WO2006090746A1 - Mask clamp moving mechanism and film forming apparatus - Google Patents
Mask clamp moving mechanism and film forming apparatus Download PDFInfo
- Publication number
- WO2006090746A1 WO2006090746A1 PCT/JP2006/303188 JP2006303188W WO2006090746A1 WO 2006090746 A1 WO2006090746 A1 WO 2006090746A1 JP 2006303188 W JP2006303188 W JP 2006303188W WO 2006090746 A1 WO2006090746 A1 WO 2006090746A1
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- WO
- WIPO (PCT)
- Prior art keywords
- mask
- expansion
- clamp
- contraction means
- mask clamp
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Definitions
- the present invention relates to a mask clamp moving mechanism and a film forming apparatus, and more particularly to a mask clamp moving mechanism used in a film forming apparatus for manufacturing an organic EL element.
- FIG. 8 is an explanatory view of the upper part of the vacuum deposition apparatus.
- the vacuum evaporation apparatus 1 is provided with an organic material evaporation source (not shown) at the bottom, and a chuck 2 is provided at the upper part of the apparatus facing the evaporation source.
- the chuck 2 is a flat plate that keeps the glass substrate 3 flat, and can be rotated by a rotation mechanism provided outside the apparatus main body.
- a mask clamp 4 for holding the mask is provided around the chuck 2 so as to be movable up and down.
- the mask has an opening pattern for forming an organic EL element pattern (pixel) on the surface of the glass substrate 3.
- the upper end of the mask clamp 4 protrudes to the outside of the apparatus main body, and a connecting member 5 is disposed at the upper end.
- a pair of cylinders 6 is provided below the connection member 5, the lower end is connected to the upper part of the apparatus main body, and the upper rod is connected to the plate member 7.
- the plate member 7 is provided so as to be in contact with the connection member 5. As the plate member 7 moves up and down due to the expansion and contraction of the cylinder 6, the connecting member 5 moves up and down, and the mask clamp 4 moves up and down.
- the range in which the mask clamp 4 moves up and down is a mask whose upper limit is held by the mask clamp 4
- the lower limit is in contact with a substrate transport mechanism (not shown) inserted between the chuck 2 and the mask clamp 4. It is in a safe position.
- This substrate transport mechanism inserts a glass substrate from the outside of the vacuum vapor deposition apparatus and places it on the substrate clamp, and takes out the glass substrate on which the pattern is formed to the outside of the apparatus. Therefore, since the mask clamp and the substrate transport mechanism do not come into contact with each other, a large stroke of the cylinder for moving the mask clamp up and down is necessary.
- the mask and the glass substrate are aligned to form an organic EL element pattern at a predetermined position on the glass substrate. Done. In this alignment, the mask placed on the alignment arm and the glass substrate are not in contact with each other. ! / Do it! /, So it is done at a slight distance.
- a mask clamp for fixing the mask conventionally uses an air cylinder whose stroke cannot be adjusted. For this reason, since the two-step operation cannot be performed, the mask clamp 4 is positioned at the lower limit of the moving range, and when the rising starts after the alignment is completed, the mask clamp 4 moves a long distance until the mask is fixed on the glass substrate. . As a result, it takes a lot of time to travel a long distance, which slows down the manufacturing speed and lowers the manufacturing efficiency.
- the glass substrate is rotated in the horizontal direction in order to make the thickness of the organic thin film formed on the glass substrate uniform within the substrate surface. Therefore, in order to rotate the glass substrate, the chuck, mask, mask holder, etc. must be rotated. Therefore, the rotation mechanism must be arranged at the top of the vacuum evaporation system.
- the vacuum vapor deposition system is complicatedly connected with wiring for driving each mechanism provided in the system, there is a mechanism that lifts and lowers the mask clamp in multiple stages on the axis of the rotating mechanism. It was considered difficult to install.
- An object of the present invention is to provide a mask clamp moving mechanism that divides the amount of movement of the mask clamp into a plurality of parts.
- Another object of the present invention is to provide a film forming apparatus having a mask clamp moving mechanism.
- the mask clamp moving mechanism can move the mask arranged on the front surface of the substrate on which the organic EL element is formed with respect to the substrate.
- a moving mechanism of the mask clamp characterized in that the moving mechanism is provided with expansion / contraction means capable of moving the mask clamp for holding the mask in a plurality of stages.
- the expansion / contraction means is attached to the first expansion / contraction means provided in a film forming apparatus main body for forming a film of the organic EL element on the substrate, and is engaged with the mask clamp. Second extending / contracting means.
- first expansion / contraction means and the second expansion / contraction means can expand and contract independently of each other.
- the first expansion / contraction means and the second expansion / contraction means may be an air cylinder or a hydraulic cylinder. Further, the expansion / contraction means can be configured using a multistage cylinder.
- the film forming apparatus is a film forming apparatus for manufacturing an organic EL element on a substrate, the chuck holding the substrate facing an organic material supply source, and the organic EL A mask clamp held by a mask on which an element pattern is formed; expansion / contraction means for moving the mask back and forth in a plurality of stages with respect to the substrate via the mask clamp; the chuck provided on an apparatus main body; and the mask clamp And a rotation mechanism for rotating the expansion / contraction means in the horizontal direction.
- the expansion / contraction means is attached to the first expansion / contraction means provided in the apparatus main body and the first expansion / contraction means, and is extendable / contractible independently of the first expansion / contraction means engaged with the mask clamp. And a second expansion / contraction means.
- the mask clamp moving mechanism when the expansion / contraction means expands and contracts in multiple stages, the mask clamp connected thereto moves up and down in multiple stages. That is, when the expansion / contraction means is composed of the first expansion / contraction means and the second expansion / contraction means, when at least one of the first expansion / contraction means and the second expansion / contraction means is expanded / contracted, the mask clamp moves up and down in accordance with this operation. To do. Therefore, if the expansion / contraction operation of each expansion / contraction means is controlled independently, the movement amount of the mask clamp can be divided into two stages. [0015]
- the expansion and contraction of the first and second expansion / contraction means can be performed by expanding and contracting a cylinder rod provided in the air cylinder and the hydraulic cylinder.
- the first expansion / contraction means is extended with the second expansion / contraction means contracted during the positioning of the mask and the substrate, and after the positioning is completed, the first expansion / contraction means and the second expansion / contraction means are expanded. Extending the means shortens the amount of movement of the mask clamp after positioning is completed, thereby shortening the manufacturing time of the organic EL element.
- FIG. 1 is an explanatory diagram of a vacuum vapor deposition apparatus.
- FIG. 2 is a schematic plan view of a mask clamp.
- FIG. 3 is an explanatory diagram when the apparatus upper mechanism is in a reference position.
- FIG. 4 is an explanatory diagram of the upper mechanism of the apparatus when the glass substrate and the mask are aligned.
- FIG. 5 is an explanatory view of the upper mechanism of the apparatus after aligning the glass substrate and the mask.
- FIG. 6 is an explanatory diagram of alignment between a glass substrate and a mask.
- FIG. 7 is a diagram for explaining a camera installation position.
- FIG. 8 is an explanatory diagram of the upper part of the vacuum evaporation apparatus.
- FIG. 1 is an explanatory diagram of a vacuum vapor deposition apparatus according to an embodiment.
- FIG. 2 is a schematic plan view of the mask clamp according to the embodiment.
- the vacuum deposition apparatus 10 includes an evaporation source 14 (sublimation source) of the organic material 12 at the bottom of the apparatus main body 11, and The chuck 16, the substrate clamp 18, the first mask clamp 20, the expansion / contraction means 22, the second mask clamp 28 and the like are provided on the upper part.
- evaporation source 14 sublimation source
- the evaporation source 14 of the organic material 12 includes a crucible 14a into which the organic material 12 is placed, and a heater 14b for heating and evaporating (sublimating) the organic material 12 is provided on the outer surface of the crucible 14a. It has been. Further, the chuck 16 provided on the inner upper portion of the apparatus main body 11 is disposed so as to face the crucible 14a, and is a flat plate disposed along the horizontal direction. The chuck 16 holds the glass substrate 32 at the part facing the crucible 14a. Further, the chuck 16 can be horizontally rotated by a rotation mechanism 30 provided on the outer upper portion of the apparatus main body 11.
- the lower end of the substrate clamp 18 passes through the ceiling of the apparatus main body 11 and is inserted into the apparatus main body 11.
- the lower end 18a of the substrate clamp 18 is folded toward the chuck 16 side (the central side of the vacuum deposition apparatus 10).
- a plurality of bent bowls are provided along the side edge of the chuck 16.
- These substrate clamps 18 are set so that each tip 18a has the same height (in the same plane) in order to support the edge of the glass substrate 32 with the tip 18a (folded portion).
- the substrate clamp 18 can be moved up and down by an elevating mechanism (not shown) provided on the outer upper portion of the apparatus body 11 while maintaining the state in which the tip portions 18a are in the same plane.
- the glass substrate 32 can be brought into contact with the chuck 16 and mounted and held in a flat shape.
- the lower end of the first mask clamp 20 passes through the ceiling of the apparatus main body 11 and is inserted into the apparatus main body 11, and the lower end 20a is directed toward the chuck 16 (center side of the vacuum evaporation apparatus 10). A plurality of bowls are bent along the side edges of the chuck 16.
- the first mask clamp 20 supports the edge of the mask 34 with the lower tip 20a (folded portion) so that the lower tips 20a are at the same height (in the same plane). It is set!
- the mask 34 includes a mask film 34a in which a plurality of opening patterns corresponding to each pixel of the organic EL element are provided, and a frame-type mask frame 34b that holds the periphery of the mask film 34a (FIG. 2). reference).
- the upper tip portion 20b of the first mask clamp 20 protrudes outside the apparatus main body 11, and each upper tip portion 20b is connected to the connection member 20c. And the upper tip 20 b and the connection member 20c serve as a base end portion of the first mask clamp 20.
