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WO2023160191A9 - 扬声器模组和电子设备 - Google Patents

扬声器模组和电子设备 Download PDF

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Publication number
WO2023160191A9
WO2023160191A9 PCT/CN2022/140884 CN2022140884W WO2023160191A9 WO 2023160191 A9 WO2023160191 A9 WO 2023160191A9 CN 2022140884 W CN2022140884 W CN 2022140884W WO 2023160191 A9 WO2023160191 A9 WO 2023160191A9
Authority
WO
WIPO (PCT)
Prior art keywords
speaker module
hole
housing
damping film
speaker
Prior art date
Application number
PCT/CN2022/140884
Other languages
English (en)
French (fr)
Other versions
WO2023160191A1 (zh
Inventor
郭志豪
张皓
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22928435.1A priority Critical patent/EP4344251A4/en
Priority to US18/578,439 priority patent/US20240340577A1/en
Publication of WO2023160191A1 publication Critical patent/WO2023160191A1/zh
Publication of WO2023160191A9 publication Critical patent/WO2023160191A9/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/283—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm
    • H04R1/2834—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact

Definitions

  • the present application relates to the field of speaker technology, and in particular, to a speaker module and electronic equipment.
  • speaker modules are mainly used to convert electrical energy into sound energy to achieve sound production.
  • the audio performance of existing speaker modules is poor and it is difficult to meet users' audio performance requirements for speaker modules.
  • This application provides a speaker module and electronic equipment to improve the audio performance of the speaker module and meet the user's requirements for the audio performance of the speaker module.
  • this application provides a speaker module, which includes a shell, a vibration component and a damping film.
  • the vibration component is installed inside the shell.
  • the vibration component divides the inside of the shell into a front cavity and a rear cavity.
  • the shell is provided with a through hole.
  • the through hole connects the front cavity and the rear cavity, and the damping film is installed inside the shell and covers the through hole;
  • the elastic modulus of the damping film is smaller than the elastic modulus of the vibration component.
  • a damping film is added. Since the elastic modulus of the damping film is smaller than the elastic modulus of the vibrating component, when the speaker module is working, the damping film can buffer the deformation of the diaphragm caused by changes in the air pressure in the rear cavity. Or rocking phenomenon, reduce the noise generated by the speaker module, improve the sound quality of the speaker module, improve the audio performance of the speaker module, and meet the user's requirements for the audio performance of the speaker module.
  • the housing includes a main housing and a partition.
  • the partition is fixedly connected to the inside of the main housing.
  • the partition is provided with mounting holes and through holes.
  • the mounting holes and through holes penetrate the partition along the thickness direction of the partition.
  • the mounting holes and through holes are arranged at intervals, the vibration component and the damping film are installed on the partition, and the vibration component covers the mounting hole.
  • the material of the damping film includes one or more of polycarbonate, acrylate, polylactic acid and nitrile.
  • the effective area of the vibration component is S 1
  • the effective area of the damping film is S 2
  • the effective vibration volume of the vibration component in the rear cavity is V 1
  • the effective vibration volume of the damping film in the rear cavity is V 2.
  • a 1 is the amplitude of the vibration component 21
  • a 2 is the maximum amplitude of the damping film 30
  • ⁇ is the compensation coefficient
  • the damping film includes multiple sub-damping films.
  • Each sub-damping film is installed on the inside of the housing and covers one through hole.
  • the housing is provided with a sound hole, and the sound hole connects the front cavity and the outside of the housing.
  • the sound generated by the speaker module during operation can be transmitted to the outside of the housing through the sound hole, thereby realizing the sound generation of the speaker module.
  • the housing is provided with a leakage hole, and the leakage hole communicates with the rear chamber and the outside of the housing to ensure air pressure balance between the rear chamber and the outside of the housing.
  • the speaker module is a dynamic speaker module.
  • the speaker module also includes a support component and a magnet component.
  • the support component supports the vibration component and the magnet component.
  • the magnet component is used to provide a driving magnetic field for the vibration component, or,
  • the speaker module is a moving iron speaker module.
  • the application provides an electronic device, including a housing and any one of the above speaker modules.
  • the housing is provided with a speaker hole.
  • the speaker hole connects the inside and outside of the housing.
  • the speaker module is installed on the housing. On the inside, the sound hole of the speaker module is connected to the sound hole.
  • the electronic device further includes a processor, which is installed inside the housing and is electrically connected to the speaker module.
  • a damping film is added to the speaker module.
  • the elastic modulus of the damping film is smaller than the elastic modulus of the vibrating component.
  • the damping film can buffer the diaphragm caused by changes in the air pressure in the rear cavity. Deformation or swaying occurs, reducing the noise generated by the speaker module, improving the sound quality of the speaker module, improving the audio performance of the speaker module, and meeting the user's audio performance requirements for the speaker module.
  • Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG 2 is a schematic structural diagram of the speaker module in the electronic device shown in Figure 1;
  • Figure 3 is a partially exploded structural diagram of the speaker module shown in Figure 2;
  • Figure 4 is a schematic structural diagram of the speaker module shown in Figure 2 cut along I-I;
  • Figure 5 is a high-order harmonic distortion curve diagram under normal power of the existing speaker module and the speaker module shown in the embodiment of the present application;
  • Figure 6 is a high-order harmonic distortion curve diagram under high power of the existing speaker module and the speaker module shown in the embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of an electronic device 1000 provided by an embodiment of the present application.
