Nothing Special   »   [go: up one dir, main page]

WO2000052547A1 - Method and apparatus for flowing liquid temperature control - Google Patents

Method and apparatus for flowing liquid temperature control Download PDF

Info

Publication number
WO2000052547A1
WO2000052547A1 PCT/US2000/005932 US0005932W WO0052547A1 WO 2000052547 A1 WO2000052547 A1 WO 2000052547A1 US 0005932 W US0005932 W US 0005932W WO 0052547 A1 WO0052547 A1 WO 0052547A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
liquid
heater
set point
power
Prior art date
Application number
PCT/US2000/005932
Other languages
French (fr)
Inventor
Kurt Christenson
Leo Lake
Moshe Olim
Original Assignee
Fsi International, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fsi International, Inc. filed Critical Fsi International, Inc.
Priority to JP2000602903A priority Critical patent/JP2002538544A/en
Priority to EP00912192A priority patent/EP1159658A1/en
Publication of WO2000052547A1 publication Critical patent/WO2000052547A1/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means

Definitions

  • U S Patent No 5,130,920 discloses an adaptive process control system especially for controlling the temperature of flowing liquids
  • the system uses an adaptive process control system based upon the feed forward controller
  • the control function is adapted by the feedback controller That is, the system exercises adaptive control on the feed forward control function based upon the feedback loop
  • the feed forward controller alone or together with the feedback controller provides an output for controlling the process variable of interest
  • the method for controlling the temperature of a flowing liquid in a process includes identifying process parameters in a controller
  • the process parameters typically comprise a set point temperature and data corresponding to a specific heat and density of the liquid
  • One or more sensors permit the controller to monitor the incoming temperature, outgoing temperature and flow rate of the liquid at the heater
  • a theoretical power required for the heater to adjust the outgoing temperature of the liquid to be substantially equal to the set point temperature is determined
  • a heater efficiency correction factor derived from information comprising the incoming liquid temperature and flow rate is also determined
  • a calculated power is derived from information comprising the theoretical power and the heater efficiency correction factor
  • a final power to be applied to the heater is derived from information comprising the calculated power and an error term
  • the error term is substantially continuously derived by a control algorithm using information comprising a proportional term, an integral term and a derivative term
  • the derivative term is derived from information comprising the difference between
  • THEORETIC ⁇ L comprises determining how much power is required to heat the liquid from Trsj to T S ET
  • Theoretical power is typically calculated by identifying the specific heat and density of the liquid being used and multiplying the flow rate, the density and the specific heat of the liquid by the difference between the incoming temperature and the set point temperature (T SET -T IN ) using the equation P TH ERO RE TIC AL - QFLOW PCP(TSET)
  • the step of determining the heater efficiency comprises empirically deriving an equation defining heater efficiency for a given liquid, a given flow rate, a given temperature, or a combination thereof
  • the step of determining the heater efficiency correction factor ( ) comprises the step of empirically deriving constants for a quadratic equation defining heater efficiency in terms of variables comprising flow rate (Q FLOW ) and temperature
  • the temperature term is typically the difference between the incoming temperature and the set point temperature (T SET -T I ⁇ ), such as for )QFLOW
  • the error term for calculating the final power is determined by using a control algorithm, such as Proportional Integral Derivative (PID) control
  • PID Proportional Integral Derivative
  • the proportional term is proportional to the difference between the set point temperature and the outgoing temperature of the liquid (T SET - T OUT )
  • the integral term is the cumulative area under the curve between the outgoing temperature and the set point temperature for a given time interval
  • the derivative term provides the slope or approach rate of the outgoing temperature toward the set point temperature
  • the contribution from the integral term is not added to the cumulative area during time intervals where the incoming temperature is not within a predetermined range of the set point temperature
  • the predetermined range is where the incoming temperature of the liquid is between 75% and 125% of the set point temperature
  • the present invention is also directed to controlling the temperature of a flowing liquid to process microelectronic components, such as integrated circuits, components for flat panel displays, precursor components including silicon wafers, and various other electrical components
  • the present invention is also directed to an apparatus for processing microelectronic components with a flowing liquid
  • the apparatus includes a processing chamber or an immersion bath
  • a controller has process parameters typically comprising a set point temperature and data corresponding to a specific heat and density of the liquid
  • the liquid flows through a heater to the processing chamber or the immersion bath
  • Process sensors are positioned to monitor an incoming temperature, an outgoing temperature and a flow rate of the liquid at a heater.