- the connecting member 20c By moving the connecting member 20c up and down, the first mask clamps 20 connected to the connecting member 20c are moved up and down. Accordingly, the tip portions 20a provided below the first mask clamp 20 can be moved up and down while maintaining a state where they are in the same plane.
- expansion / contraction means 22 for raising and lowering the connection member 20c is provided below the connection member 20c.
- the connecting member 20c and the expansion / contraction means 22 are arranged to face each other.
- the expansion / contraction means 22 includes a first expansion / contraction means 24 and a second expansion / contraction means 26.
- the first expansion / contraction means 24 and the second expansion / contraction means 26 may be an actuator such as an air cylinder or a hydraulic cylinder. If an air cylinder is used, maintenance is easy.
- a plurality of first expansion / contraction means 24 are provided, the lower end of each tube is connected to the upper part of the apparatus main body 11, and the tip 24a of the rod serving as the upper end is connected to the plate member 23.
- a plurality of first expansion / contraction means 24 (cylinder main body) are disposed on the outer upper portion of the apparatus main body 11 along the rotation direction of the chuck 16, and the tip 24 a of each rod is connected to the plate member 23. It is the structure connected by. The plate member 23 is moved up and down as the first expansion / contraction means 24 expands and contracts.
- the plate member 23 is provided with second expansion / contraction means 26 via a bracket provided at the lower end of the plate member 23.
- the rod 26a penetrates the plate member 23, and the tip of the rod 26a is engaged, that is, connected or in contact with the connection member 20c.
- the plurality of second expansion / contraction means 26 (cylinder main body) are arranged below the plate member 23, and the rod 26a (second rod) is provided in the hole provided in the plate member 23. It extends upward via a portion (not shown), and its tip is connected to or in contact with the connecting member 20c.
- the second expansion / contraction means 26 and the first expansion / contraction means 24 can expand and contract independently of each other, and the connecting member 20c is moved up and down in accordance with at least one expansion / contraction operation.
- the substrate clamp 18, the first mask clamp 20, and the expansion / contraction means 22 can be rotated together with the chuck 16 by a rotation mechanism 30 provided on the outer upper portion of the apparatus main body 11.
- the second mask clamp 28 is disposed between the chuck 16 and the evaporation source 14 so that the lower part thereof is bent inward so as to face the chuck 16, and the configuration of the second mask clamp 28 is the edge of the mask 34.
- the portion (mask frame 34b) corresponds to the portion (mask frame 34b), it has an extending portion 28a extending from the side of the mask 34, and a fitting pin 28b provided at the tip of the extending portion 28a. More specifically, the extended portion 28a supports the edge of the mask 34, is disposed at a position where the first mask clamp 20 is sandwiched along the side edge of the chuck 16, and is formed in a bowl shape. The outer force of the mask 34 extends to the edge of the mask 34 along the tip of the first mask clamp 20 thus formed.
- a fitting pin 28b that fits into the fitting hole 34c of the mask 34 is provided at the tip of the extended portion 28a.
- a fitting hole may be provided at the tip of the extended portion 28a, and a fitting pin may be provided on the mask 34.
- the base end portions of the extending portions 28a disposed so as to sandwich the first mask clamp 20 on both sides are connected to each other.
- the extended portion 28a extends from the outer cover of the mask 34 so as to support each corner portion of the mask 34. Since the second mask clamp 28 is at the reference position with respect to the vacuum deposition apparatus 10, when the mask 34 is placed on the second mask clamp 28 so that the fitting hole 34c and the fitting pin 28b are fitted, the mask 34 is Positioned relative to the vacuum deposition apparatus 10.
- FIG. 3 is an explanatory diagram when the upper mechanism of the apparatus is at the reference position.
- FIG. 4 is an explanatory view of the upper mechanism of the apparatus when the glass substrate and the mask are aligned.
- FIG. 5 is an explanatory view of the upper mechanism of the apparatus after aligning the glass substrate and the mask.
- a mask 34 is disposed on the second mask clamp 28 in advance.
- the second mask clamp 28 is in the reference position with respect to the vacuum deposition apparatus 10
- the mask 34 is placed on the vacuum deposition apparatus 10.
- the glass substrate 32 is placed inside the apparatus main body 11 by the substrate transport mechanism and inserted between the chuck 16 and the mask 34. Then, the glass substrate 32 is moved downward along with the lowering operation of the substrate transport mechanism and placed on the substrate clamp 18.
- the mask 34 is moved upward by raising the second mask clamp 28, and the mask 34 is moved upward.
- a glass substrate 32 is placed on the disc 34.
- the second mask clamp 28 continues to be raised until the glass substrate 32 contacts the bottom surface (chuck surface) of the chuck 16.
- the glass substrate 32 becomes horizontal along the mask 34, and is kept in contact with the chuck 16 while maintaining this horizontal state.
- the substrate clamp 18 is raised until it contacts the glass substrate 32.
- the glass substrate 32 is mounted and held on the chuck 16 while maintaining the horizontal state by the substrate clamp 18.
- the second mask clamp 28 is lowered and the mask 34 is moved downward.
- the lower end portion 20a of the first mask clamp 20 is in contact with the mask 34 and the substrate transport mechanism. There is no.
- FIG. 6 is an explanatory diagram of alignment between the glass substrate and the mask.
- FIG. 6A is a diagram for explaining the arrangement of the camera, the glass substrate, and the mask.
- FIG. 6B is an image taken by a camera and shows a case where a positional deviation has occurred.
- Fig. 6 (C) is an image taken by a camera and shows a case where the positions are correct.
- the glass substrate 32 is provided with alignment marks 42 in at least two places.
- the alignment mark 42 provided on the glass substrate 32 is provided, for example, at the opposite corner of the glass substrate 32.
- the alignment mark 42 is made of the same material as this electrode. It may be formed.
- the shape of the alignment mark 42 provided on the glass substrate 32 may be, for example, a circle, a dot or a cross!
- the alignment mark 44 provided on the mask 34 may be a dot, a circle, or a cross, as long as it is provided at a position corresponding to the alignment mark 42 provided on the glass substrate 32. If there is. If the alignment mark 42 on the glass substrate 32 is rounded, the alignment mark 44 on the mask 34 should be set as a dot. If the alignment mark 42 on the glass substrate 32 is set as a dot, the alignment on the mask 34 is set.
- the mark 44 may be a circle with a different size or a different shape.
- the vacuum deposition apparatus 10 includes an alignment mark 42 provided on the glass substrate 32, A camera 40 for imaging the alignment mark 44 provided on the mask 34 may be provided (see FIG. 6A).
- the mask 34 (second mask clamp 28) is arranged so that the dot of the alignment mark 44 (42) enters the circle of the alignment mark 42 (44). If the X (vertical), Y (horizontal), and ⁇ (rotation) directions are adjusted, the alignment between the glass substrate 32 and the mask 34 is completed (see FIGS. 6B and 6C). At the time of alignment between the glass substrate 32 and the mask 34, the mask 34 is positioned with respect to the vacuum deposition apparatus 10, so that the alignment mark 44 of the mask 34 surely enters the field of view of the camera 40.
- the first expansion / contraction means 24 is extended to raise the first mask clamp 20 (see FIG. 4). As a result, the lower end of the first mask clamp 20 is raised. The lower tip when the first expansion / contraction means 24 is extended is below the mask 34 on which the positioning operation is performed.
- the mask 34 is transferred from the second mask clamp 28 to the first mask clamp 20, and the lower tip 20a is further raised. Then, the mask 34 is put on the glass substrate 32.
- the lower tip 20a rises, that is, the second expansion / contraction means 26 stops. Note that the upper limit position of the lower end portion 20a when the second expansion / contraction means 26 is extended is slightly smaller than the distance from the chuck 16 surface to the lower surface of the mask 34 when the mask 34 is placed on the glass substrate 32 (at least several mm) If it is located above.
- the glass substrate 32 and the mask 34 are rotated by the operation of the rotating mechanism 30, and the organic material 12 is heated and evaporated by the heater 14 b to form an organic EL element pattern on the glass substrate 32.
- the first expansion / contraction means 24 and the second expansion / contraction means 26 are contracted, and the first mask clamp 20 is lowered.
- the mask 34 is moved downward along with the lowering of the first mask clamp 20, but is replaced on the way from the first mask clamp 20 to the second mask clamp 28 below the chuck 16.
- the substrate clamp 18 is also lowered, and the glass substrate 32 is moved downward.
- the substrate transfer device enters the apparatus body 11 and collects the glass substrate 32. To do.
- An organic EL element is manufactured by such an operation.
- the first expansion / contraction means 24 and the second expansion / contraction means 26 are provided as the expansion / contraction means 22 for moving the first mask clamp 20 up and down. Therefore, the first mask clamp 20 can be moved up and down in two stages by extending and contracting each independently. That is, the movement amount of the first mask clamp 20 can be divided into two stages.
- the first mask clamp 20 is raised by one step, and the distance between the mask 34 and the lower tip of the first mask clamp 20 is slightly increased.
- the moving distance of the first mask clamp 20 after the alignment can be shortened. Therefore, since the alignment of the mask 34 and the glass substrate 32 and the raising of the first mask clamp 20 are performed at the same time, the manufacturing time of the organic EL element can be shortened and the manufacturing speed can be improved. In addition, the manufacturing efficiency of organic EL elements can be improved.
- the expansion / contraction means 22 has a configuration in which a plate member 23 is connected to the other end 24a of the first expansion / contraction means 24, and the second expansion / contraction means 26 is disposed on the plate member 23.
- the first masking means 24 and the second expanding / contracting means 26 can lift and lower the first mask clamp 20 in two stages on the axis of the rotating mechanism 30.
- the first mask clamp 20 is lowered to the lowest point by retracting the first expansion means 24 and the second expansion means 26 when the glass substrate 32 is inserted and recovered and the mask 34 is replaced.
