WO2014030289A1

WO2014030289A1 - Lamp and lighting device

Info

Publication number: WO2014030289A1
Application number: PCT/JP2013/004297
Authority: WO
Inventors: 康一中村; 高橋　健治; 雅人松本
Original assignee: パナソニック株式会社
Priority date: 2012-08-21
Filing date: 2013-07-11
Publication date: 2014-02-27
Also published as: CN203615157U; JPWO2014030289A1; JP2014139950A; JP5658394B2

Abstract

A lamp (1) is equipped with: a base (a metallic base (30)); a substrate (11) that is arranged on the base; multiple LED elements (12) that are mounted on the substrate (11); a light-permeable cover (20) that covers the multiple LED elements (12) and is fixed to the base; and a TIM material (40) that joins the base to the substrate (11).

Description

Lamp and lighting device

The present invention relates to a lamp and a lighting device, for example, a straight tube lamp having a light emitting element such as a light emitting diode (LED), and a lighting device including the same.

LED is expected to be a new light source in various lamps such as fluorescent lamps and incandescent lamps, which are conventionally known because of its high efficiency and long life, and research and development of lamps using LED (LED lamps) is being promoted. ing.

As an LED lamp, it has a bulb-type LED lamp (bulb-shaped LED lamp) that replaces an incandescent bulb using a light bulb shaped fluorescent tube or filament coil in a glass bulb, or has an electrode coil at both ends. There are straight tube type LED lamps (straight tube type LED lamps) and the like that can replace straight tube type fluorescent lamps. For example, Patent Document 1 discloses a conventional bulb-type LED lamp. Patent Document 2 discloses a conventional straight tube LED lamp.

In the LED lamp, an LED module in which a plurality of LEDs are mounted on a substrate is used. In the LED, heat is generated from the LED itself by light emission, thereby increasing the temperature of the LED and reducing the light output of the LED and shortening the lifetime. For this reason, the LED lamp is provided with a base that functions as a heat sink, and the LED module is placed on the base.

JP 2006-313717 A JP 2009-043447 A

For example, in a straight tube type LED lamp, a method of arranging a base made of a long metal on a long cylindrical glass tube is conceivable. In this case, the LED module is placed on the base. Alternatively, as a straight tube type LED lamp, a long casing may be divided into two along its longitudinal direction. In this case, using a long base having a substantially semicircular cross section whose outer surface is exposed to the outside of the lamp, the LED module is placed on the base and is long so as to cover the LED module. A translucent cover having a substantially semicircular cross section is fixed to the base.

In such a straight tube type LED lamp, the LED module is fixed to a long base. For example, a method of fixing the LED module to the base by inserting the substrate of the LED module through a rail (concave groove) provided on the base is conceivable (slide method). Moreover, the method of fixing an LED module to a base by latching the board | substrate of an LED module to the latching claw provided in the base is also considered (claw system).

However, there is a problem that workability is poor in the fixing method by the slide method or the claw method. In particular, in the fixing method using the slide method, since the LED module is inserted from the end of the long base, there is a problem that a large work space must be secured.

The present invention has been made to solve the above-described problems, and it is an object of the present invention to provide a lamp and a lighting device that simplify the mounting work between the base and the LED module and have excellent heat dissipation.

In order to achieve the above object, one aspect of a lamp according to the present invention includes a base, a substrate disposed on the base, a plurality of light emitting elements mounted on the substrate, and the plurality of light emitting elements. The light-emitting element includes a translucent cover fixed to the base, and a TIM (Thermal Interface Material) material that joins the base and the substrate.

In one aspect of the lamp according to the present invention, the substrate includes a metal base, an insulating layer formed on the metal base, and a metal wiring formed on the insulating layer. It is good.

Further, in one aspect of the lamp according to the present invention, the insulating layer may be made of a polyimide resin.

Further, in one aspect of the lamp according to the present invention, the insulating layer may have a thickness equal to or less than a thickness of the metal base material.

Further, in one aspect of the lamp according to the present invention, the base may have a wall portion that contacts the side surface of the substrate.

Further, in one aspect of the lamp according to the present invention, a long cylindrical casing may be configured by the base and the translucent cover.

Further, in one aspect of the lamp according to the present invention, the base may be made of metal.

Further, an aspect of the lighting device according to the present invention includes any one of the lamps described above.

According to the present invention, it is possible to simplify the work of attaching the substrate on which the light emitting element is mounted to the base, and to efficiently dissipate the heat generated in the light emitting element.