  • the controller includes means for determining a theoretical power comprising multiplying the difference between the incoming temperature and the set point temperature by the flow rate, specific heat and density of the liquid; means for determining a heater efficiency correction factor derived from information comprising the incoming temperature and flow rate of the liquid and for adjusting the theoretical power with the heater efficiency correction factor to determine a calculated power; and means for calculating a final power derived from information comprising the calculated power and an error term.
  • the error term is substantially continuously determined by a proportional term, an integral term and a derivative term.
  • the derivative term is derived from information comprising the difference between the set point temperature and the outgoing temperature of the liquid (T SET - TO L T).
  • a power controller is provided for applying the final power to the heater.
  • An applicator in the process chamber or the immersion bath is positioned to apply the liquid to the microelectronic components.
  • Figure 2 is a sample graph illustrating one mode of operation for the flowing liquid temperature control system of Figure 1.
  • Figure 3 is a schematic illustration of a process utilizing the flowing liquid temperature control system of the present invention.
  • Figure 4 is a sample graph illustrating a specific application of the present flowing liquid temperature control system.
  • FIG. 1 is a schematic illustration of a flowing liquid temperature control system 20 in accordance with the present invention.
  • a liquid flows through the inlet pipe 22 to a heater 24 that applies heat to the liquid at or near a control point 26 After heating, the liquid continues through the outlet pipe 28 to a process 30
  • the incoming temperature of the liquid is measured ahead of the control point 26 by a temperature sensor 32
  • the outgoing temperature of the liquid is measured by temperature sensor 34
  • the temperature sensors 32, 34 are located within about 30 centimeters of the control point 26 so that the time delay between the temperature measurements is minimal and the temperature at the sensor 32 is substantially the same as the temperature of the liquid at the control point 26
  • Suitable temperature sensors are available from Omega Engineering Incorporated located in Stamford, CT under the model number W2103
  • the temperature sensors are encapsulated in an inert material such as Teflon® or PVDF (polyvinylidinefluo ⁇ de)
  • a flow sensor 36 is located along the inlet pipe 22 to sense the flow rate of the liquid through the system 20
  • the incoming flow rate of the liquid through the inlet pipe 22 is substantially the same as the outgoing flow rate through the outlet pipe 28
  • a suitable flow sensor is available from Futurestar Corp located in Edina, MN under model number Futurestar TP W
  • the output from the temperature sensors 32, 34 and flow sensor 36 are maintained by controller 40
  • the controller 40 includes an input/output device 42. such as a touch screen or a keyboard and display
  • the controller is connected to a power controller 44 that controls the connection of a power supply 45 (e g , 1 10 volts, 220 volts, 440 volts) to the heater 24
  • a power controller 44 suitable for use in the present invention is available from Control Concepts of Chanhassen, MN under model number 1029C
  • a controller 40 suitable for use in the present flowing liquid temperature control system 20 is the 25 MFIz-CPU card available from Win Systems of Arlington, Texas under part number M486SX25BM-0479A
  • the sensors 32, 34, 36 are polled by the controller 40 about every 40 milliseconds to about every 2 seconds
  • a variety of devices may be used for the heater 24, such as the microwave generator described in U S Patent No 5,130,920 In the embodiment illustrated in Figure 3, the heater 24 is about 25 feet of 3/8 inch OD and
  • the method of the present flowing liquid temperature control system utilizes the controller 40 to provide feed forward control in response to the incoming temperature and flow rate (Q FLO W) of the liquid as measured by the sensors 32, 36 and feedback control in response to the outgoing temperature (T OUT ) of the liquid as measured by the sensor 34
  • An operator uses the input/output device 42 to enter a set point temperature (T SET ) and identify the liquid
  • T SET set point temperature
  • the identity of the liquid can be correlated with a heat capacity (C p ) and density (p) for that liquid
  • the heat capacity (C p ) and density (p) for that liquid can be stored in the controller 40 as a composite number
  • the input/output device 42 is utilized for entering a recipe that identifies a series of set point temperatures, time intervals, flow rates, liquids, etc that are used through a segment of the process 20
  • the controller 40 monitors the temperature sensor 32 and flow sensor 36 and performs a feed forward calculation to predict the theoretical power (PTHEROR ET IC A L) required to adjust the outgoing temperature (T OUT ) of the liquid to be substantially equal to the set point temperature (T SET )
  • PTHEROR ET IC A L the theoretical power required to adjust the outgoing temperature (T OUT ) of the liquid to be substantially equal to the set point temperature (T SET )
  • the P TH E RO R ET I C AL is calculated by the equation
  • the second step in the feed forward process is to determine a heater efficiency correction factor (J) for the heater 24 and apply it to the P ⁇ HER ⁇ R£ ⁇ c AL to calculate the power (PCALC ULA TE D ) required
  • the heater efficiency correction factor can be determined empirically for a given liquid, a given flow rate, a desired temperature rise, or combinations thereof
  • the heater efficiency correction factor (/) is a quadratic equation of flow rate (Q FLO W) and the difference between the incoming temperature and the set point temperature of the liquid (TSET -
  • the heater efficiency correction factor (f) can be calculated based on the equation a 4 Q F Low " +as(T S ⁇ -T ⁇ QFLOW where ao, ai.
