WO2022117834A1

WO2022117834A1 - Electronic module and associated production method

Info

Publication number: WO2022117834A1
Application number: PCT/EP2021/084203
Authority: WO
Inventors: Christian MAUDET; Nicolas MEILLERAIS; Pierre Guern
Original assignee: Thales
Priority date: 2020-12-03
Filing date: 2021-12-03
Publication date: 2022-06-09
Also published as: FR3117302A1; FR3117302B1; EP4256911A1

Abstract

The invention relates to an electronic module comprising a main block (101) and a protective layer (120). The main block (101) has side faces (1021, 1022). The protective layer (120) is electrically connected to the main block (101) via at least one connection portion (102, 103) present at one of the lateral faces (1021, 1022) of said main block (101).

Description

Title of the invention: Electronic module and associated manufacturing process

[0001] Technical area

The present invention relates to an electronic module and a method of manufacturing such an electronic module.

[0003] PRIOR ART

[0004] The integration of a set of functions on an electronic card requires arranging numerous electronic components and modules, the multiple and heterogeneous constraints of which make it difficult to obtain a high-performance configuration for all the functional bricks placed stakes.

[0005] The establishment of a standard functionality leads either to a constraint for the new electronic cards which will use this standard by imposing the technological choices of the original standard on the whole of the developed card, or to a degradation of the original standard to each iteration of reuse to be able to adapt it to the implementation of the other functionalities of the host card.

[0006] A standard functionality only exists in fact at the level of an electronic component, because the latter makes it possible to separate the technology necessary for the production of said component from that necessary for the production of the complete equipped electronic card.

[0007] The generation of High Density Modules seeks to concentrate several interconnected functions in the same box, which requires costly development over a multiannual time scale for each variation of functional groups. These modules incorporating metal belts and covers suffer from mechanical deformations during assembly operations on their host electronic card that must be compensated for by design in the development phases. The routing and the intrinsic layout of a product component for a standard individual functionality must neither be a constraint for the host electronic card nor degraded by it.

[0008] The development of an electronic function in a package is directly linked to the development of the chip that the package contains. The economic equilibrium of the development of a chip in package is only attainable by the volume of production demanded by the industrial market associated with a very often generic industrial need.

[0009] The development of a function more specific to the context of the electronic card is not compatible with the costs and volumes used in microelectronics. This leads to degrading the density of the electronic applications on the card to maintain a relative functional performance by associating adaptation patterns whose layout is very complex and involves increasing the technology of the printed circuit itself.

[0010] Mixed technologies of the Sip type (acronym of the Anglo-Saxon expression "Single inline Package") which combine bare chips and discrete components are reserved for markets associated with a large production volume (greater than 100,000 units per year) whose skill set is available from the system producer and requires access to bare chip supply.

[0011] It is constant to seek to resolve the question of the production of a package without access to the development or the supply of bare microelectronic chips for nominal volumes of production restricted by the market to which it responds (less than 100,000 units per year).

[0012] The heterogeneity and the increasing density of functions on an electronic card requires more and more to partition the electronic modules and to introduce mechanical elements of EMC protection (acronym of the expression Electromagnetic Compatibility) as close as possible to the functions. individual. These elements penalize the level of integration of the boards and complicate the assembly and test processes, which increases manufacturing costs.

[0013] The document FR3061404 discloses an electronic module comprising a main unit. This main block includes:

- an electronic component;

- a resin surrounding the electronic component;

- a printed circuit supporting the electronic component and electronically connected to said at least one component, said printed circuit comprising a layer n°3, a layer n°2 and a layer n°1 stacked on each other, a lower surface of the layer number 1 being intended to support all of said layers. Layer no. 1 and layer no. 2 each comprise a dielectric part and an electrically conductive part. A metallized via-type electrically conductive bridge electrically connects the two electrically conductive parts of layer no. 1 and layer no. 2. These electrically conductive parts and this electrically conductive bridge form a conductive network in the printed circuit. The main block has six faces including:

- an upper face;

- a lower face formed by the lower surface of layer no. 1;

- four side faces arranged between the upper face and the lower face.

