과 반사율 저감 문제는 서로 trade-off 관계에 있어, 상기 두가지 특성을 동시에 개선(광특성 개선 및 반사율 저감)시킬 수 있는 기술에 대한 니즈가 점점 커지고 있다.In the case of solvent-free curable compositions (quantum dot ink compositions), due to the nature of containing an excessive amount of polymerizable compounds, clogging and discharge defects due to nozzle drying due to volatility, and single film thickness reduction due to volatilization of the ink composition jetted within the pattern partition pixels etc. becomes a problem. Therefore, efforts are being made from various angles to improve the optical properties of solvent-free curable compositions. In order to improve the optical properties of a solvent-free curable composition, a method of increasing the content of inorganic materials is generally used, but the problem is that as the content of inorganic materials increases, the reflectance increases. In other words, the problems of improving optical properties and reducing reflectance of solvent-free curable compositions are in a trade-off relationship, and the need for technology that can improve both properties simultaneously (improving optical properties and reducing reflectance) is growing.
일 구현예는 광특성 개선 및 반사율 저감을 동시에 달성할 수 있는 경화성 조성물을 제공하기 위한 것이다.One embodiment is to provide a curable composition that can simultaneously improve optical properties and reduce reflectance.
다른 일 구현예는 상기 경화성 조성물을 이용하여 제조된 경화막을 제공하기 위한 것이다.Another embodiment is to provide a cured film manufactured using the curable composition.
또 다른 일 구현예는 상기 경화막을 포함하는 컬러필터를 제공하기 위한 것이다.Another embodiment is to provide a color filter including the cured film.
또 다른 일 구현예는 상기 컬러필터를 포함하는 디스플레이 장치를 제공하기 위한 것이다.Another embodiment is to provide a display device including the color filter.
일 구현예는 (A) 양자점; 및 (B) 하기 화학식 1로 표시되는 화합물을 포함하는 중합성 화합물을 포함하는 경화성 조성물을 제공한다.One embodiment includes (A) quantum dots; and (B) a polymerizable compound including a compound represented by the following formula (1).
[화학식 1][Formula 1]
상기 화학식 1에서,In Formula 1,
L1은 황 원자를 포함하는 2가의 연결기이되, 단 다이설파이드(*-S-S-*) 연결구조는 포함하지 않고,L 1 is a divalent linking group containing a sulfur atom, but does not include a disulfide (*-SS-*) linking structure,
L2 및 L3은 각각 독립적으로 단일결합, 치환 또는 비치환된 C1 내지 C20 알킬렌기 또는 치환 또는 비치환된 C3 내지 C20 사이클로알킬렌기이고, L 2 and L 3 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, or a substituted or unsubstituted C3 to C20 cycloalkylene group,
R1 및 R2는 각각 독립적으로 수소 원자, 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이다.R 1 and R 2 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
상기 L1은 하기 화학식 L-1 내지 화학식 L-4 중 어느 하나로 표시될 수 있다.The L 1 may be represented by any one of the following formulas L-1 to formula L-4.
[화학식 L-1][Formula L-1]
[화학식 L-2][Formula L-2]
[화학식 L-3][Formula L-3]
[화학식 L-4][Formula L-4]
상기 화학식 L-1 내지 화학식 L-4에서,In Formula L-1 to Formula L-4,
L4 내지 L8은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C20 알킬렌기이다.L 4 to L 8 are each independently a single bond or a substituted or unsubstituted C1 to C20 alkylene group.
상기 화학식 1로 표시되는 화합물은 1.455 초과의 굴절율을 가질 수 있다.The compound represented by Formula 1 may have a refractive index greater than 1.455.
상기 화학식 1로 표시되는 화합물은 하기 화학식 1-1 내지 화학식 1-3 중 어느 하나로 표시될 수 있다.The compound represented by Formula 1 may be represented by any one of the following Formulas 1-1 to 1-3.
[화학식 1-1][Formula 1-1]
[화학식 1-2][Formula 1-2]
[화학식 1-3][Formula 1-3]
상기 중합성 화합물은 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물을 더 포함할 수 있다.The polymerizable compound may further include a compound having a different structure from the compound represented by Formula 1.
상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물은 하기 화학식 2로 표시될 수 있다.A compound having a structure different from the compound represented by Formula 1 may be represented by Formula 2 below.
[화학식 2][Formula 2]
상기 화학식 2에서,In Formula 2,
L9는 치환 또는 비치환된 C1 내지 C10 알킬렌기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬렌기 또는 에테르기(*-O-*)이고,L 9 is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, or an ether group (*-O-*),
L10 및 L11은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C10 알킬렌기이고,L 10 and L 11 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,
R3 및 R4는 각각 독립적으로 수소 원자, 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이다.R 3 and R 4 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
상기 화학식 2로 표시되는 화합물은 1.455 이하의 굴절율을 가질 수 있다.The compound represented by Formula 2 may have a refractive index of 1.455 or less.
상기 화학식 1로 표시되는 화합물 및 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물은 1:9 내지 9:1의 중량비로 포함될 수 있다.The compound represented by Formula 1 and the compound having a structure different from the compound represented by Formula 1 may be included in a weight ratio of 1:9 to 9:1.
상기 경화성 조성물은 무용매형 경화성 조성물일 수 있다.The curable composition may be a solvent-free curable composition.
상기 무용매형 경화성 조성물은, 상기 무용매형 경화성 조성물 총량에 대해, 상기 양자점 5 중량% 내지 60 중량%; 및 상기 중합성 화합물 40 중량% 내지 95 중량%를 포함할 수 있다.The solvent-free curable composition includes 5 to 60 wt% of the quantum dots, based on the total amount of the solvent-free curable composition; And it may include 40% by weight to 95% by weight of the polymerizable compound.
상기 경화성 조성물은 중합개시제, 광확산제, 중합금지제 또는 이들의 조합을 더 포함할 수 있다.The curable composition may further include a polymerization initiator, a light diffuser, a polymerization inhibitor, or a combination thereof.
상기 광확산제는 황산바륨, 탄산칼슘, 이산화티타늄, 지르코니아 또는 이들의 조합을 포함할 수 있다.The light diffuser may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.
상기 경화성 조성물은 용매를 더 포함할 수 있다.The curable composition may further include a solvent.
상기 경화성 조성물은, 상기 경화성 조성물 전체 중량을 기준으로, 상기 양자점 1 중량% 내지 40 중량%; 상기 중합성 화합물 1 중량% 내지 20 중량%; 및 상기 용매 40 중량% 내지 80 중량%를 포함할 수 있다.The curable composition includes 1% to 40% by weight of the quantum dots, based on the total weight of the curable composition; 1% to 20% by weight of the polymerizable compound; And it may include 40% by weight to 80% by weight of the solvent.
상기 경화성 조성물은 말론산; 3-아미노-1,2-프로판디올; 실란계 커플링제; 레벨링제; 불소계 계면활성제; 또는 이들의 조합을 더 포함할 수 있다.The curable composition includes malonic acid; 3-amino-1,2-propanediol; Silane-based coupling agent; leveling agent; Fluorine-based surfactant; Or, it may further include a combination thereof.
다른 일 구현예는 상기 경화성 조성물을 이용하여 제조된 경화막을 제공한다.Another embodiment provides a cured film manufactured using the curable composition.
상기 경화막은 50% 내지 55%의 난반사율을 가질 수 있다.The cured film may have a diffuse reflectance of 50% to 55%.
또 다른 일 구현예는 상기 경화막을 포함하는 컬러필터를 제공한다.Another embodiment provides a color filter including the cured film.
또 다른 일 구현예는 상기 컬러필터를 포함하는 디스플레이 장치를 제공한다.Another embodiment provides a display device including the color filter.
기타 본 발명의 측면들의 구체적인 사항은 이하의 상세한 설명에 포함되어 있다.Details of other aspects of the invention are included in the detailed description below.
양자점 함유 경화성 조성물 내 황을 함유하는 다이(메타)아크릴레이트 화합물을 포함시킴으로써, 상기 양자점 함유 경화성 조성물의 광특성을 개선시키면서도 동시에 반사율도 저감시킬 수 있다. By including a di(meth)acrylate compound containing sulfur in a curable composition containing quantum dots, the optical properties of the curable composition containing quantum dots can be improved while simultaneously reducing reflectance.
이하, 본 발명의 구현예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구범위의 범주에 의해 정의될 뿐이다. Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and the present invention is not limited thereby, and the present invention is only defined by the scope of the claims to be described later.
본 명세서에서 특별한 언급이 없는 한, "알킬기"란 C1 내지 C20 알킬기를 의미하고, "알케닐기"란 C2 내지 C20 알케닐기를 의미하고, "사이클로알케닐기"란 C3 내지 C20 사이클로알케닐기를 의미하고, "헤테로사이클로알케닐기"란 C3 내지 C20 헤테로사이클로알케닐기를 의미하고, "아릴기"란 C6 내지 C20 아릴기를 의미하고, "아릴알킬기"란 C6 내지 C20 아릴알킬기를 의미하며, "알킬렌기"란 C1 내지 C20 알킬렌기를 의미하고, "아릴렌기"란 C6 내지 C20 아릴렌기를 의미하고, "알킬아릴렌기"란 C6 내지 C20 알킬아릴렌기를 의미하고, "헤테로아릴렌기"란 C3 내지 C20 헤테로아릴렌기를 의미하고, "알콕실렌기"란 C1 내지 C20 알콕실렌기를 의미한다.Unless otherwise specified herein, “alkyl group” refers to a C1 to C20 alkyl group, “alkenyl group” refers to a C2 to C20 alkenyl group, and “cycloalkenyl group” refers to a C3 to C20 cycloalkenyl group. , “Heterocycloalkenyl group” refers to a C3 to C20 heterocycloalkenyl group, “aryl group” refers to a C6 to C20 aryl group, “arylalkyl group” refers to a C6 to C20 arylalkyl group, and “alkylene group” means a C1 to C20 alkylene group, “arylene group” means a C6 to C20 arylene group, “alkylarylene group” means a C6 to C20 alkylarylene group, and “heteroarylene group” means a C3 to C20 heteroarylene group. It means an arylene group, and “alkoxylene group” means a C1 to C20 alkoxylene group.
본 명세서에서 특별한 언급이 없는 한, "치환"이란 적어도 하나의 수소 원자가 할로겐 원자(F, Cl, Br, I), 히드록시기, C1 내지 C20 알콕시기, 니트로기, 시아노기, 아민기, 이미노기, 아지도기, 아미디노기, 히드라지노기, 히드라조노기, 카르보닐기, 카르바밀기, 티올기, 에스테르기, 에테르기, 카르복실기 또는 그것의 염, 술폰산기 또는 그것의 염, 인산이나 그것의 염, C1 내지 C20 알킬기, C2 내지 C20 알케닐기, C2 내지 C20 알키닐기, C6 내지 C20 아릴기, C3 내지 C20 사이클로알킬기, C3 내지 C20 사이클로알케닐기, C3 내지 C20 사이클로알키닐기, C2 내지 C20 헤테로사이클로알킬기, C2 내지 C20 헤테로사이클로알케닐기, C2 내지 C20 헤테로사이클로알키닐기, C3 내지 C20 헤테로아릴기 또는 이들의 조합의 치환기로 치환된 것을 의미한다.Unless otherwise specified herein, “substitution” means that at least one hydrogen atom is replaced by a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, Azido group, amidino group, hydrazino group, hydrazono group, carbonyl group, carbamyl group, thiol group, ester group, ether group, carboxyl group or its salt, sulfonic acid group or its salt, phosphoric acid or its salt, C1 to C20 alkyl group, C2 to C20 alkenyl group, C2 to C20 alkynyl group, C6 to C20 aryl group, C3 to C20 cycloalkyl group, C3 to C20 cycloalkenyl group, C3 to C20 cycloalkynyl group, C2 to C20 heterocycloalkyl group, C2 to C20 heterocycloalkenyl group, C2 to C20 heterocycloalkynyl group, C3 to C20 heteroaryl group, or a combination thereof.
또한 본 명세서에서 특별한 언급이 없는 한, "헤테로"란, 화학식 내에 N, O, S 및 P 중 적어도 하나의 헤테로 원자가 적어도 하나 포함된 것을 의미한다.Also, unless otherwise specified herein, “hetero” means that at least one hetero atom among N, O, S, and P is included in the chemical formula.
또한 본 명세서에서 특별한 언급이 없는 한, "(메타)아크릴레이트"는 "아크릴레이트"와 "메타크릴레이트" 둘 다 가능함을 의미하며, "(메타)아크릴산"은 "아크릴산"과 "메타크릴산" 둘 다 가능함을 의미한다. Also, unless otherwise specified in the specification, “(meth)acrylate” means that both “acrylate” and “methacrylate” are possible, and “(meth)acrylic acid” means “acrylic acid” and “methacrylic acid.” "It means that both are possible.
본 명세서에서 특별한 언급이 없는 한, "조합"이란 혼합 또는 공중합을 의미한다.Unless otherwise specified herein, “combination” means mixing or copolymerization.
본 명세서 내 화학식에서 별도의 정의가 없는 한, 화학결합이 그려져야 하는 위치에 화학결합이 그려져있지 않은 경우는 상기 위치에 수소 원자가 결합되어 있음을 의미한다.Unless otherwise defined in the chemical formulas in this specification, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.
또한 본 명세서에서 특별한 언급이 없는 한, "*"는 동일하거나 상이한 원자 또는 화학식과 연결되는 부분을 의미한다.Also, unless otherwise specified herein, “*” refers to a portion connected to the same or different atom or chemical formula.
이하에서 일 구현예에 따른 경화성 조성물을 구성하는 각각의 성분에 대하여 구체적으로 설명한다.Hereinafter, each component constituting the curable composition according to one embodiment will be described in detail.
중합성 화합물polymerizable compound
일 구현예에 따른 양자점 함유 경화성 조성물은 중합성 화합물로 고굴절율을 가지는 황 함유 다이(메타)아크릴레이트 화합물을 포함함으로써, 상기 황 함유 다이(메타)아크릴레이트 화합물의 고굴절 특성이 경화성 조성물의 광특성 개선 효과로 이어지고, 나아가 상기 경화성 조성물의 열경화 시 티올-엔(thiol-ene) 부가 반응이 유도되어 경화성 조성물의 경화막 표면 경화를 촉진시켜 반사율 저감 효과를 동시에 만족시킬 수 있다. The curable composition containing quantum dots according to one embodiment includes a sulfur-containing di(meth)acrylate compound having a high refractive index as a polymerizable compound, so that the high refractive characteristics of the sulfur-containing di(meth)acrylate compound are the optical properties of the curable composition. This leads to an improvement effect, and furthermore, when the curable composition is thermally cured, a thiol-ene addition reaction is induced, thereby promoting hardening of the surface of the cured film of the curable composition, thereby satisfying the reflectance reduction effect at the same time.
상기 황 함유 다이(메타)아크릴레이트 화합물은 하기 화학식 1로 표시될 수 있다.The sulfur-containing di(meth)acrylate compound may be represented by the following formula (1).
