Nothing Special   »   [go: up one dir, main page]

WO2007013001A2 - Light-emitting device with a sealing integrated driver circuit - Google Patents

Light-emitting device with a sealing integrated driver circuit Download PDF

Info

Publication number
WO2007013001A2
WO2007013001A2 PCT/IB2006/052453 IB2006052453W WO2007013001A2 WO 2007013001 A2 WO2007013001 A2 WO 2007013001A2 IB 2006052453 W IB2006052453 W IB 2006052453W WO 2007013001 A2 WO2007013001 A2 WO 2007013001A2
Authority
WO
WIPO (PCT)
Prior art keywords
driver
led
cover plate
elements
cells
Prior art date
Application number
PCT/IB2006/052453
Other languages
French (fr)
Other versions
WO2007013001A3 (en
Inventor
Eberhard Waffenschmidt
Edward Willem Albert Young
Dirk Hente
Original Assignee
Philips Intellectual Property & Standards Gmbh
Koninklijke Philips Electronics N. V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Intellectual Property & Standards Gmbh, Koninklijke Philips Electronics N. V. filed Critical Philips Intellectual Property & Standards Gmbh
Priority to CN2006800272283A priority Critical patent/CN101228649B/en
Priority to JP2008523501A priority patent/JP2009503777A/en
Priority to EP06780119A priority patent/EP1911110A2/en
Priority to US11/996,597 priority patent/US7855498B2/en
Publication of WO2007013001A2 publication Critical patent/WO2007013001A2/en
Publication of WO2007013001A3 publication Critical patent/WO2007013001A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the invention relates to an electroluminescent, e.g. a light-emitting device (O-LED) with a sealing integrated driver circuit.
  • O-LED light-emitting device
  • Such a device comprises a transparent substrate and a cover plate having a first side facing the transparent substrate and a second side opposite the first side, at least one electroluminescent element comprising an organic electroluminescent layer arranged between the transparent substrate and the cover plate, and an intermediate sealing means joining the transparent substrate and the cover plate.
  • O-LED Organic light-emitting diodes
  • PCB printed circuit board mounted on the rear side of the O-LED can be used, so that a tight and flat construction is obtained.
  • Such a device is disclosed in WO 03/034513.
  • the intermediate sealing means of the device is used as the substrate for the driving electronics.
  • the problem is that the conventional components needed for these electronics are typically bulky and stiff elements. This is in contrast to the thin and, if possible, flexible O-LED elements.
  • the devices described in WO 03/034513 are based on a substrate layer made of glass and a circuit board made of ceramics. It is therefore an object of the invention to provide an organic electroluminescent device of the type mentioned in the opening paragraph, which is provided with a hermetically closed very flat housing. Moreover, it should improve the functionality of an O-LED, considerably reduce the height of an O-LED module and allow cost-effective mass production.
  • This object is realized in that the driver circuit and the electronic driver elements or the printed circuit board (PCB) with the electronic driver elements are incorporated into the cover plate of the device.
  • PCB printed circuit board
  • a further advantage of the invention is that a lamp covering a large area consists of a number of cells.
  • the invention allows equipping each cell with its own driver on the rear side. In this way, each cell may be easily controlled in order to achieve a homogeneous light output of all cells or the application of certain light patterns.
  • Various electronic functionalities are possible, which can be integrated in the back of an O-LED by using this inventive compact, yet flexible construction.
  • a very simple supply may be a series resistor which can be integrated in the circuit board to adjust the device, e.g. the diode current to the supply voltage.
  • This resistor may be chosen from another flexible material.
  • a somewhat more advanced solution may be a linear control circuit, which is e.g. realized with a current-controlled transistor. Since this transistor does not need to be fast, printed polymer transistors can also be used, so that the construction remains both flat and flexible.
  • the driving electronics preferably consist of a DC/DC converter.
  • a step- down converter with current control is applied for a supply voltage which is higher than the diode voltage of the O-LED.
  • a step-up converter with current control is applied for a supply voltage which is lower than the diode voltage.
  • a flyback converter with an integrated transformer may also be used for a large difference between supply voltage and diode voltage. The secondary side diode of the flyback can be omitted and the O- LED can be used for this purpose.
  • Each converter is equipped with a control stage, such that the output of each cell can be controlled individually. This is important for generating light patterns using invention-related O-LEDs.
  • coils which are flat and flexible, can be produced and incorporated into the device. These coils are needed for several applications.
  • the coils serve for the remote powering of the O-LED (a wireless powered O-LED).
  • This combination is very effective because flexible O-LEDs for generating light patterns can be obtained, which O-LEDs are as flat as films, because no external-to-internal connection of conducting paths is necessary.
  • It is possible to integrate further electronic elements such as WIFI for remote communication between O-LED systems and/or passive filters consisting of LC combinations in order to filter disturbances, and also passive narrow-band filters consisting of LC-combinations (e.g. a series resonator), wherein each filter selects a certain frequency without reducing the flexibility of the complete device.
  • Different O-LED cells are provided with filters of different center frequencies. Each cell may then be controlled by its related frequency. Groups of cells may have the same frequency, e.g. all red cells, all green cells, and all blue cells have the same frequency. The RGB -color of all cells can thus be jointly controlled.
  • Each cell may be equipped with a tiny transformer integrated in the PCB to adapt an AC-bus voltage to the cell current.
  • the secondary side of the transformer may be equipped with an additional rectifier stage (e.g. full bridge, half bridge, or single diode rectifier).
  • an additional rectifier stage e.g. full bridge, half bridge, or single diode rectifier.
  • two neighboring cells can be connected in an anti- parallel way, thus working as a rectifier. In this way, no additional external rectifier is necessary.
  • the primary side of the transformer can be distributed across a large area covering a number of cells. In every cell, a secondary winding picks up a part of the magnetic flux to drive the cell. In this way, no interconnections to each individual cell are necessary.
  • Integrated capacitors may act as analog sample-and-hold devices to allow easy multiplexing of a large number of cells.
