WO2017185969A1

WO2017185969A1 - Terminal housing and mobile terminal

Info

Publication number: WO2017185969A1
Application number: PCT/CN2017/079958
Authority: WO
Inventors: 吴寿宽; 曾武春
Original assignee: 广东欧珀移动通信有限公司
Priority date: 2016-04-29
Filing date: 2017-04-10
Publication date: 2017-11-02
Also published as: CN105744810A; CN105744810B

Abstract

Disclosed in the embodiments of the present application are a terminal housing and a mobile terminal; said housing is used for forming an accommodating space with the front cover of said terminal so as to accommodate an electronic component; said housing comprises a main body and a heat-absorbing/heat-storing material, said heat-absorbing/heat-storing material being arranged on the inside surface of the main body; the heat-absorbing/heat-storing material is a material having heat-absorbing and heat-storing functions; the heat-absorbing/heat-storing material is used for absorbing heat from said electronic component and storing the absorbed heat. Using the present application, it is possible to effectively reduce the temperature of a heat-generating electronic component in a mobile terminal and isolate the heat radiated from the electronic component, thus reducing the temperature of the surface of the housing.

Description

Terminal housing and mobile terminal

Technical field

The present application relates to the field of electronic devices, and in particular, to a housing and a mobile terminal of a terminal.

Background technique

With the development of the electronic equipment industry, the configuration of mobile terminals such as tablet computers and mobile phones is getting higher and higher, and the functions that can be realized are more and more abundant, which satisfies people's daily needs, but with the improvement of configuration, mobile terminals The central processing unit (CPU) has higher and higher frequency, and the power consumption is getting larger and larger, which causes the heat generated by the mobile terminal to increase accordingly. If the heat is not controlled or transferred, it will bring The impact of two aspects: 1, the temperature of the mobile terminal chip is too high, resulting in slow operation of the mobile terminal, and even stuck, affecting the use of the mobile terminal; 2, the temperature of the mobile terminal chip is transmitted to the outer casing of the mobile phone, resulting in a higher temperature of the outer casing, using There will be problems such as hot hands and hot ears.

In order to solve the problem of heat generation of the mobile terminal, the prior art generally disposes the heat dissipating graphite sheet on the inner surface of the housing of the terminal to indirectly dissipate the chip, but since the setting of the heat dissipating graphite sheet is limited by the position, The heat-generating position cannot be directly dissipated, resulting in poor heat dissipation.

Summary of the invention

The embodiment of the present application provides a housing for connecting a front cover to form an accommodating space for accommodating the packaged electronic device, the housing including the body and the heat absorbing heat storage material, and the heat absorbing heat storage. a material disposed on an inner surface of the body and adjacent to a surface of the electronic device; the endothermic heat storage material is a material having an endothermic and heat storage function, the endothermic heat storage material is for absorbing and storing the The heat of the electronic device.

The embodiment of the present application further provides a mobile terminal, including a shell of the foregoing terminal.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the following description The drawings in the drawings are only some of the embodiments of the present application, and those skilled in the art can obtain other drawings according to the drawings without any creative work.

1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application;

2 is a schematic structural diagram of a housing of a terminal according to an embodiment of the present application;

FIG. 3 is a schematic perspective structural view of a housing of a terminal according to an embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.

The mobile terminal involved in the embodiment of the present application may be any device having communication and storage functions, such as a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer (PC), a notebook computer, an in-vehicle device, and a network television. A smart device with network capabilities such as wearable devices.

FIG. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application. As shown in FIG. 1 , the mobile terminal may include a housing 1 of the terminal, and the housing 1 is preferably a battery cover. The housing 1 may be a metal or plastic material having a certain thickness. The housing 1 is connected to the front cover of the mobile terminal to form an accommodating space, and the electronic components such as the main board, the CPU, the battery, the display screen, and the camera of the mobile terminal are accommodated in the accommodating space.

2 is a schematic structural diagram of a housing of a terminal according to an embodiment of the present application. As shown in FIG. 2, the housing 1 may include a body 11 and an endothermic heat storage material 12.

The heat absorbing heat storage material 12 is disposed on an inner surface of the body 11. It is understood that the inner surface of the body 11 is a surface of an electronic device near the mobile terminal, and the body 11 is preferably a battery cover. The body 11 may be made of a metal material, a plastic material or the like.

