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WO2020090518A1 - Substrate supply system and substrate processing device - Google Patents

Substrate supply system and substrate processing device Download PDF

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Publication number
WO2020090518A1
WO2020090518A1 PCT/JP2019/041058 JP2019041058W WO2020090518A1 WO 2020090518 A1 WO2020090518 A1 WO 2020090518A1 JP 2019041058 W JP2019041058 W JP 2019041058W WO 2020090518 A1 WO2020090518 A1 WO 2020090518A1
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WO
WIPO (PCT)
Prior art keywords
cassette
substrate
supply system
wafer
unit
Prior art date
Application number
PCT/JP2019/041058
Other languages
French (fr)
Japanese (ja)
Inventor
奥田 修
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Priority to CN201980036023.9A priority Critical patent/CN112912998A/en
Priority to JP2020553785A priority patent/JP7432243B2/en
Publication of WO2020090518A1 publication Critical patent/WO2020090518A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a substrate supply system for supplying a substrate.
  • semiconductor devices widely used in electronic equipment are manufactured from wafers in which optical devices are incorporated in each of the areas divided into a plurality of areas.
  • the semiconductor device is manufactured, for example, by the following steps. First, the outer peripheral surface of the single crystal ingot is ground so that the diameter of the single crystal ingot is uniform and sliced into a disk shape having a thickness of about 1 mm. This is a so-called wafer. Both sides of the wafer are ground to a predetermined thickness (grinding step). Subsequently, both surfaces of the wafer are polished, and mirror-finished with high flatness is performed (polishing step). Then, the polished wafer is cleaned (cleaning step) to complete the wafer. After that, a circuit pattern is printed on the surface of the wafer and divided along predetermined lines.
  • Patent Document 1 discloses a cutting device that cuts a wafer along a predetermined line provided on the wafer.
  • This cutting device has a cassette that stores a plurality of wafers (unprocessed wafers) before being cut and a cassette that stores wafers that have been cut (processed wafers) on the chuck table. Placed on. The unprocessed wafers are sequentially transferred from the cassette, cut, and then transferred to the cassette that accommodates the processed wafers.
  • Patent Document 1 when all the unprocessed wafers are unloaded from the cassette and the cassette is emptied, the cassette is removed from the apparatus and a new unprocessed wafer is stored in the cassette. Then, the cassette is mounted on the apparatus again, and the wafer cutting process is newly executed.
  • the safety mechanism is activated during the removal of the cassette in order to prevent accidental access to the interior of the device. In this case, the time required for removing and mounting the cassette to the device becomes longer, and as a result, the operating rate of the device is further reduced.
  • an object of the present invention is to provide a substrate supply system capable of increasing the operating rate of the device, and a substrate processing apparatus including the substrate supply system.
  • the first aspect of the present invention relates to a substrate supply system that supplies the substrates from a cassette that accommodates a plurality of substrates in a stacked state at predetermined intervals to a transfer path.
  • a first storage unit that detachably stores the first cassette a second storage unit that detachably stores the second cassette, and the substrate are the first storage unit.
  • a drawer mechanism that draws out in a direction perpendicular to the stacking direction of the substrates and transfers it to the transport path, and the drawer mechanism between the first storage section and the second storage section.
  • a moving mechanism for moving is the first storage unit that accommodates a plurality of substrates in a stacked state at predetermined intervals to a transfer path.
  • a first storage unit that detachably stores the first cassette a second storage unit that detachably stores the second cassette, and the substrate are the first storage unit.
  • a drawer mechanism that draws out in a direction perpendicular to the stacking direction of the substrates and transfers it to the transport path,
  • the first cassette that has finished supplying the substrate is first stored.
  • the first cassette can be stored in the first storage portion, and the first cassette can be stored in the first storage portion again.
  • the substrates are accommodated in the first cassette without temporarily stopping the supply operation by the drawing mechanism, and the first cassette is transferred to the first cassette.
  • the number of storage devices that detachably stores the cassettes is not limited to two, and three or more storage devices may be provided.
  • the substrate supplied from the second cassette to the transfer path may be processed by a predetermined device and then returned to the second cassette through the same transfer path.
  • the second cassette is taken out of the second storage section and the processed substrate is removed from the second cassette.
  • the unprocessed substrate can be stored in the second cassette and stored again in the second storage section.
  • the pulling-out mechanism supports and guides the hand that holds the substrate, a drive mechanism that moves the hand in a direction perpendicular to the stacking direction, and the pulled-out substrate.
  • a guide part, and the moving mechanism may be configured to position the hand so as to face the substrate to be supplied when the hand pulls the substrate out of the first cassette and the second cassette.
  • substrates such as semiconductor wafers are thin, brittle, and weak against impact.
  • the storage unit or the cassette is moved vertically or horizontally, the substrate may be damaged in the cassette due to shaking or vibration.
  • the storage unit and the cassette do not move, and the hand moves in the stacking direction by the moving mechanism to pull out the substrate to be supplied from the cassette.
  • the drawer mechanism includes a guide portion.
  • the first storage unit and the second storage unit are arranged side by side in the stacking direction, and the moving mechanism is configured to move the drawer mechanism in the stacking direction. Can be done.
  • the drawing mechanism by moving the drawing mechanism only in the stacking direction, the drawing mechanism can be positioned at the accommodation position of each substrate of the first cassette and the second cassette. Therefore, the configuration and control of the moving mechanism can be simplified.
  • the stacking direction may be configured to be a vertical direction.
  • the substrate can be stored in the cassette in a stable state. Further, since the substrate is pulled out horizontally from the cassette, the substrate can be stably pulled out from the cassette.
  • a control unit that controls the moving mechanism may be provided, and the control unit may be configured to move the drawing mechanism in one direction of the stacking direction by the moving mechanism.
  • the drawer mechanism moves in one direction without moving back and forth in the stacking direction.
  • the substrates are sequentially supplied to the transport path from one of the first cassette and the second cassette.
  • the empty cassette can be quickly taken out of the storage device, a new substrate can be stored in the cassette, and the new substrate can be stored in the storage device again.
  • the processed substrate is processed after the substrate supplied to the transfer path is processed by a predetermined device and transferred to the original cassette.
  • the cassette in which the is stored is removed from the storage device. Then, similarly to the above, the unprocessed substrate can be stored in the cassette and then stored again in the storage device. In this way, the substrate can be supplied smoothly and efficiently.
  • the stacking direction is an up-down direction
  • the control unit may be configured to move the pull-out mechanism in one direction from the lower side to the upper side by the moving mechanism.
  • the drawer mechanism is configured such that the substrate housed at the bottom of the cassette arranged at the lower side is moved to the substrate housed at the top of the cassette arranged at the upper side. Until the board is pulled out in order. As a result, the substrate can be efficiently supplied from one cassette to the transfer path. Therefore, it is possible to expedite the cycle of the work of taking out the cassette containing the empty or processed substrate from the storage device, storing the unprocessed substrate in the cassette, and storing it again in the storage device. it can.
  • the second aspect of the present invention relates to a substrate processing apparatus for processing a substrate.
  • a substrate processing apparatus is a substrate supply system that supplies the substrates to a transport path from a cassette that accommodates a plurality of substrates in a stacked state at a predetermined interval, and detachably accommodates the first cassette.
  • a first storage portion, a second storage portion that detachably stores the second cassette, and the substrate is drawn from the first cassette and the second cassette in a direction perpendicular to the stacking direction of the substrates.
  • a moving mechanism for moving the pullout mechanism between the first storage section and the second storage section.
  • the substrate processing apparatus of the present aspect a scribe unit that forms a scribe line on the surface of the substrate, a film laminating unit that attaches a film to the surface of the substrate on which the scribe line is formed, and the film is attached.
  • a reversing unit for reversing the substrate so that the face is on the lower side a break unit for dividing the substrate along the scribe line by applying a predetermined force to the surface on which the film is not attached, And a transport unit that transports the substrate to a predetermined position.
  • the present invention it is possible to provide a substrate supply system capable of increasing the operating rate of the device, and a substrate processing apparatus including the substrate supply system.
  • FIG. 1A to 1C are perspective views showing the configuration of the substrate supply system according to the embodiment.
  • FIG. 1A is a perspective view showing the configuration of the substrate supply system.
  • FIG. 1B is a perspective view showing the configuration of the cassette housed in the substrate supply system.
  • FIG. 1C is a perspective view showing the configuration of the storage device of the substrate supply system, and corresponds to FIG.
  • FIG. 2A and FIG. 2B are perspective views showing the configurations of the drawing mechanism and the moving mechanism of the substrate supply system according to the embodiment.
  • 3A and 3B are perspective views showing the substrate supply system and the transfer path according to the embodiment.
  • 4A and 4B are perspective views showing the substrate supply system and the transfer path according to the embodiment.
  • FIG. 5A is a block diagram showing the configuration of the substrate supply system according to the embodiment.
  • FIG. 5B is a flowchart showing the operation of the substrate supply system according to the embodiment.
  • 6A to 6C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 7 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 8 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 9 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 10A to 10C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment. 10A and 10B are enlarged views around the link mechanism.
  • FIG. 10C is a perspective view corresponding to FIG. 9. FIG.
  • FIG. 11 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 12A to 12C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 12A and 12B are enlarged views around the link mechanism.
  • FIG. 12C is a perspective view corresponding to FIG. 11.
  • FIG. 13 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 14A and 14B are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 14A is an enlarged view around the link mechanism.
  • FIG. 14B is a perspective view corresponding to FIG. 13.
  • FIG. 15 is a perspective view showing the configuration of a substrate processing apparatus including the substrate supply system according to the embodiment.
  • X-axis, Y-axis, and Z-axis orthogonal to each other are added to each drawing.
  • the XY plane is parallel to the horizontal plane
  • the Z-axis direction is the vertical direction.
  • the Z-axis positive side is the upper side
  • the Z-axis negative side is the lower side.
  • the Z-axis direction is the “stacking direction” described in the claims. In the present embodiment, this stacking direction may be referred to as the “vertical direction”.
  • the Y-axis direction is the “direction perpendicular to the stacking direction” described in the claims. This Y-axis direction may be described as “horizontal direction” in the present embodiment.
  • the substrate supply system 1 is used for supplying a wafer to a transfer path for transferring the wafer to a predetermined device when manufacturing a semiconductor wafer which is a material of a semiconductor device widely used in electronic devices and the like.
  • the substrate to be supplied by the substrate supply system 1 is a semiconductor wafer attached to an annular frame with a dicing tape.
  • the "semiconductor wafer attached to the annular frame with the dicing tape" is simply referred to as "wafer W".
  • the position where the wafer W is completely pulled out from the substrate supply system 1 is referred to as a “drawing position”, and the position where the wafer W is transferred to the transfer path is referred to as a “transfer position”. ..
  • Examples of the material of the wafer W include single crystal silicon (Si), silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide (GaSa).
  • the above-mentioned material, thickness, and size of the semiconductor wafer are appropriately selected and designed according to the type, function, etc. of the semiconductor device to be manufactured.
  • FIG. 1A to 1C are perspective views showing the configuration of the substrate supply system 1.
  • 1A is a perspective view of the substrate supply system 1
  • FIG. 1B is a perspective view showing a cassette in which a wafer W is stored
  • FIG. 1C is a perspective view of a storage device 100. It is a figure.
  • the substrate supply system 1 includes a storage device 100, a drawer mechanism 200, and a movement mechanism 300.
  • the entire storage device 100 is covered with a housing, this housing is omitted for convenience of description.
  • the casing that covers the entire storage device 100 is omitted.
  • the storage device 100 stores the wafer W supplied to the transfer path. Specifically, as shown in FIG. 1B, a plurality of wafers W are stacked and stored in a cassette, and the cassette is stored in the storage device 100. In this embodiment, two cassettes, the first cassette 10 and the second cassette 20, are prepared. Grooves 12 are provided at predetermined intervals on the inner surfaces of the side walls 11a and 11b of the first cassette 10. The wafer W is accommodated while being supported inside the first cassette 10 by being inserted into the groove 12.
  • a handle 13 used by an operator to carry the first cassette 10 is provided above the first cassette 10. Since the second cassette 20 has the same configuration as the first cassette 10, the description will be omitted. In the above description, the first cassette 10 and the second cassette 20 are described as a common cassette, but the first cassette 10 and the second cassette 20 are provided on the inner side surfaces of the side walls 11a and 11b. The intervals of the grooves 12 may be different, and the number of wafers W to be accommodated may be different.
  • the storage device 100 stores the first cassette 10 and the second cassette 20 described above. As shown in FIG. 1C, the storage device 100 includes a first storage portion 101 and a second storage portion 102 that are arranged side by side in the stacking direction of the wafers W, that is, in the vertical direction. Further, the storage device 100 includes a mounting portion 110 on which the first cassette 10 is detachably mounted, a housing 103 that covers the first storage portion 101, and a door 104 in the first storage portion 101. A handle 112 installed on the placement unit 110 and a shutter 140 that shuts off the storage device 100 from the pulled-out position are provided.
  • the first storage portion 101 is covered with the housing 103, and the door 104 that opens and closes in the horizontal direction is provided.
  • the door 104 is attached to a casing (not shown in FIGS. 1A and 1C) that covers the entire storage device 100.
  • the door 104 can be made of a transparent member so that the operator can visually recognize the first cassette 10 and the second cassette 20 during the operation of the substrate supply system 1.
  • FIG. 1C illustrates the case where the door 104 is transparent.
  • the case 103, the door 104, the mounting portion 110, and the handle 112 described above are similarly provided for the second storage portion 102.
  • the storage device 100 includes the first storage portion 101 and the second storage portion 102, and the door 104 is provided in each of the first storage portion 101 and the second storage portion 102. .. Therefore, for example, while the wafer W is being supplied from the first cassette 10 stored in the first storage unit 101 to the transfer path, the operator opens the door 104 of the second storage unit 102 to The mounting portion 110 of the second storage portion 102 can be pulled out in the Y-axis negative direction. At this time, when the second cassette 20 is not stored in the second storage section 102 or when the wafer W is not stored in the second cassette 20 (that is, all the wafers from the second cassette 20 are stored).
  • the operator When W is supplied to the transfer path), the operator stores the wafer W in the second cassette 20 and appropriately mounts the second cassette 20 on the mounting unit 110 of the second storage unit 102. After that, the mounting portion 110 of the second storage portion 102 is pulled in the Y-axis positive direction. In this way, the second cassette 20 can be stored in the second storage section 102.
  • the shutter 140 is opened in the storage device 100 when the wafer W is supplied to the transfer path.
  • the shutter 140 since the wafer W is supplied from the first storage unit 101 to the transfer path, the shutter 140 provided in the first storage unit 101 is open.
  • the second storage section 102 the second cassette 20 is being taken out.
  • the operator's hand may accidentally enter the back (Y-axis positive side) of the second storage unit 102, which is dangerous.
  • the wafer W may jump out of the second cassette 20 and fall.
  • the shutter 140 of the second storage unit 102 is closed in order to block the space between the second storage unit 102 and the pulled-out position.
  • 1A and 1C for convenience of description, the shutter 140 of the first storage unit 101 and the shutter 140 of the second storage unit 102 are illustrated so that the inside of each storage unit can be seen. The open state is shown, but it does not correspond to the actual operation. This is the same in FIGS. 3A to 4B.
  • the storage device 100 includes a moving unit 120, a restricting unit 130, an elevating mechanism 150, a supporting unit 160, a link mechanism 170, and a detecting unit 180.
  • the moving unit 120 is not shown in FIG. 1C but is shown in FIG. The detailed configuration of the storage device 100 will be described later with reference to FIGS. 6 to 14B.
  • FIGS. 2A and 2B are perspective views showing the configurations of the drawer mechanism 200 and the movement mechanism 300.
  • the drawing mechanism 200 draws the wafer W from the first cassette 10 and the second cassette 20 in order to supply the wafer W to the transfer path.
  • the drawer mechanism 200 includes a hand 210, a drive mechanism 220, a guide section 230, a retracting mechanism 240, and a sensor 250.
  • the hand 210 holds the peripheral edge of the wafer W.
  • the drive mechanism 220 moves the hand 210 in the horizontal direction.
  • the guide unit 230 guides the wafer W pulled out from the cassette to the transfer path while supporting the wafer W.
  • the guide portion 230 includes rails 231a and 231b and guide support members 232a to 232c that support the rails 231a and 231b.
  • the rails 231a and 231b are arranged on the X-axis positive side and the negative side.
  • the guide support members 232a and 232b are in contact with the lower portions of the rails 231a and 231b, respectively.
  • a guide support member 232c is connected to the lower portion of each of the guide support members 232a and 232b.
  • the guide support members 232a to 232c are rectangular plate members. 2A and 2B, the guide support member 232a is divided into two bodies, but the guide support member 232a may be integrated into one body.
  • the retracting mechanism 240 the wafer W pulled out from the storage device 100 is used as a transfer path. When the wafer is delivered, the interference between a member that receives the wafer W at the delivery position (for example, a holding member on the transfer path side) and the hand 210 is avoided.
  • the sensor 250 detects the wafer W to be supplied when the hand 210 pulls out the wafer W from the cassette.
  • the hand 210, the sensor 250, and the retracting mechanism 240 are connected in this order from the Y-axis negative side via a connecting member. Further, the retracting mechanism 240 is arranged below the hand 210 and the sensor 250.
  • the retracting mechanism 240 is specifically an air cylinder.
  • the retracting mechanism 240 and the hand 210 and the sensor 250 connected via the connecting member move integrally downward.
  • the air cylinder drive unit 405 is illustrated in FIG.
  • the drive mechanism 220 moves the wafer W held by the hand 210 in the horizontal direction.
  • the drive mechanism 220 includes a drawing guide part 221 that moves the wafer W in the horizontal direction, and a moving member 222 that moves the drawing guide part 221.
  • the drawer guide portion 221 is arranged in the space surrounded by the guide support members 232a to 232c, and is attached to the guide support member 232c.
  • a retracting mechanism 240 is attached to the moving member 222.
  • the retracting mechanism 240, the sensor 250, the hand 210, the guide part 230, and the wafer W integrally move in the horizontal direction.
  • the moving mechanism 300 moves the drawer mechanism 200 up and down between the first storage unit 101 and the second storage unit 102.
  • the moving mechanism 300 includes an elevating guide 310 that elevates the drawer mechanism 200, and an elevating member 320 that elevates the elevating guide 310.
  • the lifting member 320 is attached to the guide support member 232b.
  • the raising / lowering member 320 moves the raising / lowering guide 310, so that the drawer mechanism 200 is integrally raised / lowered via the raising / lowering member 320.
  • the substrate supply system 1 will be described on the assumption that the wafer W is supplied to the transfer path 500.
  • the wafers W stored in the lowermost part of the first cassette 10 stored in the first storage unit 101 are sequentially supplied to the transfer path.
  • FIGS. 3A to 4B are perspective views showing the configurations of the substrate supply system 1 and the transfer path 500.
  • FIG. 3A shows the case where the wafer W is drawn out by the drawing mechanism 200
  • FIG. 3B shows the case where the drawing of the wafer W by the drawing mechanism 200 is completed.