  • Intelligence is added to the driver for stand-alone operation of each cell, e.g. for setting individual light patterns or color schemes.
  • the printed circuit board (PCB) on the rear side contains integrated, planar components.
  • This can be realized either as an assembly or as a fully integrated O-LED device in which the rear side is made of a printed circuit board. In this way, the sealing of the O-LED even performs an electronic function.
  • a further Figure shows an example with an integrated inductor. The aspect ratio in the Figures is not 1:1, but the thickness of the printed circuit board (PCB) is exaggerated. Also further passive components such as capacitors or resistors can be integrated in the PCB.
  • the sealing and the electronics can be made flexible, so that a completely flexible or bendable display module can be obtained.
  • each cell or group of cells is equipped with electronic bus-address units, by which each luminescent element or cell or group of luminescent elements or cells can be identified and selectively generated.
  • Each cell or group of cells can thus be generated selectively, and no conductive paths are necessary in combination with a contactless inductive intercoupling.
  • the electronic elements for the bus- address units are also implemented and incorporated into the cover plate in the way described.
  • this bus-address circuit is also constructed with planar components only, and, in a special solution, such a device is flexible or bendable. It is thus possible to create semiconductor elements in such a thin construction that they are flexible or bendable. This can be realized with classical anorganic semiconductors as well. Dimensions of thickness must be less than 100 micrometers.
  • Figure 1 shows an O-LED with a flex foil as top sealing.
  • Figure 2 shows an O-LED with a flex foil as top sealing with a substrate for driver electronics.
  • Figure 3 shows an O-LED with an integrated inductor.
  • Figure 1 is a cross-sectional view of an O-LED 20 with a flexible foil as top sealing 10 and interconnection. The complete structure is layered, rendering it flexible and bendable.
  • the transparent substrate 1 on the light-emitting side of the O-LED 20 is a light-transmitting flexible material in the sense of the disclosed invention.
  • the flex foil 10 is a layer with a polyimide core with copper layers 2 on both sides in order to realize an interconnection between the inner O-LED and the outer conducting paths. Therefore, this flex foil is bendable.
  • the O-LED cells 3 are located between the flex foil 10 and the transparent substrate 1.
  • the O-LED cells themselves consist of a conducting layer 4 on one side and a transparent conducting layer 5 on the other side which faces the transparent substrate 1.
  • the active O-LED layer is located between the conducting layer 4 of the O-LED cell and the transparent conducting layer 5 of the O-LED.
  • the transparent conducting layers of several O-LED cells can be kept together, but the conducting layers on the other side of the O-LEDs must be separated, i.e. they have to be isolated from each other in order to activate each O-LED itself, i.e. independently of each other.
  • the gap between the transparent substrate and the flex foil is sealed with a side sealing 8 at least at the outer sides of an O-LED.
  • the conducting layers of the O-LEDs are bonded with conducting posts, which interconnect these conducting rear sides of the O-LEDs with the inner conducting layers, in this case copper layers 2 of the flex foil 10.
  • the O-LED-cells 3 are preferably positioned on the transparent substrate 1, or, more preferably, on the transparent conducting layer 5 with a defined gap between each other.
  • the conducting posts 7 for the common transparent conducting layer is located in this gap.
  • the dimensions of the conducting posts 7 and the gaps are combined so as to preclude a shortcut between these conducting posts and the conducting layers of the O-LED cells.
  • FIG. 2 is a cross-sectional view similar to that in Figure 1.
  • An O-LED 20 is shown with flex foil 10 as a top sealing with substrate for driver electronics 11.
  • the multilayer sandwich construction is similar as in Figure 1, but the flex foil 10 is a multilayer system with two polyimide cores 9, the first of which has substantially the same construction as in Figure 1, but the second flex foil layer has an integral circuit board for the driver electronics 11.
  • One possibility for construction is to mount the electronic components 11 on top of this circuit board which is an integral part of the top sealing of the complete device.
  • Another possibility is to position at least some electronic components in the intermediate layers of the top sealing.
  • the complete device is flexible and bendable and it is necessary to consider the desired range of flexibility so that a satisfactory contact with all electronic components is realized in every case.
  • the external top surface carries the conductive paths, which may be made of copper layers 2, as is customary for printed circuit boards. Interconnections from these layers to the inner layer of the top sealing downwards are realized by conducting vias 6, which are made of copper in this case.
  • Figure 3 is a cross-sectional view of an O-LED with an integral inductor 30 which is completely incorporated into the top sealing of this device.
  • the intermediate layer bulk comprises an inductor 30 consisting of a soft magnetic core 31 and a spiral winding 32.
  • These inductor components 31, 32 are completely integrated, i.e. they are completely incorporated into the bulk of the upper layer of the flex foil 10.
  • the flex foil 10 remains flexible andbendable.
  • the spiral winding 32 as well as the soft magnetic cores 31 are therefore created in a thin-layered way.
  • the rest of the construction is similar to that shown in Figure 2.
  • the integrated inductor couples with an external inductor. This results in a contactless steering of the O-LED.
  • capacitors in the sealing top i.e. the flex foil. This may enable devices to allow easy multiplexing of a large number of cells.
  • the invention leads to a very compact, i.e. flat construction of the O-LED. Furthermore, the flat construction supports the option to create the O-LED in a flexible and bendable way. This special embodiment will generate really new fields of application of O-LEDs.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention relates to light-emitting diodes (O-LED). In particular, it relates to the driver electronics needed for these devices. An organic electroluminescent device is provided, which has a hermetically closed very flat housing. To improve the functionality of an O-LED, considerably reduce the height of an O-LED module and allow a cost-effective mass production, the driver circuit and the electronic driver elements or the printed circuit board (PCB) with the electronic driver elements are incorporated into the cover plate of the device.