  • the electronic device 1000 can be a mobile phone, a tablet computer, a laptop, a car, a smart watch, a smart bracelet, a POS machine (point of sales terminal, point of sale terminal) and other electronic products with sound functions.
  • the embodiment of the present application will be described by taking the electronic device 1000 as a mobile phone as an example.
  • the width direction of the electronic device 1000 is defined as the X-axis direction
  • the length direction of the electronic device 1000 is defined as the Y-axis direction
  • the thickness direction of the electronic device 1000 is defined as the Z-axis direction
  • the X-axis direction, the Y-axis direction and the Z-axis direction The directions are perpendicular to each other.
  • the electronic device 1000 includes a housing 100, a display module 200, a circuit board 300, a processor 400, an earpiece 500 and a speaker module 600.
  • the display module 200 is installed on the housing 100 .
  • the circuit board 300, the processor 400, the earpiece 500 and the speaker module 600 are all installed inside the housing 100.
  • the housing 100 includes a frame 110 and a bottom plate 120 .
  • the bottom plate 120 is fixedly connected to one side of the frame 110 .
  • the frame 110 and the bottom plate 120 may be an integral structure, or may be an integral structure formed by assembly.
  • the frame 110 is provided with a speaker hole 1001 , and the speaker hole 1001 communicates with the inside and outside of the housing 100 .
  • the number of speaker holes 1001 is one.
  • the bottom plate 120 may also be provided with a speaker hole 1001, or the frame 110 and the bottom plate 120 may be enclosed together to form a speaker hole 1001. This application does not specifically limit the formation method of the speaker hole 1001.
  • the display module 200 is installed on the side of the frame 110 away from the base plate 120 . That is, the display module 200 and the bottom panel 120 are respectively located on opposite sides of the frame 110 . When the user is holding the electronic device 1000, the display module 200 faces the user and the base plate 120 faces away from the user.
  • the display module 200 includes a display panel and a cover. The cover is fixed on the frame 110 of the casing 100 , and the display panel is fixed on the inner surface of the cover facing the casing 100 . The cover is used to protect the display panel, and the display panel is used to display image information. In addition, the display panel can also integrate touch functionality.
  • the display module 200 is provided with an earpiece hole 2001, and the earpiece hole 2001 penetrates the display module 200 along the thickness direction of the display module 200 (in the Z-axis direction in the figure).
  • the earpiece hole 2001 communicates with the inside and outside of the housing 100 .
  • the housing 100 may also be provided with an earpiece hole 2001.
  • the earpiece hole 2001 is provided at the top area of the frame 110 of the housing 100, or the display module 200 and the housing 100 are enclosed to form an earpiece hole.
  • an earpiece hole 2001 is formed between the top edge of the display module 200 and the top edge of the frame 110 of the housing 100. This application does not specifically limit the formation method of the earpiece hole 2001.
  • the processor 400 is installed on the circuit board 300 and is electrically connected to the circuit board 300 .
  • the circuit board 300 can be the main board of the electronic device 1000
  • the processor 400 can be the CPU (central processing unit, central processing unit) of the electronic device 1000.
  • the earpiece 500 may be located on the top of the housing 100 and be electrically connected to the processor 400 .
  • the earpiece 500 can receive the audio signal sent by the processor 400 and vibrate to produce sound according to the audio signal.
  • the sound is diffused into the external environment through the earpiece hole 2001 to realize the sound generation of the electronic device 1000 .
  • the speaker module 600 may be located at the bottom of the housing 100 and is electrically connected to the processor 400 .
  • the speaker module 600 can receive the audio signal sent by the processor 400 and vibrate to produce sound according to the audio signal.
  • the sound is diffused to the external environment through the speaker hole 1001 to realize the sound production of the electronic device 1000.
  • both the earpiece 500 and the speaker module 600 may adopt the speaker module described in the embodiments below.
  • the earpiece 500 may adopt a speaker module with other structures.
  • the speaker module 600 may adopt a speaker module described in the embodiments below, or the earpiece 500 may adopt a speaker module described in the embodiments below.
  • the speaker module 600 may be a speaker module with other structures.
  • top refers to the negative direction of the Y-axis as “bottom”. It does not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. .
  • the vibration component when the existing speaker module is working, the vibration component will vibrate, causing the air pressure in the rear cavity of the speaker module to change. Since the front cavity of the speaker module is in an open state, the air pressure change rate of the front cavity will be smaller than the change rate of the rear cavity, causing the diaphragm of the vibrating component to deform or swing, causing the speaker module to produce noise during operation, affecting the speaker. Audio performance of the module.
  • the structure of the speaker module 600 shown in the embodiment of the present application will be described.
  • Figure 2 is a schematic structural diagram of the speaker module 600 in the electronic device 1000 shown in Figure 1.
  • Figure 3 is a partially exploded structural diagram of the speaker module 600 shown in Figure 2.
  • Figure 4 is FIG. 2 shows a schematic structural diagram of the speaker module 600 cut along the line I-I.
  • cutting along I-I refers to cutting along the plane where line I-I lies.
  • the length direction of the speaker module 600 is the X-axis direction in the figure
  • the width direction of the speaker module 600 is the Y-axis direction in the figure
  • the thickness direction of the speaker module 600 is the Z-axis direction in the figure.
  • the speaker module 600 includes a shell 10, a speaker core 20, a damping film 30 and a connecting plate (not shown).