FIG. 1 is an overall perspective view and a partially enlarged view of a lamp according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view of the lamp according to Embodiment 1 of the present invention. 3A is a perspective view of the LED module in the lamp according to Embodiment 1 of the present invention, and FIG. 3B is a cross-sectional view of the LED element in the LED module. 4A is a cross-sectional view (a cross-sectional view taken along a plane perpendicular to the tube axis) of the lamp according to Embodiment 1 of the present invention, and FIG. It is a partially expanded sectional view which shows the detailed structure of the junction part of a LED module and a metal base. FIG. 5 is a cross-sectional view (a cross-sectional view taken along a plane perpendicular to the tube axis) of a lamp according to a modification of the first embodiment of the present invention. FIG. 6 is a diagram for explaining a method of joining the LED module and the metal base in the lamp according to Embodiment 1 of the present invention. FIG. 7A is a cross-sectional view (a cross-sectional view taken along a plane perpendicular to the tube axis) of the lamp according to Embodiment 2 of the present invention, and FIG. It is a partially expanded sectional view which shows the detailed structure of the junction part of a LED module and a metal base. FIG. 8 is a schematic perspective view of a lighting apparatus according to Embodiment 3 of the present invention.

Hereinafter, a lamp and an illumination device according to an embodiment of the present invention will be described with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of the components shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member. In the present embodiment, the tube axis direction (longitudinal direction) of the lamp is the X-axis direction, one direction (short direction) perpendicular to the X-axis is the Y-axis direction, and is orthogonal to the X-axis and the Y-axis. Let the direction be the Z-axis direction.

(Embodiment 1)
First, the lamp 1 according to Embodiment 1 of the present invention will be described. The lamp 1 according to the present embodiment is a straight tube LED lamp that replaces a conventional straight tube fluorescent lamp. In addition, the lamp 1 according to the present embodiment has a split structure in which a straight tubular casing is separated into a light transmitting member and a heat sink (base).

[Entire configuration of the lamp]
The overall configuration of the lamp 1 according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of a lamp according to Embodiment 1 of the present invention, showing an external view of the entire lamp and an enlarged view of a part of the lamp. FIG. 2 is a cross-sectional view (a cross-sectional view in the XZ plane passing through the tube axis) of the lamp according to Embodiment 1 of the present invention.

As shown in FIGS. 1 and 2, the lamp 1 according to the present embodiment is a straight tube LED lamp which is an illumination light source that replaces a conventional straight tube fluorescent lamp. The lamp 1 includes an LED module 10 that emits predetermined light, a long translucent cover 20 that covers the LED module 10, a long metal base 30 on which the LED module 10 is placed, and an LED module. 10 and a TIM (Thermal Interface Material) material 40 that joins the metal base 30 to each other.

In the present embodiment, the translucent cover 20 and the metal base 30 constitute a long cylindrical casing (envelope). That is, by connecting the translucent cover 20 and the metal base 30, a tubular casing having openings at both ends is configured as the outer member (insertion tube). In the present embodiment, the casing when the translucent cover 20 and the metal base 30 are joined has a circular outline in a cross section perpendicular to the longitudinal direction. A pair of first cap 50 and second cap 60 are provided at both ends in the longitudinal direction (X-axis direction) of the casing, and the LED module 10 and the like are housed in the casing. The lamp 1 is supported by the lighting fixture by attaching the first base 50 and the second base 60 to the socket of the lighting fixture.

Although not shown, a connector for passing power supplied to the LED module 10 and a lighting circuit for causing the LED module to emit light are provided in the housing. Further, in the lamp 1 according to the present embodiment, a one-side power feeding method that feeds power to the LED module 10 only from the first base 50 is adopted. That is, the lamp 1 receives power from the lighting fixture or the like only from the first base 50.

Hereinafter, each component of the lamp 1 will be described in detail.

[Translucent cover]
The translucent cover 20 is a housing having translucency. As shown in FIG.1 and FIG.2, the translucent cover 20 is comprised so that the metal base 30 with which the LED module 10 is arrange | positioned may be covered. The translucent cover 20 in the present embodiment is a translucent substantially semi-cylindrical translucent member, and the cross-sectional shape on a plane (YZ plane) perpendicular to the tube axis (X axis) is substantially semicircular It is. The translucent cover 20 is fixed to the metal base by engaging the edges on both sides in the circumferential direction with the step portions of the metal base 30.

The translucent cover 20 is made of a translucent material, and can be formed using a resin material such as acrylic or polycarbonate, for example. In the present embodiment, the translucent cover 20 is a resin valve, but the translucent cover 20 may be formed using a translucent material other than resin.

