WO2016203668A1

WO2016203668A1 - Three-dimensional measurement device

Info

Publication number: WO2016203668A1
Application number: PCT/JP2015/082098
Authority: WO
Inventors: 大山　剛; 憲彦坂井田; 間宮　高弘; 裕之石垣
Original assignee: Ckd株式会社
Priority date: 2015-06-15
Filing date: 2015-11-16
Publication date: 2016-12-22
Also published as: TWI606227B; JP2017003513A; TW201643370A

Abstract

Provided is a three-dimensional measurement device that, when measuring height using a phase shift method, uses light of a plurality of differing periods to broaden a measurement range and shorten a measurement time. A substrate inspection device 1 is provided with an illumination device 4 capable of irradiating two light patterns onto a printed circuit board 2 from diagonally above, a camera 5 for imaging the part of the printed circuit board 2 onto which the light patterns are irradiated, and a control device 6 for carrying out various control, image processing, and calculation in the substrate inspection device 1. The control device 6 acquires a first height measurement value from image data obtained from the irradiation of a first light pattern having a first period and acquires gain and offset values from the image data. Next, the control device 6 uses the gain and offset values to acquire a second height measurement value from image data obtained by irradiating a second light pattern having a second period. The control device 6 acquires height data specified on the basis of the first measurement value and second measurement value as true height data.

Description

3D measuring device

The present invention relates to a three-dimensional measurement apparatus that performs height measurement using a phase shift method.

Generally, when an electronic component is mounted on a printed circuit board, cream solder is first printed on a predetermined electrode pattern disposed on the printed circuit board. Next, an electronic component is temporarily fixed on the printed circuit board based on the viscosity of the cream solder. Thereafter, the printed circuit board is guided to a reflow furnace, and soldering is performed through a predetermined reflow process. In recent years, it is necessary to inspect the printed state of the cream solder in a stage before being led to the reflow furnace, and a three-dimensional measuring device is sometimes used for such inspection.

In recent years, various so-called non-contact type three-dimensional measuring apparatuses using light have been proposed. For example, a technique relating to a three-dimensional measuring apparatus using a phase shift method has been proposed.

In the three-dimensional measuring device using the phase shift method, a combination of a light source that emits predetermined light and a grating that converts light from the light source into a light pattern having a sinusoidal (stripe) light intensity distribution. The light pattern is irradiated onto the object to be measured (in this case, cream solder printed on the printed circuit board) by the irradiation means. And it observes using the imaging means which has arrange | positioned the point on a board | substrate directly above. As the imaging means, a CCD camera or the like including a lens and an imaging element is used.

Under the above configuration, the light intensity (luminance) I of each coordinate (pixel) on the image data imaged by the imaging means is given by the following equation (R1).

I = f · sinφ + e (R1)
Where f: gain, e: offset, and φ: phase of the light pattern.

Here, by switching and controlling the grating, the phase of the light pattern is changed in, for example, four stages (φ + 0, φ + 90 °, φ + 180 °, φ + 270 °), and intensity distributions I ₀ , I ₁ , I ₂ corresponding thereto. , I ₃ is taken in, f (gain) and e (offset) are canceled based on the following formula (R2), and the phase φ is obtained.

φ = tan ⁻¹ [(I ₁ −I ₃ ) / (I ₂ −I ₀ )] (R2)
Then, using this phase φ, the height (Z) at each coordinate (X, Y) on the object to be measured such as cream solder is obtained based on the principle of triangulation.

However, actual measured objects may be high or low. For example, when it comes to cream solder, there is a thin film type, and there are some that protrude in the shape of a truncated cone. If the period of the light pattern to be irradiated (the interval between the stripes) is increased in accordance with the maximum height of these objects to be measured, the resolution becomes rough and the measurement accuracy may be deteriorated. On the other hand, although the accuracy can be improved by narrowing the period of the light pattern, there is a risk that the measurement range in which the height can be measured will be insufficient (the fringe order will be different). .

In view of this, in recent years, a three-dimensional measurement apparatus that performs measurement using two types of light patterns with different periods has been proposed in order to solve the shortage of the range (see, for example, Patent Document 1).

JP 2013-167464 A

However, as described above, in the three-dimensional measurement using the phase shift method, it is necessary to change the phase of the light pattern to be irradiated in four steps (or three steps) and capture four (or three) images. is there.

