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WO2019102800A1 - Fil isolé - Google Patents

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Publication number
WO2019102800A1
WO2019102800A1 PCT/JP2018/040172 JP2018040172W WO2019102800A1 WO 2019102800 A1 WO2019102800 A1 WO 2019102800A1 JP 2018040172 W JP2018040172 W JP 2018040172W WO 2019102800 A1 WO2019102800 A1 WO 2019102800A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
insulated wire
polyimide
mass
polyimide film
Prior art date
Application number
PCT/JP2018/040172
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English (en)
Japanese (ja)
Inventor
齋藤　秀明
雅晃 山内
Original Assignee
住友電工ウインテック株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電工ウインテック株式会社, 住友電気工業株式会社 filed Critical 住友電工ウインテック株式会社
Priority to JP2019514141A priority Critical patent/JP7107921B2/ja
Priority to CN201880012123.3A priority patent/CN110301015B/zh
Publication of WO2019102800A1 publication Critical patent/WO2019102800A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Definitions

  • the present disclosure relates to an insulated wire.
  • the insulated wire used for the production of coils for motors and the like Since a general insulated wire is provided with a resin insulating layer on the outer peripheral surface side of the linear metal conductor, the resin insulating layer has not only insulation but also adhesion to the metal conductor, heat resistance and durability. Sex is required.
  • Polyimide, polyamide imide, polyester imide, etc. are used as resin which forms an insulating layer of an insulated wire.
  • polyimide is most suitably used as a material for forming an insulating layer of an insulated wire having high required performance because polyimide is the most excellent in heat resistance and high in durability and solvent resistance.
  • a method of forming the insulating layer of the insulated wire for example, a method is known in which a varnish for forming an insulating film is applied to the outer peripheral surface of a metal conductor and then the varnish is baked (Patent Document 1).
  • a varnish for forming an insulating film is applied to the outer peripheral surface of a metal conductor and then the varnish is baked (Patent Document 1).
  • an insulating film having a thickness of about several ⁇ m is formed by one baking step.
  • the application process and baking process of a varnish are implemented in multiple times until the insulating layer of sufficient thickness is formed.
  • the outermost layer of the insulating layer is a polyimide layer
  • the resin constituting the insulating layers other than the outermost layer is a polyamide imide or the like, whereby the insulating layer under the polyimide layer and the polyimide layer is formed.
  • An insulated wire according to an aspect of the present invention is an insulated wire including a linear metal conductor and an insulating layer laminated on the outer peripheral surface side of the metal conductor, and the insulating layer is an insulating film having two or more insulating films. And at least one of the two or more insulating films is a polyimide film containing polyimide as a main component, and the insulating layer contains two or more types of residual solvents having different boiling points.
  • An insulated wire according to another aspect of the present invention is an insulated wire including a linear metal conductor and an insulating layer laminated on the outer peripheral surface side of the metal conductor, wherein the insulating layer is two or more insulating layers. It has a laminated structure of films, and at least one of the two or more insulating films is a polyimide film mainly composed of polyimide, and the insulating layer contains two or more kinds of residual solvents having different boiling points, The content of each of the residual solvents in the insulating layer is 0.001% by mass or more and less than 0.1% by mass, and the total content of the two or more types of residual solvents in the insulating layer is 0.002% by mass More than 0.1% by mass or less, and the above-mentioned polyimide in the above-mentioned polyimide film is derived from a structural unit derived from pyromellitic dianhydride and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride
  • FIG. 1 is a schematic partial cross-sectional view showing an insulated wire according to an embodiment of the present invention.
  • Polyimide having high solvent resistance has low affinity with the varnish. Therefore, even if a varnish containing polyimide is simply applied to the surface of the polyimide film, the adhesion between the two polyimide films after baking is not sufficiently improved. When the adhesion between the insulation films forming the insulation layer is low, the insulation film may be peeled off when the insulated wire provided with the insulation layer is subjected to winding processing.
  • the present disclosure aims to provide an insulated wire capable of improving the adhesion between insulating films forming the insulating layer.