  • 4A shows a state immediately before the drawing mechanism 200 delivers the wafer W to the delivery position of the transfer path 500
  • FIG. 4B shows that the delivery of the wafer W to the delivery position of the transfer path 500 is completed. The case is shown.
  • the transport path 500 includes a transport mechanism 510, two transport rails 520, a guide member 530, and a transport hand 540.
  • the transfer hand 540 holds the wafer W transferred from the substrate supply system 1.
  • the transport hand 540 is attached to the guide member 530 of the transport rail 520, and when the transport mechanism 510 is driven, the guide member 530 moves along the guide of the transport mechanism 510. As a result, the wafer W is transferred along the transfer rail 520.
  • the moving mechanism 300 integrally moves the pull-out mechanism 200 downward and positions it at a predetermined height position.
  • the moving mechanism 300 integrally moves the pulling mechanism 200 to a position where the hand 210 faces the wafer W to be supplied, which is accommodated in the first cassette 10 or the second cassette 20.
  • the hand 210 positioned at the height position of the wafer W to be supplied moves to the Y-axis negative side by the drive mechanism 220 and holds the wafer W to be supplied.
  • the sensor 250 detects the wafer W to be supplied. This operation of the substrate supply system 1 is referred to as "drawing operation".
  • the drive mechanism 220 pulls the wafer W to the Y axis positive side.
  • the pulled-out wafer W is supported by rails 231a and 231b and positioned at the pull-out position while being guided.
  • the hand 210 is in a state of holding the wafer W.
  • This operation of the substrate supply system 1 is referred to as "drawing completion operation”.
  • the moving mechanism 300 integrally moves the extraction mechanism 200 upward.
  • the moving mechanism 300 integrally moves the drawer mechanism 200 so that the height positions of the rails 231a and 231b and the height position of the transport rail 520 of the transport path 500 match.
  • the hand 210 is in a state of holding the wafer W. This operation of the substrate supply system 1 is referred to as "delivery preparation operation".
  • the transfer mechanism 510 is driven to move the guide member 530 to which the transfer hand 540 is attached along the guide of the transfer mechanism, and the transfer hand 540 holds the wafer W. Then, the wafer W is transported to a predetermined place while being supported by the transport rail 520.
  • the substrate supply system 1 supplies the wafer W to the transfer path as described above.
  • the substrate supply system 1 repeatedly executes the above-mentioned drawing operation, drawing completion operation, delivery preparation operation, and delivery completion operation while the wafer W to be supplied is present.
  • the pull-out mechanism 200 and the moving mechanism 300 are the second storage units stored in the second storage unit 102.
  • the wafer W is pulled out from the cassette 20 and is supplied to the transfer path.
  • the pull-out mechanism 200 and the moving mechanism 300 sequentially pull out the wafer W stored in the lowermost part of the second cassette 20.
  • the operator While the substrate supply system 1 pulls out the wafer W from the second cassette 20 and supplies the wafer W to the transfer path, the operator opens the door 104 of the first storage unit 101 to set the mounting unit of the first storage unit 101. 110 is pulled out in the negative direction of the Y-axis, and the mounting portion 110 is positioned at the mounting / removing position. Then, the operator takes out the first cassette 10 from the mounting portion 110 of the first storage portion 101, stores a new wafer W in the first cassette 10, and places the mounting portion of the first storage portion 101. After being mounted on 110, the first storage unit 101 can be positioned again at the storage position. In this way, even while the first cassette is being taken out from the first storage unit 101, the wafer W is pulled out from the second cassette 20 and the supply operation to the transfer path is continued. Therefore, the operating rate of the substrate supply system 1 can be increased.
  • the delivery of the wafer W on the transfer path may be performed by holding the wafer W by the hand as described above, or by sucking and holding the wafer W by, for example, a member having a suction pad.
  • FIG. 5A is a block diagram showing the configuration of the substrate supply system 1.
  • the substrate supply system 1 includes a storage device 100, a drawer mechanism 200, and a movement mechanism 300, and further includes a control unit 400, an input unit 401, and a detection unit 402. , Is provided.
  • a pull-out guide drive unit 403, which is a drive unit of each of the pull-out guide unit 221, the elevating guide 310, and the retracting mechanism 240, an elevating guide drive unit 404, and an air cylinder drive unit 405 are provided.
  • the control unit 400 includes an arithmetic processing circuit such as a CPU and a memory such as a ROM, a RAM, and a hard disk.
  • the control unit controls each unit according to the program stored in the memory.
  • the input unit 401 receives a start when the substrate supply system 1 supplies the wafer W to the transfer path.
  • the detection unit 402 detects the position of the wafer W to be supplied in the substrate supply system 1. Further, the detection unit 402 may be configured to detect that the wafer W has been supplied to the transfer path.
  • the detection unit 402 can use, for example, a sensor, an imaging device, or the like.
  • FIG. 5B is a flowchart showing the operation of the substrate supply system 1 according to this embodiment. This control is executed by the control unit 400 shown in FIG. Here, similarly to the above, the operation when the wafer W is supplied from the substrate supply system 1 to the transfer path 500 will be described.
  • start is the time when the input unit receives the supply start of the wafer W to the transfer path.
  • the first storage unit 101 and the second storage unit 102 of the storage device 100 respectively store the first cassette 10 and the second cassette 20 in which the wafer W is stored. Further, the wafers W stored in the lowermost part of the first cassette 10 are sequentially supplied to the upper wafers W.
  • step S11 the elevating guide driving unit 404 drives the elevating guide 310 to move the extraction mechanism 200 to the height position of the wafer W to be supplied, and the sensor 250 to detect the wafer W to be supplied. This is the above-mentioned drawing operation, and corresponds to the state shown in FIG.
  • step S12 when the sensor 250 detects the supply target wafer W, the control unit 400 causes the extraction guide drive unit 403 to drive the hand 210 to hold the supply target wafer W and to extract the supply target wafer W in the horizontal direction. Position in position. This is the above-mentioned drawing completion operation, and corresponds to the state shown in FIG.
  • step S13 the control unit 400 causes the elevating guide driving unit 404 to drive the elevating guide 310 to position the drawer mechanism 200 at the height position of the conveying rail 520 of the conveying path 500.
  • This is the delivery preparation operation described above, and corresponds to the state shown in FIG.
  • step S ⁇ b> 14 when the detection unit 402 detects that the wafer W is located at the height position of the transfer rail 520, the control unit 400 causes the extraction guide drive unit 403 to drive the hand 210, and the hand 210 operates. The gripping of the wafer W is stopped. Then, the control unit 400 causes the air cylinder drive unit 405 to apply a predetermined pressure to the retracting mechanism 240, and moves the hand 210 downward. This avoids interference between the hand 210 and the transport hand 540. This is the delivery completion operation described above, and corresponds to the state shown in FIG.
  • step S14 the wafer W is transferred to the transfer path 500 (see FIG. 4B) and transferred to a predetermined place.
  • step S15 when the detection unit 402 detects that the delivery of the wafer W is completed, the control unit 400 determines whether the wafer W to be supplied is in the first cassette 10 or the second cassette 20. .. When there is a wafer W to be supplied (S15; YES), the operations in steps S11 to S14 described above are repeatedly executed. When there is no wafer W to be supplied (S15; NO), the supply of the wafer W to the transfer path by the substrate supply system 1 ends.
  • the substrate supply system 1 may be configured to include a display unit that displays the states of the first cassette 10 and the second cassette 20. For example, when a display screen (not shown) is connected to the substrate supply system 1 and unprocessed, that is, the wafer W to be supplied remains in both the first cassette 10 and the second cassette 20, "Processing" is displayed on the screen. From this display, the operator can grasp that the wafer W is being supplied from the first cassette 10 or the second cassette 20 to the transfer path.
  • a display screen not shown
  • processing completed is displayed. From this display, the operator can know that the supply of the wafer W is completed.
  • the operator can quickly grasp the states of the first cassette 10 and the second cassette 20 stored in the storage device 100, and thus the operation can be performed smoothly. be able to.
  • 6A to 6C are perspective views showing different states of the storage device 100, and the left side view and the right side view correspond to each other.
  • FIGS. 6A to 6C the storage device 100 has four main states.
  • FIG. 6A shows a state (first state) in which the mounting portion 110 is pulled out from the second storage portion 102. At this time, since the shutter 140 of the second storage unit 102 is closed, the operator cannot put his or her hand in the storage device 100.
  • FIG. 6B shows a state (second state) in which the mounting portion 110 is accommodated in the second storage portion 102.
  • FIG. 6C shows a preparation state (third state) for opening the shutter 140 of the second storage section 102.
  • the state where the opening of the shutter 140 of the second storage unit 102 is completed corresponds to FIGS. 1A and 1C.
  • the configuration of the storage device 100 will be described separately for these four states.
  • the shutter 140 of the first storage unit 101 is opened upward, and the shutter 140 of the second storage unit 102 is opened downward.
  • the opening direction is different between the upper and lower sides, the structure for opening the shutter 140 is the same. Therefore, in the following description, the description will focus on the second storage section 102 arranged in the upper stage.
  • the second cassette 20 is detachably mounted on the mounting portion 110 of the second storage portion 102.
  • the position of the placement unit 110 of the second storage unit 102 is referred to as the “attachment / detachment position”.
  • the second cassette 20 is in the state of being mounted on the mounting portion 110 of the second storage portion 102, and the second storage It is stored in the unit 102.
  • the position of the placement unit 110 of the second storage unit 102 at this time is referred to as a “storage position”.
  • the placement unit 110 is located at the attachment / detachment position.
  • FIGS. 7 and 8 are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the first state.
  • the second cassette 20, the housing 103, and the door 104 are omitted in FIGS. 7 and 8, and the detection unit 180 is further omitted in FIG.
  • the storage device 100 includes the mounting portion 110, the moving portion 120, the regulating portion 130, the shutter 140, the elevating mechanism 150, the supporting portion 160, and the link mechanism 170 described above.
  • a pedestal 190 is provided in addition to the detection means 180.
  • the portion surrounded by the broken line is an area where the second cassette 20 is mounted.
  • the mounting part 110 On the upper surface of the mounting part 110 , four positioning members 111 for positioning the second cassette 20 are provided. When mounting the second cassette 20 on the mounting portion 110, both ends of the side walls 11a and 11b of the second cassette 20 are fitted to the four positioning members 111 (see FIG. 1C).
  • the moving unit 120 moves the placing unit 110 in the horizontal direction between the attachment / detachment position and the storage position.
  • the moving unit 120 includes a link member 121, horizontal slide members 122a and 122b, a guide member 123, and a protruding member 124.
  • the link member 121 is not shown in FIG. 7, but is shown in FIG.
  • the link member 121 includes a member 121a having a stepped cross section in the X-axis direction and a transfer roller 121b.
  • a hole is formed in the lower part of the member 121a in the X-axis direction, and the rotation shaft of the transfer roller 121b is passed through the hole.
  • the shutter 140 is attached to the rising portion above the member 121a (see FIG. 10C).
  • the horizontal slide member 122a is provided on the mounting portion 110 side, and the horizontal slide member 122b is provided on the pedestal 190 side.
  • the mounting part 110 moves in the horizontal direction
  • the horizontal slide member 122a moves with respect to the horizontal slide member 122b.
  • the mounting unit 110 can move in the horizontal direction.
  • the guide member 123 is an elongated rectangular member and is installed on the pedestal 190.
  • the Y-axis positive side and the negative side of the guide member 123 are formed with a gentle slope toward the center, and a V-shaped recess 123a is formed at the end on the Y-axis positive side.
  • the lower end of the protruding member 124 provided on the mounting portion 110 is formed in a hemispherical shape (not shown).
  • the mounting portion 110 is appropriately braked, and the pedestal 190 can smoothly move while decelerating. Further, the hemispherical portion of the projecting member 124 is fitted into the recess 123 a, whereby the mounting portion 110 is positioned in the second storage portion 102.
  • the restriction unit 130 moves the mounting unit 110 to the storage position while the mounting unit 110 moves in the horizontal direction between the attachment / detachment position (first state) and the storage position (second state).
  • the wafer W is prevented from jumping out and falling from the second cassette 20 (on the Y-axis positive side).
  • the restricting portion 130 contacts the inner end surface of the second cassette 20. That is, it abuts the wafer W stored in the second cassette 20.
  • the restriction part 130 is a plate-shaped member, and in the present embodiment, two are provided.
  • the restriction portion 130 is supported by the support plate 131.
  • the shutter 140 blocks between the second storage unit 102 and the pull-out position.
  • the shutter 140 In the second storage unit 102, when the wafer W is pulled out from the second cassette 20, the shutter 140 is opened, and when the mounting unit 110 is moved from the storage position to the attachment / detachment position, the shutter 140 is closed.
  • the lifting mechanism 150 moves the shutter 140 up and down.
  • the elevating mechanism 150 includes a drive unit 151, a receiving member 152, and elevating slide members 153a and 153b.
  • the drive unit 151 is a cylinder.
  • the receiving member 152 is connected to the lower end of the rod 151a of the drive unit 151.
  • the receiving member 152 is composed of a frame-shaped member whose Y-axis negative side is open.
  • the upper and lower gaps 152a of the receiving member 152 fit into the above-mentioned transfer rollers 121b.
  • the transfer roller 121b is fitted in the gap 152a of the receiving member 152 (for example, see FIG. 10C). Since the receiving member 152 is connected to the rod 151a, when the driving unit 151 drives, the receiving member 152 moves up and down together with the driving unit 151.
  • the elevating slide members 153a and 153b are provided between the shutter 140 and the support 160, and elevate the shutter 140.
  • An elevating slide member 153a is attached to the shutter 140, and an elevating slide member 153b is attached to the support part 160.
  • the support part 160 is a member having a stepwise cross section in the Y-axis direction (see FIG. 9) and is installed on the mounting part 110.
  • the restriction unit 130 is supported via a link mechanism 170 described below.
  • the link mechanism 170 includes a link base 171, a link plate 172, two link bars 173, and a link roller 174.
  • the link base 171 and the link plate 172 are plate-shaped members and are connected by two link bars 173.
  • the link base 171 is attached to the shutter 140, and the link plate 172 is attached to the support plate 131.
  • a link roller 174 is rotatably provided below the link plate 172.
  • the link roller 174 is in contact with the horizontal surface below the support 160.
  • the two link bars 173 are not shown in FIG. 7, but are shown in FIG.
  • the shutter 140 is supported by the support portion 160 via the horizontal slide members 122a and 122b.
  • a link base 171 is attached to the shutter 140, and a link plate 172 connected to the link base 171 via a link bar 173 is attached to the support plate 131.
  • the link base 171 and the link plate 172 form a four-bar link with the two link bars 173.
  • the link plate 172 slides while maintaining the vertical state.
  • the support plate 131 supports the restriction portion 130. Therefore, the restriction unit 130 is supported by the shutter 140 via the link mechanism 170, and the restriction unit 130 is supported by the support unit 160 via the link mechanism 170.
  • the link bar 173 of the link mechanism 170 is horizontal with respect to the mounting portion 110. Therefore, the link base 171 and the link plate 172 are slightly separated from each other. That is, the shutter 140 to which the link base 171 is attached and the support plate 131 to which the link plate 172 is attached are separated from each other. Since the restriction portion 130 is mounted on the support plate 131, the shutter 140 and the restriction portion 130 are separated from each other.
  • the detection means 180 is a sensor provided on the Y-axis positive side of the pedestal 190.
  • the detection unit 180 detects whether the wafer W is protruding from the second cassette 20.
  • the restricting portion 130, the support plate 131, and the shutter 140 also move horizontally along with the mounting portion 110. Move to.
  • This is a state in which the restricting portion 130 is in contact with the wafer W, as shown in FIG. 6A, particularly the right side diagram of FIG. 6A. Therefore, when taking out the second cassette 20 from the placing section 110 and when placing the second cassette 20 on the placing section 110, the operator puts his / her hand only within the area of the placing section 110. Therefore, the operator's hand does not enter the transport path. Therefore, the operator can safely attach and detach the second cassette 20.
  • the storage device 100 is in the second state, that is, the placement unit 110 is located at the storage position will be described.
  • FIGS. 9 and 10A to 10C are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the second state.
  • 10A and 10B are enlarged views around the link mechanism, and the shutter 140 is omitted in FIG. 10B.
  • FIG. 10C is a perspective view corresponding to FIG. 9. Further, in FIGS. 9 and 10A to 10C, the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
  • the linking member 121, the restriction section 130, the support plate 131, the shutter 140, and the support section 160 are in the states shown in FIGS. 7 and 8. While maintaining, it moves horizontally together with the mounting part 110.
  • the transfer roller 121b of the linking member 121 horizontally moved together with the shutter 140 fits into the gap 152a of the receiving member 152.
  • the width of the transfer roller 121b is set to be wider so that the transfer roller 121b can continuously transfer to the receiving member 152.
  • FIGS. 10A and 10C the upper frame of the receiving member 152 and the shutter 140 do not interfere with each other.
  • the link mechanism 170 is the same as in the first state. It is slightly separated, and the restriction portion 130 is in contact with the wafer W. This is shown in FIG. 6B, in which the restricting portion 130 is in contact with the wafer W.
  • the mounting unit 110 horizontally moves from the attachment / detachment position to the storage position from the first state to the second state, the positional relationship between the restriction unit 130 and the shutter 140 does not change, It horizontally moves together with the mounting unit 110. Therefore, while the mounting part 110 is horizontally moved from the attachment / detachment position to the storage position, the restriction part 130 continues to contact the wafer W. Therefore, there is no possibility that the wafer W jumps out of the second cassette 20 toward the supply region side and falls. Further, since the shutter 140 closes the supply area side, it is possible to reliably prevent the operator's hand from entering the storage device 100.
  • FIGS. 11 and 12 (a) to (c) are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the third state.
  • 12A and 12B are enlarged views around the link mechanism, and the shutter 140 is omitted in FIG. 12B.
  • FIG. 12C is a perspective view corresponding to FIG. 11. Further, in FIGS. 11 and 12A to 12C, the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
  • the storage device 100 prepares to open the shutter 140 so that the wafer W can be supplied from the second cassette 20.
  • the restriction unit 130 also moves up and down together with the shutter 140. Since the regulating portion 130 is in contact with the wafer W, the regulating portion 130 moves up and down while rubbing the wafer W. Since the quality of the wafer W deteriorates, it is necessary to raise the shutter 140 after separating the wafer W and the restriction unit 130. Therefore, as shown in FIGS. 7 and 8A to 8C, in the storage device 100, in preparation for opening the shutter 140, the wafer W and the restriction unit 130 are separated (third state).
  • a link base 171 is attached to the shutter 140.
  • the link base 171 also moves up, and the two link bars 173 (see FIG. 10B) maintained in the horizontal direction rotate.
  • the link roller 174 rotatably provided on the link plate 172 rolls on the horizontal surface of the lower portion of the support portion 160 to the Y axis positive side, and moves the link plate 172 to the Y axis positive side. Since the link plate 172 is attached to the support plate 131, the support plate 131 also moves to the Y axis positive side.
  • the link plate 172 moves horizontally while maintaining a vertical state by a four-bar link.