In addition, a light diffusion part may be formed in the translucent cover 20, and the translucent cover 20 may be provided with the light diffusion function for diffusing the light from the LED module 10. Thereby, the light emitted from the LED module 10 can be diffused when passing through the translucent cover 20. Examples of the light diffusion portion include a light diffusion sheet or a light diffusion film formed on the inner surface or the outer surface of the translucent cover 20. Specifically, a milky white light diffusing film can be formed by attaching a resin or white pigment containing a light diffusing material (fine particles) such as silica or calcium carbonate to the inner or outer surface of the translucent cover 20. it can. As other light diffusion parts, there are a lens structure provided inside or outside the translucent cover 20, or a concave or convex part formed on the translucent cover 20. For example, a light diffusing function can be given to the translucent cover 20 by printing a dot pattern on the inner surface or the outer surface of the translucent cover 20 or by processing a part of the translucent cover 20. . Alternatively, the light-transmitting cover 20 itself can be molded using a resin material or the like in which a light diffusing material is dispersed, so that the light-transmitting cover 20 can have a light diffusing function (light diffusing portion).

[Metal base]
As shown in FIGS. 1 and 2, the metal base 30 is a long member and is covered with a translucent cover 20. A portion of the metal base 30 that is not covered with the translucent cover 20 is exposed to the outside. That is, the metal base 30 constitutes the outline of the lamp 1 together with the translucent cover 20.

The metal base 30 is an example of a base, and functions as a heat sink that dissipates heat generated by the LED module 10. Accordingly, a part of the metal base 30 is exposed to the outside of the lamp. The metal base 30 functions as a mounting table for mounting and fixing the LED module 10.

Specifically, the inner part of the metal base 30 on the side of the translucent cover 20 is a plate-like placement portion 31 having a placement surface on which the LED module 10 is placed. In this Embodiment, the mounting surface of the mounting part 31 of the metal base 30 is a long rectangular plane.

Further, a plurality of heat radiating fins 32 are provided as heat radiating portions on the outer portion which is the back surface of the mounting surface of the metal base 30. The heat radiating fins 32 are exposed to the outside of the lamp and are provided so as to protrude outward from the mounting portion 31. A plurality of the radiation fins 32 are formed along the longitudinal direction of the metal base 30.

Furthermore, step portions are provided at both ends in the width direction of the metal base 30 so that the edges on both sides in the circumferential direction of the translucent cover 20 are engaged. The translucent cover 20 and the metal base 30 are formed by sliding and inserting the translucent cover 20 into the metal base 30 along the longitudinal direction, or from above the metal base 30. It can be engaged by fitting.

The metal base 30 is preferably made of a high thermal conductivity material such as metal, and is an extruded material made of aluminum in the present embodiment. Instead of the metal base 30, a resin base made of a resin having the same shape as the metal base 30 or a base made of a material other than metal or resin may be used. In this case, it is preferable to use a material having a high thermal conductivity. For example, when using a resin, a resin material having a high thermal conductivity or a resin material containing a high thermal conductivity material such as metal particles is used. It is preferable to use it.

Further, the length of the metal base 30 is longer than the length of the translucent cover 20. This is because the resin-made translucent cover 20 has a larger coefficient of thermal expansion than that of the metal base 30, and the length of the translucent cover 20 is different from that of the metal base 30. It is shortened by minutes.

In addition, you may adhere | attach the translucent cover 20 and the metal base 30 with an adhesive agent as needed. Moreover, a rail groove is provided in the longitudinal direction of the metal base 30 without using an adhesive, and the rail groove is provided along the longitudinal direction of the translucent cover 20 or the end of the translucent cover 20 in the short direction. The translucent cover 20 and the metal base 30 may be engaged with each other by inserting the protrusion provided.

[LED module]
The LED module 10 is placed on the metal base 30 via the TIM material 40. In addition, the number of the LED modules 10 mounted on the metal base 30 may be either one or a plurality. When a plurality of LED modules 10 are used, the plurality of LED modules 10 are arranged in a line along the longitudinal direction of the metal base 30, for example.

Here, the detailed configuration of the LED module 10 will be described with reference to FIG. 3A is a perspective view of the LED module in the lamp according to Embodiment 1 of the present invention, and FIG. 3B is a cross-sectional view of the LED element in the LED module.

As shown in FIG. 3A, the LED module 10 is a surface mount (SMD) type light emitting module, and includes a substrate 11 and a plurality of LED elements 12 mounted on the substrate 11. Prepare.

The substrate 11 is a mounting substrate for mounting the LED element 12. The substrate 11 in the present embodiment is a metal base substrate, and includes a metal base 11a, an insulating layer 11b formed on the metal base 11a, and a metal wiring 11c patterned on the insulating layer 11b. And a resist 11d formed on a portion of the insulating layer 11b where the metal wiring 11c is not formed. In addition, as a shape of the board | substrate 11, the rectangular thing which makes long shape in the longitudinal direction of the metal base 30, for example can be used.