[화학식 1][Formula 1]
상기 화학식 1에서,In Formula 1,
L1은 황 원자를 포함하는 2가의 연결기이되, 단 다이설파이드(*-S-S-*) 연결구조는 포함하지 않고,L 1 is a divalent linking group containing a sulfur atom, but does not include a disulfide (*-SS-*) linking structure,
L2 및 L3은 각각 독립적으로 단일결합, 치환 또는 비치환된 C1 내지 C20 알킬렌기 또는 치환 또는 비치환된 C3 내지 C20 사이클로알킬렌기이고, L 2 and L 3 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, or a substituted or unsubstituted C3 to C20 cycloalkylene group,
R1 및 R2는 각각 독립적으로 수소 원자, 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이다.R 1 and R 2 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
녹색 양자점 함유 경화성 조성물은 적색 양자점 함유 경화성 조성물 대비 상대적으로 흡수율(abs.) 및 광효율(EQE)이 낮고, 반사율은 2배 가까이 높은 단점이 있다. 따라서, 패널에서의 녹색 양자점 픽셀의 휘도 개선과 외광 반사를 줄여 정측면 휘도를 좀더 개선해야 하는 기술적 과제가 아직 해결되지 못하고 있다. The green quantum dot-containing curable composition has the disadvantage of having a relatively low absorption rate (abs.) and luminous efficiency (EQE) compared to the red quantum dot-containing curable composition, and having a reflectance that is nearly twice as high. Therefore, the technical challenge of improving the brightness of the green quantum dot pixels in the panel and further improving the brightness of the front side by reducing external light reflection has not yet been solved.
본 발명자들은 상기와 같은 문제점을 명확히 인신하고, 녹색 양자점 함유 경화성 조성물의 광특성 개선 및 반사율 저감을 위해 오랫동안 관련 연구를 진행하고 수백번의 시행착오를 겪은 끝에, 상기 화학식 1로 표시되는 화합물을 중합성 화합물로 적용하여 상기 기술적 과제를 해결하기에 이르렀다.The present inventors have clearly addressed the above problems, conducted related research for a long time and experienced hundreds of trials and errors to improve the optical properties and reduce the reflectance of the curable composition containing green quantum dots, and polymerized the compound represented by Formula 1 above. The above technical problem was solved by applying it as a chemical compound.
일반적으로 그동안 녹색 양자점 함유 경화성 조성물에서 광특성을 개선하기 위해 사용하던 주요한 방법은 무기물의 함량을 증가시키는 것이었고, 반대로 상기 녹색 양자점 함유 경화성 조성물의 반사율을 저감시키기 위해 사용하던 주요한 방법은 무기물의 함량을 감소시키는 것이어서, 상기 광특성 개선 및 반사율 저감은 서로 반대되는, 즉 trade-off 관계에 있는 물성으로 상기 두가지 특성을 동시에 달성하는 것은 매우 어려웠다. In general, the main method used to improve the optical properties of curable compositions containing green quantum dots was to increase the content of inorganic substances, and conversely, the main method used to reduce the reflectance of the curable compositions containing green quantum dots was to increase the content of inorganic substances. Since improving optical properties and reducing reflectance are opposite physical properties, that is, they are in a trade-off relationship, it was very difficult to achieve both properties at the same time.
일 구현예에 따르면, 상기 화학식 1로 표시되는 황 함유 디(메타)아크릴레이트 화합물을 중합성 화합물로 경화성 조성물 조성에 적용시켜, 적색 양자점 함유 경화성 조성물 외에 녹색 양자점 함유 경화성 조성물에서도 광특성 개선 및 반사율 저감 효과를 동시에 달성할 수 있다.According to one embodiment, the sulfur-containing di(meth)acrylate compound represented by Formula 1 is applied as a polymerizable compound to a curable composition composition to improve optical properties and reflectance in a curable composition containing green quantum dots in addition to a curable composition containing red quantum dots. The reduction effect can be achieved simultaneously.
구체적으로, 상기 광특성 개선은 상기 화학식 1로 표시되는 화합물의 굴절율이 높기 때문이다. 예컨대, 상기 화학식 1로 표시되는 화합물은 1.455 초과의 굴절율, 예컨대 1.455 초과 1.7 이하의 굴절율을 가질 수 있으며, 상기 화학식 1로 표시되는 화합물이 상기 범위의 높은 굴절율을 가지기에 이를 중합성 화합물로 포함하는 양자점 함유 경화성 조성물의 광특성을 크게 개선시킬 수 있다.Specifically, the improvement in optical properties is due to the high refractive index of the compound represented by Formula 1. For example, the compound represented by Formula 1 may have a refractive index of more than 1.455, for example, more than 1.455 and less than 1.7. Since the compound represented by Formula 1 has a high refractive index in the above range, it is included as a polymerizable compound. The optical properties of a curable composition containing quantum dots can be greatly improved.
나아가, 상기 반사율 저감 효과는 일 구현예에 따른 경화성 조성물의 열 경화 시 상기 중합성 화합물로 사용되는 화학식 1로 표시되는 화합물이 열분해되어 티올기가 드러나게 되고, 이 티올기에 의해 (메타)아크릴레이트기의 탄소-탄소 이중결합과 티올기 간 티올-엔 반응이 용이하게 유도되어(하기 반응식 참조), 일 구현예에 따른 경화성 조성물의 열경화 단막의 표면 경화를 촉진시켜, 궁극적으로 상기 경화막의 반사율, 특히 난반사율을 크게 저감시킬 수 있다. 예컨대 상기 경화막의 난반사율을 55% 이하, 예컨대 50% 내지 55%로 떨어뜨릴 수 있다.Furthermore, the reflectance reduction effect is achieved by thermally curing the curable composition according to one embodiment, when the compound represented by Chemical Formula 1 used as the polymerizable compound is thermally decomposed to reveal a thiol group, and the (meth)acrylate group is formed by this thiol group. The thiol-ene reaction between the carbon-carbon double bond and the thiol group is easily induced (see the reaction formula below), promoting surface curing of the thermosetting single film of the curable composition according to one embodiment, ultimately increasing the reflectance of the cured film, especially The diffuse reflectance can be greatly reduced. For example, the diffuse reflectance of the cured film can be reduced to 55% or less, for example, 50% to 55%.
[반응식][Reaction formula]
상기 화학식 1에서, L1이 다이설파이드(*-S-S-*) 연결구조를 포함하거나, L2 또는 L3이 아릴렌기를 연결기로 포함할 경우에는, 화합물의 굴절율이 낮아져 광특성 개선 측면에서 불리하고, 또한 상기 티올-엔 반응이 원활하게 일어나지 않아 반사율 저감 효과도 반감되기에 바람직하지 않다.In Formula 1, when L 1 includes a disulfide (*-SS-*) linking structure or when L 2 or L 3 includes an arylene group as a linking group, the refractive index of the compound is lowered, which is disadvantageous in terms of improving optical properties. In addition, it is undesirable because the thiol-ene reaction does not occur smoothly and the effect of reducing reflectance is halved.
예컨대, 상기 L1은 하기 화학식 L-1 내지 화학식 L-4 중 어느 하나로 표시될 수 있다.For example, L 1 may be represented by any one of the following formulas L-1 to L-4.
[화학식 L-1][Formula L-1]
[화학식 L-2][Formula L-2]
[화학식 L-3][Formula L-3]
[화학식 L-4][Formula L-4]
상기 화학식 L-1 내지 화학식 L-4에서,In Formula L-1 to Formula L-4,
L4 내지 L8은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C20 알킬렌기이다.L 4 to L 8 are each independently a single bond or a substituted or unsubstituted C1 to C20 alkylene group.
상기 화학식 1의 L1 연결기가 상기 구조를 가질 경우, 일 구현예에 따른 경화성 조성물의 광특성 개선 및 반사율(난반사율) 저감 효과를 동시에 구현하는 것이 매우 유리할 수 있다.When the L 1 linking group of Formula 1 has the above structure, it can be very advantageous to simultaneously improve optical properties and reduce reflectance (diffuse reflectance) of the curable composition according to one embodiment.
예컨대, 상기 화학식 1로 표시되는 화합물은 하기 화학식 1-1 내지 화학식 1-3 중 어느 하나로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the compound represented by Formula 1 may be represented by any one of the following Formulas 1-1 to 1-3, but is not necessarily limited thereto.
[화학식 1-1][Formula 1-1]
[화학식 1-2][Formula 1-2]
[화학식 1-3][Formula 1-3]
예컨대, 상기 중합성 화합물은 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물을 더 포함할 수 있다. 즉, 상기 중합성 화합물은 상기 화학식 1로 표시되는 화합물 및 이와 상이한 구조를 가지는 다른 화합물을 포함할 수 있다.For example, the polymerizable compound may further include a compound having a different structure from the compound represented by Formula 1. That is, the polymerizable compound may include the compound represented by Formula 1 and other compounds having a different structure.
예컨대, 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물은 하기 화학식 2로 표시될 수 있다.For example, a compound having a structure different from the compound represented by Formula 1 may be represented by Formula 2 below.
[화학식 2][Formula 2]
상기 화학식 2에서,In Formula 2,
L9는 치환 또는 비치환된 C1 내지 C10 알킬렌기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬렌기 또는 에테르기(*-O-*)이고,L 9 is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, or an ether group (*-O-*),
L10 및 L11은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C10 알킬렌기이고,L 10 and L 11 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,
R3 및 R4는 각각 독립적으로 수소 원자, 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이다.R 3 and R 4 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
일 구현예에 따른 경화성 조성물은 고굴절율의 상기 화학식 1로 표시되는 화합물과 함께, 추가로 상기 화학식 2로 표시되는 화합물을 중합성 화합물로 함께 포함하여도, 상기 화학식 1로 표시되는 화합물을 단독으로 사용하는 경우와 마찬가지로, 경화성 조성물의 광특성 개선 및 반사율 저감 효과를 동시에 달성할 수 있다.The curable composition according to one embodiment may further include the compound represented by Formula 2 as a polymerizable compound together with the compound represented by Formula 1 having a high refractive index, or the compound represented by Formula 1 may be used alone. As in the case of use, the effect of improving the optical properties of the curable composition and reducing the reflectance can be achieved at the same time.
예컨대, 상기 화학식 2로 표시되는 화합물은 1.455 이하의 굴절율을 가질 수 있다. 상기 화학식 2로 표시되는 화합물이 1.455 초과의 굴절율을 가질 경우 광특성 개선에는 유리하나, 반사율 저감 측면에서는 불리할 수 있다.For example, the compound represented by Formula 2 may have a refractive index of 1.455 or less. If the compound represented by Formula 2 has a refractive index of more than 1.455, it is advantageous for improving optical properties, but may be disadvantageous in terms of reducing reflectance.
예컨대, 상기 화학식 1로 표시되는 화합물 및 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물(예컨대 상기 화학식 2로 표시되는 화합물 등)은 1:9 내지 9:1의 중량비, 예컨대 5:5 내지 9:1의 중량비로 포함될 수 있다. For example, the compound represented by Formula 1 and the compound having a different structure from the compound represented by Formula 1 (e.g., the compound represented by Formula 2, etc.) have a weight ratio of 1:9 to 9:1, for example, 5:5 to 5:5. It may be included in a weight ratio of 9:1.
예컨대, 상기 화학식 1로 표시되는 화합물은 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물(예컨대 상기 화학식 2로 표시되는 화합물 등)보다 많은 함량으로 포함될 수 있다.For example, the compound represented by Formula 1 may be included in a larger amount than a compound having a different structure from the compound represented by Formula 1 (for example, the compound represented by Formula 2, etc.).
예컨대, 상기 화학식 1로 표시되는 화합물 및 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물(예컨대 상기 화학식 2로 표시되는 화합물 등)은 6:4 내지 9:1의 중량비로 포함될 수 있다. For example, a compound represented by Formula 1 and a compound having a different structure from the compound represented by Formula 1 (for example, a compound represented by Formula 2, etc.) may be included in a weight ratio of 6:4 to 9:1.
상기 화학식 1로 표시되는 화합물은 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물(예컨대 상기 화학식 2로 표시되는 화합물 등)보다 많은 함량, 예컨대 6:4 내지 9:1의 중량비로 포함될 경우, 일 구현예에 따른 경화성 조성물의 경화율이 높아지게 되어, 광특성 개선 및 반사율 저감이라는 두 가지 효과의 동시 개선을 극대화시킬 수 있다.When the compound represented by Formula 1 is contained in a greater amount than the compound having a different structure from the compound represented by Formula 1 (e.g., the compound represented by Formula 2, etc.), for example, at a weight ratio of 6:4 to 9:1, The curing rate of the curable composition according to one embodiment is increased, thereby maximizing simultaneous improvement of the two effects of improving optical properties and reducing reflectance.
예컨대, 상기 화학식 2로 표시되는 화합물은 하기 화학식 2-1 또는 2-2로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the compound represented by Formula 2 may be represented by the following Formula 2-1 or 2-2, but is not necessarily limited thereto.
[화학식 2-1][Formula 2-1]
[화학식 2-2][Formula 2-2]
예컨대, 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물은 상기 화학식 2-1 및 화학식 2-2로 표시되는 화합물 외에도, 에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 1,4-부탄디올디아크릴레이트, 1,6-헥산디올디아크릴레이트, 네오펜틸글리콜디아크릴레이트, 펜타에리트리톨디아크릴레이트, 펜타에리트리톨트리아크릴레이트, 디펜타에리트리톨디아크릴레이트, 디펜타에리트리톨트리아크릴레이트, 디펜타에리트리톨펜타아크릴레이트, 펜타에리트리톨헥사아크릴레이트, 비스페놀 A 디아크릴레이트, 트리메틸올프로판트리아크릴레이트, 노볼락에폭시아크릴레이트, 에틸렌글리콜디메타크릴레이트, 트리에틸렌글리콜디메타크릴레이트, 프로필렌글리콜디메타크릴레이트, 1,4-부탄디올디메타크릴레이트, 1,6-헥산디올디메타크릴레이트 또는 이들의 조합을 더 포함할 수 있다.For example, compounds having a different structure from the compound represented by Formula 1 include, in addition to the compounds represented by Formula 2-1 and Formula 2-2, ethylene glycol diacrylate, triethylene glycol diacrylate, and 1,4-butanediol. Diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate , dipentaerythritol pentaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, It may further include propylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, or a combination thereof.
또한, 상기 중합성 화합물과 더불어 종래의 열경화성 또는 광경화성 조성물에 일반적으로 사용되는 단량체를 더 사용할 수 있으며, 예컨대 상기 단량체는 비스[1-에틸(3-옥세타닐)]메틸 에테르 등의 옥세탄계 화합물 등을 더 포함할 수 있다.In addition, in addition to the polymerizable compound, monomers commonly used in conventional thermosetting or photocuring compositions may be further used. For example, the monomer may be an oxetane-based monomer such as bis[1-ethyl(3-oxetanyl)]methyl ether. It may further include compounds, etc.