Accordingly, when two types of light patterns having different periods are used, first, the first light pattern of the first period is irradiated, the phase is changed in four steps (or three steps), and four patterns ( (Or three ways) after imaging, the second light pattern of the second period is irradiated, the phase is changed in four steps (or three steps), and four (or three) images under these In other words, it is necessary to image four times (or three times) for each light pattern, for a total of eight times (or six times), and there is a risk that the imaging time will increase significantly.

In addition, when a large number of measurement target ranges are set on a single printed board, the time required for measurement of the single printed board is further several times that time. Therefore, further shortening of the measurement time is required.

Note that the above-described problem is not necessarily limited to the height measurement of cream solder or the like printed on a printed circuit board, but is inherent in the field of other three-dimensional measurement apparatuses.

The present invention has been made in view of the above circumstances, and its purpose is to expand the measurement range using a plurality of lights having different periods when performing height measurement using the phase shift method. An object of the present invention is to provide a three-dimensional measuring apparatus that can shorten the measuring time.

Hereafter, each means suitable for solving the above-mentioned problems will be described in terms of items. In addition, the effect specific to the means to respond | corresponds as needed is added.

Means 1. An irradiating means capable of irradiating the object to be measured with a plurality of light patterns having at least a striped light intensity distribution and different periods (stripe pitch)
Phase control means capable of changing the phase of the light pattern irradiated from the irradiation means in a plurality of ways;
Imaging means capable of imaging reflected light from the object to be measured irradiated with the light pattern;
Image processing means capable of performing three-dimensional measurement of the object to be measured by a phase shift method based on image data picked up by the image pickup means;
The image processing means includes
Based on the first predetermined number of image data captured by irradiating the first light pattern of the first period with a first predetermined number (for example, three or four) phases, the measurement target on the image data First measurement value acquisition means for performing measurement related to coordinates (pixels) and acquiring the measurement values (height measurement values or phase measurement values) as first measurement values related to the measured coordinates;
Gain offset acquisition means for acquiring a gain and / or an offset value related to the measured coordinates based on the first predetermined number of image data imaged under the first light pattern;
The second predetermined pattern imaged by irradiating a second light pattern having a second period different from the first period with a second predetermined number (for example, one or two) of phases smaller than the first predetermined number. Based on several kinds of image data, using the gain and / or offset value acquired by the gain offset acquisition means, measurement is performed on the measured coordinates, and the measurement value (height measurement value or phase) is measured. Second measurement value acquisition means for acquiring (measurement value) as a second measurement value related to the measured coordinates;
A three-dimensional measurement comprising: height data acquisition means capable of acquiring height data specified from the first measurement value and the second measurement value as height data related to the measured coordinates. apparatus.

According to the means 1, the three-dimensional measurement is performed based on the image data obtained by irradiating the measurement target with the first light pattern of the first period, and the measurement value is acquired as the first measurement value. Three-dimensional measurement is performed based on image data obtained by irradiating the measurement object with the second light pattern of the second period, and the measurement value is acquired as the second measurement value. Then, the height data specified from the first measurement value and the second measurement value is acquired as the true height data related to the measured coordinates. This makes it possible to increase the measurable height range, which is an advantage of using a light pattern with a long period, and to realize high-precision measurement with high resolution, which is an advantage of using an optical pattern with a short period. An effect can be obtained. As a result, high-resolution measurement can be performed in a wide measurement range, and more accurate measurement can be realized.

Furthermore, in this means, when measuring with the second light pattern by using the gain and offset values of each coordinate obtained from the image data captured at the time of measurement with the first light pattern, the second light is used. The number of images to be imaged under the pattern (number of imaging times) may be smaller than the number of images to be imaged under the first light pattern.

For example, when the first light pattern is irradiated with four phases, four images are captured under the first light pattern, the second light pattern is irradiated with one phase, and one image is captured under the second light pattern. In this case, the number of times of imaging is five times, and the imaging time is significantly reduced.

Therefore, the total number of times of imaging can be reduced and the imaging time can be shortened as compared with the conventional technique in which only two types of light patterns having different periods are used. As a result, the measurement time can be dramatically shortened.

