WO2016115696A1

WO2016115696A1 - Electronic device

Info

Publication number: WO2016115696A1
Application number: PCT/CN2015/071222
Authority: WO
Inventors: 刘雨
Original assignee: 华为技术有限公司
Priority date: 2015-01-21
Filing date: 2015-01-21
Publication date: 2016-07-28
Also published as: CN106465553A

Abstract

An electronic device, which relates to the technical field of electronics, and can reduce the impact sustained by a glass cover plate when the glass cover plate is impacted, so as to reduce the damage probability of the glass cover plate. The electronic device comprises: a shell (100), an electronic device body (101) provided inside the shell (100), a glass cover plate (102) provided on the electronic device body (101), wherein the shell (100) and the glass cover plate (102) form a cavity for packaging the electronic device body (101), and a buffer (103) contacting the glass cover plate (102) for reducing the impact sustained by the glass cover plate (102).

Description

Electronic device

Technical field

The present invention relates to the field of electronic technologies, and in particular, to an electronic device.

Background technique

With the development of electronic communication technology, the use of large-screen electronic devices is becoming more and more common. In order to protect the display screen of large-screen electronic devices, the display screens of existing electronic devices can be waterproof, shock-proof and glare-proof. And scratch-resistant, a glass cover is usually provided outside the display of the electronic device. Generally, the glass cover of the electronic device is tempered glass.

In the prior art, the glass cover of the electronic device is directly bonded to the outer casing of the electronic device through a bonding material such as double-sided tape or glue. Since the prior art does not have any protective measures for the glass cover of the electronic device, when the user accidentally causes the electronic device to fall to the ground and is impacted during the use of the electronic device, the glass cover of the electronic device is easy. Broken, causing losses to the user. In the current trend of increasing the size of electronic devices and the thinning of electronic devices, the protection of the glass cover of electronic devices is particularly important.

Summary of the invention

Embodiments of the present invention provide an electronic device capable of reducing an impact of a glass cover plate and reducing a probability of damage to the glass cover plate when the glass cover of the electronic device is impacted.

In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:

In a first aspect, an embodiment of the present invention provides an electronic device, including: a housing, an electronic device body disposed in the housing, and a glass cover disposed on the main body of the electronic device, the housing and the glass cover forming a package for the electronic The cavity of the device body, the electronic device further includes: a buffer in contact with the glass cover plate for reducing the impact of the glass cover plate.

In combination with the first aspect, in a first possible implementation of the first aspect, the buffering The object is disposed on the inner wall of the outer casing and is in contact with the side surface of the glass cover plate for reducing the impact on the side surface of the glass cover plate when the side surface of the glass cover plate is impacted.

In conjunction with the first aspect, in a second possible implementation of the first aspect, the buffer is disposed on the main body of the electronic device and is in contact with the bottom surface of the cover glass for impacting the bottom surface or surface of the cover glass When the bottom surface or the surface of the glass cover is damaged, the bottom surface is a surface of the glass cover close to the main body of the electronic device, and the surface is a surface of the glass cover away from the main body of the electronic device.

In combination with the first aspect, in a third possible implementation manner of the first aspect, the buffer is disposed on the inner wall of the outer casing and the main body of the electronic device, and is in contact with the side surface and the bottom surface of the glass cover, and is used for the glass cover When the side surface, the bottom surface or the surface is impacted, the impact on the side surface, the bottom surface or the surface of the glass cover plate is reduced, wherein the bottom surface is a surface of the glass cover plate close to the main body of the electronic device, and the surface is a surface of the glass cover plate away from the main body of the electronic device. .

In conjunction with the first possible implementation, in a fourth possible implementation of the first aspect, the width of the buffer is in the range of 0.3 mm to 0.5 mm, and the thickness of the buffer is less than or equal to the thickness of the cover glass.

In conjunction with the fourth possible implementation, in a fifth possible implementation of the first aspect, the width of the cushion is 0.3 mm and the thickness of the cushion is equal to the thickness of the cover glass.

In conjunction with the second possible implementation, in a sixth possible implementation of the first aspect, the width of the buffer is in the range of 0.3 mm to 0.5 mm, and the thickness of the buffer is in the range of 0.3 mm to 0.5 mm. .

In conjunction with the sixth possible implementation, in a seventh possible implementation of the first aspect, the buffer has a width of 0.3 mm and the buffer has a thickness of 0.3 mm.

In combination with the first aspect or the first possible implementation of the first aspect to any one of the seventh possible implementation manners, in the eighth possible implementation manner of the first aspect, the buffer is soft rubber or plastic.