The metal substrate 11a is a base substrate. As a material of the metal substrate 11a, for example, a metal having high thermal conductivity such as copper or aluminum can be used.

The insulating layer 11b is formed between the metal base 11a and the metal wiring 11c, and insulates the metal base 11a and the metal wiring 11c. As a material of the insulating layer 11b, for example, a polyimide resin can be used.

The metal wiring 11c is a conductive metal thin film for electrically connecting adjacent LED elements 12, and in the present embodiment, the metal wiring 11c is intermittently linear along the longitudinal direction of the substrate 11 on the insulating layer 11b. Is formed. As a material of the metal wiring 11c, for example, a metal having a high thermal conductivity and a low electrical resistivity, such as copper, aluminum, or silver, can be used.

The resist 11d is a second insulating layer formed on the surface of the substrate 11, and is formed so as to expose part of the electrode terminal 13 and the metal wiring 11c. In the metal wiring 11c, at least a conductive portion with the LED element 12 is exposed.

An electrode terminal 13 is provided at each of both ends in the longitudinal direction of the substrate 11. The electrode terminal 13 is an external connection terminal that receives DC power for causing the LED element 12 to emit light from the outside of the LED module 10.

The LED element 12 is an example of a light emitting element, and is mounted on the surface of the substrate 11. In the present embodiment, as shown in FIG. 3A, a plurality of LED elements 12 are arranged in a line along the longitudinal direction of the substrate 11.

Each LED element 12 is a so-called SMD type light emitting element in which an LED chip and a phosphor are packaged, and is housed in a package (container) 12a and a package 12a as shown in FIG. LED chip 12b, and a sealing member 12c that seals the LED chip 12b. The LED element 12 in the present embodiment is a white LED element that emits white light.

The package 12a is molded from white resin or the like, and includes an inverted frustoconical concave portion (cavity). The inner side surface of the recess is an inclined surface, and is configured to reflect light from the LED chip 12b upward.

The LED chip 12b is an example of a semiconductor light emitting element, and is mounted in a recess of the package 12a. The LED chip 12b is a bare chip that emits monochromatic visible light, and is die-bonded to the bottom surface of the recess of the package 12a by a die attach material (die bond material). For example, a blue LED chip that emits blue light when energized can be used as the LED chip 12b.

The sealing member 12c is a phosphor-containing resin including a phosphor that is a light wavelength converter, and converts the wavelength of light from the LED chip 12b to a predetermined wavelength (color conversion) and seals the LED chip 12b. Thus, the LED chip 12b is protected. The sealing member 12c is filled in the recess of the package 12a, and is sealed up to the opening surface of the recess. As the sealing member 12c, for example, when the LED chip 12b is a blue LED, a phosphor-containing resin in which YAG (yttrium, aluminum, garnet) -based yellow phosphor particles are dispersed in a silicone resin in order to obtain white light. Can be used. Accordingly, since the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light, white light is emitted from the sealing member 12c by the excited yellow light and the blue light of the blue LED chip. Is done. The sealing member 12c may also contain a light diffusing material such as silica.

In this way, the LED element 12 is configured. Although not shown, the LED element 12 has two external connection terminals of a positive electrode and a negative electrode, and these external connection terminals and the metal wiring 11c are electrically connected. In addition, in this Embodiment, although the LED element 12 is mounted in the shape of a line, it is not restricted to this. Moreover, in this Embodiment, although the several LED element 12 on the board | substrate 11 is connected in series by the metal wiring 11c, it is good also as the connection which combined the parallel connection or the serial connection and the parallel connection.

[TIM material]
As shown in FIGS. 1 and 2, the TIM material 40 is disposed between the LED module 10 and the metal base 30. The TIM material 40 is disposed so that one surface is in close contact with the back surface of the substrate 11 of the LED module 10. More specifically, one surface of the TIM material 40 is in close contact with the metal base 11 a of the substrate 11. The other surface of the TIM material 40 is in close contact with the mounting surface of the mounting portion 31 of the metal base 30.

TIM material 40 is a highly heat conductive sheet having flexibility. Moreover, the TIM material 40 in this Embodiment has adhesiveness (adhesiveness), is comprised by the adhesive tape shape, and is adhere | attached on the metal base 30 while it adheres to the LED module 10. FIG. That is, the TIM material 40 also functions as an adhesive that bonds the LED module 10 (substrate 11) and the metal base 30. The LED module 10 (substrate 11) and the metal base 30 are attached by the TIM material 40. Are combined.

Also, since the TIM material 40 has flexibility, it deforms so as to follow the thermal deformation of the substrate 11 and the metal base 30 of the LED module 10. For example, even if the metal base 30 is warped due to thermal expansion, the metal base 30 is deformed following the warped shape of the metal base 30.