  • the restriction portion 130 supported by the support plate 131 slightly moves from the state shown in FIGS. 9, 10 (a) to (c) to the Y-axis positive side. Then, the restriction portion 130 also moves in the horizontal direction, and the restriction portion 130 is separated from the wafer W. Accordingly, the restriction portion 130 can be lifted after being separated from the wafer W without contacting the wafer W, that is, without shifting the position of the wafer W.
  • the storage device 100 is in the fourth state, that is, the mounting unit 110 is located at the storage position and the shutter 140 is opened will be described.
  • FIGS. 13, 14 (a) and (b) are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the fourth state.
  • 14A is an enlarged view around the link mechanism 170
  • FIG. 14B is a perspective view corresponding to FIG.
  • the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
  • the shutter 140 of the first storage unit 101 moves downward.
  • the first storage unit 101 is composed of members and mechanisms similar to those of the second storage unit 102.
  • the support section 160 and the link mechanism 170 are provided upside down with respect to the support section 160 and the link mechanism 170 of the second storage section 102.
  • Other configurations are provided similarly to the second storage section 102.
  • the link mechanism 170 is provided upside down from the state in which it was provided in the second storage unit 102. Due to its own weight, the link roller 174 of the second storage portion 102 can be stably positioned on the horizontal plane of the step portion of the support portion 160 without providing the link mechanism 170 with the biasing member.
  • the link roller 174 is located below the horizontal surface of the step portion of the support portion 160. As a result, the link roller 174 can be moved by its own weight. When the link roller 174 moves, the link plate 172 also moves, and the link mechanism 170 becomes unstable. Therefore, the link mechanism 170 of the second storage unit 102 is provided with an urging member (not shown) for urging the link roller 174 upward. As a result, the link mechanism 170 of the first storage unit 101 is stabilized.
  • the regulation portion 130 and the shutter 140 are also pulled out. The same applies when returning the placing part 110 to the storage position. For this reason, the restriction unit 130 continues to face the wafer W during the movement of the mounting unit 110, and it is possible to reliably prevent the wafer W from dropping from the cassette. Further, when the mounting portion 110 is positioned at the attachment / detachment position, the back of each storage portion is closed by the shutter 140, so that it is possible to prevent the operator from inserting a hand into the storage device 100.
  • the board supply system 1 does not move the storage device 100 vertically or horizontally.
  • a semiconductor wafer is a thin film, is brittle, and is vulnerable to impact. Therefore, when the storage device 100 moves, the wafer W to be supplied may be damaged due to shaking or vibration.
  • the wafer W is pulled out by the pulling mechanism 200 and the moving mechanism 300. Therefore, it is possible to reliably prevent the wafer W from being damaged in the storage device 100.
  • the drawer mechanism 200 also includes rails 231a and 231b.
  • the wafer W is pulled out while being supported by the rails 231a and 231b. Therefore, the wafer W can be pulled out smoothly.
  • the first storage section 101 and the second storage section 102 are arranged side by side in the stacking direction of the wafers W.
  • the pull-out mechanism 200 can be moved only in the stacking direction to position the hand 210 on the wafer W of the first cassette 10 and the second cassette 20. Therefore, the configuration and control of the moving mechanism 300 can be simplified.
  • the wafer W supplied to the transfer path may be returned to the cassette stored before the supply.
  • the wafer W is delivered to the hand 210 of the pullout mechanism 200 at the delivery position of the transfer path.
  • the moving mechanism 300 positions the drawing mechanism 200 at the position before the supply of the wafer W. Then, the drawing mechanism 200 inserts the wafer W into the cassette.
  • the stacking direction is the vertical direction.
  • the wafer W can be accommodated in the first cassette 10 and the second cassette 20 in a stable state. Further, the wafer W can be stably pulled out in the horizontal direction from the first cassette 10 and the second cassette 20.
  • the wafer W is supplied from the first cassette 10 of the first storage unit 101. That is, the pull-out mechanism 200 moves in one direction from the lower side to the upper side without moving back and forth in the stacking direction. Therefore, when the first cassette 10 becomes empty, the first cassette 10 is promptly taken out from the storage device 100, a new wafer W is stored in the first cassette 10, and the first storage 10 is again stored. It can be stored in the unit 101. Therefore, the supply of the wafer W is performed smoothly and efficiently.
  • the wafer W may be supplied from the second cassette 20.
  • the wafers W stored in the uppermost part of the second cassette 20 may be sequentially supplied so that the drawing mechanism 200 moves in one direction in the stacking direction.
  • the wafer W when the wafer W is supplied from the first cassette 10 of the one storage unit 101 via the horizontal slide members 122a and 122b, the wafer stored in the lowermost part of the first cassette 10 is used. Wafers W are supplied in order from W. As a result, the wafer W can be efficiently supplied from one cassette to the transfer path. Therefore, a cycle in which the cassette containing the wafer W that has become empty or has been processed is taken out from the storage device 100, the unprocessed wafer W is stored in the cassette, and the wafer W is stored again in the storage device 100. Can be accelerated.
  • the substrate supply system 1 described above can be combined with a plurality of units for processing a wafer to configure the substrate processing apparatus 30.
  • FIG. 15 is a perspective view showing the configuration of the substrate processing apparatus 30 including the substrate supply system 1.
  • the substrate processing apparatus 30 includes a scribe unit 40 that forms a scribe line on the surface of the wafer W, a film laminating unit 50 that attaches a film to the surface of the wafer W on which the scribe line is formed, and a film.
  • the reversing unit 60 for reversing the wafer W so that the surface on which the film is adhered is on the lower side, and the break unit 70 for dividing the wafer W along the scribe line by applying a predetermined force to the surface on which the film is not adhered.
  • a transfer unit 80 that transfers the wafer W to a predetermined position.
  • the substrate supply system 1 is covered with a housing.
  • the substrate processing apparatus 30 having the above-described configuration supplies the wafer W smoothly by the substrate supply system 1, so that the operation rate of the apparatus is increased. Can be increased.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

This substrate supply system (1) supplies substrates (W) to a conveyance path from a cassette (10) which houses a plurality of substrates (W) in a state stacked separated by a prescribed interval, and is provided with: a first storage unit (101) which detachably stores a first cassette (10); a second storage unit (102) which detachably stores a second cassette (20); a pull-out mechanism (200) which pulls substrates (W) out of the first cassette (10) and the second cassette (20) in a direction perpendicular to the direction of stacking of the substrates (W) and transfers these to the conveyance path; and a moving mechanism (300) which moves the pull-out mechanism (200) between the first storage unit (101) and the second storage unit (102).

Description

基板供給システムおよび基板加工装置Substrate supply system and substrate processing equipment
 本発明は、基板を供給するための基板供給システムに関する。 The present invention relates to a substrate supply system for supplying a substrate.
 従来、電子機器等に広く利用される半導体デバイスは、複数の領域に区分された各領域にそれぞれ光デバイス等が組み込まれたウェーハから製造される。ここで、半導体デバイスは、たとえば、次のような工程により製造される。まず、単結晶インゴットの直径が均一となるように、単結晶インゴットの外周面が研削され、厚さ1mm程度の円盤状にスライスされる。これが、いわゆるウェーハである。ウェーハの両面が研削されて、所定の厚さに仕上げられる(研削工程)。続いて、ウェーハの両面が研磨され、平坦度の高い鏡面仕上げが行われる(研磨工程)。そして、研磨されたウェーハは洗浄され(洗浄工程)、ウェーハが完成する。この後、ウェーハの表面に回路パターンが焼き付けられ、所定のラインに沿って分割される。 Conventionally, semiconductor devices widely used in electronic equipment are manufactured from wafers in which optical devices are incorporated in each of the areas divided into a plurality of areas. Here, the semiconductor device is manufactured, for example, by the following steps. First, the outer peripheral surface of the single crystal ingot is ground so that the diameter of the single crystal ingot is uniform and sliced into a disk shape having a thickness of about 1 mm. This is a so-called wafer. Both sides of the wafer are ground to a predetermined thickness (grinding step). Subsequently, both surfaces of the wafer are polished, and mirror-finished with high flatness is performed (polishing step). Then, the polished wafer is cleaned (cleaning step) to complete the wafer. After that, a circuit pattern is printed on the surface of the wafer and divided along predetermined lines.
 以下の特許文献1は、ウェーハに設けられた所定のラインに沿ってウェーハを切削する切削装置が開示されている。この切削装置には、切削される前の複数のウェーハ(未加工のウェーハ)が収容されているカセット、および切削された後のウェーハ(加工後のウェーハ)を収容するためのカセットがチャックテーブル上に載置される。未加工のウェーハはカセットから順に搬送され、切削された後、加工後のウェーハを収容するカセットに搬送される。 The following Patent Document 1 discloses a cutting device that cuts a wafer along a predetermined line provided on the wafer. This cutting device has a cassette that stores a plurality of wafers (unprocessed wafers) before being cut and a cassette that stores wafers that have been cut (processed wafers) on the chuck table. Placed on. The unprocessed wafers are sequentially transferred from the cassette, cut, and then transferred to the cassette that accommodates the processed wafers.
特開2014-175422号公報JP, 2014-175422, A
 特許文献1では、未加工のウェーハがカセットから全て搬出されてカセットが空になると、カセットが装置から取り外されて、カセットに新たに未加工のウェーハが収容される。そして、再度、カセットが装置に装着されて、新たに、ウェーハの切削工程が実行される。 In Patent Document 1, when all the unprocessed wafers are unloaded from the cassette and the cassette is emptied, the cassette is removed from the apparatus and a new unprocessed wafer is stored in the cassette. Then, the cassette is mounted on the apparatus again, and the wafer cutting process is newly executed.
 ここで、装置に対するカセットの取り外しと装着には、所定の時間を要する。このため、この時間においては、装置にウェーハを供給できず、装置の稼働率が低下する。特に、カセットの取り外し時には、誤って装置の内部に手が入らないように、安全機構を動作させることも想定され得る。この場合は、装置に対するカセットの取り外しと装着に要する時間がさらに長くなり、その結果、装置の稼働率がより一層低下することとなる。 Here, it takes a certain amount of time to remove and attach the cassette to the device. Therefore, during this time, the wafer cannot be supplied to the apparatus, and the operation rate of the apparatus decreases. In particular, it may be envisaged that the safety mechanism is activated during the removal of the cassette in order to prevent accidental access to the interior of the device. In this case, the time required for removing and mounting the cassette to the device becomes longer, and as a result, the operating rate of the device is further reduced.
 かかる課題に鑑み、本発明は、装置の稼働率を高めることが可能な基板供給システム、および基板供給システムを備えた基板加工装置を提供することを目的とする。 In view of such a problem, an object of the present invention is to provide a substrate supply system capable of increasing the operating rate of the device, and a substrate processing apparatus including the substrate supply system.
 本発明の第1の態様は、複数の基板を所定の間隔で積層した状態で収容するカセットから前記基板を搬送路に供給する基板供給システムに関する。本態様に係る基板供給システムは、第1のカセットを着脱可能に収納する第1の収納部と、第2のカセットを着脱可能に収納する第2の収納部と、前記基板を前記第1のカセットおよび前記第2のカセットから前記基板の積層方向に垂直な方向に引き出して前記搬送路に受け渡す引き出し機構と、前記引き出し機構を前記第1の収納部と前記第2の収納部との間で移動させる移動機構と、を備える。 The first aspect of the present invention relates to a substrate supply system that supplies the substrates from a cassette that accommodates a plurality of substrates in a stacked state at predetermined intervals to a transfer path. In the substrate supply system according to this aspect, a first storage unit that detachably stores the first cassette, a second storage unit that detachably stores the second cassette, and the substrate are the first storage unit. Between the cassette and the second cassette, a drawer mechanism that draws out in a direction perpendicular to the stacking direction of the substrates and transfers it to the transport path, and the drawer mechanism between the first storage section and the second storage section. And a moving mechanism for moving.
 本態様に係る構成によれば、たとえば、引き出し機構が第2のカセットから基板を引き出して搬送路に供給している間に、先に基板を供給し終えた第1のカセットを第1の収納部から取り出し、この第1のカセットに基板を収容して、再び第1の収納部に第1のカセットを収納することができる。これにより、第1のカセットから全ての基板が搬送路に供給された場合、引き出し機構による供給動作を一旦停止させることなく、第1のカセットに基板を収容し、第1のカセットを第1の収納部に収納することができる。よって、第1のカセットおよび第2のカセットから連続的に基板を搬送路に供給でき、基板供給システムの稼働率を高めることができる。 According to the configuration of this aspect, for example, while the drawing mechanism draws the substrate from the second cassette and supplies the substrate to the transport path, the first cassette that has finished supplying the substrate is first stored. The first cassette can be stored in the first storage portion, and the first cassette can be stored in the first storage portion again. As a result, when all the substrates are supplied from the first cassette to the transport path, the substrates are accommodated in the first cassette without temporarily stopping the supply operation by the drawing mechanism, and the first cassette is transferred to the first cassette. Can be stored in the storage section. Therefore, the substrate can be continuously supplied from the first cassette and the second cassette to the transfer path, and the operating rate of the substrate supply system can be increased.
 なお、本態様にかかる基板供給システムにおいて、カセットを着脱可能に収納する収納装置は2つに限らず、3つ以上設けられてもよい。 In the substrate supply system according to this aspect, the number of storage devices that detachably stores the cassettes is not limited to two, and three or more storage devices may be provided.
 また、第2のカセットから搬送路に供給された基板は、所定の装置で加工された後、同じ搬送路を通って、第2のカセットに戻らせるようにしてもよい。この場合、第2のカセットから搬送路に供給された基板の全てが第2のカセットに戻った後、第2の収納部から第2のカセットを取り出し、第2のカセットから加工後の基板を回収し、未加工の基板を第2のカセットに収容して、再び、第2の収納部に収納することができる。 Alternatively, the substrate supplied from the second cassette to the transfer path may be processed by a predetermined device and then returned to the second cassette through the same transfer path. In this case, after all of the substrates supplied from the second cassette to the transport path have returned to the second cassette, the second cassette is taken out of the second storage section and the processed substrate is removed from the second cassette. The unprocessed substrate can be stored in the second cassette and stored again in the second storage section.
 本態様に係る基板供給システムにおいて、前記引き出し機構は、前記基板を保持するハンドと、前記ハンドを前記積層方向に垂直な方向に移動させる駆動機構と、引き出された前記基板を支持して案内するガイド部と、を備え、前記ハンドが前記基板を前記第1カセットおよび前記第2のカセットから引き出すとき、前記移動機構は、供給対象の基板に向かい合うように前記ハンドを位置付けるよう構成され得る。 In the substrate supply system according to this aspect, the pulling-out mechanism supports and guides the hand that holds the substrate, a drive mechanism that moves the hand in a direction perpendicular to the stacking direction, and the pulled-out substrate. A guide part, and the moving mechanism may be configured to position the hand so as to face the substrate to be supplied when the hand pulls the substrate out of the first cassette and the second cassette.
 一般に、半導体ウェーハのような基板は、薄膜で脆く、衝撃に弱い。このような基板を搬送路に供給する際、収納部やカセットを上下あるいは左右に移動させると、揺れや振動により基板がカセット内で破損する虞が生じる。この点、この構成では、収納部およびカセットは移動することなく、移動機構によりハンドが積層方向に移動して供給対象の基板をカセットから引き出す。これにより、基板がカセット内で破損することを確実に防ぐことができる。また、引き出し機構は、ガイド部を備える。これにより、引き出し機構がカセットから基板を引き出すとき、基板は、ガイド部により支持されながら引き出される。よって、基板の引き出しを円滑に行うことができる。 Generally speaking, substrates such as semiconductor wafers are thin, brittle, and weak against impact. When such a substrate is supplied to the transport path, if the storage unit or the cassette is moved vertically or horizontally, the substrate may be damaged in the cassette due to shaking or vibration. In this respect, in this configuration, the storage unit and the cassette do not move, and the hand moves in the stacking direction by the moving mechanism to pull out the substrate to be supplied from the cassette. This makes it possible to reliably prevent the substrate from being damaged in the cassette. Further, the drawer mechanism includes a guide portion. Thus, when the pulling-out mechanism pulls out the substrate from the cassette, the substrate is pulled out while being supported by the guide portion. Therefore, the substrate can be pulled out smoothly.
 本態様に係る基板供給システムにおいて、前記第1の収納部と前記第2の収納部は、前記積層方向に並んで配置され、前記移動機構は、前記積層方向に前記引き出し機構を移動させるよう構成され得る。 In the substrate supply system according to this aspect, the first storage unit and the second storage unit are arranged side by side in the stacking direction, and the moving mechanism is configured to move the drawer mechanism in the stacking direction. Can be done.
 本態様に係る構成によれば、引き出し機構を積層方向のみに移動させることにより、第1のカセットおよび第2カセットの各基板の収容位置に引き出し機構を位置付けることができる。よって、移動機構の構成および制御を簡素にできる。 According to the configuration of this aspect, by moving the drawing mechanism only in the stacking direction, the drawing mechanism can be positioned at the accommodation position of each substrate of the first cassette and the second cassette. Therefore, the configuration and control of the moving mechanism can be simplified.
 この場合、前記積層方向は、上下方向であるよう構成され得る。 In this case, the stacking direction may be configured to be a vertical direction.
 この構成であれば、基板を安定した状態でカセットに収容できる。また、基板がカセットから水平に引き出されるため、基板を安定的にカセットから引き出すことができる。 With this configuration, the substrate can be stored in the cassette in a stable state. Further, since the substrate is pulled out horizontally from the cassette, the substrate can be stably pulled out from the cassette.
 本態様に係る基板供給システムにおいて、前記移動機構を制御する制御部を備え、前記制御部は、前記移動機構により、前記引き出し機構を前記積層方向の一方向に移動させるよう構成され得る。 In the substrate supply system according to this aspect, a control unit that controls the moving mechanism may be provided, and the control unit may be configured to move the drawing mechanism in one direction of the stacking direction by the moving mechanism.
 本態様に係る構成によれば、引き出し機構は積層方向を行き来することなく、一方向に移動する。これにより、第1のカセットまたは第2のカセットの一方から順に基板が搬送路に供給される。そして、空になった方のカセットを速やかに収納装置から取り出して、新たな基板をそのカセットに収容し、再び、収納装置に収納することができる。 According to the configuration of this aspect, the drawer mechanism moves in one direction without moving back and forth in the stacking direction. As a result, the substrates are sequentially supplied to the transport path from one of the first cassette and the second cassette. Then, the empty cassette can be quickly taken out of the storage device, a new substrate can be stored in the cassette, and the new substrate can be stored in the storage device again.
 また、搬送路に供給された基板が元のカセットに回収される場合であれば、搬送路に供給された基板が所定の装置で加工されて元のカセットに搬送された後、加工済みの基板が収容された方のカセットを収納装置から取り出す。そして、上記と同様に、未加工の基板をカセットに収容し、再び、収納装置に収納することができる。このように、基板の供給が円滑に、また、効率よく行われる。 If the substrate supplied to the transfer path is collected in the original cassette, the processed substrate is processed after the substrate supplied to the transfer path is processed by a predetermined device and transferred to the original cassette. The cassette in which the is stored is removed from the storage device. Then, similarly to the above, the unprocessed substrate can be stored in the cassette and then stored again in the storage device. In this way, the substrate can be supplied smoothly and efficiently.