An embodiment of the present invention provides an electronic device, including: a housing, an electronic device body disposed in the housing, and a glass cover disposed on the main body of the electronic device, the housing and the glass The glass cover forms a cavity for wrapping the main body of the electronic device, and a buffer in contact with the cover glass for reducing the impact of the cover glass.

Based on the description of the above embodiment, compared with the prior art, since the buffer in contact with the cover glass is provided in the present invention, when the cover glass is subjected to impact, the cushion can absorb a part of the impact by deformation. Reduce the impact of the glass cover, thereby reducing the probability of electronic devices breaking the screen.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.

1 is a schematic structural diagram 1 of an electronic device according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram 2 of an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram 3 of an electronic device according to an embodiment of the present disclosure;

4 is a schematic structural diagram 4 of an electronic device according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram 5 of an electronic device according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram 6 of an electronic device according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram 7 of an electronic device according to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram 8 of an electronic device according to an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram IX of an electronic device according to an embodiment of the present disclosure;

FIG. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present invention; FIG.

FIG. 11 is a schematic structural diagram 11 of an electronic device according to an embodiment of the present disclosure;

FIG. 12 is a schematic structural diagram 12 of an electronic device according to an embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all others obtained by those of ordinary skill in the art without creative efforts The embodiments are all within the scope of protection of the present invention.

In the description of the present invention, it is to be understood that the orientation or positional relationship of the terms "left", "right", "upper", "lower", "horizontal", "vertical", etc. is based on the drawings. The orientation or the positional relationship is merely for the purpose of describing the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore is not to be construed as limiting the invention. .

Embodiment 1

An embodiment of the present invention provides an electronic device 10, which is a cross-sectional structural diagram of the electronic device 10, as shown in FIG.

The outer casing 100, the electronic device main body 101 disposed in the outer casing 100, and the glass cover 102 disposed on the electronic device main body 101, the outer casing 100 and the glass cover 102 form a cavity for wrapping the electronic device main body 101.

The electronic device 10 provided by the embodiment of the present invention further includes a buffer 103 in contact with the glass cover 102. The buffer 103 is used to absorb a part of the impact force by the deformation of the buffer 103 when the glass cover 102 is impacted. The impact of the glass cover 102 is reduced, thereby reducing the probability of the electronic device breaking the screen and reducing the loss of the user.

Specifically, the buffer 103 is disposed on the inner wall of the outer casing 100 (as shown in A of FIG. 2), and is in contact with the side surface of the cover glass 102 (shown as a in FIG. 2) for the side of the glass cover 102. When subjected to an impact, a part of the impact is absorbed by the deformation of the cushion 103, and the impact on the side surface of the cover glass 102 is reduced.

Optionally, the width of the buffer 103 is in the range of 0.3 mm to 0.5 mm, that is, the horizontal distance between the inner wall of the outer casing 100 and the side of the cover glass 102 is in the range of 0.3 mm to 0.5 mm, and the thickness of the buffer 103 is Less than or equal to the thickness of the cover glass 102, that is, the vertical thickness of the cushion 103 is less than or equal to the thickness of the cover glass 102.

Preferably, the width of the buffer 103 is 0.3 mm, and the thickness of the cushion 103 is equal to the thickness of the cover glass 102.

Preferably, the buffer 103 can be placed along the side of the cover glass 102 to enclose the cover glass 102, and its front view is as shown in FIG. Since the cushion 103 is disposed on the side of the cover glass 102, cushioning can be seen from its front view. Object 103.

Further, the buffer 103 may be disposed along the side of the glass cover 102 in various forms, for example, a buffer may be provided to surround the glass cover 102 at intervals, or only the left and right sides of the cover glass 102 may be provided with a buffer. 103, or the buffer 103 is provided only on the front and rear sides of the cover glass 102, which is not limited in the present invention.

It should be noted that, in an electronic device provided by the embodiment of the present invention, the thickness of the buffer 103 may be smaller than the thickness of the glass cover 102, as shown in FIG. 4, when the thickness of the buffer 103 is smaller than the cover glass 102. The thickness of the buffer and the buffer structure are located above the side of the glass cover 103, as shown in FIG. 5, when the thickness of the buffer 103 is smaller than the thickness of the cover glass 102 and the buffer is located below the side of the cover glass 103. FIG. 6 is a schematic cross-sectional view showing the structure of the buffer member 103 when the thickness of the buffer 103 is smaller than the thickness of the cover glass 102 and the buffer is located at the side of the side surface of the cover glass 103. The invention is not limited thereto.

The cushion 103 is soft rubber or plastic. Preferably, the buffer 103 is a soft gel.

Wherein, the buffer 103 formed on the side of the glass cover 102 can be formed by a process such as oil pressure molding, in-mold insert molding, liquid silicone injection molding, dispensing, and the like.