[0014] The electronic module also comprises a protective layer adapted to reduce the electromagnetic field in the vicinity of the electronic component. This protective layer extends over the upper face of the main block and over the four side faces of this main block. The protective layer is electrically connected to the conductive network of the printed circuit by a metallized hole which passes through said printed circuit over its entire thickness. However, the presence of such a through hole can degrade the level of sensitivity to humidity of the electronic module. Indeed, the lower face of the main block not being covered by the protective layer, a rise in humidity, for example in the form of vapour, is possible along this through hole. In addition, the through hole is bordered by conductive tabs which come up on the upper face of the main block. These tabs come to create protrusions on this upper face. However, these protuberances can ultimately interfere with the adhesion of the protective layer to the upper face of the main block. In addition, it is necessary to reserve a particular space in the electronic module for the passage of the through hole, which brings an additional constraint in the dimensioning of this module.

[0015] There is therefore a need to improve the EMC protection of the electronic module while maintaining optimal moisture sealing.

[0016] Disclosure of the invention

The present invention aims to at least partially remedy this need. More particularly, the present invention aims to improve the design of an electronic module for an electronic card.

A first object of the invention relates to an electronic module comprising: - a main block comprising:

- at least one electronic component;

- A resin surrounding, at least in part, said electronic component;

- a printed circuit supporting said electronic component and electrically connected to said component, said printed circuit comprising a plurality of layers stacked on top of each other, a lower surface of a last layer being intended to support all of said layers, all or part layers comprising at least one dielectric part and at least one electrically conductive part;

- a plurality of electrically conductive bridges, each bridge electrically connecting two electrically conductive parts of two layers which follow one another in the printed circuit, the plurality of electrically conductive bridges and the electrically conductive parts of the different layers forming a conductive network in the printed circuit; said main block comprising six faces including:

- an upper face;

- a lower face formed by the lower surface of the last layer of the printed circuit;

- four side faces arranged between the upper face to the lower face; said electronic module comprising a protective layer adapted to reduce the electromagnetic field in the vicinity of the electronic component, said protective layer extending over the upper face of the main block and over the four side faces of said main block. The electronic module comprises at least one connection part, said connection part being adapted to electrically connect the protective layer to the conductive network of the printed circuit at the level of a side face of the main block.

[0020] Thus, the EMC shielding of the electronic module is improved and the interconnection between the conductive network internal to the printed circuit and the external protective layer is facilitated. Furthermore, this interconnection between the layer of external protection and the conductive network being inside the printed circuit, the risks of rising damp in the electronic module are limited.

In a particular embodiment, the electronic module comprises several connection parts respectively present at one or more side faces of the main block.

In a particular embodiment, the protective layer has a thickness greater than or equal to 5 μm and less than or equal to 1 mm.

In a particular embodiment, the electronic module comprises at least one counterbore extending into the resin in line with the electronic component.

[0024] Countersinking makes it possible to increase thermal conduction around the electronic component. The heat given off by this component during its operation is then more easily evacuated.

In a particular embodiment, the electronic module comprises at least one electrically insulating inorganic material capable of limiting rising damp in the main block.

Another object of the invention relates to a method of manufacturing an electronic module. This process includes the following steps:

- a step of assembling at least one electronic component on a printed circuit, said component being electrically connected to said printed circuit, said printed circuit comprising a plurality of layers stacked on top of each other, a bottom surface of a last layer being intended to support all of said layers, all or part of the layers of the printed circuit comprising at least one dielectric part and at least one electrically conductive part, said printed circuit comprising a plurality of electrically conductive bridges, each bridge electrically connecting two electrically conductive parts conductors of two layers which follow each other in the printed circuit, the plurality of bridges electrically conductive and the electrically conductive parts of the different layers forming a conductive network in the printed circuit;

- a step of applying a resin to surround, at least in part, the electronic component;

- a first step of sawing the resin and the printed circuit to form, at least in part, a main block of the electronic module, said main block comprising six faces including:

- an upper face;

- four side faces arranged between the upper face and the lower face;

- a step of applying a protective layer to the main block of the electronic module, said protective layer being adapted to reduce the electromagnetic field in the vicinity of the electronic component, said protective layer extending over the upper face of the module electric and on the four side faces of said module. The electronic module comprises at least one connection part, said connection part being adapted to electrically connect the protective layer to the conductive network of the printed circuit at the level of a side face of the main block.

In a particular embodiment, the first sawing step comprises the production of at least one counterbore extending into the resin in line with the electronic component.

[0028] In a particular embodiment, the resin is applied to a peelable varnish present on the lower surface of the last layer.