Further, in order to improve the thermal conductivity, a thermal conductive filler may be added to the TIM material 40. In this case, the TIM material 40 having a thermal conductivity of 0.8 W / m · K or more can be obtained. In the present embodiment, in order to place importance on the adhesiveness, the TIM material 40 does not contain a thermally conductive filler, and the TIM material 40 having a thermal conductivity of 0.15 W / m · K is used. As the TIM material 40, one having a thermal conductivity of 0.1 to 1.2 W / m · K can be used.

[First cap]
The first base 50 is a power supply base for supplying power to the LED elements 12 of the LED module 10. The first base 50 is also a power receiving base that receives power for turning on the LED element 12 of the LED module 10 from the outside of the lamp (commercial power source or the like).

As shown in FIG. 1, the first base 50 is provided in a cap shape so as to cover one side in the longitudinal direction of a long casing constituted by the translucent cover 20 and the metal base 30. The first base 50 in the present embodiment includes a base body 51 made of a synthetic resin such as polybutylene terephthalate (PBT) and a pair of power supply pins 52 made of a metal material such as brass.

The base body 51 has a substantially bottomed cylindrical shape. The pair of power supply pins 52 are configured to protrude outward from the bottom of the base body 51. The power supply pin 52 is a pin that supplies power to turn on the LED element 12 and functions as a power reception pin that receives predetermined power from an external device such as a lighting fixture. For example, by attaching the first base 50 to the socket of the lighting fixture, the pair of power supply pins 52 is in a state of receiving power from the power supply device built in the lighting fixture. For example, DC power is supplied to the lighting circuit in the lamp via the pair of power supply pins 52. The lighting circuit rectifies input DC power and outputs a desired voltage for energizing the LED element 12.

It should be noted that the base body 51 may be a split-type base that can be disassembled into two parts (up and down) (in the XY plane), or a non-split base that is not divided.

[Second base]
The second base 60 is a non-power feeding base. That is, the 2nd nozzle | cap | die 60 functions as an attaching part for attaching the lamp | ramp 1 to a lighting fixture.

As shown in FIG. 1, the second base 60 is provided in a cap shape so as to cover one side in the longitudinal direction of a long casing constituted by the translucent cover 20 and the metal base 30. The second base 60 in the present embodiment includes a base body 61 made of a synthetic resin such as PBT, and a single non-power-feeding pin 62 made of a metal material such as brass.

The base body 61 has a substantially bottomed cylindrical shape. The non-feeding pin 62 is configured to protrude outward from the bottom of the base body 61.

Note that the second cap 60 may have a ground function. In this case, the non-feeding pin 62 functions as a ground pin, and the non-feeding pin 62 and the metal base 30 are grounded, whereby the metal base 30 is grounded via the lighting fixture. The base body 61 may be a split-type base configured to be disassembled in two upper and lower parts (on the XY plane), or may be a non-partitioned base that is not divided.

[Junction between LED module and metal base]
Next, a detailed configuration of a joint portion between the LED module 10 and the metal base 30 in the lamp 1 according to the present embodiment will be described with reference to FIG. 4A is a cross-sectional view (a cross-sectional view taken along a plane perpendicular to the tube axis) of the lamp according to Embodiment 1 of the present invention, and FIG. It is a partially expanded sectional view which shows the detailed structure of the junction part of a LED module and a metal base. In FIG. 4A, the constituent members of the substrate 11 are not shown.

4 (a) and 4 (b), the metal base 30 and the substrate 11 are joined by a TIM material 40. The substrate 11 in the present embodiment is a copper base substrate, and includes a metal base material 11a made of a copper substrate, an insulating layer 11b made of polyimide (thermal conductivity: 0.3 W / m · K), and a copper wiring. The metal wiring 11c and the resist 11d, which is a white resist.

In the present embodiment, the thickness d _MET of the metal base 11a (copper substrate) is 50 μm, the thickness d _INS of the insulating layer 11b (polyimide) is 20 μm, and the thickness d _{LIN of the} metal wiring 11c (copper wiring). Was 35 μm, and the thickness d _RES of the resist 11d (white resist) was 55 μm.

The thickness of the insulating layer 11b can be 10 μm. In this way, by using polyimide as the material of the insulating layer 11b, even if the thickness d _INS of the insulating layer 11b is equal to or less than the thickness d _MET of the metal base 11a (d _INS ≦ d _MET ), the insulation of the substrate 11 is achieved. A breakdown voltage can be secured. In the present embodiment, the areas of the metal substrate 11a and the insulating layer 11b are the same.

The substrate 11 thus configured has a thermal resistance (when the thickness of the insulating layer is 10 μm) of 0.7 k · m ² / K. Thereby, the heat generated in the LED element 12 can be efficiently conducted to the metal base 30 via the substrate 11.