  • the speaker core 20 is installed on the inside of the housing 10 and divides the inside of the housing 10 into a front cavity 601 and a rear cavity 602 .
  • Speaker core 20 converts electrical signals into acoustic signals.
  • the housing 10 is provided with a through hole 101, which communicates the front cavity 601 and the rear cavity 602.
  • the damping film 30 is installed inside the housing 10 and covers the through hole 101 .
  • the connection board may be a circuit board.
  • One end of the connecting plate is located inside the housing 10 and is electrically connected to the speaker core 20 .
  • the other end of the connecting board is located outside the housing 10 to electrically connect external components of the speaker module 600 .
  • the other end of the connection board may be electrically connected to the processor 400 (as shown in FIG. 1 ).
  • the housing 10 is also provided with a sound outlet 102 and a leakage hole 103.
  • the sound hole 102 communicates with the front cavity 601 and the outside of the housing 10 .
  • the sound emitted by the speaker core 20 can be transmitted to the outside of the housing 10 through the sound hole 102 .
  • the speaker hole 1001 of the housing 100 communicates with the sound outlet 102 and the outside of the electronic device 1000 .
  • the sound emitted by the speaker core 20 can be transmitted to the outside of the electronic device 1000 through the sound hole 102 and the speaker hole 1001 in sequence.
  • the leak hole 103 communicates with the rear chamber 602 and the outside of the housing 10 to ensure the air pressure balance between the rear chamber 602 and the outside of the housing 10 .
  • the housing 10 includes a main housing 11 , an upper cover 12 , a lower cover 13 and a partition 14 .
  • the upper cover 12 is installed on the upper surface of the main housing 11, and the lower cover 13 is installed on the lower surface of the main housing 11.
  • the upper cover 12, the lower cover 13 and the main housing 11 together form a receiving cavity 603 ( That is, the inside of the housing 10).
  • the partition 14 is installed in the receiving cavity 603 and divides the receiving cavity 603 into a first receiving cavity 604 and a second receiving cavity 605 .
  • the housing 10 may also include an upper shell and a lower shell. The upper shell and the lower shell are fixedly connected to each other to enclose the receiving cavity 603. This application does not impose specific limitations on the formation method of the receiving cavity 603.
  • the main housing 11 is provided with a sound hole 102 , and the sound hole 102 communicates with the first receiving cavity 604 and the outside of the housing 10 .
  • the lower cover 13 is provided with a leakage hole 103 , and the leakage hole 103 communicates with the second receiving cavity 605 and the outside of the housing 10 .
  • the partition 14 is provided with a through hole 101 and a mounting hole 104.
  • the through hole 101 and the mounting hole 104 are both connected to the first receiving cavity 604 and the second receiving cavity 605. Among them, the through holes 101 and the mounting holes 104 are spaced apart. Exemplarily, both the through hole 101 and the mounting hole 104 are rectangular. In some other embodiments, the through hole 101 and/or the mounting hole 104 may also be circular or other special shapes.
  • the speaker core 20 is installed on the partition 14 and covers the installation hole 104 .
  • the speaker core 20 includes a vibration component 21 installed on the partition 14 and covering the mounting hole 104 .
  • the vibration component 21 is installed on the lower surface of the partition 14 .
  • the vibration component 21 is installed on the lower surface of the partition 14 through a first glue layer (not shown).
  • the vibration assembly 21, the main shell 11, the upper cover 12 and the partition 14 are enclosed to form a front cavity 601 (i.e. the first receiving cavity 604).
  • the vibration assembly 21, the main shell 11, the lower cover 13 and the partition 14 are enclosed to form The rear cavity 602 (ie, the second receiving cavity 605).
  • the speaker module 600 is a dynamic speaker module.
  • the speaker core 20 is a dynamic speaker.
  • the vibration component 21 includes a diaphragm 22, a dome 23 and a voice coil 24.
  • the dome 23 is installed on the upper surface of the diaphragm 22, and the voice coil is installed on the lower surface of the diaphragm 22.
  • the speaker core 20 also includes a support component and a magnetic circuit component. The support component supports the vibration component 21 , and the magnetic circuit component provides a driving magnetic field for the vibration component 21 .
  • the speaker module 600 may also be a moving iron speaker module. At this time, the speaker core 20 is a moving iron speaker.
  • the damping membrane 30 is installed on the partition 14 and is spaced apart from the speaker core 20 .
  • the damping film 30 is installed on the upper surface of the partition 14 .
  • the damping film 30 is installed on the upper surface of the partition 14 through a second glue layer (not shown).
  • the elastic modulus of the damping film 30 is smaller than the elastic modulus of the vibration component 21 .
  • the material of the damping film 30 includes one or more of polycarbonate (PC, polycarbonate), acrylic ester (acrylic ester), polylactic acid (PLA, polylactic acid), and nitrile (butyronitrile).
  • the damping film 30 is not limited to the rectangular shape shown in FIG. 3 , and may also be circular or special-shaped. In some other embodiments, there may be multiple through holes 101 , and the plurality of through holes 101 are spaced apart from each other.
  • the damping film 30 may also include multiple sub-damping films, each sub-damping film is installed on the partition 14 and covers a through hole 101, which is not specifically limited in this application.
  • the effective area of the vibration component 21 is S 1
  • the effective area of the damping film 30 is S 2
  • the effective vibration volume of the vibration component 21 in the back cavity 602 is V 1
  • the damping film 30 is in the back cavity 602 .