 この場合、前記積層方向は上下方向であって、前記制御部は、前記移動機構により、前記引き出し機構を下方から上方の一方向に移動させるよう構成され得る。 In this case, the stacking direction is an up-down direction, and the control unit may be configured to move the pull-out mechanism in one direction from the lower side to the upper side by the moving mechanism.
 本態様に係る構成によれば、引き出し機構は、下側に配置されているカセットの一番下に収容されている基板から、上側に配置されているカセットの一番上に収容されている基板まで、順に基板を引き出す。これにより、効率よく1つのカセットから基板を搬送路に供給することができる。よって、空になった、あるいは、加工後の基板が収容されたカセットを、収納装置から取り出して未加工の基板をカセットに収容し、再び、収納装置に収納するという作業のサイクルを早めることができる。 According to the configuration of this aspect, the drawer mechanism is configured such that the substrate housed at the bottom of the cassette arranged at the lower side is moved to the substrate housed at the top of the cassette arranged at the upper side. Until the board is pulled out in order. As a result, the substrate can be efficiently supplied from one cassette to the transfer path. Therefore, it is possible to expedite the cycle of the work of taking out the cassette containing the empty or processed substrate from the storage device, storing the unprocessed substrate in the cassette, and storing it again in the storage device. it can.
 本発明の第2の態様は、基板を加工する基板加工装置に関する。本態様に係る基板加工装置は、複数の基板を所定の間隔で積層した状態で収容するカセットから前記基板を搬送路に供給する基板供給システムであって、第1のカセットを着脱可能に収納する第1の収納部と、第2のカセットを着脱可能に収納する第2の収納部と、前記基板を前記第1のカセットおよび前記第2のカセットから前記基板の積層方向に垂直な方向に引き出して前記搬送路に受け渡す引き出し機構と、前記引き出し機構を前記第1の収納部と前記第2の収納部との間で移動させる移動機構と、を備える基板供給システムを備える。また、本態様の基板加工装置は、前記基板の表面にスクライブラインを形成するスクライブユニットと、前記スクライブラインが形成された前記基板の表面にフィルムを貼付するフィルムラミネートユニットと、前記フィルムが貼付された面が下側となるように前記基板を反転させる反転ユニットと、前記フィルムが貼付されていない面に所定の力を付与して前記スクライブラインに沿って前記基板を分断するブレイクユニットと、前記基板を所定の位置に搬送する搬送部と、を備える。 The second aspect of the present invention relates to a substrate processing apparatus for processing a substrate. A substrate processing apparatus according to this aspect is a substrate supply system that supplies the substrates to a transport path from a cassette that accommodates a plurality of substrates in a stacked state at a predetermined interval, and detachably accommodates the first cassette. A first storage portion, a second storage portion that detachably stores the second cassette, and the substrate is drawn from the first cassette and the second cassette in a direction perpendicular to the stacking direction of the substrates. And a moving mechanism for moving the pullout mechanism between the first storage section and the second storage section. Further, the substrate processing apparatus of the present aspect, a scribe unit that forms a scribe line on the surface of the substrate, a film laminating unit that attaches a film to the surface of the substrate on which the scribe line is formed, and the film is attached. A reversing unit for reversing the substrate so that the face is on the lower side, a break unit for dividing the substrate along the scribe line by applying a predetermined force to the surface on which the film is not attached, And a transport unit that transports the substrate to a predetermined position.
 この構成であれば、第1の態様と同様の効果を奏する。 With this configuration, the same effect as that of the first aspect is achieved.
 以上のとおり、本発明によれば、装置の稼働率を高めることが可能な基板供給システム、および基板供給システムを備えた基板加工装置を提供することができる。 As described above, according to the present invention, it is possible to provide a substrate supply system capable of increasing the operating rate of the device, and a substrate processing apparatus including the substrate supply system.
 本発明の効果ないし意義は、以下に示す実施の形態の説明により更に明らかとなろう。ただし、以下に示す実施の形態は、あくまでも、本発明を実施化する際の一つの例示であって、本発明は、以下の実施の形態に記載されたものに何ら制限されるものではない。 The effect or significance of the present invention will be further clarified by the description of the embodiments below. However, the embodiment described below is merely an example for embodying the present invention, and the present invention is not limited to what is described in the following embodiment.
図1(a)~(c)は、実施形態に係る基板供給システムの構成を示す斜視図である。図1(a)は、基板供給システムの構成を示す斜視図である。図1(b)は、基板供給システムに収納されるカセットの構成を示す斜視図である。図1(c)は、基板供給システムの収納装置の構成を示す斜視図であり、図1(a)に対応する。1A to 1C are perspective views showing the configuration of the substrate supply system according to the embodiment. FIG. 1A is a perspective view showing the configuration of the substrate supply system. FIG. 1B is a perspective view showing the configuration of the cassette housed in the substrate supply system. FIG. 1C is a perspective view showing the configuration of the storage device of the substrate supply system, and corresponds to FIG. 図2(a)、(b)は、実施形態に係る基板供給システムの引き出し機構および移動機構の構成を示す斜視図である。FIG. 2A and FIG. 2B are perspective views showing the configurations of the drawing mechanism and the moving mechanism of the substrate supply system according to the embodiment. 図3(a)、(b)は、実施形態に係る基板供給システムと搬送路とを示す斜視図である。3A and 3B are perspective views showing the substrate supply system and the transfer path according to the embodiment. 図4(a)、(b)は、実施形態に係る基板供給システムと搬送路とを示す斜視図である。4A and 4B are perspective views showing the substrate supply system and the transfer path according to the embodiment. 図5(a)は、実施形態に係る基板供給システムの構成を示すブロック図である。図5(b)は、実施形態に係る基板供給システムの動作を示すフローチャートである。FIG. 5A is a block diagram showing the configuration of the substrate supply system according to the embodiment. FIG. 5B is a flowchart showing the operation of the substrate supply system according to the embodiment. 図6(a)~(c)は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。6A to 6C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment. 図7は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。FIG. 7 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment. 図8は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。FIG. 8 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment. 図9は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。FIG. 9 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment. 図10(a)~(c)は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。図10(a)、(b)は、リンク機構周辺の拡大図である。図10(c)は、図9に対応する斜視図である。10A to 10C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment. 10A and 10B are enlarged views around the link mechanism. FIG. 10C is a perspective view corresponding to FIG. 9. 図11は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。FIG. 11 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment. 図12(a)~(c)は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。図12(a)、(b)は、リンク機構周辺の拡大図である。図12(c)は、図11に対応する斜視図である。12A to 12C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment. 12A and 12B are enlarged views around the link mechanism. FIG. 12C is a perspective view corresponding to FIG. 11. 図13は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。FIG. 13 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment. 図14(a)、(b)は、実施形態に係る基板供給システムの収納装置の構成を示す斜視図である。図14(a)は、リンク機構周辺の拡大図である。図14(b)は、図13に対応する斜視図である。14A and 14B are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment. FIG. 14A is an enlarged view around the link mechanism. FIG. 14B is a perspective view corresponding to FIG. 13. 図15は、実施形態に係る基板供給システムを備えた基板加工装置の構成を示す斜視図である。FIG. 15 is a perspective view showing the configuration of a substrate processing apparatus including the substrate supply system according to the embodiment.
 以下、本発明の実施形態について、図面を参照して説明する。なお、各図には、便宜上、互いに直交するX軸、Y軸およびZ軸が付記されている。X-Y平面は水平面に平行で、Z軸方向は鉛直方向である。Z軸正側が上方であり、Z軸負側が下方である。また、本実施の形態において、Z軸方向が特許請求の範囲に記載の「積層方向」である。この積層方向は、本実施の形態において、「上下方向」と表記される場合がある。また、Y軸方向が特許請求の範囲に記載の「積層方向に垂直な方向」である。このY軸方向は、本実施の形態において、「水平方向」と表記される場合がある。 Embodiments of the present invention will be described below with reference to the drawings. It should be noted that, for convenience, X-axis, Y-axis, and Z-axis orthogonal to each other are added to each drawing. The XY plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction. The Z-axis positive side is the upper side, and the Z-axis negative side is the lower side. Further, in the present embodiment, the Z-axis direction is the “stacking direction” described in the claims. In the present embodiment, this stacking direction may be referred to as the “vertical direction”. The Y-axis direction is the “direction perpendicular to the stacking direction” described in the claims. This Y-axis direction may be described as “horizontal direction” in the present embodiment.
 <実施形態>
 [基板供給システムの構成]
 本実施の形態の基板供給システム1は、電子機器等に広く利用される半導体デバイスの材料である半導体ウェーハの製造の際、ウェーハを所定の装置に搬送する搬送路に供給するために用いられる。本実施の形態において、基板供給システム1による供給対象の基板は、環状のフレームにダイシングテープで貼付された半導体ウェーハである。以降、「環状のフレームにダイシングテープで貼付された半導体ウェーハ」は、単に、「ウェーハW」と表記される。また、本実施の形態の説明では、ウェーハWが基板供給システム1から完全に引き出された位置を「引き出し位置」と称し、この引き出し位置から搬送路に受け渡される位置を「受渡位置」と称する。
<Embodiment>
[Structure of substrate supply system]
The substrate supply system 1 according to the present embodiment is used for supplying a wafer to a transfer path for transferring the wafer to a predetermined device when manufacturing a semiconductor wafer which is a material of a semiconductor device widely used in electronic devices and the like. In the present embodiment, the substrate to be supplied by the substrate supply system 1 is a semiconductor wafer attached to an annular frame with a dicing tape. Hereinafter, the "semiconductor wafer attached to the annular frame with the dicing tape" is simply referred to as "wafer W". Further, in the description of the present embodiment, the position where the wafer W is completely pulled out from the substrate supply system 1 is referred to as a “drawing position”, and the position where the wafer W is transferred to the transfer path is referred to as a “transfer position”. ..
 ウェーハWの材質として、たとえば、単結晶シリコン(Si)、炭化ケイ素(SiC)、窒化ガリウム(GaN)、およびヒ化ガリウム(GaSa)等が挙げられる。半導体ウェーハの上記のような材質、厚み、およびサイズは、製造目的の半導体デバイスの種類、機能等によって適切に選択され、設計される。 Examples of the material of the wafer W include single crystal silicon (Si), silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide (GaSa). The above-mentioned material, thickness, and size of the semiconductor wafer are appropriately selected and designed according to the type, function, etc. of the semiconductor device to be manufactured.
 図1(a)~(c)は、基板供給システム1の構成を示す斜視図である。図1(a)は、基板供給システム1の斜視図であり、図1(b)は、ウェーハWが収容されたカセットを示す斜視図であり、図1(c)は、収納装置100の斜視図である。 1A to 1C are perspective views showing the configuration of the substrate supply system 1. 1A is a perspective view of the substrate supply system 1, FIG. 1B is a perspective view showing a cassette in which a wafer W is stored, and FIG. 1C is a perspective view of a storage device 100. It is a figure.
 図1(a)に示すように、基板供給システム1は、収納装置100と、引き出し機構200と、移動機構300と、を備えている。なお、収納装置100全体は筐体で覆われているが、説明の便宜上、この筐体は省略されている。以降、全ての図において、収納装置100全体を覆う筐体は省略されている。 As shown in FIG. 1A, the substrate supply system 1 includes a storage device 100, a drawer mechanism 200, and a movement mechanism 300. Although the entire storage device 100 is covered with a housing, this housing is omitted for convenience of description. Hereinafter, in all of the drawings, the casing that covers the entire storage device 100 is omitted.
 収納装置100は、搬送路に供給されるウェーハWが収納される。具体的には、図1(b)に示すように、複数のウェーハWが積層された状態でカセットに収容され、このカセットが収納装置100に収納される。本実施の形態では、第1のカセット10および第2のカセット20の2つが用意される。第1のカセット10の側壁11a、11bの内側面に、所定の間隔で溝12が設けられている。ウェーハWは、この溝12に挿入されることにより、第1のカセット10の内部で支持された状態で収容される。 The storage device 100 stores the wafer W supplied to the transfer path. Specifically, as shown in FIG. 1B, a plurality of wafers W are stacked and stored in a cassette, and the cassette is stored in the storage device 100. In this embodiment, two cassettes, the first cassette 10 and the second cassette 20, are prepared. Grooves 12 are provided at predetermined intervals on the inner surfaces of the side walls 11a and 11b of the first cassette 10. The wafer W is accommodated while being supported inside the first cassette 10 by being inserted into the groove 12.
 第1のカセット10の上部には、オペレータが第1のカセット10を持ち運びする際に使用される取っ手13が設けられている。第2のカセット20は、第1のカセット10と同様の構成であるため、説明を省略する。なお、上記では、第1のカセット10および第2のカセット20は、共通のカセットとして説明したが、第1のカセット10と第2のカセット20とで、側壁11a、11bの内側面に設けられる溝12の間隔を異ならせてもよく、また、収容するウェーハWの数を異ならせてもよい。 A handle 13 used by an operator to carry the first cassette 10 is provided above the first cassette 10. Since the second cassette 20 has the same configuration as the first cassette 10, the description will be omitted. In the above description, the first cassette 10 and the second cassette 20 are described as a common cassette, but the first cassette 10 and the second cassette 20 are provided on the inner side surfaces of the side walls 11a and 11b. The intervals of the grooves 12 may be different, and the number of wafers W to be accommodated may be different.
 収納装置100は、上記した第1のカセット10および第2のカセット20を収納する。図1(c)に示すように、収納装置100は、ウェーハWの積層方向、つまり、上下方向に並んで配置されている第1の収納部101と第2の収納部102とを備える。また、収納装置100は、第1の収納部101に、第1のカセット10が着脱可能に載置される載置部110と、第1の収納部101を覆う筐体103と、扉104と、載置部110に設置される取っ手112と、収納装置100と引き出し位置とを遮断するシャッタ140と、を備える。 The storage device 100 stores the first cassette 10 and the second cassette 20 described above. As shown in FIG. 1C, the storage device 100 includes a first storage portion 101 and a second storage portion 102 that are arranged side by side in the stacking direction of the wafers W, that is, in the vertical direction. Further, the storage device 100 includes a mounting portion 110 on which the first cassette 10 is detachably mounted, a housing 103 that covers the first storage portion 101, and a door 104 in the first storage portion 101. A handle 112 installed on the placement unit 110 and a shutter 140 that shuts off the storage device 100 from the pulled-out position are provided.
 上記のとおり、収納装置100は、第1の収納部101が筐体103で覆われ、また、水平方向に開閉する扉104が設けられている。扉104は、図1(a)、(c)において図示を省略した、収納装置100全体を覆う筐体に取付られており、扉104を開閉すると、第1の収納部101にアクセスすることができる。また、オペレータが基板供給システム1の稼働中、第1のカセット10および第2のカセット20を視認できるよう、扉104を透明な部材で構成することができる。図1(c)では、扉104が透明な場合を図示している。 As described above, in the storage device 100, the first storage portion 101 is covered with the housing 103, and the door 104 that opens and closes in the horizontal direction is provided. The door 104 is attached to a casing (not shown in FIGS. 1A and 1C) that covers the entire storage device 100. When the door 104 is opened and closed, the first storage unit 101 can be accessed. it can. Further, the door 104 can be made of a transparent member so that the operator can visually recognize the first cassette 10 and the second cassette 20 during the operation of the substrate supply system 1. FIG. 1C illustrates the case where the door 104 is transparent.
 上記した筐体103、扉104、載置部110、および取っ手112は、第2の収納部102についても同様に設けられる。 The case 103, the door 104, the mounting portion 110, and the handle 112 described above are similarly provided for the second storage portion 102.
 このように、収納装置100が第1の収納部101と第2の収納部102とを備えており、第1の収納部101および第2の収納部102のそれぞれに扉104が設けられている。このため、たとえば、第1の収納部101に収納された第1のカセット10からウェーハWが搬送路に供給されている間、オペレータは、第2の収納部102の扉104を開けて、第2の収納部102の載置部110をY軸負方向に引き出すことができる。このとき、第2の収納部102に第2のカセット20が収納されていない、あるいは、第2のカセット20内にウェーハWが収容されていない場合(つまり、第2のカセット20から全てのウェーハWが搬送路に供給されていた場合)、オペレータは、第2のカセット20にウェーハWを収容し、第2の収納部102の載置部110に適切に第2のカセット20を載置した後、第2の収納部102の載置部110をY軸正方向に引き入れる。このように、第2の収納部102に第2のカセット20を収納することができる。 As described above, the storage device 100 includes the first storage portion 101 and the second storage portion 102, and the door 104 is provided in each of the first storage portion 101 and the second storage portion 102. .. Therefore, for example, while the wafer W is being supplied from the first cassette 10 stored in the first storage unit 101 to the transfer path, the operator opens the door 104 of the second storage unit 102 to The mounting portion 110 of the second storage portion 102 can be pulled out in the Y-axis negative direction. At this time, when the second cassette 20 is not stored in the second storage section 102 or when the wafer W is not stored in the second cassette 20 (that is, all the wafers from the second cassette 20 are stored). When W is supplied to the transfer path), the operator stores the wafer W in the second cassette 20 and appropriately mounts the second cassette 20 on the mounting unit 110 of the second storage unit 102. After that, the mounting portion 110 of the second storage portion 102 is pulled in the Y-axis positive direction. In this way, the second cassette 20 can be stored in the second storage section 102.
 図1(a)に示すように、シャッタ140は、収納装置100において、ウェーハWが搬送路に供給される場合、開放される。たとえば、上記の場合であれば、第1の収納部101からウェーハWが搬送路に供給されているため、第1の収納部101に設けられているシャッタ140は、開放されている。一方、第2の収納部102では、第2のカセット20の取り出しが行われている。このような場合、第2の収納部102のシャッタ140が開放されると、作業者の手が誤って第2の収納部102の奥方(Y軸正側)に入り込み危険である。あるいは、新たなウェーハWが収容された第2のカセット20を第2の収納部102に収納する際、ウェーハWが第2のカセット20から奥方へ飛び出し、落下する虞がある。そのため、第2の収納部102と引き出し位置との間を遮断するため、第2の収納部102のシャッタ140は閉塞される。なお、図1(a)、(c)は、説明の便宜上、各収納部の内部が見えるように図示するために、第1の収納部101のシャッタ140および第2の収納部102のシャッタ140は開放された状態が図示されているが、実際の動作に対応するものではない。これは、図3(a)~図4(b)も同様である。 As shown in FIG. 1A, the shutter 140 is opened in the storage device 100 when the wafer W is supplied to the transfer path. For example, in the above case, since the wafer W is supplied from the first storage unit 101 to the transfer path, the shutter 140 provided in the first storage unit 101 is open. On the other hand, in the second storage section 102, the second cassette 20 is being taken out. In such a case, if the shutter 140 of the second storage unit 102 is opened, the operator's hand may accidentally enter the back (Y-axis positive side) of the second storage unit 102, which is dangerous. Alternatively, when the second cassette 20 in which a new wafer W is stored is stored in the second storage section 102, the wafer W may jump out of the second cassette 20 and fall. Therefore, the shutter 140 of the second storage unit 102 is closed in order to block the space between the second storage unit 102 and the pulled-out position. 1A and 1C, for convenience of description, the shutter 140 of the first storage unit 101 and the shutter 140 of the second storage unit 102 are illustrated so that the inside of each storage unit can be seen. The open state is shown, but it does not correspond to the actual operation. This is the same in FIGS. 3A to 4B.