- the second expansion / contraction means 26 may be expanded and contracted while the first expansion / contraction means 24 is extended, and moved up and down.
- the first expansion / contraction means 24 and the second expansion / contraction means 26 are connected vertically via the plate member 23.
- the other end 26a of the second expansion / contraction means 26 is used.
- a plate member may be connected to the plate member, the third expansion / contraction means may be disposed on the plate member, and the other end of the third expansion / contraction means may be engaged (connected or contacted) with the connection member 20c. . That is, the first expansion / contraction means, the second expansion / contraction means, and the third expansion / contraction means can be connected vertically via the plate member, and the first mask clamp 20 can be moved up and down in three stages.
- the first mask clamp 20 can be lifted and lowered in a plurality of stages.
- the first mask clamp 20 is configured by the first expansion / contraction means 24 and the second expansion / contraction means 26 as the expansion / contraction means for moving up and down, the multistage cylinder of the hydraulic pressure or hydraulic pressure described above is used. You can use!
- the force is a form in which two cameras for aligning the glass substrate and the mask are provided.
- the present invention is not limited to this. That is, three cameras can be provided as shown in FIG. 7 (A), and four cameras can be provided as shown in FIG. 7 (B).
- the formation in which the mask moving mechanism is used in the vacuum vapor deposition apparatus 10 has been described. It can also be used for other film forming apparatuses such as a vapor phase growth apparatus.
- the substrate may be a substrate with material strength other than glass, not limited to the glass substrate 32! / ⁇ Industrial Applicability
- the present invention can be applied to a film forming apparatus that forms a thin film on a substrate such as glass or semiconductor by vapor deposition or sputtering.
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A moving mechanism of a first mask clamp (20) is a mechanism for moving the first mask clamp (20) in a film forming apparatus for forming an organic EL element. The moving mechanism is provided with a chuck (16) which is arranged to face a vapor source (14) of an organic material (12) and places a mask (34) over a substrate; a first mask clamp (20) which has a leading edge section (20a) formed in a hook-shape and holds the mask (34) placed over the chuck (16) by the leading edge section (20a); and an extending/retracting means (22) for moving the substrate clamp (18). The extending/retracting means (22) is configured by arranging a first extending/retracting means (24) on an apparatus main body (11), connecting a first rod, which performs extending/extracting operation, to a board member (23), arranging a second extending/retracting means (26) on the board member (23), and connecting or bringing a second rod, which performs extending/retracting operation, to or into contact with an base end section of the substrate clamp (18).
Description
明 細 書 Specification
マスククランプの移動機構および成膜装置 Mask clamp moving mechanism and film forming apparatus
技術分野 Technical field
[0001] 本発明はマスククランプの移動機構および成膜装置に係り、特に有機 EL素子を製 造する成膜装置に用いられるマスククランプの移動機構に関する。 TECHNICAL FIELD [0001] The present invention relates to a mask clamp moving mechanism and a film forming apparatus, and more particularly to a mask clamp moving mechanism used in a film forming apparatus for manufacturing an organic EL element.
背景技術 Background art
[0002] 有機 EL (Electroluminescence)素子を製造する成膜装置には、例えば真空蒸 着装置が用いられる。図 8は真空蒸着装置上部の説明図である。真空蒸着装置 1に は、底部に有機材料の蒸発源 (不図示)が設けられており、この蒸発源に対面する装 置の上部にチャック 2が設けられている。チャック 2は、ガラス基板 3を平面に維持する 平板であり、装置本体の外部に設けられた回転機構により回転可能となっている。そ してチャック 2の周囲には、マスクを保持するマスククランプ 4が昇降可能に設けられ ている。なおマスクには、ガラス基板 3表面に有機 EL素子のパターン (画素)を形成 するための開口パターンが形成されている。 For example, a vacuum evaporation apparatus is used as a film forming apparatus for manufacturing an organic EL (Electroluminescence) element. FIG. 8 is an explanatory view of the upper part of the vacuum deposition apparatus. The vacuum evaporation apparatus 1 is provided with an organic material evaporation source (not shown) at the bottom, and a chuck 2 is provided at the upper part of the apparatus facing the evaporation source. The chuck 2 is a flat plate that keeps the glass substrate 3 flat, and can be rotated by a rotation mechanism provided outside the apparatus main body. A mask clamp 4 for holding the mask is provided around the chuck 2 so as to be movable up and down. The mask has an opening pattern for forming an organic EL element pattern (pixel) on the surface of the glass substrate 3.
[0003] マスククランプ 4は、その上端部が装置本体の外部に突き出ており、その上端に接 続部材 5が配設されている。また接続部材 5の下方には、例えば一対のシリンダ 6が 設けられており、下端が装置本体の上部に接続され、上部のロッドが板部材 7に接続 されている。この板部材 7は、接続部材 5と接触可能に設けられている。そしてシリン ダ 6の伸縮動作による板部材 7の上下移動に伴って、接続部材 5が上下移動し、マス ククランプ 4が上下に移動する。 [0003] The upper end of the mask clamp 4 protrudes to the outside of the apparatus main body, and a connecting member 5 is disposed at the upper end. Also, for example, a pair of cylinders 6 is provided below the connection member 5, the lower end is connected to the upper part of the apparatus main body, and the upper rod is connected to the plate member 7. The plate member 7 is provided so as to be in contact with the connection member 5. As the plate member 7 moves up and down due to the expansion and contraction of the cylinder 6, the connecting member 5 moves up and down, and the mask clamp 4 moves up and down.
なおシリンダの伸縮動作により、マスククランプを上下に移動させることについて開 示された文献は不知である。 In addition, the literature disclosed about moving the mask clamp up and down by the expansion and contraction of the cylinder is unknown.
発明の開示 Disclosure of the invention
発明が解決しょうとする課題 Problems to be solved by the invention
[0004] マスククランプ 4の上下移動する範囲は、上限がマスククランプ 4に保持させたマスク [0004] The range in which the mask clamp 4 moves up and down is a mask whose upper limit is held by the mask clamp 4
(図示せず)がチャック 2の保持したガラス基板 3に接触する位置である。また、下限は 、チャック 2とマスククランプ 4との間に挿入される図示しない基板搬送機構と接触する
ことのない位置になっている。この基板搬送機構は、ガラス基板を真空蒸着装置の外 部から内部に挿入して基板クランプ上に載せるとともに、パターンが成膜されたガラス 基板を装置の外部へ取り出すものである。したがってマスククランプと前記基板搬送 機構とが接触しないために、マスククランプを上下に移動させるシリンダのストローク は、大きいものが必要であった。 (Not shown) is a position in contact with the glass substrate 3 held by the chuck 2. The lower limit is in contact with a substrate transport mechanism (not shown) inserted between the chuck 2 and the mask clamp 4. It is in a safe position. This substrate transport mechanism inserts a glass substrate from the outside of the vacuum vapor deposition apparatus and places it on the substrate clamp, and takes out the glass substrate on which the pattern is formed to the outside of the apparatus. Therefore, since the mask clamp and the substrate transport mechanism do not come into contact with each other, a large stroke of the cylinder for moving the mask clamp up and down is necessary.
[0005] ところで、ガラス基板が装置内に挿入されてチャックに装着固定された後には、ガラ ス基板の所定位置に有機 EL素子のパターンを形成するために、マスクとガラス基板 との位置合わせが行われる。この位置合わせは、ァライメントアームに載せられたマス クとガラス基板とが接触しな 、距離、すなわち距離が少しでも空!、て!/、ればよ!/、ので 、僅かな距離をおいて行われている。 [0005] By the way, after the glass substrate is inserted into the apparatus and mounted and fixed to the chuck, the mask and the glass substrate are aligned to form an organic EL element pattern at a predetermined position on the glass substrate. Done. In this alignment, the mask placed on the alignment arm and the glass substrate are not in contact with each other. ! / Do it! /, So it is done at a slight distance.
[0006] この位置合わせのときには、マスクを固定するマスククランプは、従来、ストロークの 調整できないエアシリンダを用いている。このため、 2段動作ができないのでマスクク ランプ 4は移動範囲の最下限に位置することとなり、位置合わせ終了後に上昇を開 始するとマスクをガラス基板上に固定するまで長い距離を移動することになる。したが つて長い距離を移動するためには多くの時間が必要になるので、製造スピードが遅く なり、製造効率が低くなつていた。 [0006] At the time of this alignment, a mask clamp for fixing the mask conventionally uses an air cylinder whose stroke cannot be adjusted. For this reason, since the two-step operation cannot be performed, the mask clamp 4 is positioned at the lower limit of the moving range, and when the rising starts after the alignment is completed, the mask clamp 4 moves a long distance until the mask is fixed on the glass substrate. . As a result, it takes a lot of time to travel a long distance, which slows down the manufacturing speed and lowers the manufacturing efficiency.
[0007] またガラス基板は、ガラス基板上に成膜される有機薄膜の厚さを基板面内で均一 にするために、水平方向に回転される。したがってガラス基板を回転させるために、 チャックやマスク、マスクホルダー等を回転させなければならないので、回転機構を 真空蒸着装置の上部に配設しなければならない。しかし真空蒸着装置には、装置に 設けられた各機構を駆動させるための配線等が複雑に接続されているので、回転機 構の軸上においてマスククランプを複数段階に分割して昇降させる機構を設けること は困難とされていた。 In addition, the glass substrate is rotated in the horizontal direction in order to make the thickness of the organic thin film formed on the glass substrate uniform within the substrate surface. Therefore, in order to rotate the glass substrate, the chuck, mask, mask holder, etc. must be rotated. Therefore, the rotation mechanism must be arranged at the top of the vacuum evaporation system. However, since the vacuum vapor deposition system is complicatedly connected with wiring for driving each mechanism provided in the system, there is a mechanism that lifts and lowers the mask clamp in multiple stages on the axis of the rotating mechanism. It was considered difficult to install.