상기 중합성 화합물은 상기 무용매형 경화성 조성물 총량에 대하여 40 중량% 내지 95 중량%, 예컨대 50 중량% 내지 90 중량%로 포함될 수 있다. 상기 중합성 화합물의 함량이 상기 범위 내이어야 잉크 젯팅이 가능한 점도를 가지는 무용매형 경화성 조성물의 제조가 가능하며, 또한 제조된 무용매형 경화성 조성물 내 양자점이 우수한 분산성을 가질 수 있어, 광특성 또한 향상될 수 있다. The polymerizable compound may be included in an amount of 40% to 95% by weight, for example, 50% to 90% by weight, based on the total amount of the solvent-free curable composition. When the content of the polymerizable compound is within the above range, it is possible to manufacture a solvent-free curable composition having a viscosity capable of ink jetting. Additionally, the quantum dots in the prepared solvent-free curable composition can have excellent dispersibility, thereby improving optical properties. It can be.
예컨대, 상기 중합성 화합물은 170 g/mol 내지 1,000 g/mol의 분자량을 가질 수 있다. 상기 중합성 화합물의 분자량이 상기 범위일 경우 양자점의 광특성을 저해하지 않으면서 조성물의 점도를 높이지 않아 잉크-젯팅에 유리할 수 있다.For example, the polymerizable compound may have a molecular weight of 170 g/mol to 1,000 g/mol. When the molecular weight of the polymerizable compound is within the above range, it can be advantageous for ink-jetting because it does not impair the optical properties of quantum dots and does not increase the viscosity of the composition.
또한, 상기 경화성 조성물이 용매를 포함하는 경우, 상기 중합성 화합물은 상기 경화성 조성물 총량에 대해 1 중량% 내지 20 중량%, 1 중량% 내지 15 중량%, 예컨대 5 중량% 내지 15 중량%로 포함될 수 있다. 상기 중합성 화합물이 상기 범위 내로 포함될 경우 상기 양자점의 광특성 향상을 꾀할 수 있다.In addition, when the curable composition includes a solvent, the polymerizable compound may be included in an amount of 1% to 20% by weight, 1% to 15% by weight, such as 5% to 15% by weight, based on the total amount of the curable composition. there is. When the polymerizable compound is included within the above range, the optical properties of the quantum dots can be improved.
양자점quantum dot
예컨대, 상기 양자점은 500nm 내지 680nm에서 최대형광 발광파장을 가질 수 있다.For example, the quantum dots may have a maximum fluorescence emission wavelength of 500 nm to 680 nm.
예컨대, 일 구현예에 따른 경화성 조성물이 무용매형 경화성 조성물일 경우, 상기 양자점은 5 중량% 내지 60 중량%, 예컨대 10 중량% 내지 60 중량%, 예컨대 20 중량% 내지 60 중량%, 예컨대 30 중량% 내지 50 중량%로 포함될 수 있다. 상기 양자점이 상기 범위 내로 포함될 경우, 경화 후에도 높은 광유지율 및 광효율을 달성할 수 있다.For example, when the curable composition according to one embodiment is a solvent-free curable composition, the quantum dots are present in an amount of 5% by weight to 60% by weight, such as 10% by weight to 60% by weight, such as 20% by weight to 60% by weight, such as 30% by weight. It may be included in 50% by weight. When the quantum dots are included within the above range, high light retention rate and light efficiency can be achieved even after curing.
예컨대, 일 구현예에 따른 경화성 조성물이 용매를 포함하는 경화성 조성물일 경우, 상기 양자점은 상기 경화성 조성물 총량에 대해 1 중량% 내지 40 중량%, 예컨대 3 중량% 내지 30 중량% 포함될 수 있다. 상기 양자점이 상기 범위 내로 포함될 경우, 광변환률이 우수하며 패턴특성과 현상특성을 저해하지 않아 우수한 공정성을 가질 수 있다.For example, when the curable composition according to one embodiment is a curable composition containing a solvent, the quantum dots may be included in an amount of 1% by weight to 40% by weight, for example, 3% by weight to 30% by weight, based on the total amount of the curable composition. When the quantum dots are included within the above range, the light conversion rate is excellent and pattern characteristics and development characteristics are not impaired, so excellent processability can be achieved.
예컨대, 상기 양자점은 360nm 내지 780nm의 파장영역, 예컨대 400nm 내지 780nm의 파장영역의 광을 흡수하여, 500nm 내지 700nm의 파장영역, 예컨대 500nm 내지 580nm에서 형광을 방출하거나, 600nm 내지 680nm에서 형광을 방출할 수 있다. 즉, 상기 양자점은 500nm 내지 680nm에서 최대형광 발광파장(fluorescence λem)을 가질 수 있다. For example, the quantum dots absorb light in a wavelength range of 360 nm to 780 nm, for example, 400 nm to 780 nm, and emit fluorescence in a wavelength range of 500 nm to 700 nm, for example, 500 nm to 580 nm, or emit fluorescence in a wavelength range of 600 nm to 680 nm. You can. That is, the quantum dot may have a maximum fluorescence emission wavelength (fluorescence λ em ) of 500 nm to 680 nm.
상기 양자점은 각각 독립적으로 20nm 내지 100nm, 예컨대 20nm 내지 50nm의 반치폭(Full width at half maximum; FWHM)을 가질 수 있다. 상기 양자점이 상기 범위의 반치폭을 가질 경우, 색순도가 높음에 따라, 컬러필터 내 색재료로 사용 시 색재현율이 높아지는 효과가 있다.The quantum dots may each independently have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 50 nm. When the quantum dot has a half width in the above range, the color purity is high, which has the effect of increasing the color reproduction rate when used as a color material in a color filter.
상기 양자점은 각각 독립적으로 유기물이거나 무기물 또는 유기물과 무기물의 하이브리드(혼성물)일 수 있다.The quantum dots may each independently be an organic material, an inorganic material, or a hybrid of an organic material and an inorganic material.
상기 양자점은 각각 독립적으로 코어 및 상기 코어를 감싸는 쉘로 구성될 수 있으며, 상기 코어 및 쉘은 각각 독립적으로 II-IV족, III-V족 등으로 이루어진 코어, 코어/쉘, 코어/제1쉘/제2쉘, 합금, 합금/쉘 등의 구조를 가질 수 있으며, 이에 한정되는 것은 아니다.The quantum dots may each independently consist of a core and a shell surrounding the core, and the core and shell each independently consist of a core made of group II-IV, group III-V, etc., core/shell, core/first shell/ It may have a structure such as a second shell, an alloy, or an alloy/shell, but is not limited thereto.
예컨대, 상기 코어는 CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs 및 이들의 합금으로 이루어진 군으로부터 선택된 적어도 하나 이상의 물질을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다. 상기 코어를 둘러싼 쉘은 CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe 및 이들의 합금으로 이루어진 군으로부터 선택된 적어도 하나 이상의 물질을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다. For example, the core may include at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs, and alloys thereof. , but is not necessarily limited to this. The shell surrounding the core may include at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe, and alloys thereof, but is not necessarily limited thereto.
일 구현예에서는, 최근 전 세계적으로 환경에 대한 관심이 크게 증가하고 유독성 물질에 대한 규제가 강화되고 있으므로, 카드뮴계 코어를 갖는 발광물질을 대신하여, 양자 효율(quantum yield)은 다소 낮지만 친환경적인 비카드뮴계 발광소재(InP/ZnS, InP/ZeSe/ZnS 등)를 사용하였으나, 반드시 이에 한정되는 것은 아니다.In one embodiment, as interest in the environment has recently greatly increased worldwide and regulations on toxic substances have been strengthened, a light-emitting material with a cadmium-based core may be used instead of a light-emitting material, which has a somewhat low quantum yield but is environmentally friendly. Non-cadmium-based light emitting materials (InP/ZnS, InP/ZeSe/ZnS, etc.) were used, but are not necessarily limited thereto.
상기 코어/쉘 구조의 양자점의 경우, 쉘을 포함한 전체 양자점 각각의 크기(평균 입경)는 1nm 내지 15nm, 예컨대 5nm 내지 15nm 일 수 있다. In the case of the quantum dots of the core/shell structure, the size (average particle diameter) of each quantum dot including the shell may be 1 nm to 15 nm, for example, 5 nm to 15 nm.
예컨대, 상기 양자점은 각각 독립적으로 적색 양자점, 녹색 양자점 또는 이들의 조합을 포함할 수 있다. 상기 적색 양자점은 각각 독립적으로 10nm 내지 15nm의 평균 입경을 가질 수 있다. 상기 녹색 양자점은 각각 독립적으로 5nm 내지 8nm의 평균 입경을 가질 수 있다.For example, the quantum dots may each independently include red quantum dots, green quantum dots, or a combination thereof. The red quantum dots may each independently have an average particle diameter of 10 nm to 15 nm. The green quantum dots may each independently have an average particle diameter of 5 nm to 8 nm.
한편, 상기 양자점의 분산안정성을 위해, 일 구현예에 따른 경화성 조성물은 분산제를 더 포함할 수도 있다. 상기 분산제는 양자점과 같은 광변환 물질이 경화성 조성물 내에서 균일하게 분산되도록 도와주며, 비이온성, 음이온성 또는 양이온성 분산제 모두를 사용할 수 있다. 구체적으로는 폴리알킬렌 글리콜 또는 이의 에스테르류, 폴리옥시 알킬렌, 다가 알코올 에스테르 알킬렌 옥사이드 부가물, 알코올 알킬렌 옥사이드 부가물, 술폰산 에스테르, 술폰산 염, 카르복시산 에스테르, 카르복시산 염, 알킬 아미드 알킬렌 옥사이드 부가물, 알킬 아민 등을 사용할 수 있으며, 이들은 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다. 상기 분산제는 양자점과 같은 광변환 물질의 고형분 대비 0.1 중량% 내지 100 중량%, 예컨대 10 중량% 내지 20 중량%로 사용될 수 있다.Meanwhile, for the dispersion stability of the quantum dots, the curable composition according to one embodiment may further include a dispersant. The dispersant helps the light conversion material such as quantum dots to be uniformly dispersed within the curable composition, and nonionic, anionic, or cationic dispersants can all be used. Specifically, polyalkylene glycol or its esters, polyoxy alkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonic acid salt, carboxylic acid ester, carboxylic acid salt, alkyl amide alkylene oxide. Adducts, alkyl amines, etc. can be used, and these can be used alone or in a mixture of two or more types. The dispersant may be used in an amount of 0.1% to 100% by weight, for example, 10% to 20% by weight, based on the solid content of the light conversion material such as quantum dots.
예컨대, 상기 양자점은 극성기를 갖는 리간드, 예컨대, 상기 중합성 화합물과 친화성이 높은 리간드로 표면개질된 양자점일 수 있다. 상기와 같이 표면개질된 양자점의 경우 고농도 혹은 고농축 양자점 분산액의 제조가 매우 용이(중합성 화합물에 대한 양자점의 분산성 향상)하여, 광효율 개선에 큰 영향을 미칠 수 있으며, 특히 무용매형 경화성 조성물 구현에 유리할 수 있다.For example, the quantum dots may be surface-modified with a ligand having a polar group, for example, a ligand having high affinity for the polymerizable compound. In the case of surface-modified quantum dots as described above, it is very easy to manufacture high-concentration or highly concentrated quantum dot dispersions (improvement of the dispersibility of quantum dots in polymerizable compounds), which can have a significant impact on improving light efficiency, especially in the implementation of solvent-free curable compositions. It can be advantageous.
예컨대, 상기 극성기를 갖는 리간드는 상기 중합성 화합물의 화학 구조와 친화성이 높은 구조를 가질 수 있다.For example, the ligand having the polar group may have a structure with high affinity to the chemical structure of the polymerizable compound.
예컨대, 상기 극성기를 갖는 리간드는 하기 화학식 A 내지 화학식 Q로 표시되는 화합물 중 어느 하나로 표시될 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the ligand having the polar group may be represented by any one of the compounds represented by the following formulas A to Q, but is not necessarily limited thereto.
[화학식 A][Formula A]
[화학식 B][Formula B]
[화학식 C][Formula C]
[화학식 D][Formula D]
(상기 화학식 D에서, m1은 0 내지 10의 정수이다.)(In the above formula D, m1 is an integer from 0 to 10.)
[화학식 E][Formula E]
[화학식 F][Formula F]
[화학식 G][Formula G]
[화학식 H][Formula H]
[화학식 I][Formula I]
[화학식 J][Formula J]
[화학식 K][Formula K]
[화학식 L][Formula L]
[화학식 M][Formula M]
[화학식 N][Formula N]
[화학식 O][Formula O]
[화학식 P][Formula P]
[화학식 Q][Formula Q]
상기 리간드를 사용할 경우 양자점의 표면개질이 더욱 용이하여, 상기 리간드로 표면개질된 양자점을 전술한 중합성 화합물에 투입하여 교반하면, 매우 투명한 분산액을 얻을 수 있으며, 이는 양자점의 표면개질이 매우 잘 되었음을 확인하는 척도가 된다. When using the above-mentioned ligand, the surface modification of the quantum dots is easier, and when the quantum dots surface-modified with the above-mentioned ligand are added to the above-mentioned polymerizable compound and stirred, a very transparent dispersion can be obtained, which indicates that the surface modification of the quantum dots is very good. It becomes a standard for confirmation.
광확산제light diffuser
일 구현예에 따른 경화성 조성물은 광확산제를 더 포함할 수 있다.The curable composition according to one embodiment may further include a light diffuser.
예컨대, 상기 광확산제는 황산바륨(BaSO4), 탄산칼슘(CaCO3), 이산화티타늄(TiO2), 지르코니아(ZrO2) 또는 이들의 조합을 포함할 수 있다.For example, the light diffuser may include barium sulfate (BaSO 4 ), calcium carbonate (CaCO 3 ), titanium dioxide (TiO 2 ), zirconia (ZrO 2 ), or a combination thereof.
상기 광확산제는 전술한 양자점에 흡수되지 않은 광을 반사시키고, 상기 반사된 광을 양자점이 다시 흡수할 수 있도록 한다. 즉, 상기 광확산제는 양자점에 흡수되는 광의 양을 증가시켜, 경화성 조성물의 광변환 효율을 증가시킬 수 있다.The light diffuser reflects light that is not absorbed by the quantum dots and allows the quantum dots to reabsorb the reflected light. That is, the light diffuser can increase the amount of light absorbed by the quantum dots, thereby increasing the light conversion efficiency of the curable composition.
상기 광확산제는 평균 입경(D50)이 150nm 내지 250nm 일 수 있으며, 구체적으로는 180nm 내지 230nm일 수 있다. 상기 광확산제의 평균 입경이 상기 범위 내일 경우, 보다 우수한 광확산 효과를 가질 수 있으며, 광변환 효율을 증가시킬 수 있다.The light diffuser may have an average particle diameter (D 50 ) of 150 nm to 250 nm, specifically 180 nm to 230 nm. When the average particle diameter of the light diffuser is within the above range, a better light diffusion effect can be achieved and light conversion efficiency can be increased.