Description

LIGHT-EMITTING DEVICE WITH A SEALING INTEGRATED DRIVER CIRCUIT
The invention relates to an electroluminescent, e.g. a light-emitting device (O-LED) with a sealing integrated driver circuit. In particular, it relates to the driver electronics needed for this device. Such a device comprises a transparent substrate and a cover plate having a first side facing the transparent substrate and a second side opposite the first side, at least one electroluminescent element comprising an organic electroluminescent layer arranged between the transparent substrate and the cover plate, and an intermediate sealing means joining the transparent substrate and the cover plate.
Organic light-emitting diodes (O-LED) are a high-potential solution for future light sources. They are expected to become a high-efficiency light source in a wide area for cost-effective manufacture. However, they typically need driving electronics to adapt the available supply voltage to the required current of the O-LED. In order to achieve a high efficiency of the whole system, these driving electronics should be switched-mode power supplies with various types of electronic components. In order to integrate this circuit, a printed circuit board (PCB) mounted on the rear side of the O-LED can be used, so that a tight and flat construction is obtained.
Such a device is disclosed in WO 03/034513. The intermediate sealing means of the device is used as the substrate for the driving electronics. The problem is that the conventional components needed for these electronics are typically bulky and stiff elements. This is in contrast to the thin and, if possible, flexible O-LED elements.
The devices described in WO 03/034513 are based on a substrate layer made of glass and a circuit board made of ceramics. It is therefore an object of the invention to provide an organic electroluminescent device of the type mentioned in the opening paragraph, which is provided with a hermetically closed very flat housing. Moreover, it should improve the functionality of an O-LED, considerably reduce the height of an O-LED module and allow cost-effective mass production.
This object is realized in that the driver circuit and the electronic driver elements or the printed circuit board (PCB) with the electronic driver elements are incorporated into the cover plate of the device.
Consequently, all driver components can be arranged together with the O-LED in a construction which is as flat as possible. As a result, the device is much flatter than that cited in the state of the art.
In the functional result of the invention, the technical fact that an O-LED is naturally flexible in itself is used to distinguish this feature by constructing a circuit board which is just as flexible as the O-LED. The complete device thus finally remains flexible, which is a great advantage in a large number of possible technical applications. This combination of a flat construction and great flexibility results in a very flat and effective device.
A further advantage of the invention is that a lamp covering a large area consists of a number of cells. The invention allows equipping each cell with its own driver on the rear side. In this way, each cell may be easily controlled in order to achieve a homogeneous light output of all cells or the application of certain light patterns. Various electronic functionalities are possible, which can be integrated in the back of an O-LED by using this inventive compact, yet flexible construction.
Due to the provision of the driver device, a very simple supply may be a series resistor which can be integrated in the circuit board to adjust the device, e.g. the diode current to the supply voltage. This resistor may be chosen from another flexible material.
A somewhat more advanced solution may be a linear control circuit, which is e.g. realized with a current-controlled transistor. Since this transistor does not need to be fast, printed polymer transistors can also be used, so that the construction remains both flat and flexible.
The driving electronics preferably consist of a DC/DC converter. A step- down converter with current control is applied for a supply voltage which is higher than the diode voltage of the O-LED. A step-up converter with current control is applied for a supply voltage which is lower than the diode voltage. A flyback converter with an integrated transformer may also be used for a large difference between supply voltage and diode voltage. The secondary side diode of the flyback can be omitted and the O- LED can be used for this purpose. Each converter is equipped with a control stage, such that the output of each cell can be controlled individually. This is important for generating light patterns using invention-related O-LEDs.
Also coils, which are flat and flexible, can be produced and incorporated into the device. These coils are needed for several applications. The coils serve for the remote powering of the O-LED (a wireless powered O-LED). This combination is very effective because flexible O-LEDs for generating light patterns can be obtained, which O-LEDs are as flat as films, because no external-to-internal connection of conducting paths is necessary. It is possible to integrate further electronic elements such as WIFI for remote communication between O-LED systems and/or passive filters consisting of LC combinations in order to filter disturbances, and also passive narrow-band filters consisting of LC-combinations (e.g. a series resonator), wherein each filter selects a certain frequency without reducing the flexibility of the complete device. Different O-LED cells are provided with filters of different center frequencies. Each cell may then be controlled by its related frequency. Groups of cells may have the same frequency, e.g. all red cells, all green cells, and all blue cells have the same frequency. The RGB -color of all cells can thus be jointly controlled.
Each cell may be equipped with a tiny transformer integrated in the PCB to adapt an AC-bus voltage to the cell current. The secondary side of the transformer may be equipped with an additional rectifier stage (e.g. full bridge, half bridge, or single diode rectifier). Alternatively, two neighboring cells can be connected in an anti- parallel way, thus working as a rectifier. In this way, no additional external rectifier is necessary. The primary side of the transformer can be distributed across a large area covering a number of cells. In every cell, a secondary winding picks up a part of the magnetic flux to drive the cell. In this way, no interconnections to each individual cell are necessary.
Integrated capacitors may act as analog sample-and-hold devices to allow easy multiplexing of a large number of cells.
Intelligence is added to the driver for stand-alone operation of each cell, e.g. for setting individual light patterns or color schemes.
As a solution, the printed circuit board (PCB) on the rear side contains integrated, planar components. This can be realized either as an assembly or as a fully integrated O-LED device in which the rear side is made of a printed circuit board. In this way, the sealing of the O-LED even performs an electronic function. A further Figure shows an example with an integrated inductor. The aspect ratio in the Figures is not 1:1, but the thickness of the printed circuit board (PCB) is exaggerated. Also further passive components such as capacitors or resistors can be integrated in the PCB.