  • a 2 , a 3 , -u as are constants
  • the constants ao, ai, a 2 , a , - as are empirically derived using known techniques
  • the constants ao, a l3 a , a 3 . a-i, a 5 are empirically derived by operating the system 20 at a fixed incoming temperature (TIN) and three different final power levels (PFINAL) and flow rates (QF LO W) until the outgoing temperature (T OUT ) stabilizes
  • TIN fixed incoming temperature
  • PFINAL final power levels
  • QF LO W flow rates
  • This analysis can optionally be performed automatically by the controller to periodically update the constants ao, ai, a , a 3 , a*, as to monitor and/or compensate for changes in the heater efficiency over time
  • the constants ao, ai, a 2 , a 3 , a 4 , a 5 preferably do not change during operation of the present flowing liquid temperature control system
  • the constants ao, ai, a 2 , a 3 , a*, a 5 may optionally be different for various liquids or set point temperatures
  • the controller 40 can select the appropriate constants based on the identity of the liquid or set point temperature provided through the input/output device 42 at the beginning of the process
  • the heater efficiency correction factor is intended to compensate for heat loss by the various components of the system 20, such as the heater 24, pipes 22, 28, temperature sensor 34, and various other factors
  • the heater efficiency correction factor (j) is a number greater than 1, such as 1 1 or 1 2
  • the calculated power is determined by the equation
  • the calculated power should accurately reflect the power required to adjust the outgoing temperature of the liquid to the set point temperature
  • external forces can cause the outgoing temperature to vary from the set point temperature That is, external forces tend to cause the heater 24 to overshoot or undershoot the set point temperature
  • These external forces include, but are not limited to aging of the infra-red lamps 72, variations in the heater 24 or power controller 44 due to normal manufacturing tolerances and variations in the actual heater efficiency correction factor/from the simple quadratic approximation
  • the calculated power (PC L CU LATED ) also does not include the power required to heat the reflective shell 74 after a change in set point temperature (Tset)
  • Tset set point temperature
  • a feedback loop utilizing a control algorithm to determine an error term
  • the control algorithm is Proportional Integral Derivative (PID) control
  • the error term is calculated using the equation
  • FIG. 2 is an exemplary illustration of the operation of the Error equation in the present system 20 where the curve is TOUT
  • the proportional term P(T SET - T O UT) IS proportional to the distance between the outgoing temperature (T OUT ) and the set point temperature (TSET), such as for example the distances 50a, 50b multiplied by the constant P
  • the integral term is proportional to a running total or cumulative area between the curve of the outgoing temperature TOUT curve and T SET for a given time interval, such as for the time interval up to 52a, 52b
  • the derivative term is proportional to the slope or approach rate of the outgoing temperature of the liquid to the set point temperature TSET, such as for example the slope of the tangents 54a, 54b to T OUT
  • contributions from the integral term are not added to the running total unless the outgoing temperature (TOUT) IS within a predetermined range of the set point temperature (T S ET)
  • TOUT outgoing temperature
  • T S ET set point temperature
  • the integral term is not added to the running total until the outgoing temperature is between 75% and 125% of the set point temperature
  • the integral teim is set to zero until the outgoing temperature is between 85% and 1 15% of the set point temperature
  • FIG. 3 illustrates application of the present flowing liquid temperature control svstem 20
  • Figure 3 schematically illustrates a spray acid processor available under the trade name MERCURY® available from FSI International for processing microelectronic components, such as integrated circuits, components for flat panel displays, precursor components including silicon wafers, and various other electrical components 62 located in a process chamber 64
  • the process chamber 64 includes a spray post 66 for applying various chemicals, such as de-ionized water, HF, H 2 O 2 , HCl, NH jOH, H 2 SO 4 , to the components 62
  • these chemicals flow through the heater 24 that is attached to the control 40, discussed above In the illustrated embodiment, the various chemicals are delivered to the heater at a temperature at or below the set point temperature
  • Another application of the present flowing liquid temperature control system 20 is disclosed in a commonly assigned U S Patent application entitled A METHOD AND SYSTEM TO UNIFORMLY ETCH SUBSTRATES USING AN ETCHING COMPOSITION COMPRISING A FLUOR
  • FIG. 4 is a sample graph illustrating the operation of the present flowing liquid control system for processing microelectronic components This example was conducted using the heater and spray acid processor available under the trade name MERCURY® from FSI International of Chaska, Minnesota The liquid was about 2° o bv volume deionized water, about 2% by volume HF and about 96% by volume ethylene glycol The flow rate (Q FLOW ) was about 4 liters/minute and the set point temperature (T SET ) was about 85 degrees C The upper curve illustrates T OLT and the lower curve illustrates T I N
  • T OLT is about equal to T IN During the three-minute time index from about 770 seconds to about 950 seconds, T OUT oscillates around TSE ⁇ During the two and a half minute time index from about 950 seconds to about 1 100 seconds, the outgoing temperature of the liquid being is within an acceptable temperature range, e ⁇ en though the incoming temperature declines about 20 degrees C during that period