상기 광확산제는 상기 경화성 조성물 총량에 대해 1 중량% 내지 20 중량%, 예컨대 2 중량% 내지 15 중량%, 예컨대 3 중량% 내지 10 중량%로 포함될 수 있다. 상기 광확산제가 상기 경화성 조성물 총량에 대해 1 중량% 미만으로 포함될 경우, 광확산제를 사용함에 따른 광변환 효율 향상 효과를 기대하기가 어렵고, 20 중량%를 초과하여 포함할 경우에는 양자점 침강 문제가 발생될 우려가 있다. The light diffuser may be included in an amount of 1% to 20% by weight, such as 2% to 15% by weight, such as 3% to 10% by weight, based on the total amount of the curable composition. If the light diffuser is included in less than 1% by weight based on the total amount of the curable composition, it is difficult to expect an effect of improving light conversion efficiency due to the use of the light diffuser, and if it is included in more than 20% by weight, there is a problem of quantum dot precipitation. There is a risk that this may occur.
중합개시제polymerization initiator
일 구현예에 따른 경화성 조성물은 중합개시제를 더 포함할 수 있으며, 예컨대, 광중합 개시제, 열중합 개시제 또는 이들의 조합을 포함할 수 있다. The curable composition according to one embodiment may further include a polymerization initiator, for example, a photopolymerization initiator, a thermal polymerization initiator, or a combination thereof.
상기 광중합 개시제는 감광성 수지 조성물에 일반적으로 사용되는 개시제로서, 예를 들어 아세토페논계 화합물, 벤조페논계 화합물, 티오크산톤계 화합물, 벤조인계 화합물, 트리아진계 화합물, 옥심계 화합물, 아미노케톤계 화합물 등을 사용할 수 있으나, 반드시 이에 한정되는 것은 아니다.The photopolymerization initiator is an initiator commonly used in photosensitive resin compositions, for example, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, oxime-based compounds, and aminoketone-based compounds. etc. may be used, but are not necessarily limited thereto.
상기 아세토페논계의 화합물의 예로는, 2,2'-디에톡시 아세토페논, 2,2'-디부톡시 아세토페논, 2-히드록시-2-메틸프로피오페논, p-t-부틸트리클로로 아세토페논, p-t-부틸디클로로 아세토페논, 4-클로로 아세토페논, 2,2'-디클로로-4-페녹시 아세토페논, 2-메틸-1-(4-(메틸티오)페닐)-2-모폴리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모폴리노페닐)-부탄-1-온 등을 들 수 있다.Examples of the acetophenone-based compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloro acetophenone, p-t-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropane- 1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.
상기 벤조페논계 화합물의 예로는, 벤조페논, 벤조일 안식향산, 벤조일 안식향산 메틸, 4-페닐 벤조페논, 히드록시벤조페논, 아크릴화 벤조페논, 4,4'-비스(디메틸 아미노)벤조페논, 4,4'-비스(디에틸아미노)벤조페논, 4,4'-디메틸아미노벤조페논, 4,4'-디클로로벤조페논, 3,3'-디메틸-2-메톡시벤조페논등을 들 수 있다.Examples of the benzophenone-based compounds include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4 Examples include '-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.
상기 티오크산톤계 화합물의 예로는, 티오크산톤, 2-메틸티오크산톤, 이소프로필 티오크산톤, 2,4-디에틸 티오크산톤, 2,4-디이소프로필 티오크산톤, 2-클로로티오크산톤 등을 들 수 있다.Examples of the thioxanthone-based compounds include thioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2- Chlorothioxanthone, etc. can be mentioned.
상기 벤조인계 화합물의 예로는, 벤조인, 벤조인 메틸 에테르, 벤조인 에틸 에테르, 벤조인 이소프로필 에테르, 벤조인 이소부틸 에테르, 벤질디메틸케탈 등을 들 수 있다.Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyldimethyl ketal.
상기 트리아진계 화합물의 예로는, 2,4,6-트리클로로-s-트리아진, 2-페닐-4,6-비스(트리클로로메틸)-s-트리아진, 2-(3',4'-디메톡시스티릴)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4'-메톡시나프틸)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(p-메톡시페닐)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(p-톨릴)-4,6-비스(트리클로로 메틸)-s-트리아진, 2-비페닐-4,6-비스(트리클로로 메틸)-s-트리아진, 비스(트리클로로메틸)-6-스티릴-s-트리아진, 2-(나프토-1-일)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4-메톡시나프토-1-일)-4,6-비스(트리클로로메틸)-s-트리아진, 2-4-비스(트리클로로메틸)-6-피페로닐-s-트리아진, 2-4-비스(트리클로로메틸)-6-(4-메톡시스티릴)-s-트리아진 등을 들 수 있다.Examples of the triazine-based compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4' -Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine , 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine , 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)- 4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4 -bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, etc. .
상기 옥심계 화합물의 예로는 O-아실옥심계 화합물, 2-(O-벤조일옥심)-1-[4-(페닐티오)페닐]-1,2-옥탄디온, 1-(O-아세틸옥심)-1-[9-에틸-6-(2-메틸벤조일)-9H-카르바졸-3-일]에탄온, O-에톡시카르보닐-α-옥시아미노-1-페닐프로판-1-온 등을 사용할 수 있다. 상기 O-아실옥심계 화합물의 구체적인 예로는, 1,2-옥탄디온, 2-디메틸아미노-2-(4-메틸벤질)-1-(4-모르폴린-4-일-페닐)-부탄-1-온, 1-(4-페닐술파닐페닐)-부탄-1,2-디온-2-옥심-O-벤조에이트, 1-(4-페닐술파닐페닐)-옥탄-1,2-디온-2-옥심-O-벤조에이트, 1-(4-페닐술파닐페닐)-옥탄-1-온옥심-O-아세테이트 및 1-(4-페닐술파닐페닐)-부탄-1-온옥심-O-아세테이트 등을 들 수 있다. Examples of the oxime-based compounds include O-acyloxime-based compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime) -1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, etc. can be used. Specific examples of the O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butane- 1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione -2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-oneoxime-O-acetate and 1-(4-phenylsulfanylphenyl)-butane-1-oneoxime- O-acetate, etc. can be mentioned.
상기 아미노케톤계 화합물의 예로는 2-벤질-2-디메틸아미노-1-(4-모폴리노페닐)-부탄온-1 (2-Benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1) 등을 들 수 있다.Examples of the aminoketone-based compound include 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone -1), etc.
상기 광중합 개시제는 상기 화합물 이외에도 카바졸계 화합물, 디케톤류 화합물, 술포늄 보레이트계 화합물, 디아조계 화합물, 이미다졸계 화합물, 비이미다졸계 화합물 등을 사용할 수 있다.In addition to the above compounds, the photopolymerization initiator may include carbazole-based compounds, diketone-based compounds, sulfonium borate-based compounds, diazo-based compounds, imidazole-based compounds, and biimidazole-based compounds.
상기 광중합 개시제는 빛을 흡수하여 들뜬 상태가 된 후 그 에너지를 전달함으로써 화학반응을 일으키는 광 증감제와 함께 사용될 수도 있다.The photopolymerization initiator may be used together with a photosensitizer that absorbs light, becomes excited, and then transmits the energy to cause a chemical reaction.
상기 광 증감제의 예로는, 테트라에틸렌글리콜 비스-3-머캡토 프로피오네이트, 펜타에리트리톨 테트라키스-3-머캡토 프로피오네이트, 디펜타에리트리톨 테트라키스-3-머캡토 프로피오네이트 등을 들 수 있다. Examples of the photosensitizer include tetraethylene glycol bis-3-mercapto propionate, pentaerythritol tetrakis-3-mercapto propionate, dipentaerythritol tetrakis-3-mercapto propionate, etc. can be mentioned.
상기 열중합 개시제의 예로는, 퍼옥사이드, 구체적으로 벤조일 퍼옥사이드, 다이벤조일 퍼옥사이드, 라우릴 퍼옥사이드, 다이라우릴 퍼옥사이드, 다이-tert-부틸 퍼옥사이드, 사이클로헥산 퍼옥사이드, 메틸 에틸 케톤 퍼옥사이드, 하이드로퍼옥사이드(예컨대, tert-부틸 하이드로퍼옥사이드, 쿠멘 하이드로퍼옥사이드), 다이사이클로헥실 퍼옥시다이카르보네이트, 2,2-아조-비스(아이소부티로니트릴), t-부틸 퍼벤조에이트 등을 들 수 있고, 2,2'-아조비스-2-메틸프로피오니트릴 등을 들 수도 있으나, 반드시 이에 한정되는 것은 아니고, 당업계에 널리 알려진 것이면 어느 것이든 사용할 수 있다.Examples of the thermal polymerization initiator include peroxides, specifically benzoyl peroxide, dibenzoyl peroxide, lauryl peroxide, dilauryl peroxide, di-tert-butyl peroxide, cyclohexane peroxide, and methyl ethyl ketone peroxide. Oxides, hydroperoxides (e.g., tert-butyl hydroperoxide, cumene hydroperoxide), dicyclohexyl peroxydicarbonate, 2,2-azo-bis(isobutyronitrile), t-butyl perbenzo ate, etc., and 2,2'-azobis-2-methylpropionitrile, etc., but it is not necessarily limited thereto, and any one widely known in the art can be used.
상기 중합개시제는 상기 경화성 조성물 총량에 대해 0.1 중량% 내지 5 중량%, 예컨대 1 중량% 내지 4 중량%로 포함될 수 있다. 중합 개시제가 상기 범위 내로 포함될 경우, 노광 또는 열경화 시 경화가 충분히 일어나 우수한 신뢰성을 얻을 수 있으며, 미반응 개시제로 인한 투과율의 저하를 막아 양자점의 광특성 저하를 방지할 수 있다. The polymerization initiator may be included in an amount of 0.1% to 5% by weight, for example, 1% to 4% by weight, based on the total amount of the curable composition. When the polymerization initiator is included within the above range, curing occurs sufficiently during exposure or heat curing to obtain excellent reliability, and a decrease in transmittance due to unreacted initiator can be prevented, thereby preventing a decrease in the optical properties of the quantum dots.
바인더 수지binder resin
일 구현예에 따른 경화성 조성물은 바인더 수지를 더 포함할 수 있다.The curable composition according to one embodiment may further include a binder resin.
상기 바인더 수지는 아크릴계 수지, 카도계 수지, 에폭시 수지 또는 이들의 조합을 포함할 수 있다.The binder resin may include an acrylic resin, a cardo-based resin, an epoxy resin, or a combination thereof.
상기 아크릴계 수지는 제1 에틸렌성 불포화 단량체 및 이와 공중합 가능한 제2 에틸렌성 불포화 단량체의 공중합체로, 하나 이상의 아크릴계 반복단위를 포함하는 수지일 수 있다.The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin containing one or more acrylic repeating units.
상기 아크릴계 바인더 수지의 구체적인 예로는 폴리벤질메타크릴레이트, (메타)아크릴산/벤질메타크릴레이트 공중합체, (메타)아크릴산/벤질메타크릴레이트/스티렌 공중합체, (메타)아크릴산/벤질메타크릴레이트/2-히드록시에틸메타크릴레이트 공중합체, (메타)아크릴산/벤질메타크릴레이트/스티렌/2-히드록시에틸메타크릴레이트 공중합체 등을 들 수 있으나, 이에 한정되는 것은 아니며, 이들을 단독 또는 2종 이상을 배합하여 사용할 수도 있다.Specific examples of the acrylic binder resin include polybenzyl methacrylate, (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene copolymer, (meth)acrylic acid/benzyl methacrylate/ Examples include, but are not limited to, 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymer, and these can be used alone or in combination of two types. The above can also be used in combination.
상기 아크릴계 수지의 중량평균 분자량은 5,000 g/mol 내지 15,000g/mol 일 수 있다. 상기 아크릴계 수지의 중량평균 분자량이 상기 범위 내일 경우, 기판과의 밀착성이 우수하고 물리적, 화학적 물성이 좋으며, 점도가 적절하다.The weight average molecular weight of the acrylic resin may be 5,000 g/mol to 15,000 g/mol. When the weight average molecular weight of the acrylic resin is within the above range, it has excellent adhesion to the substrate, good physical and chemical properties, and appropriate viscosity.
상기 아크릴계 수지의 산가는 80 mgKOH/g 내지 130 mgKOH/g 일 수 있다. 상기 아크릴계 수지의 산가가 상기 범위 내일 경우 픽셀 패턴의 해상도가 우수하다.The acid value of the acrylic resin may be 80 mgKOH/g to 130 mgKOH/g. When the acid value of the acrylic resin is within the above range, the resolution of the pixel pattern is excellent.
상기 카도계 수지는 통상적인 경화성 수지(또는 감광성 수지)조성물에 사용되는 것을 사용할 수 있으며, 예컨대 한국 공개특허 10-2018-0067243호에 제시된 것을 사용할 수 있으나, 이에 한정되지 않는다. The cardo-based resin can be used in a typical curable resin (or photosensitive resin) composition, for example, the one shown in Korean Patent Publication No. 10-2018-0067243 can be used, but is not limited thereto.
상기 카도계 수지는 예컨대, 9,9-비스(4-옥시라닐메톡시페닐)플루오렌 등의 플루오렌 함유 화합물; 벤젠테트라카르복실산 디무수물, 나프탈렌테트라카르복실산 디무수물, 비페닐테트라카르복실산 디무수물, 벤조페논테트라카르복실산 디무수물, 피로멜리틱 디무수물, 사이클로부탄테트라카르복실산 디무수물, 페릴렌테트라카르복실산 디무수물, 테트라히드로푸란테트라카르복실산 디무수물, 테트라하이드로프탈산 무수물 등의 무수물 화합물; 에틸렌글리콜, 프로필렌글리콜, 폴리에틸렌글리콜 등의 글리콜 화합물; 메탄올, 에탄올, 프로판올, n-부탄올, 사이클로헥산올, 벤질알코올 등의 알코올 화합물; 프로필렌글리콜 메틸에틸아세테이트, N-메틸피롤리돈 등의 용매류 화합물; 트리페닐포스핀 등의 인 화합물; 및 테트라메틸암모늄 클로라이드, 테트라에틸암모늄 브로마이드, 벤질디에틸아민, 트리에틸아민, 트리부틸아민, 벤질트리에틸암모늄 클로라이드 등의 아민 또는 암모늄염 화합물 중에서 둘 이상을 혼합하여 제조할 수 있다.The cardo-based resin includes, for example, fluorene-containing compounds such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; Benzene tetracarboxylic acid dianhydride, naphthalene tetracarboxylic acid dianhydride, biphenyl tetracarboxylic acid dianhydride, benzophenone tetracarboxylic acid dianhydride, pyromellitic dianhydride, cyclobutane tetracarboxylic acid dianhydride, Anhydride compounds such as rylene tetracarboxylic acid dianhydride, tetrahydrofuran tetracarboxylic acid dianhydride, and tetrahydrophthalic acid anhydride; Glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; Alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol methyl ethyl acetate and N-methylpyrrolidone; Phosphorus compounds such as triphenylphosphine; and amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride.
상기 카도계 수지의 중량평균 분자량은 500 g/mol 내지 50,000 g/mol, 예컨대 1,000 g/mol 내지 30,000 g/mol 일 수 있다. 상기 카도계 수지의 중량평균 분자량이 상기 범위 내일 경우 경화막 제조 시 잔사 없이 패턴 형성이 잘되며, 경화성 조성물의 현상 시 막두께의 손실이 없고, 양호한 패턴을 얻을 수 있다.The weight average molecular weight of the cardo-based resin may be 500 g/mol to 50,000 g/mol, for example, 1,000 g/mol to 30,000 g/mol. If the weight average molecular weight of the cardo-based resin is within the above range, a pattern can be easily formed without residue when producing a cured film, there is no loss of film thickness when developing the curable composition, and a good pattern can be obtained.