[0008] 本発明は、マスククランプの移動量を複数に分割するマスククランプの移動機構を 提供することを目的とする。 An object of the present invention is to provide a mask clamp moving mechanism that divides the amount of movement of the mask clamp into a plurality of parts.
また本発明は、マスククランプの移動機構を備えた成膜装置を提供することを目的 とする。 Another object of the present invention is to provide a film forming apparatus having a mask clamp moving mechanism.
課題を解決するための手段
[0009] 上記目的を達成するために、本発明に係るマスククランプの移動機構は、有機 EL 素子が形成される基板の前面に配置されるマスクを、前記基板に対して進退させるこ とが可能なマスククランプの移動機構であって、前記移動機構は、前記マスクを保持 させる前記マスククランプを複数段に移動できる伸縮手段を備えていることを特徴とし ている。 Means for solving the problem [0009] In order to achieve the above object, the mask clamp moving mechanism according to the present invention can move the mask arranged on the front surface of the substrate on which the organic EL element is formed with respect to the substrate. A moving mechanism of the mask clamp, characterized in that the moving mechanism is provided with expansion / contraction means capable of moving the mask clamp for holding the mask in a plurality of stages.
[0010] 前記伸縮手段は、前記基板に前記有機 EL素子の膜を成膜する成膜装置本体に 設けた第 1伸縮手段と、前記第 1伸縮手段に取り付けられるとともに、前記マスククラ ンプを係合させた第 2伸縮手段と、を有するように構成できる。 [0010] The expansion / contraction means is attached to the first expansion / contraction means provided in a film forming apparatus main body for forming a film of the organic EL element on the substrate, and is engaged with the mask clamp. Second extending / contracting means.
[0011] この場合、前記第 1伸縮手段と前記第 2伸縮手段とは、相互に独立して伸縮できる ようにするとよい。また、前記第 1伸縮手段、前記第 2伸縮手段は、エアシリンダまた は油圧シリンダであってよい。さらに、伸縮手段は、多段シリンダを用いて構成できる [0011] In this case, it is preferable that the first expansion / contraction means and the second expansion / contraction means can expand and contract independently of each other. The first expansion / contraction means and the second expansion / contraction means may be an air cylinder or a hydraulic cylinder. Further, the expansion / contraction means can be configured using a multistage cylinder.
[0012] また本発明に係る成膜装置は、基板に有機 EL素子を製造するための成膜装置で あって、有機材料の供給源に対向して前記基板を保持するチャックと、前記有機 EL 素子のパターンが形成されたマスクの保持するマスククランプと、前記マスククランプ を介して前記マスクを前記基板に対して複数段に進退させる伸縮手段と、装置本体 に設けられて前記チャック、前記マスククランプおよび前記伸縮手段を水平方向に回 転させる回転機構と、を有することを特徴としている。 [0012] The film forming apparatus according to the present invention is a film forming apparatus for manufacturing an organic EL element on a substrate, the chuck holding the substrate facing an organic material supply source, and the organic EL A mask clamp held by a mask on which an element pattern is formed; expansion / contraction means for moving the mask back and forth in a plurality of stages with respect to the substrate via the mask clamp; the chuck provided on an apparatus main body; and the mask clamp And a rotation mechanism for rotating the expansion / contraction means in the horizontal direction.
[0013] また前記伸縮手段は、前記装置本体に設けた第 1伸縮手段と、前記第 1伸縮手段 に取り付けられるとともに、前記マスククランプを係合させた前記第 1伸縮手段と独立 に伸縮可能な第 2伸縮手段と、を有する特徴としている。 [0013] The expansion / contraction means is attached to the first expansion / contraction means provided in the apparatus main body and the first expansion / contraction means, and is extendable / contractible independently of the first expansion / contraction means engaged with the mask clamp. And a second expansion / contraction means.
発明の効果 The invention's effect
[0014] マスククランプの移動機構は、伸縮手段が多段に伸縮すると、これに接続したマス ククランプが多段に上下に移動する。すなわち、伸縮手段を第 1伸縮手段と第 2伸縮 手段とによって構成した場合、第 1伸縮手段および第 2伸縮手段の少なくとも 1つを 伸縮動作させると、この動作に伴ってマスククランプも上下に移動する。したがって各 伸縮手段の伸縮動作を独立に制御すると、マスククランプの移動量を 2段階に分割 することができる。
[0015] また第 1、第 2伸縮手段の伸縮動作は、エアシリンダ、油圧シリンダに設けられたシ リンダロッドを伸縮させることにより行うことができる。 In the mask clamp moving mechanism, when the expansion / contraction means expands and contracts in multiple stages, the mask clamp connected thereto moves up and down in multiple stages. That is, when the expansion / contraction means is composed of the first expansion / contraction means and the second expansion / contraction means, when at least one of the first expansion / contraction means and the second expansion / contraction means is expanded / contracted, the mask clamp moves up and down in accordance with this operation. To do. Therefore, if the expansion / contraction operation of each expansion / contraction means is controlled independently, the movement amount of the mask clamp can be divided into two stages. [0015] The expansion and contraction of the first and second expansion / contraction means can be performed by expanding and contracting a cylinder rod provided in the air cylinder and the hydraulic cylinder.
そして有機 EL素子の製造時にぉ 、て、マスクと基板との位置決め中に第 2伸縮手 段を縮めた状態で第 1伸縮手段を伸ばし、前記位置決め終了後に第 1伸縮手段およ び第 2伸縮手段を伸ばすと、位置決め終了後のマスククランプの移動量が短くなるの で、有機 EL素子の製造時間を短縮できる。 During the manufacturing of the organic EL element, the first expansion / contraction means is extended with the second expansion / contraction means contracted during the positioning of the mask and the substrate, and after the positioning is completed, the first expansion / contraction means and the second expansion / contraction means are expanded. Extending the means shortens the amount of movement of the mask clamp after positioning is completed, thereby shortening the manufacturing time of the organic EL element.
図面の簡単な説明 Brief Description of Drawings
[0016] [図 1]真空蒸着装置の説明図である。 FIG. 1 is an explanatory diagram of a vacuum vapor deposition apparatus.
[図 2]マスククランプの概略平面図である。 FIG. 2 is a schematic plan view of a mask clamp.
[図 3]装置上部機構が基準位置にあるときの説明図である。 FIG. 3 is an explanatory diagram when the apparatus upper mechanism is in a reference position.
[図 4]ガラス基板とマスクとを位置合わせしているときの、装置上部機構の説明図であ る。 FIG. 4 is an explanatory diagram of the upper mechanism of the apparatus when the glass substrate and the mask are aligned.
[図 5]ガラス基板とマスクとを位置合わせした後の、装置上部機構の説明図である。 FIG. 5 is an explanatory view of the upper mechanism of the apparatus after aligning the glass substrate and the mask.
[図 6]ガラス基板とマスクとの位置合わせの説明図である。 FIG. 6 is an explanatory diagram of alignment between a glass substrate and a mask.
[図 7]カメラの配設位置を説明する図である。 FIG. 7 is a diagram for explaining a camera installation position.
[図 8]真空蒸着装置上部の説明図である。 FIG. 8 is an explanatory diagram of the upper part of the vacuum evaporation apparatus.
符号の説明 Explanation of symbols
[0017] 10 真空蒸着装置、 11 装置本体、 16 チャック、 18 基板ク ランプ、 20 第 1マスククランプ、 20c 接続部材、 22 伸縮手段、 2 [0017] 10 vacuum deposition apparatus, 11 apparatus main body, 16 chuck, 18 substrate clamp, 20 first mask clamp, 20c connecting member, 22 expansion / contraction means, 2
3 板部材、 24 第 1伸縮手段、 26 第 2伸縮手段、 28 第 2 マスククランプ、 32 ガラス基板、 34 マスク、 40 カメラ。 3 plate members, 24 first expansion / contraction means, 26 second expansion / contraction means, 28 second mask clamp, 32 glass substrate, 34 mask, 40 camera.
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
[0018] 以下に、本発明に係るマスククランプの移動機構および成膜装置の最良の実施形 態について説明する。なお以下では、成膜装置として真空蒸着装置を用いた形態に ついて説明する。 [0018] The best mode of the mask clamp moving mechanism and film forming apparatus according to the present invention will be described below. In the following description, a mode in which a vacuum deposition apparatus is used as the film forming apparatus will be described.
[0019] 図 1は実施形態に係る真空蒸着装置の説明図である。図 2は実施形態に係るマス ククランプの概略平面図である。これらの図において、真空蒸着装置 10は、装置本 体 11の底部に有機材料 12の蒸発源 14 (昇華源)を備えるとともに、装置本体 11の
上部にチャック 16、基板クランプ 18、第 1マスククランプ 20、伸縮手段 22および第 2 マスククランプ 28等を備えた構成である。 FIG. 1 is an explanatory diagram of a vacuum vapor deposition apparatus according to an embodiment. FIG. 2 is a schematic plan view of the mask clamp according to the embodiment. In these drawings, the vacuum deposition apparatus 10 includes an evaporation source 14 (sublimation source) of the organic material 12 at the bottom of the apparatus main body 11, and The chuck 16, the substrate clamp 18, the first mask clamp 20, the expansion / contraction means 22, the second mask clamp 28 and the like are provided on the upper part.