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Control Of Resistance Heating (AREA)
  • Control Of Temperature (AREA)

Abstract

A method and apparatus for controlling the temperature of a flowing liquid in a process. Process parameters are identified in a controller. The process parameters typically include a set point temperature and data corresponding to a specific heat and density of the liquid. One or more sensors permit the controller to monitor the incoming temperature, outgoing temperature and flow rate of the liquid at the heater. A theoretical power required for the heater to adjust the outgoing temperature of the liquid to be substantially equal to the set point temperature is determined. A heater efficiency correction factor derived from information including the incoming liquid temperature and flow rate is also determined. A calculated power is derived from information including the theoretical power and the heater efficiency correction factor. A final power to be applied to the heater is derived from information including the calculated power and an error term. The error term is substantially continuously derived by a control algorithm using information including a proportional term, an integral term and a derivative term. The derivative term is derived from information including the difference between the set point temperature and the outgoing temperature of the liquid (TSET-TOUT). The final power is applied to the heater to adjust the outgoing temperature of the liquid to be substantially equal to the set point temperature.

Description

METHOD AND APPARATUS FOR FLOWING LIQUID TEMPERATURE
CONTROL
Field of the Invention The present invention is directed to a method and apparatus for controlling the outgoing temperature of a flowing liquid where the incoming temperature and the flow rate of the liquid may vary
Background of the Invention Control systems and methods can essentially be divided into two groups The first group includes feedback controls in which a control signal is generated after the parameter of the process which is to be controlled shows a deviation from the value this parameter is supposed to have The second group includes feed forward controls in which variables of a process are sensed before they become effective on the parameter to be controlled and a control operation is taken to prevent a dev iation of the parameters from the target value Modern control systems and methods combine both feed forward and feedback controls to obtain results that are more accurate
Some processes that utilize a flowing liquid require that the temperature of the liquid be controlled precisely However, the various components of the system, such as valves, tubing, chambeis, cause transient cooling affects which absorb heat w hen changing from hot to cold liquids Additionally, precise temperature control of a flowing liquid becomes extremely difficult when the flow rate and incoming temperature of the liquid varies during the process
U S Patent No 5,130,920 (Gebo) discloses an adaptive process control system especially for controlling the temperature of flowing liquids The system uses an adaptive process control system based upon the feed forward controller The control function is adapted by the feedback controller That is, the system exercises adaptive control on the feed forward control function based upon the feedback loop The feed forward controller alone or together with the feedback controller provides an output for controlling the process variable of interest
Brief Summary of the Invention The present invention is directed to an improved method and apparatus for controlling the outgoing temperature of a flowing liquid in which the incoming temperature and flow rate of the liquid may vary In one embodiment, the method for controlling the temperature of a flowing liquid in a process includes identifying process parameters in a controller The process parameters typically comprise a set point temperature and data corresponding to a specific heat and density of the liquid One or more sensors permit the controller to monitor the incoming temperature, outgoing temperature and flow rate of the liquid at the heater A theoretical power required for the heater to adjust the outgoing temperature of the liquid to be substantially equal to the set point temperature is determined A heater efficiency correction factor derived from information comprising the incoming liquid temperature and flow rate is also determined A calculated power is derived from information comprising the theoretical power and the heater efficiency correction factor A final power to be applied to the heater is derived from information comprising the calculated power and an error term The error term is substantially continuously derived by a control algorithm using information comprising a proportional term, an integral term and a derivative term The derivative term is derived from information comprising the difference between the set point temperature and the outgoing temperature of the liquid (TSET - TOUT) The final power is applied to the heater to adjust the outgoing temperature of the liquid to be substantially equal to the set point temperature As used herein, "substantially equal to the set point temperature" or similar statements refer to an outgoing temperature of the liquid being within an acceptable temperature range The acceptable temperature range can vary from process to process and liquid to liquid As used herein, "identifying process parameters in the controller" refers to entering the heat capacity and density of the liquid into the controller or identifying the liquid and allowing the controller to correlate the identity of the liquid with heat capacity and density values previously stored In one embodiment, the heat capacity and density for a given liquid is entered or stored as a composite number In one embodiment, the step of determining the theoretical power
(TTHEORETICΛL) comprises determining how much power is required to heat the liquid from Trsj to TSET Theoretical power is typically calculated by identifying the specific heat and density of the liquid being used and multiplying the flow rate, the density and the specific heat of the liquid by the difference between the incoming temperature and the set point temperature (TSET -TIN) using the equation PTHERORETIC AL - QFLOW PCP(TSET
Figure imgf000005_0001
The step of determining the heater efficiency comprises empirically deriving an equation defining heater efficiency for a given liquid, a given flow rate, a given temperature, or a combination thereof In one embodiment, the step of determining the heater efficiency correction factor ( ) comprises the step of empirically deriving constants for a quadratic equation defining heater efficiency in terms of variables comprising flow rate (QFLOW) and temperature The temperature term is typically the difference between the incoming temperature and the set point temperature (TSET -TI\), such as for
Figure imgf000005_0002
Figure imgf000005_0003
)QFLOW The step of determining the calculated power comprises the step of evaluating the quadratic equation and modifying the theoretical power by the heater efficiency correction factor In one embodiment, it is possible to have different heater efficiency correction factors (or different constants for the quadratic equation) for different liquids or set point temperatures It is also possible for the controller to automatically recalculate the heater efficiency correction factors or constants to compensate for changes in the actual efficiency of the heater