Means 2. When the second predetermined number is 1, the second measurement value acquisition unit calculates the phase θ of the second light pattern that satisfies at least the relationship of the following formula (S1) when acquiring the second measurement value. The three-dimensional measuring apparatus according to means 1, characterized in that:

V ₀ = Asinθ + B (S1)
Where V _{0 is} the luminance value of the measured coordinate, A is the gain of the measured coordinate, and B is the offset of the measured coordinate.

According to the means 2, since the number of times of imaging under the second light pattern is only one, the effect of the means 1 is more effective.

When the above formula (S1) is arranged with respect to “sin θ”, the following formula (S2) is obtained.

sinθ = (V ₀ −B) / A (S2)
Here, when the above equation (S2) is solved for the phase θ, the following equation (S3) can be derived.

θ = sin ⁻¹ {(V ₀ −B) / A} (S3)
Thus, the phase θ can be specified by the known luminance value V ₀ acquired by the second light pattern and the known gain A and offset B acquired by the first light pattern.

Means 3. When the second predetermined number is 2, the second measurement value acquisition unit obtains the second light pattern satisfying the relationship of at least the following formulas (T1) and (T2) when acquiring the second measurement value. The three-dimensional measuring apparatus according to means 1, wherein the phase θ is calculated.

V ₀ = Asinθ + B (T1)
V ₁ = Asin (θ + 90 °) + B (T2)
V ₀ , V ₁ : brightness value of measured coordinate of two kinds of image data, A: gain of measured coordinate, B: offset of measured coordinate.

According to the above means 3, since it is only necessary to perform imaging twice under the two second light patterns whose phases are different by 90 °, the effect of the means 1 is more effective.

The following formula (T3) is derived from the above formula (T2).

V ₁ = Asin (θ + 90 °) + B
= Acosθ + B (T3)
When the above equation (T3) is arranged with respect to “cos θ”, the following equation (T4) is obtained.

cos θ = (V ₁ −B) / A (T4)
Further, when the above formula (T1) is arranged with respect to “sin θ”, the following formula (T5) is obtained.

sinθ = (V ₀ −B) / A (T5)
Next, when the above formulas (T4) and (T5) are substituted into the following formula (T6), the following formula (T7) is derived.

tanθ = sinθ / cosθ (T6)
= {(V ₀ -B) / A} / {(V ₁ -B) / A}
= (V ₀ -B) / (V ₁ -B) (T7)
Here, when the above equation (T7) is solved for the phase θ, the following equation (T8) can be derived.

θ = tan ⁻¹ {(V ₀ −B) / (V ₁ −B)} (T8)
Thus, the phase θ can be specified by the known luminance values V ₀ and V ₁ acquired by the second light pattern and the known offset B acquired by the first light pattern.

Further, according to the above means 3, since the phase θ can be obtained based on the arithmetic expression using “tan ⁻¹ ”, the height can be measured in the range of 360 ° from −180 ° to 180 °. The range can be increased.

Means 4. 4. The three-dimensional measuring apparatus according to claim 1, wherein the object to be measured is cream solder printed on a printed circuit board or solder bumps formed on a wafer substrate.

According to the above means 4, it is possible to measure the height of cream solder printed on a printed circuit board or solder bumps formed on a wafer substrate. As a result, in the inspection of cream solder or solder bumps, the quality of cream solder or solder bumps can be determined based on the measured values. Therefore, in such an inspection, the effect of each means described above is exhibited, and the quality determination can be performed with high accuracy. As a result, it is possible to improve the inspection accuracy in the solder printing inspection apparatus or the solder bump inspection apparatus.

It is a schematic block diagram which shows a board | substrate inspection apparatus typically. It is a block diagram which shows the electric constitution of a board | substrate inspection apparatus. It is explanatory drawing which shows the resolution etc. by each light pattern.

Hereinafter, an embodiment will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram schematically illustrating a substrate inspection apparatus 1 including a three-dimensional measurement apparatus according to the present embodiment. As shown in the figure, the substrate inspection apparatus 1 includes a mounting table 3 for mounting a printed circuit board 2 on which cream solder as an object to be measured is printed, and a predetermined angle from above on the surface of the printed circuit board 2. Illumination device 4 as an irradiating means for irradiating a light pattern, a camera 5 as an imaging means for imaging a portion irradiated with a light pattern on printed circuit board 2, and various controls and images in substrate inspection apparatus 1 And a control device 6 for performing processing and arithmetic processing.