  • the effective vibration volume is V 2 .
  • the effective area S 1 of the vibration component 21 , the effective area S 2 of the damping film 30 , the effective vibration volume V 1 of the vibration component 21 in the rear cavity 602 and the effective vibration volume V 2 of the damping film 30 in the rear cavity 602 Relationship Satisfaction:
  • a 1 is the amplitude of the vibration component 21
  • a 2 is the maximum amplitude of the damping film 30
  • ⁇ is the compensation coefficient
  • ⁇ is generally between 3.0 and 5.0.
  • the specific value of ⁇ will also be adjusted based on the back cavity heating effect and the ideal gas formula.
  • the multiple components of the vibration assembly 21 can be divided into first type components and second type components.
  • the first type of components such as the diaphragm
  • the second type of components Such components (such as voice coils) cannot reflect the sound waves from the front cavity 601 to the outside of the housing 10 .
  • the effective area S 1 of the vibration component 21 refers to the sum of the areas of the first type of components.
  • the damping film 30 includes a fixed part and an elastic part.
  • the fixed part refers to the part of the damping film 30 that is fixed to the partition 14 .
  • the elastic part refers to the other parts of the damping film 30 excluding the fixed part.
  • the effective area S 2 of the damping film 30 refers to The area of the elastic part.
  • the gas in the back cavity 602 flows smoothly in the back cavity 602 , and the effective vibration volume V 1 of the vibration component 21 in the back cavity 602 and the damping film 30 are in the back cavity 602
  • the effective vibration volumes V 2 in are equal and both are the volume of the back cavity 602 .
  • V 1 is the volume of the unobstructed space below the vibration component 21
  • V 2 is The volume of the unobstructed space below the damping membrane 30.
  • P the gas pressure
  • V the gas volume
  • T the temperature
  • n the amount of gas substance
  • R the molar gas constant
  • the vibration component 21 vibrates to the rear cavity 602
  • the volume of the rear cavity 602 decreases, and the air pressure increases.
  • the vibration component 21 vibrates to the front cavity 601
  • the volume of the rear cavity 602 increases.
  • the air pressure drops.
  • the air pressure change amount ⁇ P 1 of the rear chamber 602 is mainly affected by the volume change generated when the vibration component 21 vibrates.
  • the damping film 30 can form a dynamic air pressure compensation, fully buffering the deformation and swing of the diaphragm 22 caused by air pressure changes.
  • the noise generated when the speaker module 600 is working can be reduced and the sound quality of the speaker module 600 can be improved.
  • the temperature of the rear cavity 602 will also increase, thereby causing the air pressure of the rear cavity 602 to increase.
  • the air pressure change amount of the back chamber 602 is ⁇ P 2 , which is mainly affected by the volume change caused by the temperature increase.
  • the damping film 30 can form a stable air pressure compensation and can participate in advance to buffer the deformation and swing of the diaphragm 22 caused by air pressure changes. This phenomenon can reduce the noise generated when the speaker module 600 is working and improve the sound quality of the speaker module 600 .
  • the damping film 30 can passively adjust the front cavity 601 and the rear cavity.
  • the volume ratio of the cavity 602 helps to increase the low-frequency dive capability of the speaker module 600, reduce harmonic distortion noise caused by deformation or swing of the diaphragm 22 under large amplitude conditions, and improve the audio performance of the speaker module 600.
  • Figure 5 shows the high-order harmonic distortion (HOHD, HO harmonic distortion) of the existing speaker module and the speaker module shown in the embodiment of the present application under normal power (NP, normal power).
  • Figure 6 is a graph of high-order harmonic distortion of the existing speaker module and the speaker module shown in the embodiment of the present application under high power (HP, high power).
  • the abscissa of the high-order harmonic distortion curves shown in Figures 5 and 6 is the sound wave frequency (unit Hz), and the ordinate is the high-order harmonic distortion coefficient.
  • the gray line is the high-order harmonic distortion curve of the existing speaker module
  • the black line is the high-order harmonic distortion curve of the speaker module shown in the embodiment of the present application.
  • the speaker module 600 shown in the embodiment of the present application has a significantly smaller distortion coefficient below 200 Hz, and the sound quality produced by the speaker module 600 is better.
  • a damping film 30 is added to the speaker module 600.
  • the elastic modulus of the damping film 30 is smaller than the elastic modulus of the vibration component 21.