In a particular embodiment, the method comprises, following the step of applying the protective layer, a second sawing step to form the electronic module. In a particular embodiment, the method comprises a step of removing the peelable varnish and the associated resin.

Another object of the invention relates to an electronic card comprising at least one electronic module according to one of the preceding objects.

The present invention will be better understood on reading the detailed description of embodiments taken by way of non-limiting examples and illustrated by the appended drawings in which:

[0033] [Fig 1] Figure 1 is a sectional view of an electronic module according to the invention;

[0034] [Fig 2] Figure 2 is a partial sectional view of the electronic module of Figure 1;

[0035] [Fig 3] Figure 3 is a partial sectional view of an electronic module according to a first embodiment of the invention;

[0036] [Fig 4] Figure 4 is a partial sectional view of an electronic module according to a second embodiment of the invention;

[0037] [Fig 5] Figure 5 is a sectional view of a plate comprising a plurality of electronic components in a first step of a method of manufacturing the electronic module of Figure 1;

[0038] [Fig 6] Figure 6 is the sectional view of the plate of Figure 5 in a second step of the manufacturing process of the electronic module of Figure 1;

[0039] [Fig 7] Figure 7 is the sectional view of the plate of Figure 5 in a third step of the manufacturing process of the electronic module of Figure 1;

[0040] [Fig 8] Figure 8 is the sectional view of the plate of Figure 5 in a fourth step of the manufacturing process of the electronic module of Figure 1;

[0041] [Fig 9] Figure 9 is the sectional view of the plate of Figure 5 in a fifth step of the manufacturing process of the electronic module of Figure 1;

[0042] [Fig 10] Figure 10 is the sectional view of the plate of Figure 5 in a sixth step of the method of manufacturing the electronic module of Figure 1. [0043] [Fig 11] Figure 1 1 is a timing diagram illustrating the sequence of the various stages of the manufacturing process of Figures 5 to 10.

In the various figures, identical or similar elements bear the same references.

Figure 1 and Figure 2 show an electronic module 10. This module

10 is suitable for carrying out one or more individual functions, such as a High Voltage switch, an audio module or others.

The electronic module 10 comprises:

- A main block 101;

- a protective layer 120;

- at least one connection part 102, 103.

The main block 101 constitutes the main part of the electronic module 10.

11 includes:

- a plurality of electronic components 101 1 A, 101 1 B, 1011 C, 1011 D, 101 1 E, 1011 F, 101 1 G;

- a 1012 resin;

- a printed circuit 1013.

An electronic component is intended to be assembled with one or more other electronic components in order to perform the individual function(s) of the electronic module 10. This may be an active component such as a chip or a passive component such as a capacitor or an inductor. The electronic component can also be a MEMS acronym for the English expression “Micro Electro Mechanical System”. An electronic component generally comprises a main body 101 1 1 and a plurality of pins 10112 arranged between said main body 101 1 1 and the printed circuit 1013. The size of the main body 101 1 1 and the number of pins 101 12 of each electronic component are variable. The resin 1012 is suitable for surrounding the electronic components 1011 A, 1011 B, 1011 C, 1011 D, 101 1 E, 101 1 F, 101 1 G in the main block 101. This resin is, for example, a epoxy type resin. This resin is liquid-tight but it may not be gas-tight, which entails a risk of diffusion of humidity inside the main block 101 .

The electronic components 101 1 A, 1011 B, 101 1 C, 101 1 D, 101 1 E, 101 1 F, 1011 G are supported by the printed circuit 1013. This printed circuit 1013 comprises a plurality of layers 1015, 1016, 1017, 1018 stacked on top of each other. Thus, a first layer 1015 is placed above the stack of layers. A fourth layer 1018 is disposed below said stack of layers. A second layer 1016 and a third layer 1017 are placed between the first layer 1015 and the fourth layer 1018. The second layer 1016 is thus positioned under the first layer 1015 and the third layer 1017 is positioned on the fourth layer 1018. The fourth layer 1018 comprises a bottom surface 10183 supporting all of said layers 1015, 1016, 1017, 1018.

[0051] Each layer 1015, 1016, 1017, 1018 comprises a dielectric part 10151, 10161, 10171, 10181 and an electrically conductive part 10152, 10162, 10172, 10182. The printed circuit 1013 also comprises connection pads 1019 arranged under the fourth layer 1018.