The endothermic heat storage material 12 may be a material having an endothermic and heat storage function for absorbing heat of the electronic device and storing the absorbed heat when absorbed. When the heat is saturated, the heat absorbing heat storage material 12 stops absorbing heat, and when the temperature of the body 11 drops to a preset temperature threshold, the heat absorbing heat storage material 12 starts to slowly dissipate heat. In one embodiment, The endothermic heat storage material 12 may include silica and polyethylene glycol, and the ratio between the silica and the polyethylene glycol is 1:1 to 1:9 (the specific value is specific to the mass ratio) The specific ratio may be determined according to the actual heat absorption and heat storage requirements. The heat absorbing heat storage material 12 may be composed of a plurality of silica gels after gelation, and emulsified polyethylene glycol. It is composed of microcapsules of the capsule core. When the heat reaches a preset threshold, the polyethylene glycol absorbs heat from a solid to a liquid, and is surrounded by silica. After the heat is lowered, the polyethylene glycol slowly dissipates heat from a liquid to a solid, and absorbs heat. Heat storage and slow heat dissipation.

The heat absorbing heat storage material 12 may be specifically prepared by adding polyethylene glycol to a certain concentration of silica sol, and after completely dissolving, adding a CaCl ₂ accelerator solution, under strong stirring, The gelation reaction occurs, and a three-dimensional network structure gel is formed after standing; the gel is air-dried in an oven at 80 ° C for 24 to 48 hours, and cooled to room temperature to obtain a plurality of organosilicon oxide compounds under alkaline conditions. The microcapsules in which the silica after gelation is a capsule wall and the emulsified polyethylene glycol is a capsule core. The material properties of the endothermic heat storage material 12 may be phase change material properties.

Referring to FIG. 3 together, the heat absorbing heat storage material 12 may be placed on the inner surface of the body 11 in an arbitrary shape by coating or bonding. Specifically, the heat absorbing heat storage material 12 can be disposed on the inner surface of the body 11 in the following two ways:

1. Coating method: The casing 1 may further include an adhesive 13 which may be a mixture of a dilution solvent and a special bonding solution, such as methanol xylene, acrylic resin or the like. The adhesive is mixed into the endothermic heat storage material 12 in proportion and bonded to the inner surface of the body 11, preferably, the endothermic heat storage material 12 mixed with the adhesive 13 Being coated on the inner surface of the body 11;

2. The manner of bonding: the casing 1 may further comprise a glue layer 14, the glue layer 14 is preferably a double-sided backing, and the heat absorbing heat storage material 12 may be hydrophobically modified by adding an acid ester coupling agent. An inorganic or organic composite shaped phase change material is obtained, which is formed into a sheet shape by a tableting machine, and one side of the endothermic heat storage material 12 is bonded to the adhesive layer, and is adhered to the inner surface of the body 11 through the adhesive layer 14. Pick up.

Optionally, the housing 1 may further include a protective film 15 for protecting the heat absorbing heat storage material 12 from being damaged by an external force. For the above two modes, the protective film 15 An outer surface of the heat absorbing heat storage material 12 may be disposed on a side of the heat absorbing heat storage material 12 away from an inner surface of the body 11; For the first mode, the endothermic heat storage material 12 may also be coated on the protective film, and the protective film 15 passes through the adhesive layer. 14 is bonded to the inner surface of the body 11. The protective film may be graphite so that the endothermic heat storage material 12 can be dissipated more quickly.

Optionally, the housing 1 may further include a heat conducting hole 16 . Referring to FIG. 3 together, the heat conducting hole 16 may be disposed at an edge portion of the body 11 by providing heat conduction at an edge portion of the housing 1 . The hole 16 can enable the endothermic heat storage material 12 to quickly dissipate the stored heat and dissipate the heat of the heat generating device, thereby facilitating better heat absorption of the electronic device and lowering the temperature of the electronic device.

In the embodiment of the present invention, by providing an endothermic heat storage material on the inner surface of the casing of the terminal, it is possible to absorb heat of the electronic device that is heated in the mobile terminal, and store heat of the absorbed heat, thereby reducing the heat. The temperature of the electronic device is to ensure the normal operation of the mobile terminal, and at the same time, the heat dissipated by the electronic device is insulated by the function of heat storage, and the body surface temperature of the casing is lowered; by adding a protective film to the heat absorbing heat storage material, it can be avoided. The heat absorbing heat storage material is damaged by the external force, which increases the service life of the heat absorbing heat storage material; by combining the heat conduction holes, the efficiency of heat absorption and heat dissipation is improved, and the temperature of the electronic device is further reduced.