[0020] 具体的には、有機材料 12の蒸発源 14は、有機材料 12が入れられるるつぼ 14aを 備えており、るつぼ 14aの外面に有機材料 12を加熱'蒸発 (昇華)させるヒーター 14b が設けられている。また装置本体 11の内側上部に設けられたチャック 16は、るつぼ 1 4aに対面して配設されており、水平方向に沿って配置された平板である。そしてチヤ ック 16は、るつぼ 14aとの対面部にてガラス基板 32を保持する。また、チャック 16は 、装置本体 11の外側上部に設けられた回転機構 30によって水平回転可能となって いる。 [0020] Specifically, the evaporation source 14 of the organic material 12 includes a crucible 14a into which the organic material 12 is placed, and a heater 14b for heating and evaporating (sublimating) the organic material 12 is provided on the outer surface of the crucible 14a. It has been. Further, the chuck 16 provided on the inner upper portion of the apparatus main body 11 is disposed so as to face the crucible 14a, and is a flat plate disposed along the horizontal direction. The chuck 16 holds the glass substrate 32 at the part facing the crucible 14a. Further, the chuck 16 can be horizontally rotated by a rotation mechanism 30 provided on the outer upper portion of the apparatus main body 11.
[0021] 基板クランプ 18は、下端が装置本体 11の天井部を貫通して装置本体 11内に挿入 され、下方の先端部 18aがチャック 16側 (真空蒸着装置 10の中央側)に向けて折り 曲げられた鉤型であり、チャック 16の側縁に沿って複数個が配設されている。これら の基板クランプ 18は、その先端部 18a (折曲げ部)でガラス基板 32の縁部を支えるた めに、各先端部 18aが同じ高さ(同一面内)になるように設定されている。また基板ク ランプ 18は、装置本体 11の外側上部に設けられた昇降機構 (不図示)によって、各 先端部 18aが同一面内にある状態を維持しつつ昇降可能になっている。そして基板 クランプ 18が上昇することによって、ガラス基板 32をチャック 16に接触させて、平面 状に装着保持させることが可能になっている。 [0021] The lower end of the substrate clamp 18 passes through the ceiling of the apparatus main body 11 and is inserted into the apparatus main body 11. The lower end 18a of the substrate clamp 18 is folded toward the chuck 16 side (the central side of the vacuum deposition apparatus 10). A plurality of bent bowls are provided along the side edge of the chuck 16. These substrate clamps 18 are set so that each tip 18a has the same height (in the same plane) in order to support the edge of the glass substrate 32 with the tip 18a (folded portion). . The substrate clamp 18 can be moved up and down by an elevating mechanism (not shown) provided on the outer upper portion of the apparatus body 11 while maintaining the state in which the tip portions 18a are in the same plane. When the substrate clamp 18 is raised, the glass substrate 32 can be brought into contact with the chuck 16 and mounted and held in a flat shape.
[0022] 第 1マスククランプ 20は、下端が装置本体 11の天井部を貫通して装置本体 11内に 挿入され、下方の先端部 20aがチャック 16側 (真空蒸着装置 10の中央側)に向けて 折り曲げられた鉤型であり、チャック 16の側縁に沿って複数個が配設されている。こ の第 1マスククランプ 20は、下方の先端部 20a (折曲げ部)でマスク 34の縁部を支え るために、下方の各先端部 20aが同じ高さ(同一面内)になるように設定されて!、る。 なおマスク 34は、有機 EL素子の各画素に対応する開口パターンが複数設けられた マスクフィルム 34aと、マスクフィルム 34aの周縁部を保持する枠型のマスクフレーム 3 4bとを備えている(図 2参照)。 [0022] The lower end of the first mask clamp 20 passes through the ceiling of the apparatus main body 11 and is inserted into the apparatus main body 11, and the lower end 20a is directed toward the chuck 16 (center side of the vacuum evaporation apparatus 10). A plurality of bowls are bent along the side edges of the chuck 16. The first mask clamp 20 supports the edge of the mask 34 with the lower tip 20a (folded portion) so that the lower tips 20a are at the same height (in the same plane). It is set! The mask 34 includes a mask film 34a in which a plurality of opening patterns corresponding to each pixel of the organic EL element are provided, and a frame-type mask frame 34b that holds the periphery of the mask film 34a (FIG. 2). reference).
[0023] また第 1マスククランプ 20の上部先端部 20bは、装置本体 11の外部に突設されて おり、上方の各先端部 20bが接続部材 20cに連結してある。そして上方の先端部 20
bと接続部材 20cとが、第 1マスククランプ 20の基端部となる。この接続部材 20cを上 下移動させることによって、接続部材 20cに接続されている各第 1マスククランプ 20が 上下移動される。これにより第 1マスククランプ 20の下方に設けられた各先端部 20a が同一面内にある状態を維持しつつ昇降可能になっている。 [0023] The upper tip portion 20b of the first mask clamp 20 protrudes outside the apparatus main body 11, and each upper tip portion 20b is connected to the connection member 20c. And the upper tip 20 b and the connection member 20c serve as a base end portion of the first mask clamp 20. By moving the connecting member 20c up and down, the first mask clamps 20 connected to the connecting member 20c are moved up and down. Accordingly, the tip portions 20a provided below the first mask clamp 20 can be moved up and down while maintaining a state where they are in the same plane.
[0024] さらに接続部材 20cの下方には、接続部材 20cを昇降させる伸縮手段 22が設けら れている。すなわち接続部材 20cと伸縮手段 22とは、対向して配置されている。この 伸縮手段 22は、実施形態の場合、第 1伸縮手段 24および第 2伸縮手段 26を備えて いる。第 1伸縮手段 24および第 2伸縮手段 26は、例えばエアシリンダや油圧シリンダ 等のァクチユエータであればよい。なおエアシリンダを用いると、メンテナンスが容易 である。第 1伸縮手段 24は、実施形態の場合複数配設してあり、各チューブの下端 が装置本体 11の上部に接続されており、上端となるロッドの先端 24aが板部材 23に 接続されている。より具体的には、複数の第 1伸縮手段 24 (シリンダ本体)がチャック 1 6の回転方向に沿って装置本体 11の外側上部に配設されており、各ロッドの先端 24 aを板部材 23で接続した構成である。そして第 1伸縮手段 24の伸縮動作に伴って、 板部材 23が上下に移動される。 [0024] Further, below the connection member 20c, expansion / contraction means 22 for raising and lowering the connection member 20c is provided. In other words, the connecting member 20c and the expansion / contraction means 22 are arranged to face each other. In the embodiment, the expansion / contraction means 22 includes a first expansion / contraction means 24 and a second expansion / contraction means 26. The first expansion / contraction means 24 and the second expansion / contraction means 26 may be an actuator such as an air cylinder or a hydraulic cylinder. If an air cylinder is used, maintenance is easy. In the embodiment, a plurality of first expansion / contraction means 24 are provided, the lower end of each tube is connected to the upper part of the apparatus main body 11, and the tip 24a of the rod serving as the upper end is connected to the plate member 23. . More specifically, a plurality of first expansion / contraction means 24 (cylinder main body) are disposed on the outer upper portion of the apparatus main body 11 along the rotation direction of the chuck 16, and the tip 24 a of each rod is connected to the plate member 23. It is the structure connected by. The plate member 23 is moved up and down as the first expansion / contraction means 24 expands and contracts.
[0025] この板部材 23には、板部材 23の下端に設けたブラケットを介して第 2伸縮手段 26 が配設されている。第 2伸縮手段 26は、ロッド 26aが板部材 23を貫通し、ロッド 26aの 先端が接続部材 20cに係合、すなわち接続または接触している。より具体的には、複 数の第 2伸縮手段 26 (シリンダ本体)は、板部材 23の下側に配設されており、ロッド 2 6a (第 2ロッド)が板部材 23に設けられた孔部 (不図示)を介して上方に延びており、 その先端部が接続部材 20cに接続または接触している。そして第 2伸縮手段 26およ び第 1伸縮手段 24は、相互に独立して伸縮可能になっており、少なくとも一方の伸 縮動作に伴って、接続部材 20cが上下に移動される。 The plate member 23 is provided with second expansion / contraction means 26 via a bracket provided at the lower end of the plate member 23. In the second expansion / contraction means 26, the rod 26a penetrates the plate member 23, and the tip of the rod 26a is engaged, that is, connected or in contact with the connection member 20c. More specifically, the plurality of second expansion / contraction means 26 (cylinder main body) are arranged below the plate member 23, and the rod 26a (second rod) is provided in the hole provided in the plate member 23. It extends upward via a portion (not shown), and its tip is connected to or in contact with the connecting member 20c. The second expansion / contraction means 26 and the first expansion / contraction means 24 can expand and contract independently of each other, and the connecting member 20c is moved up and down in accordance with at least one expansion / contraction operation.
[0026] そして基板クランプ 18、第 1マスククランプ 20および伸縮手段 22は、装置本体 11 の外側上部に設けられた回転機構 30によって、チャック 16とともに回転することが可 會 こなっている。 The substrate clamp 18, the first mask clamp 20, and the expansion / contraction means 22 can be rotated together with the chuck 16 by a rotation mechanism 30 provided on the outer upper portion of the apparatus main body 11.