[0052] Electrically conductive bridges 10191, 10192, 10193, 10194, 10195, 10196, 10197, 10198 are arranged in the printed circuit 1013. Among these bridges, there are bridges 10197 electrically connecting the electrically conductive part 10152 of the first layer 1015 with pins 101 12 of the electronic components. Other bridges 10198 electrically connect the electrically conductive part of the fourth layer 1018 with connection pads 1019. Finally other electrically conductive bridges 10191, 10192, 10193, 10194, 10195, 1096 connect two electrically conductive parts of two layers which follow each other in the printed circuit. Thus, first electrically conductive bridges 10191, 10192 electrically connect the electrically conductive part 10152 of the first layer 1015 with the electrically conductive part 10162 of the second layer 1016. In the same way second electrically conductive bridges 10193, 10194 electrically connect the electrically conductive part 10162 of the second layer 1016 with the electrically conductive part 10172 of the third layer 1017. Finally, third electrically conductive bridges 10195, 10196 electrically connect the electrically conductive part 10172 of the third layer 1017 with the electrically conductive part 10182 of the fourth layer 1018. Each first electrically conductive bridge 10191, 10192 is here respectively aligned vertically with a second electrically conductive bridge 10193, 10194 and a third electrically conductive bridge 10195, 10196. Alternatively, the various bridges may not be aligned vertically . The different bridges 10191, 10192, 10193, 10194, 10195, 10196, 10197, 10198 form with the electrically conductive parts 10152, 10162, 10172, 10182 different layers 1015, 1016, 1017, 1018 all or part of a conductive network in the printed circuit 1013. This conductive network is notably represented in dark gray in the various figures 1 to 10.

[0053] In Figure 1, the main block 101 has six visible faces. These six sides include:

- an upper face 1020;

- A lower face formed by the lower surface 10183 of the last layer 1018 of the printed circuit 1013;

- Four side faces 1021, 1022 arranged between the upper face 1020 and the lower face 10183. Only two side faces 1021, 1022 are shown here.

The electronic module 10 also includes a protective layer 120. This protective layer 120 is suitable for protecting the main block 101 against moisture infiltration. In addition, this protective layer 120 may be composed of a metallic material in order to provide electrical shielding of the electronic module 10.

Finally, the electronic module 10 comprises at least one connection part

102, 103. Each connection part 102, 103 is adapted to electrically connect the protective layer 120 to the conductive network of the printed circuit 1013. In the embodiment of FIGS. 1 and 2, the electronic module 10 comprises a first connection part 102 and a second connection part

103. The first connection part 102 extends the electrically conductive part 10162 of the second layer 1016 towards the side face 1022 of the block main 101. The second connection part 103 extends the electrically conductive part 10172 of the third layer 1017 towards the side face 1021 opposite the side face 1022 of the block 101 . In this embodiment, the first connection part 102 and the second connection part 103 have the same thickness and are made of the same material as the electrically conductive parts 10162, 10172 of the layers 1016, 1017. The borders between these connection parts 102, 103 and the rest of the conductive network are represented by dotted lines in FIG. 1 and in FIG. 2. Alternatively, the connection parts 102, 103 electrically connect the same side face of block 101. In another embodiment, the number of connection parts is greater than two. This number of connection parts can, for example, be identical to or greater than the number of layers constituting the electronic circuit 1013. All combinations are possible.

[0056] In another embodiment, the connection parts have different thicknesses with respect to the electrical parts of the different layers. They can, moreover, be composed of an electrically conductive material different from the electrically conductive material of the conductive network.

It will also be noted that the protective layer 120 has a thickness greater than or equal to 5 μm and less than or equal to 1 mm.