  • An insulated wire according to an aspect of the present invention is an insulated wire including a linear metal conductor and an insulating layer laminated on the outer peripheral surface side of the metal conductor, and the insulating layer is an insulating film having two or more insulating films. And at least one of the two or more insulating films is a polyimide film containing polyimide as a main component, and the insulating layer contains two or more types of residual solvents having different boiling points.
  • At least one of the two or more insulating films forming the laminated structure is a polyimide film mainly composed of polyimide, and the insulating layer containing this polyimide film contains two or more kinds of residual solvents having different boiling points.
  • the varnish for forming the polyimide film contains two or more solvents having different boiling points, rapid drying of the varnish is suppressed at the time of formation of the polyimide film, so that the surface of the polyimide film tends to be smooth.
  • the polyimide film contains two or more types of residual solvents, the affinity with other varnishes for forming an insulating film is improved.
  • the said insulated wire can improve the adhesiveness between the insulating film which forms the insulating layer containing a polyimide film by providing the insulating layer containing 2 or more types of residual solvents in which boiling points differ.
  • the main component refers to the component with the highest content, and usually represents a component of 50% by mass or more.
  • the content of each of the residual solvents in the insulating layer is 0.001% by mass or more and less than 0.1% by mass, and the total content of the two or more types of residual solvents in the insulating layer is 0.002% by mass It is preferable that the content be 0.1% by mass or less.
  • the polyimide in the polyimide film contains at least one of a structural unit derived from pyromellitic dianhydride and a structural unit derived from 3,3 ′, 4,4′-biphenyltetracarboxylic acid dianhydride Good.
  • the insulated wire can be used. The heat resistance of the polyimide film can be improved.
  • the polyimide in the polyimide film may include at least one of a structural unit derived from 4,4'-diaminodiphenyl ether and a structural unit derived from 4,4'-bis (4-aminophenoxy) biphenyl.
  • the said insulated wire improves the heat resistance of a polyimide membrane by using at least any one of 4,4'- diaminodiphenyl ether and 4,4'- bis (4-amino phenoxy) biphenyl as diamine used as a raw material of polyimide. be able to.
  • An intermediate insulating layer laminated between the metal conductor and the insulating layer is further provided, and the intermediate insulating layer is formed of a resin composition containing a thermosetting resin, a thermoplastic resin, or a mixture thereof as a main component. Good to have. It is because it can contribute to the improvement of the heat resistance of the above-mentioned middle insulating layer. From the viewpoint of improving the heat resistance, it is more preferable that the resin composition contains polyamideimide as a main component.
  • the average thickness of the intermediate insulating layer is preferably 5 ⁇ m or more and 250 ⁇ m or less. While maintaining the strength of the intermediate insulating layer, it is possible to prevent the decrease in space factor of the coil formed of the insulated wire.
  • the insulated wire 1 of FIG. 1 includes a linear metal conductor 2 and an insulating layer 3 laminated on the outer peripheral surface side of the metal conductor 2.
  • the insulated wire 1 further includes an intermediate insulating layer 4 stacked between the metal conductor 2 and the insulating layer 3.
  • the metal conductor 2 is a metal linear body responsible for the electrical conduction of the insulated wire 1 and is formed in a circular shape in a cross sectional view.
  • the cross-sectional shape of the metal conductor 2 is not limited to a circle, and may be, for example, a rectangle, a rounded rectangle, or an ellipse.
  • the metal conductor 2 may be a single linear body, or may be a stranded wire body in which a plurality of thin wires are twisted.
  • the metal conductor 2 As a material of the metal conductor 2, for example, a metal such as copper, aluminum, nickel, silver, iron or the like or an alloy thereof is used, but it is preferable to use copper or aluminum from the viewpoint of conductivity and processability.
  • the metal conductor 2 may have a multilayer structure in which a coating made of another metal is laminated on the outer peripheral surface of the linear body made of metal.
  • the average cross-sectional area of the metal conductor 2 As a lower limit of the average cross-sectional area of the metal conductor 2, 0.01 mm 2 is preferable, and 0.1 mm 2 is more preferable. On the other hand, preferably 100 mm 2 as the upper limit of the average cross-sectional area of the metal conductor 2, 50 mm 2 is more preferable. If the average cross-sectional area of the metal conductor 2 does not reach the above lower limit, the electrical resistance of the metal conductor 2 may increase, and heat generation may occur when the insulated wire 1 is used. On the contrary, when the average cross-sectional area of the metal conductor 2 exceeds the above-mentioned upper limit, the cross-sectional area of the insulated wire 1 becomes large, and there is a possibility that the coil etc. manufactured using the insulated wire 1 may become large.