  • the damping film 30 can buffer The diaphragm 22 deforms or swings due to the change in air pressure in the rear cavity 602, which reduces the noise generated by the speaker module 600, improves the sound quality of the speaker module 600, improves the audio performance of the speaker module 600, and satisfies the user's requirements for the speaker module 600. audio performance requirements.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
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Abstract

本申请提供一种扬声器模组和电子设备，电子设备包括扬声器模组。扬声器模组包括外壳、振动组件和阻尼膜，振动组件安装于外壳的内部，振动组件将外壳的内部分隔为前腔和后腔，外壳设有通孔，通孔连通前腔和后腔，阻尼膜安装于外壳的内部，且覆盖通孔。其中，阻尼膜的弹性模量小于振动组件的弹性模量。本申请所示扬声器模组中，增设了阻尼膜，由于阻尼膜的弹性模量小于振动组件的弹性模量，扬声器模组工作时，阻尼膜可缓冲因后腔气压变化导致的振膜发生变形或摇摆现象，减少扬声器模组产生的杂音，提高扬声器模组的音质，提高扬声器模组的音频性能，满足用户对扬声器模组音频性能的要求。

Description

扬声器模组和电子设备
本申请要求于2022年02月24日提交中国专利局、申请号为202210177035.7、申请名称为“扬声器模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及扬声器技术领域，尤其涉及一种扬声器模组和电子设备。
背景技术
随着手机等电子设备的普及率不断提高，电子设备更新换代的速度也越来越快，用户对电子设备的要求也越来越高。目前的电子设备中，主要利用扬声器模组来将电能转变为声能以实现发声。然而，现有的扬声器模组的音频性能较差，难以满足用户对扬声器模组音频性能的要求。
发明内容
本申请提供一种扬声器模组和电子设备，用以提高扬声器模组的音频性能，满足用户对扬声器模组音频性能的要求。
第一方面，本申请提供一种扬声器模组，包括外壳、振动组件和阻尼膜，振动组件安装于外壳的内部，振动组件将外壳的内部分隔为前腔和后腔，外壳设有通孔，通孔连通前腔和后腔，阻尼膜安装于外壳的内部，且覆盖通孔；
其中，阻尼膜的弹性模量小于振动组件的弹性模量。
本申请所示扬声器模组中，增设了阻尼膜，由于阻尼膜的弹性模量小于振动组件的弹性模量，扬声器模组工作时，阻尼膜可缓冲因后腔气压变化导致的振膜发生变形或摇摆现象，减少扬声器模组产生的杂音，提高扬声器模组的音质，提高扬声器模组的音频性能，满足用户对扬声器模组音频性能的要求。
一种实施方式中，外壳包括主外壳和隔板，隔板固定连接于主外壳的内部，隔板设有安装孔和通孔，安装孔和通孔均沿隔板的厚度方向贯穿隔板，安装孔和通孔间隔设置，振动组件和阻尼膜均安装于隔板，振动组件覆盖安装孔。
一种实施方式中，阻尼膜的材料包括聚碳酸酯、丙烯酸酯、聚乳酸和丁腈中的一种或多种。
一种实施方式中，振动组件的有效面积为S 1，阻尼膜的有效面积为S 2，振动组件在后腔内的有效振动容积为V 1，阻尼膜在后腔内的有效振动容积为V 2，四者之间的关系满足：
Figure PCTCN2022140884-appb-000001
其中，A 1为振动组件21的振幅，A 2为阻尼膜30的最大振幅，α为补偿系数。
一种实施方式中，通孔有多个，多个通孔间隔设置，阻尼膜包括多个子阻尼膜，每一子阻尼膜均安装于外壳的内侧，且覆盖一个通孔。
一种实施方式中，外壳设有出音孔，出音孔连通前腔和外壳的外侧，扬声器模组工作时产生的声音可经出音孔传递至外壳的外侧，实现扬声器模组的发声。
一种实施方式中，外壳设有泄露孔，泄露孔连通后腔和外壳的外侧，以保证后腔和外壳的外侧的气压平衡。
一种实施方式中，扬声器模组为动圈式扬声器模组，扬声器模组还包括支撑组件和磁铁组件，支撑组件支撑振动组件和磁铁组件，磁铁组件用于为振动组件提供驱动磁场，或者，扬声器模组为动铁式扬声器模组。
第二方面，本申请提供一种电子设备，包括壳体和上述任一种扬声器模组，壳体设有扬声孔，扬声孔连通壳体的内侧和外侧，扬声器模组安装于壳体的内侧，扬声器模组的出音孔连通扬声孔。
一种实施方式中，电子设备还包括处理器，处理器安装于壳体的内侧，且与扬声器模组电连接。
本申请所示电子设备中，扬声器模组中增设了阻尼膜，阻尼膜的弹性模量小于振动组件的弹性模量，扬声器模组工作时，阻尼膜可缓冲因后腔气压变化导致的振膜发生变形或摇摆现象，减少扬声器模组产生的杂音，提高扬声器模组的音质，提高扬声器模组的音频性能，满足用户对扬声器模组的音频性能的要求。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例所需要使用的附图进行说明。
图1是本申请实施例提供的一种电子设备的结构示意图；
图2是图1所示电子设备中扬声器模组的结构示意图；
图3是图2所示扬声器模组的部分分解结构示意图；