All of these combinations of features with the features defined in the independent claim open up an immense field of application of invention-related O- LEDs which are flat and flexible or bendable. In the invention, polymer materials are used by way of example for printed circuit boards. As compared with the state of the art, it is an advantage that this type of material is less expensive and is available in larger sizes than ceramic materials. By using a flexible printed circuit board material such as polyimide, also flexible components can be integrated in this flexible substrate, which even comprises inductors.
In this way, the sealing and the electronics can be made flexible, so that a completely flexible or bendable display module can be obtained.
It is also advantageous that, in one explicit solution, each cell or group of cells is equipped with electronic bus-address units, by which each luminescent element or cell or group of luminescent elements or cells can be identified and selectively generated. Each cell or group of cells can thus be generated selectively, and no conductive paths are necessary in combination with a contactless inductive intercoupling.
In the context of the invention, the electronic elements for the bus- address units are also implemented and incorporated into the cover plate in the way described. In a particular combination, this bus-address circuit is also constructed with planar components only, and, in a special solution, such a device is flexible or bendable. It is thus possible to create semiconductor elements in such a thin construction that they are flexible or bendable. This can be realized with classical anorganic semiconductors as well. Dimensions of thickness must be less than 100 micrometers. These and other aspects of the invention are apparent from and will be elucidated with reference to the embodiments described hereinafter.
In the drawings: Figure 1 shows an O-LED with a flex foil as top sealing.
Figure 2 shows an O-LED with a flex foil as top sealing with a substrate for driver electronics. Figure 3 shows an O-LED with an integrated inductor.
Figure 1 is a cross-sectional view of an O-LED 20 with a flexible foil as top sealing 10 and interconnection. The complete structure is layered, rendering it flexible and bendable.
The transparent substrate 1 on the light-emitting side of the O-LED 20 is a light-transmitting flexible material in the sense of the disclosed invention. The flex foil 10 is a layer with a polyimide core with copper layers 2 on both sides in order to realize an interconnection between the inner O-LED and the outer conducting paths. Therefore, this flex foil is bendable.
The O-LED cells 3 are located between the flex foil 10 and the transparent substrate 1. The O-LED cells themselves consist of a conducting layer 4 on one side and a transparent conducting layer 5 on the other side which faces the transparent substrate 1. The active O-LED layer is located between the conducting layer 4 of the O-LED cell and the transparent conducting layer 5 of the O-LED.
The transparent conducting layers of several O-LED cells can be kept together, but the conducting layers on the other side of the O-LEDs must be separated, i.e. they have to be isolated from each other in order to activate each O-LED itself, i.e. independently of each other. The gap between the transparent substrate and the flex foil is sealed with a side sealing 8 at least at the outer sides of an O-LED.
The conducting layers of the O-LEDs are bonded with conducting posts, which interconnect these conducting rear sides of the O-LEDs with the inner conducting layers, in this case copper layers 2 of the flex foil 10.
The O-LED-cells 3 are preferably positioned on the transparent substrate 1, or, more preferably, on the transparent conducting layer 5 with a defined gap between each other.
The conducting posts 7 for the common transparent conducting layer is located in this gap. The dimensions of the conducting posts 7 and the gaps are combined so as to preclude a shortcut between these conducting posts and the conducting layers of the O-LED cells.
In this respect, it should be considered that no shortcut in the sense described can take place in the range of the predetermined maximal bending or flexing action. Through the polyimide core 9 of the flex foil 10, there is a conductive via 6 between the conductive layer inside and the conductive layer outside.
Figure 2 is a cross-sectional view similar to that in Figure 1. An O-LED 20 is shown with flex foil 10 as a top sealing with substrate for driver electronics 11. The multilayer sandwich construction is similar as in Figure 1, but the flex foil 10 is a multilayer system with two polyimide cores 9, the first of which has substantially the same construction as in Figure 1, but the second flex foil layer has an integral circuit board for the driver electronics 11. One possibility for construction is to mount the electronic components 11 on top of this circuit board which is an integral part of the top sealing of the complete device. Another possibility is to position at least some electronic components in the intermediate layers of the top sealing. In both construction alternatives, the complete device is flexible and bendable and it is necessary to consider the desired range of flexibility so that a satisfactory contact with all electronic components is realized in every case. In this sandwich construction of the top sealing, the external top surface carries the conductive paths, which may be made of copper layers 2, as is customary for printed circuit boards. Interconnections from these layers to the inner layer of the top sealing downwards are realized by conducting vias 6, which are made of copper in this case.
Figure 3 is a cross-sectional view of an O-LED with an integral inductor 30 which is completely incorporated into the top sealing of this device. In this embodiment, a sandwich construction similar to that in Figure 2 is shown. The intermediate layer bulk comprises an inductor 30 consisting of a soft magnetic core 31 and a spiral winding 32. These inductor components 31, 32 are completely integrated, i.e. they are completely incorporated into the bulk of the upper layer of the flex foil 10.
Also in this alternative, the flex foil 10 remains flexible andbendable. The spiral winding 32 as well as the soft magnetic cores 31 are therefore created in a thin-layered way. The rest of the construction is similar to that shown in Figure 2.
The integrated inductor couples with an external inductor. This results in a contactless steering of the O-LED.
Similarly as with inductors, it is possible to integrate capacitors in the sealing top, i.e. the flex foil. This may enable devices to allow easy multiplexing of a large number of cells.
As defined in the claims, the invention leads to a very compact, i.e. flat construction of the O-LED. Furthermore, the flat construction supports the option to create the O-LED in a flexible and bendable way. This special embodiment will generate really new fields of application of O-LEDs.

