WO2002082549A1 - Semiconductor integrated circuit device and its manufacturing method - Google Patents
Semiconductor integrated circuit device and its manufacturing method Download PDFInfo
- Publication number
- WO2002082549A1 WO2002082549A1 PCT/JP2002/003172 JP0203172W WO02082549A1 WO 2002082549 A1 WO2002082549 A1 WO 2002082549A1 JP 0203172 W JP0203172 W JP 0203172W WO 02082549 A1 WO02082549 A1 WO 02082549A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor
- film
- integrated circuit
- semiconductor integrated
- circuit device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000003990 capacitor Substances 0.000 abstract 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 abstract 1
- 230000002411 adverse Effects 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/312—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with a bit line higher than the capacitor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
Landscapes
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
A semiconductor integrated circuit device in which the quality of a capacitor insulating ferroelectric film of an FeRAM does not degraded and the characteristics of the FeRAM is improved. A PZT film containing Pb of a content more than that of a capacitor insulating film (11a) (PZT film) constituting a capacitor (C) of the FeRAM memory cell is deposited on the capacitor (C) and subjected to an anisotropic etching so as to form a side wall film (SW) on the side wall of the capacitor (C). As a result, for example, the adverse influence of the hydrogen and H2O in a TEOS film on the capacitor (C) can be weakened, and the degradation of the characteristics of the capacitor insulating film (11a) can be suppressed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-107011 | 2001-04-05 | ||
JP2001107011A JP2002305289A (en) | 2001-04-05 | 2001-04-05 | Semiconductor integrated circuit device and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002082549A1 true WO2002082549A1 (en) | 2002-10-17 |
Family
ID=18959409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/003172 WO2002082549A1 (en) | 2001-04-05 | 2002-03-29 | Semiconductor integrated circuit device and its manufacturing method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2002305289A (en) |
WO (1) | WO2002082549A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004214544A (en) * | 2003-01-08 | 2004-07-29 | Fujitsu Ltd | Method for manufacturing semiconductor device |
JP4663216B2 (en) * | 2003-06-10 | 2011-04-06 | ルネサスエレクトロニクス株式会社 | Semiconductor memory device and manufacturing method thereof |
JP2005057103A (en) * | 2003-08-06 | 2005-03-03 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
JP4579236B2 (en) | 2004-02-19 | 2010-11-10 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
JP4803995B2 (en) * | 2004-06-28 | 2011-10-26 | 富士通セミコンダクター株式会社 | Semiconductor device and manufacturing method thereof |
JP2007013011A (en) * | 2005-07-01 | 2007-01-18 | Seiko Epson Corp | Ferroelectric memory device and display driving IC |
JP4661572B2 (en) * | 2005-12-12 | 2011-03-30 | セイコーエプソン株式会社 | Ferroelectric memory and manufacturing method of ferroelectric memory |
JP4515492B2 (en) * | 2007-08-29 | 2010-07-28 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
JP6539900B2 (en) * | 2013-07-25 | 2019-07-10 | 国立研究開発法人産業技術総合研究所 | Ferroelectric device and method of manufacturing the same |
JP6821291B2 (en) * | 2015-05-29 | 2021-01-27 | キヤノン株式会社 | Manufacturing method of photoelectric conversion device, imaging system and photoelectric conversion device |
JP6751866B2 (en) | 2016-04-22 | 2020-09-09 | 国立研究開発法人産業技術総合研究所 | Manufacturing method of semiconductor ferroelectric storage element and semiconductor ferroelectric storage transistor |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5523595A (en) * | 1990-08-21 | 1996-06-04 | Ramtron International Corporation | Semiconductor device having a transistor, a ferroelectric capacitor and a hydrogen barrier film |
WO1997035341A1 (en) * | 1996-03-15 | 1997-09-25 | Hitachi, Ltd. | Semiconductor storage device and its manufacture |
JPH11103029A (en) * | 1997-09-29 | 1999-04-13 | Nec Corp | Capacitor, semiconductor memory device therewith, and manufacture thereof |
EP0911871A2 (en) * | 1997-10-24 | 1999-04-28 | Sharp Kabushiki Kaisha | Semiconductor memory device with ferroelectric thin film |
EP0951058A2 (en) * | 1998-04-17 | 1999-10-20 | Symetrix Corporation | Method of fabricating ferroelectric integrated circuit using dry and wet etching |
JP2000004001A (en) * | 1998-06-15 | 2000-01-07 | Toshiba Corp | Semiconductor memory and manufacture thereof |
EP0978881A2 (en) * | 1998-08-07 | 2000-02-09 | Matsushita Electronics Corporation | Ferroelectric capacitor and its manufacturing method |
JP2000260956A (en) * | 1999-03-10 | 2000-09-22 | Oki Electric Ind Co Ltd | Capacitance element and its manufacture, and semiconductor storage element and its manufacture |
-
2001
- 2001-04-05 JP JP2001107011A patent/JP2002305289A/en active Pending
-
2002
- 2002-03-29 WO PCT/JP2002/003172 patent/WO2002082549A1/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5523595A (en) * | 1990-08-21 | 1996-06-04 | Ramtron International Corporation | Semiconductor device having a transistor, a ferroelectric capacitor and a hydrogen barrier film |
WO1997035341A1 (en) * | 1996-03-15 | 1997-09-25 | Hitachi, Ltd. | Semiconductor storage device and its manufacture |
JPH11103029A (en) * | 1997-09-29 | 1999-04-13 | Nec Corp | Capacitor, semiconductor memory device therewith, and manufacture thereof |
EP0911871A2 (en) * | 1997-10-24 | 1999-04-28 | Sharp Kabushiki Kaisha | Semiconductor memory device with ferroelectric thin film |
EP0951058A2 (en) * | 1998-04-17 | 1999-10-20 | Symetrix Corporation | Method of fabricating ferroelectric integrated circuit using dry and wet etching |
JP2000004001A (en) * | 1998-06-15 | 2000-01-07 | Toshiba Corp | Semiconductor memory and manufacture thereof |
EP0978881A2 (en) * | 1998-08-07 | 2000-02-09 | Matsushita Electronics Corporation | Ferroelectric capacitor and its manufacturing method |
JP2000260956A (en) * | 1999-03-10 | 2000-09-22 | Oki Electric Ind Co Ltd | Capacitance element and its manufacture, and semiconductor storage element and its manufacture |
Also Published As
Publication number | Publication date |
---|---|
JP2002305289A (en) | 2002-10-18 |
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