图4是图2所示扬声器模组沿I-I处剖开后的结构示意图；
图5是现有的扬声器模组和本申请实施例所示扬声器模组在正常功率下的高次谐波失真曲线图；
图6是现有的扬声器模组和本申请实施例所示扬声器模组在高功率下的高次谐波失真曲线图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。
请参阅图1，图1是本申请实施例提供的一种电子设备1000的结构示意图。
电子设备1000可以是手机、平板电脑、笔记本电脑、车机、智能手表、智能手环、POS机(point of sales terminal，销售点终端)等具有发声功能的电子产品。接下来，本申请实施例以电子设备1000是手机为例进行说明。其中，为了便于描述，定义电子设备1000的宽度方向为X轴方向，电子设备1000的长度方向为Y轴方向，电子设备1000的厚度方向为Z轴方向，X轴方向、Y轴方向和Z轴方向两两相互垂直。
电子设备1000包括壳体100、显示模组200、电路板300、处理器400、听筒500和扬声器模组600。显示模组200安装于壳体100。电路板300、处理器400、听筒500和扬声器模组600均安装于壳体100的内侧。
壳体100包括边框110和底板120，底板120固定连接于边框110的一侧。其中，边框110和底板120可以是一体成型的结构，也可以是通过组装形成的一体式结构。具体的，边框110设有扬声孔1001，扬声孔1001连通壳体100的内侧和外侧。示例性的，扬声孔1001的数量为一个。在其他一些实施例中，底板120也可以设有扬声孔1001，或者，边框110和底板120共同围合形成扬声孔1001，本申请对扬声孔1001的形成方式不做具体限制。
显示模组200安装于边框110背离底板120的一侧。即，显示模组200和底板120分别位于边框110的相对两侧。用户在手持使用电子设备1000时，显示模组200朝向用户，底板120背离用户。其中，显示模组200包括显示面板和盖板。盖板固定于壳体100的边框110，显示面板固定于盖板朝向壳体100的内表面。盖板用于保护显示面板，显示面板用于显示图像信息。此外，显示面板还可以集成触摸功能。
显示模组200设有听筒孔2001，听筒孔2001沿显示模组200的厚度方向(图示Z轴方向上)贯穿显示模组200。听筒孔2001连通壳体100的内侧和外侧。在其他一些实施例中，壳体100也可以设有听筒孔2001，例如壳体100中边框110的顶部区域处设有听筒孔2001，或者，显示模组200与壳体100围合形成听筒孔2001，例如显示模组200的顶部边缘与壳体100中边框110的顶部边缘之间形成听筒孔2001，本申请对听筒孔2001的形成方式不作具体限定。
处理器400安装于电路板300，且与电路板300电连接。其中，电路板300可为电子设备1000的主板(main board)，处理器400可为电子设备1000的CPU(central processing unit，中央处理器)。
听筒500可位于壳体100的顶部，且与处理器400电连接。听筒500可接收处理器400发送的音频信号，并根据音频信号振动发声，声音经听筒孔2001扩散至外界环境中，实现电子设备1000的发声。扬声器模组600可位于壳体100的底部，且与处理器400电连接。扬声器模组600可接收处理器400发送的音频信号，并根据音频信号振动发声，声音经扬声孔1001扩散至外界环境中，实现电子设备1000的发声。
本实施例中，听筒500和扬声器模组600可均采用后文实施例中描述的扬声器模组。在其他一些实施例中，听筒500可采用其他结构的扬声器模组，扬声器模组600可采用后文实施例中描述的扬声器模组，或者，听筒500可采用后文实施例中描述的扬声器模组，扬声器模组600可采用其他结构的扬声器模组。
应当理解的是，本申请中涉及的“顶”、“底”等方位用词，是参考用户手持使用电子设备1000时的方位进行描述，如附图1所示，以朝向Y轴正方向为“顶”，以朝向Y轴负方向为“底”，其并不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
需要说明的是，现有的扬声器模组在工作的过程中，振动组件会发生振动，导致扬声器模组的后腔的气压会发生变化。由于扬声器模组的前腔处于开放状态，前腔的气压变化率会小于后腔的变化率，使得振动组件的振膜会发生变形或者摇摆，导致扬声器模组在工 作时产生杂音，影响了扬声器模组的音频性能。接下来，将对本申请实施例所示扬声器模组600的结构进行描述。
请参阅图2、图3和图4，图2是图1所示电子设备1000中扬声器模组600的结构示意图，图3是图2所示扬声器模组600的部分分解结构示意图，图4是图2所示扬声器模组600沿I-I处剖开后的结构示意图。其中，沿I-I处剖开是指沿I-I线所处平面剖开。
示例性的，扬声器模组600的长度方向为图示X轴方向，扬声器模组600的宽度方向为图示Y轴方向，扬声器模组600的厚度方向为图示Z轴方向。
扬声器模组600包括外壳10、扬声器内核20、阻尼膜30和连接板(图未示)。扬声器内核20安装于外壳10的内侧，且将外壳10的内侧分隔为前腔601和后腔602。扬声器内核20可将电信号转换为声音信号。外壳10设有通孔101，通孔连通前腔601和后腔602。阻尼膜30安装于外壳10的内侧，且覆盖通孔101。连接板可为电路板。连接板的一端位于外壳10的内侧，且电连接扬声器内核20。连接板的另一端位于外壳10的外侧，以电连接扬声器模组600的外部器件。示例性，连接板的另一端可以电连接处理器400(如图1所示)。