FIG. 3 illustrates a variant embodiment of the invention in which the electronic module 10 comprises counterbores 104C and 104D extending into the resin 1012 in line with electronic components 1011 C, 1011 D. Thus, a first counterbore 104C extends in line with a first electronic component 1011 C and a second counterbore 104D extends in line with a second electronic component 1011 D. The width and depth of the counterbores 104C, 104D are different. The first counterbore 104C has a large width and a shallow depth while the second counterbore 104D has a smaller width and a greater depth. The countersinks 104C, 104D make it possible to increase the thermal conduction at the level of the respective electronic components 1011 C, 1011 D. [0059] Figure 4 illustrates another embodiment in which the electronic module 10 comprises an electrically insulating inorganic material 105 capable of limiting a rise in humidity in the main block 101. This inorganic material constitutes a barrier against rising moisture originating in particular from the lower surface 10183 of the last layer of the printed circuit 1013. This inorganic material is, for example, a non-stoichiometric oxide such as SiOx with X less than 2. This material forms a protective barrier having a thickness which may be between 0.1 and 1 μm. As a variant, other inorganic materials can be used, such as any other oxide (Al ₂ O ₃ , etc.) or nitride (Si ₃ N ₄ , etc.) or carbide. In the example of FIG. 4, the electrically insulating inorganic material 105 surrounds the electrically conductive part 10182 of the fourth layer to form the barrier limiting the rise of humidity.

[0060] Figures 5 to 11 illustrate an example of a method of manufacturing the electronic module according to the invention.

In a first manufacturing step E1 illustrated in FIG. 5, a plate 106 comprises a plurality of electronic components 1011 A, 1011 B, 1011 C, 1011 D, 1011 E, 1011 F, 1011 G mounted on a printed circuit general 107. Electronic components are organized by component group. Each component group has the same number and arrangement of components. Each component group here includes seven components 1011 A, 1011 B, 1011 C, 1011 D, 1011 E, 1011 F, 1011 G of varying main body size and pin count. The general printed circuit 107 comprises a set of interconnected layers. These interconnections are repeated in an identical manner under the different groups of components, so that it is possible to produce from the same plate 106 a plurality of identical electronic modules. The electronic components 1011 A, 101 1 B, 1011 C, 1011 D, 1011 E, 1011 F, 1011 G are here surface mounted according to SMD technology, acronym for the Anglo-Saxon expression “Surface Mounted Component”. This technology consists in soldering the electronic components on the surface of the printed circuit general 107, rather than passing component pins through. It allows a panoply assembly of an individual electronic function without systematically resorting to one or more microelectronic interconnection technologies such as thermocompression or wiring by wire. It will be noted that in the example of FIG. 5, a peelable varnish 130 is present on the lower surface of the last layer. This peelable varnish 130 is suitable for encapsulating the connection pads 1019 to protect them during the manufacturing process of the electronic module. This peelable varnish 130 is for example a peelable film obtained by screen printing and intended to smooth the underside of the electronic module 10. This makes it possible to continue the steps of the manufacturing process in panoply while making handling safer.

In a second manufacturing step E2 illustrated in FIG. 6, resin 1012 is applied to surround the various electronic components 1011 A, 1011 B, 1011 C, 1011 D, 1011 E, 1011 F, 1011 G. This resin 1012 helps to reinforce the electrical insulation of the terminations between components. In addition, it makes it possible to obtain an upper surface of plate 106 that is well parallel to the lower surface of this plate. It will be noted that resin 1012 is also applied to the preliminary varnish 130.

In general, the resin 1012 is applied by spraying. As a variant, this resin 1012 is implemented by conventional baths.

In a third manufacturing step E3 illustrated in FIG. 7, the resin 1012 and the general printed circuit 107 are sawn to partially form a plurality of main blocks 101. The sawing operation thus creates separating grooves 140 to form the different side faces of the main blocks 101 . The various main blocks 101 however remain bound together by the peelable varnish 130, the resin 1012 and a residual thickness of the printed circuit 1013. electromagnetic of the final electronic module. In addition, the grooves 140 will make it possible to expose connection parts of the general printed circuit 107. Finally, the grooves 140 are here straight which will make it possible to obtain vertical edges for the electronic modules. It will be noted that during the third step E3, counterbores 104C, 104D are made in line with the electronic components 1011 C and 1011 D. In a fourth manufacturing step E4 illustrated in FIG. 8, the protective layer 120 is applied to the plate 106. This protective layer will then cover the resin 1012 on the upper faces and the lower faces of the various main blocks. to form electronic modules 10. The protective layer 120 also penetrates the counterbores 104C, 104D. In addition, this protective layer 120 penetrates into the grooves 140. The protective layer 120 will then come into contact with the connection parts of the general circuit 107 exposed during the previous sawing operation.

In a fifth manufacturing step E5 illustrated in FIG. 9, the grooves 140 are not deepened by sawing, so that the layer of peelable varnish 130 is interrupted.