It should be added that after the buffer 103 is formed on the side of the cover glass 102 by the above process, the cover glass 102 can be adhered to the outer casing 100 through the buffer by the dispensing process to fix the cover glass 102. Specifically, the glass cover 102 may be fixed by using a dispensing process between the buffer 103 on the side of the cover glass 102 and the outer casing 100, or on the bottom surface of the buffer 103 on the side of the cover glass 102 and the cover glass 102. The dispensing process secures the cover glass 102. The narrow bezel design of the electronic device can be achieved by fixing the glass cover 102 by a dispensing process.

An embodiment of the present invention provides an electronic device, including: a housing, an electronic device body disposed in the housing, and a glass cover disposed on the main body of the electronic device, the housing and the glass cover forming a cavity for wrapping the main body of the electronic device a body, and a buffer in contact with the cover glass for reducing the impact of the cover glass.

Based on the description of the above embodiment, compared with the prior art, since the buffer in contact with the cover glass is provided in the present invention, when the cover glass is subjected to impact, The buffer can absorb a part of the impact by deformation, reducing the impact of the glass cover, thereby reducing the probability of the electronic device breaking the screen.

Embodiment 2

Another embodiment of the present invention further provides an electronic device 20, which is a cross-sectional structural diagram of the electronic device 20, as shown in FIG.

An electronic device 20 according to an embodiment of the present invention further includes a buffer 203 in contact with the cover glass 102. The buffer 203 is used to absorb a part of the deformation of the buffer 203 when the cover glass 102 is impacted. The impact reduces the impact on the glass cover 102, thereby reducing the probability of the electronic device breaking the screen and reducing the user's loss.

Specifically, the buffer 203 is disposed on the electronic device main body 101 and is in contact with the bottom surface of the glass cover 102 (shown as b0 in FIG. 8) for the bottom surface or surface of the glass cover 102 (as shown in FIG. 8). When the impact is b1, the deformation of the buffer 203 absorbs a part of the impact, and the impact of the bottom surface or the surface of the glass cover 102 is reduced. The bottom surface is a surface of the glass cover 102 close to the surface of the electronic device body 101. The glass cover 102 is away from one side of the electronic device body 101.

Optionally, the width of the buffer 203 is in the range of 0.3 mm to 0.5 mm, that is, the horizontal length of the buffer 203 is in the range of 0.3 mm to 0.5 mm, and the thickness of the buffer 203 is in the range of 0.3 mm to 0.5 mm. That is, the vertical height of the buffer 203 is in the range of 0.3 mm to 0.5 mm.

Preferably, the buffer 203 has a width of 0.3 mm and the buffer 203 has a thickness of 0.3 mm.

Preferably, the buffer 203 may be disposed along the bottom surface of the cover glass 102, and the bottom surface of the cover glass 102 is adhered to the electronic device main body 101 through the buffer 203. Its front view is shown in Figure 9. Since the cushion 203 is disposed on the bottom surface of the cover glass 102, the buffer 203 is not visible in the front view.

The cushion 203 is soft rubber or plastic. Preferably, the buffer 203 is a soft gel.

Wherein, the buffer 203 formed on the side of the glass cover 102 can be formed by a process such as oil pressure molding, in-mold insert molding, liquid silicone injection molding, dispensing, and the like.

It should be noted that after the buffer 203 is formed on the bottom surface of the cover glass 102 by the above process, the cover glass 102 can be fixed by the buffer 203 by a dispensing process. Specifically, the glass cover 102 may be fixed by a dispensing process between the side of the cover glass 102 and the side of the bottom buffer 203 and the outer casing 101, or may be passed through the dispensing process under the buffer 203 on the bottom surface of the cover glass 102. It is adhered to the main body of the electronic device to fix the glass cover 102. The narrow bezel design of the electronic device can be achieved by fixing the glass cover 102 by a dispensing process.

It should be noted that, in an electronic device provided by the embodiment of the present invention, the position of the buffer 203 may also be a position as shown in FIG. 10, which is not limited by the present invention.

It should be added that the right side of the left buffer 203 and the left side of the right buffer 203 are not in contact with the display screen to prevent the impact of the buffer 203 from causing damage to the display screen. Wherein, the display screen is optically bonded to the glass cover 102.

Embodiment 3

Another embodiment of the present invention further provides an electronic device 30. As shown in FIG. 11, the cross-sectional structure of the electronic device 30 includes:

An electronic device 30 according to an embodiment of the present invention further includes a cover glass 102 The buffer 303 is contacted, and the buffer 303 is used to absorb a part of the impact by the deformation of the buffer 303 when the glass cover 102 is impacted, thereby reducing the impact of the glass cover 102, thereby reducing the breakage of the electronic device. The probability of reducing the user's loss.