  • the average cross-sectional area indicates an average value of cross-sectional areas in any five cross-sectional views.
  • the intermediate insulating layer 4 is a covering layer covering the outer periphery of the metal conductor 2 and has an insulating property.
  • the intermediate insulating layer 4 is laminated on the outer peripheral surface of the metal conductor 2 as shown in FIG. 1, but may be laminated on the outer peripheral surface side of the metal conductor 2, and the metal conductor 2 and the intermediate insulating layer 4 Another layer may be laminated between the layers.
  • the intermediate insulating layer 4 is formed of a resin composition containing a thermosetting resin, a thermoplastic resin, or a mixture thereof as a main component.
  • a resin composition polyamide imide, polyester imide, polyether imide, H type polyester, polyester imide, polyurethane etc. are used, for example.
  • polyamide imide from the viewpoint of heat resistance improvement.
  • a hardening agent may be added to the intermediate insulating layer 4 as necessary.
  • the lower limit of the average thickness of the intermediate insulating layer 4 is preferably 5 ⁇ m, more preferably 10 ⁇ m, and still more preferably 15 ⁇ m.
  • the upper limit of the average thickness of the intermediate insulating layer 4 is preferably 250 ⁇ m, more preferably 200 ⁇ m, and still more preferably 150 ⁇ m. If the average thickness of the intermediate insulating layer 4 is less than the above lower limit, the strength of the intermediate insulating layer 4 may be insufficient. Conversely, when the average thickness of the intermediate insulating layer 4 exceeds the upper limit, the space factor of the coil formed of the insulated wire 1 may be reduced.
  • the average thickness indicates an average value of any five thicknesses in one cross-sectional view.
  • the intermediate insulating layer 4 is formed by applying a varnish obtained by dissolving the above-described resin composition in a volatile solvent on the outer peripheral surface of the metal conductor 2 and then evaporating the solvent by heating and curing the resin composition. Be done.
  • the insulating layer 3 is a covering layer covering the outer periphery of the intermediate insulating layer 4 and has an insulating property. Although the insulating layer 3 is laminated on the outer peripheral surface of the intermediate insulating layer 4 in FIG. 1, it may be laminated on the outer peripheral surface side of the metal conductor 2, and the other insulating layer 3 may be interposed between the intermediate insulating layer 4 and the insulating layer 3. Layers may be stacked.
  • the insulating layer 3 has a laminated structure of two or more insulating films. Specifically, as shown in FIG. 1, the insulating layer 3 is an insulating film 3 c laminated on the outer peripheral surface of the intermediate insulating layer 4, an insulating film 3 b laminated on the outer peripheral surface of the insulating film 3 c, and an insulating film And an insulating film 3a to be laminated on the outer peripheral surface of 3b, and these insulating films form a laminated structure.
  • the insulating layer 3 should just have a laminated structure of two or more insulating films, and is not limited to what has a laminated structure of three insulating films.
  • the lower limit of the average thickness of the insulating layer 3 is preferably 5 ⁇ m, more preferably 10 ⁇ m, and still more preferably 15 ⁇ m.
  • the upper limit of the average thickness of the insulating layer 3 is preferably 250 ⁇ m, more preferably 200 ⁇ m, and still more preferably 150 ⁇ m. If the average thickness of the insulating layer 3 is less than the above lower limit, the strength of the insulating layer 3 may be insufficient. Conversely, when the average thickness of the insulating layer 3 exceeds the upper limit, the space factor of the coil formed of the insulated wire 1 may be reduced.
  • the insulating film 3a, the insulating film 3b, and the insulating film 3c are polyimide films containing polyimide as a main component, and contain two or more types of residual solvents having different boiling points.
  • the entire insulating film forming the insulating layer 3 does not have to be a polyimide film, and at least one of the two or more insulating films contains polyimide as a main component, and contains two or more types of residual solvents having different boiling points. It may be a film.
  • the upper limit of the content may be less than 100% by mass, but the upper limit of the content is preferably 98% by mass, and more preferably 95% by mass.
  • the content exceeds the preferable upper limit, it is difficult to add other additives to the polyimide film, and there is a possibility that the design freedom of the polyimide film may be reduced.
  • a varnish for forming a polyimide film can be obtained by dissolving tetracarboxylic acid dianhydride and diamine as raw materials of polyamic acid in a solvent and then promoting a condensation polymerization reaction of tetracarboxylic acid dianhydride and diamine. .
  • the polyamic acid which is a precursor of polyimide is imidated by heating and becomes polyimide.