 また、収納装置100は、図1(c)に示すように、移動部120と、規制部130と、昇降機構150と、支持部160と、リンク機構170と、検知手段180と、を備えている。なお、移動部120は、図1(c)では図示されず、図6にて図示される。収納装置100の詳細な構成に関しては、追って、図6~図14(b)を参照しながら説明する。 In addition, as shown in FIG. 1C, the storage device 100 includes a moving unit 120, a restricting unit 130, an elevating mechanism 150, a supporting unit 160, a link mechanism 170, and a detecting unit 180. There is. The moving unit 120 is not shown in FIG. 1C but is shown in FIG. The detailed configuration of the storage device 100 will be described later with reference to FIGS. 6 to 14B.
 次に、引き出し機構200について説明する。 Next, the drawer mechanism 200 will be described.
 図2(a)、(b)は、引き出し機構200および移動機構300の構成を示す斜視図である。 2A and 2B are perspective views showing the configurations of the drawer mechanism 200 and the movement mechanism 300.
 引き出し機構200は、搬送路にウェーハWを供給するため、第1のカセット10および第2のカセット20からウェーハWを引き出す。引き出し機構200は、ハンド210と、駆動機構220と、ガイド部230と、退避機構240と、センサ250と、を備えている。 The drawing mechanism 200 draws the wafer W from the first cassette 10 and the second cassette 20 in order to supply the wafer W to the transfer path. The drawer mechanism 200 includes a hand 210, a drive mechanism 220, a guide section 230, a retracting mechanism 240, and a sensor 250.
 ハンド210は、ウェーハWの周縁部を把持する。駆動機構220は、ハンド210を水平方向に移動させる。 The hand 210 holds the peripheral edge of the wafer W. The drive mechanism 220 moves the hand 210 in the horizontal direction.
 ガイド部230は、カセットから引き出されたウェーハWを支持しながら、搬送路へ案内する。ガイド部230は、レール231a、231bと、レール231a、231bを支持するガイド支持部材232a~232cと、を備えている。レール231a、231bは、X軸正側および負側に配置されている。レール231a、231bのそれぞれの下部に、ガイド支持部材232a、232bが当接する。ガイド支持部材232a、232bのそれぞれの下部に、ガイド支持部材232cが連結される。 The guide unit 230 guides the wafer W pulled out from the cassette to the transfer path while supporting the wafer W. The guide portion 230 includes rails 231a and 231b and guide support members 232a to 232c that support the rails 231a and 231b. The rails 231a and 231b are arranged on the X-axis positive side and the negative side. The guide support members 232a and 232b are in contact with the lower portions of the rails 231a and 231b, respectively. A guide support member 232c is connected to the lower portion of each of the guide support members 232a and 232b.
 また、ガイド支持部材232a~232cは、矩形状の板部材である。図2(a)、(b)では、ガイド支持部材232aは2体に分けられているが、一体であっても構わない
 退避機構240は、収納装置100から引き出されたウェーハWが搬送路に受け渡される際、受渡位置でウェーハWを受け取る部材(たとえば、搬送路側の把持部材)とハンド210との干渉を回避させる。
The guide support members 232a to 232c are rectangular plate members. 2A and 2B, the guide support member 232a is divided into two bodies, but the guide support member 232a may be integrated into one body. In the retracting mechanism 240, the wafer W pulled out from the storage device 100 is used as a transfer path. When the wafer is delivered, the interference between a member that receives the wafer W at the delivery position (for example, a holding member on the transfer path side) and the hand 210 is avoided.
 センサ250は、ハンド210がカセットからウェーハWを引き出す際、供給対象のウェーハWを検知する。ハンド210、センサ250、および退避機構240は、Y軸負側からこの順に、連結部材を介して連結される。また、退避機構240は、ハンド210およびセンサ250よりも下方に配置される。 The sensor 250 detects the wafer W to be supplied when the hand 210 pulls out the wafer W from the cassette. The hand 210, the sensor 250, and the retracting mechanism 240 are connected in this order from the Y-axis negative side via a connecting member. Further, the retracting mechanism 240 is arranged below the hand 210 and the sensor 250.
 また、退避機構240は、具体的には、エアシリンダである。退避機構240にエアシリンダ駆動部405から所定の圧力が付与されると、退避機構240と、連結部材を介して連結されているハンド210およびセンサ250とが一体的に下方に移動する。なお、エアシリンダ駆動部405は、図5(a)で図示される。 Further, the retracting mechanism 240 is specifically an air cylinder. When a predetermined pressure is applied to the retracting mechanism 240 from the air cylinder drive unit 405, the retracting mechanism 240 and the hand 210 and the sensor 250 connected via the connecting member move integrally downward. The air cylinder drive unit 405 is illustrated in FIG.
 駆動機構220は、ハンド210に把持されたウェーハWを水平方向に移動させる。駆動機構220は、ウェーハWを水平方向に移動させる引き出しガイド部221と、引き出しガイド部221を移動させる移動部材222と、を備えている。図2(a)、(b)に示すように、引き出しガイド部221は、ガイド支持部材232a~232cにより囲まれる空間内配置されており、ガイド支持部材232cに装着される。また、移動部材222には、退避機構240が装着されている。 The drive mechanism 220 moves the wafer W held by the hand 210 in the horizontal direction. The drive mechanism 220 includes a drawing guide part 221 that moves the wafer W in the horizontal direction, and a moving member 222 that moves the drawing guide part 221. As shown in FIGS. 2A and 2B, the drawer guide portion 221 is arranged in the space surrounded by the guide support members 232a to 232c, and is attached to the guide support member 232c. A retracting mechanism 240 is attached to the moving member 222.
 引き出し機構200において、移動部材222が引き出しガイド部221を水平方向に移動すると、退避機構240、センサ250、ハンド210、ガイド部230、およびウェーハWが一体的に水平方向に移動する。 In the pulling-out mechanism 200, when the moving member 222 moves the pulling-out guide part 221 in the horizontal direction, the retracting mechanism 240, the sensor 250, the hand 210, the guide part 230, and the wafer W integrally move in the horizontal direction.
 移動機構300は、引き出し機構200を、第1の収納部101と第2の収納部102との間で昇降移動させる。移動機構300は、引き出し機構200を昇降させる昇降ガイド310と、昇降ガイド310を昇降する昇降部材320と、を備えている。 The moving mechanism 300 moves the drawer mechanism 200 up and down between the first storage unit 101 and the second storage unit 102. The moving mechanism 300 includes an elevating guide 310 that elevates the drawer mechanism 200, and an elevating member 320 that elevates the elevating guide 310.
 昇降部材320は、ガイド支持部材232bに装着されている。移動機構300において、昇降部材320が昇降ガイド310を移動することにより、昇降部材320を介して引き出し機構200が一体的に昇降する。 The lifting member 320 is attached to the guide support member 232b. In the moving mechanism 300, the raising / lowering member 320 moves the raising / lowering guide 310, so that the drawer mechanism 200 is integrally raised / lowered via the raising / lowering member 320.
 次に、基板供給システム1によるウェーハWの搬送路への供給について説明する。ここでは、基板供給システム1は、ウェーハWを搬送路500に供給する場合を想定して説明する。 Next, the supply of the wafer W to the transfer path by the substrate supply system 1 will be described. Here, the substrate supply system 1 will be described on the assumption that the wafer W is supplied to the transfer path 500.
 また、本実施の形態では、第1の収納部101に収納された第1のカセット10の最下部に収容されているウェーハWから順に搬送路に供給する。 Further, in the present embodiment, the wafers W stored in the lowermost part of the first cassette 10 stored in the first storage unit 101 are sequentially supplied to the transfer path.
 図3(a)~4(b)は、基板供給システム1と搬送路500との構成を示す斜視図である。図3(a)は、引き出し機構200によりウェーハWが引き出される場合であり、図3(b)は、引き出し機構200によるウェーハWの引き出しが完了した場合である。図4(a)は、引き出し機構200が搬送路500の受渡位置にウェーハWを受け渡す直前を示しており、図4(b)は、搬送路500の受渡位置にウェーハWの受け渡しが完了した場合を示している。 FIGS. 3A to 4B are perspective views showing the configurations of the substrate supply system 1 and the transfer path 500. FIG. 3A shows the case where the wafer W is drawn out by the drawing mechanism 200, and FIG. 3B shows the case where the drawing of the wafer W by the drawing mechanism 200 is completed. 4A shows a state immediately before the drawing mechanism 200 delivers the wafer W to the delivery position of the transfer path 500, and FIG. 4B shows that the delivery of the wafer W to the delivery position of the transfer path 500 is completed. The case is shown.
 図3(a)~図4(b)に示すように、搬送路500は、搬送機構510と、2つの搬送レール520と、案内部材530と、搬送ハンド540と、を備える。搬送ハンド540は、基板供給システム1から受け渡されたウェーハWを把持する。搬送レール520案内部材530に搬送ハンド540が装着されており、搬送機構510を駆動すると、案内部材530が搬送機構510のガイドに沿って移動する。これにより、搬送レール520に沿ってウェーハWが搬送される。 As shown in FIGS. 3A to 4B, the transport path 500 includes a transport mechanism 510, two transport rails 520, a guide member 530, and a transport hand 540. The transfer hand 540 holds the wafer W transferred from the substrate supply system 1. The transport hand 540 is attached to the guide member 530 of the transport rail 520, and when the transport mechanism 510 is driven, the guide member 530 moves along the guide of the transport mechanism 510. As a result, the wafer W is transferred along the transfer rail 520.
 図3(a)に示すように、移動機構300が引き出し機構200を一体的に下方に移動させ、所定の高さ位置に位置付ける。このとき、移動機構300は、ハンド210が第1のカセット10または第2のカセット20に収容されている供給対象のウェーハWと対向する位置に、引き出し機構200を一体的に移動させる。そして、供給対象のウェーハWの高さ位置に位置付けられたハンド210は、駆動機構220によりY軸負側に移動して、供給対象のウェーハWを把持する。このとき、センサ250が、供給対象のウェーハWを検知する。基板供給システム1のこの動作を、「引き出し動作」と称する。 As shown in FIG. 3 (a), the moving mechanism 300 integrally moves the pull-out mechanism 200 downward and positions it at a predetermined height position. At this time, the moving mechanism 300 integrally moves the pulling mechanism 200 to a position where the hand 210 faces the wafer W to be supplied, which is accommodated in the first cassette 10 or the second cassette 20. Then, the hand 210 positioned at the height position of the wafer W to be supplied moves to the Y-axis negative side by the drive mechanism 220 and holds the wafer W to be supplied. At this time, the sensor 250 detects the wafer W to be supplied. This operation of the substrate supply system 1 is referred to as "drawing operation".
 図3(b)に示すように、ウェーハWがハンド210に把持されると、駆動機構220は、Y軸正側にウェーハWを引き出す。引き出されたウェーハWは、レール231a、231bに支持され、案内されながら引き出し位置に位置付けられる。このとき、ハンド210はウェーハWを把持した状態である。基板供給システム1のこの動作を、「引き出し完了動作」と称する。 As shown in FIG. 3B, when the wafer W is gripped by the hand 210, the drive mechanism 220 pulls the wafer W to the Y axis positive side. The pulled-out wafer W is supported by rails 231a and 231b and positioned at the pull-out position while being guided. At this time, the hand 210 is in a state of holding the wafer W. This operation of the substrate supply system 1 is referred to as "drawing completion operation".
 図4(a)に示すように、ウェーハWが引き出し位置に位置付けられると、移動機構300は引き出し機構200を一体的に上方に移動させる。このとき、レール231a、231bの高さ位置と、搬送路500の搬送レール520の高さ位置とが一致するように、移動機構300は引き出し機構200を一体的に移動させる。また、ハンド210はウェーハWを把持した状態である。基板供給システム1のこの動作を、「受渡準備動作」と称する。 As shown in FIG. 4A, when the wafer W is positioned at the extraction position, the moving mechanism 300 integrally moves the extraction mechanism 200 upward. At this time, the moving mechanism 300 integrally moves the drawer mechanism 200 so that the height positions of the rails 231a and 231b and the height position of the transport rail 520 of the transport path 500 match. The hand 210 is in a state of holding the wafer W. This operation of the substrate supply system 1 is referred to as "delivery preparation operation".
 図4(b)に示すように、引き出し機構200のレール231a、231bが搬送レール520の高さ位置、すなわち受渡位置に位置付けられると、ハンド210はウェーハWを離す。そして、退避機構240に所定の圧力が付与されて、ハンド210とセンサ250とが搬送レール520よりも下方に移動する。これにより、ハンド210とセンサ250とが、搬送ハンド540と干渉しない。なお、この状態では、ウェーハWは未だレール231a、231bに支持されている。基板供給システム1のこの動作を、「受渡完了動作」と称する。 As shown in FIG. 4B, when the rails 231a and 231b of the pullout mechanism 200 are positioned at the height position of the transfer rail 520, that is, the delivery position, the hand 210 releases the wafer W. Then, a predetermined pressure is applied to the retracting mechanism 240, and the hand 210 and the sensor 250 move below the transport rail 520. As a result, the hand 210 and the sensor 250 do not interfere with the transport hand 540. In this state, the wafer W is still supported by the rails 231a and 231b. This operation of the substrate supply system 1 is referred to as "delivery completion operation".
 ハンド210がウェーハWを離すと、搬送機構510を駆動により、搬送ハンド540が装着されている案内部材530が搬送機構のガイドに沿って移動し、搬送ハンド540は、ウェーハWを把持する。そして、搬送レール520に支持されながら所定の場所へウェーハWは搬送される。 When the hand 210 releases the wafer W, the transfer mechanism 510 is driven to move the guide member 530 to which the transfer hand 540 is attached along the guide of the transfer mechanism, and the transfer hand 540 holds the wafer W. Then, the wafer W is transported to a predetermined place while being supported by the transport rail 520.
 以上のようにして、基板供給システム1はウェーハWを搬送路に供給する。基板供給システム1は、上記の引き出し動作、引き出し完了動作、受渡準備動作、および受渡完了動作を供給対象のウェーハWがある間、繰り返し実行する。 The substrate supply system 1 supplies the wafer W to the transfer path as described above. The substrate supply system 1 repeatedly executes the above-mentioned drawing operation, drawing completion operation, delivery preparation operation, and delivery completion operation while the wafer W to be supplied is present.
 本実施の形態では、第1のカセット10に収容されていたウェーハWが全て搬送路に供給された場合、引き出し機構200および移動機構300は、第2の収納部102に収納されている第2のカセット20からウェーハWを引き出して、搬送路に供給する。このとき、第1のカセット10からウェーハWを引き出したときと同様に、引き出し機構200および移動機構300は、第2のカセット20の最下部に収容されているウェーハWから順に引き出す。 In the present embodiment, when all the wafers W stored in the first cassette 10 are supplied to the transfer path, the pull-out mechanism 200 and the moving mechanism 300 are the second storage units stored in the second storage unit 102. The wafer W is pulled out from the cassette 20 and is supplied to the transfer path. At this time, similarly to when the wafer W is pulled out from the first cassette 10, the pull-out mechanism 200 and the moving mechanism 300 sequentially pull out the wafer W stored in the lowermost part of the second cassette 20.
 基板供給システム1が第2のカセット20からウェーハWを引き出して搬送路に供給している間、オペレータは、第1の収納部101の扉104を開け、第1の収納部101の載置部110をY軸負方向に引き出し、載置部110を着脱位置に位置付ける。そして、オペレータは、第1の収納部101の載置部110から第1のカセット10を取り出して、第1のカセット10に新たなウェーハWを収容して第1の収納部101の載置部110に載置した後、再び、第1の収納部101を収納位置に位置付けることができる。このように、第1の収納部101から第1のカセットを取り出している間であっても、第2のカセット20からウェーハWが引き出され、搬送路への供給動作が継続されている。よって、基板供給システム1の稼働率を高めることができる。 While the substrate supply system 1 pulls out the wafer W from the second cassette 20 and supplies the wafer W to the transfer path, the operator opens the door 104 of the first storage unit 101 to set the mounting unit of the first storage unit 101. 110 is pulled out in the negative direction of the Y-axis, and the mounting portion 110 is positioned at the mounting / removing position. Then, the operator takes out the first cassette 10 from the mounting portion 110 of the first storage portion 101, stores a new wafer W in the first cassette 10, and places the mounting portion of the first storage portion 101. After being mounted on 110, the first storage unit 101 can be positioned again at the storage position. In this way, even while the first cassette is being taken out from the first storage unit 101, the wafer W is pulled out from the second cassette 20 and the supply operation to the transfer path is continued. Therefore, the operating rate of the substrate supply system 1 can be increased.
 なお、搬送路でのウェーハWの受け渡しは、上記のように、ハンドによってウェーハWを把持する他に、たとえば、吸着パッドを備えた部材により、ウェーハWを吸着し、保持してもよい。 The delivery of the wafer W on the transfer path may be performed by holding the wafer W by the hand as described above, or by sucking and holding the wafer W by, for example, a member having a suction pad.
 [基板供給システムの供給動作]
 次に、基板供給システム1によるウェーハWの供給動作について説明する。図5(a)は、基板供給システム1の構成を示すブロック図である。図5(a)に示すように、基板供給システム1は、収納装置100と、引き出し機構200と、移動機構300と、を備え、さらに、制御部400と、入力部401と、検出部402と、を備える。また、引き出しガイド部221、昇降ガイド310、および退避機構240のそれぞれの駆動部である引き出しガイド駆動部403と、昇降ガイド駆動部404と、エアシリンダ駆動部405と、を備える。
[Supply operation of substrate supply system]
Next, a wafer W supply operation by the substrate supply system 1 will be described. FIG. 5A is a block diagram showing the configuration of the substrate supply system 1. As shown in FIG. 5A, the substrate supply system 1 includes a storage device 100, a drawer mechanism 200, and a movement mechanism 300, and further includes a control unit 400, an input unit 401, and a detection unit 402. , Is provided. Further, a pull-out guide drive unit 403, which is a drive unit of each of the pull-out guide unit 221, the elevating guide 310, and the retracting mechanism 240, an elevating guide drive unit 404, and an air cylinder drive unit 405 are provided.
 制御部400は、CPU等の演算処理回路や、ROM、RAM、ハードディスク等のメモリを含んでいる。制御部は、メモリに記憶されたプログラムに従って各部を制御する。 The control unit 400 includes an arithmetic processing circuit such as a CPU and a memory such as a ROM, a RAM, and a hard disk. The control unit controls each unit according to the program stored in the memory.
 入力部401は、基板供給システム1がウェーハWを搬送路に供給する際の開始を受け付ける。検出部402は、基板供給システム1において、供給対象のウェーハWの位置を検出する。また、検出部402は、ウェーハWが搬送路に供給されたことを検出するよう構成してもよい。検出部402は、たとえば、センサや、撮像装置等を使用することができる。 The input unit 401 receives a start when the substrate supply system 1 supplies the wafer W to the transfer path. The detection unit 402 detects the position of the wafer W to be supplied in the substrate supply system 1. Further, the detection unit 402 may be configured to detect that the wafer W has been supplied to the transfer path. The detection unit 402 can use, for example, a sensor, an imaging device, or the like.