The error term for calculating the final power is determined by using a control algorithm, such as Proportional Integral Derivative (PID) control The proportional term is proportional to the difference between the set point temperature and the outgoing temperature of the liquid (TSET - TOUT) The integral term is the cumulative area under the curve between the outgoing temperature and the set point temperature for a given time interval The derivative term provides the slope or approach rate of the outgoing temperature toward the set point temperature In one embodiment, the contribution from the integral term is not added to the cumulative area during time intervals where the incoming temperature is not within a predetermined range of the set point temperature In one embodiment, the predetermined range is where the incoming temperature of the liquid is between 75% and 125% of the set point temperature The present invention is also directed to controlling the temperature of a flowing liquid to process microelectronic components, such as integrated circuits, components for flat panel displays, precursor components including silicon wafers, and various other electrical components The microelectronic components or their precursors are located in a processing chamber or an immersion bath The flowing liquid within the desired temperature range is applied to the microelectronic components or their precursors
The present invention is also directed to an apparatus for processing microelectronic components with a flowing liquid The apparatus includes a processing chamber or an immersion bath A controller has process parameters typically comprising a set point temperature and data corresponding to a specific heat and density of the liquid The liquid flows through a heater to the processing chamber or the immersion bath Process sensors are positioned to monitor an incoming temperature, an outgoing temperature and a flow rate of the liquid at a heater. The controller includes means for determining a theoretical power comprising multiplying the difference between the incoming temperature and the set point temperature by the flow rate, specific heat and density of the liquid; means for determining a heater efficiency correction factor derived from information comprising the incoming temperature and flow rate of the liquid and for adjusting the theoretical power with the heater efficiency correction factor to determine a calculated power; and means for calculating a final power derived from information comprising the calculated power and an error term. The error term is substantially continuously determined by a proportional term, an integral term and a derivative term. The derivative term is derived from information comprising the difference between the set point temperature and the outgoing temperature of the liquid (TSET - TOLT). A power controller is provided for applying the final power to the heater. An applicator in the process chamber or the immersion bath is positioned to apply the liquid to the microelectronic components.
Brief Description of the Several Views of the Drawing Figure 1 is a schematic illustration of the flowing liquid temperature control system in accordance with the present invention.
Figure 2 is a sample graph illustrating one mode of operation for the flowing liquid temperature control system of Figure 1.
Figure 3 is a schematic illustration of a process utilizing the flowing liquid temperature control system of the present invention.
Figure 4 is a sample graph illustrating a specific application of the present flowing liquid temperature control system.
Detailed Description of the Invention Figure 1 is a schematic illustration of a flowing liquid temperature control system 20 in accordance with the present invention. A liquid flows through the inlet pipe 22 to a heater 24 that applies heat to the liquid at or near a control point 26 After heating, the liquid continues through the outlet pipe 28 to a process 30 The incoming temperature of the liquid is measured ahead of the control point 26 by a temperature sensor 32 The outgoing temperature of the liquid is measured by temperature sensor 34 In the illustrated embodiment, the temperature sensors 32, 34 are located within about 30 centimeters of the control point 26 so that the time delay between the temperature measurements is minimal and the temperature at the sensor 32 is substantially the same as the temperature of the liquid at the control point 26 Suitable temperature sensors are available from Omega Engineering Incorporated located in Stamford, CT under the model number W2103 In the illustrated embodiment, the temperature sensors are encapsulated in an inert material such as Teflon® or PVDF (polyvinylidinefluoπde)
A flow sensor 36 is located along the inlet pipe 22 to sense the flow rate of the liquid through the system 20 In the illustrated embodiment, the incoming flow rate of the liquid through the inlet pipe 22 is substantially the same as the outgoing flow rate through the outlet pipe 28 A suitable flow sensor is available from Futurestar Corp located in Edina, MN under model number Futurestar TP W
The output from the temperature sensors 32, 34 and flow sensor 36 are maintained by controller 40 The controller 40 includes an input/output device 42. such as a touch screen or a keyboard and display The controller is connected to a power controller 44 that controls the connection of a power supply 45 (e g , 1 10 volts, 220 volts, 440 volts) to the heater 24 A power controller 44 suitable for use in the present invention is available from Control Concepts of Chanhassen, MN under model number 1029C A controller 40 suitable for use in the present flowing liquid temperature control system 20 is the 25 MFIz-CPU card available from Win Systems of Arlington, Texas under part number M486SX25BM-0479A In the illustrated embodiment, the sensors 32, 34, 36 are polled by the controller 40 about every 40 milliseconds to about every 2 seconds A variety of devices may be used for the heater 24, such as the microwave generator described in U S Patent No 5,130,920 In the embodiment illustrated in Figure 3, the heater 24 is about 25 feet of 3/8 inch OD and lA ID perfluoroalkoxy (PFA) tubing 70 coiled around three 2 kilowatts elongated infrared lamps 72 available from General Electric under part number QH2M-T3 lCL/VB A reflective shell 74 can be wrapped around the assembly of lamps and tubing to minimize heat loss The tubing 70 is available from Fluoroware of Chaska, Minnesota The heater utilized in the spray acid processor available under the trade name MERCURY® from FSI International of Chaska, Minnesota is also suitable for use in the present flowing liquid temperature control system 20
The method of the present flowing liquid temperature control system utilizes the controller 40 to provide feed forward control in response to the incoming temperature
Figure imgf000009_0001
and flow rate (QFLOW) of the liquid as measured by the sensors 32, 36 and feedback control in response to the outgoing temperature (TOUT) of the liquid as measured by the sensor 34 An operator uses the input/output device 42 to enter a set point temperature (TSET) and identify the liquid The identity of the liquid can be correlated with a heat capacity (Cp) and density (p) for that liquid The heat capacity (Cp) and density (p) for that liquid can be stored in the controller 40 as a composite number In an alternate embodiment, the input/output device 42 is utilized for entering a recipe that identifies a series of set point temperatures, time intervals, flow rates, liquids, etc that are used through a segment of the process 20
Once the set point temperature and identity of the liquid are provided to the controller 40, the controller 40 monitors the temperature sensor 32 and flow sensor 36 and performs a feed forward calculation to predict the theoretical power (PTHERORETIC AL) required to adjust the outgoing temperature (TOUT) of the liquid to be substantially equal to the set point temperature (TSET) In the illustrated embodiment, the PTHERORETIC AL is calculated by the equation
PTHERORETICAL = QFLOW pCp(Tsετ -TIN) where QFLOW IS the flow rate, p is the density of the liquid, and CP is the heat capacity of the liquid This feed forward calculation of the theoretical power required to adjust the outgoing temperature of the liquid to the set point temperature, however, excludes systemic factors such as heat loss, non-uniformity of the heating elements, etc