Finally, in a sixth manufacturing step E6 illustrated in FIG. 10, the peelable varnish and the associated resin are removed. Several independent electronic modules 10 are thus obtained. The electronic modules comprise a multitude of layers, all the interconnections of which are internal to said electronic module. Burying interconnection tracks eliminates the need for solder resist varnish and facilitates resin coating around electronic components.

Each electronic module 10 is then marked. This marking includes at least a polarity indicator, a product reference and a batch reference. All or part of the electronic modules 10 are tested before they are packaged.

The different modules 10 can be associated on the same electronic card in order to obtain the desired function or functions. The EMC shielding provided by the protective layer in each electronic module 10 will ensure optimal operation of said electronic card.

The manufacturing process of the electronic module provides the following advantages:

- it allows batch processing of the manufacturing operations of a PCMA printed circuit module assembly, acronym for the English expression "Printed Circuit Module Assembly";

- it allows the implementation of housings whose assembly remains exclusively compatible with standard SMT assemblies (screen printing of solder paste, transfer of the component with feeding by strip or from a tray, reflow);

- it allows the application of microelectronic back-end processes such as transfer onto film and sawing with controlled depth of wafers applied to PCMA;

- it allows the use of a metallization process according to an electronic circuit process by wet process on five sides;

- it allows the production of specific functions in a package without resorting to the development of bare chips or to micro-electronic packaging channels;

- it promotes cost reduction by identifying an industrial sector allowing the production of specific electronic components dissociated from volume constraints.

The invention is not limited to the embodiments and variants presented and other embodiments and variants will appear clearly to those skilled in the art.

[0072] Thus, it is possible to add one or more metallized grooves to isolate sub-functions of the same electronic component. These grooves may have different heights, i

Claims

[Claim 1] Electronic module comprising:

- a main block (101) comprising:

- at least one electronic component (1011 A, 1011 B, 1011 C, 1011 D, 1011 E, 1011 F, 1011 G);

- a resin (1012) surrounding, at least in part, said electronic component (1011 A, 1011 B, 1011 C, 1011 D, 1011 E, 1011 F, 1011 G);

- a printed circuit (1013) supporting said electronic component (1011 A, 1011 B, 1011 C, 1011 D, 1011 E, 1011 F, 1011 G) and electrically connected to said component (1011A, 1011 B, 1011C, 1011 D, 1011 E, 1011 F, 1011 G), said printed circuit (1013) comprising:

- a plurality of layers (1015, 1016, 1017, 1018) stacked on top of each other, a lower surface (10183) of a last layer (1018) being intended to support all of said layers, all or part of the layers (1015, 1016, 1017, 1018) comprising at least one dielectric part (10151, 10161, 10171, 10181) and at least one electrically conductive part (10152, 10162, 10172, 10182);

- a plurality of electrically conductive bridges (10191, 10192, 10193, 10194, 10195, 10196, 10197, 10198), all or part of said bridges (10191, 10192, 10193, 10194, 10195, 1096) electrically connecting two electrically conductive parts ( 10152, 10162, 10172, 10182) of two layers (1015, 1016, 1017, 1018) which follow each other in the printed circuit, the plurality of bridges (10191, 10192, 10193, 10194, 10195, 10196, 10197, 10198) electrically conductors and the electrically conductive parts (10152, 10162, 10172, 10182) of the different layers forming a conductive network in the printed circuit (1013); said main block (101) comprising six faces including:

- an upper face (1020);

- a lower face formed by the lower surface (10183) of the last layer (1018) of the printed circuit (1013);

- four side faces (1021, 1022) arranged between the upper face (1020) and the lower face (10183); said electronic module comprising a protective layer (120) adapted to reduce the electromagnetic field in the vicinity of the electronic component (1011 A, 101 1 B, 101 1 C, 101 1 D, 1011 E, 1011 F, 1011 G), said layer protection (120) extending over the upper face (1020) of the main block (101) and over the four side faces (1021, 1022) of said main block (101) characterized in that the electronic module (10) comprises:

- at least one connection part (102, 103), said connection part (102, 103) being adapted to electrically connect the protective layer (120) to the conductive network of the printed circuit at the level of a side face (1021, 1022) of the main block,

- at least one electrically insulating inorganic material (105) capable of limiting rising damp in the main block (101), and

- at least one counterbore (104C, 104D) extending into the resin (1012) in line with the electronic component (101 1 C, 101 1 D).