As described above, the thickness of the entire substrate 11 can be reduced by using polyimide as the insulating layer 11b. For example, the thickness of the insulating layer 11b can be changed from 80 μm to 20 μm by changing the material of the insulating layer 11b from epoxy to polyimide. Since the thermal conductivity of the substrate 11 is dominated by the thermal conductivity of the insulating layer 11b, the thermal resistance of the substrate 11 can be reduced by reducing the thickness of the insulating layer 11b. Thereby, the heat generated in the LED element 12 can be efficiently radiated to the metal base 30.

Also, the thickness of the entire substrate 11 can be reduced by reducing the thickness of the insulating layer 11b. Thus, the substrate 11 itself can be configured to have flexibility. That is, a metal base substrate having flexibility can be realized.

In this case, as shown in FIG. 5, the lamp 1A can be configured by using a substrate 11A which is a flexible metal base substrate. FIG. 5 is a cross-sectional view of a lamp according to a modification of the first embodiment of the present invention.

As shown in FIG. 5, in the lamp 1A of the present modification example, a metal base 30A having a mounting portion 31A having a thick central portion and a triangular cross section is used so as to follow the surface shape of the metal base 30A. The TIM material 40 and the substrate 11A are arranged so as to be bent toward the translucent cover 20. In this case, the LED element 12 is mounted on the inclined substrate 11A. Thereby, a lamp in which the LED elements 12 are arranged three-dimensionally can be realized. As a result, a lamp having a wider light distribution angle than the lamp having the configuration shown in FIG. 4 can be obtained.

In addition, when the insulating layer 11b is an epoxy, since the epoxy is a material that is easily cracked, if the substrate 11 is bent, the insulating layer 11b is cracked and it is impossible to ensure the withstand voltage. That is, the substrate 11 using the insulating layer 11b as an epoxy cannot be fixed to the metal base 30A with the substrate 11 bent as shown in FIG.

Next, a method for joining the LED module and the metal base will be described with reference to FIG. FIG. 6 is a diagram for explaining a method of joining the LED module and the metal base in the lamp according to Embodiment 1 of the present invention.

First, the sheet-like TIM material 40 is bonded to the back surface of the substrate 11 of the LED module 10. In this case, you may prepare what adhered the TIM material 40 to the back surface of the LED module 10 (board | substrate 11) previously. At this time, as shown in FIG. 6, it is preferable to attach a protective sheet 41 to the exposed surface of the TIM material 40.

Then, the LED module 10 with the TIM material with the protective sheet 41 attached to the back surface and the metal base 30 on which the LED module 10 is placed are prepared. As shown in FIG. And the exposed surface of the TIM material 40 is bonded to the mounting surface of the metal base 30. Thereby, the LED module 10 and the metal base 30 can be adhered and bonded together by the adhesive force of the TIM material 40.

As mentioned above, according to the lamp | ramp which concerns on Embodiment 1 of this invention, the LED module 10 (board | substrate 11) and the metal base 30 are joined by the TIM material 40. FIG. Thereby, since the thermal resistance between the board | substrate 11 and the metal base 30 can be made small, a high heat dissipation characteristic can be acquired. Therefore, since the heat generated in the LED element 12 can be efficiently radiated, a lamp having excellent heat dissipation can be realized.

Also, since the TIM material 40 has flexibility, even if the substrate 11 and the metal base 30 are deformed by thermal expansion, the TIM material 40 is also elastically deformed following these deformations. That is, the TIM material 40 can absorb the influence of thermal deformation of the substrate 11 and the metal base 30. For example, warpage or the like caused by a difference in thermal expansion coefficient between the substrate 11 and the metal base 30 can be suppressed.

Furthermore, in this embodiment, since the adhesion method of adhering the LED module 10 (substrate 11) and the metal base 30 with the TIM material 40 is adopted, the LED module 10 and the module are compared with the slide method and the claw method. Attachment workability with the metal base 30 can be simplified. Further, the working space can be narrowed by joining the LED module 10 (substrate 11) and the metal base 30 by the bonding method, and the lamp can be assembled in a small working space.

In this embodiment, a metal base substrate having polyimide as an insulating layer 11b is used as the substrate 11 of the LED module 10. Thereby, the withstand voltage can be ensured even if the thickness of the substrate 11 is less than the conventional limit. That is, since the board | substrate 11 arrange | positioned between the LED element 12 and the metal base 30 can be made thin, the heat which generate | occur | produces in the LED element 12 can be thermally radiated to the metal base 30 still more efficiently. Moreover, by making the board | substrate 11 thin, the metal base board | substrate which has flexibility can also be implement | achieved, and the LED element 12 can be easily arranged in three dimensions. As a result, light distribution control can be performed by adjusting the arrangement of the LED elements 12, such as widening the light distribution angle.