 図5(b)は、本実施の形態に係る基板供給システム1の動作を示すフローチャートである。この制御は、図5(a)に示した制御部400が実行する。ここで、上記と同様に、基板供給システム1から搬送路500にウェーハWを供給する場合の動作について説明する。 FIG. 5B is a flowchart showing the operation of the substrate supply system 1 according to this embodiment. This control is executed by the control unit 400 shown in FIG. Here, similarly to the above, the operation when the wafer W is supplied from the substrate supply system 1 to the transfer path 500 will be described.
 また、図5(b)のフローチャートにおいて、「スタート」は、入力部により、ウェーハWの搬送路への供給開始を受け付けた時点である。なお、収納装置100の第1の収納部101および第2の収納部102にはそれぞれ、ウェーハWが収容された第1のカセット10および第2のカセット20が収納されている。また、第1のカセット10の最下部に収容されているウェーハWから上方のウェーハWへ順に供給される。 Further, in the flowchart of FIG. 5B, “start” is the time when the input unit receives the supply start of the wafer W to the transfer path. The first storage unit 101 and the second storage unit 102 of the storage device 100 respectively store the first cassette 10 and the second cassette 20 in which the wafer W is stored. Further, the wafers W stored in the lowermost part of the first cassette 10 are sequentially supplied to the upper wafers W.
 ステップS11では、昇降ガイド駆動部404に昇降ガイド310を駆動させて、引き出し機構200を供給対象のウェーハWの高さ位置に移動させ、センサ250に供給対象のウェーハWを検知させる。これは、上記の引き出し動作であり、図3(a)に示した状態に相当する。 In step S11, the elevating guide driving unit 404 drives the elevating guide 310 to move the extraction mechanism 200 to the height position of the wafer W to be supplied, and the sensor 250 to detect the wafer W to be supplied. This is the above-mentioned drawing operation, and corresponds to the state shown in FIG.
 ステップS12では、センサ250が供給対象のウェーハWを検出すると、制御部400は、引き出しガイド駆動部403にハンド210を駆動させて、供給対象のウェーハWを把持させ、水平方向に引き出させ、引き出し位置に位置付ける。これは、上記の引き出し完了動作であり、図3(b)に示した状態に相当する。 In step S12, when the sensor 250 detects the supply target wafer W, the control unit 400 causes the extraction guide drive unit 403 to drive the hand 210 to hold the supply target wafer W and to extract the supply target wafer W in the horizontal direction. Position in position. This is the above-mentioned drawing completion operation, and corresponds to the state shown in FIG.
 ステップS13では、制御部400は、昇降ガイド駆動部404に昇降ガイド310を駆動させて、引き出し機構200を搬送路500の搬送レール520の高さ位置に位置付ける。これは、上記の受渡準備動作であり、図4(a)に示した状態に相当する。 In step S13, the control unit 400 causes the elevating guide driving unit 404 to drive the elevating guide 310 to position the drawer mechanism 200 at the height position of the conveying rail 520 of the conveying path 500. This is the delivery preparation operation described above, and corresponds to the state shown in FIG.
 ステップS14では、検出部402が、ウェーハWが搬送レール520の高さ位置に位置していることを検出すると、制御部400は、引き出しガイド駆動部403にハンド210を駆動させて、ハンド210によるウェーハWの把持を停止させる。そして、制御部400は、エアシリンダ駆動部405に退避機構240に対して所定の圧力を付与させて、ハンド210を下方に移動させる。これにより、ハンド210と搬送ハンド540との干渉が回避される。これは、上記の受渡完了動作であり、図4(b)に示した状態に相当する。 In step S <b> 14, when the detection unit 402 detects that the wafer W is located at the height position of the transfer rail 520, the control unit 400 causes the extraction guide drive unit 403 to drive the hand 210, and the hand 210 operates. The gripping of the wafer W is stopped. Then, the control unit 400 causes the air cylinder drive unit 405 to apply a predetermined pressure to the retracting mechanism 240, and moves the hand 210 downward. This avoids interference between the hand 210 and the transport hand 540. This is the delivery completion operation described above, and corresponds to the state shown in FIG.
 ステップS14の後、ウェーハWは搬送路500に受け渡され(図4(b)参照。)、所定の場所に搬送される。ステップS15では、検出部402が、ウェーハWの受け渡しが完了したことを検出すると、制御部400は、供給すべきウェーハWが第1のカセット10または第2のカセット20にあるか否か判定する。供給対象のウェーハWがある場合(S15;YES)、上記のステップS11~S14の各動作を繰り返し実行する。供給対象のウェーハWがない場合(S15;NO)、基板供給システム1によるウェーハWの搬送路への供給が終了する。 After step S14, the wafer W is transferred to the transfer path 500 (see FIG. 4B) and transferred to a predetermined place. In step S15, when the detection unit 402 detects that the delivery of the wafer W is completed, the control unit 400 determines whether the wafer W to be supplied is in the first cassette 10 or the second cassette 20. .. When there is a wafer W to be supplied (S15; YES), the operations in steps S11 to S14 described above are repeatedly executed. When there is no wafer W to be supplied (S15; NO), the supply of the wafer W to the transfer path by the substrate supply system 1 ends.
 なお、基板供給システム1は、第1のカセット10および第2のカセット20の状態を表示する表示部を備えるよう構成してもよい。たとえば、基板供給システム1に図示しない表示画面が接続されており、第1のカセット10および第2のカセット20のどちらにも未処理、すなわち、供給対象のウェーハWが残存している場合、表示画面に「処理中」と表示される。この表示により、オペレータは、第1のカセット10または第2のカセット20からウェーハWが搬送路に供給されていることを把握することができる。 The substrate supply system 1 may be configured to include a display unit that displays the states of the first cassette 10 and the second cassette 20. For example, when a display screen (not shown) is connected to the substrate supply system 1 and unprocessed, that is, the wafer W to be supplied remains in both the first cassette 10 and the second cassette 20, "Processing" is displayed on the screen. From this display, the operator can grasp that the wafer W is being supplied from the first cassette 10 or the second cassette 20 to the transfer path.
 また、第1のカセット10が空になった場合、あるいは、予定数のウェーハWが搬送路に供給された場合であって、第2のカセット20には未処理のウェーハWが残存する場合、「第1のカセット10:処理完了」と表示される。この表示により、オペレータは、直ぐに第1のカセット10を第1の収納部101から取り出し、第1のカセット10に新たにウェーハWを収容し、再び、第1のカセット10を第1の収納部101に収納することができる。 In addition, when the first cassette 10 is empty, or when a predetermined number of wafers W are supplied to the transfer path and unprocessed wafers W remain in the second cassette 20, “First cassette 10: processing completed” is displayed. By this display, the operator immediately takes out the first cassette 10 from the first storage unit 101, newly stores the wafer W in the first cassette 10, and again stores the first cassette 10 in the first storage unit 101. It can be stored in 101.
 また、第1のカセット10および第2のカセット20が空になった場合、あるいは、予定数のウェーハWが搬送路に供給された場合、「処理完了」と表示される。この表示により、オペレータは、ウェーハWの供給が完了したことを把握することができる。 Further, when the first cassette 10 and the second cassette 20 are empty, or when the planned number of wafers W are supplied to the transfer path, “processing completed” is displayed. From this display, the operator can know that the supply of the wafer W is completed.
 このように、表示部を設けた場合、オペレータは、収納装置100に収納されている第1のカセット10および第2のカセット20の状態を迅速に把握することができるため、円滑に作業を行うことができる。 In this way, when the display unit is provided, the operator can quickly grasp the states of the first cassette 10 and the second cassette 20 stored in the storage device 100, and thus the operation can be performed smoothly. be able to.
 [収納装置の構成]
 続いて、収納装置100の構成について説明する。
[Structure of storage device]
Next, the configuration of the storage device 100 will be described.
 図6(a)~(c)は、収納装置100の異なる状態を示す斜視図であり、左側の図と右側の図とは対応している。 6A to 6C are perspective views showing different states of the storage device 100, and the left side view and the right side view correspond to each other.
 図6(a)~(c)に示すように、収納装置100には主に4つの状態がある。図6(a)は、載置部110が第2の収納部102から引き出された状態(第1の状態)を示す。このとき、第2の収納部102のシャッタ140は閉じているため、オペレータが収納装置100に手を入れることはできない。図6(b)は、載置部110が第2の収納部102に収まっている状態(第2の状態)を示す。図6(c)は、第2の収納部102のシャッタ140を開放するための準備状態(第3の状態)を示す。第2の収納部102のシャッタ140の開放が完了した状態(第4の状態)は、図1(a)および(c)が相当する。以降、これら4つの状態に分けて、収納装置100の構成を説明する。ここで、第1の収納部101のシャッタ140は、上方に開放し、第2の収納部102のシャッタ140は、下方に開放する。このように、開放する方向が上下で異なるものの、シャッタ140を開放するための構成は、同様の構成である。そのため、以降の説明では、上段に配置されている第2の収納部102に着目して説明する。 As shown in FIGS. 6A to 6C, the storage device 100 has four main states. FIG. 6A shows a state (first state) in which the mounting portion 110 is pulled out from the second storage portion 102. At this time, since the shutter 140 of the second storage unit 102 is closed, the operator cannot put his or her hand in the storage device 100. FIG. 6B shows a state (second state) in which the mounting portion 110 is accommodated in the second storage portion 102. FIG. 6C shows a preparation state (third state) for opening the shutter 140 of the second storage section 102. The state where the opening of the shutter 140 of the second storage unit 102 is completed (the fourth state) corresponds to FIGS. 1A and 1C. Hereinafter, the configuration of the storage device 100 will be described separately for these four states. Here, the shutter 140 of the first storage unit 101 is opened upward, and the shutter 140 of the second storage unit 102 is opened downward. In this way, although the opening direction is different between the upper and lower sides, the structure for opening the shutter 140 is the same. Therefore, in the following description, the description will focus on the second storage section 102 arranged in the upper stage.
 また、収納装置100が第1の状態(図6(a)に示す状態)のとき、第2のカセット20は、第2の収納部102の載置部110に着脱可能に載置される。このとき、第2の収納部102の載置部110の位置を「着脱位置」と称する。収納装置100が第2の状態(図6(b)に示す状態)のとき、第2のカセット20は第2の収納部102の載置部110に載置された状態で、第2の収納部102に収納される。このときの第2の収納部102の載置部110の位置を「収納位置」と称する。 Further, when the storage device 100 is in the first state (the state shown in FIG. 6A), the second cassette 20 is detachably mounted on the mounting portion 110 of the second storage portion 102. At this time, the position of the placement unit 110 of the second storage unit 102 is referred to as the “attachment / detachment position”. When the storage device 100 is in the second state (the state shown in FIG. 6B), the second cassette 20 is in the state of being mounted on the mounting portion 110 of the second storage portion 102, and the second storage It is stored in the unit 102. The position of the placement unit 110 of the second storage unit 102 at this time is referred to as a “storage position”.
 まず、収納装置100が第1の状態、つまり、載置部110が着脱位置に位置している場合について説明する。 First, the case where the storage device 100 is in the first state, that is, the placement unit 110 is located at the attachment / detachment position will be described.
 図7、図8は、収納装置100の構成を示す斜視図であり、収納装置100が第1の状態であるときを示している。図7、図8では、第2のカセット20、筐体103、および扉104が省略されており、図8では、さらに、検知手段180が省略されている。 7 and 8 are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the first state. The second cassette 20, the housing 103, and the door 104 are omitted in FIGS. 7 and 8, and the detection unit 180 is further omitted in FIG.
 図7、図8に示すように、収納装置100は、上記した載置部110と、移動部120と、規制部130と、シャッタ140と、昇降機構150と、支持部160と、リンク機構170と、検知手段180と、の他に、台座190を備える。また、図7の載置部110において、破線で囲まれた部分は、第2のカセット20が載置される領域である。 As shown in FIGS. 7 and 8, the storage device 100 includes the mounting portion 110, the moving portion 120, the regulating portion 130, the shutter 140, the elevating mechanism 150, the supporting portion 160, and the link mechanism 170 described above. In addition to the detection means 180, a pedestal 190 is provided. In addition, in the mounting portion 110 of FIG. 7, the portion surrounded by the broken line is an area where the second cassette 20 is mounted.
 載置部110の上面には、第2のカセット20を位置決めする位置決め部材111が4つ設けられている。第2のカセット20を載置部110に載置する際、第2のカセット20の側壁11a、11bの両端部を4つの位置決め部材111に嵌め合わせる(図1(c)参照。)。 On the upper surface of the mounting part 110, four positioning members 111 for positioning the second cassette 20 are provided. When mounting the second cassette 20 on the mounting portion 110, both ends of the side walls 11a and 11b of the second cassette 20 are fitted to the four positioning members 111 (see FIG. 1C).
 移動部120は、載置部110を着脱位置と収納位置との間で水平方向に移動させる。移動部120は、連係部材121と、水平スライド部材122a、122bと、案内部材123と、突部材124と、を備えている。なお、連係部材121は、図7では図示されておらず、図8にて図示される。 The moving unit 120 moves the placing unit 110 in the horizontal direction between the attachment / detachment position and the storage position. The moving unit 120 includes a link member 121, horizontal slide members 122a and 122b, a guide member 123, and a protruding member 124. The link member 121 is not shown in FIG. 7, but is shown in FIG.
 連係部材121は、X軸方向における断面が段状の部材121aと、移送ローラ121bとから構成される。部材121aの下部には、X軸方向に孔が形成されており、この孔に移送ローラ121bの回転軸が通される。部材121aの上部の立ち上がり部にシャッタ140が装着される(図10(c)参照。)。 The link member 121 includes a member 121a having a stepped cross section in the X-axis direction and a transfer roller 121b. A hole is formed in the lower part of the member 121a in the X-axis direction, and the rotation shaft of the transfer roller 121b is passed through the hole. The shutter 140 is attached to the rising portion above the member 121a (see FIG. 10C).
 水平スライド部材122aは、載置部110側に設けられ、水平スライド部材122bは、台座190側に設けられる。載置部110が水平方向に移動する際、水平スライド部材122bに対して、水平スライド部材122aが移動する。これにより、載置部110は、水平方向に移動できる。 The horizontal slide member 122a is provided on the mounting portion 110 side, and the horizontal slide member 122b is provided on the pedestal 190 side. When the mounting part 110 moves in the horizontal direction, the horizontal slide member 122a moves with respect to the horizontal slide member 122b. As a result, the mounting unit 110 can move in the horizontal direction.
 案内部材123は、細長い矩形状の部材であり、台座190に設置される。案内部材123のY軸正側および負側は中央に向かって緩やかな傾斜面が形成されており、Y軸正側の端部には、V字状の凹部123aが形成されている。載置部110に設けられている突部材124の下端部は半球状に形成されている(不図示)。水平スライド部材122a、122bにより載置部110が収納位置まで水平方向に移動すると、突部材124の半球状の部分が案内部材123の傾斜面を滑る。これにより、載置部110には適切にブレーキが掛かり、台座190に減速しながら滑らかに移動することができる。また、突部材124の半球状の部分が凹部123aに嵌まることにより、載置部110は第2の収納部102に位置決めされる。 The guide member 123 is an elongated rectangular member and is installed on the pedestal 190. The Y-axis positive side and the negative side of the guide member 123 are formed with a gentle slope toward the center, and a V-shaped recess 123a is formed at the end on the Y-axis positive side. The lower end of the protruding member 124 provided on the mounting portion 110 is formed in a hemispherical shape (not shown). When the mounting portion 110 is horizontally moved to the storage position by the horizontal slide members 122a and 122b, the hemispherical portion of the protruding member 124 slides on the inclined surface of the guide member 123. As a result, the mounting portion 110 is appropriately braked, and the pedestal 190 can smoothly move while decelerating. Further, the hemispherical portion of the projecting member 124 is fitted into the recess 123 a, whereby the mounting portion 110 is positioned in the second storage portion 102.
 規制部130は、載置部110が着脱位置(第1の状態)と収納位置(第2の状態)との間で水平方向に移動している間、また、載置部110が収納位置に位置しているとき(第2の状態)、第2のカセット20から奥方(Y軸正側)にウェーハWが飛び出して落下することを防ぐ。規制部130は、第2のカセット20の奥方の端面に当接する。つまり、第2のカセット20に収容されているウェーハWに当接する。規制部130は、板状の部材であり、本実施の形態では、2つ設けられる。規制部130は、支持板131に支持されている。 The restriction unit 130 moves the mounting unit 110 to the storage position while the mounting unit 110 moves in the horizontal direction between the attachment / detachment position (first state) and the storage position (second state). When the wafer W is positioned (second state), the wafer W is prevented from jumping out and falling from the second cassette 20 (on the Y-axis positive side). The restricting portion 130 contacts the inner end surface of the second cassette 20. That is, it abuts the wafer W stored in the second cassette 20. The restriction part 130 is a plate-shaped member, and in the present embodiment, two are provided. The restriction portion 130 is supported by the support plate 131.
 シャッタ140は、第2の収納部102と引き出し位置との間を遮断する。第2の収納部102において、第2のカセット20からウェーハWが引き出されるとき、シャッタ140は開放され、載置部110が収納位置から着脱位置に移動するとき、シャッタ140は閉塞する。 The shutter 140 blocks between the second storage unit 102 and the pull-out position. In the second storage unit 102, when the wafer W is pulled out from the second cassette 20, the shutter 140 is opened, and when the mounting unit 110 is moved from the storage position to the attachment / detachment position, the shutter 140 is closed.
 昇降機構150は、シャッタ140を昇降させる。昇降機構150は、駆動部151と、受け部材152と、昇降スライド部材153a、153bと、を備えている。 The lifting mechanism 150 moves the shutter 140 up and down. The elevating mechanism 150 includes a drive unit 151, a receiving member 152, and elevating slide members 153a and 153b.
 駆動部151は、シリンダである。駆動部151のロッド151aの下端部に、受け部材152が接続されている。受け部材152は、Y軸負側が開いた枠状の部材から構成されている。受け部材152の上下の隙間152aは、上記した移送ローラ121bに嵌まり込む。後で説明するが、収納装置100が第2~第4の状態であるとき、移送ローラ121bは受け部材152の隙間152aに嵌められている(たとえば、図10(c)参照。)。受け部材152はロッド151aと接続されているため、駆動部151が駆動すると、受け部材152は駆動部151と一体となって昇降する。 The drive unit 151 is a cylinder. The receiving member 152 is connected to the lower end of the rod 151a of the drive unit 151. The receiving member 152 is composed of a frame-shaped member whose Y-axis negative side is open. The upper and lower gaps 152a of the receiving member 152 fit into the above-mentioned transfer rollers 121b. As will be described later, when the storage device 100 is in the second to fourth states, the transfer roller 121b is fitted in the gap 152a of the receiving member 152 (for example, see FIG. 10C). Since the receiving member 152 is connected to the rod 151a, when the driving unit 151 drives, the receiving member 152 moves up and down together with the driving unit 151.