상기 바인더 수지가 카도계 수지일 경우, 이를 포함하는 경화성 조성물, 특히 감광성 수지 조성물의 현상성이 우수하고, 광경화 시 감도가 좋아 미세 패턴 형성성이 우수하다.When the binder resin is a cardo-based resin, the curable composition containing it, especially the photosensitive resin composition, has excellent developability, has good sensitivity during photocuring, and has excellent fine pattern formation.
상기 에폭시 수지는 열에 의해서 중합될 수 있는 모노머(monomer) 또는 올리고머(oligomer)로서, 탄소-탄소 불포화 결합 및 탄소-탄소 고리형 결합을 가지는 화합물 등을 포함할 수 있다.The epoxy resin is a monomer or oligomer that can be polymerized by heat, and may include compounds having a carbon-carbon unsaturated bond and a carbon-carbon cyclic bond.
상기 에폭시 수지로는 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 페놀 노볼락형 에폭시 수지, 고리형 지방족 에폭시 수지 및 지방족 폴리글리시딜 에테르 등을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다.The epoxy resin may include, but is not limited to, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phenol novolak-type epoxy resin, cyclic aliphatic epoxy resin, and aliphatic polyglycidyl ether.
이러한 화합물의 시판품으로, 비스페닐 에폭시 수지에는 유까쉘 에폭시(주)社의 YX4000, YX4000H, YL6121H, YL6640, YL6677; 크레졸 노볼락형 에폭시 수지에는 크레졸 노블락형 에폭시 수지에는 닛본 가야꾸(주)社의 EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, EOCN-1027 및 유까쉘 에폭시(주)社의 에피코트 180S75; 비스페놀 A형 에폭시 수지에는 유까쉘 에폭시(주)社의 에피코트 1001, 1002, 1003, 1004, 1007, 1009, 1010 및 828; 비스페놀 F형 에폭시 수지에는 유까쉘 에폭시(주)社의 에피코트 807 및 834; 페놀 노블락형 에폭시 수지에는 유까쉘 에폭시(주)社의 에피코트 152, 154, 157H65 및 닛본 가야꾸(주)社의 EPPN 201, 202; 그 밖의 고리형 지방족 에폭시 수지에는 CIBA-GEIGY A.G 社의 CY175, CY177 및 CY179, U.C.C 社의 ERL-4234, ERL-4299, ERL-4221 및 ERL-4206, 쇼와 덴꼬(주)社의 쇼다인 509, CIBA-GEIGY A.G 社의 아랄다이트 CY-182, CY-192 및 CY-184, 다이닛본 잉크 고교(주)社의 에피크론 200 및 400, 유까쉘 에폭시(주)社의 에피코트 871, 872 및 EP1032H60, 셀라니즈 코팅(주)社의 ED-5661 및 ED-5662; 지방족 폴리글리시딜에테르에는 유까쉘 에폭시(주)社의 에피코트 190P 및 191P, 교에샤 유시 가가꾸 고교(주)社의 에포라이트 100MF, 닛본 유시(주)社의 에피올 TMP 등을 들 수 있다.As commercial products of these compounds, bisphenyl epoxy resins include YX4000, YX4000H, YL6121H, YL6640, and YL6677 from Yukashell Epoxy Co., Ltd.; Cresol novolak-type epoxy resins include EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, EOCN-1027 from Nippon Kayaku Co., Ltd. and Yukashell Epoxy Co., Ltd. )'s Epicoat 180S75; Bisphenol A type epoxy resins include Epicoat 1001, 1002, 1003, 1004, 1007, 1009, 1010, and 828 from Yukashell Epoxy Co., Ltd.; Bisphenol F-type epoxy resins include Epicoat 807 and 834 from Yukashell Epoxy Co., Ltd.; Phenolic noblock-type epoxy resins include Epicoat 152, 154, and 157H65 from Yukashell Epoxy Co., Ltd. and EPPN 201 and 202 from Nippon Kayaku Co., Ltd.; Other cyclic aliphatic epoxy resins include CY175, CY177 and CY179 from CIBA-GEIGY A.G., ERL-4234, ERL-4299, ERL-4221 and ERL-4206 from U.C.C., and Shodine 509 from Showa Denko Co., Ltd. , Araldite CY-182, CY-192 and CY-184 from CIBA-GEIGY A.G., Epicron 200 and 400 from Dainippon Ink Kogyo Co., Ltd., and Epicot 871 and 872 from Yukashell Epoxy Co., Ltd. and EP1032H60, ED-5661 and ED-5662 from Celanese Coatings Co., Ltd.; Aliphatic polyglycidyl ethers include Epicoat 190P and 191P from Yukashell Epoxy Co., Ltd., Eporite 100MF from Kyoesha Yushi Chemical Co., Ltd., and Epiol TMP from Nippon Yushi Co., Ltd. You can.
예컨대, 일 구현예에 따른 경화성 조성물이 무용매형 경화성 조성물일 경우, 상기 바인더 수지는 경화성 조성물 총량에 대하여 0.5 중량% 내지 10 중량%, 예컨대 1 중량% 내지 5 중량%로 포함될 수 있다. 이 경우, 상기 무용매형 경화성 조성물의 내열성 및 내화학성을 향상시킬 수 있으며, 조성물의 저장 안정성 또한 개선시킬 수 있다. For example, when the curable composition according to one embodiment is a solvent-free curable composition, the binder resin may be included in an amount of 0.5% by weight to 10% by weight, for example, 1% by weight to 5% by weight, based on the total amount of the curable composition. In this case, the heat resistance and chemical resistance of the solvent-free curable composition can be improved, and the storage stability of the composition can also be improved.
예컨대, 일 구현예에 따른 경화성 조성물이 용매를 포함하는 경화성 조성물일 경우, 상기 바인더 수지는 경화성 조성물 총량에 대하여 1 중량% 내지 30 중량%, 예컨대 3 중량% 내지 20 중량%로 포함될 수 있다. 이 경우, 우수하며 패턴특성과 내열성 및 내화학성을 향상시킬 수 있다.For example, when the curable composition according to one embodiment is a curable composition containing a solvent, the binder resin may be included in an amount of 1% to 30% by weight, for example, 3% to 20% by weight, based on the total amount of the curable composition. In this case, it is excellent and can improve pattern characteristics, heat resistance, and chemical resistance.
기타 첨가제Other additives
상기 양자점의 안정성 및 분산성 향상을 위해, 일 구현예에 따른 경화성 조성물은 중합금지제를 더 포함할 수 있다.To improve the stability and dispersibility of the quantum dots, the curable composition according to one embodiment may further include a polymerization inhibitor.
상기 중합 금지제는 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다. 일 구현예에 따른 경화성 조성물이 상기 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합을 더 포함함에 따라, 경화성 조성물을 인쇄(코팅) 후, 노광하는 동안 상온 가교를 방지할 수 있다.The polymerization inhibitor may include a hydroquinone-based compound, a catechol-based compound, or a combination thereof, but is not necessarily limited thereto. As the curable composition according to one embodiment further includes the hydroquinone-based compound, the catechol-based compound, or a combination thereof, room temperature crosslinking can be prevented during exposure to light after printing (coating) the curable composition.
예컨대, 상기 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합은 하이드로퀴논, 메틸 하이드로퀴논, 메톡시하이드로퀴논, t-부틸 하이드로퀴논, 2,5-디-t-부틸 하이드로퀴논, 2,5-비스(1,1-디메틸부틸) 하이드로퀴논, 2,5-비스(1,1,3,3-테트라메틸부틸) 하이드로퀴논, 카테콜, t-부틸 카테콜, 4-메톡시페놀, 피로가롤, 2,6-디-t-부틸-4-메틸페놀, 2-나프톨, 트리스(N-하이드록시-N-니트로소페닐아미나토-O,O')알루미늄(Tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminium) 또는 이들의 조합을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다.For example, the hydroquinone-based compound, catechol-based compound, or combinations thereof include hydroquinone, methyl hydroquinone, methoxyhydroquinone, t-butyl hydroquinone, 2,5-di- t -butyl hydroquinone, 2,5- Bis(1,1-dimethylbutyl) hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl) hydroquinone, catechol, t-butyl catechol, 4-methoxyphenol, pyroga Roll, 2,6-di- t -butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O') aluminum (Tris(N-hydroxy-N -nitrosophenylamineto-O,O')aluminium) or a combination thereof, but is not necessarily limited thereto.
상기 하이드로퀴논계 화합물, 카테콜계 화합물 또는 이들의 조합은 분산액의 형태로 사용될 수 있으며, 상기 분산액 형태의 중합 금지제는 경화성 조성물 총량에 대하여 0.001 중량% 내지 3 중량%, 예컨대 0.01 중량% 내지 2 중량%로 포함될 수 있다. 상기 중합 금지제가 상기 범위 내로 포함될 경우, 상온 경시 문제를 해결함과 동시에, 감도 저하 및 표면 박리 현상을 방지할 수 있다.The hydroquinone-based compound, catechol-based compound, or a combination thereof may be used in the form of a dispersion, and the polymerization inhibitor in the form of the dispersion is 0.001% by weight to 3% by weight, for example, 0.01% by weight to 2% by weight, based on the total amount of the curable composition. It can be included as a percentage. When the polymerization inhibitor is included within the above range, it is possible to solve the problem of aging at room temperature and prevent deterioration of sensitivity and surface peeling.
또한, 일 구현예에 따른 경화성 조성물은 내열성 및 신뢰성 향상을 위해, 말론산; 3-아미노-1,2-프로판디올; 실란계 커플링제; 레벨링제; 불소계 계면활성제; 또는 이들의 조합을 더 포함할 수 있다.In addition, the curable composition according to one embodiment includes malonic acid to improve heat resistance and reliability; 3-amino-1,2-propanediol; Silane-based coupling agent; leveling agent; Fluorine-based surfactant; Or it may further include a combination thereof.
예컨대, 일 구현예에 따른 경화성 조성물은 기판과의 밀착성 등을 개선하기 위해 비닐기, 카르복실기, 메타크릴옥시기, 이소시아네이트기, 에폭시기 등의 반응성 치환기를 갖는 실란계 커플링제를 더 포함할 수 있다.For example, the curable composition according to one embodiment may further include a silane-based coupling agent having a reactive substituent such as a vinyl group, carboxyl group, methacryloxy group, isocyanate group, or epoxy group to improve adhesion to the substrate.
상기 실란계 커플링제의 예로는, 트리메톡시실릴 벤조산, γ메타크릴 옥시프로필 트리메톡시실란, 비닐 트리아세톡시실란, 비닐 트리메톡시실란, γ이소시아네이트 프로필 트리에톡시실란, γ글리시독시 프로필 트리메톡시실란, β에폭시사이클로헥실)에틸트리메톡시실란 등을 들 수 있으며, 이들을 단독 또는 2종 이상 혼합하여 사용할 수 있다. Examples of the silane-based coupling agent include trimethoxysilyl benzoic acid, γ methacryl oxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ isocyanate propyl triethoxysilane, and γ glycidoxy propyl. Trimethoxysilane, β-epoxycyclohexyl)ethyltrimethoxysilane, etc. can be used, and these can be used alone or in combination of two or more.
상기 실란계 커플링제는 상기 경화성 조성물 100 중량부에 대하여 0.01 중량부 내지 10 중량부로 포함될 수 있다. 실란계 커플링제가 상기 범위 내로 포함될 경우 밀착성, 저장성 등이 우수하다. The silane-based coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the curable composition. When the silane-based coupling agent is included within the above range, adhesion and storage properties are excellent.
또한 상기 경화성 조성물은 필요에 따라 코팅성 향상 및 결점 생성 방지 효과를 위해, 즉 레벨링(leveling) 성능을 개선시키기 위해 계면 활성제, 예컨대 불소계 계면활성제를 더 포함할 수 있다. In addition, the curable composition may further include a surfactant, such as a fluorine-based surfactant, if necessary, to improve coating properties and prevent defects, that is, to improve leveling performance.
상기 불소계 계면활성제는 4,000 g/mol 내지 10,000 g/mol의 낮은 중량평균 분자량을 가질 수 있으며, 구체적으로는 6,000 g/mol 내지 10,000g/mol의 중량평균 분자량을 가질 수 있다. 또한 상기 불소계 계면활성제는 표면장력이 18 mN/m 내지 23 mN/m(0.1% 프로필렌글리콜 모노메틸에테르 아세테이트(PGMEA) 용액에서 측정)일 수 있다. 상기 불소계 계면활성제의 중량평균 분자량 및 표면장력이 상기 범위 내일 경우 레벨링 성능을 더욱 개선할 수 있으며, 고속 코팅(high speed coating)시 얼룩 발생을 방지할 수 있고, 기포 발생이 적어 막 결함이 적기 때문에, 고속 코팅법인 슬릿 코팅(slit coating)에 우수한 특성을 부여한다. The fluorine-based surfactant may have a low weight average molecular weight of 4,000 g/mol to 10,000 g/mol, and specifically, may have a weight average molecular weight of 6,000 g/mol to 10,000 g/mol. Additionally, the fluorine-based surfactant may have a surface tension of 18 mN/m to 23 mN/m (measured in 0.1% propylene glycol monomethyl ether acetate (PGMEA) solution). If the weight average molecular weight and surface tension of the fluorine-based surfactant are within the above range, leveling performance can be further improved, stains can be prevented during high speed coating, and there are fewer film defects due to less bubble generation. , gives excellent properties to slit coating, a high-speed coating method.
상기 불소계 계면활성제로는, BM Chemie社의 BM-1000®, BM-1100® 등; 다이 닛폰 잉키 가가꾸 고교(주)社의 메카 팩 F 142D®, 동 F 172®, 동 F 173®, 동 F 183® 등; 스미토모 스리엠(주)社의 프로라드 FC-135®, 동 FC-170C®, 동 FC-430®, 동 FC-431® 등; 아사히 그라스(주)社의 사프론 S-112®, 동 S-113®, 동 S-131®, 동 S-141®, 동 S-145® 등; 도레이 실리콘(주)社의 SH-28PA®, 동-190®, 동-193®, SZ-6032®, SF-8428® 등; DIC(주)社의 F-482, F-484, F-478, F-554 등의 명칭으로 시판되고 있는 불소계 계면활성제를 사용할 수 있다.Examples of the fluorine-based surfactants include BM-1000 ® and BM-1100 ® from BM Chemie; Mecha pack F 142D ® , F 172 ® , F 173 ® , F 183 ® , etc. from Dai Nippon Inki Chemicals Co., Ltd.; Prorad FC-135 ® , FC-170C ® , FC-430 ® , FC-431 ® , etc. from Sumitomo 3M Co., Ltd.; Asahi Grass Co., Ltd.'s Saffron S-112 ® , S-113 ® , S-131 ® , S-141 ® , S-145 ® , etc.; Toray Silicone Co., Ltd.'s SH-28PA ® , Dong-190 ® , Dong-193 ® , SZ-6032 ® , SF-8428 ® , etc.; Fluorine-based surfactants commercially available under names such as F-482, F-484, F-478, and F-554 from DIC Co., Ltd. can be used.