The mounting table 3 is provided with

motors

15 and 16, and the

motors

15 and 16 are driven and controlled by the control device 6 (motor control means 23), whereby the printed circuit board mounted on the mounting table 3. 2 can be slid in any direction (X-axis direction and Y-axis direction).

The illumination device 4 includes a light source 4a that emits predetermined light, and a liquid crystal lattice 4b that converts light from the light source 4a into a light pattern having a sinusoidal (stripe) light intensity distribution. On the other hand, it is possible to irradiate a striped light pattern whose phase changes in a plurality of ways from obliquely above.

More specifically, the light emitted from the light source 4a is guided to a pair of condensing lenses by an optical fiber, and is converted into parallel light there. The parallel light is guided to the projection lens through the liquid crystal grating 4b. Then, a striped light pattern is irradiated onto the printed circuit board 2 from the projection lens.

The liquid crystal lattice 4b includes a liquid crystal layer formed between a pair of transparent substrates, a common electrode disposed on one transparent substrate, and a plurality of strips arranged in parallel on the other transparent substrate so as to face the common electrode. Each of the grids corresponding to each band electrode by controlling on and off the switching elements (thin film transistors, etc.) connected to each band electrode by a drive circuit and controlling the voltage applied to each band electrode. The light transmittance of the line is switched to form a striped lattice pattern composed of a “bright portion” having a high light transmittance and a “dark portion” having a low light transmittance. And the light irradiated on the printed circuit board 2 via the liquid crystal grating 4b becomes a light pattern having a sinusoidal light intensity distribution due to blur caused by diffraction action or the like.

Further, the illumination device 4 is configured to be able to switch and irradiate a plurality of types of light patterns having different periods (stripe pitch). In the present embodiment, two types of light patterns, a first light pattern with a period of 600 μm and a second light pattern with a period of 800 μm, are switched and irradiated. Here, “600 μm” corresponds to the “first period”, and “800 μm” corresponds to the “second period”.

More specifically, the liquid crystal grating 4b is controlled, for example, a sinusoidal wave having a width of six grid lines (a “bright part” of three grid lines and a “dark part” of three grid lines) as one cycle. By generating the light pattern, the first light pattern with a period of 600 μm can be irradiated.

On the other hand, by generating a sinusoidal light pattern with a width of 8 grating lines (a “bright part” for 4 grating lines and a “dark part” for 4 grating lines) as one period, a period of 800 μm is generated. The second light pattern can be irradiated.

The camera 5 includes a lens, an image sensor, and the like. A CMOS sensor is used as the image sensor. Of course, the imaging device is not limited to this, and a CCD sensor or the like may be employed, for example. Image data captured by the camera 5 is converted into a digital signal inside the camera 5 and then input to the control device 6 (image data storage means 24) in the form of a digital signal. Then, the control device 6 performs image processing, inspection processing, and the like, which will be described later, based on the image data. In this sense, the control device 6 constitutes image processing means.

Next, the electrical configuration of the control device 6 will be described. As shown in FIG. 2, the control device 6 includes a camera control unit 21 that controls the imaging timing of the camera 5, an illumination control unit 22 that controls the illumination device 4, and a motor control unit 23 that controls the

motors

15 and 16. Image data storage means 24 for storing image data (luminance data) picked up by the camera 5, and gain / offset storage means 25 for storing gain A and offset B values calculated later based on the image data. Three-dimensional measurement means 26 for performing three-dimensional measurement based on at least the image data, a measurement value storage means 27 for storing the measurement result of the three-dimensional measurement means 26, and the measurement value storage means 27. Height data acquisition means 28 for acquiring true height data (absolute height data) based on the measurement value, and based on the height data obtained by the height data acquisition means 28 And a determination unit 30 for checking the print status of the ream solder 4. The phase control means in this embodiment is constituted by the illumination control means 22 that controls the illumination device 4 (liquid crystal grating 4b).

Although not shown in the drawings, the board inspection apparatus 1 includes an input unit composed of a keyboard and a touch panel, a display unit having a display screen such as a CRT or a liquid crystal, a storage unit for storing inspection results, and a solder printer. Output means for outputting inspection results and the like.