此外，外壳10还设有出音孔102和泄露孔103。出音孔102连通前腔601和外壳10的外侧。扬声器内核20发出的声音能够经出音孔102传输至外壳10外侧。如图1所示，壳体100的扬声孔1001连通出音孔102和电子设备1000的外侧。扬声器内核20发出的声音能够依次经过出音孔102和扬声孔1001传输至电子设备1000外侧。泄露孔103连通后腔602和外壳10的外侧，以保证后腔602与外壳10的外侧的气压平衡。
本实施例中，外壳10包括主外壳11、上盖板12、下盖板13和隔板14。具体的，上盖板12安装于主外壳11的上表面，下盖板13安装于主外壳11的下表面，上盖板12、下盖板13和主外壳11共同围合形成收容腔603(即外壳10的内侧)。隔板14安装于收容腔603，且将收容腔603分隔成第一收容腔604和第二收容腔605。在其他一些实施例中，外壳10也可以包括上壳和下壳，上壳和下壳彼此固定连接，以围合形成收容腔603，本申请对收容腔603的形成方式不做具体限制。
需要说明的是，本申请中涉及的“上”、“下”等方位用词，是参考附图2所示，以朝向Z轴正方向为“上”，以朝向Z轴负方向为“下”，其并不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
主外壳11设有出音孔102，出音孔102连通第一收容腔604和外壳10的外侧。下盖板13设有泄露孔103，泄露孔103连通第二收容腔605和外壳10的外侧。隔板14设有通孔101和安装孔104，通孔101和安装孔104均连通第一收容腔604和第二收容腔605。其中，通孔101和安装孔104间隔设置。示例性的，通孔101和安装孔104均呈长方形。在其他一些实施例中，通孔101和/或安装孔104也可以呈圆形或其他异形。
扬声器内核20安装于隔板14，且覆盖安装孔104。扬声器内核20包括振动组件21，振动组件21安装于隔板14，且覆盖安装孔104。其中，振动组件21安装于隔板14的下表面。示例性的，振动组件21通过第一胶层(图未示)安装于隔板14的下表面。振动组件21、主外壳11、上盖板12和隔板14围合形成前腔601(即第一收容腔604)，振动组件21、主外壳11、下盖板13和隔板14围合形成后腔602(即第二收容腔605)。
本实施例中，扬声器模组600为动圈式扬声器模组。扬声器内核20为动圈式扬声器。振动组件21包括振膜22、球顶23和音圈24，球顶23安装于振膜22的上表面，音圈安装于振膜22的下表面。此外，扬声器内核20还包括支撑组件和磁路组件，支撑组件支撑振动组件21，磁路组件为振动组件21提供驱动磁场。在其他一些实施例中，扬声器模组600也可以为动铁式扬声器模组。此时，扬声器内核20为动铁式扬声器。
阻尼膜30安装于隔板14，且与扬声器内核20间隔设置。具体的，阻尼膜30安装于隔板14的上表面。示例性的，阻尼膜30通过第二胶层(图未示)安装于隔板14的上表面。其中，阻尼膜30的弹性模量小于振动组件21的弹性模量。示例性的，阻尼膜30的材料包括聚碳酸酯(PC，polycarbonate)、丙烯酸酯(acrylic ester)、聚乳酸(PLA，polylactic acid)和丁腈(butyronitrile)等材料中的一种或多种。
应当理解的是，阻尼膜30并不仅限于图3所示的长方形，也可以为圆形或异形。在其他一些实施例中，通孔101也可以为多个，多个通孔101彼此间隔。阻尼膜30也可以包括多个子阻尼膜，每一子阻尼膜均安装于隔板14，且覆盖一个通孔101，本申请对此不做具体限定。
本实施例中，振动组件21的有效面积为S 1，阻尼膜30的有效面积为S 2，振动组件21在后腔602中的有效振动容积为V 1，阻尼膜30在后腔602内的有效振动容积为V 2。振动组件21的有效面积S 1、阻尼膜30的有效面积S 2、振动组件21在后腔602内的有效振动容积V 1和阻尼膜30在后腔602内的有效振动容积V 2之间的关系满足：
Figure PCTCN2022140884-appb-000002
其中，A 1为振动组件21的振幅，A 2为阻尼膜30的最大振幅，α为补偿系数，α一般在3.0至5.0之间。此外，α的具体数值还同时会结合后腔发热效应和理想气体公式进行调整。
应当理解的是，振动组件21的多个部件可分为第一类部件和第二类部件，第一类部件(比如振膜)能够将前腔601的声波反射至外壳10的外侧，第二类部件(比如音圈)无法将前腔601的声波反射至外壳10的外侧，振动组件21的有效面积S 1是指第一类部件的面积之和。
阻尼膜30包括固定部分和弹性部分，固定部分是指阻尼膜30中与隔板14固定的部分，弹性部分是阻尼膜30中除去固定部分的其他部分，阻尼膜30的有效面积S 2是指弹性部分的面积。
需要说明的是，当后腔602的结构规整时，后腔602内的气体在后腔602内流动顺畅，振动组件21在后腔602内的有效振动容积V 1和阻尼膜30在后腔602内的有效振动容积V 2相等，且均为后腔602的容积。而当后腔602结构不规整，比如后腔602的结构呈狭长或者异形，会导致后腔602内的气体在后腔602内因流道狭窄等原因而流动不流畅，从而导致振动组件21和阻尼膜30所处位置气体流动不顺畅，使得后腔602内热量和气体流动会产生延时性，降低阻尼膜30的灵敏度，此时V 1为振动组件21下方无障碍空间的容积，V 2为阻尼膜30下方无障碍空间的容积。
接下来，将后腔602内的气体看成理想气体来对阻尼膜30的工作原理进行说明。其中， 理想气体公式为PV＝nRT，P为气压，V为气体体积，T为温度，n为气体的物质的量，R为摩尔气体常数。依据理想气体公式可知，气压P的变化与气体体积V和温度T均相关。