The second step in the feed forward process is to determine a heater efficiency correction factor (J) for the heater 24 and apply it to the PτHERθR£τιcALto calculate the power (PCALCULATED) required The heater efficiency correction factor can be determined empirically for a given liquid, a given flow rate, a desired temperature rise, or combinations thereof In the illustrated embodiment, the heater efficiency correction factor (/), is a quadratic equation of flow rate (QFLOW) and the difference between the incoming temperature and the set point temperature of the liquid (TSET -
Figure imgf000010_0001
The heater efficiency correction factor (f) can be calculated based on the equation
Figure imgf000010_0002
a4QFLow " +as(TSετ -TΠ QFLOW where ao, ai. a2, a3, -u, as are constants The constants ao, ai, a2, a , - , as are empirically derived using known techniques For example, in one embodiment the constants ao, al3 a , a3. a-i, a5 are empirically derived by operating the system 20 at a fixed incoming temperature (TIN) and three different final power levels (PFINAL) and flow rates (QFLOW) until the outgoing temperature (TOUT) stabilizes A least-square fit analysis is performed on the nine resulting data points to determine the constants ao, ai, a2, a3, a4, a-. This analysis can optionally be performed automatically by the controller to periodically update the constants ao, ai, a , a3, a*, as to monitor and/or compensate for changes in the heater efficiency over time The constants ao, ai, a2, a3, a4, a5 preferably do not change during operation of the present flowing liquid temperature control system However, in one embodiment, the constants ao, ai, a2, a3, a*, a5 may optionally be different for various liquids or set point temperatures The controller 40 can select the appropriate constants based on the identity of the liquid or set point temperature provided through the input/output device 42 at the beginning of the process
The heater efficiency correction factor is intended to compensate for heat loss by the various components of the system 20, such as the heater 24, pipes 22, 28, temperature sensor 34, and various other factors In most applications, the heater efficiency correction factor (j) is a number greater than 1, such as 1 1 or 1 2 In the illustrated embodiment, the calculated power is determined by the equation
P CALCULATED = PTHEORETICAL * /
Although the calculated power should accurately reflect the power required to adjust the outgoing temperature of the liquid to the set point temperature, in actual application, external forces can cause the outgoing temperature to vary from the set point temperature That is, external forces tend to cause the heater 24 to overshoot or undershoot the set point temperature These external forces include, but are not limited to aging of the infra-red lamps 72, variations in the heater 24 or power controller 44 due to normal manufacturing tolerances and variations in the actual heater efficiency correction factor/from the simple quadratic approximation The calculated power (PC LCULATED) also does not include the power required to heat the reflective shell 74 after a change in set point temperature (Tset) In order to minimize the variation in TOLT from TSET of the heater 24, a feedback loop utilizing a control algorithm to determine an error term In the illustrated embodiment, the control algorithm is Proportional Integral Derivative (PID) control The error term is calculated using the equation
Error = P(TSET - TOUT) ~rIJ( sEτ - TOUT) "" D((TSET - TOLT)/ΔTIV.E) where (TSET - TOUT) I the difference between the outgoing temperature of the liquid and the set point temperature and P, I and D are constants For some embodiments, one or more of the constants P, I and D may equal 1
Application of this Error equation is illustrated in Figure 2 Figure 2 is an exemplary illustration of the operation of the Error equation in the present system 20 where the curve is TOUT The proportional term P(TSET - TOUT) IS proportional to the distance between the outgoing temperature (TOUT) and the set point temperature (TSET), such as for example the distances 50a, 50b multiplied by the constant P The integral term is proportional to a running total or cumulative area between the curve of the outgoing temperature TOUT curve and TSET for a given time interval, such as for the time interval up to 52a, 52b The derivative term is proportional to the slope or approach rate of the outgoing temperature of the liquid to the set point temperature TSET, such as for example the slope of the tangents 54a, 54b to TOUT
In one embodiment of the present invention, contributions from the integral term are not added to the running total unless the outgoing temperature (TOUT) IS within a predetermined range of the set point temperature (TSET) In the illustrated embodiment, the integral term is not added to the running total until the outgoing temperature is between 75% and 125% of the set point temperature In another embodiment, the integral teim is set to zero until the outgoing temperature is between 85% and 1 15% of the set point temperature
The final power (PFIΛAL) necessary for the heater 24 to adjust the temperature of the flowing liquid to the set point temperature is calculated by the equation
PFINAL - PCALCULATED (1+Error) The final power requirement is communicated to the power controller 44, which in turn controls the connection of a 220-volt power supply to the heater 24
Figure 3 illustrates application of the present flowing liquid temperature control svstem 20 Figure 3 schematically illustrates a spray acid processor available under the trade name MERCURY® available from FSI International for processing microelectronic components, such as integrated circuits, components for flat panel displays, precursor components including silicon wafers, and various other electrical components 62 located in a process chamber 64 The process chamber 64 includes a spray post 66 for applying various chemicals, such as de-ionized water, HF, H2O2, HCl, NH jOH, H2SO4, to the components 62 These chemicals flow through the heater 24 that is attached to the control 40, discussed above In the illustrated embodiment, the various chemicals are delivered to the heater at a temperature at or below the set point temperature Another application of the present flowing liquid temperature control system 20 is disclosed in a commonly assigned U S Patent application entitled A METHOD AND SYSTEM TO UNIFORMLY ETCH SUBSTRATES USING AN ETCHING COMPOSITION COMPRISING A FLUORIDE ION SOURCE AND A HYDROGEN ION SOURCE (Chπstianson et al , attorney docket no 15676-217185), filed on the same date herewith
Example
Figure 4 is a sample graph illustrating the operation of the present flowing liquid control system for processing microelectronic components This example was conducted using the heater and spray acid processor available under the trade name MERCURY® from FSI International of Chaska, Minnesota The liquid was about 2° o bv volume deionized water, about 2% by volume HF and about 96% by volume ethylene glycol The flow rate (QFLOW) was about 4 liters/minute and the set point temperature (TSET ) was about 85 degrees C The upper curve illustrates TOLT and the lower curve illustrates TIN
InitialK. TOLT is about equal to TIN During the three-minute time index from about 770 seconds to about 950 seconds, TOUT oscillates around TSEΓ During the two and a half minute time index from about 950 seconds to about 1 100 seconds, the outgoing temperature of the liquid being is within an acceptable temperature range, e\ en though the incoming temperature
Figure imgf000013_0001
declines about 20 degrees C during that period All patents and patent applications disclosed herein, including those disclosed in the background of the invention, are hereby incorporated by reference. While several embodiments of the present invention have now been described, it will be apparent to those of ordinary skill in the art that various changes and modifications may be made without deviating from the inventive concept set forth above. Thus, the scope of the present invention should not be limited to the structures described in this application, but only by the structures described by the language of the claims and the equivalents of those structures.