Next, the procedure for inspecting the printed circuit board 2 by the substrate inspection apparatus 1 will be described in detail based on the inspection routine performed for each inspection area. This inspection routine is executed by the control device 6.

The control device 6 (motor control means 23) first drives and controls the

motors

15 and 16 to move the printed circuit board 2, and adjusts the field of view of the camera 5 to a predetermined inspection area (measurement range) on the printed circuit board 2. The inspection area is one area in which the surface of the printed circuit board 2 is divided in advance with the size of the field of view of the camera 5 as one unit.

Subsequently, the control device 6 switches and controls the liquid crystal grating 4b of the illumination device 4, sets the position of the grating formed in the liquid crystal grating 4b to a predetermined reference position (phase “0 °”), and the pitch thereof. Is set to a period of 600 μm corresponding to the first light pattern.

When the switching setting of the liquid crystal lattice 4b is completed, the control device 6 first causes the illumination control means 22 to emit light from the light source 4a of the illumination device 4, starts irradiation of the first light pattern (period 600 μm), and the camera control means 21. Then, the camera 5 is driven and controlled to image the inspection area portion irradiated with the first light pattern. Here, the image data captured by the camera 5 is transferred to and stored in the image data storage device 24.

Similarly, the above-described series of imaging processes is performed under the three first light patterns (phase “90 °”, phase “180 °”, phase “270 °”) with the phase shifted by 90 °. As a result, four types of image data captured under the first light pattern with the phase shifted by 90 ° for a predetermined inspection area are acquired.

The control device 6 (three-dimensional measurement means 26), by the phase shift method, calculates the phase theta ₁ of the first light pattern in each coordinate from the image data of four types above (luminance value).

Here, the luminance values V ₁₀ , V ₁₁ , V ₁₂ , and V _{13 at} the respective coordinates of the four types of image data can be expressed by the following formulas (H1), (H2), (H3), and (H4). .

When the above equations (H1), (H2), (H3), and (H4) are solved for the phase θ ₁ , the following equation (H5) can be derived.

Then, using the phase θ ₁ calculated as described above, a first height measurement value at each coordinate is calculated based on the principle of triangulation, and the first height measurement value is used as a first measurement value. Store in the storage means 27. Accordingly, the series of processing functions constitute the first measurement value acquisition means in the present embodiment.

Next, the gain A and the offset B at each coordinate are specified from the above-described four kinds of image data captured under the first light pattern. Such processing functions constitute the gain offset acquisition means in the present embodiment. However, the gain A and offset B calculation processing is performed in parallel with the calculation processing of the first height measurement value after the acquisition of the four types of image data.

Here, the procedure for calculating the gain A and the offset B will be described in more detail. The relationship between the luminance values V ₁₀ , V ₁₁ , V ₁₂ , and V ₁₃ at each coordinate of the four types of image data, the gain A, and the offset B are as shown in the above formulas (H1) to (H4).

Here, the luminance values V ₁₀ , V ₁₁ , V ₁₂ and V ₁₃ of the four kinds of image data are added, and the above equations (H1) to (H4) are arranged as shown in the following [Equation 3], the following equations (H6) can be derived.

Moreover, the following formula (H7) can be derived from the above formulas (H1) and (H3).

Further, the following formula (H8) can be derived from the above formulas (H2) and (H4).

Then, as shown in [Equation 6] below, when the above formulas (H7) and (H8) are substituted into the following formula (H9) and rearranged, the following formula (H10) can be derived.

The gain A and the offset B at each coordinate calculated in this way are stored in the gain / offset storage means 25.

Next, the control device 6 starts an imaging process related to the second light pattern (period 800 μm). However, the imaging process related to the second light pattern is started immediately after the series of imaging processes related to the first light pattern is completed. That is, the calculation process of the first height measurement value and the calculation process of the gain A and the offset B are performed in parallel.

More specifically, the control device 6 switches and controls the liquid crystal grating 4b of the illuminating device 4, sets the position of the grating formed in the liquid crystal grating 4b to the reference position (phase “0 °”), and the pitch thereof. Is set to a period of 800 μm corresponding to the second light pattern.