  • the polyimide film is formed by applying the varnish to the outer peripheral surface of the intermediate insulating layer 4 or the other insulating film, and then baking to evaporate most of the solvent and imidizing the polyamic acid in the solvent.
  • additives such as a pigment, a dye, an inorganic or organic filler, a lubricant, and an adhesion improver may be added to the varnish for forming a polyimide film, as needed.
  • the polyimide in the polyimide film contains at least one of a structural unit derived from pyromellitic dianhydride and a structural unit derived from 3,3 ′, 4,4′-biphenyltetracarboxylic acid dianhydride. There is.
  • At least one of 4,4'-diaminodiphenyl ether (ODA) and 4,4'-bis (4-aminophenoxy) biphenyl (BAPB) is used as a diamine which is a raw material of polyamic acid. Therefore, the polyimide in the polyimide film contains at least one of structural units derived from 4,4'-diaminodiphenyl ether and structural units derived from 4,4'-bis (4-aminophenoxy) biphenyl.
  • diamines 4,4'- methylenedianiline (MDA), 2, 2-bis [4- (amino phenoxy) phenyl] propane (BAPP) as a diamine used as the raw material of a polyamic acid 1,4-bis (4-aminophenoxy) benzene (TPE-Q), 1,3-bis (4-aminophenoxy) benzene (TPE-R), 1,1-bis [4- (4-aminophenoxy) ) Diamines such as phenyl] cyclohexane (4-APBZ), 1,3-bis (3-aminophenoxy) benzene (3-APB), 1,5-bis (3-aminophenoxy) naphthalene (1,5-BAPN) May be used.
  • MDA 2, 2-bis [4- (amino phenoxy) phenyl] propane
  • TPE-Q 1,4-bis (4-aminophenoxy) benzene
  • TPE-R 1,3-bis (4-aminophenoxy
  • Examples of the solvent contained in the varnish for forming a polyimide film include N-methylpyrrolidone (NMP), N-ethylpyrrolidone (NEP), N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAc), Two types of aprotic polar solvents such as monomethylformaldehyde (NMF), ⁇ -alkoxypropionamide, 3-methoxy-N, N-dimethylpropanamide, dimethylsulfoxide (DMSO), and ⁇ -butyrolactone ( ⁇ -BL) The above is used in combination.
  • NMP N-methylpyrrolidone
  • NEP N-ethylpyrrolidone
  • DMF N-dimethylformamide
  • DMAc N-dimethylacetamide
  • Two types of aprotic polar solvents such as monomethylformaldehyde (NMF), ⁇ -alkoxypropionamide, 3-methoxy-N, N-di
  • the solvent which has not volatilized by baking remains on the polyimide film. That is, the polyimide film contains at least two or more kinds of residual solvents having different boiling points.
  • the upper limit of the content is preferably less than 0.1% by mass, more preferably less than 0.08% by mass, and still more preferably less than 0.07% by mass. If the content is less than the above lower limit, the surface of the polyimide film may not be formed smooth. On the other hand, when the content is equal to or more than the upper limit, the dielectric constant of the polyimide film may be increased, and the insulation of the polyimide film may be reduced.
  • the content of each of the residual solvents in the insulating layer is the same as the residual solvent in the polyimide film.
  • the lower limit of the total content of the two or more types of residual solvents relative to the polyimide film is preferably 0.002% by mass, more preferably 0.01% by mass, and still more preferably 0.02% by mass.
  • the upper limit of the content is preferably 0.1% by mass, more preferably 0.09% by mass, and still more preferably 0.08% by mass.
  • the content is less than the above lower limit, the surface of the polyimide film may not be formed smooth, and the affinity between the polyimide film and the varnish for forming the insulating film may not be sufficiently improved.
  • the content exceeds the upper limit the dielectric constant of the polyimide film may be increased, and the insulation of the polyimide film may be reduced.
  • the total content of the two or more types of residual solvents in the insulating layer is the same as the total content of the two or more types of residual solvents in the polyimide film.
  • the insulating film 3a, the insulating film 3b and the insulating film 3c forming the laminated structure are a polyimide film, and the polyimide film is mainly composed of polyimide and contains two or more kinds of residual solvents having different boiling points. doing.
  • the said insulated wire 1 suppresses rapid drying of the varnish for polyimide film formation at the time of forming a polyimide film, and promotes smoothing of the surface of a polyimide film.
  • the said insulated wire 1 contains 2 or more types of residual solvents of a suitable quantity in a polyimide film, the affinity of the polyimide film and the varnish for other insulating film formation is improved. Therefore, the said insulated wire 1 can improve the adhesiveness between the insulation films which form the insulating layer 3.
  • the polyimide in the polyimide film is a structural unit derived from pyromellitic dianhydride and a structural unit derived from 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride. Since the insulating layer 3 contains at least one of structural units derived from 4,4'-diaminodiphenyl ether and / or structural units derived from 4,4'-bis (4-aminophenoxy) biphenyl, The heat resistance of the formed polyimide film can be improved.
  • the insulated wire 1 does not need to be equipped with the intermediate