(Embodiment 2)
Next, a lamp 1B according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 7A is a cross-sectional view (a cross-sectional view taken along a plane perpendicular to the tube axis) of the lamp according to Embodiment 2 of the present invention, and FIG. It is a partially expanded sectional view which shows the detailed structure of the junction part of a LED module and a metal base. In FIG. 7, the same reference numerals are given to the same components as those in the first embodiment. Further, in FIG. 7A, the constituent members of the substrate 11 are not shown.

7 (a) and 7 (b), the lamp 1B according to the present embodiment is different from the lamp 1 according to the first embodiment in that the metal base 30 has a wall portion 33.

The wall portion 33 is a convex portion provided so as to protrude from the placement portion 31 toward the placement surface vertical direction (Z-axis direction), and is provided at each of both ends of the metal base 30 in the short direction. It has been. The wall 33 is plate-shaped and extends along the longitudinal direction of the metal base 30. The wall 33 in the present embodiment is a part of the metal base 30 and is formed when the metal base 30 is extruded.

The substrate 11 of the LED module 10 is disposed so as to be sandwiched between a pair of wall portions 33. That is, the substrate 11 is placed on the metal base 30 such that the side surface of the substrate 11 is in contact with the side surface of the wall portion 33.

As mentioned above, according to the lamp | ramp 1B which concerns on this Embodiment, since the wall part 33 is provided in the metal base 30, there exist the following effects.

In general, in the bonding method in which the LED module 10 and the metal base 30 are bonded to each other by bonding (TIM material 40), when the LED module 10 and the metal base 30 are misaligned, the LED module 10 and the metal base 30 are bonded. The base 30 cannot be easily pasted again.

In this embodiment, since the wall 33 is provided on the metal base 30, the wall 33 is placed on the LED module 10 (board 11) when the LED module 10 (board 11) is placed on the metal base 30. Therefore, the LED module 10 can be placed at a predetermined position on the metal base 30 with high accuracy. Thereby, since the position shift with the LED module 10 and the metal base 30 does not arise, the lamp | ramp which has a desired light distribution characteristic without a dispersion | variation can be produced.

Furthermore, according to the present embodiment, the side surface of the substrate 11 and the wall portion 33 are in contact with each other. That is, the substrate 11 is not only in contact with the TIM material 40 but also in contact with the metal base 30. Thereby, the heat generated in the LED module 10 is directly conducted to the metal base 30 not only via the TIM material 40 but also from the side surface of the substrate 11 via the wall portion 33. Therefore, the heat dissipation of the LED module 10 can be further improved.

Further, according to the present embodiment, the plate-like wall portion 33 extends along the longitudinal direction of the metal base 30. Thereby, the shape of the tube axis direction (X-axis direction) of the upper end part of the part which interrupts | blocks the light of the LED module 10 among the wall parts 33 can be made into linear form. Thereby, the light from the LED module 10 is uniformly blocked by the wall 33 in a straight line. Therefore, the appearance of the light emitted from the lamp 1B can be improved, and the aesthetic appearance when the lamp 1B emits light can be improved. In this case, the light distribution characteristic (light distribution angle) of the lamp 1B can be controlled by adjusting the height of the wall 33.

In this embodiment as well, a rail groove for engaging the translucent cover 20 and the metal base 30 may be provided. In this case, the rail groove can also be provided in the wall portion 33. For example, the rail groove can be formed so that the outer side surface of the wall portion 33 becomes the bottom surface of the recess.

(Embodiment 3)
Next, the illuminating device 2 which concerns on Embodiment 3 of this invention is demonstrated using FIG. FIG. 8 is a schematic perspective view of a lighting apparatus according to Embodiment 3 of the present invention.

As shown in FIG. 8, the lighting device 2 according to the embodiment of the present invention is a base light, and includes a lamp 1 and a lighting fixture 100.

The lamp 1 is a straight tube LED lamp according to the first embodiment, and is used as an illumination light source of the illumination device 2. In the present embodiment, two lamps 1 are used as shown in FIG. In the present embodiment, the

lamps

1A and 1B described above may be used.

The lighting fixture 100 includes a pair of sockets 110 that are electrically connected to the lamp 1 and holds the lamp 1, and a fixture main body 120 to which the socket 110 is attached. The instrument main body 120 can be formed by, for example, pressing an aluminum steel plate. In addition, the inner surface of the instrument main body 120 is a reflecting surface that reflects light emitted from the lamp 1 in a predetermined direction (for example, downward).