在常温环境下，扬声器模组600工作时，振动组件21向后腔602振动时，后腔602的体积减小，则气压上升，振动组件21向前腔601振动时，后腔602的体积增加，则气压下降。此时，后腔602的气压变化量ΔP 1，主要由振动组件21振动时产生的体积变化影响。
在扬声器模组600工作时，由于阻尼膜30的弹性模量小于振动组件21的弹性模量，阻尼膜30可形成动态的气压补偿，充分缓冲气压变化导致振膜22产生的变形和摇摆现象，可减少扬声器模组600工作时产生的杂音，提高扬声器模组600的音质。
在低温环境下，扬声器模组600工作时，后腔602的温度也会升高，由此导致后腔602的气压上升。此时，后腔602的气压变化量为ΔP 2，主要由温度升高产生的体积变化影响。
在扬声器模组600工作时，由于阻尼膜30的弹性模量小于振动组件21的弹性模量，阻尼膜30可形成稳定的气压补偿，可以提前参与缓冲气压变化导致振膜22产生的变形和摇摆现象，可减少扬声器模组600工作时产生的杂音，提高扬声器模组600的音质。
需要说明的是，随着振动组件21振幅的增大，振动组件21的振动频率下降，阻尼膜30的上下两侧受到的压力差也会增大，阻尼膜30可被动调整前腔601和后腔602的体积比例，有助于增加扬声器模组600的低频下潜能力，减少大振幅情况下振膜22发生变形或者摇摆等原因造成的谐波失真噪音，提高扬声器模组600的音频性能。
请参阅图5和图6，图5是现有的扬声器模组与本申请实施例所示扬声器模组在正常功率(NP，normal power)下的高次谐波失真(HOHD，HO harmonic distortion)曲线图，图6现有的扬声器模组与本申请实施例所示扬声器模组在高功率(HP，high power)下的高次谐波失真曲线图。
其中，图5和图6所示高次谐波失真曲线图横坐标为声波频率(单位Hz)，纵坐标为高次谐波失真系数。图5和图6中，灰色线条为现有扬声器模组的高次谐波失真曲线，黑色线条为本申请实施例所示扬声器模组的高次谐波失真曲线。
由图5和图6可知，本申请实施例所示扬声器模组600在200Hz以下明显失真系数更小，扬声器模组600产生的音质更佳。
本申请实施例所示电子设备1000中，扬声器模组600中增设了阻尼膜30，阻尼膜30的弹性模量小于振动组件21的弹性模量，扬声器模组600工作时，阻尼膜30可缓冲因后腔602气压变化导致的振膜22发生变形或摇摆现象，减少扬声器模组600产生的杂音，提高扬声器模组600的音质，提高扬声器模组600的音频性能，满足用户对扬声器模组600的音频性能的要求。
以上描述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内；在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括外壳、振动组件和阻尼膜，所述振动组件安装于所述外壳的内部，所述振动组件将所述外壳的内部分隔为前腔和后腔，所述外壳设有通孔，所述通孔连通所述前腔和所述后腔，所述阻尼膜安装于所述外壳的内部，且覆盖所述通孔；
    其中，所述阻尼膜的弹性模量小于所述振动组件的弹性模量。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述外壳包括主外壳和隔板，所述隔板安装于所述主外壳的内侧，所述隔板设有安装孔和所述通孔，所述安装孔和所述通孔均沿所述隔板的厚度方向贯穿所述隔板，所述安装孔和所述通孔间隔设置，所述振动组件和所述阻尼膜均安装于所述隔板，所述振动组件覆盖所述安装孔。
  3. 根据权利要求1或2所述的扬声器模组，其特征在于，所述阻尼膜的材料包括聚碳酸酯、丙烯酸酯、聚乳酸和丁腈中的一种或多种。
  4. 根据权利要求1或2所述的扬声器模组，其特征在于，所述振动组件的有效面积为S 1，所述阻尼膜的有效面积为S 2，所述振动组件在所述后腔内的有效振动容积为V 1，所述阻尼膜在所述后腔内的有效振动容积为V 2，四者之间的关系满足：
    Figure PCTCN2022140884-appb-100001
    其中，A 1为振动组件21的振幅，A 2为阻尼膜30的最大振幅，α为补偿系数。
  5. 根据权利要求1所述的扬声器模组，其特征在于，所述通孔有多个，多个所述通孔间隔设置，所述阻尼膜包括多个子阻尼膜，每一所述子阻尼膜均安装于所述外壳的内侧，且覆盖一个所述通孔。
  6. 根据权利要求1所述的扬声器模组，其特征在于，所述外壳设有出音孔，所述出音孔连通所述前腔和所述外壳的外侧。
  7. 根据权利要求1所述的扬声器模组，其特征在于，所述外壳设有泄露孔，所述泄露孔连通所述后腔和所述外壳的外侧。
  8. 根据权利要求1所述的扬声器模组，其特征在于，所述扬声器模组为动圈式扬声器模组，所述扬声器模组还包括支撑组件和磁铁组件，所述支撑组件支撑所述振动组件和所述磁铁组件，所述磁铁组件用于为所述振动组件提供驱动磁场，或者，所述扬声器模组为动铁式扬声器模组。
  9. 一种电子设备，其特征在于，包括壳体和如权利要求1至8中任一项所述的扬声器模组，所述壳体设有扬声孔，所述扬声孔连通所述壳体的内侧和外侧，所述扬声器模组安装于所述壳体的内侧，所述扬声器模组的出音孔连通所述扬声孔。
  10. 根据权利要求9所述的电子设备，其特征在于，所述电子设备还包括处理器，所述处理器安装于所述壳体的内侧，且与所述扬声器模组电连接。
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