또한, 일 구현예에 따른 경화성 조성물은 전술한 불소계 계면활성제와 함께 실리콘계 계면활성제를 사용할 수도 있다. 상기 실리콘계 계면활성제의 구체적인 예로는 도시바 실리콘社의 TSF400, TSF401, TSF410, TSF4440 등이 있으나, 이에 한정되는 것은 아니다. Additionally, the curable composition according to one embodiment may use a silicone-based surfactant along with the fluorine-based surfactant described above. Specific examples of the silicone-based surfactant include TSF400, TSF401, TSF410, and TSF4440 manufactured by Toshiba Silicone, but are not limited thereto.
상기 불소계 계면활성제 등을 포함하는 계면활성제는 상기 경화성 조성물 100 중량부에 대하여 0.01 중량부 내지 5 중량부, 예컨대 0.1 중량부 내지 2 중량부로 포함될 수 있다. 상기 계면활성제가 상기 범위 내로 포함될 경우 분사된 조성물 내에 이물이 발생되는 현상이 줄어들게 된다.Surfactants including the fluorine-based surfactant may be included in an amount of 0.01 parts by weight to 5 parts by weight, for example, 0.1 parts by weight to 2 parts by weight, based on 100 parts by weight of the curable composition. When the surfactant is included within the above range, the occurrence of foreign substances in the sprayed composition is reduced.
또한 일 구현예에 따른 경화성 조성물은 물성을 저해하지 않는 범위 내에서 산화방지제 등의 기타 첨가제가 일정량 더 첨가될 수도 있다.Additionally, a certain amount of other additives such as antioxidants may be added to the curable composition according to one embodiment within a range that does not impair the physical properties.
용매menstruum
한편, 일 구현예에 따른 경화성 조성물은 용매를 더 포함할 수도 있다.Meanwhile, the curable composition according to one embodiment may further include a solvent.
상기 용매는 예컨대 메탄올, 에탄올 등의 알코올류; 에틸렌 글리콜 메틸에테르, 에틸렌 글리콜 에틸에테르, 프로필렌 글리콜 메틸에테르 등의 글리콜 에테르류; 메틸 셀로솔브 아세테이트, 에틸 셀로솔브 아세테이트, 디에틸 셀로솔브 아세테이트 등의 셀로솔브 아세테이트류; 메틸에틸 카르비톨, 디에틸 카르비톨, 디에틸렌 글리콜 모노메틸에테르, 디에틸렌 글리콜 모노에틸에테르, 디에틸렌 글리콜 디메틸에테르, 디에틸렌 글리콜 메틸에틸에테르, 디에틸렌 글리콜 디에틸에테르 등의 카르비톨류; 프로필렌 글리콜 모노메틸에테르 아세테이트, 프로필렌 글리콜 프로필에테르 아세테이트 등의 프로필렌 글리콜 알킬에테르 아세테이트류; 메틸에틸케톤, 사이클로헥사논, 4-히드록시-4-메틸-2-펜타논, 메틸-n-프로필케톤, 메틸-n-부틸케톤, 메틸-n-아밀케톤, 2-헵타논 등의 케톤류; 초산 에틸, 초산-n-부틸, 초산 이소부틸 등의 포화 지방족 모노카르복실산 알킬 에스테르류; 메틸 락테이트, 에틸 락테이트 등의 락트산 알킬 에스테르류; 메틸 히드록시아세테이트, 에틸 히드록시아세테이트, 부틸 히드록시아세테이트 등의 히드록시아세트산 알킬 에스테르류; 메톡시메틸 아세테이트, 메톡시에틸 아세테이트, 메톡시부틸 아세테이트, 에톡시메틸 아세테이트, 에톡시에틸 아세테이트 등의 아세트산 알콕시알킬 에스테르류; 메틸 3-히드록시프로피오네이트, 에틸 3-히드록시프로피오네이트 등의 3-히드록시프로피온산 알킬 에스테르류; 메틸 3-메톡시프로피오네이트, 에틸 3-메톡시프로피오네이트, 에틸 3-에톡시프로피오네이트, 메틸 3-에톡시프로피오네이트 등의 3-알콕시프로피온산 알킬 에스테르류; 메틸 2-히드록시프로피오네이트, 에틸 2-히드록시프로피오네이트, 프로필 2-히드록시프로피오네이트 등의 2-히드록시프로피온산 알킬 에스테르류; 메틸 2-메톡시프로피오네이트, 에틸 2-메톡시프로피오네이트, 에틸 2-에톡시프로피오네이트, 메틸 2-에톡시프로피오네이트 등의 2-알콕시프로피온산 알킬 에스테르류; 메틸 2-히드록시-2-메틸프로피오네이트, 에틸 2-히드록시-2-메틸프로피오네이트 등의 2-히드록시-2-메틸프로피온산 알킬 에스테르류; 메틸 2-메톡시-2-메틸프로피오네이트, 에틸 2-에톡시-2-메틸프로피오네이트 등의 2-알콕시-2-메틸프로피온산 알킬 에스테르류; 2-히드록시에틸 프로피오네이트, 2-히드록시-2-메틸에틸 프로피오네이트, 히드록시에틸 아세테이트, 메틸 2-히드록시-3-메틸부타노에이트 등의 에스테르류; 또는 피루빈산 에틸 등의 케톤산 에스테르류의 화합물이 있으며, 또한 N-메틸포름아미드, N,N-디메틸포름아미드, N-메틸포름아닐리드, N-메틸아세트아미드, N,N-디메틸아세트아미드, N-메틸피롤리돈, 디메틸술폭시드, 벤질에틸에테르, 디헥실에테르, 아세틸아세톤, 이소포론, 카프론산, 카프릴산, 1-옥탄올, 1-노난올, 벤질알코올, 초산 벤질, 안식향산 에틸, 옥살산 디에틸, 말레인산 디에틸, γ-부티로락톤, 에틸렌 카보네이트, 프로필렌 카보네이트, 페닐 셀로솔브 아세테이트 등을 들 수 있으나, 이에 한정되는 것은 아니다.The solvent includes, for example, alcohols such as methanol and ethanol; Glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; Carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone ; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid alkyl esters such as methyl lactate and ethyl lactate; hydroxyacetic acid alkyl esters such as methyl hydroxyacetate, ethyl hydroxyacetate, and butyl hydroxyacetate; acetic acid alkoxyalkyl esters such as methoxymethyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, and ethoxyethyl acetate; 3-hydroxypropionic acid alkyl esters such as methyl 3-hydroxypropionate and ethyl 3-hydroxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-hydroxypropionic acid alkyl esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, and propyl 2-hydroxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-hydroxy-2-methylpropionic acid alkyl esters such as methyl 2-hydroxy-2-methylpropionate and ethyl 2-hydroxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as 2-hydroxyethyl propionate, 2-hydroxy-2-methylethyl propionate, hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; Or there are compounds of keto acid esters such as ethyl pyruvate, and also N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide. , N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, benzoic acid. Examples include ethyl, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate, etc., but are not limited thereto.
예컨대, 상기 용매는 에틸렌 글리콜 모노에틸에테르, 에틸렌디글리콜메틸에틸에테르 등의 글리콜 에테르류; 에틸 셀로솔브 아세테이트 등의 에틸렌 글리콜 알킬에테르 아세테이트류; 2-히드록시 프로피온산 에틸 등의 에스테르류; 디에틸렌 글리콜 모노메틸에테르 등의 카르비톨류; 프로필렌 글리콜 모노메틸에테르 아세테이트, 프로필렌 글리콜 프로필에테르 아세테이트 등의 프로필렌 글리콜 알킬에테르 아세테이트류; 에탄올 등의 알코올류 또는 이들의 조합을 사용하는 것이 바람직하다.For example, the solvent may include glycol ethers such as ethylene glycol monoethyl ether and ethylene diglycol methyl ethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; Carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; It is preferable to use alcohols such as ethanol or a combination thereof.
예컨대, 상기 용매는 프로필렌 글리콜 모노메틸에테르 아세테이트, 디프로필렌 글리콜 메틸에테르 아세테이트, 에탄올, 에틸렌글리콜디메틸에테르, 에틸렌디글리콜메틸에틸에테르, 디에틸렌글리콜디메틸에테르, 2-부톡시에탄올, N-메틸피롤리딘, N-에틸피롤리딘, 프로필렌 카보네이트, γ-부티로락톤 또는 이들의 조합을 포함하는 극성 용매일 수 있다.For example, the solvent is propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, ethylene glycol dimethyl ether, ethylene diglycol methyl ethyl ether, diethylene glycol dimethyl ether, 2-butoxyethanol, N-methylpyrroli It may be a polar solvent including dine, N-ethylpyrrolidine, propylene carbonate, γ-butyrolactone, or a combination thereof.
상기 용매는 경화성 조성물 총량에 대하여 40 중량% 내지 80 중량%, 예컨대 45 중량% 내지 80 중량%로 포함될 수 있다. 용매가 상기 범위 내로 포함될 경우 용매형 경화성 조성물이 적절한 점도를 가짐에 따라 스핀 코팅 및 슬릿을 이용한 대면적 코팅 시 우수한 코팅성을 가질 수 있다. The solvent may be included in an amount of 40% to 80% by weight, for example, 45% to 80% by weight, based on the total amount of the curable composition. When the solvent is included within the above range, the solvent-type curable composition has an appropriate viscosity and can have excellent coating properties during large-area coating using spin coating and slit.
다른 일 구현예는 상기 경화성 조성물, 예컨대 상기 경화성 조성물을 이용하여 제조된 경화막, 상기 경화막을 포함하는 컬러필터 및 상기 컬러필터를 포함하는 디스플레이 장치를 제공한다. 이 때, 상기 경화막은 전술한 바와 같이 50% 내지 55%의 난반사율을 가질 수 있다.Another embodiment provides the curable composition, for example, a cured film manufactured using the curable composition, a color filter including the cured film, and a display device including the color filter. At this time, the cured film may have a diffuse reflectance of 50% to 55% as described above.
상기 경화막의 제조방법 중 하나는, 상기 경화성 조성물을 기판 위에 잉크젯 분사 방법으로 도포하여 패턴을 형성하는 단계(S1); 및 상기 패턴을 경화하는 단계(S2)를 포함한다.One of the methods for producing the cured film includes forming a pattern by applying the curable composition on a substrate using an inkjet spraying method (S1); and curing the pattern (S2).
(S1) 패턴을 형성하는 단계(S1) Step of forming a pattern
상기 경화성 조성물은 잉크젯 분산 방식으로 0.5 내지 20 ㎛의 두께로 기판 위에 도포하는 것이 바람직하다. 상기 잉크젯 분사는 각 노즐당 단일 컬러만 분사하여 필요한 색의 수에 따라 반복적으로 분사함으로써 패턴을 형성할 수 있으며, 공정을 줄이기 위하여 필요한 색의 수를 각 잉크젯 노즐을 통해 동시에 분사하는 방식으로 패턴을 형성할 수도 있다. The curable composition is preferably applied to the substrate at a thickness of 0.5 to 20 ㎛ by inkjet dispersion. The inkjet spraying can form a pattern by spraying only a single color per nozzle and spraying repeatedly according to the number of colors required. To reduce the process, the pattern can be formed by spraying the required number of colors simultaneously through each inkjet nozzle. It can also be formed.
(S2) 경화하는 단계(S2) Curing step
상기 수득된 패턴을 경화시켜 화소를 얻을 수 있다. 이때 경화시키는 방법으로는 열경화 공정 또는 광경화 공정을 모두 적용할 수 있다. 상기 열경화 공정은 100℃ 이상의 온도로 가열하여 경화시키는 것이 바람직하고, 더욱 바람직하게는 100℃ 내지 300℃로 가열하여 경화시킬 수 있으며, 조금 더 바람직하게는 160℃ 내지 250℃로 가열하여 경화시킬 수 있다. 상기 광경화 공정은 190nm 내지 450nm, 예컨대 200nm 내지 500nm의 UV 광선 등의 활성선을 조사한다. 조사에 사용되는 광원으로는 저압 수은등, 고압 수은등, 초고압 수은등, 금속 할로겐화물 램프, 아르곤 가스 레이저 등을 사용할 수 있으며, 경우에 따라 X선, 전자선 등도 이용할 수 있다. Pixels can be obtained by curing the obtained pattern. At this time, as a curing method, either a thermal curing process or a photo curing process can be applied. The heat curing process is preferably performed by heating to a temperature of 100°C or higher, more preferably by heating to 100°C to 300°C, and more preferably by heating to 160°C to 250°C. You can. The photocuring process irradiates active rays such as UV light of 190 nm to 450 nm, for example, 200 nm to 500 nm. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.
상기 경화막의 제조방법 중 또 다른 하나는 상기 경화성 조성물을 이용하여 리소그래피법을 이용하여 경화막을 제조하는 것으로, 제조방법은 다음과 같다.Another method of manufacturing the cured film is to manufacture the cured film using the lithography method using the curable composition, and the manufacturing method is as follows.
(1) 도포 및 도막 형성 단계(1) Application and film formation stage
상기 경화성 조성물을 소정의 전처리를 한 기판 상에 스핀 또는 슬릿 코트법, 롤 코트법, 스크린 인쇄법, 어플리케이터법 등의 방법을 사용하여 원하는 두께, 예를 들어 2㎛ 내지 10㎛의 두께로 도포한 후, 70℃내지 90℃의 온도에서 1분 내지 10분 동안 가열하여 용매를 제거함으로써 도막을 형성한다. The curable composition is applied to a desired thickness, for example, 2㎛ to 10㎛, using a method such as spin or slit coating, roll coating, screen printing, or applicator method on a substrate that has been pretreated. Afterwards, the solvent is removed by heating at a temperature of 70°C to 90°C for 1 to 10 minutes to form a coating film.
(2) 노광 단계(2) exposure step
상기 얻어진 도막에 필요한 패턴 형성을 위해 소정 형태의 마스크를 개재한 뒤, 190nm 내지 450nm, 예컨대 200nm 내지 400nm의 UV 광선 등의 활성선을 조사한다. 조사에 사용되는 광원으로는 저압 수은등, 고압 수은등, 초고압 수은등, 금속 할로겐화물 램프, 아르곤 가스 레이저 등을 사용할 수 있으며, 경우에 따라 X선, 전자선 등도 이용할 수 있다. In order to form the necessary pattern on the obtained coating film, a mask of a predetermined shape is interposed, and then actinic rays such as UV rays of 190 nm to 450 nm, for example, 200 nm to 400 nm, are irradiated. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.
노광량은 상기 경화성 조성물 각 성분의 종류, 배합량 및 건조 막 두께에 따라 다르지만, 예를 들어 고압 수은등을 사용할 경우 500 mJ/cm2 이하(365 nm 센서에 의함)이다.The exposure amount varies depending on the type, mixing amount, and dry film thickness of each component of the curable composition, but for example, when using a high-pressure mercury lamp, it is 500 mJ/cm 2 or less (based on a 365 nm sensor).