The lighting fixture 100 configured in this way is mounted on a ceiling or the like via a fixture. The lighting fixture 100 may include a circuit for controlling the lighting of the lamp 1 or the like. A cover member may be provided so as to cover the lamp 1.

(Other)
As described above, the lamp and the illumination device according to the present invention have been described based on the embodiments, but the present invention is not limited to the above-described embodiments.

For example, in the above-described embodiment, the single-side power feeding method in which power is supplied to all LEDs in the housing from only one side of the first base 50 is adopted, but a double-sided power feeding method in which power is supplied from both the bases may be used. .

In the above embodiment, the TIM material 40 and the substrate 11 are fixed by the adhesive layer formed on the TIM material 40. However, the substrate is not formed on the TIM material 40 without forming the adhesive layer. 11 may be fixed by forming an adhesive layer on the lowermost layer.

In the above-described embodiment, the first base 50 is an L-shaped base having a pair of L-shaped power feeding pins 52, but may be a G13 base. Similarly, the second base 60 may be a G13 base. As described above, a 1-pin to 2-pin base structure in which one of the two bases has one pin (1 pin) and the other has two pins (2 pins) may be used. A two-pin to two-pin base structure may be used as this pin (two pins).

In the above embodiment, the first base 50 is configured to receive DC power, but may be configured to receive AC power. When the first base 50 receives AC power, the lighting circuit incorporated in the lamp 1 includes a circuit that converts AC power into DC power.

In the above embodiment, the LED module 10 is an SMD type LED module using the packaged LED element 12, but is not limited thereto. For example, a COB (Chip On Board) type LED module having a configuration in which a plurality of LED chips are directly mounted on the substrate 11 and the plurality of LED chips are collectively sealed with a phosphor-containing resin may be used.

In the above embodiment, the LED module 10 (LED element 12) is configured to emit white light by the blue LED chip and the yellow phosphor, but is not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used and combined with this and a blue LED chip to emit white light. Alternatively, an LED chip that emits a color other than blue may be used. For example, an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than that of the blue LED chip is used. Further, white light may be emitted by the blue phosphor particles that emit red light and green light, the green phosphor particles, and the red phosphor particles.

In the above embodiment, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, or other solid light emitting element is used. Also good.

In the above embodiment, a straight tube LED lamp having a structure in which a part of the metal base 30 is exposed to the outside has been described as an example. However, the present invention is not limited to this. For example, instead of the translucent cover 20, a long cylindrical translucent housing (glass tube, plastic tube, etc.) is used to store the metal base 30 in the translucent housing. It doesn't matter.

In the above embodiment, a straight tube lamp has been described as an example, but the present invention can also be applied to a light bulb shaped lamp and a round lamp. In this case, the shape of the substrate 11 on which the LED element 12 is mounted may be formed according to the lamp outer shape.

In addition, the embodiment can be realized by arbitrarily combining the components and functions in each embodiment without departing from the scope of the present invention, or a form obtained by subjecting each embodiment to various modifications conceived by those skilled in the art. Forms are also included in the present invention.

The present invention can be widely used as a lamp using a light emitting element such as an LED, for example, a straight tube LED lamp and a lighting device equipped with the same.

DESCRIPTION OF

SYMBOLS

1, 1A, 1B Lamp 2 Illuminating device 10

LED module

11, 11A Board | substrate 11a Metal base material

11b Insulating layer

11c Metal wiring 11d Resist 12 LED element 12a Package

12b LED chip

12c Sealing member 13 Electrode terminal 20

Translucent cover

30,

30A Metal base

31, 31A Placement part 32 Radiation fin 33 Wall part 40 TIM material 41 Protective sheet 50

First base

51, 61 Base body 52 Power supply pin 60 Second base 62 Non-power supply pin 100 Lighting equipment 110 Socket 120 Equipment body

Claims

The base,
A substrate disposed on the base;
A plurality of light emitting elements mounted on the substrate;
A translucent cover that covers the plurality of light emitting elements and is fixed to the base;
A lamp comprising a TIM (Thermal Interface Material) material that joins the base and the substrate.
The lamp according to claim 1, wherein the substrate includes a metal base, an insulating layer formed on the metal base, and metal wiring formed on the insulating layer.
The lamp according to claim 2, wherein the insulating layer is made of a polyimide resin.
The lamp according to claim 3, wherein a thickness of the insulating layer is equal to or less than a thickness of the metal substrate.
The lamp according to any one of claims 1 to 4, wherein the base includes a wall portion that contacts a side surface of the substrate.
The lamp according to any one of claims 1 to 5, wherein the base is made of metal.
The lamp according to any one of claims 1 to 6, wherein the base and the translucent cover constitute a long cylindrical casing.
An illumination device comprising the lamp according to any one of claims 1 to 7.