Specifically, the buffer 303 is disposed on the inner wall of the outer casing 100 and the electronic device main body 101, and is in contact with the side surface and the bottom surface of the glass cover 102 for buffering when the side surface, the bottom surface or the surface of the glass cover 102 is impacted. The deformation of the object 303 absorbs a part of the impact, and reduces the impact on the side surface, the bottom surface or the surface of the glass cover 102. The bottom surface is a surface of the glass cover 102 close to the electronic device body 101, and the surface is the glass cover 102 away from the electronic device. One face of the body 101.

Optionally, the width of the buffer contacting the inner wall of the outer casing 100 is in the range of 0.3 mm to 0.5 mm, that is, the distance between the outer casing 100 and the cover glass 102 is in the range of 0.3 mm to 0.5 mm, and the buffer is The width is equal to the distance between the outer casing 100 and the cover glass 102.

Preferably, the buffer 303 can be designed along the side and bottom surfaces of the cover glass 102 to enclose the cover glass 102. The front view is as shown in FIG. In this case, only the buffer on the side of the cover glass 102 can be seen in the front view, and the cushion on the bottom surface of the cover glass 102 is not visible.

The cushion 303 is soft rubber or plastic. Preferably, the buffer 303 is a soft gel.

Wherein, the buffer 303 formed on the side of the glass cover 102 can be formed by a process such as oil pressure molding, in-mold insert molding, liquid silicone injection molding, dispensing, and the like.

It should be noted that after the buffer 303 is formed on the side and the bottom surface of the cover glass 102 by the above process, the cover glass 102 can be adhered to the outer casing 100 or the electronic device main body 101 through the buffer 303 by a dispensing process. The glass cover 102 is fixed. Specifically, the glass cover 102 may be fixed by a dispensing process between the buffer 303 on the side of the cover glass 102 and the outer casing 101, or may be fixed by a dispensing process under the buffer 303 on the bottom surface of the cover glass 102. Cover plate 102. The narrow bezel design of the electronic device can be achieved by fixing the glass cover 102 by a dispensing process.

It should be added that the right side of the left side buffer 303 and the left side of the right side buffer 303 are not in contact with the display screen to prevent the impact of the buffer 203 from being affected by the display screen. Into damage. Wherein, the display screen is optically bonded to the glass cover 102.

The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It should be covered by the scope of the present invention. Therefore, the scope of the invention should be determined by the scope of the claims.

Claims

An electronic device comprising: a housing, an electronic device body disposed in the housing, and a glass cover disposed on the main body of the electronic device, the housing and the cover glass forming a package for wrapping The cavity of the main body of the electronic device, wherein the electronic device further comprises:

A buffer in contact with the cover glass for reducing the impact of the cover glass.
The electronic device according to claim 1, wherein

The buffer is disposed on the inner wall of the outer casing and is in contact with the side surface of the glass cover plate for reducing the impact on the side surface of the glass cover plate when the side surface of the glass cover plate is impacted.
The electronic device according to claim 1, wherein

The buffer is disposed on the main body of the electronic device and is in contact with the bottom surface of the glass cover plate for reducing the bottom surface of the glass cover or when the bottom surface or surface of the glass cover is impacted The surface is subjected to an impact, wherein the bottom surface is a surface of the glass cover adjacent to the main body of the electronic device, and the surface is a surface of the glass cover away from the main body of the electronic device.
The electronic device according to claim 1, wherein

The buffer is disposed on the inner wall of the outer casing and the main body of the electronic device, and is in contact with the side surface and the bottom surface of the glass cover plate, and is used for reducing the glass when the side surface, the bottom surface or the surface of the glass cover plate is impacted. The side surface, the bottom surface or the surface of the cover plate is subjected to an impact, wherein the bottom surface is a surface of the glass cover plate adjacent to the main body of the electronic device, and the surface is a surface of the glass cover plate away from the main body of the electronic device surface.
The electronic device according to claim 2, wherein

The width of the buffer is in the range of 0.3 mm to 0.5 mm, and the thickness of the buffer is less than or equal to the thickness of the cover glass.
The electronic device according to claim 5, wherein

The buffer has a width of 0.3 mm and the thickness of the buffer is equal to the thickness of the cover glass.
The electronic device according to claim 3, wherein

The width of the buffer is in the range of 0.3 mm to 0.5 mm, and the thickness of the buffer is in the range of 0.3 mm to 0.5 mm.
The electronic device according to claim 7, wherein

The buffer has a width of 0.3 mm and the buffer has a thickness of 0.3 mm.
The electronic device according to any one of claims 1-8, wherein

The buffer is soft rubber or plastic.