(3) 현상 단계(3) Development stage
상기 노광 단계에 이어, 알칼리성 수용액을 현상액으로 이용하여 불필요한 부분을 용해, 제거함으로써 노광 부분만을 잔존시켜 화상 패턴을 형성시킨다. 즉, 알칼리 현상액으로 현상하는 경우, 비노광부는 용해되고, 이미지 컬러필터 패턴이 형성되게 된다.Following the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts remaining to form an image pattern. That is, when developing with an alkaline developer, the unexposed portion is dissolved and an image color filter pattern is formed.
(4) 후처리 단계(4) Post-processing step
상기 현상에 의해 수득된 화상 패턴을 내열성, 내광성, 밀착성, 내크랙성, 내화학성, 고강도, 저장 안정성 등의 면에서 우수한 패턴을 얻기 위해, 다시 가열하거나 활성선 조사 등을 행하여 경화시킬 수 있다.The image pattern obtained by the above phenomenon can be cured by heating again or irradiating with actinic rays, etc., in order to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc.
이하, 본 발명의 바람직한 실시예를 기재한다. 다만, 하기의 실시예는 본 발명의 바람직한 일 실시예일뿐, 본 발명이 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, preferred embodiments of the present invention will be described. However, the following example is only a preferred example of the present invention, and the present invention is not limited by the following example.
중합성 화합물의 제조Preparation of polymerizable compounds
제조예 1Manufacturing Example 1
2,2-thiodiethanol 20g을 플라스크에 넣고 dichloromethane 400mL 에 충분히 용해한다. 여기에acryloyl chloride 32.6g을 넣고 질소 분위기에서 교반한다. 0℃ 에서 Trimethylamine 36.4g 을 drop-wise로 1시간 동안 주입한 다음, 2시간 교반 후 반응을 종료한다. Dichloromethane 200mL, water 500mL 를 넣고 extraction한 후, dichloromethane 층을 분리하고 여기에 희석 염산을 투입하여 3회 extraction을 반복한다. Dichloromethane 층을 분리하여 MgSO4 를 넣고 5분간 교반한다. 필터링 후 여액을 농축한다. Column 정제 후 농축 및 진공 건조하여, 하기 화학식 1-1로 표시되는 화합물(굴절율: 1.495)을 제조한다. Add 20g of 2,2-thiodiethanol to the flask and sufficiently dissolve in 400mL of dichloromethane. Add 32.6 g of acryloyl chloride here and stir in a nitrogen atmosphere. 36.4 g of Trimethylamine was injected drop-wise at 0°C for 1 hour, then stirred for 2 hours and the reaction was terminated. After adding 200mL of dichloromethane and 500mL of water and extracting, separate the dichloromethane layer, add diluted hydrochloric acid, and repeat extraction three times. Separate the dichloromethane layer, add MgSO 4 and stir for 5 minutes. After filtering, the filtrate is concentrated. After column purification, concentration and vacuum drying are performed to prepare a compound (refractive index: 1.495) represented by the following formula 1-1.
[화학식 1-1][Formula 1-1]
제조예 2Production example 2
3,6-dithia-1,8-octanediol 20g을 플라스크에 넣고 dichloromethane 200mL 및 ethanol 200mL 에 충분히 용해한다. 여기에 acryloyl chloride 21.8g을 넣고 질소 분위기에서 교반한다. 0℃ 에서 Trimethylamine 24.4g 을 drop-wise로 1시간 동안 주입한 다음, 2시간 교반 후 반응을 종료한다. Dichloromethane 200mL, water 500mL 를 넣고 extraction한 후, dichloromethane 층을 분리하고 여기에 희석 염산을 투입하여 3회 extraction을 반복한다. Dichloromethane 층을 분리하여 MgSO4 를 넣고 5분간 교반한다. 필터링 후 여액을 농축한다. Column 정제 후 농축 및 진공 건조하여, 하기 화학식 1-2로 표시되는 화합물(굴절율: 1.529)을 제조한다. Put 20g of 3,6-dithia-1,8-octanediol into a flask and sufficiently dissolve in 200mL of dichloromethane and 200mL of ethanol. Add 21.8 g of acryloyl chloride here and stir in a nitrogen atmosphere. At 0°C, 24.4 g of Trimethylamine was injected drop-wise for 1 hour, then stirred for 2 hours and the reaction was terminated. After adding 200mL of dichloromethane and 500mL of water and extracting, separate the dichloromethane layer, add diluted hydrochloric acid, and repeat extraction three times. Separate the dichloromethane layer, add MgSO 4 and stir for 5 minutes. After filtering, the filtrate is concentrated. After column purification, concentration and vacuum drying are performed to prepare a compound (refractive index: 1.529) represented by the following formula 1-2.
[화학식 1-2][Formula 1-2]
제조예 3Production example 3
1,4-dithiane-2,5-diol 20g을 ethanol 300mL 및 dichloromethane 200mL 넣고 교반한다. 여기에 acryloyl chloride 26g을 넣고 질소 분위기에서 교반한다. 0℃ 에서 Trimethylamine 29.2g 을 drop-wise로 1시간 동안 주입한 다음, 2시간 교반 후 반응을 종료한다. Dichloromethane 200mL, water 500mL 를 넣고 extraction한 후, dichloromethane 층을 분리하고 여기에 희석 염산을 투입하여 3회 extraction을 반복한다. Dichloromethane 층을 분리하여 MgSO4 를 넣고 5분간 교반한다. 필터링 후 여액을 농축한다. Column 정제 후 농축 및 진공 건조하여, 하기 화학식 1-3으로 표시되는 화합물(굴절율: 1.680)을 제조한다. Add 20g of 1,4-dithiane-2,5-diol to 300mL of ethanol and 200mL of dichloromethane and stir. Add 26g of acryloyl chloride here and stir in a nitrogen atmosphere. 29.2 g of Trimethylamine was injected drop-wise at 0°C for 1 hour, then stirred for 2 hours and the reaction was terminated. After adding 200mL of dichloromethane and 500mL of water and extracting, separate the dichloromethane layer, add diluted hydrochloric acid, and repeat extraction three times. Separate the dichloromethane layer, add MgSO 4 and stir for 5 minutes. After filtering, the filtrate is concentrated. After column purification, concentration and vacuum drying are performed to prepare a compound (refractive index: 1.680) represented by the following formula 1-3.
[화학식 1-3][Formula 1-3]
제조예 4Production example 4
1,6-hexanediol 100g을 toluene 100ml에 녹인 뒤 acrylic acid 135g, methanesulfonic acid 8.2g과 함께 120℃에서, 5시간 동안 반응시켜 하기 화학식 2-2로 표시되는 화합물(굴절율: 1.455)을 제조한다. Dissolve 100g of 1,6-hexanediol in 100ml of toluene and react with 135g of acrylic acid and 8.2g of methanesulfonic acid at 120°C for 5 hours to prepare a compound (refractive index: 1.455) represented by the following formula 2-2.
[화학식 2-2][Formula 2-2]
비교제조예 1Comparative Manufacturing Example 1
Bis(2-hydroxyethyl) disulfide 20g을 ethanol 300mL 및 methylene chloride 150mL에 충분히 용해한다. 여기에 acryloyl chloride 25.7g을 투입하고 10분간 교반한다. 0℃에서 Triethylamine 28.8g을 drop-wise 로 천천히 주입한 다음, 5시간 교반 후 반응을 종료하고 methylene chloride 250mL, water 300mL를 넣고 extraction한다. 유기층을 분리하여 희석 염산 수용액으로 3회 추가 extraction한다. Dichloromethane 층을 분리하여 MgSO4 를 넣고 5분간 교반한다. 필터링 후 여액을 농축한다. Column 정제 후 농축 및 진공 건조하여, 하기 화학식 C-1로 표시되는 화합물(굴절율: 1.517)을 제조한다. Sufficiently dissolve 20 g of Bis(2-hydroxyethyl) disulfide in 300 mL of ethanol and 150 mL of methylene chloride. Add 25.7 g of acryloyl chloride here and stir for 10 minutes. 28.8 g of Triethylamine was slowly injected drop-wise at 0°C, and after stirring for 5 hours, the reaction was terminated, and 250 mL of methylene chloride and 300 mL of water were added and extracted. The organic layer was separated and extracted three additional times with a diluted aqueous hydrochloric acid solution. Separate the dichloromethane layer, add MgSO 4 and stir for 5 minutes. After filtering, the filtrate is concentrated. After column purification, concentration and vacuum drying are performed to prepare a compound represented by the following formula C-1 (refractive index: 1.517).
[화학식 C-1][Formula C-1]
비교제조예 2Comparative Manufacturing Example 2
1,4-benzene dithiol 20g을 methylene chloride 200mL에 충분히 용해한다. 여기에 2-chloroethyl acrylate 22.5g 을 넣고 10분간 교반한 후, 0℃에서 triethylamine 17g을 drop-wise로 천천히 주입한 다음, 12시간 교반 후에 반응을 종료한다. Methylene chloride 300mL, water 300mL를 넣고 extraction한 후, 유기층을 분리하고 희석 염산용액을 넣고 3회 extraction 반복한다. Dichloromethane 층을 분리하여 MgSO4 를 넣고 5분간 교반한다. 필터링 후 여액을 농축한다. Column 정제 후 농축 및 진공 건조하여, 하기 화학식 C-2로 표시되는 화합물(굴절율: 1.556)을 제조한다. Sufficiently dissolve 20g of 1,4-benzene dithiol in 200mL of methylene chloride. Add 22.5 g of 2-chloroethyl acrylate and stir for 10 minutes, then slowly inject 17 g of triethylamine drop-wise at 0°C, and terminate the reaction after stirring for 12 hours. After adding 300mL of methylene chloride and 300mL of water and extracting, separate the organic layer, add diluted hydrochloric acid solution, and repeat extraction three times. Separate the dichloromethane layer, add MgSO 4 and stir for 5 minutes. After filtering, the filtrate is concentrated. After column purification, concentration and vacuum drying are performed to prepare a compound represented by the following formula C-2 (refractive index: 1.556).
[화학식 C-2][Formula C-2]
표면개질된 양자점 분산액의 제조Preparation of surface-modified quantum dot dispersion
제조예 5Production example 5
3구 환저 플라스크에 마그네틱바를 넣고, 녹색 양자점 분산용액(InP/ZnSe/ZnS, 한솔케미칼; 양자점 고형분 23 중량%)을 각각 투입한다. 여기에 하기 화학식 Q로 표시되는 화합물(리간드)를 투입하고, 80℃, 질소 분위기에서 교반한다. 반응 종료 후 상온(23℃)으로 냉각한 다음 cyclohexane에 양자점 반응액을 넣어 침전을 잡는다. 원심분리를 통해 침전물과 cyclohexane을 분리하고, 침전물은 진공 오븐에서 24시간 충분히 건조하여, 표면개질된 양자점을 수득한다. A magnetic bar is placed in a three-neck round bottom flask, and green quantum dot dispersion solution (InP/ZnSe/ZnS, Hansol Chemical; quantum dot solid content 23% by weight) is added to each. A compound (ligand) represented by the following formula Q is added here, and stirred at 80°C in a nitrogen atmosphere. After completion of the reaction, cool to room temperature (23°C) and then add the quantum dot reaction solution to cyclohexane to prevent precipitation. Separate the precipitate and cyclohexane through centrifugation, and dry the precipitate in a vacuum oven for 24 hours to obtain surface-modified quantum dots.
상기 표면개질된 녹색 양자점을 중합성 화합물에 12시간 동안 교반하여 표면개질된 양자점 분산액(QD고형분: 23 중량%)을 수득하였다. The surface-modified green quantum dots were stirred in a polymerizable compound for 12 hours to obtain a surface-modified quantum dot dispersion (QD solid content: 23% by weight).
(*화학식 Q로 표시되는 화합물 합성: PH-4 (한농화성) 100g을 2구 환저 플라스크에 넣고 THF 300mL에 충분히 용해시킨다. 여기에 0℃에서 NaOH 15.4g, 물 100mL를 투입한 후, 맑은 용액이 될 때까지 충분히 용해시킨다. Para-toluene sulfonic chloride 73g 을 THF 100mL에 녹인 용액을 0℃에서 천천히 주입한다. 주입은 1시간 동안 진행되었으며, 이후 상온에서 12시간 동안 교반한다. 반응 종료 후 과량의 methylene chloride를 넣고 교반 후 NaHCO3 포화 용액을 넣고 추출, 적정, 수분 제거를 진행한다. 용매를 제거한 후 dry oven에서 24시간 건조한다. 수득한 건조물 50g을 2구 환저 플라스크에 넣고 에탄올 300mL에 충분히 교반한다. 이후 Thiourea 27g 을 넣고 분산 후 80℃에서 12시간 reflux한다. 이후 NaOH 4.4g을 20mL 물에 녹인 수용액을 주입하고 5시간 더 교반하면서 과량의 methylene chloride을 넣고 교반 후 염산수용액을 넣고 추출, 적정, 수분제거, 용매 제거를 차례로 진행한다. 진공 오븐에서 24시간 건조하여, 하기 화학식 Q로 표시되는 화합물을 수득한다.)(*Synthesis of compound represented by chemical formula Q: Place 100g of PH-4 (Han Nong Chemical) in a two-necked round bottom flask and sufficiently dissolve in 300mL of THF. Add 15.4g of NaOH and 100mL of water at 0℃, and then obtain a clear solution. Sufficiently dissolve 73 g of para-toluene sulfonic chloride in 100 mL of THF and slowly inject it for 1 hour, then stir at room temperature for 12 hours. After adding methylene chloride and stirring, saturated NaHCO 3 solution was added, the solvent was removed, and 50 g of the obtained dried material was placed in a two-neck round bottom flask and thoroughly stirred in 300 mL of ethanol. Afterwards, add 27 g of Thiourea and reflux at 80°C for 12 hours. Then, add an aqueous solution of 4.4 g of NaOH dissolved in 20 mL of water and stir for 5 more hours. After stirring, add an aqueous hydrochloric acid solution and extract and titrate. , moisture removal, and solvent removal are carried out sequentially and dried in a vacuum oven for 24 hours to obtain a compound represented by the following formula Q.)
[화학식 Q][Formula Q]
(경화성 조성물 제조)(Preparation of curable composition)
실시예 1 내지 실시예 7 및 비교예 1 내지 비교예 3Examples 1 to 7 and Comparative Examples 1 to 3
하기 언급된 구성성분들을 이용하여 하기 표 1 및 표 2에 나타낸 조성으로 각 실시예 1 내지 실시예 7 및 비교예 1 내지 비교예 3에 따른 경화성 조성물을 제조하였다.Curable compositions according to Examples 1 to 7 and Comparative Examples 1 to 3 were prepared with the compositions shown in Tables 1 and 2 below using the components mentioned below.
구체적으로, 상기 양자점 분산액을 계량한 후 중합성 화합물과 혼합하여 희석하고, 중합금지제를 넣고 5분 간 교반한다. 이어서 광개시제를 투입하고 난 후, 광확산제를 넣는다. 이후 해당 조액을 1시간 동안 교반하여 경화성 조성물을 제조한다. Specifically, the quantum dot dispersion is weighed and diluted by mixing with a polymerizable compound, and then a polymerization inhibitor is added and stirred for 5 minutes. Next, after adding the photoinitiator, add the light diffuser. Thereafter, the crude solution is stirred for 1 hour to prepare a curable composition.