[0027] 第 2マスククランプ 28は、チャック 16と蒸発源 14との間において、下部が内側に折 り曲げられて.チャック 16に対面するよう配設されており、その構成はマスク 34の縁
部(マスクフレーム 34b)に対応して前記マスク 34の側方から延設された延設部 28a と、この延設部 28aの先端部に設けられた嵌合ピン 28bとを有するものである。より具 体的には、延設部 28aは、マスク 34の縁部を支えるものであり、チャック 16の側縁に 沿って第 1マスククランプ 20を挟み込む位置に配設され、且つ鉤型に形成された第 1 マスククランプ 20の先端部に沿ってマスク 34の外側力 マスク 34の縁部まで延ばさ れている。この延設部 28aの先端部には、マスク 34の嵌合穴 34cと嵌め合わされる嵌 合ピン 28bが設けられている。なお実施形態によっては、延設部 28aの先端部に嵌 合穴が設けられ、マスク 34に嵌合ピンが設けられた形態であってもよい。また一方の 第 1マスククランプ 20を両側力も挟み込むように配設された各延設部 28aの基端部は それぞれ接続されている。なお図 2に示す形態では、延設部 28aは、マスク 34の各 角部を支えるようにマスク 34の外側カゝら延設されて ヽる。そして第 2マスククランプ 28 は、真空蒸着装置 10に対する基準位置にあるので、嵌合穴 34cと嵌合ピン 28bとが 嵌め合うようにマスク 34を第 2マスククランプ 28上に載せると、マスク 34は真空蒸着 装置 10に対して位置決めされる。 [0027] The second mask clamp 28 is disposed between the chuck 16 and the evaporation source 14 so that the lower part thereof is bent inward so as to face the chuck 16, and the configuration of the second mask clamp 28 is the edge of the mask 34. Corresponding to the portion (mask frame 34b), it has an extending portion 28a extending from the side of the mask 34, and a fitting pin 28b provided at the tip of the extending portion 28a. More specifically, the extended portion 28a supports the edge of the mask 34, is disposed at a position where the first mask clamp 20 is sandwiched along the side edge of the chuck 16, and is formed in a bowl shape. The outer force of the mask 34 extends to the edge of the mask 34 along the tip of the first mask clamp 20 thus formed. A fitting pin 28b that fits into the fitting hole 34c of the mask 34 is provided at the tip of the extended portion 28a. In some embodiments, a fitting hole may be provided at the tip of the extended portion 28a, and a fitting pin may be provided on the mask 34. Further, the base end portions of the extending portions 28a disposed so as to sandwich the first mask clamp 20 on both sides are connected to each other. In the form shown in FIG. 2, the extended portion 28a extends from the outer cover of the mask 34 so as to support each corner portion of the mask 34. Since the second mask clamp 28 is at the reference position with respect to the vacuum deposition apparatus 10, when the mask 34 is placed on the second mask clamp 28 so that the fitting hole 34c and the fitting pin 28b are fitted, the mask 34 is Positioned relative to the vacuum deposition apparatus 10.
[0028] 次に、第 1マスククランプ 20の移動機構の動作および真空蒸着装置 10の動作につ いて説明する。なお以下では、チャック 16、基板クランプ 18、第 1マスククランプ 20お よび第 2マスククランプ 28を装置上部機構という場合がある。図 3は装置上部機構が 基準位置にあるときの説明図である。図 4はガラス基板とマスクとを位置合わせしてい るときの、装置上部機構の説明図である。図 5はガラス基板とマスクとを位置合わせし た後の、装置上部機構の説明図である。 Next, the operation of the moving mechanism of the first mask clamp 20 and the operation of the vacuum evaporation apparatus 10 will be described. Hereinafter, the chuck 16, the substrate clamp 18, the first mask clamp 20, and the second mask clamp 28 may be referred to as an apparatus upper mechanism. FIG. 3 is an explanatory diagram when the upper mechanism of the apparatus is at the reference position. FIG. 4 is an explanatory view of the upper mechanism of the apparatus when the glass substrate and the mask are aligned. FIG. 5 is an explanatory view of the upper mechanism of the apparatus after aligning the glass substrate and the mask.
[0029] 第 2マスククランプ 28上には、予めマスク 34が配設されている。このとき第 2マスクク ランプ 28は真空蒸着装置 10に対する基準位置にあるので、嵌合ピン 28bと嵌合穴 3 4cとが嵌め合うようにマスク 34が載せられると、マスク 34は真空蒸着装置 10に対して 位置決めされる。そしてガラス基板 32は、前記基板搬送機構によって装置本体 11の 内部に入れられ、チャック 16とマスク 34との間に挿入される。そしてガラス基板 32は 、前記基板搬送機構の下降動作とともに下方へ移動されて、基板クランプ 18上に載 せられる。 A mask 34 is disposed on the second mask clamp 28 in advance. At this time, since the second mask clamp 28 is in the reference position with respect to the vacuum deposition apparatus 10, when the mask 34 is placed so that the fitting pin 28b and the fitting hole 34c are fitted, the mask 34 is placed on the vacuum deposition apparatus 10. Positioned against. The glass substrate 32 is placed inside the apparatus main body 11 by the substrate transport mechanism and inserted between the chuck 16 and the mask 34. Then, the glass substrate 32 is moved downward along with the lowering operation of the substrate transport mechanism and placed on the substrate clamp 18.
[0030] この後、第 2マスククランプ 28を上昇させることによりマスク 34を上方に移動させ、マ
スク 34上にガラス基板 32を載せる。そして第 2マスククランプ 28は、ガラス基板 32が チャック 16の底面 (チャック面)に接触するまで上昇され続ける。なおガラス基板 32は 、マスク 34上に載せられるとマスク 34に沿って水平になり、この水平状態を維持しつ つチャック 16に当接される。 [0030] Thereafter, the mask 34 is moved upward by raising the second mask clamp 28, and the mask 34 is moved upward. A glass substrate 32 is placed on the disc 34. The second mask clamp 28 continues to be raised until the glass substrate 32 contacts the bottom surface (chuck surface) of the chuck 16. When the glass substrate 32 is placed on the mask 34, the glass substrate 32 becomes horizontal along the mask 34, and is kept in contact with the chuck 16 while maintaining this horizontal state.
[0031] この後、基板クランプ 18をガラス基板 32に接触するまで上昇させる。これによりガラ ス基板 32は、基板クランプ 18により水平状態を維持しつつチャック 16に装着保持さ れる。そして第 2マスククランプ 28を下降させて、マスク 34を下方に移動させる。なお 、上記動作の間は、第 1伸縮手段 24および第 2伸縮手段 26は縮められているので、 第 1マスククランプ 20の下方の先端部 20aがマスク 34や前記基板搬送機構と接触す ることはない。 Thereafter, the substrate clamp 18 is raised until it contacts the glass substrate 32. Thus, the glass substrate 32 is mounted and held on the chuck 16 while maintaining the horizontal state by the substrate clamp 18. Then, the second mask clamp 28 is lowered and the mask 34 is moved downward. During the above operation, since the first expansion / contraction means 24 and the second expansion / contraction means 26 are contracted, the lower end portion 20a of the first mask clamp 20 is in contact with the mask 34 and the substrate transport mechanism. There is no.
[0032] この後、ガラス基板 32に設けられたァライメントマークと、マスク 34に設けられたァラ ィメントマークとを用いて、ガラス基板 32とマスク 34との位置合わせが行われる。図 6 はガラス基板とマスクとの位置合わせの説明図である。そして図 6 (A)はカメラ、ガラ ス基板およびマスクの配置を説明する図である。また図 6 (B)はカメラで撮像された画 像であって、位置ズレが生じている場合を示す図である。さら〖こ図 6 (C)はカメラで撮 像された画像であって、位置が合って 、る場合を示す図である。 Thereafter, the alignment between the glass substrate 32 and the mask 34 is performed using the alignment mark provided on the glass substrate 32 and the alignment mark provided on the mask 34. Fig. 6 is an explanatory diagram of alignment between the glass substrate and the mask. FIG. 6A is a diagram for explaining the arrangement of the camera, the glass substrate, and the mask. FIG. 6B is an image taken by a camera and shows a case where a positional deviation has occurred. Furthermore, Fig. 6 (C) is an image taken by a camera and shows a case where the positions are correct.
[0033] 具体的には、ガラス基板 32には、少なくとも 2箇所にァライメントマーク 42が設けら れている。ガラス基板 32に設けられたァライメントマーク 42は、例えばガラス基板 32 の対角する角部に設けられ、ガラス基板 32に有機 EL素子の電極膜を形成するのと 同時に、この電極と同じ材料で形成されればよい。そしてガラス基板 32に設けられる ァライメントマーク 42の形状は、例えば丸や点若しくは十字形等であればよ!、。 Specifically, the glass substrate 32 is provided with alignment marks 42 in at least two places. The alignment mark 42 provided on the glass substrate 32 is provided, for example, at the opposite corner of the glass substrate 32. At the same time as forming the electrode film of the organic EL element on the glass substrate 32, the alignment mark 42 is made of the same material as this electrode. It may be formed. The shape of the alignment mark 42 provided on the glass substrate 32 may be, for example, a circle, a dot or a cross!
[0034] またマスク 34に設けられたァライメントマーク 44は、ガラス基板 32に設けられたァラ ィメントマーク 42に対応した位置に設けられればよぐその形状は点や丸若しくは十 字形等であればょ 、。なおガラス基板 32のァライメントマーク 42を丸とした場合は 、マスク 34のァライメントマーク 44を点にすればよぐガラス基板 32のァライメントマ一 ク 42を点とした場合は、マスク 34のァライメントマーク 44を大きさの異なる丸若しくは 異なる形状にすればよい。 In addition, the alignment mark 44 provided on the mask 34 may be a dot, a circle, or a cross, as long as it is provided at a position corresponding to the alignment mark 42 provided on the glass substrate 32. If there is. If the alignment mark 42 on the glass substrate 32 is rounded, the alignment mark 44 on the mask 34 should be set as a dot. If the alignment mark 42 on the glass substrate 32 is set as a dot, the alignment on the mask 34 is set. The mark 44 may be a circle with a different size or a different shape.
[0035] さらに真空蒸着装置 10には、ガラス基板 32に設けられたァライメントマーク 42と、
マスク 34に設けられたァライメントマーク 44とを撮像するカメラ 40を設けておけばよ い(図 6 (A)参照)。 Furthermore, the vacuum deposition apparatus 10 includes an alignment mark 42 provided on the glass substrate 32, A camera 40 for imaging the alignment mark 44 provided on the mask 34 may be provided (see FIG. 6A).