[Claim 2] Electronic module according to claim 1, wherein said electronic module (10) comprises several connection parts (102, 103) respectively present at one or more side faces (1021, 1022) of the main block.

[Claim 3] Electronic module according to any one of Claims 1 or 2, in which the protective layer (120) has a thickness greater than or equal to 5 µm and less than or equal to 1 mm.

[Claim 4] Electronic module according to any one of the preceding claims, in which the electrically insulating inorganic material (101) has a thickness greater than or equal to 0.1 µm and less than or equal to 1 µm.

[Claim 5] An electronic module according to any preceding claim, wherein the inorganic electrically insulating material (101) is a non-stoichiometric oxide such as SiOx with X less than 2.

[Claim 6] A method of manufacturing an electronic module (10), said method comprising the following steps:

- a step (E1) of assembling at least one electronic component (1011 A, 1011 B, 101 1 C, 101 1 D, 1011 E, 101 1 F, 1011 G) on a printed circuit (1013), said 18 component (101 1 A, 101 1 B, 101 10, 1011 D, 101 1 E, 101 1 F, 101 1 G) being electrically connected to said printed circuit (1013), said printed circuit (1013) comprising a plurality of layers (1015, 1016, 1017, 1018) stacked on top of each other, a lower surface (10183) of a last layer (1018) being intended to support all of said layers, all or part of the layers (1015, 1016, 1017, 1018) of the printed circuit (1013) comprising at least one dielectric part (10151, 10161, 10171, 10181) and at least one electrically conductive part (10152, 10162, 10172, 10182), said printed circuit (1013) comprising a plurality of electrically conductive bridges (10191, 10192, 10193, 10194, 10195, 10196, 10197, 10198), all or part of said bridges (10191, 10192, 10193, 10194, 10195, 1096) electrically connecting two electrically conductive parts (10152, 10162, 10172, 10182) of two layers (1015, 1016, 1017, 1018) which follow each other in the printed circuit (1013), the plurality of electrically conductive bridges (10191, 10192, 10193, 10194, 10195, 10196, 10197, 10198) and the electrically conductive parts (10152, 10162, 10172, 10182) of the different layers forming a conductive network in the printed circuit (1013), and an electrically conductive part (10152, 10162, 10172, 10182), said printed circuit (1013) comprising at least one electrically conductive part (10152, 10162, 10172, 10182) surrounded by an inorganic material electrically insulating (105) forming the barrier limiting the rise of humidity in the main block (101);

- a step (E2) of applying a resin (1012) to surround, at least in part, the electronic component (101 1 A, 101 1 B, 101 1 C, 1011 D, 101 1 E, 101 1 F , 1011G);

- a (E3) step of sawing the resin (1012) and the printed circuit (1013) to form, at least in part, a main block (101) of the electronic module (10), said main block (101) comprising six sides of which:

- an upper face (1020), for which the sawing step (E3) comprises the production of at least one counterbore (104C, 104D) extending into the resin (1012) in line with the electronic component (101 1 C , 101 1D);

- four side faces (1021, 1022) arranged between the upper face (1020) and the lower face (10183); 19

- a step (E4) of applying a protective layer (120) on the main block (101) of the electronic module (10), said protective layer (120) being adapted to reduce the electromagnetic field in the vicinity of the component (101 1 A, 101 1 B, 1011 C, 101 1 D, 101 1 E, 101 1 F, 101 1 G), said protective layer (120) extending over the upper face (1020) of the electrical module (10) and on the four side faces (1021, 1022) of said module (10) and in that the electronic module (10) comprises at least one connection part (102, 103), said connection part (102, 103 ) being adapted to electrically connect the protective layer (120) to the conductive network of the printed circuit (1013) at a side face (1021, 1022) of the main block.

[Claim 7] Manufacturing process according to claim 6, in which the resin (1012) is applied to a peelable varnish (130) present on the lower surface (10183) of the last layer (1018).

[Claim 8] Manufacturing process according to any one of claims 6 or 7, said process comprising, following the step (E4) of applying the protective layer (120), another step (E5) of sawing to form the electronic module (10).

[Claim 9] Manufacturing process according to any one of claims 7 or 8, said process comprising a step (E6) of removing the peelable varnish and the associated resin.

[Claim 10] Electronic card comprising at least one electronic module (10) according to any one of claims 1 to 5.