Claims

CLAIMS:
1. An electroluminescent device with a sealing integrated driver circuit, the device comprising a transparent substrate and a cover plate having a first side facing the transparent substrate and a second side opposite the first side, at least one electroluminescent element comprising an organic electroluminescent layer arranged between the transparent substrate and the cover plate, and an intermediate sealing means joining the transparent substrate and the cover plate characterized in that the driver circuit and the electronic driver elements (11) or the printed circuit board (PCB) with the electronic driver elements are incorporated into the cover plate (10) of the device.
2. A device as claimed in claim 1, characterized in that the semiconducting driver elements (11) are made of printed polymer semiconductor material.
3. A device as claimed in claim 1 , characterized in that the transparent substrate (1) and the cover plate (10) as well as the sealing (8) and the printed circuit board (PCB) driver are formed of a flexible or bendable material.
4. A device as claimed in claim 1 , characterized in that the driver is supplied by a series resistor preferably made of flexible, electrically resistive material which is integrated in the printed circuit board.
5. A device as claimed in claim 1 or 2, characterized in that the driver is supplied by a linear control circuit which is implemented by a current-controlled transistor.
6. A device as claimed in claim 3 or 4, characterized in that the driver consists of a DC/DC converter, and in that each converter is equipped with a control stage, such that the output of each electroluminescent element or cell can be individually controlled in order to generate light patterns.
7. A device as claimed in claim 2 or 3, characterized in that at least one coil for remote powering of the electroluminescent element is incorporated into the cover plate and/or the flexible circuit board.
8. A device as claimed in claim 7, characterized in that the electroluminescent element is an organic light-emitting diode O-LED.
9. A device as claimed in claim 1 or 2, characterized in that further electronic elements such as WiFi for remote communication between O-LED systems, and/or passive filters with LC-combinations, and/or narrow-band filters with LC-combinations are integrated in the cover plate.
10. A device as claimed in claim 1 or 5, characterized in that different electroluminescent elements or cells (O-LED) are provided with filters of different center frequencies in order to group different cells to an assembly with different light colors.
11. A device as claimed in claim 1 or 8, characterized in that, in an assembly or an arrangement of several electroluminescent elements or cells, each element or cell is equipped with a tiny transformer which is integrated in the PCB, i.e in the cover plate, in order to adapt an AC-bus voltage to the cell current, wherein the second side of the transformer is equipped with a rectifier stage.
12. A device as claimed in claim 1 or 9, characterized in that each cell or group of cells is equipped with electronic bus address units, by which each luminescent element or cell or group of luminescent elements or cells can be identified and selectively generated.
13. A device as claimed in claim 1 or 2, characterized in that the semiconductor elements are created to be so thin that they are bendable or flexible.
PCT/IB2006/052453 2005-07-27 2006-07-18 Light-emitting device with a sealing integrated driver circuit WO2007013001A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2006800272283A CN101228649B (en) 2005-07-27 2006-07-18 Light-emitting device with a sealing integrated driver circuit
JP2008523501A JP2009503777A (en) 2005-07-27 2006-07-18 LIGHTING DEVICE HAVING SEALING UNIT WITH INTEGRATED DRIVE CIRCUIT
EP06780119A EP1911110A2 (en) 2005-07-27 2006-07-18 Light-emitting device with a sealing integrated driver circuit
US11/996,597 US7855498B2 (en) 2005-07-27 2006-07-18 Light-emitting device with a sealing integrated driver circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05106924 2005-07-27
EP05106924.3 2005-07-27

Publications (2)

Publication Number Publication Date
WO2007013001A2 true WO2007013001A2 (en) 2007-02-01
WO2007013001A3 WO2007013001A3 (en) 2007-10-18

Family

ID=37683719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/052453 WO2007013001A2 (en) 2005-07-27 2006-07-18 Light-emitting device with a sealing integrated driver circuit

Country Status (7)