Claims

What is claimed is
1 A method for controlling the temperature of a flowing liquid in a process comprising the steps of identifying process parameters in a controller, the process parameters comprising a set point temperature and data corresponding to a specific heat and density of the liquid. monitoring in the controller an incoming temperature, an outgoing temperature and a flow rate of the liquid at a heater, determining a theoretical power required for the heater to adjust the outgoing temperature of the liquid to be substantially equal to the set point temperature, determining a heater efficiency correction factor derived from information comprising the incoming temperature and flow rate of the liquid, adjusting the theoretical power with the heater efficiency correction factor to determine a calculated power, calculating a final power derived from information comprising the calculated power and an error term, the error term being continuously determined by a proportional term, an integral term and a derivative term of the difference between the set point temperature and the outgoing temperature of the liquid, and applying the final power to the heater
2 The method of claim 1 wherein the step of determining the theoretical power comprises the step of multiplying the difference between the incoming temperature and the set point temperature by the flow rate, specific heat and density of the liquid
3. The method of claim 1 wherein the step of determining the heater efficiency correction factor comprises the step of empirically deriving an equation defining heater efficiency for a given liquid.
4. The method of claim 1 wherein the step of determining the heater efficiency correction factor comprises the step of empirically deriving an equation defining heater efficiency for a given flow rate.
5. The method of claim 1 wherein the step of determining the heater efficiency correction factor comprises the step of empirically deriving an equation defining heater efficiency for a given temperature range.
6. The method of claim 1 wherein the step of determining the heater efficiency correction factor comprises the step of empirically deriving constants for a quadratic equation defining heater efficiency in terms of flow rate and the difference between the incoming temperature and the set point temperature
7. The method of claim 6 wherein the step of determining the calculated power comprises the steps of evaluating the quadratic equation and modifying the theoretical power by the heater efficiency correction factor
8 The method of claim 1 wherein the step of calculating a final power comprises the steps of not adding contributions to the integral term during time intervals where the incoming temperature is not within a predetermined ranged of the set point temperature.
9. The method of claim 1 wherein the step of calculating a final power comprises the steps of not adding contributions to the integral term during time intervals where the incoming temperature is not between 75% and 125%) of the set point temperature
10 The method of claim 1 wherein the step of calculating a final power comprises the steps of not adding contributions to the integral term during time intervals where the incoming temperature is not between 85% and 1 15% of the set point temperature
1 1 The method of claim 1 wherein the final power is recalculated about every 40 milliseconds to about every 2 seconds
12 A method for controlling the temperature of a flowing liquid to process microelectronics components, comprising the steps of locate microelectronic components in a processing chamber or an immersion bath, identifying process parameters in a controller, the process parameters comprising a set point temperature and data corresponding to a specific heat and density of the liquid, flowing the liquid through a heater to the processing chamber or the immersion bath, monitoring in the controller an incoming temperature, an outgoing temperature and a flow rate of the liquid at a heater, determining a theoretical power required for the heater to adjust the outgoing temperature of the liquid to be substantially equal to the set point temperature, determining a heater efficiency correction factor derived from information comprising the incoming temperature and flow rate of the liquid, adjusting the theoretical power with the heater efficiency correction factor to determine a calculated power, calculating a final power derived from information comprising the calculated power and an error term, the error term being continuously determined by one or more of a proportional term, an integral term and a derivative term of the difference between the set point temperature and the outgoing temperature of the liquid, applying the final power to the heater, and applying the liquid to the microelectronic components
13 An apparatus for processing microelectronic components with a flowing liquid comprising a processing chamber or an immersion bath, a controller having process parameters, the process parameters comprising a set point temperature and data corresponding to a specific heat and density of the liquid. a liquid flowing through a heater to the processing chamber or the immersion bath, process sensors positioned to monitor an incoming temperature, an outgoing temperature and a flow rate of the liquid at a heater, means in the controller for determining a theoretical power comprising multiplying the difference between the incoming temperature and the set point temperature by the flow rate, specific heat and density of the liquid, means in the controller for determining a heater efficiency correction factor derived from information comprising the incoming temperature and flow rate of the liquid and for adjusting the theoretical power with the heater efficiency correction factor to determine a calculated power, means in the controller for calculating a final power derived from information comprising the calculated power and an error term, the error term being continuously determined by one or more of a proportional term, an integral term and a derivative term of the difference between the set point temperature and the outgoing temperature of the liquid; a power controller capable of applying the final power to the heater; and an applicator in the process chamber or the immersion bath positioned to apply the liquid to the microelectronic components.
14. The apparatus of claim 13 wherein the means for determining the heater efficiency correction factor comprises means for empirically deriving an equation defining heater efficiency for a given liquid.
15 The apparatus of claim 13 wherein the means for determining the heater efficiency correction factor comprises means for empirically deriving an equation defining heater efficiency for a given flow rate
16 The apparatus of claim 13 wherein the means for determining the heater efficiency correction factor comprises means for empirically deriving an equation defining heater efficiency for a given temperature range.
17 The apparatus of claim 13 wherein the means for determining the heater efficiency correction factor comprises means for empirically deriving constants for a quadratic equation defining heater efficiency in terms of flow rate and the difference between the incoming temperature and the set point temperature
18. The apparatus of claim 17 wherein the means for determining the calculated power comprises means for evaluating the quadratic equation and modifying the theoretical power by the heater efficiency correction factor.
19. The apparatus of claim 13 wherein the means for calculating a final power comprises not adding contributions to the integral term during time intervals where the incoming temperature is not within a predetermined ranged of the set point temperature.
20. The apparatus of claim 13 wherein the means for calculating a final power comprises not adding contributions to the integral term during time intervals where the incoming temperature is not between 75% and 125% of the set point temperature.
PCT/US2000/005932 1999-03-03 2000-03-03 Method and apparatus for flowing liquid temperature control WO2000052547A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000602903A JP2002538544A (en) 1999-03-03 2000-03-03 Method and apparatus for flow temperature control
EP00912192A EP1159658A1 (en) 1999-03-03 2000-03-03 Method and apparatus for flowing liquid temperature control