  • the insulated wire 1 may be provided with the linear metal conductor 2 and the insulating layer 3 directly laminated on the outer peripheral surface of the metal conductor 2.
  • the polyimide film may contain three or more types of residual solvents having different boiling points.
  • the content of each of the two or more types of residual solvents selected from the three or more types of residual solvents contained in the polyimide film is 0.001% by mass or more and less than 0.1% by mass, and the polyimide film is The total content of all residual solvents contained may be 0.002% by mass or more and 0.1% by mass or less.
  • the varnish for polyimide film formation was prepared using the following tetracarboxylic acid dianhydride, diamine and a solvent.
  • a varnish for forming a polyimide film is to promote the condensation polymerization reaction of tetracarboxylic acid dianhydride and diamine after dissolving tetracarboxylic acid dianhydride and diamine as raw materials of polyamic acid in a solvent in an equimolar ratio. Obtained by The composition of the tetracarboxylic acid dianhydride as the raw material, the composition of the diamine and the composition of the solvent used are shown in Table 1. In Table 1, the composition ratio of tetracarboxylic dianhydride and the composition ratio of diamine are shown by molar ratio, and the composition ratio of the solvent is shown by mass ratio.
  • Tetracarboxylic acid dianhydride As a tetracarboxylic acid dianhydride used as a raw material of a polyamic acid, pyromellitic dianhydride and 3,3 ', 4,4'-biphenyltetracarboxylic acid dianhydride were used. In Table 1, these acid anhydrides are denoted as PMDA and BPDA, respectively, and the composition ratios are shown such that the total of these is 100.
  • diamines (Diamine) 4,4'-Diaminodiphenyl ether and 4,4'-bis (4-aminophenoxy) biphenyl were used as diamines to be a raw material of the polyamic acid.
  • these diamine is each displayed as ODA and BAPB, and the composition ratio is shown so that the sum total of these may be set to 100.
  • solvent As the solvent, “NMP” (N-methyl pyrrolidone, boiling point 202 ° C.) of Mitsubishi Chemical Corporation, “NMF” (monomethyl formaldehyde, boiling point 199 ° C.) of Mitsubishi Gas Chemical Co., Ltd., “DMAC” of Mitsubishi Gas Chemical Co., Ltd. (N, N-dimethylacetamide, boiling point 165 ° C.), Tokyo Chemical Industry Co., Ltd. “D0722” (N, N-dimethylformamide, boiling point 153 ° C.), Idemitsu Kosan Co., Ltd.
  • Equamide M100 ( ⁇ -alkoxypropionamide) Boiling point 216 ° C.
  • E0358 N-ethyl pyrrolidone, boiling point 218 ° C.) of Tokyo Chemical Industry Co., Ltd.
  • GBL ⁇ -butyrolactone, boiling point 204 ° C.
  • the measurement of the relative permittivity of the insulating layer is performed by applying silver paste to three places on the surface of the insulated wire, and then measuring the capacitance between the silver paste and the copper wire with an LCR meter at normal temperature.
  • the relative dielectric constant was calculated from the value of the capacitance and the thickness of the insulating layer.
  • peeling test In the peeling test, after prestretching the insulated wire by 20% in the longitudinal direction, the insulated wire is wound 30 times around an iron core having the same diameter as the insulated wire, and whether cracking or peeling occurs in the insulating layer Adopted a method to confirm the In Table 2, A indicates that cracking or peeling did not occur in the insulating layer, and B indicates that cracking or peeling occurred in the insulating layer.
  • the 12 insulated wires are examples in which the polyimide film forming the insulating layer contains two or three types of residual solvents, and the content of each residual solvent to the polyimide film is 0.001 mass. % Or more and less than 0.1% by mass, and the total content of the residual solvent to the polyimide film is 0.002% by mass or more and 0.1% by mass or less.
  • No. 1 to No. In the 12 insulated wires, it was confirmed that the relative dielectric constant of the insulating layer is 3.2 or more and 3.3 or less and that cracking or peeling does not occur in the insulating layer even in the peeling test. That is, no. 1 to No. In the 12 insulated wires, the dielectric constant of the insulating layer is low, and it can be said that the adhesion between the polyimide films forming the insulating layer is high.
  • the insulated wire of 14 is an example in which the polyimide film forming the insulating layer contains only one type of residual solvent. No. 13 to No. In the insulated wire of No. 14, it was confirmed that cracking and peeling occur in the insulating layer also in the peeling test. That is, no. 13 to No. In the 14 insulated wires, it can be said that the adhesion between the polyimide films forming the insulating layer is not sufficient.
  • the insulated wire of No. 15 is an example in which the polyimide film forming the insulating layer contains only one type of residual solvent, and is an example in which the content of the residual solvent with respect to the polyimide film is 0.1% by mass or more.
  • the dielectric constant of the insulating layer is 3.6, and it can be said that the dielectric constant of the insulating layer is high.