 昇降スライド部材153a、153bは、シャッタ140と支持部160との間に設けられており、シャッタ140を昇降させる。シャッタ140に昇降スライド部材153aが装着されており、支持部160に昇降スライド部材153bが装着される。 The elevating slide members 153a and 153b are provided between the shutter 140 and the support 160, and elevate the shutter 140. An elevating slide member 153a is attached to the shutter 140, and an elevating slide member 153b is attached to the support part 160.
 支持部160は、Y軸方向の断面が段状の部材であり(図9参照。)、載置部110に設置される。次に説明するリンク機構170を介して規制部130を支持する。 The support part 160 is a member having a stepwise cross section in the Y-axis direction (see FIG. 9) and is installed on the mounting part 110. The restriction unit 130 is supported via a link mechanism 170 described below.
 リンク機構170は、リンクベース171と、リンクプレート172と、2つのリンクバー173と、リンクローラ174とから構成される。 The link mechanism 170 includes a link base 171, a link plate 172, two link bars 173, and a link roller 174.
 リンクベース171およびリンクプレート172は、板状の部材であり、2つのリンクバー173によって連結される。リンクベース171は、シャッタ140に装着されており、リンクプレート172は、支持板131に装着される。リンクプレート172の下部にリンクローラ174が回転可能に設けられている。リンクローラ174は、支持部160の下部の水平面と当接する。なお、2つのリンクバー173は、図7では図示されず、図8にて図示される。 The link base 171 and the link plate 172 are plate-shaped members and are connected by two link bars 173. The link base 171 is attached to the shutter 140, and the link plate 172 is attached to the support plate 131. A link roller 174 is rotatably provided below the link plate 172. The link roller 174 is in contact with the horizontal surface below the support 160. The two link bars 173 are not shown in FIG. 7, but are shown in FIG.
 上記のとおり、シャッタ140は、水平スライド部材122a、122bを介して支持部160に支持される。シャッタ140にリンクベース171が装着されており、リンクベース171とリンクバー173を介して連結されているリンクプレート172は支持板131に装着されている。このリンクベース171およびリンクプレート172は、2つのリンクバー173により四つ棒リンクを構成する。このリンク機構により、リンクプレート172は、垂直な状態を維持した状態で摺動する。そして、この支持板131は規制部130を支持する。したがって、規制部130は、リンク機構170を介してシャッタ140に支持され、また、規制部130は、リンク機構170を介して支持部160に支持される。 As described above, the shutter 140 is supported by the support portion 160 via the horizontal slide members 122a and 122b. A link base 171 is attached to the shutter 140, and a link plate 172 connected to the link base 171 via a link bar 173 is attached to the support plate 131. The link base 171 and the link plate 172 form a four-bar link with the two link bars 173. With this link mechanism, the link plate 172 slides while maintaining the vertical state. Then, the support plate 131 supports the restriction portion 130. Therefore, the restriction unit 130 is supported by the shutter 140 via the link mechanism 170, and the restriction unit 130 is supported by the support unit 160 via the link mechanism 170.
 図7、図8に示すように、第1の状態では、リンク機構170のリンクバー173は載置部110に対して水平である。そのため、リンクベース171とリンクプレート172とは僅かながら離間している。つまり、リンクベース171が装着されているシャッタ140と、リンクプレート172が装着されている支持板131とは離間している。支持板131には規制部130が装着されているため、シャッタ140と、規制部130とは、離間している。 As shown in FIGS. 7 and 8, in the first state, the link bar 173 of the link mechanism 170 is horizontal with respect to the mounting portion 110. Therefore, the link base 171 and the link plate 172 are slightly separated from each other. That is, the shutter 140 to which the link base 171 is attached and the support plate 131 to which the link plate 172 is attached are separated from each other. Since the restriction portion 130 is mounted on the support plate 131, the shutter 140 and the restriction portion 130 are separated from each other.
 検知手段180は、台座190のY軸正側に設けられるセンサである。検知手段180は、第2のカセット20からウェーハWが飛び出しているか否かを検知する。 The detection means 180 is a sensor provided on the Y-axis positive side of the pedestal 190. The detection unit 180 detects whether the wafer W is protruding from the second cassette 20.
 図7、図8に示すように、第1の状態では、載置部110が引き出され、着脱位置に位置するとき、規制部130、支持板131、およびシャッタ140も載置部110とともに水平方向に移動する。これは、図6(a)、特に、図6(a)の右側の図に示すように、規制部130がウェーハWに当接した状態である。このため、載置部110から第2のカセット20を取り出すとき、および、第2のカセット20を載置部110に載置するとき、オペレータは載置部110の領域内のみしか手を入れることができず、搬送路にオペレータの手が入り込むことはない。よって、オペレータは安全に第2のカセット20の着脱を行うことができる。 As shown in FIGS. 7 and 8, in the first state, when the mounting portion 110 is pulled out and is located at the attachment / detachment position, the restricting portion 130, the support plate 131, and the shutter 140 also move horizontally along with the mounting portion 110. Move to. This is a state in which the restricting portion 130 is in contact with the wafer W, as shown in FIG. 6A, particularly the right side diagram of FIG. 6A. Therefore, when taking out the second cassette 20 from the placing section 110 and when placing the second cassette 20 on the placing section 110, the operator puts his / her hand only within the area of the placing section 110. Therefore, the operator's hand does not enter the transport path. Therefore, the operator can safely attach and detach the second cassette 20.
 次に、収納装置100が第2の状態、つまり、載置部110が収納位置に位置している場合について説明する。 Next, the case where the storage device 100 is in the second state, that is, the placement unit 110 is located at the storage position will be described.
 図9、図10(a)~(c)は、収納装置100の構成を示す斜視図であり、収納装置100が第2の状態のときを示している。図10(a)、(b)は、リンク機構周辺の拡大図であり、図10(b)は、シャッタ140が省略されている。図10(c)は、図9に対応する斜視図である。また、図9、図10(a)~(c)では、第2のカセット20、筐体103、扉104、および検知手段180が省略されている。 9 and 10A to 10C are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the second state. 10A and 10B are enlarged views around the link mechanism, and the shutter 140 is omitted in FIG. 10B. FIG. 10C is a perspective view corresponding to FIG. 9. Further, in FIGS. 9 and 10A to 10C, the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
 図9に示すように、載置部110を収納位置に移動させると、連係部材121、規制部130、支持板131、シャッタ140、および支持部160は、図7、図8に示した状態を維持しながら載置部110とともに水平移動する。このとき、図10(b)に示すように、シャッタ140とともに水平移動した連係部材121の移送ローラ121bが、受け部材152の隙間152aに嵌まり込む。このとき、移送ローラ121bが台座190を転動すると、受け部材152に連続的に乗り移ることが可能なように、移送ローラ121bの幅は広めに設定されている。また、図10(a)、(c)に示すように、受け部材152の上部の枠とシャッタ140は干渉しない。 As shown in FIG. 9, when the mounting section 110 is moved to the storage position, the linking member 121, the restriction section 130, the support plate 131, the shutter 140, and the support section 160 are in the states shown in FIGS. 7 and 8. While maintaining, it moves horizontally together with the mounting part 110. At this time, as shown in FIG. 10B, the transfer roller 121b of the linking member 121 horizontally moved together with the shutter 140 fits into the gap 152a of the receiving member 152. At this time, when the transfer roller 121b rolls on the pedestal 190, the width of the transfer roller 121b is set to be wider so that the transfer roller 121b can continuously transfer to the receiving member 152. Further, as shown in FIGS. 10A and 10C, the upper frame of the receiving member 152 and the shutter 140 do not interfere with each other.
 図10(a)、(b)に示すように、収納装置100が第2の状態のとき、リンク機構170は、第1の状態と同様であるから、未だ、規制部130とシャッタ140とは僅かに離間しており、規制部130はウェーハWに当接している。これは、規制部130がウェーハWに当接している様子は、図6(b)に示されている。 As shown in FIGS. 10A and 10B, when the storage device 100 is in the second state, the link mechanism 170 is the same as in the first state. It is slightly separated, and the restriction portion 130 is in contact with the wafer W. This is shown in FIG. 6B, in which the restricting portion 130 is in contact with the wafer W.
 このように、第1の状態から第2の状態、つまり、載置部110が着脱位置から収納位置へ水平移動するとき、規制部130とシャッタ140とは互いの位置関係が変化することなく、載置部110とともに水平移動する。よって、載置部110が着脱位置から収納位置へ水平移動している間、規制部130はウェーハWに当接し続ける。よって、第2のカセット20からウェーハWが供給領域側に飛び出して落下する虞はない。また、シャッタ140が供給領域側を塞いでいるため、収納装置100内に作業者の手が入り込むことを確実に防ぐ。 Thus, when the mounting unit 110 horizontally moves from the attachment / detachment position to the storage position from the first state to the second state, the positional relationship between the restriction unit 130 and the shutter 140 does not change, It horizontally moves together with the mounting unit 110. Therefore, while the mounting part 110 is horizontally moved from the attachment / detachment position to the storage position, the restriction part 130 continues to contact the wafer W. Therefore, there is no possibility that the wafer W jumps out of the second cassette 20 toward the supply region side and falls. Further, since the shutter 140 closes the supply area side, it is possible to reliably prevent the operator's hand from entering the storage device 100.
 次に、収納装置100が第3の状態、つまり、載置部110が収納位置に位置し、シャッタ140が開放される直前について説明する。 Next, a description will be given of the state where the storage device 100 is in the third state, that is, immediately before the mounting portion 110 is located at the storage position and the shutter 140 is opened.
 図11、12(a)~(c)は、収納装置100の構成を示す斜視図であり、収納装置100が第3の状態のときを示している。図12(a)、(b)は、リンク機構周辺の拡大図であり、図12(b)は、シャッタ140が省略されている。図12(c)は、図11に対応する斜視図である。また、図11、12(a)~(c)では、第2のカセット20、筐体103、扉104、および検知手段180が省略されている。 11 and 12 (a) to (c) are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the third state. 12A and 12B are enlarged views around the link mechanism, and the shutter 140 is omitted in FIG. 12B. FIG. 12C is a perspective view corresponding to FIG. 11. Further, in FIGS. 11 and 12A to 12C, the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
 載置部110が収納位置に位置付けられると、収納装置100は、第2のカセット20からウェーハWが供給可能となるように、シャッタ140を開放する準備を行う。ここで、シャッタ140をいっきに昇降移動させると、規制部130もシャッタ140と一体的に昇降移動する。規制部130はウェーハWに当接しているため、規制部130はウェーハWを擦りながら昇降移動する。ウェーハWは、これは、ウェーハWの品質の低下を招くため、ウェーハWと規制部130とを離間させてから、シャッタ140を上昇させる必要がある。そこで、図7、8(a)~(c)に示すように、収納装置100において、シャッタ140を開放する準備として、ウェーハWと規制部130とを離間させる(第3の状態)。 When the mounting unit 110 is positioned at the storage position, the storage device 100 prepares to open the shutter 140 so that the wafer W can be supplied from the second cassette 20. Here, when the shutter 140 is moved up and down all at once, the restriction unit 130 also moves up and down together with the shutter 140. Since the regulating portion 130 is in contact with the wafer W, the regulating portion 130 moves up and down while rubbing the wafer W. Since the quality of the wafer W deteriorates, it is necessary to raise the shutter 140 after separating the wafer W and the restriction unit 130. Therefore, as shown in FIGS. 7 and 8A to 8C, in the storage device 100, in preparation for opening the shutter 140, the wafer W and the restriction unit 130 are separated (third state).
 図11、12(a)~(c)に示すように、駆動部151に所定の圧力が付与されると、ロッド151aが所定ストローク上昇する。これにより、ロッド151aに接続されている受け部材152は、連係部材121の移送ローラ121bが嵌まった状態で、所定ストローク上昇する。連係部材121の部材121aは、シャッタ140に装着されているため、受け部材152の上昇に伴い、連係部材121とシャッタ140とが一体的に所定ストローク上昇する。このとき、シャッタ140は、昇降スライド部材153a、153bにより上下移動可能なようにガイドされる。 As shown in FIGS. 11 and 12 (a) to (c), when a predetermined pressure is applied to the drive unit 151, the rod 151a moves up by a predetermined stroke. As a result, the receiving member 152 connected to the rod 151a moves up by a predetermined stroke while the transfer roller 121b of the linking member 121 is fitted. Since the member 121a of the linking member 121 is attached to the shutter 140, the linking member 121 and the shutter 140 integrally rise by a predetermined stroke as the receiving member 152 moves up. At this time, the shutter 140 is vertically movably guided by the elevating slide members 153a and 153b.
 図12(a)、(b)に示すように、シャッタ140には、リンクベース171が装着されている。このため、シャッタ140が上昇するとリンクベース171も上昇し、水平方向に維持されていた2つのリンクバー173(図10(b)参照。)が回動する。このとき、リンクプレート172に回動可能に設けられているリンクローラ174が支持部160の下部の水平面をY軸正側へ転がり、リンクプレート172をY軸正側へ移動させる。リンクプレート172は支持板131に装着されているため、支持板131もY軸正側へ移動する。リンクプレート172は、四つ棒リンクにより、垂直な状態を維持しながら水平方向に移動する。これにより、支持板131に支持されている規制部130が図9、10(a)~(c)に示されていた状態から、Y軸正側へ僅かに移動する。そして、規制部130も水平方向に移動し、規制部130は、ウェーハWから離間する。これにより、規制部130はウェーハWに当接することなく、すなわち、ウェーハWの位置をずらすことなく、ウェーハWから離間してから上昇することができる。 As shown in FIGS. 12A and 12B, a link base 171 is attached to the shutter 140. For this reason, when the shutter 140 moves up, the link base 171 also moves up, and the two link bars 173 (see FIG. 10B) maintained in the horizontal direction rotate. At this time, the link roller 174 rotatably provided on the link plate 172 rolls on the horizontal surface of the lower portion of the support portion 160 to the Y axis positive side, and moves the link plate 172 to the Y axis positive side. Since the link plate 172 is attached to the support plate 131, the support plate 131 also moves to the Y axis positive side. The link plate 172 moves horizontally while maintaining a vertical state by a four-bar link. As a result, the restriction portion 130 supported by the support plate 131 slightly moves from the state shown in FIGS. 9, 10 (a) to (c) to the Y-axis positive side. Then, the restriction portion 130 also moves in the horizontal direction, and the restriction portion 130 is separated from the wafer W. Accordingly, the restriction portion 130 can be lifted after being separated from the wafer W without contacting the wafer W, that is, without shifting the position of the wafer W.
 次に、収納装置100が第4の状態、つまり、載置部110が収納位置に位置し、シャッタ140が開放される場合について説明する。 Next, the case where the storage device 100 is in the fourth state, that is, the mounting unit 110 is located at the storage position and the shutter 140 is opened will be described.
 図13、14(a)、(b)は、収納装置100の構成を示す斜視図であり、収納装置100が第4の状態のときを示している。図14(a)は、リンク機構170周辺の拡大図であり、図14(b)は、図13に対応する斜視図である。また、図13、14(a)、(b)では、第2のカセット20、筐体103、扉104、および検知手段180が省略されている。 13, 14 (a) and (b) are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the fourth state. 14A is an enlarged view around the link mechanism 170, and FIG. 14B is a perspective view corresponding to FIG. Further, in FIGS. 13, 14 (a) and (b), the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
 図13、14(a)、(b)に示すように、第3の状態から続けて駆動部151に所定の圧力が付与されると、ロッド151aがさらに所定ストローク上昇する。これにより、ロッド151aに接続されている受け部材152に連係部材121の移送ローラ121bが嵌まり込んだまま、所定ストローク上昇する。これにより、シャッタ140は、規制部130と一体的に上昇し、第2の収納部102を供給領域に対して開放することができる。 As shown in FIGS. 13, 14 (a) and (b), when a predetermined pressure is continuously applied to the driving unit 151 from the third state, the rod 151a further rises by a predetermined stroke. As a result, the transfer roller 121b of the linking member 121 is fitted in the receiving member 152 connected to the rod 151a, and the predetermined stroke is raised. As a result, the shutter 140 can be lifted up integrally with the restriction portion 130, and the second storage portion 102 can be opened to the supply area.
 なお、第1の収納部101のシャッタ140は、下方に移動する。第1の収納部101は、第2の収納部102と同様の部材および機構により構成される。第1の収納部101では、支持部160およびリンク機構170が第2の収納部102の支持部160およびリンク機構170とは上下逆向きに設けられる。その他の構成は、第2の収納部102と同様に設けられる。 Note that the shutter 140 of the first storage unit 101 moves downward. The first storage unit 101 is composed of members and mechanisms similar to those of the second storage unit 102. In the first storage section 101, the support section 160 and the link mechanism 170 are provided upside down with respect to the support section 160 and the link mechanism 170 of the second storage section 102. Other configurations are provided similarly to the second storage section 102.
 上記のとおり、第1の収納部101では、リンク機構170が第2の収納部102に設けられていた状態とは上下逆向きの状態で設けられている。第2の収納部102のリンクローラ174は、自重により、リンク機構170に付勢部材を設けなくても、支持部160の段部の水平面上に安定的に位置付けられる。 As described above, in the first storage unit 101, the link mechanism 170 is provided upside down from the state in which it was provided in the second storage unit 102. Due to its own weight, the link roller 174 of the second storage portion 102 can be stably positioned on the horizontal plane of the step portion of the support portion 160 without providing the link mechanism 170 with the biasing member.
 これに対し、第1の収納部101では、支持部160の段部の水平面よりもリンクローラ174は下方に位置する。これにより、リンクローラ174は自重により移動可能となる。リンクローラ174が移動すると、リンクプレート172も移動するため、リンク機構170が不安定化する。そこで、第2の収納部102のリンク機構170には、リンクローラ174を上方に付勢するための付勢部材(不図示)が設けられる。これにより、第1の収納部101のリンク機構170は、安定化する。 On the other hand, in the first storage portion 101, the link roller 174 is located below the horizontal surface of the step portion of the support portion 160. As a result, the link roller 174 can be moved by its own weight. When the link roller 174 moves, the link plate 172 also moves, and the link mechanism 170 becomes unstable. Therefore, the link mechanism 170 of the second storage unit 102 is provided with an urging member (not shown) for urging the link roller 174 upward. As a result, the link mechanism 170 of the first storage unit 101 is stabilized.
 上記のような構成の収納装置100であれば各収納部から載置部110を着脱位置側に引き出すと、規制部130およびシャッタ140も引き出される。載置部110を収納位置に戻す場合も同様である。このため、載置部110の移動中、規制部130がウェーハWに対向し続けることとなり、カセットからウェーハWが落下することを確実に防ぐことができる。また、載置部110が着脱位置に位置付けられたとき、シャッタ140により各収納部の奥方が塞がれているため、オペレータが収納装置100内に手を挿入することを防ぐことができる。 With the storage device 100 having the above-described configuration, when the mounting portion 110 is pulled out from each storage portion to the attachment / detachment position side, the regulation portion 130 and the shutter 140 are also pulled out. The same applies when returning the placing part 110 to the storage position. For this reason, the restriction unit 130 continues to face the wafer W during the movement of the mounting unit 110, and it is possible to reliably prevent the wafer W from dropping from the cassette. Further, when the mounting portion 110 is positioned at the attachment / detachment position, the back of each storage portion is closed by the shutter 140, so that it is possible to prevent the operator from inserting a hand into the storage device 100.