When the switching setting of the liquid crystal lattice 4b is completed, the control device 6 first causes the illumination control means 22 to emit light from the light source 4a of the illumination device 4, starts irradiation of the second light pattern (period 800 μm), and the camera control means 21. Then, the camera 5 is driven and controlled to image the inspection area portion irradiated with the second light pattern. Here, the image data captured by the camera 5 is transferred to and stored in the image data storage device 24.

Note that the imaging process related to the second light pattern in the present embodiment is performed only once under the second light pattern having the phase “0 °”. That is, in the present embodiment, only one type of image data captured under the second light pattern with the phase “0 °” is acquired for a predetermined inspection area.

Then, the control device 6 (three-dimensional measuring means 26) uses a single image data (luminance value) imaged under the second light pattern, and a gain A and an offset B stored in the gain / offset storage means 25. The phase θ ₂ of the second light pattern at each coordinate is calculated based on this value.

Here, the luminance value V ₂₀ at each coordinate of the one type of image data can be expressed by the following equation (H11).

When the above equation (H11) is solved for the phase θ ₂ , the following equation (H12) can be derived.

Then, using the phase θ ₂ calculated as described above, a second height measurement value at each coordinate is calculated based on the principle of triangulation, and the second height measurement value is used as a second measurement value. Store in the storage means 27. Therefore, the series of processing functions constitute the second measurement value acquisition unit in the present embodiment.

Next, the control device 6 (height data acquisition means 28), based on the first measurement value and the second measurement value relating to each coordinate stored in the measurement value storage means 27, the true height data relating to the coordinate. To get. Such processing functions constitute the height data acquisition means in this embodiment.

Here, the height data acquisition method will be described based on the specific example illustrated in FIG. In this example, “−300 (μm)”, such as “−300 (μm)”, “−200 (μm)”, “−100 (μm)”, etc., by the first light pattern (period of 600 μm). ”To“ +300 (μm) ”can be measured with an accuracy of“ 100 (μm) ”. Note that “+300 (μm)” corresponds to “−300 (μm)” in the next higher stripe order.

On the other hand, depending on the second light pattern (period 800 μm), “−400 (μm)”, “−300 (μm)”, “−200 (μm)”, etc. The height within the range of “+400 (μm)” can be measured with an accuracy of “100 (μm)”. Note that “+400 (μm)” corresponds to “−400 (μm)” in the stripe order one level higher.

If the value obtained as the first measurement value is “+100 (μm)” for a predetermined measured coordinate, the true height data candidate for the measured coordinate is the fringe order [ 1] “+100 (μm)”, fringe order [2] “+700 (μm)”, or fringe order [3] “+1300 (μm)”.

Here, when the value obtained as the second measurement value is, for example, “−100 (μm)” for the same measured coordinate, the true height data of the measured coordinate is the fringe order [ 2], which is a value corresponding to the first measured value of “+700 (μm)”.

And the control apparatus 6 (determination means 30) detects the printing range of the cream solder which became higher than a reference plane based on the true height data in each coordinate of the inspection area obtained in this way, and this range The amount of the printed cream solder is calculated by integrating the height of each part inside.

Subsequently, the control device 6 (determination means 30) compares and determines the data such as the position, area, height or quantity of the cream solder thus obtained with reference data stored in advance, and the comparison result is acceptable. Whether the printed state of the cream solder in the inspection area is good or bad is determined depending on whether or not it is within the range.

While such processing is being performed, the control device 6 drives and controls the

motors

15 and 16 to move the printed circuit board 2 to the next inspection area. Thereafter, the above series of processing is performed in all inspection areas. By being repeatedly performed, the inspection of the entire printed circuit board 2 is completed.

As described above in detail, according to the present embodiment, the three-dimensional measurement is performed based on the image data obtained by irradiating the printed circuit board 2 with the first light pattern of the first period (period 600 μm), and the measurement is performed. A value is acquired as a first measurement value, and a three-dimensional measurement is performed based on image data obtained by irradiating the printed circuit board 2 with a second light pattern having a second period (period of 800 μm). Obtained as the second measurement value. And the height data specified from the 1st measurement value and the 2nd measurement value are acquired as true height data. This makes it possible to increase the measurable height range, which is the merit of using the second light pattern with a long period, and realizes high-precision measurement with high resolution, which is the merit of using the first light pattern with a short period. Both effects can be obtained. As a result, high-resolution measurement can be performed in a wide measurement range, and more accurate measurement can be realized.