[0036] そしてカメラ 40で撮像された画像を確認しつつ、ァライメントマーク 42 (44)の円の 中に、ァライメントマーク 44 (42)の点が入るようにマスク 34 (第 2マスククランプ 28)の X(縦), Y (横), Θ (回転)方向を調整すれば、ガラス基板 32とマスク 34との位置合 わせが終了する(図 6 (B) , (C)参照)。なおガラス基板 32とマスク 34との位置合わせ 時は、マスク 34が真空蒸着装置 10に対して位置決めされているので、マスク 34のァ ライメントマーク 44が確実にカメラ 40の視野内に入る。 [0036] Then, while confirming the image captured by the camera 40, the mask 34 (second mask clamp 28) is arranged so that the dot of the alignment mark 44 (42) enters the circle of the alignment mark 42 (44). If the X (vertical), Y (horizontal), and Θ (rotation) directions are adjusted, the alignment between the glass substrate 32 and the mask 34 is completed (see FIGS. 6B and 6C). At the time of alignment between the glass substrate 32 and the mask 34, the mask 34 is positioned with respect to the vacuum deposition apparatus 10, so that the alignment mark 44 of the mask 34 surely enters the field of view of the camera 40.
[0037] このようなマスク 34とガラス基板 32との位置決めが行われている間に第 1伸縮手段 24を伸ばして、第 1マスククランプ 20を上昇させる(図 4参照)。これにより第 1マスクク ランプ 20の下方の先端部が上昇する。そして第 1伸縮手段 24を伸ばしたときの下方 の先端部は、位置決め動作が行われているマスク 34よりも下方にある。 While the mask 34 and the glass substrate 32 are positioned as described above, the first expansion / contraction means 24 is extended to raise the first mask clamp 20 (see FIG. 4). As a result, the lower end of the first mask clamp 20 is raised. The lower tip when the first expansion / contraction means 24 is extended is below the mask 34 on which the positioning operation is performed.
[0038] その後、第 2伸縮手段 26を伸ばして第 1マスククランプ 20を上昇させる(図 5参照)。 Thereafter, the second expansion / contraction means 26 is extended to raise the first mask clamp 20 (see FIG. 5).
具体的には、第 1マスククランプ 20の下方の先端部 20aを上昇させると、マスク 34が 第 2マスククランプ 28から第 1マスククランプ 20に載せ換えられ、さらに下方の先端部 20aを上昇させ続けると、マスク 34がガラス基板 32に被せられる。そしてマスク 34が ガラス基板 32に被せられると、下方の先端部 20aの上昇、すなわち第 2伸縮手段 26 の伸びが止まる。なお第 2伸縮手段 26を伸ばしたときの下方の先端部 20aの動作上 限位置は、マスク 34をガラス基板 32に被せたときのチャック 16面からマスク 34下面 までの距離よりも少し (少なくとも数 mm)上方に位置させればょ 、。 Specifically, when the lower tip 20a of the first mask clamp 20 is raised, the mask 34 is transferred from the second mask clamp 28 to the first mask clamp 20, and the lower tip 20a is further raised. Then, the mask 34 is put on the glass substrate 32. When the mask 34 is placed on the glass substrate 32, the lower tip 20a rises, that is, the second expansion / contraction means 26 stops. Note that the upper limit position of the lower end portion 20a when the second expansion / contraction means 26 is extended is slightly smaller than the distance from the chuck 16 surface to the lower surface of the mask 34 when the mask 34 is placed on the glass substrate 32 (at least several mm) If it is located above.
[0039] この後、回転機構 30の動作によってガラス基板 32やマスク 34を回転させるとともに 、ヒーター 14bによって有機材料 12を加熱'蒸発させて、ガラス基板 32上に有機 EL 素子のパターンを形成する。 Thereafter, the glass substrate 32 and the mask 34 are rotated by the operation of the rotating mechanism 30, and the organic material 12 is heated and evaporated by the heater 14 b to form an organic EL element pattern on the glass substrate 32.
[0040] この後、第 1伸縮手段 24および第 2伸縮手段 26を縮めて、第 1マスククランプ 20を 下降させる。このときマスク 34は、第 1マスククランプ 20の下降とともに下方へ移動さ れるが、第 1マスククランプ 20からチャック 16の下方にある第 2マスククランプ 28へ移 動の途中で載せかえられる。また基板クランプ 18も下降して、ガラス基板 32を下方へ 移動させる。この後、装置本体 11に前記基板搬送装置が入り、ガラス基板 32を回収
する。このような動作により有機 EL素子が製造される。 Thereafter, the first expansion / contraction means 24 and the second expansion / contraction means 26 are contracted, and the first mask clamp 20 is lowered. At this time, the mask 34 is moved downward along with the lowering of the first mask clamp 20, but is replaced on the way from the first mask clamp 20 to the second mask clamp 28 below the chuck 16. The substrate clamp 18 is also lowered, and the glass substrate 32 is moved downward. After that, the substrate transfer device enters the apparatus body 11 and collects the glass substrate 32. To do. An organic EL element is manufactured by such an operation.
[0041] このような第 1マスククランプ 20の移動機構および真空蒸着装置 10によれば、第 1 マスククランプ 20を上下に移動させる伸縮手段 22として第 1伸縮手段 24および第 2 伸縮手段 26を設けたので、それぞれを独立に伸縮させることにより、第 1マスククラン プ 20は 2段階の上下移動が可能になる。すなわち第 1マスククランプ 20の移動量を 2 段階に分割することができる。したがって、マスク 34とガラス基板 32との位置合わせ 中に第 1マスククランプ 20を 1段階上昇させて、マスク 34と第 1マスククランプ 20の下 方の先端部との距離を僅かにあけておき、位置合わせ終了後に第 1マスククランプ 2 0をもう 1段上昇させてマスク 34をガラス基板 32に被せると、位置合わせ終了後の第 1マスククランプ 20の移動距離を短くすることができる。よってマスク 34とガラス基板 3 2との位置合わせと、第 1マスククランプ 20の上昇とが同時に行われるので、有機 EL 素子の製造時間を短縮することができ、製造スピードを向上させることができる。そし て有機 EL素子の製造効率を向上させることができる。 [0041] According to such a moving mechanism of the first mask clamp 20 and the vacuum deposition apparatus 10, the first expansion / contraction means 24 and the second expansion / contraction means 26 are provided as the expansion / contraction means 22 for moving the first mask clamp 20 up and down. Therefore, the first mask clamp 20 can be moved up and down in two stages by extending and contracting each independently. That is, the movement amount of the first mask clamp 20 can be divided into two stages. Therefore, during the alignment of the mask 34 and the glass substrate 32, the first mask clamp 20 is raised by one step, and the distance between the mask 34 and the lower tip of the first mask clamp 20 is slightly increased, When the first mask clamp 20 is moved up one more stage after the alignment is completed and the mask 34 is put on the glass substrate 32, the moving distance of the first mask clamp 20 after the alignment can be shortened. Therefore, since the alignment of the mask 34 and the glass substrate 32 and the raising of the first mask clamp 20 are performed at the same time, the manufacturing time of the organic EL element can be shortened and the manufacturing speed can be improved. In addition, the manufacturing efficiency of organic EL elements can be improved.
[0042] また伸縮手段 22は、第 1伸縮手段 24の他端 24aに板部材 23を接続し、この板部 材 23に第 2伸縮手段 26を配設した構成なので、装置本体 11に設けられた各機構( 前記装置上部機構)等を駆動させるための配線等と干渉することがない。したがって 第 1伸縮手段 24および第 2伸縮手段 26によって、回転機構 30の軸上において第 1 マスククランプ 20を 2段階に分割して昇降させることができる。 The expansion / contraction means 22 has a configuration in which a plate member 23 is connected to the other end 24a of the first expansion / contraction means 24, and the second expansion / contraction means 26 is disposed on the plate member 23. In addition, there is no interference with wiring for driving each mechanism (the device upper mechanism) and the like. Therefore, the first masking means 24 and the second expanding / contracting means 26 can lift and lower the first mask clamp 20 in two stages on the axis of the rotating mechanism 30.
[0043] なお第 1マスククランプ 20は、ガラス基板 32の挿入や回収、マスク 34の交換のとき には第 1伸縮手段 24および第 2伸縮手段 26を縮めておいて最下点まで下げられて いればよぐこれ以外のときには第 1伸縮手段 24を伸ばした状態で第 2伸縮手段 26 を伸縮させて上下に移動されればよい。 [0043] The first mask clamp 20 is lowered to the lowest point by retracting the first expansion means 24 and the second expansion means 26 when the glass substrate 32 is inserted and recovered and the mask 34 is replaced. In other cases, the second expansion / contraction means 26 may be expanded and contracted while the first expansion / contraction means 24 is extended, and moved up and down.
[0044] また本実施形態では、板部材 23を介して第 1伸縮手段 24および第 2伸縮手段 26 を上下に接続した構成であるが、他の実施形態として第 2伸縮手段 26の他端 26aに さらに板部材を接続して、この板部材に第 3伸縮手段を配設し、第 3伸縮手段の他端 を接続部材 20cに係合 (接続または接触)させた構成にしてもよ!ヽ。すなわち板部材 を介して第 1伸縮手段、第 2伸縮手段および第 3伸縮手段を上下に接続し、第 1マス ククランプ 20を 3段階に分割して昇降させることもできる。さらに板部材を介して伸縮
手段を複数上下に接続する構成を繰り返せば、第 1マスククランプ 20を複数段階に 分割して昇降させることができる。そして、前記実施形態においては、第 1マスククラ ンプ 20を昇降する伸縮手段として第 1伸縮手段 24と第 2伸縮手段 26とにより構成し た場合にっ 、て説明した力 油圧または液圧の多段シリンダを用いてもよ!ヽ。 In the present embodiment, the first expansion / contraction means 24 and the second expansion / contraction means 26 are connected vertically via the plate member 23. However, as another embodiment, the other end 26a of the second expansion / contraction means 26 is used. Further, a plate member may be connected to the plate member, the third expansion / contraction means may be disposed on the plate member, and the other end of the third expansion / contraction means may be engaged (connected or contacted) with the connection member 20c. . That is, the first expansion / contraction means, the second expansion / contraction means, and the third expansion / contraction means can be connected vertically via the plate member, and the first mask clamp 20 can be moved up and down in three stages. Further expansion and contraction via plate members By repeating a configuration in which a plurality of means are connected vertically, the first mask clamp 20 can be lifted and lowered in a plurality of stages. In the above-described embodiment, when the first mask clamp 20 is configured by the first expansion / contraction means 24 and the second expansion / contraction means 26 as the expansion / contraction means for moving up and down, the multistage cylinder of the hydraulic pressure or hydraulic pressure described above is used. You can use!