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)

Abstract

Un fil isolé selon la présente invention comprend un conducteur métallique linéaire et une couche isolante qui est superposée sur la surface circonférentielle externe du conducteur métallique. La couche isolante a une structure multicouche qui est composée de deux films isolants ou plus; au moins l'un des deux films isolants ou plus est un film de polyimide qui est principalement composé d'un polyimide; et la couche isolante contient deux solvants résiduels ou plus qui ont des points d'ébullition différents.
PCT/JP2018/040172 2017-11-27 2018-10-29 Fil isolé WO2019102800A1 (fr)

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JP2019514141A JP7107921B2 (ja) 2017-11-27 2018-10-29 絶縁電線
CN201880012123.3A CN110301015B (zh) 2017-11-27 2018-10-29 绝缘电线

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JP2017-227118 2017-11-27
JP2017227118 2017-11-27

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WO2019102800A1 true WO2019102800A1 (fr) 2019-05-31

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Citations (4)

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JP2012234625A (ja) * 2011-04-28 2012-11-29 Sumitomo Electric Wintec Inc 絶縁電線及びそれを用いた、電機コイル、モータ
WO2013073397A1 (fr) * 2011-11-16 2013-05-23 住友電気工業株式会社 Vernis isolant et fil électrique isolé l'utilisant
WO2015105095A1 (fr) * 2014-01-10 2015-07-16 古河電気工業株式会社 Fil électrique isolé, bobine et dispositif électrique/électronique, et procédé de prévention de fissuration pour fil électrique isolé
JP2015209457A (ja) * 2014-04-24 2015-11-24 日立金属株式会社 ポリアミック酸塗料および絶縁電線

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5486646B2 (ja) * 2012-07-20 2014-05-07 株式会社デンソー 絶縁電線
US9843233B2 (en) * 2014-06-27 2017-12-12 Hitachi Metals, Ltd. Insulated electric wire and coil

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012234625A (ja) * 2011-04-28 2012-11-29 Sumitomo Electric Wintec Inc 絶縁電線及びそれを用いた、電機コイル、モータ
WO2013073397A1 (fr) * 2011-11-16 2013-05-23 住友電気工業株式会社 Vernis isolant et fil électrique isolé l'utilisant
WO2015105095A1 (fr) * 2014-01-10 2015-07-16 古河電気工業株式会社 Fil électrique isolé, bobine et dispositif électrique/électronique, et procédé de prévention de fissuration pour fil électrique isolé
JP2015209457A (ja) * 2014-04-24 2015-11-24 日立金属株式会社 ポリアミック酸塗料および絶縁電線

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CN110301015A (zh) 2019-10-01
JPWO2019102800A1 (ja) 2020-10-01
JP7107921B2 (ja) 2022-07-27
CN110301015B (zh) 2021-03-12

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