 <実施形態の効果>
 図3(a)~図4(b)に示すように、引き出し機構200が第2の収納部102に収納されている第2のカセットからウェーハWを引き出して搬送路に供給している間、第1のカセット10内が空の場合、オペレータは、第1の収納部101から載置部110を引き出し、第1のカセット10を載置部110から取り出して、第1のカセット10に供給対象のウェーハWを収容する。そして、再び第1の収納部101に第1のカセット10を収納することができる。これにより、第1のカセット10から全てのウェーハWが搬送路に供給された場合、引き出し機構200による供給動作を一旦停止することなく、第1のカセット10にウェーハWを収容し、第1の収納部101に収納することができる。よって、第1のカセット10および第2のカセット20から連続的にウェーハWを搬送路に供給でき、基板供給システム1の稼働率を高めることができる。
<Effects of the embodiment>
As shown in FIGS. 3A to 4B, while the drawing mechanism 200 draws the wafer W from the second cassette stored in the second storage unit 102 and supplies the wafer W to the transfer path, When the inside of the first cassette 10 is empty, the operator pulls out the placement unit 110 from the first storage unit 101, removes the first cassette 10 from the placement unit 110, and supplies the first cassette 10 with the target. The wafer W is stored. Then, the first cassette 10 can be stored in the first storage portion 101 again. As a result, when all the wafers W are supplied from the first cassette 10 to the transfer path, the wafers W are accommodated in the first cassette 10 without temporarily stopping the supply operation by the extraction mechanism 200, and the first It can be stored in the storage unit 101. Therefore, the wafer W can be continuously supplied to the transfer path from the first cassette 10 and the second cassette 20, and the operating rate of the substrate supply system 1 can be increased.
 また、基板供給システム1は、収納装置100を上下、左右方向に移動させることがない。一般に、半導体ウェーハは、薄膜で脆く、衝撃に弱い。このため、収納装置100が移動すると、揺れや振動により、供給対象のウェーハWが破損する虞がある。この点、基板供給システム1では、ウェーハWの引き出しは、引き出し機構200と移動機構300とによって行われている。よって、ウェーハWが収納装置100内で破損することを確実に防ぐことができる。 Also, the board supply system 1 does not move the storage device 100 vertically or horizontally. Generally, a semiconductor wafer is a thin film, is brittle, and is vulnerable to impact. Therefore, when the storage device 100 moves, the wafer W to be supplied may be damaged due to shaking or vibration. In this respect, in the substrate supply system 1, the wafer W is pulled out by the pulling mechanism 200 and the moving mechanism 300. Therefore, it is possible to reliably prevent the wafer W from being damaged in the storage device 100.
 また、引き出し機構200は、レール231a、231bを備える。これにより、ハンド210がウェーハWを引き出すとき、ウェーハWは、レール231a、231bにより支持されながら引き出される。よって、ウェーハWの引き出しを円滑に行うことができる。 The drawer mechanism 200 also includes rails 231a and 231b. Thus, when the hand 210 pulls out the wafer W, the wafer W is pulled out while being supported by the rails 231a and 231b. Therefore, the wafer W can be pulled out smoothly.
 また、収納装置100において、第1の収納部101と第2の収納部102とは、ウェーハWの積層方向に並んで配置されている。これにより、引き出し機構200を積層方向のみに移動させ、第1のカセット10および第2のカセット20のウェーハWにハンド210を位置付けることができる。よって、移動機構300の構成および制御を簡素にできる。 Further, in the storage device 100, the first storage section 101 and the second storage section 102 are arranged side by side in the stacking direction of the wafers W. As a result, the pull-out mechanism 200 can be moved only in the stacking direction to position the hand 210 on the wafer W of the first cassette 10 and the second cassette 20. Therefore, the configuration and control of the moving mechanism 300 can be simplified.
 また、搬送路に供給されたウェーハWが、供給前に収容されていたカセットに戻るように構成しても構わない。この場合、搬送路の受渡位置にて、引き出し機構200のハンド210にウェーハWが受け渡される。移動機構300は、引き出し機構200をウェーハWの供給前の位置に位置付ける。そして、引き出し機構200によりウェーハWがカセットに挿入される。 Alternatively, the wafer W supplied to the transfer path may be returned to the cassette stored before the supply. In this case, the wafer W is delivered to the hand 210 of the pullout mechanism 200 at the delivery position of the transfer path. The moving mechanism 300 positions the drawing mechanism 200 at the position before the supply of the wafer W. Then, the drawing mechanism 200 inserts the wafer W into the cassette.
 このように構成した場合、所定の処理がなされたウェーハWを纏めて回収し、別の工程へと移ることができる。 With this configuration, it is possible to collect the wafers W that have been subjected to the predetermined processing all together and move to another process.
 また、基板供給システム1において、積層方向は、上下方向である。これにより、ウェーハWを安定した状態で第1のカセット10および第2のカセット20に収容できる。また、ウェーハWを第1のカセット10および第2のカセット20から安定的に、水平方向に引き出すことができる。 Also, in the substrate supply system 1, the stacking direction is the vertical direction. As a result, the wafer W can be accommodated in the first cassette 10 and the second cassette 20 in a stable state. Further, the wafer W can be stably pulled out in the horizontal direction from the first cassette 10 and the second cassette 20.
 また、基板供給システム1では、第1の収納部101の第1のカセット10からウェーハWを供給する。つまり、引き出し機構200は積層方向に行き来することなく、下方から上方の一方向に移動する。よって、第1のカセット10が空になった場合、速やかに収納装置100から第1のカセット10を取り出して、新たなウェーハWをその第1のカセット10に収容し、再び、第1の収納部101に収納することができる。よって、ウェーハWの供給が円滑に、また、効率よく行われる。 Further, in the substrate supply system 1, the wafer W is supplied from the first cassette 10 of the first storage unit 101. That is, the pull-out mechanism 200 moves in one direction from the lower side to the upper side without moving back and forth in the stacking direction. Therefore, when the first cassette 10 becomes empty, the first cassette 10 is promptly taken out from the storage device 100, a new wafer W is stored in the first cassette 10, and the first storage 10 is again stored. It can be stored in the unit 101. Therefore, the supply of the wafer W is performed smoothly and efficiently.
 なお、ウェーハWの供給を、第2のカセット20から行ってもよい。この場合、引き出し機構200が積層方向に一方向に移動するよう、第2のカセット20の最上部に収容されているウェーハWから順に供給すればよい。 The wafer W may be supplied from the second cassette 20. In this case, the wafers W stored in the uppermost part of the second cassette 20 may be sequentially supplied so that the drawing mechanism 200 moves in one direction in the stacking direction.
 また、基板供給システム1では、水平スライド部材122a、122bを介して1の収納部101の第1のカセット10からウェーハWを供給する場合、第1のカセット10の最下部に収容されているウェーハWから順にウェーハWを供給する。これにより、効率よく1つのカセットからウェーハWを搬送路に供給することができる。よって、空になった、あるいは、加工後のウェーハWが収容されたカセットを、収納装置100から取り出して未加工のウェーハWをカセットに収容し、再び、収納装置100に収納するという作業のサイクルを早めることができる。 Further, in the substrate supply system 1, when the wafer W is supplied from the first cassette 10 of the one storage unit 101 via the horizontal slide members 122a and 122b, the wafer stored in the lowermost part of the first cassette 10 is used. Wafers W are supplied in order from W. As a result, the wafer W can be efficiently supplied from one cassette to the transfer path. Therefore, a cycle in which the cassette containing the wafer W that has become empty or has been processed is taken out from the storage device 100, the unprocessed wafer W is stored in the cassette, and the wafer W is stored again in the storage device 100. Can be accelerated.
 また、上記の基板供給システム1は、ウェーハを加工する複数のユニットと組み合わせて、基板加工装置30を構成することができる。 Further, the substrate supply system 1 described above can be combined with a plurality of units for processing a wafer to configure the substrate processing apparatus 30.
 図15は、基板供給システム1を備える基板加工装置30の構成を示す斜視図である。図15に示すように、基板加工装置30は、ウェーハWの表面にスクライブラインを形成するスクライブユニット40と、スクライブラインが形成されたウェーハWの表面にフィルムを貼付するフィルムラミネートユニット50と、フィルムが貼付された面が下側となるようにウェーハWを反転させる反転ユニット60と、フィルムが貼付されていない面に所定の力を付与してスクライブラインに沿ってウェーハWを分断するブレイクユニット70と、ウェーハWを所定の位置に搬送する搬送部80と、を備える。なお、図15では、基板供給システム1は、筐体で覆われている
 上記の構成の基板加工装置30は、基板供給システム1により、円滑にウェーハWが供給されるため、装置の稼働率を高めることができる。
FIG. 15 is a perspective view showing the configuration of the substrate processing apparatus 30 including the substrate supply system 1. As shown in FIG. 15, the substrate processing apparatus 30 includes a scribe unit 40 that forms a scribe line on the surface of the wafer W, a film laminating unit 50 that attaches a film to the surface of the wafer W on which the scribe line is formed, and a film. The reversing unit 60 for reversing the wafer W so that the surface on which the film is adhered is on the lower side, and the break unit 70 for dividing the wafer W along the scribe line by applying a predetermined force to the surface on which the film is not adhered. And a transfer unit 80 that transfers the wafer W to a predetermined position. In addition, in FIG. 15, the substrate supply system 1 is covered with a housing. The substrate processing apparatus 30 having the above-described configuration supplies the wafer W smoothly by the substrate supply system 1, so that the operation rate of the apparatus is increased. Can be increased.
 本発明の実施の形態は、特許請求の範囲に示された技術的思想の範囲内において、適宜、種々の変更が可能である。 The embodiment of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the claims.
 1…基板供給システム
 10…第1のカセット
 20…第2のカセット
 30…基板加工装置
 40…スクライブユニット
 50…フィルムラミネートユニット
 60…反転ユニット
 70…ブレイクユニット
 80…搬送部
 101…第1の収納部
 102…第2の収納部
 200…引き出し機構
 210…ハンド
 220…駆動機構
 230…ガイド部
 300…移動機構
 W…基板(ウェーハ)
DESCRIPTION OF SYMBOLS 1 ... Substrate supply system 10 ... 1st cassette 20 ... 2nd cassette 30 ... Substrate processing device 40 ... Scribing unit 50 ... Film laminating unit 60 ... Reversing unit 70 ... Break unit 80 ... Conveying part 101 ... 1st accommodating part 102 ... 2nd storage part 200 ... Drawing mechanism 210 ... Hand 220 ... Drive mechanism 230 ... Guide part 300 ... Moving mechanism W ... Substrate (wafer)

Claims (7)

  1.  複数の基板を所定の間隔で積層した状態で収容するカセットから前記基板を搬送路に供給する基板供給システムであって、
     第1のカセットを着脱可能に収納する第1の収納部と、
     第2のカセットを着脱可能に収納する第2の収納部と、
     前記基板を前記第1のカセットおよび前記第2のカセットから前記基板の積層方向に垂直な方向に引き出して前記搬送路に受け渡す引き出し機構と、
     前記引き出し機構を前記第1の収納部と前記第2の収納部との間で移動させる移動機構と、を備える、ことを特徴とする基板供給システム。
     
    A substrate supply system for supplying the substrate to a transfer path from a cassette that accommodates a plurality of substrates in a stacked state at a predetermined interval,
    A first storage part for detachably storing the first cassette;
    A second storage portion for detachably storing the second cassette;
    A pull-out mechanism that pulls out the substrate from the first cassette and the second cassette in a direction perpendicular to the stacking direction of the substrates and transfers the substrate to the transport path;
    A substrate supply system, comprising: a moving mechanism that moves the drawer mechanism between the first storage portion and the second storage portion.
  2.  請求項1に記載の基板供給システムにおいて、
     前記引き出し機構は、
     前記基板を保持するハンドと、
     前記ハンドを前記積層方向に垂直な方向に移動させる駆動機構と、
     引き出された前記基板を支持して案内するガイド部と、を備え、
     前記ハンドが前記基板を前記第1カセットおよび前記第2のカセットから引き出すとき、前記移動機構は、供給対象の基板に向かい合うように前記ハンドを位置付ける、ことを特徴とする基板供給システム。
     
    The substrate supply system according to claim 1,
    The drawer mechanism is
    A hand for holding the substrate,
    A drive mechanism for moving the hand in a direction perpendicular to the stacking direction,
    A guide portion that supports and guides the pulled-out substrate,
    The substrate supply system according to claim 1, wherein when the hand pulls out the substrate from the first cassette and the second cassette, the moving mechanism positions the hand so as to face the substrate to be supplied.
  3.  請求項1または2に記載の基板供給システムにおいて、
     前記第1の収納部と前記第2の収納部は、前記積層方向に並んで配置され、
     前記移動機構は、前記積層方向に前記引き出し機構を移動させる、
    ことを特徴とする基板供給システム。
     
    The substrate supply system according to claim 1 or 2,
    The first storage portion and the second storage portion are arranged side by side in the stacking direction,
    The moving mechanism moves the drawer mechanism in the stacking direction,
    A substrate supply system characterized by the above.
  4.  請求項3に記載の基板供給システムにおいて、
     前記積層方向は、上下方向である、ことを特徴とする基板供給システム。
     
    The substrate supply system according to claim 3,
    The substrate supply system is characterized in that the stacking direction is a vertical direction.
  5.  請求項3または4に記載の基板供給システムにおいて、
     前記移動機構を制御する制御部を備え、
     前記制御部は、前記移動機構により、前記引き出し機構を前記積層方向の一方向に移動させる、ことを特徴とする基板供給システム。
     
    The substrate supply system according to claim 3 or 4,
    A control unit for controlling the moving mechanism,
    The substrate supply system, wherein the control unit causes the movement mechanism to move the drawer mechanism in one direction of the stacking direction.
  6.  請求項5に記載の基板供給システムにおいて、
     前記積層方向は上下方向であって、
     前記制御部は、前記移動機構により、前記引き出し機構を下方から上方の一方向に移動させる、ことを特徴とする基板供給システム。
     
    The substrate supply system according to claim 5,
    The stacking direction is a vertical direction,
    The substrate supply system according to claim 1, wherein the control unit causes the moving mechanism to move the pulling-out mechanism in one direction from a lower side to an upper side.
  7.  複数の基板を所定の間隔で積層した状態で収容するカセットから前記基板を搬送路に供給する基板供給システムであって、
     第1のカセットを着脱可能に収納する第1の収納部と、
     第2のカセットを着脱可能に収納する第2の収納部と、
     前記基板を前記第1のカセットおよび前記第2のカセットから前記基板の積層方向に垂直な方向に引き出して前記搬送路に受け渡す引き出し機構と、
     前記引き出し機構を前記第1の収納部と前記第2の収納部との間で移動させる移動機構と、を備える基板供給システムと、
     前記基板の表面にスクライブラインを形成するスクライブユニットと、
     前記スクライブラインが形成された前記基板の表面にフィルムを貼付するフィルムラミネートユニットと、
     前記フィルムが貼付された面が下側となるように前記基板を反転させる反転ユニットと、
     前記フィルムが貼付されていない面に所定の力を付与して前記スクライブラインに沿って前記基板を分断するブレイクユニットと、
     前記基板を所定の位置に搬送する搬送部と、を備えることを特徴とする、基板加工装置。
    A substrate supply system for supplying the substrate to a transfer path from a cassette that accommodates a plurality of substrates in a stacked state at a predetermined interval,
    A first storage part for detachably storing the first cassette;
    A second storage portion for detachably storing the second cassette;
    A pull-out mechanism that pulls out the substrate from the first cassette and the second cassette in a direction perpendicular to the stacking direction of the substrates and transfers the substrate to the transport path;
    A substrate supply system including: a moving mechanism that moves the drawer mechanism between the first storage portion and the second storage portion;
    A scribe unit for forming scribe lines on the surface of the substrate,
    A film laminating unit for sticking a film on the surface of the substrate on which the scribe line is formed,
    A reversing unit that reverses the substrate so that the surface on which the film is attached is on the lower side;
    A break unit that divides the substrate along the scribe line by applying a predetermined force to the surface on which the film is not attached,
    A substrate processing apparatus, comprising: a transfer unit that transfers the substrate to a predetermined position.
PCT/JP2019/041058 2018-10-31 2019-10-18 Substrate supply system and substrate processing device WO2020090518A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024161644A1 (en) * 2023-02-03 2024-08-08 ヤマハ発動機株式会社 Laser processing device, semiconductor chip and method for manufacturing semiconductor chip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI718078B (en) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 Wafer carrier device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082542A1 (en) * 2002-04-01 2003-10-09 Mitsuboshi Diamond Industrial Co., Ltd. Parting method for fragile material substrate and parting device using the method
JP2009010287A (en) * 2007-06-29 2009-01-15 Tokyo Electron Ltd Processing system for substrate
JP2012146872A (en) * 2011-01-13 2012-08-02 Disco Abrasive Syst Ltd Resin coating device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347036A (en) * 1986-08-15 1988-02-27 Toshiba Corp Material transfer device
JP3054480B2 (en) * 1991-12-20 2000-06-19 株式会社日立製作所 Pellet bonding equipment
JPH0778794A (en) * 1993-06-22 1995-03-20 Disco Abrasive Syst Ltd Cassette table of dicing device
JPH09199575A (en) * 1996-01-18 1997-07-31 Toshiba Mechatronics Kk Semiconductor pellet bonding equipment
JP2005159295A (en) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd Device and method for treating substrate
JP5175256B2 (en) 2009-09-30 2013-04-03 ホシデン株式会社 Capacitive touch panel and manufacturing method thereof
JP2012009519A (en) * 2010-06-23 2012-01-12 Hitachi High-Technologies Corp Vacuum processing apparatus
JP5686469B2 (en) 2011-01-28 2015-03-18 富士機械製造株式会社 Die supply device
US9545724B2 (en) 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
JP2015138856A (en) 2014-01-22 2015-07-30 株式会社ディスコ Cutting device
JP6347036B2 (en) 2014-02-07 2018-06-27 アドバンストマテリアルテクノロジーズ株式会社 Roller type plasma equipment
JP2017175029A (en) 2016-03-25 2017-09-28 富士機械製造株式会社 Wafer transfer device
JP6707291B2 (en) * 2016-10-14 2020-06-10 株式会社ディスコ Wafer processing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082542A1 (en) * 2002-04-01 2003-10-09 Mitsuboshi Diamond Industrial Co., Ltd. Parting method for fragile material substrate and parting device using the method
JP2009010287A (en) * 2007-06-29 2009-01-15 Tokyo Electron Ltd Processing system for substrate
JP2012146872A (en) * 2011-01-13 2012-08-02 Disco Abrasive Syst Ltd Resin coating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024161644A1 (en) * 2023-02-03 2024-08-08 ヤマハ発動機株式会社 Laser processing device, semiconductor chip and method for manufacturing semiconductor chip

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