[0045] また本実施形態では、ガラス基板とマスクとの位置合わせを行うカメラが 2つ設けら れた形態である力 これに限定されることはない。すなわちカメラは、図 7 (A)に示す ように 3個設けることもでき、図 7 (B)に示すように 4個設けることもできる。 In the present embodiment, the force is a form in which two cameras for aligning the glass substrate and the mask are provided. The present invention is not limited to this. That is, three cameras can be provided as shown in FIG. 7 (A), and four cameras can be provided as shown in FIG. 7 (B).
[0046] また本実施形態では、マスクの移動機構が真空蒸着装置 10に用いられている形成 を説明したが、マスクの移動機構は真空蒸着装置 10に用いられるば力りでなぐスパ ッタ装置や気相成長装置等の他の成膜装置に用いられることもできる。また基板は、 ガラス基板 32に限定されることはなぐガラス以外の材料力もなる基板であってもよ!/ヽ 産業上の利用可能性 Further, in the present embodiment, the formation in which the mask moving mechanism is used in the vacuum vapor deposition apparatus 10 has been described. It can also be used for other film forming apparatuses such as a vapor phase growth apparatus. Also, the substrate may be a substrate with material strength other than glass, not limited to the glass substrate 32! / ヽ Industrial Applicability
[0047] 本発明は、ガラスや半導体などの基板に蒸着やスパッタリングにより薄膜を形成す る成膜装置等に適用することができる。
The present invention can be applied to a film forming apparatus that forms a thin film on a substrate such as glass or semiconductor by vapor deposition or sputtering.
Claims
[1] 有機 EL素子が形成される基板の前面に配置されるマスクを、前記基板に対して進 退させることが可能なマスククランプの移動機構であって、 [1] A mask clamp moving mechanism capable of moving a mask arranged in front of a substrate on which an organic EL element is formed with respect to the substrate,
前記移動機構は、前記マスクを保持させる前記マスククランプを複数段に移動でき る伸縮手段を備えていることを特徴とするマスククランプの移動機構。 The moving mechanism of the mask clamp, characterized in that the moving mechanism includes expansion / contraction means capable of moving the mask clamp holding the mask in a plurality of stages.
[2] 前記伸縮手段は、 [2] The expansion and contraction means is
前記基板に前記有機 EL素子の膜を成膜する成膜装置本体に設けた第 1伸縮手 段と、 A first telescopic means provided in a film forming apparatus body for forming a film of the organic EL element on the substrate;
前記第 1伸縮手段に取り付けられるとともに、前記マスククランプを係合させた第 2 伸縮手段と、 A second telescopic means attached to the first telescopic means and engaged with the mask clamp;
を有することを特徴とする請求項 1に記載のマスククランプの移動機構。 The mask clamp moving mechanism according to claim 1, further comprising:
[3] 前記第 1伸縮手段と前記第 2伸縮手段とは、相互に独立して伸縮可能であることを 特徴とする請求項 2に記載のマスククランプの移動手段。 3. The mask clamp moving means according to claim 2, wherein the first extending / contracting means and the second extending / contracting means can be extended / contracted independently of each other.
[4] 前記第 1伸縮手段、前記第 2伸縮手段は、エアシリンダまたは油圧シリンダであるこ とを特徴とする請求項 2または 3に記載のマスククランプの移動機構。 4. The mask clamp moving mechanism according to claim 2 or 3, wherein the first expansion / contraction means and the second expansion / contraction means are air cylinders or hydraulic cylinders.
[5] 前記伸縮手段は、多段シリンダであることを特徴とする請求項 1に記載のマスククラ ンプの移動機構。 5. The mask clamp moving mechanism according to claim 1, wherein the expansion / contraction means is a multistage cylinder.
[6] 基板に有機 EL素子を製造するための成膜装置であって、 [6] A film forming apparatus for manufacturing an organic EL element on a substrate,
有機材料の供給源に対向して前記基板を保持するチャックと、 A chuck for holding the substrate against a source of organic material;
前記有機 EL素子のパターンが形成されたマスクの保持するマスククランプと、 前記マスククランプを介して前記マスクを前記基板に対して複数段に進退させる伸 縮手段と、 A mask clamp held by a mask on which the pattern of the organic EL element is formed; and a stretching means for moving the mask forward and backward with respect to the substrate through the mask clamp;
装置本体に設けられて前記チャック、前記マスククランプおよび前記伸縮手段を水 平方向に回転させる回転機構と、 A rotation mechanism provided in the apparatus main body for rotating the chuck, the mask clamp and the expansion / contraction means in a horizontal direction;
を有することを特徴とする成膜装置。 A film forming apparatus comprising:
[7] 前記伸縮手段は、 [7] The expansion and contraction means includes
前記装置本体に設けた第 1伸縮手段と、 A first expansion / contraction means provided in the apparatus body;
前記第 1伸縮手段に取り付けられるとともに、前記マスククランプを係合させた前記
1伸縮手段と独立に伸縮可能な第 2伸縮手段と、 を有することを特徴とする請求項 6に記載の成膜装置。
It is attached to the first expansion / contraction means and the mask clamp is engaged. 7. The film forming apparatus according to claim 6, further comprising: a first expansion / contraction means and a second expansion / contraction means that can expand and contract independently.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2006800015547A CN101090993B (en) | 2005-02-23 | 2006-02-22 | Mask clamp moving mechanism and film forming apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005047812A JP4609754B2 (en) | 2005-02-23 | 2005-02-23 | Mask clamp moving mechanism and film forming apparatus |
JP2005-047812 | 2005-02-23 |
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WO2006090746A1 true WO2006090746A1 (en) | 2006-08-31 |
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PCT/JP2006/303188 WO2006090746A1 (en) | 2005-02-23 | 2006-02-22 | Mask clamp moving mechanism and film forming apparatus |
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JP (1) | JP4609754B2 (en) |
KR (1) | KR100947572B1 (en) |
CN (1) | CN101090993B (en) |
TW (1) | TW200641549A (en) |
WO (1) | WO2006090746A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984135A (en) * | 2010-11-19 | 2011-03-09 | 光驰科技(上海)有限公司 | Film-forming substrate clamp and film-forming device thereof |
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KR101060652B1 (en) * | 2008-04-14 | 2011-08-31 | 엘아이지에이디피 주식회사 | Organic material deposition apparatus and deposition method using the same |
CN102686764B (en) * | 2009-12-28 | 2014-06-04 | 株式会社爱发科 | Film forming device and film forming method |
JP5783811B2 (en) | 2010-07-06 | 2015-09-24 | キヤノン株式会社 | Deposition equipment |
KR102046563B1 (en) * | 2012-12-13 | 2019-11-20 | 삼성디스플레이 주식회사 | Thin film depositing apparatus and the thin film depositing method using the same |
KR101570072B1 (en) * | 2013-08-30 | 2015-11-19 | 주식회사 에스에프에이 | Thin layers deposition apparatus |
KR102218644B1 (en) * | 2013-12-19 | 2021-02-23 | 삼성디스플레이 주식회사 | Depositing apparatus |
KR102141855B1 (en) * | 2014-03-31 | 2020-08-07 | 주식회사 선익시스템 | Mask align apparatus |
DE102016107524B4 (en) * | 2016-04-22 | 2019-11-14 | Carl Zeiss Smt Gmbh | Method for detecting the position of a mask holder on a measuring table |
CN105887033B (en) * | 2016-06-02 | 2018-10-23 | 京东方科技集团股份有限公司 | Chucking device and its working method, magnetic control sputtering device |
JP6262811B2 (en) * | 2016-07-08 | 2018-01-17 | キヤノントッキ株式会社 | Vacuum deposition system |
KR102405438B1 (en) * | 2018-06-25 | 2022-06-03 | 캐논 톡키 가부시키가이샤 | Mask position adjusting apparatus, film forming apparatus, mask position adjusting method, film forming method, and manufacturing method of electronic device |
KR102430361B1 (en) * | 2018-09-21 | 2022-08-05 | 캐논 톡키 가부시키가이샤 | Adsorption apparatus, apparatus for forming film, adsorption method, method for forming film, and manufacturing method of electronic device |
KR102257008B1 (en) * | 2019-01-11 | 2021-05-26 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method, and manufacturing method of electronic device |
CN109837509B (en) * | 2019-04-04 | 2024-03-01 | 江苏集萃有机光电技术研究所有限公司 | Substrate sample holder, coating equipment and control method |
CN110172667B (en) * | 2019-06-20 | 2021-06-01 | 深圳市华星光电半导体显示技术有限公司 | Clamping device applied to sputtering equipment and sputtering equipment |
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- 2006-02-22 WO PCT/JP2006/303188 patent/WO2006090746A1/en active Application Filing
- 2006-02-22 CN CN2006800015547A patent/CN101090993B/en not_active Expired - Fee Related
- 2006-02-22 KR KR1020077016159A patent/KR100947572B1/en not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
TWI323290B (en) | 2010-04-11 |
KR100947572B1 (en) | 2010-03-15 |
JP2006233256A (en) | 2006-09-07 |
CN101090993B (en) | 2010-12-01 |
JP4609754B2 (en) | 2011-01-12 |
CN101090993A (en) | 2007-12-19 |
KR20070087081A (en) | 2007-08-27 |
TW200641549A (en) | 2006-12-01 |
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