The above is only the preferred embodiment of the present application, and the scope of the application is not limited thereto, and the equivalent changes made in the claims of the present application are still within the scope of the present application.

Claims

a housing for connecting with the front cover to form an accommodating space for accommodating the packaged electronic device, wherein the housing of the terminal comprises a body and a heat absorbing heat storage material, and the heat absorbing heat storage a material disposed on an inner surface of the body;

The endothermic heat storage material is a material having an endothermic and heat storage function for absorbing heat of the electronic device and storing the absorbed heat.
The housing of the terminal according to claim 1, wherein the endothermic heat storage material comprises silica and polyethylene glycol, and a ratio of the silica to the polyethylene glycol is 1 : 1 to 1:9.
The housing of the terminal according to claim 1, wherein the heat absorbing heat storage material is composed of a gelatinized silica as a capsule wall and an emulsified polyethylene glycol as a capsule core. Composition.
The housing of the terminal according to claim 1, wherein the material property of the heat absorbing heat storage material is a phase change material property.
The housing of the terminal according to any one of claims 1 to 4, further comprising an adhesive, the adhesive is mixed in proportion to the endothermic heat storage material, and the adhesive is mixed The endothermic heat storage material is applied to an inner surface of the body.
The housing of the terminal according to any one of claims 1 to 4, further comprising a glue layer, wherein the heat absorbing heat storage material is formed into a sheet shape, and one side of the heat absorbing heat storage material and the glue layer Bonding, the endothermic heat storage material is bonded to the inner surface of the body through the adhesive layer.
The housing of the terminal according to any one of claims 1 to 4, further comprising a protective film disposed on an outer surface of the heat absorbing heat storage material, the heat absorbing heat storage The outer surface of the material is remote from the inner surface of the body.
The housing of the terminal according to any one of claims 1 to 4, further comprising a protective film and a glue layer, wherein the heat absorbing heat storage material is coated on the protective film, and the adhesive layer is adhered The protective film is bonded to the inner surface of the body through the adhesive layer on a side where the heat absorbing heat storage material does not contact the protective film.
The housing of the terminal according to claim 1, further comprising a heat conducting hole disposed at an edge portion of the body.
A mobile terminal characterized by comprising the housing of the terminal according to any one of claims 1 to 9.
a housing for connecting to the front cover to form an accommodating space for accommodating the package electronic device, wherein the housing comprises a body and a heat absorbing heat storage material, and the heat absorbing heat storage material is disposed On the inner surface of the body and adjacent to the surface of the electronic device;

The endothermic heat storage material is a material having an endothermic and heat storage function for absorbing and storing heat of the electronic device.
The housing of the terminal according to claim 11, wherein the endothermic heat storage material comprises silica and polyethylene glycol, and the ratio between the silica and the polyethylene glycol is 1 : 1 to 1:9.
The housing of the terminal according to claim 11, wherein the heat absorbing heat storage material is composed of a gelatinized silica as a capsule wall and an emulsified polyethylene glycol as a capsule core. Composition.
The housing of the terminal according to claim 11, wherein the material property of the heat absorbing heat storage material is a phase change material property.
The housing of the terminal according to any one of claims 11 to 14, further comprising an adhesive, said adhesive being mixed in proportion to said endothermic heat storage material, mixed with said adhesive Said An endothermic heat storage material is applied to the inner surface of the body.
The housing of the terminal according to any one of claims 11 to 14, further comprising a glue layer, wherein the heat absorbing heat storage material is formed into a sheet shape, and one side of the heat absorbing heat storage material and the glue layer Bonding, the endothermic heat storage material is bonded to the inner surface of the body through the adhesive layer.
The housing of the terminal according to any one of claims 11 to 14, further comprising a protective film disposed on an outer surface of the heat absorbing heat storage material, the heat absorbing heat storage The outer surface of the material is remote from the inner surface of the body.
The housing of the terminal according to any one of claims 11 to 14, further comprising a protective film and a glue layer, wherein the heat absorbing heat storage material is coated on the protective film, and the adhesive layer is adhered The protective film is bonded to the inner surface of the body through the adhesive layer on a side where the heat absorbing heat storage material does not contact the protective film.
The housing of the terminal according to any one of claims 11-14, wherein the body is made of a metal material.
The housing of the terminal according to claim 19, further comprising a heat conducting hole disposed at an edge portion of the body.