Furthermore, in the present embodiment, when performing measurement using the second light pattern by using the values of the gain A and offset B of each coordinate obtained from the image data captured during measurement using the first light pattern, The number of images to be captured under the second light pattern (number of times of imaging) may be smaller than the number of images to be captured under the first light pattern.

Specifically, after irradiating the first light pattern with four different phases, capturing four images under the first light pattern, irradiating the second light pattern with one phase, and one image under the second light pattern. Therefore, the total number of times of imaging is five, and the imaging time is significantly reduced.

In addition, it is not limited to the description content of the said embodiment, For example, you may implement as follows. Of course, other application examples and modification examples not illustrated below are also possible.

(A) In the above-described embodiment, the three-dimensional measuring device is embodied as the substrate inspection device 1 that measures the height of the cream solder printed on the printed circuit board 2, but is not limited thereto, for example, printing on the substrate You may embody in the structure which measures the height of other things, such as the solder bump made and the electronic component mounted on the board | substrate.

(B) In the above embodiment, the grating for converting the light from the light source 4a into a striped light pattern is constituted by the liquid crystal grating 4b, and the phase of the light pattern is shifted by switching this. It has a configuration. For example, the grating member may be transferred by a transfer unit such as a piezo actuator to shift the phase of the light pattern.

(C) In the above-described embodiment, the phase shift method is used to increase the frequency based on the four image data captured under the four first light patterns whose phases are different by 90 ° at the time of measurement using the first light pattern. However, the present invention is not limited to this, and for example, a configuration in which height measurement is performed based on three types of image data captured under three types of first light patterns whose phases are different by 120 °. It is good. That is, the “first predetermined number” that is the number of times of imaging under the first light pattern may be any number that can at least perform height measurement by the phase shift method.

(D) In the above embodiment, a known gain is obtained based on one image data obtained by irradiating a second light pattern having one phase without phase shift at the time of measurement using the second light pattern. The height is measured using the values of A and offset B. Not limited to this, for example, based on two types of image data captured under two types of second light patterns having different phases, height measurement is performed using the values of known gain A and / or offset B. It is good also as a structure to perform.

That is, the “second predetermined number” that is the number of times of imaging under the second light pattern may be a number smaller than at least the “first predetermined number” that is the number of times of imaging under the first light pattern. For example, when the measurement is performed using the first light pattern, if the height measurement is performed based on four types of image data captured under the first light pattern having four phases, the second light At the time of measurement using a pattern, height measurement is performed using known gain A and / or offset B values based on three types of image data captured under a second light pattern having three phases. It is good also as a structure. Even in such a case, the phase θ ₂ of the second light pattern can be obtained based on a relatively simple arithmetic expression as compared with the conventional case, and the processing speed can be increased.

(E) As a configuration for performing height measurement based on two types of image data captured under two types of second light patterns having different phases, for example, two types of second light patterns having phases different by 90 ° are used. There is a configuration in which height measurement is performed based on two types of image data captured below.

According to such a configuration, the phase θ ₂ of the second light pattern at each coordinate includes the known luminance values V ₂₀ and V ₂₁ at each coordinate on the two types of image data acquired by the second light pattern, and the first It can be specified by the known offset B acquired by the light pattern [see the above formula (T8)]. Further, according to such a configuration, the phase θ ₂ can be obtained based on an arithmetic expression using “tan ⁻¹ ”, so that the height can be measured in a range of 360 ° from −180 ° to 180 °. The range can be increased.

Of course, the present invention is not limited to the configuration in which the height measurement is performed based on the two types of image data captured under the two types of second light patterns whose phases are different by 90 °. For example, the two types of second light whose phases are different by 180 °. The height may be measured based on two types of image data captured under the pattern.

(F) In the above-described embodiment, the first measurement is performed (the first measurement value is acquired) using the first light pattern having the shorter cycle (cycle 600 μm), and the second light pattern having the longer cycle (cycle 800 μm). However, the present invention is not limited to this, and the first measurement is performed with the light pattern with the longer cycle, and the first measurement is performed with the light pattern with the shorter cycle. It is good also as a structure which performs 2 measurement.