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26178899A 1999-03-03 1999-03-03
US09/261,788 1999-03-03

Publications (1)

Publication Number Publication Date
WO2000052547A1 true WO2000052547A1 (en) 2000-09-08

Family

ID=22994875

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/005932 WO2000052547A1 (en) 1999-03-03 2000-03-03 Method and apparatus for flowing liquid temperature control

Country Status (3)

Country Link
EP (1) EP1159658A1 (en)
JP (1) JP2002538544A (en)
WO (1) WO2000052547A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013208503A (en) * 2002-05-24 2013-10-10 Baxter Internatl Inc Peritoneal dialysis machine with variable voltage input control scheme
US9504778B2 (en) 2002-05-24 2016-11-29 Baxter International Inc. Dialysis machine with electrical insulation for variable voltage input
CN114251836A (en) * 2021-10-08 2022-03-29 佛山市顺德区美的饮水机制造有限公司 Instantaneous heating device, control method and control device thereof, water treatment device and medium
EP4075073A1 (en) * 2021-04-15 2022-10-19 BDR Thermea Group B.V. Method for controlling a fluid outlet temperature of a heat exchanger

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4603932B2 (en) * 2005-05-17 2010-12-22 株式会社フロンティアエンジニアリング Heating device
CN102147626B (en) * 2011-04-28 2013-03-13 北京七星华创电子股份有限公司 Feedforward temperature control method for cleaning liquid
JP5913942B2 (en) * 2011-12-02 2016-05-11 キヤノン株式会社 Temperature control device
CN104661686A (en) * 2012-09-24 2015-05-27 雀巢产品技术援助有限公司 Methods and systems for energy balance control for feed flow and feed temperature disturbances
US9285280B2 (en) 2013-03-07 2016-03-15 Joel S. Faden Systems and methods of determining load temperatures

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130920A (en) * 1989-09-15 1992-07-14 Eastman Kodak Company Adaptive process control system, especially for control of temperature of flowing fluids
DE4344244A1 (en) * 1993-12-23 1995-06-29 Bosch Siemens Hausgeraete Electric throughflow waterheater with fast responsive characteristic
DE4344243A1 (en) * 1993-12-23 1995-06-29 Bosch Siemens Hausgeraete Control of electric continuous flow water heater

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130920A (en) * 1989-09-15 1992-07-14 Eastman Kodak Company Adaptive process control system, especially for control of temperature of flowing fluids
DE4344244A1 (en) * 1993-12-23 1995-06-29 Bosch Siemens Hausgeraete Electric throughflow waterheater with fast responsive characteristic
DE4344243A1 (en) * 1993-12-23 1995-06-29 Bosch Siemens Hausgeraete Control of electric continuous flow water heater

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013208503A (en) * 2002-05-24 2013-10-10 Baxter Internatl Inc Peritoneal dialysis machine with variable voltage input control scheme
US9504778B2 (en) 2002-05-24 2016-11-29 Baxter International Inc. Dialysis machine with electrical insulation for variable voltage input
EP4075073A1 (en) * 2021-04-15 2022-10-19 BDR Thermea Group B.V. Method for controlling a fluid outlet temperature of a heat exchanger
WO2022219144A1 (en) * 2021-04-15 2022-10-20 Bdr Thermea Group B.V. Method for controlling a fluid outlet temperature of a heat exchanger
CN114251836A (en) * 2021-10-08 2022-03-29 佛山市顺德区美的饮水机制造有限公司 Instantaneous heating device, control method and control device thereof, water treatment device and medium

Also Published As

Publication number Publication date
JP2002538544A (en) 2002-11-12
EP1159658A1 (en) 2001-12-05

Similar Documents

Publication Publication Date Title
US6222164B1 (en) Temperature control system for a thermal reactor
US7706925B2 (en) Integrated pressure and flow ratio control system
US9484231B2 (en) Temperature controller for semiconductor manufacturing equipment, method for calculating PID constants in semiconductor manufacturing, and method for operating temperature controller for semiconductor manufacturing equipment
US8153017B2 (en) Substrate treating method
US20060027169A1 (en) Method and system for substrate temperature profile control
US20050029170A1 (en) Method and apparatus for continuously blending chemical solutions
KR102450184B1 (en) Substrate liquid processing apparatus
WO2014151778A1 (en) Processing system and method for providing a heated etching solution
US20060080041A1 (en) Chemical mixing apparatus, system and method
WO2000052547A1 (en) Method and apparatus for flowing liquid temperature control
EP1321836A1 (en) Controller, temperature controller and heat processor using same
KR20010100947A (en) Temperature control apparatus
JP2005510054A (en) Improved process control for immersion treatment
KR101590745B1 (en) Sequential stage mixing for single substrate strip processing
JP3929699B2 (en) Requirements prediction control system for high efficiency ultrapure fluid heater
KR102394219B1 (en) Point-of-use mixing systems and methods for controlling temperatures of liquids dispensed at substrate
US7364095B2 (en) Apparatus for judging target to be temperature-regulated
US20230106044A1 (en) Apparatus for controlling flow rate and method of controlling flow rate
JP3507026B2 (en) Work temperature control device
US20040242004A1 (en) Substrate treating method and apparatus
JP3719918B2 (en) Substrate processing equipment
US20050026460A1 (en) Optimized temperature controller for cold mass introduction
JP3739952B2 (en) Substrate processing equipment
JPS63307223A (en) Method for changing speed in sheet temperature control in continuous annealing furnace
JP3492901B2 (en) Substrate surface treatment method and surface treatment device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP KR

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): DE FR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
ENP Entry into the national phase

Ref country code: JP

Ref document number: 2000 602903

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 2000912192

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2000912192

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2000912192

Country of ref document: EP