(A) 양자점(A) Quantum dots
제조예 5로부터 제조된 표면개질된 녹색 양자점 분산액 Surface-modified green quantum dot dispersion prepared from Preparation Example 5
(B) 중합성 화합물(B) Polymerizable compounds
(B-1) 제조예 1의 화합물(B-1) Compound of Preparation Example 1
(B-2) 제조예 2의 화합물(B-2) Compound of Preparation Example 2
(B-3) 제조예 3의 화합물(B-3) Compound of Preparation Example 3
(B-4) 제조예 4의 화합물(B-4) Compound of Preparation Example 4
(B-5) 비교제조예 1의 화합물(B-5) Compound of Comparative Preparation Example 1
(B-6) 비교제조예 2의 화합물(B-6) Compound of Comparative Preparation Example 2
(C) 광중합 개시제(C) Photopolymerization initiator
TPO-L(폴리네트론社) TPO-L (Polynetron Co., Ltd.)
(D) 광확산제(D) Light diffuser
이산화티탄 분산액 (TiO2 고형분 20중량%, 평균입경: 200nm, 디토테크놀로지㈜)Titanium dioxide dispersion (TiO 2 solid content 20% by weight, average particle diameter: 200nm, Dito Technology Co., Ltd.)
(E) 중합금지제(E) Polymerization inhibitor
메틸하이드로퀴논 (TOKYO CHEMICAL社)Methylhydroquinone (TOKYO CHEMICAL)
실시예 1Example 1 | 실시예 2Example 2 | 실시예 3Example 3 | 실시예 4Example 4 | 실시예 5Example 5 | 실시예 6Example 6 | 실시예 7Example 7 | ||
(A) 양자점 분산액(A) Quantum dot dispersion | 4242 | 4242 | 4242 | 4242 | 4242 | 4242 | 4242 | |
(B) 중합성 화합물(B) Polymerizable compounds | (B-1)(B-1) | 10.5810.58 | 20.720.7 | 31.2831.28 | 41.441.4 | 4646 | -- | -- |
(B-2)(B-2) | -- | -- | -- | -- | -- | 41.441.4 | -- | |
(B-3)(B-3) | -- | -- | -- | -- | -- | -- | 41.441.4 | |
(B-4)(B-4) | 35.4235.42 | 25.325.3 | 14.7214.72 | 4.64.6 | -- | 4.64.6 | 4.64.6 | |
(B-5)(B-5) | -- | -- | -- | -- | -- | -- | -- | |
(B-6)(B-6) | -- | -- | -- | -- | -- | -- | -- | |
(B-7)(B-7) | -- | -- | -- | -- | -- | -- | -- | |
(C) 광중합 개시제(C) Photopolymerization initiator | 33 | 33 | 33 | 33 | 33 | 33 | 33 | |
(D) 광확산제(D) Light diffuser | 88 | 88 | 88 | 88 | 88 | 88 | 88 | |
(E) 중합금지제(E) Polymerization inhibitor | 1One | 1One | 1One | 1One | 1One | 1One | 1One | |
합계Sum | 100100 | 100100 | 100100 | 100100 | 100100 | 100100 | 100100 |
비교예 1Comparative Example 1 | 비교예 2Comparative Example 2 | 비교예 3Comparative Example 3 | ||
(A) 양자점 분산액(A) Quantum dot dispersion | 4242 | 4242 | 4242 | |
(B) 중합성 화합물(B) Polymerizable compounds | (B-1)(B-1) | -- | -- | -- |
(B-2)(B-2) | -- | -- | -- | |
(B-3)(B-3) | -- | -- | -- | |
(B-4)(B-4) | 4.64.6 | 4.64.6 | 4646 | |
(B-5)(B-5) | -- | -- | -- | |
(B-6)(B-6) | 41.441.4 | -- | -- | |
(B-7)(B-7) | -- | 41.441.4 | -- | |
(C) 광중합 개시제(C) Photopolymerization initiator | 33 | 33 | 33 | |
(D) 광확산제(D) Light diffuser | 88 | 88 | 88 | |
(E) 중합금지제(E) Polymerization inhibitor | 1One | 1One | 1One | |
합계Sum | 100100 | 100100 | 100100 |
평가: 경화성 조성물의 광특성 및 난반사율 평가Evaluation: Evaluation of optical properties and diffuse reflectance of curable composition
실시예 1 내지 실시예 7 및 비교예 1 내지 비교예 3에 따른 경화성 조성물 각각에 대하여 노광 후 양자효율(EQE) 및 경화 후 난반사율(SCE) 값을 분광측색계 (Konica Minolta, CM-3600A)를 이용하여 측정하고, 그 결과를 하기 표 3에 나타내었다.For each of the curable compositions according to Examples 1 to 7 and Comparative Examples 1 to 3, the quantum efficiency (EQE) after exposure and the diffuse reflectance (SCE) after curing were measured using a spectrophotometer (Konica Minolta, CM-3600A). It was measured using and the results are shown in Table 3 below.
노광 후 양자효율 (%)Quantum efficiency after exposure (%) | 경화 후 난반사율 (%)Diffuse reflectance after curing (%) | |
실시예 1Example 1 | 32.232.2 | 54.754.7 |
실시예 2Example 2 | 32.932.9 | 53.653.6 |
실시예 3Example 3 | 33.133.1 | 53.653.6 |
실시예 4Example 4 | 33.633.6 | 52.552.5 |
실시예 5Example 5 | 31.931.9 | 55.855.8 |
실시예 6Example 6 | 33.533.5 | 52.552.5 |
실시예 7Example 7 | 34.034.0 | 52.152.1 |
비교예 1Comparative Example 1 | 31.531.5 | 56.156.1 |
비교예 2Comparative Example 2 | 30.830.8 | 57.357.3 |
비교예 3Comparative Example 3 | 31.731.7 | 56.156.1 |
상기 표 3으로부터, 실시예 1 내지 실시예 7에 따른 경화성 조성물은 비교예 1 내지 비교예 3에 따른 경화성 조성물과 비교하여, 노광 후 양자효율이 높아 광특성 개선이 이루어지며, 동시에 경화 후 난반사율이 낮아 반사율 저감 효과도 가짐을 확인할 수 있다. From Table 3, compared to the curable compositions according to Comparative Examples 1 to 3, the curable compositions according to Examples 1 to 7 have higher quantum efficiency after exposure, resulting in improved optical properties, and at the same time, the diffuse reflectance after curing Since this is low, it can be confirmed that it also has the effect of reducing reflectance.
본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.The present invention is not limited to the above-mentioned embodiments, but can be manufactured in various different forms, and those skilled in the art will be able to form other specific forms without changing the technical idea or essential features of the present invention. You will be able to understand that this can be implemented. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.
Claims (19)
- (A) 양자점; 및 (A) Quantum dots; and(B) 하기 화학식 1로 표시되는 화합물을 포함하는 중합성 화합물(B) a polymerizable compound containing a compound represented by the following formula (1)을 포함하는 경화성 조성물:A curable composition comprising:[화학식 1][Formula 1]상기 화학식 1에서,In Formula 1,L1은 황 원자를 포함하는 2가의 연결기이되, 단 다이설파이드(*-S-S-*) 연결구조는 포함하지 않고,L 1 is a divalent linking group containing a sulfur atom, but does not include a disulfide (*-SS-*) linking structure,L2 및 L3은 각각 독립적으로 단일결합, 치환 또는 비치환된 C1 내지 C20 알킬렌기 또는 치환 또는 비치환된 C3 내지 C20 사이클로알킬렌기이고, L 2 and L 3 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, or a substituted or unsubstituted C3 to C20 cycloalkylene group,R1 및 R2는 각각 독립적으로 수소 원자, 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이다.R 1 and R 2 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
- 제1항에 있어서,According to paragraph 1,상기 L1은 하기 화학식 L-1 내지 화학식 L-4 중 어느 하나로 표시되는 경화성 조성물:Wherein L 1 is a curable composition represented by any one of the following formulas L-1 to L-4:[화학식 L-1][Formula L-1][화학식 L-2][Formula L-2][화학식 L-3][Formula L-3][화학식 L-4][Formula L-4]상기 화학식 L-1 내지 화학식 L-4에서,In Formula L-1 to Formula L-4,L4 내지 L8은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C20 알킬렌기이다.L 4 to L 8 are each independently a single bond or a substituted or unsubstituted C1 to C20 alkylene group.
- 제1항에 있어서,According to paragraph 1,상기 화학식 1로 표시되는 화합물은 1.455 초과의 굴절율을 가지는 경화성 조성물.The compound represented by Formula 1 is a curable composition having a refractive index of more than 1.455.
- 제1항에 있어서,According to paragraph 1,상기 중합성 화합물은 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물을 더 포함하는 경화성 조성물.The curable composition wherein the polymerizable compound further includes a compound having a different structure from the compound represented by Formula 1.
- 제5항에 있어서,According to clause 5,상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물은 하기 화학식 2로 표시되는 경화성 조성물.A compound having a structure different from the compound represented by Formula 1 is a curable composition represented by Formula 2 below.[화학식 2][Formula 2]상기 화학식 2에서,In Formula 2,L9는 치환 또는 비치환된 C1 내지 C10 알킬렌기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬렌기 또는 에테르기(*-O-*)이고,L 9 is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, or an ether group (*-O-*),L10 및 L11은 각각 독립적으로 단일결합 또는 치환 또는 비치환된 C1 내지 C10 알킬렌기이고,L 10 and L 11 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,R3 및 R4는 각각 독립적으로 수소 원자, 치환 또는 비치환된 C1 내지 C20 알킬기, 치환 또는 비치환된 C3 내지 C20 사이클로알킬기 또는 치환 또는 비치환된 C6 내지 C20 아릴기이다.R 3 and R 4 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group.
- 제6항에 있어서,According to clause 6,상기 화학식 2로 표시되는 화합물은 1.455 이하의 굴절율을 가지는 경화성 조성물.The compound represented by Formula 2 is a curable composition having a refractive index of 1.455 or less.
- 제5항에 있어서,According to clause 5,상기 화학식 1로 표시되는 화합물 및 상기 화학식 1로 표시되는 화합물과 상이한 구조를 가지는 화합물은 1:9 내지 9:1의 중량비로 포함되는 경화성 조성물.A curable composition comprising the compound represented by Formula 1 and a compound having a structure different from the compound represented by Formula 1 in a weight ratio of 1:9 to 9:1.
- 제1항에 있어서,According to paragraph 1,상기 경화성 조성물은 무용매형 경화성 조성물인 경화성 조성물.The curable composition is a solvent-free curable composition.
- 제9항에 있어서,According to clause 9,상기 무용매형 경화성 조성물은, 상기 무용매형 경화성 조성물 총량에 대해, The solvent-free curable composition is, relative to the total amount of the solvent-free curable composition,상기 양자점 5 중량% 내지 60 중량%; 및5% to 60% by weight of the quantum dots; and상기 중합성 화합물 40 중량% 내지 95 중량%40% to 95% by weight of the polymerizable compound를 포함하는 무용매형 경화성 조성물.A solvent-free curable composition comprising a.
- 제1항에 있어서,According to paragraph 1,상기 경화성 조성물은 중합개시제, 광확산제, 중합금지제 또는 이들의 조합을 더 포함하는 경화성 조성물.The curable composition further includes a polymerization initiator, a light diffuser, a polymerization inhibitor, or a combination thereof.
- 제11항에 있어서,According to clause 11,상기 광확산제는 황산바륨, 탄산칼슘, 이산화티타늄, 지르코니아 또는 이들의 조합을 포함하는 경화성 조성물.The light diffuser is a curable composition comprising barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.
- 제1항에 있어서, According to paragraph 1,상기 경화성 조성물은 용매를 더 포함하는 경화성 조성물.The curable composition further includes a solvent.
- 제13항에 있어서, According to clause 13,상기 경화성 조성물은, 상기 경화성 조성물 전체 중량을 기준으로, 상기 양자점 1 중량% 내지 40 중량%; 상기 중합성 화합물 1 중량% 내지 20 중량%; 및 상기 용매 40 중량% 내지 80 중량%를 포함하는 경화성 조성물.The curable composition includes 1% to 40% by weight of the quantum dots, based on the total weight of the curable composition; 1% to 20% by weight of the polymerizable compound; and 40% to 80% by weight of the solvent.
- 제1항에 있어서,According to paragraph 1,상기 경화성 조성물은 말론산; 3-아미노-1,2-프로판디올; 실란계 커플링제; 레벨링제; 불소계 계면활성제; 또는 이들의 조합을 더 포함하는 경화성 조성물.The curable composition includes malonic acid; 3-amino-1,2-propanediol; Silane-based coupling agent; leveling agent; Fluorine-based surfactant; Or a curable composition further comprising a combination thereof.
- 제1항 내지 제15항 중 어느 한 항에 따른 경화성 조성물을 이용하여 제조된 경화막.A cured film manufactured using the curable composition according to any one of claims 1 to 15.
- 제16항에 있어서,According to clause 16,상기 경화막은 50% 내지 55%의 난반사율을 가지는 경화막.The cured film is a cured film having a diffuse reflectance of 50% to 55%.
- 제16항의 경화막을 포함하는 컬러필터.A color filter comprising the cured film of claim 16.
- 제18항의 컬러필터를 포함하는 디스플레이 장치.A display device including the color filter of claim 18.
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KR20200095988A (en) * | 2019-02-01 | 2020-08-11 | 삼성에스디아이 주식회사 | Non-solvent type curable composition, curing layer using the same, color filter including the curing layer, display device and manufacturing method of the curing layer |
KR20200105052A (en) * | 2019-02-28 | 2020-09-07 | 동우 화인켐 주식회사 | Light Conversion Ink Composition, Color Filter and Display Device |
KR20210005821A (en) * | 2013-06-24 | 2021-01-15 | 제이에스알 가부시끼가이샤 | Curable resin composition, cured film, wavelength conversion film, method for forming light emitting layer, and light emitting display device |
KR20220036675A (en) * | 2020-09-16 | 2022-03-23 | 삼성에스디아이 주식회사 | Curable composition, cured layer using the composition and color filter including the cured layer |
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KR101937665B1 (en) * | 2018-11-15 | 2019-01-11 | 주식회사 신아티앤씨 | Composition for forming a quantum dot layer, Quantum dot film, Backlight unit, and Liquid crystal display |
KR20200095988A (en) * | 2019-02-01 | 2020-08-11 | 삼성에스디아이 주식회사 | Non-solvent type curable composition, curing layer using the same, color filter including the curing layer, display device and manufacturing method of the curing layer |
KR20200105052A (en) * | 2019-02-28 | 2020-09-07 | 동우 화인켐 주식회사 | Light Conversion Ink Composition, Color Filter and Display Device |
KR20220036675A (en) * | 2020-09-16 | 2022-03-23 | 삼성에스디아이 주식회사 | Curable composition, cured layer using the composition and color filter including the cured layer |
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