Country Link
US (1) US7855498B2 (en)
EP (1) EP1911110A2 (en)
JP (1) JP2009503777A (en)
KR (1) KR20080042094A (en)
CN (1) CN101228649B (en)
TW (1) TW200717890A (en)
WO (1) WO2007013001A2 (en)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231134A (en) * 2008-03-24 2009-10-08 Toshiba Lighting & Technology Corp Lighting device
WO2009141111A2 (en) 2008-05-23 2009-11-26 Osram Gesellschaft mit beschränkter Haftung Wireless supplyable lighting module
EP2144290A1 (en) * 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same
WO2010089683A1 (en) 2009-02-05 2010-08-12 Philips Intellectual Property & Standards Gmbh Electroluminescent device
WO2010089684A1 (en) 2009-02-05 2010-08-12 Philips Intellectual Property & Standards Gmbh Electroluminescent device
DE102009046755A1 (en) * 2009-11-17 2011-05-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Organic photoelectric device
WO2011083414A1 (en) * 2010-01-05 2011-07-14 Koninklijke Philips Electronics N.V. A method of manufacturing an oled device
US20110180206A1 (en) * 2008-07-02 2011-07-28 Nederlandse Organisatie Voor Toegepastnatuurweten- Schappelijk Onderzoek Tno Method of providing conductive structures in a multi-foil system and multifoil system comprising same
EP2363905A1 (en) * 2010-03-05 2011-09-07 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electrical device and method for manufacturing thereof
US8035309B2 (en) 2006-03-23 2011-10-11 Koninklijke Philips Electronics N.V. Light emitting device
DE102010023550A1 (en) * 2010-06-03 2011-12-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. lighting element
WO2012049580A1 (en) * 2010-10-11 2012-04-19 Koninklijke Philips Electronics N.V. Multi-device oled
US8358062B2 (en) 2009-02-05 2013-01-22 Koninklijke Philips Electronics N.V. Electroluminescent device
JP2013101969A (en) * 2008-12-30 2013-05-23 Samsung Display Co Ltd Method for encapsulating environmentally sensitive element
DE102011056570A1 (en) * 2011-12-16 2013-06-20 Osram Opto Semiconductors Gmbh Light-emitting component arrangement
DE102012220724A1 (en) * 2012-11-14 2014-05-15 Osram Opto Semiconductors Gmbh Optoelectronic component
DE102013107613A1 (en) * 2013-07-17 2015-01-22 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
CN104362259A (en) * 2014-11-17 2015-02-18 京东方科技集团股份有限公司 LED display panel and packaging method thereof
EP2844036A3 (en) * 2013-08-12 2015-03-11 Toshiba Lighting & Technology Corporation Power supply device and illumination device
WO2015162308A1 (en) * 2014-04-23 2015-10-29 Mundo Original, S.L. Light-emitting textile element with a free connection system
DE102014111345A1 (en) * 2014-08-08 2016-02-11 Osram Oled Gmbh Optoelectronic component and method for its production
DE102015101531A1 (en) * 2015-02-03 2016-08-04 Osram Oled Gmbh Organic light emitting device and light emitting device
US9839940B2 (en) 2002-04-15 2017-12-12 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
EP1863093B1 (en) * 2006-05-30 2018-12-19 OSRAM OLED GmbH Organic light-emitting component, device with an organic light-emitting component and illumination device and method for manufacturing an organic light-emitting component
WO2021048240A1 (en) 2019-09-10 2021-03-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Organic led module

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE534510C2 (en) * 2008-11-19 2011-09-13 Silex Microsystems Ab Functional encapsulation
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
US8350470B2 (en) * 2008-12-17 2013-01-08 General Electric Company Encapsulation structures of organic electroluminescence devices
US8536779B2 (en) * 2009-02-05 2013-09-17 Koinklijke Philips N.V. Electroluminescent device with protective means for divide areas
WO2010125494A1 (en) * 2009-04-27 2010-11-04 Koninklijke Philips Electronics N. V. Organic light emitting diode circuit with cover
US8450926B2 (en) * 2009-05-21 2013-05-28 General Electric Company OLED lighting devices including electrodes with magnetic material
JP5581029B2 (en) * 2009-09-18 2014-08-27 パナソニック株式会社 Lighting module
TWI423718B (en) * 2009-10-21 2014-01-11 Au Optronics Corp Organic electroluminescence device and electronic device having the same
JP5715149B2 (en) * 2009-11-27 2015-05-07 コーニンクレッカ フィリップス エヌ ヴェ Enhanced counter electrode for electroluminescent devices
CN101826601B (en) * 2010-04-13 2012-12-12 友达光电股份有限公司 Encapsulation of organic electroluminescent elements and manufacturing method thereof
CN103038562B (en) * 2010-08-13 2016-05-25 Oled工厂有限责任公司 The airtight electroluminescent device of inductive power supply
JP2012079469A (en) * 2010-09-30 2012-04-19 Brother Ind Ltd Organic el element and manufacturing method therefor
WO2012052886A2 (en) 2010-10-21 2012-04-26 Koninklijke Philips Electronics N.V. Oled device with a brightness distribution controlling means
DE102010042727A1 (en) 2010-10-21 2012-05-10 Ledon Oled Lighting Gmbh & Co. Kg OLED module
KR101771162B1 (en) 2010-12-14 2017-08-25 삼성디스플레이 주식회사 Organic light emitting diode display
KR20120066352A (en) 2010-12-14 2012-06-22 삼성모바일디스플레이주식회사 Organic light emitting diode display and manufacturing method thereof
KR101858182B1 (en) 2011-04-11 2018-05-16 삼성디스플레이 주식회사 Organic light emitting diode display
EP2629347A1 (en) * 2012-02-17 2013-08-21 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electric device and method for manufacturing the same
RU2014140547A (en) 2012-03-08 2016-04-27 Конинклейке Филипс Н.В. SEGMENTED ELECTROLUMINESCENT DEVICE WITH DISTRIBUTED LOAD ELEMENTS
WO2014115064A1 (en) * 2013-01-25 2014-07-31 Koninklijke Philips N.V. Lighting assembly and method for manufacturing a lighting assembly
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
CN104362103B (en) * 2014-11-13 2017-03-15 京东方科技集团股份有限公司 Packaging system and method for packing
DE102015114010A1 (en) 2015-08-24 2017-03-02 Osram Opto Semiconductors Gmbh Optoelectronic component, method for producing an optoelectronic component and method for operating an optoelectronic component
US9865671B2 (en) 2015-09-03 2018-01-09 Industrial Technology Research Institute Organic light-emitting device
US9923135B2 (en) 2015-11-23 2018-03-20 Industrial Technology Research Institute Light-emitting assembly