(G) In the above embodiment, a case where measurement is performed up to a height of 1500 μm by combining a first light pattern with a period of 600 μm and a second light pattern with a period of 800 μm is illustrated. The pattern period, resolution, and measurement range are not limited to this. For example, the period of the first light pattern may be shorter (for example, 400 μm), and the first light pattern may have a configuration in which measurement can be performed in a range in which the stripe order of the first light pattern is 4 or more.

(H) In the above embodiment, the height measurement value is stored in the measurement value storage means 27 as the first measurement value and the second measurement value. The phase measurement values (phases θ ₁ and θ ₂ ) may be stored as two measurement values.

(I) In the above embodiment, the measurement range is expanded by irradiating two types of light patterns having different periods. However, the present invention is not limited to this, and three or more types of light patterns having different periods are irradiated. It is good also as a structure which expands a measurement range.

For example, when irradiating three types of light patterns (periods α, β, and γ), if the light pattern having the period α is regarded as the “first light pattern”, the light pattern having the period β and / or the period γ is represented. It can be seen as a “second light pattern”. However, the measurement using the light pattern with the period α is not limited to the measurement performed first among the three types of measurement, and may be measurement performed second. When the measurement using the light pattern with the period α is the second measurement, the gain A and / or obtained with the light pattern with the period α in the third measurement with the light pattern with the period β or the period γ. Alternatively, the offset B is used.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate inspection apparatus, 2 ... Printed circuit board, 4 ... Illumination apparatus, 4a ... Light source, 4b ... Liquid crystal lattice, 5 ... Camera, 6 ... Control apparatus, 22 ... Illumination control means, 24 ... Image data storage means, 25 ... Gain Offset storage means, 26 ... three-dimensional measurement means, 27 ... measurement value storage means, 28 ... height data acquisition means, A ... gain, B ... offset.

Claims

An irradiation means capable of irradiating the object to be measured with a plurality of light patterns having at least a striped light intensity distribution and different periods;
Phase control means capable of changing the phase of the light pattern irradiated from the irradiation means in a plurality of ways;
Imaging means capable of imaging reflected light from the object to be measured irradiated with the light pattern;
Image processing means capable of performing three-dimensional measurement of the object to be measured by a phase shift method based on image data picked up by the image pickup means;
The image processing means includes
Based on the first predetermined number of image data imaged by irradiating the first light pattern of the first period with the first predetermined number of phases, the measurement of the measured coordinates on the image data is performed, First measurement value acquisition means for acquiring a measurement value as a first measurement value related to the measured coordinates;
Gain offset acquisition means for acquiring a gain and / or an offset value related to the measured coordinates based on the first predetermined number of image data imaged under the first light pattern;
Based on the second predetermined number of image data obtained by irradiating a second predetermined light pattern having a second period different from the first period with a second predetermined number of phases smaller than the first predetermined number of images. , Using the gain and / or offset value acquired by the gain offset acquisition means, performing measurement related to the measured coordinate, and acquiring the measured value as a second measured value related to the measured coordinate. 2 measurement value acquisition means;
A three-dimensional measurement comprising: height data acquisition means capable of acquiring height data specified from the first measurement value and the second measurement value as height data related to the measured coordinates. apparatus.
When the second predetermined number is 1, the second measurement value acquisition unit calculates the phase θ of the second light pattern that satisfies at least the relationship of the following formula (S1) when acquiring the second measurement value. The three-dimensional measuring apparatus according to claim 1, wherein:
V 0 = Asinθ + B (S1)
Where V 0 is the luminance value of the measured coordinate, A is the gain of the measured coordinate, and B is the offset of the measured coordinate.
When the second predetermined number is 2, the second measurement value acquisition unit obtains the second light pattern satisfying the relationship of at least the following formulas (T1) and (T2) when acquiring the second measurement value. The three-dimensional measurement apparatus according to claim 1, wherein the phase θ is calculated.
V 0 = Asinθ + B (T1)
V 1 = Asin (θ + 90 °) + B (T2)
V 0 , V 1 : brightness value of measured coordinate of two kinds of image data, A: gain of measured coordinate, B: offset of measured coordinate.
4. The three-dimensional measuring apparatus according to claim 1, wherein the object to be measured is cream solder printed on a printed circuit board or solder bumps formed on a wafer substrate.