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703394A (en) 1996-06-10 1997-12-30 Motorola Integrated electro-optical package
WO2002039513A1 (en) 2000-11-08 2002-05-16 Koninklijke Philips Electronics N.V. Electro-optical device
WO2003034513A1 (en) 2001-10-18 2003-04-24 Koninklijke Philips Electronics N.V. Electroluminescent device
EP1437703A1 (en) 2001-09-07 2004-07-14 Matsushita Electric Industrial Co., Ltd. Display apparatus and its manufacturing method
EP1450587A1 (en) 2001-12-18 2004-08-25 Seiko Epson Corporation Light-emitting device, its manufacturing method, electro-optical device, and electronic device
US6893896B1 (en) 1998-03-27 2005-05-17 The Trustees Of Princeton University Method for making multilayer thin-film electronics

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85103742A (en) * 1985-05-16 1986-11-19 斯托弗化学公司 Adopt the Thin Film Transistor (TFT) of nitrogen group element polymer semiconductor
JP4273551B2 (en) * 1999-01-14 2009-06-03 ソニー株式会社 Video apparatus and manufacturing method thereof
DE10005296A1 (en) 2000-02-07 2001-08-16 Infineon Technologies Ag Device for the emission of electromagnetic radiation and method for the production thereof
JP2002082627A (en) * 2000-09-07 2002-03-22 Sony Corp Display device
JP2002366059A (en) * 2001-06-07 2002-12-20 Hitachi Ltd Portable information terminal
DE10139707A1 (en) 2001-08-11 2003-02-20 Philips Corp Intellectual Pty circuit board
US6637906B2 (en) * 2001-09-11 2003-10-28 Recot, Inc. Electroluminescent flexible film for product packaging
JP2003228332A (en) * 2002-02-06 2003-08-15 Toshiba Corp Display device
US20030197475A1 (en) * 2002-04-04 2003-10-23 Makoto Takamura Flat-panel display, manufacturing method thereof, and portable terminal
JP2007503715A (en) 2003-08-26 2007-02-22 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Printed circuit board with integrated inductor
JP2005116320A (en) * 2003-10-07 2005-04-28 Nippon Hoso Kyokai <Nhk> Flexible el display device
EP1854161B1 (en) 2005-02-16 2008-12-10 Koninklijke Philips Electronics N.V. An oled device
JP2006243127A (en) * 2005-03-01 2006-09-14 Victor Co Of Japan Ltd Sheet display
US20070139575A1 (en) * 2005-12-16 2007-06-21 Ceramate Technical Co., Ltd. Display module for LCD

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703394A (en) 1996-06-10 1997-12-30 Motorola Integrated electro-optical package
US6893896B1 (en) 1998-03-27 2005-05-17 The Trustees Of Princeton University Method for making multilayer thin-film electronics
WO2002039513A1 (en) 2000-11-08 2002-05-16 Koninklijke Philips Electronics N.V. Electro-optical device
EP1437703A1 (en) 2001-09-07 2004-07-14 Matsushita Electric Industrial Co., Ltd. Display apparatus and its manufacturing method
WO2003034513A1 (en) 2001-10-18 2003-04-24 Koninklijke Philips Electronics N.V. Electroluminescent device
EP1450587A1 (en) 2001-12-18 2004-08-25 Seiko Epson Corporation Light-emitting device, its manufacturing method, electro-optical device, and electronic device

Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9839940B2 (en) 2002-04-15 2017-12-12 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8035309B2 (en) 2006-03-23 2011-10-11 Koninklijke Philips Electronics N.V. Light emitting device
EP1863093B1 (en) * 2006-05-30 2018-12-19 OSRAM OLED GmbH Organic light-emitting component, device with an organic light-emitting component and illumination device and method for manufacturing an organic light-emitting component
JP2009231134A (en) * 2008-03-24 2009-10-08 Toshiba Lighting & Technology Corp Lighting device
WO2009141111A2 (en) 2008-05-23 2009-11-26 Osram Gesellschaft mit beschränkter Haftung Wireless supplyable lighting module
US8901857B2 (en) 2008-05-23 2014-12-02 Osram Gesellschaft Mit Beschraenkter Haftung Wireless supplyable lighting module
WO2009141111A3 (en) * 2008-05-23 2010-04-15 Osram Gesellschaft mit beschränkter Haftung Wireless supplyable lighting module
CN102037277B (en) * 2008-05-23 2013-10-30 奥斯兰姆有限公司 Wireless supplyable lighting module
US10575411B2 (en) * 2008-07-02 2020-02-25 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Method of providing conductive structures in a multi-foil system and multifoil system comprising same
US20110180206A1 (en) * 2008-07-02 2011-07-28 Nederlandse Organisatie Voor Toegepastnatuurweten- Schappelijk Onderzoek Tno Method of providing conductive structures in a multi-foil system and multifoil system comprising same
WO2010005301A1 (en) * 2008-07-08 2010-01-14 Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek Tno Electronic device and method of manufacturing the same
US8759884B2 (en) 2008-07-08 2014-06-24 Nederlandse Organisatie Voor Toegepast—Natuurwetenschappelijk Onderzoek Tno Electronic device and method of manufacturing the same
JP2011527816A (en) * 2008-07-08 2011-11-04 ネーデルランツ オルガニサティー フォール トゥーゲパストナトゥールヴェテンシャッペリーク オンデルズーク テーエンオー Electronic device and manufacturing method thereof
EP2144290A1 (en) * 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same
JP2013101969A (en) * 2008-12-30 2013-05-23 Samsung Display Co Ltd Method for encapsulating environmentally sensitive element
WO2010089683A1 (en) 2009-02-05 2010-08-12 Philips Intellectual Property & Standards Gmbh Electroluminescent device
US8358062B2 (en) 2009-02-05 2013-01-22 Koninklijke Philips Electronics N.V. Electroluminescent device
WO2010089684A1 (en) 2009-02-05 2010-08-12 Philips Intellectual Property & Standards Gmbh Electroluminescent device
US8536783B2 (en) 2009-02-05 2013-09-17 Koninklijke Philips N.V. Electroluminescent device with protective means for contact areas
EP2323191A3 (en) * 2009-11-17 2011-12-28 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Organic photoelectric component
DE102009046755A1 (en) * 2009-11-17 2011-05-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Organic photoelectric device
US8530924B2 (en) 2009-11-17 2013-09-10 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Organic photoelectric device
WO2011083414A1 (en) * 2010-01-05 2011-07-14 Koninklijke Philips Electronics N.V. A method of manufacturing an oled device
US20130087824A1 (en) * 2010-03-05 2013-04-11 Jeroen van den Brand Opto-electrical device and method for manufacturing thereof
WO2011108921A1 (en) 2010-03-05 2011-09-09 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Opto-electrical device and method for manufacturing thereof
EP2363905A1 (en) * 2010-03-05 2011-09-07 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electrical device and method for manufacturing thereof
US9437510B2 (en) 2010-03-05 2016-09-06 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Opto-electrical device and method for manufacturing thereof
DE102010023550A1 (en) * 2010-06-03 2011-12-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. lighting element
DE102010023550B4 (en) * 2010-06-03 2015-02-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. lighting element
US9054333B2 (en) 2010-06-03 2015-06-09 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Organic light emitting diode and circuit board for control thereof
WO2012049580A1 (en) * 2010-10-11 2012-04-19 Koninklijke Philips Electronics N.V. Multi-device oled
US9240563B2 (en) 2010-10-11 2016-01-19 Koninklijke Philips N.V. Multi-device OLED
DE102011056570A1 (en) * 2011-12-16 2013-06-20 Osram Opto Semiconductors Gmbh Light-emitting component arrangement
US9245929B2 (en) 2011-12-16 2016-01-26 Osram Oled Gmbh Light-emitting component arrangement
DE102012220724A1 (en) * 2012-11-14 2014-05-15 Osram Opto Semiconductors Gmbh Optoelectronic component
US9502682B2 (en) 2012-11-14 2016-11-22 Osram Oled Gmbh Optoelectronic device
DE102012220724B4 (en) 2012-11-14 2022-05-25 Pictiva Displays International Limited optoelectronic component
DE102013107613A1 (en) * 2013-07-17 2015-01-22 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
EP2844036A3 (en) * 2013-08-12 2015-03-11 Toshiba Lighting & Technology Corporation Power supply device and illumination device
WO2015162308A1 (en) * 2014-04-23 2015-10-29 Mundo Original, S.L. Light-emitting textile element with a free connection system
US9888729B2 (en) 2014-04-23 2018-02-13 Light Flex Technology, S.L. Light-emitting textile element with a free connection system
DE102014111345A1 (en) * 2014-08-08 2016-02-11 Osram Oled Gmbh Optoelectronic component and method for its production
DE102014111345B4 (en) 2014-08-08 2023-05-04 Osram Oled Gmbh Optoelectronic component and method for its production
CN104362259B (en) * 2014-11-17 2017-02-22 京东方科技集团股份有限公司 LED display panel and packaging method thereof
US9660215B2 (en) 2014-11-17 2017-05-23 Boe Technology Group Co., Ltd. Display panel and encapsulation method thereof
CN104362259A (en) * 2014-11-17 2015-02-18 京东方科技集团股份有限公司 LED display panel and packaging method thereof
DE102015101531A1 (en) * 2015-02-03 2016-08-04 Osram Oled Gmbh Organic light emitting device and light emitting device
WO2021048240A1 (en) 2019-09-10 2021-03-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Organic led module
DE102020123553B4 (en) 2019-09-10 2024-08-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Organic light-emitting diode module

Also Published As

Publication number Publication date
JP2009503777A (en) 2009-01-29
WO2007013001A3 (en) 2007-10-18
US7855498B2 (en) 2010-12-21
CN101228649A (en) 2008-07-23
EP1911110A2 (en) 2008-04-16
TW200717890A (en) 2007-05-01
US20080231180A1 (en) 2008-09-25
KR20080042094A (en) 2008-05-14
CN101228649B (en) 2011-09-28

Similar Documents

Publication Publication Date Title
US7855498B2 (en) Light-emitting device with a sealing integrated driver circuit
US8461775B2 (en) Integrated three dimensional inductor and method of manufacturing same
KR101296238B1 (en) Dc-dc converter
US5959846A (en) Modular surface mount circuit device and a manufacturing method thereof
RU2411700C2 (en) Light-emitting device
WO2016194626A1 (en) Dc-dc converter, switching ic, and inductor device
JP2013215053A (en) Power supply device and power module
JP2017027970A (en) Electronic component
WO2016125531A1 (en) Module
JP2008099378A (en) Hybrid ic circuit and dc-dc converter
US11181243B2 (en) Rugged flexible LED lighting panel
EP0851439B1 (en) Modular surface mount circuit device and a manufacturing method thereof
CN103238229A (en) Oled module
JP4674545B2 (en) Electromagnetic induction parts and power supply
JP4974009B2 (en) Electronic components
JP6799050B2 (en) DC / DC converter
TWM585466U (en) Integrated electronic circuit
KR100747973B1 (en) Integrated type intelligent power module for pdp
WO2022091479A1 (en) Power supply circuit module
KR100809487B1 (en) Converter module
KR100631983B1 (en) Lcd back light inverter of stacked type
JP2007028838A (en) Power supply circuit device
JP2007173647A (en) Electromagnetic induction component and power supply apparatus

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2006780119

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06780119

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2008523501

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 11996597

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 200680027228.3

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087004566

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2006780119

Country of ref document: EP